US20140043111A1 - High frequency power amplifier - Google Patents
High frequency power amplifier Download PDFInfo
- Publication number
- US20140043111A1 US20140043111A1 US13/845,736 US201313845736A US2014043111A1 US 20140043111 A1 US20140043111 A1 US 20140043111A1 US 201313845736 A US201313845736 A US 201313845736A US 2014043111 A1 US2014043111 A1 US 2014043111A1
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- US
- United States
- Prior art keywords
- high frequency
- duplexer
- frequency power
- power amplifier
- amplification element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High frequency amplifiers, e.g. radio frequency amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
Definitions
- the present invention relates to a high frequency power amplifier used for CDMA (Code Division Multiple Access) or LTE (Long Term Evolution) cellular phones, portable terminals or the like, and in particular to a high frequency power amplifier which can realize desired performance at low cost for specified maximum output power conditions of a plurality of specifications.
- CDMA Code Division Multiple Access
- LTE Long Term Evolution
- High frequency power amplifiers used for CDMA or LTE cellular phones, portable terminals or the like are required to realize a desired ACLR (Adjacent Channel Leakage Ratio) during specified maximum output power with low current consumption.
- a matching circuit in the high frequency power amplifier needs to be adjusted to achieve such desired high frequency performance (e.g., see Japanese Patent Laid-Open No. 11-127040).
- the specified maximum output power required varies depending on cellular phone terminals or makers that manufacture cellular phone terminals. That is, there are a plurality of specifications of specified maximum output power.
- the matching circuit is fixed and cannot be adjusted. Therefore, it is necessary to provide, as a lineup, high frequency power amplifiers of a plurality of specifications provided with a matching circuit which is adjusted so as to obtain desired high frequency performance according to the respective specified maximum output power levels. This poses a problem that development periods are lengthened, and development and manufacturing management costs increase.
- an object of the present invention is to provide a high frequency power amplifier which can realize desired performance at low cost for specified maximum output power conditions of a plurality of specifications.
- a high frequency power amplifier comprises: an amplification element amplifying a high frequency signal; a duplexer to which an output signal of the amplification element is inputted, the duplexer allowing a signal of a certain frequency band to pass and attenuating signals of other frequency bands; a matching circuit connected between the amplification element and the duplexer; an external terminal connected to the matching circuit; and a passive element connected between the external terminal and a grounding point.
- the amplification element, the matching circuit, and the duplexer are integrally molded on an identical substrate.
- the passive element is provided outside the substrate.
- the present invention makes it possible to realize desired performance at low cost for specified maximum output power conditions of a plurality of specifications.
- FIG. 1 is a diagram illustrating a high frequency power amplifier according to a first embodiment of the present invention.
- FIG. 2 is a diagram illustrating actual example 1 of the high frequency power amplifier according to the first embodiment of the present invention.
- FIG. 3 is a diagram illustrating actual example 2 of the high frequency power amplifier according to the first embodiment of the present invention.
- FIG. 4 is a diagram illustrating a high frequency power amplifier according to a second embodiment of the present invention.
- FIG. 5 is a diagram illustrating a high frequency power amplifier according to a third embodiment of the present invention.
- a high frequency power amplifier according to the embodiments of the present invention will be described with reference to the drawings.
- the same components will be denoted by the same symbols, and the repeated description thereof may be omitted.
- FIG. 1 is a diagram illustrating a high frequency power amplifier according to a first embodiment of the present invention.
- An amplification element 1 amplifies a high frequency signal inputted from a transmission signal input terminal 2 .
- the output signal of this amplification element 1 is inputted to a duplexer 3 , and the duplexer 3 allows a signal of a certain frequency band to pass and attenuates signals of other frequency bands.
- the duplexer 3 is connected with a transmission signal output/received signal input terminal 4 and a received signal output terminal 5 .
- a matching circuit 6 connected to the input of the amplification element 1 causes the input impedance of the amplification element 1 to match the characteristic impedance.
- Matching circuits 7 and 8 are connected between the amplification element 1 and the duplexer 3 to cause the output impedance of the amplification element 1 to match the input impedance of the duplexer 3 .
- An external terminal 9 is connected to the matching circuits 7 and 8 .
- a passive element 10 is connected between the external terminal 9 and a grounding point.
- the amplification element 1 , the matching circuits 6 , 7 and 8 , and the duplexer 3 are integrally molded on an identical substrate 11 and the passive element 10 is provided outside the substrate 11 .
