US20140034281A1 - Heat dissipation mechanism - Google Patents
Heat dissipation mechanism Download PDFInfo
- Publication number
- US20140034281A1 US20140034281A1 US13/731,267 US201213731267A US2014034281A1 US 20140034281 A1 US20140034281 A1 US 20140034281A1 US 201213731267 A US201213731267 A US 201213731267A US 2014034281 A1 US2014034281 A1 US 2014034281A1
- Authority
- US
- United States
- Prior art keywords
- main
- sub
- casing
- casings
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to a heat dissipation mechanism, and in particular, relates to a heat dissipation mechanism for a stacking system.
- the present invention provides a heat dissipation mechanism, comprising a main casing, an air exhaust device, and at least a first sub-casing.
- the main casing includes an opening, an air outlet and a main joining portion.
- the air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing.
- the first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
- FIGS. 1 a and 1 b is a schematic view showing a main casing of a heat dissipation mechanism according to an embodiment of the invention
- FIGS. 2 a and 2 b is a schematic view showing a first sub-casing of a heat dissipation mechanism according to an embodiment of the invention
- FIG. 3 is a schematic view of a heat dissipation mechanism according to an embodiment of the invention.
- FIG. 4 is a schematic view of a heat dissipation mechanism according to another embodiment
- FIG. 5 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention t;
- FIG. 6 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 7 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 8 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 9 is a schematic view of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 10 is a schematic view of a main casing of a heat dissipation mechanism according to another embodiment of the invention.
- FIG. 11 is a schematic view showing an of a heat dissipation mechanism according to an embodiment of the invention.
- an embodiment of a heat dissipation mechanism ( FIG. 3 ) comprises a main casing 1 and a first sub-casing 2 .
- the main casing 1 comprises an opening 10 , an air outlet 5 and a main joining portion 11 .
- the main joining portion 11 projects from a surface of the main casing 1
- an air exhaust device 4 is disposed in the main casing 1 .
- the air exhaust device 4 may include a fan for exhausting air in the main casing 1 through the air outlet 5 , wherein an electronic component such as a graphics processing unit may also be disposed in the main casing 1 .
- the first sub-casing 2 comprises a first through hole 20 and a first joining portion 21 , wherein the first joining portion 21 may be a recess formed on a surface of the first sub-casing 2 .
- the main casing 1 when the main casing 1 is engaged with the first sub-casing 2 , the main joining portion 11 is engaged with the first joining portion 21 , and the first through hole 20 is communicated with the opening 10 .
- the fan 4 drives air from the first through hole 20 , through the first sub-casing 2 and the main casing 1 for heat dissipation. Subsequently, air is exhausted by the fan 4 through an air outlet 5 on the top side of the main casing 1 .
- the air outlet 5 may also be disposed on other sides of the main casing 1 .
- FIG. 4 another embodiment of a heat dissipation mechanism comprises a main casing 1 and two first sub-casings 2 .
- the main casing 1 comprises two openings 10 and two main joining portions 11 , wherein the openings 10 and the main joining portions 11 are respectively disposed on opposite sides of the main casing 1 .
- the two first sub-casings 2 are disposed on opposite sides of the main casing 1 , wherein the two first joining portions 21 of the first sub-casings 2 are respectively engaged with the two main joining portions 11 , and the two first through holes 20 are respectively communicated with the two openings 10 .
- the fan 4 can inhales air from the first through holes 20 for dissipating the heat inside of the two first sub-casings 2 , and air can be exhausted through an air outlet 5 on the top side of the main casing 1 by the fan 4 .
- the first sub-casing 2 has a hollow first joining portion 21 and a protruding second joining portion 22 , and the first joining portion 21 and the second joining portion 22 are disposed on opposite sides thereof
- the second sub-casing 3 has a second through hole 30 and a hollow third joining portion 31 .
- the main casing 1 , the first sub-casing 2 , and the second sub-casing 3 can be assembled, wherein the main joining portion 11 engages with the first joining portion 21 , the second joining portion 22 engages with the third joining portion 31 , and the first through hole 20 communicates with the opening 10 and the second through hole 30 .
- the fan 4 can inhale air from the second through hole 30 and dissipate heat sequentially through the second sub-casing 3 , the first sub-casing 2 , and the main casing 1 . Subsequently, air is exhausted through an air outlet 5 on the top side of the main casing 1 by the fan 4 (as arrows indicate shown in FIG. 5 ).
- a first joining portion 21 and a second first joining portion 22 are respectively disposed on the right and left sides of the first sub-casing 2 .
- the main joining portion 11 is engaged with the first joining portion 21
- the second joining portion 22 is engaged with the main joining portion 11 ′
- all the openings 10 of the main casings 1 are communicated with the first through hole 20 of the first sub-casing 2 .
