US20120211196A1

US20120211196A1 - Heat dissipation assembly and latch apparatus of the same

Info

Publication number: US20120211196A1
Application number: US13/076,464
Authority: US
Inventors: Lei Liu
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2011-02-23
Filing date: 2011-03-31
Publication date: 2012-08-23
Also published as: TW201235573A; CN102651954B; CN102651954A

Abstract

A heat dissipation assembly includes a heat sink, a mounting member fixed to the heat sink, a pivot member pivotably attached to the mounting member, and a latch member attached to the pivot member. The latch member includes a first latch portion and a second latch portion. The pivot member is pivoted to switch between using the first latch portion or the second latch portion to be fixed to different types of circuit boards.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to a heat dissipation assembly and a latch apparatus of the heat dissipation assembly.
2. Description of Related Art
An electronic device, such as a computer or a server, includes a motherboard, and a number of electronic elements such as central processing units and memories arranged on the motherboard. A heat sink is usually mounted on the motherboard and attached on one electronic element for heat dissipation. Most heat sinks are configured to fit one type of motherboard, so a different type of motherboard needs a different type of heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of a heat dissipation assembly.

FIG. 2 is an assembled, isometric view of the heat dissipation assembly mounted to a first motherboard.

FIG. 3 is a partial, cross-sectional view of FIG. 2, taken along the line III-III.

FIG. 4 is an assembled, isometric view of the heat dissipation assembly mounted to a second motherboard.

FIG. 5 is a partial, cross-sectional view of FIG. 4, taken along the line V-V.

DETAILED DESCRIPTION

The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIG. 1, an exemplary embodiment of a heat dissipation assembly mounted to a circuit board for heat dissipation includes a heat sink 1 and a latch apparatus 2 attached to the heat sink 1. The heat sink 1 includes a base 10, and a plurality of fins 12 extending up from the base 10. In one embodiment, two latch apparatuses 2 are attached to opposite sides of the base 10 respectively. The latch apparatus 2 includes a mounting member 20 fixed to the base 10, a pivot member 30, two resilient members 40, and a latch member 50. In this embodiment, the resilient members 40 are springs.
The mounting member 20 is substantially U-shaped, and includes a mounting portion 21 fixed to a side of the base 10, and two parallel sidewalls 22 extending from opposite ends of the mounting portion 21 away from the base 10. Each sidewall 22 defines a pivot hole 221, facing the other sidewall 22.
The pivot member 30 is substantially rectangular, and defines a through hole 32 through the center of the pivot member 30 from top to bottom of the pivot member 30. Two shafts 34 extend from opposite ends of the pivot member 30.
The latch member 50 is substantially dumbbell shaped, and includes a pole 51, and a first latch portion 52 and a second latch portion 54 formed from opposite ends of the pole 51. The first latch portion 52 and the second latch portion 54 may be fixed to the pole 51 by welding or screwing. The first latch portion 52 is substantially tapered, and includes a plurality of elastic tenons 522 slantingly extending up from the tapered end of the first latch portion 52 around the first latch portion 52. The second latch portion 54 includes a hook 542.
In assembly, the pole 51 of the latch member 50 slidably extends through the through hole 32 of the pivot member 30. Two resilient members 40 are set around the pole 51, and at the top and bottom of the pivot member 30, respectively. One of the resilient members 40 is positioned between the first latch portion 52 and the pivot member 30, and the other of the resilient members 40 is positioned between the second latch portion 54 and the pivot member 30. The shafts 34 of the pivot member 30 are pivotably received in the pivot holes 221 of the mounting member 20, to pivotably attach the pivot member 30 to the mounting member 20, between the sidewalls 22.
Referring to FIGS. 2 and 3, in assembling the heat dissipation assembly to a first circuit board 100 defining a mounting hole 102, the heat dissipation assembly is arranged on the first circuit board 100 with the first latch portion 52 of the latch member 50 facing the first circuit board 100. The tenons 522 of the first latch portion 52 are compressed and extended through the mounting hole 102, and then restore to be locked to the bottom of the first circuit board 100.
Referring to FIGS. 4 and 5, in assembling the heat dissipation assembly to a second circuit board 200 defining a hook 202, the heat dissipation assembly is arranged on the second circuit board 200 with the second latch portion 54 facing the second circuit board 200. The hook 542 is locked to the hook 202 of the second circuit board 200.
In this embodiment, the pivot member 30 can be pivoted to switch between using the first latch portion 52 or the second latch portion 54 for being fixed to different types of circuit boards.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation assembly comprising:

a heat sink comprising a base and a plurality of fins extending up from the base;

a mounting member fixed to a side of the heat sink;

a pivot member pivotably attached to the mounting member; and

a latch member attached to the pivot member, wherein the latch member comprises a first latch portion and a second latch portion, the pivot member is pivoted to switch the first latch portion or the second latch portion to be fixed to different types of circuit boards.

2. The heat dissipation assembly of claim 1, wherein the latch member comprises a pole slidably attached to the pivot member, the first and second latch portions are formed from opposite ends of the pole.

3. The heat dissipation assembly of claim 2, wherein two resilient members are set around the pole of the latch member, one of the resilient members is positioned between the first latch portion and the pivot member, the other of the resilient members is positioned between the second latch portion and the pivot member.

4. The heat dissipation assembly of claim 2, wherein the first latch portion and the second latch portion are fixed to the pole by welding or screwing.

5. The heat dissipation assembly of claim 1, wherein the first latch portion is substantially tapered, and comprises a plurality of elastic tenons slantingly extending up from the tapered end of the first latch portion around the first latch portion.

6. The heat dissipation assembly of claim 1, wherein the second latch portion comprises a hook.

7. A latch apparatus for latching a heat sink to a circuit board, the latch apparatus comprising:

a mounting member fixed to the heat sink;

a pivot member pivotably attached to the mounting member; and

a latch member attached to the pivot member, wherein the latch member comprises a first latch portion and a second latch portion, the pivot member is operable to pivot to switch the first latch portion or the second latch portion to be fixed to different types of circuit boards.

8. The latch apparatus of claim 7, wherein the latch member comprises a pole slidably attached to the pivot member, the first and second latch portions are formed from opposite ends of the pole.

9. The latch apparatus of claim 8, wherein two resilient members are set around the pole of the latch member, one of the resilient members is positioned between the first latch portion and the pivot member, the other of the resilient members is positioned between the second latch portion and the pivot member.

10. The latch apparatus of claim 8, wherein the first latch portion and the second latch portion are fixed to the pole by welding or screwing.

11. The latch apparatus of claim 7, wherein the first latch portion is substantially tapered, and comprises a plurality of elastic tenons slantingly extending up from the tapered end of the first latch portion around the first latch portion.

12. The latch apparatus of claim 7, wherein the second latch portion comprises a hook.