- FIG. 2 is a diagram illustrating actual example 1 of the high frequency power amplifier according to the first embodiment of the present invention.
- An inductor 12 having a desired inductance is connected between the external terminal 9 and the grounding point as the passive element 10 .
- FIG. 3 is a diagram illustrating actual example 2 of the high frequency power amplifier according to the first embodiment of the present invention.
- a capacitor 13 having a desired capacitance value is connected between the external terminal 9 and the grounding point as the passive element 10 .
- the circuit constant of the matching circuits 7 and 8 is determined according to the specified maximum output power level outputted to the transmission signal output/received signal input terminal 4 .
- the circuit constant of the matching circuits 7 and 8 for achieving desired performance differs depending on whether the specified maximum output power level is 25 dBm, 26 dBm or 27 dBm. For this reason, in the comparative example, it is necessary to develop high frequency power amplifiers of a plurality of specifications provided with a matching circuit optimized for the respective specified maximum output power levels, resulting in a problem of cost increase.
- Table 1 is a table comparing the comparative example and the performance of the first embodiment.
- the matching circuits 7 and 8 are configured so that an ACLR during 26 dBm output satisfies target performance of ⁇ 38 dBc or less.
- the inductor 12 having a desired inductance is connected to the external terminal 9 , and ACLR can thereby be set to ⁇ 38 dBc or less.
- the capacitor 13 having a desired capacitance value is connected to the external terminal 9 , and ACLR can thereby be set to ⁇ 38 dBc or less and current consumption can be reduced from that in the comparative example.
- the external terminal 9 connected to the matching circuits 7 and 8 is provided and it is possible to adjust the circuit constant of the matching circuit made up of the matching circuits 7 and 8 , and the passive element 10 by changing the passive element 10 connected to the external terminal 9 . Therefore, since the amplification element 1 , the matching circuits 6 , 7 and 8 , and the duplexer 3 integrally molded on the substrate 11 can be used just as they are, it is not necessary to develop high frequency power amplifiers of a plurality of specifications according to the specified maximum output power levels. As a result, desired performance can be realized at low cost for specified maximum output power conditions of a plurality of specifications.
- FIG. 4 is a diagram illustrating a high frequency power amplifier according to a second embodiment of the present invention.
- the high frequency power amplifier of the first embodiment includes one external terminal 9 and one passive element 10 .
- there are a plurality of external terminals 9 and a plurality of passive elements 10 connected between the plurality of external terminals 9 and grounding points. This makes it possible to cover more diversified specified maximum output power conditions.
- FIG. 5 is a diagram illustrating a high frequency power amplifier according to a third embodiment of the present invention.
- the high frequency power amplifiers in the first and second embodiments have a single path
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a high frequency power amplifier used for CDMA (Code Division Multiple Access) or LTE (Long Term Evolution) cellular phones, portable terminals or the like, and in particular to a high frequency power amplifier which can realize desired performance at low cost for specified maximum output power conditions of a plurality of specifications.
- 2. Background Art
- High frequency power amplifiers used for CDMA or LTE cellular phones, portable terminals or the like are required to realize a desired ACLR (Adjacent Channel Leakage Ratio) during specified maximum output power with low current consumption. A matching circuit in the high frequency power amplifier needs to be adjusted to achieve such desired high frequency performance (e.g., see Japanese Patent Laid-Open No. 11-127040).
- The specified maximum output power required varies depending on cellular phone terminals or makers that manufacture cellular phone terminals. That is, there are a plurality of specifications of specified maximum output power. However, in a high frequency power amplifier in which an amplification element, a duplexer and a matching circuit disposed therebetween are integrally molded on the same substrate, the matching circuit is fixed and cannot be adjusted. Therefore, it is necessary to provide, as a lineup, high frequency power amplifiers of a plurality of specifications provided with a matching circuit which is adjusted so as to obtain desired high frequency performance according to the respective specified maximum output power levels. This poses a problem that development periods are lengthened, and development and manufacturing management costs increase.
- In view of the above-described problems, an object of the present invention is to provide a high frequency power amplifier which can realize desired performance at low cost for specified maximum output power conditions of a plurality of specifications.
- According to the present invention, a high frequency power amplifier comprises: an amplification element amplifying a high frequency signal; a duplexer to which an output signal of the amplification element is inputted, the duplexer allowing a signal of a certain frequency band to pass and attenuating signals of other frequency bands; a matching circuit connected between the amplification element and the duplexer; an external terminal connected to the matching circuit; and a passive element connected between the external terminal and a grounding point. The amplification element, the matching circuit, and the duplexer are integrally molded on an identical substrate. The passive element is provided outside the substrate.
- The present invention makes it possible to realize desired performance at low cost for specified maximum output power conditions of a plurality of specifications.
- Other and further objects, features and advantages of the invention will appear more fully from the following description.
-
FIG. 1 is a diagram illustrating a high frequency power amplifier according to a first embodiment of the present invention. -
FIG. 2 is a diagram illustrating actual example 1 of the high frequency power amplifier according to the first embodiment of the present invention. -
FIG. 3 is a diagram illustrating actual example 2 of the high frequency power amplifier according to the first embodiment of the present invention. -
FIG. 4 is a diagram illustrating a high frequency power amplifier according to a second embodiment of the present invention. -
FIG. 5 is a diagram illustrating a high frequency power amplifier according to a third embodiment of the present invention. - A high frequency power amplifier according to the embodiments of the present invention will be described with reference to the drawings. The same components will be denoted by the same symbols, and the repeated description thereof may be omitted.
-
FIG. 1 is a diagram illustrating a high frequency power amplifier according to a first embodiment of the present invention. Anamplification element 1 amplifies a high frequency signal inputted from a transmissionsignal input terminal 2. The output signal of thisamplification element 1 is inputted to a duplexer 3, and the duplexer 3 allows a signal of a certain frequency band to pass and attenuates signals of other frequency bands. The duplexer 3 is connected with a transmission signal output/receivedsignal input terminal 4 and a receivedsignal output terminal 5. - A
matching circuit 6 connected to the input of theamplification element 1 causes the input impedance of theamplification element 1 to match the characteristic impedance. Matchingcircuits amplification element 1 and the duplexer 3 to cause the output impedance of theamplification element 1 to match the input impedance of the duplexer 3. Anexternal terminal 9 is connected to thematching circuits passive element 10 is connected between theexternal terminal 9 and a grounding point. Theamplification element 1, thematching circuits identical substrate 11 and thepassive element 10 is provided outside thesubstrate 11. -
FIG. 2 is a diagram illustrating actual example 1 of the high frequency power amplifier according to the first embodiment of the present invention. Aninductor 12 having a desired inductance is connected between theexternal terminal 9 and the grounding point as thepassive element 10.FIG. 3 is a diagram illustrating actual example 2 of the high frequency power amplifier according to the first embodiment of the present invention. Acapacitor 13 having a desired capacitance value is connected between theexternal terminal 9 and the grounding point as thepassive element 10. - Next, effects of the present embodiment will be described in comparison with a comparative example. In the comparative example, neither the
external terminal 9 nor thepassive element 10 is provided. Since thematching circuits substrate 11 cannot be adjusted, in the comparative example, it is not possible to adjust the circuit constant of the matching circuit disposed between theamplification element 1 and the duplexer 3. The circuit constant of thematching circuits signal input terminal 4. For example, the circuit constant of thematching circuits - Table 1 is a table comparing the comparative example and the performance of the first embodiment. In both the comparative example and the first embodiment, the
matching circuits -
TABLE 1 25 dBm output 26 dBm output 27 dBm output current current current consumption ACLR consumption ACLR consumption ACLR comparative 310 mA −43 dBc 350 mA −40 dBc 400 mA −35 dBc example actual 345 mA −45 dBc 390 mA −43 dBc 450 mA −40 dBc example 1 actual 270 mA −40 dBc 315 mA −35 dBc 370 mA −31 dBc example 2 target <300 mA <−38 dBc <380 mA <−38 dBc <480 mA <−38 dBc performance - In the comparative example, linearity during 27 dBm output deteriorates, ACLR is −35 dBc, and the target performance is thereby not satisfied. To cause the ACLR during 27 dBm output to decrease to or below −38 dBc, a different high frequency power amplifier is required in which the matching
circuits matching circuits - In actual examples 1 and 2 of the first embodiment, the
inductor 12 having a desired inductance is connected to theexternal terminal 9, and ACLR can thereby be set to −38 dBc or less. In actual example 2 of the first embodiment, thecapacitor 13 having a desired capacitance value is connected to theexternal terminal 9, and ACLR can thereby be set to −38 dBc or less and current consumption can be reduced from that in the comparative example. - In contrast, in the present embodiment, the
external terminal 9 connected to thematching circuits matching circuits passive element 10 by changing thepassive element 10 connected to theexternal terminal 9. Therefore, since theamplification element 1, thematching circuits substrate 11 can be used just as they are, it is not necessary to develop high frequency power amplifiers of a plurality of specifications according to the specified maximum output power levels. As a result, desired performance can be realized at low cost for specified maximum output power conditions of a plurality of specifications. -
FIG. 4 is a diagram illustrating a high frequency power amplifier according to a second embodiment of the present invention. The high frequency power amplifier of the first embodiment includes oneexternal terminal 9 and onepassive element 10. In contrast, according to the second embodiment, there are a plurality ofexternal terminals 9, and a plurality ofpassive elements 10 connected between the plurality ofexternal terminals 9 and grounding points. This makes it possible to cover more diversified specified maximum output power conditions. -
FIG. 5 is a diagram illustrating a high frequency power amplifier according to a third embodiment of the present invention. Although the high frequency power amplifiers in the first and second embodiments have a single path, in the third embodiment, there are a plurality of paths each made up of anamplification element 1, matchingcircuits semiconductor substrate 11. Effects similar to those of the first and second embodiments can also be obtained in this case as well. - Obviously many modifications and variations of the present invention are possible in the light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described.
- The entire disclosure of Japanese Patent Application No. 2012-174988, filed on Aug. 7, 2012, including specification, claims, drawings, and summary, on which the
- Convention priority of the present application is based, is incorporated herein by reference in its entirety.
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-174988 | 2012-08-07 | ||
JP2012174988A JP2014036256A (en) | 2012-08-07 | 2012-08-07 | High frequency power amplifier |
Publications (2)
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US20140043111A1 true US20140043111A1 (en) | 2014-02-13 |
US9231558B2 US9231558B2 (en) | 2016-01-05 |
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US13/845,736 Active 2033-09-23 US9231558B2 (en) | 2012-08-07 | 2013-03-18 | High frequency power amplifier |
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JP (1) | JP2014036256A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20130207732A1 (en) * | 2012-02-14 | 2013-08-15 | Qualcomm Incorporated | Amplifier with reduced source degeneration inductance |
US8872599B2 (en) * | 2010-08-24 | 2014-10-28 | ZYW Microelectronics, Inc | Power synthesis circuit for radio frequency power amplifier |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06350375A (en) | 1993-06-14 | 1994-12-22 | Toshiba Corp | Matching circuit |
JPH09186533A (en) | 1995-12-30 | 1997-07-15 | Sony Corp | Transmitter |
JP3811557B2 (en) | 1997-10-21 | 2006-08-23 | 松下電器産業株式会社 | Multiple frequency band high efficiency linear power amplifier |
JP3560900B2 (en) * | 2000-05-22 | 2004-09-02 | シャープ株式会社 | Power Amplifier |
WO2004023649A1 (en) * | 2002-09-05 | 2004-03-18 | Renesas Technology Corp. | Electronic component for amplifying high frequency power and radio communication system |
JP2004304521A (en) | 2003-03-31 | 2004-10-28 | Fujitsu Ltd | Antenna circuit and wireless transceiver |
JP2005102099A (en) * | 2003-08-29 | 2005-04-14 | Kyocera Corp | High-frequency radio circuit module and radio communication device |
JP2006005848A (en) * | 2004-06-21 | 2006-01-05 | Sharp Corp | Power amplifier and high frequency communication device |
JP4423210B2 (en) * | 2005-01-21 | 2010-03-03 | 京セラ株式会社 | High frequency module and communication device using the same |
US7417508B1 (en) * | 2007-03-08 | 2008-08-26 | Sige Semiconductor (U.S.), Corp. | Multiple RF path amplifiers |
JP2011155357A (en) * | 2010-01-26 | 2011-08-11 | Murata Mfg Co Ltd | Multi-band power amplifier |
JP2011211273A (en) | 2010-03-29 | 2011-10-20 | Nec Corp | Portable radio device |
-
2012
- 2012-08-07 JP JP2012174988A patent/JP2014036256A/en active Pending
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2013
- 2013-03-18 US US13/845,736 patent/US9231558B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8872599B2 (en) * | 2010-08-24 | 2014-10-28 | ZYW Microelectronics, Inc | Power synthesis circuit for radio frequency power amplifier |
US20130207732A1 (en) * | 2012-02-14 | 2013-08-15 | Qualcomm Incorporated | Amplifier with reduced source degeneration inductance |
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US9231558B2 (en) | 2016-01-05 |
JP2014036256A (en) | 2014-02-24 |
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