- two fans 4 in the main casings 1 can inhale air from the opening 10 on the right side of the main casing 1 and dissipate heat through the air outlets 5 .
- Two protruding hollow main joining portions 11 are respectively formed on the opposite sides of the left main casing 1 .
- the right main casing has a main joining portion 11 and a main portion 11 ′ on opposite sides thereof for engagement with the left main casing 1 .
- the first joining portions 21 are respectively formed on the two first sub-casings, and the first joining portions 21 are corresponding to the main joining portions 11 .
- the main casings 1 can be connected to each other and the first sub-casings 2 can be disposed on opposite sides of the two main casings 1 and respectively engaged therewith.
- air can enter the heat dissipation mechanism through the first through hole 20 , dissipating heat inside of the two main casings 1 and the first sub-casings 2 . Subsequently, air can be exhausted through air outlets 5 on the top sides by the two fans 4 .
- the two main casings 1 are respectively disposed on opposite sides of the two sub-casings 2 and engaged with the first sub-casings 2 .
- two air inlets 60 are respectively disposed on the two first sub-casings 2 , and air can enter the heat dissipation mechanism through the two openings 10 and the air inlets 60 for dissipating heat in the first sub-casings 2 . Subsequently, air may be exhausted through the air outlets 5 on the top side of the two main casings 1 by the fans 4 .
- air can enter the heat dissipation mechanism through the first through hole 20 or the air inlets 60 .
- air flows through the first sub-casing 2 and main casing 1 , and can be exhausted through air outlets 5 on the top side of the two main casings 1 by the fans 4 .
- a main casing 1 may comprise two fans 4 for increasing the quantity of air flow.
- a meshed structure 70 may be disposed on the opening 10 of the main casing 1 , and the ventilation area ratio of the meshed structure 70 ranges from 30% ⁇ 50%.
- the meshed structure 70 may also be disposed on the first through hole 20 of the first sub-casing 2 or the second through hole 30 of the second sub-casing 3 for preventing damage of the fan 4 due to unexpected impact from external objects.
- the heat dissipation mechanism can form a flow channel by engaging the main casing with the sub-casing, so as to rapidly dissipate heat and improve cooling efficiency of a stacking system.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101215052 | 2012-08-06 | ||
TW101215052U TWM445207U (zh) | 2012-08-06 | 2012-08-06 | 散熱機構 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140034281A1 true US20140034281A1 (en) | 2014-02-06 |
Family
ID=48090896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/731,267 Abandoned US20140034281A1 (en) | 2012-08-06 | 2012-12-31 | Heat dissipation mechanism |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140034281A1 (zh) |
EP (1) | EP2696258A1 (zh) |
TW (1) | TWM445207U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180085671A1 (en) * | 2015-02-27 | 2018-03-29 | Sony Interactive Entertainment Inc. | Information processing apparatus |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4683424A (en) * | 1984-11-07 | 1987-07-28 | Wehr Corporation | Apparatus for use in testing circuit boards |
US5237484A (en) * | 1991-07-08 | 1993-08-17 | Tandem Computers Incorporated | Apparatus for cooling a plurality of electronic modules |
US6094347A (en) * | 1999-01-08 | 2000-07-25 | Intel Corporation | Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station |
US6104607A (en) * | 1997-03-03 | 2000-08-15 | Inclose Design, Inc. | Cooling fan for PC card slot |
US6109039A (en) * | 1999-03-24 | 2000-08-29 | International Business Machines Corporation | Heat transfer in electronic apparatus |
US6239970B1 (en) * | 1998-12-04 | 2001-05-29 | Sony Corporation | Cooling assisting device, cooling assisting method, electronic apparatus, and information processor |
US6453378B1 (en) * | 1998-12-16 | 2002-09-17 | Gateway, Inc. | Portable computer with enhanced performance management |
US6459574B1 (en) * | 2000-12-28 | 2002-10-01 | Intel Corporation | Docking station having a cooling unit to cool an electronic device |
US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
US6522535B1 (en) * | 1997-10-23 | 2003-02-18 | Hewlett-Packard Company | Method and apparatus for cooling a portable computer in a docking station |
US6542360B2 (en) * | 2000-06-30 | 2003-04-01 | Kabushiki Kaisha Toshiba | Electronic apparatus containing heat generating component, and extension apparatus for extending the function of the electronic apparatus |
US20070064385A1 (en) * | 2005-09-19 | 2007-03-22 | Paul Dieter G | Receiving frame having removable computer drive carrier and fan modules |
US7233159B2 (en) * | 2004-06-02 | 2007-06-19 | Emc Corporation | Ergonomic, rotatable electronic component testing apparatus |
US7281936B2 (en) * | 2004-12-30 | 2007-10-16 | Microsoft Corporation | Modular electronic storage unit |
US8000099B2 (en) * | 2005-10-24 | 2011-08-16 | Hewlett-Packard Development Company, L.P. | Power supply cooling system |
US8351204B2 (en) * | 2008-01-31 | 2013-01-08 | Hewlett-Packard Development Company, L.P. | Modular data processing components and systems |
US8520381B2 (en) * | 2009-09-18 | 2013-08-27 | Sma Solar Technology Ag | Inverter with electrical and electronic components arranged in a sealed housing |
US8638558B2 (en) * | 2009-06-01 | 2014-01-28 | Fujitsu Limited | Electronic unit, electronic system, and containing device |
US8787015B2 (en) * | 2010-05-27 | 2014-07-22 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
US8939524B2 (en) * | 2011-03-22 | 2015-01-27 | Erwin Gasser | Shelter |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5909357A (en) * | 1997-04-24 | 1999-06-01 | Orr; Tom | Vertically stacked computer modules shaped to indicate compatibility with vertical cooling shaft extending throughout |
US20050264995A1 (en) * | 2004-05-28 | 2005-12-01 | Lsi Logic Corporation | Downdraft cooling system for in-line devices |
-
2012
- 2012-08-06 TW TW101215052U patent/TWM445207U/zh not_active IP Right Cessation
- 2012-12-31 US US13/731,267 patent/US20140034281A1/en not_active Abandoned
-
2013
- 2013-01-24 EP EP13152521.4A patent/EP2696258A1/en not_active Withdrawn
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4683424A (en) * | 1984-11-07 | 1987-07-28 | Wehr Corporation | Apparatus for use in testing circuit boards |
US5237484A (en) * | 1991-07-08 | 1993-08-17 | Tandem Computers Incorporated | Apparatus for cooling a plurality of electronic modules |
US6104607A (en) * | 1997-03-03 | 2000-08-15 | Inclose Design, Inc. | Cooling fan for PC card slot |
US6522535B1 (en) * | 1997-10-23 | 2003-02-18 | Hewlett-Packard Company | Method and apparatus for cooling a portable computer in a docking station |
US6239970B1 (en) * | 1998-12-04 | 2001-05-29 | Sony Corporation | Cooling assisting device, cooling assisting method, electronic apparatus, and information processor |
US6453378B1 (en) * | 1998-12-16 | 2002-09-17 | Gateway, Inc. | Portable computer with enhanced performance management |
US6691197B2 (en) * | 1998-12-16 | 2004-02-10 | Gateway, Inc. | Portable computer with enhanced performance management |
US6094347A (en) * | 1999-01-08 | 2000-07-25 | Intel Corporation | Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station |
US6109039A (en) * | 1999-03-24 | 2000-08-29 | International Business Machines Corporation | Heat transfer in electronic apparatus |
US6542360B2 (en) * | 2000-06-30 | 2003-04-01 | Kabushiki Kaisha Toshiba | Electronic apparatus containing heat generating component, and extension apparatus for extending the function of the electronic apparatus |
US6459574B1 (en) * | 2000-12-28 | 2002-10-01 | Intel Corporation | Docking station having a cooling unit to cool an electronic device |
US6459575B1 (en) * | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
US7233159B2 (en) * | 2004-06-02 | 2007-06-19 | Emc Corporation | Ergonomic, rotatable electronic component testing apparatus |
US7281936B2 (en) * | 2004-12-30 | 2007-10-16 | Microsoft Corporation | Modular electronic storage unit |
US20070064385A1 (en) * | 2005-09-19 | 2007-03-22 | Paul Dieter G | Receiving frame having removable computer drive carrier and fan modules |
US8000099B2 (en) * | 2005-10-24 | 2011-08-16 | Hewlett-Packard Development Company, L.P. | Power supply cooling system |
US8351204B2 (en) * | 2008-01-31 | 2013-01-08 | Hewlett-Packard Development Company, L.P. | Modular data processing components and systems |
US8638558B2 (en) * | 2009-06-01 | 2014-01-28 | Fujitsu Limited | Electronic unit, electronic system, and containing device |
US8520381B2 (en) * | 2009-09-18 | 2013-08-27 | Sma Solar Technology Ag | Inverter with electrical and electronic components arranged in a sealed housing |
US8787015B2 (en) * | 2010-05-27 | 2014-07-22 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
US8939524B2 (en) * | 2011-03-22 | 2015-01-27 | Erwin Gasser | Shelter |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180085671A1 (en) * | 2015-02-27 | 2018-03-29 | Sony Interactive Entertainment Inc. | Information processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWM445207U (zh) | 2013-01-11 |
EP2696258A1 (en) | 2014-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ACER INCORPORATED, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, CHENG-PANG;LIAO, WEN-NENG;REEL/FRAME:029546/0271 Effective date: 20121212 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |