US20140022468A1 - Touch panel - Google Patents
Touch panel Download PDFInfo
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- US20140022468A1 US20140022468A1 US14/034,567 US201314034567A US2014022468A1 US 20140022468 A1 US20140022468 A1 US 20140022468A1 US 201314034567 A US201314034567 A US 201314034567A US 2014022468 A1 US2014022468 A1 US 2014022468A1
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- Prior art keywords
- touch
- disposed
- layer
- electrodes
- touch panel
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
Definitions
- the invention relates to a touch panel. More particularly, the invention relates to a touch panel having a light-shielding layer.
- a conventional touch display panel includes a display panel, a touch panel disposed on the display panel, and a transparent cover disposed on the touch panel, wherein the transparent cover is used to protect the underlying touch panel and the display panel.
- a signal generated by an operation of a user is transmitted to a touch chip disposed on a flexible printed circuit board, and the touch chip analyses the signal to determine a position of the user's touch on the touch panel.
- a wiring region is configured at the peripheral region of the touch panel for disposing a plurality of conductive lines.
- the transparent cover having a black ink layer is additionally used to prevent the exposition of the conductive lines inside the wiring region of the touch panel, wherein the black ink layer is usually disposed on the location corresponding to the wiring region of the transparent cover so as to cover the conductive lines. Accordingly, the invention is provided for reducing the layering structure of the touch panel so as to lower the manufacturing cost.
- the invention is directed to a touch panel, wherein the conductive particles disposed between the touch chip and the conductive lines steadily connect the touch chip to the layer of conductive lines.
- the invention is directed to a touch panel having a hard light-shielding layer to prevent from collapse.
- the invention provides a touch panel having a transparent region and a peripheral region surrounding the transparent region and including a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip.
- the transparent cover has a touch surface and a device mounting surface opposite thereto.
- the touch device is disposed on the device mounting surface and at least located at the transparent region.
- the light-shielding layer is disposed on the transparent cover and located inside the peripheral region.
- the layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device.
- the touch chip is disposed on the layer of conductive lines through a chip-on-glass process.
- the invention facilitates the enhancement of the reliance of the connection between the touch chip and the layer of the conductive lines in the chip-on-glass process through thinning the thickness of the light-shielding layer or increasing the hardness of the light-shielding layer.
- FIG. 1A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to an embodiment of the invention.
- FIG. 1B illustrates a partial top view of the transparent region of the touch panel in FIG. 1A .
- FIG. 2A illustrates a cross-sectional view of a different structure of the touch panel in FIG. 1A .
- FIG. 2B illustrates a partial top view of the transparent region of the touch panel in FIG. 2A .
- FIG. 2C is a cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ in FIG. 2B .
- FIG. 2D is another cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ in FIG. 2B .
- FIG. 3 illustrates a cross-sectional view showing a touch panel disposed on a display panel according to another embodiment of the invention.
- FIG. 4A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to further another embodiment of the invention.
- FIG. 4B illustrates a top view of the touch panel of FIG. 4A .
- FIG. 5 illustrates a top view of a different structure of the touch panel of FIG. 4B .
- FIG. 1A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to an embodiment of the invention
- FIG. 1B illustrates a partial top view of the transparent region of the touch panel in FIG. 1A
- FIG. 2A illustrates a cross-sectional view of a different structure of the touch panel in FIG. 1A
- FIG. 2B illustrates a partial top view of the transparent region of the touch panel in FIG. 2A .
- the touch panel 100 of the present embodiment has a transparent region A 1 and a peripheral region A 2 surrounding the transparent region A 1 , wherein the peripheral region A 2 is exemplified as a non-transparent region.
- the transparent elements such as the transparent touch electrodes are disposed in the transparent region A 1
- the non-transparent elements such as the touch chips and the conductive layers having the transmitting lines are disposed in the peripheral region A 2 so that the non-transparent elements are prevented from negatively influencing on the visual effect when a user views the touch panel 100 .
- the touch panel 100 includes a transparent cover 110 , a touch device 120 , a light-shielding layer 130 , a layer of conductive lines 140 , and a touch chip 150 .
- the transparent cover 110 has a touch surface 112 and a device mounting surface 114 opposite thereto, wherein the touch surface 112 serves a surface to be directly touched by the user for operating the touch panel 100 .
- the light-shielding layer 130 is disposed on the transparent cover 114 and located inside the peripheral region A 2 . In the present embodiment, the thickness T 1 of the light-shielding layer 130 is ranged from 0.5 ⁇ m to 6 ⁇ m.
- a material of the light-shielding layer 130 includes non-transparent materials such as resin, and in an embodiment, the non-transparent resin can be a black resin or a white resin.
- the layer of conductive lines 140 is disposed on the light-shielding layer 130 and the conductive lines in the layer 140 can be metal such as Cr, Al, Cu, Mo, Mo/Al alloy, Ti, Ti/Al alloy, Ag, Ag/Pd alloy, or a combination thereof.
- the touch device 120 is disposed on the device mounting surface 114 , located inside the transparent region A 1 , and electrically connected to the layer of conductive lines 140 .
- the touch device 120 includes a plurality of first touch electrodes 122 , an insulator layer 124 , and a plurality of second touch electrodes 126 .
- the first touch electrodes 122 are disposed on the device mounting surface 114 along a first direction V 1 .
- the insulator layer 124 is disposed on the device mounting surface 114 to cover the first touch electrodes 122 .
- the second touch electrodes 126 are disposed on a surface 124 a of the insulator layer 124 away from the first touch electrodes 122 along a second direction V 2 perpendicular to the first direction V 1 .
- the first touch electrodes 122 are partially overlapped the second touch electrodes 126 .
- the first touch electrodes 122 and the second touch electrodes 126 are exemplified as band-like electrodes.
- the layer of conductive lines 140 can have a plurality of conductive lines (not shown), and each first touch electrode 122 is electrically connected to the corresponding conductive line.
- Each second touch electrode 126 is also electrically connected to the corresponding conductive line.
- the first touch electrodes 122 and the second touch electrodes 126 can be made of a transparent conductive material, such as indium tin oxide (ITO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium zinc oxide (IZO), zinc oxide (ZnO), tin oxide (SnO), or a combination thereof.
- ITO indium tin oxide
- CTO cadmium tin oxide
- AZO aluminum zinc oxide
- IZO indium zinc oxide
- ZnO zinc oxide
- tin oxide (SnO) a combination thereof.
- the touch device 120 is directly formed on the transparent cover 110 in the present embodiment, and thus no extra substrate is required to be disposed between the touch device 120 and the transparent cover 110 so that the total volume and the manufacturing cost of the touch panel 100 are reduced.
- the first touch electrodes 122 a and the second touch electrodes 126 a can be disposed respectively on two opposite substrates.
- the touch chip 150 is directly bonded on the layer of conductive lines 140 through a chip-on-glass process, wherein an anisotropic conductive film (ACF) I is disposed between the touch chip 150 and the layer of conductive lines 140 .
- the ACF I has a glue layer G and a plurality of conductive particles 160 distributed in the glue layer G, and the touch chip 150 is electrically connected to the layer of conductive lines 140 through the conductive particles 160 of the ACF I.
- the light-shielding layer 130 may be caved in due to the pressure generating during the process of bonding the touch chip 150 on the layer of conductive lines 140 . Once the caving depth is too deep for the conductive particles 160 to firmly connect the layer of conductive lines 140 to the touch chip 150 , the connection between the layer of conductive lines 140 and the touch chip 150 is insufficiently reliable.
- the thickness T 1 of the light-shielding layer 130 is reduced in the present embodiment and a diameter D of each conductive particle 160 is larger than the thickness T 1 of the light-shielding layer 130 and also larger than the thickness T 2 of the layer of conductive lines 140 .
- the diameter D of the conductive particles 160 is large enough to compensate the caving effect of the light-shielding layer 130 during the process of bonding the touch chip 150 to the layer of conductive lines 140 .
- the conductive particles 160 are firmly connected with the touch chip 150 and the layer of conductive lines 140 simultaneously during the bonding process of the touch chip 150 in the present embodiment, the yield rate is thus improved, and the cost is reduced.
- the touch panel 100 can further includes a flexible printed circuit board 170 in the present embodiment which connects to the margin of the transparent cover 110 and electrically connects the layer of conductive lines 140 .
- the touch panel 100 can be disposed on a display panel S, such as a liquid crystal display panel (LCD), a plasma display panel (PDP), an electronic paper display (EPD) panel, or an organic light emitting display (OLED) panel, and the display panel S can be selectively connected to the touch chip 150 .
- a driving signal can be transmitted to the display panel S through the touch chip 150 so that the display panel S is driven based on the signal to display a corresponding image.
- the touch device 120 a includes a plurality of first touch electrodes 122 a and a plurality of second touch electrodes 126 a.
- the first touch electrodes 122 a are disposed on the device mounting surface 114 and each first touch electrode 122 a extends along the first direction V 1
- the second touch electrodes 126 a are disposed on the device mounting surface 114 and each second touch electrode 126 a extends along the second direction V 2 , wherein the second touch electrodes 126 a are intersecting with the first touch electrodes 122 a.
- the first direction V 1 is perpendicular to the second direction V 2 .
- the first touch electrodes 122 a are electrode series consisting of a plurality of diamond patterns B 1 serially connected through a plurality of connecting lines C 1 and the second touch electrodes 126 a are electrode series consisting of a plurality of diamond patterns B 2 serially connected through a plurality of connecting lines C 2 . It is noted that the diamond patterns B 1 and B 2 can be coplanar disposed.
- the layer of conductive lines 140 is fabricated before the fabrication of the diamond patterns B 1 and B 2 .
- the layer of conductive lines 140 are generally made of metal material and the diamond patterns B 1 and B 2 are made of transparent conductive material. Therefore, for the continuity of the lines in the layer of the conductive lines 140 , a less-corrosive etching solution must be used in the patterning process for forming the diamond patterns B 1 and B 2 so that the damage of the layer of conductive lines 140 is prevented. Nevertheless, based on the less-corrosive requirement, the transparent conductive layer including the diamond patterns B 1 and B 2 are fabricated by using a low temperature process.
- the transparent conductive layer fabricated through the low temperature process has relative poor light transmission characteristic and is not conducive to the application of the touch panel 100 . Accordingly, the dispositions of the layer of conductive lines 140 and the diamond patterns B 1 and B 2 can be shown in FIG. 2C and FIG. 2D to enhance the process yield rate and the quality of the touch panel 100 .
- FIG. 2C is a cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ in FIG. 2B .
- the transparent cover 110 is configured with the light shielding layer 130 , the layer of conductive lines 140 , the first touch electrodes 122 a, and the second touch electrodes 126 a, wherein the first touch electrode 122 a is formed by serially connecting of the diamond patterns B 1 and the connecting lines C 1 .
- the drawing only shows the connecting line C 2 of the second touch electrode 126 a while the second touch electrode 126 a is formed by serially connecting of the diamond patterns (not shown) and the connecting line C 2 .
- the insulating layer 180 is further disposed between the connecting line C 1 and the connecting line C 2 for the electrically insulation between the connecting lines C 1 and the connecting line C 2 .
- the layer of conductive lines 140 and the connecting lines C 1 are made of metal material and the diamond pattern B 1 located at the terminal area is extended to the layer of the conductive lines 140 so as to form a plurality of transparent pads 142 . That is to say, the layer of conductive lines 140 and the connecting lines C 1 are completely covered by the insulating layer and elements made of transparent conductive material.
- the transparent cover 110 is covered by a passivation layer 190 having a plurality of openings 192 exposing the transparent pads 142 . Accordingly, the transparent pads 142 can be electrically connected to a plurality of bumps 152 of the chip 150 through the ACF I.
- a patterned metal layer including the connecting lines C 1 and the layer of conductive lines 140 are subsequently formed.
- the patterned insulating layer 180 and a patterned transparent conductive layer including the diamond patterns B 1 and B 2 , the connecting lines C 2 , and the transparent pads 142 are formed.
- the passivation layer 190 and the openings 192 exposing the transparent pads 142 are fabricated to form the touch panel 100 .
- the layer of conductive lines 140 is not exposed during the process for patterning the transparent conductive layer so as to prevent from being damaged by the etching solution. Therefore, a high temperature process can be used to form the transparent conductive layer without damaging the layer of conductive lines 140 . Accordingly, the layer of conductive lines 140 has desirable quality and reliability, and the diamond patterns B 1 and B 2 can have desirable light transmission characteristic.
- FIG. 2D is another cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ in FIG. 2B .
- the difference between FIG. 2C and FIG. 2D lies in that the transparent pads 144 are not directly connected to the diamond pattern B 1 located at the terminal area and the openings 192 of the passivation layer 190 substantially exposes the transparent pads 144 .
- the layer of conductive layer 140 shown in FIG. 2C and FIG. 2D is completely covered by the patterned transparent conductive layer and the insulating layer 180 . Accordingly, the layer of conductive lines 140 is not damaged by the etching solution used for patterning the transparent conductive layer and the transparent conductive layer can be fabricated by using a high temperature process to enhance the light transmission characteristic.
- the touch panel 100 of the invention is not restricted to be adhered on the display panel S to form a touch display panel.
- a transparent substrate or a protecting layer (not shown) can further be disposed on the device mounting surface 114 , wherein the touch device 120 is located between the transparent substrate (or the protecting layer) and the transparent cover 110 . That is to say, the touch panel 100 of the present embodiment can be used individually or assembled with other display apparatus such as the display panel S to form a touch display panel.
- the thickness of the light-shielding layer 130 is reduced in the embodiment depicted in FIG. 1A so as to minimize the negative influence caused by the light-shielding layer 130 during the bonding process of the touch chip 150 . Accordingly, the layer of conductive lines 140 and the touch chip 150 are steadily electrically connected. Nevertheless, other methods can be adopted for achieving the aforesaid effect, e.g. a material with high hardness can be used to form the light-shielding layer 130 to enhance the supporting property of the light-shielding layer 130 and the embodiment of FIG. 3 is provided to describe the example.
- FIG. 3 illustrates a cross-sectional view showing a touch panel disposed on a display panel according to another embodiment of the invention.
- the touch panel 200 of the present embodiment is similar to the touch panel 100 in FIG. 1A , and the difference between the two touch panels lies mainly in that the material of the light-shielding layer 130 in touch panel 200 is diamond-like carbon.
- the diamond-like carbon has high hardness so that the light-shielding layer 130 is difficultly caved in during the bonding process of the touch chip 130 if the light-shielding layer 130 is made of the diamond-like carbon. Accordingly, the manufacturing yield rate is enhanced and the cost can be decreased.
- the material of the layer of conductive lines 140 includes Al, Cu, Mo, Mo/Al alloy, Ti, Ti/Al alloy, Ag, Ag/Pd alloy or any combination of the foregoing.
- the diamond-like carbon has good light-shielding property so that the thickness of the light-shielding layer 130 can be relatively thin while still provides superior light-shielding effect.
- the thickness of the light-shielding layer 130 e.g. 0.5 ⁇ m to 6 ⁇ m, can be smaller than the thickness the user's hand can feel, e.g. 0.5 ⁇ m to 6 ⁇ m. Therefore, in addition to be disposed on the device mounting surface 114 , the light-shielding layer 130 can be disposed on the touch surface 112 without generating the feeling of drop on the surface when the user touches the touch panel 200 .
- FIG. 4A and FIG. 4B are shown to exemplify the embodiment which has the light-shielding layer disposed on the touch surface.
- FIG. 4A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to further another embodiment of the invention
- FIG. 4B illustrates a top view of the touch panel in FIG. 4A
- FIG. 5 illustrates a top view of a different structure of the touch panel in FIG. 4B .
- the touch panel 300 of the present embodiment has a transparent region A 1 and a peripheral region A 2 surrounding the transparent region A 1 .
- the touch panel 300 includes a transparent cover 310 , a touch device 320 , a light-shielding layer 330 , a touch chip 340 , and a layer of conductive lines 360 .
- the transparent cover 310 has a touch surface 312 and a device mounting surface 314 opposite thereto.
- the touch device 320 is disposed on the device mounting surface 314 and located at the transparent region A 1 .
- the touch chip 340 is disposed on the device mounting surface 314 , located inside the peripheral region A 2 , and electrically connected to the touch device 320 .
- the light-shielding layer 330 can be disposed on the touch surface 312 and located in the peripheral region A 2 for shielding the touch chip 340 , wherein the material of the light-shielding layer 330 is diamond-like carbon.
- the diamond-like carbon has dense structure and is very hard so as to provide desirable light-shielding property and abrasion resistance. Accordingly, the light-shielding layer 330 is quite thin while still has good light-shielding effect.
- the light-shielding layer 330 is configured on the touch surface 312 , no touch feeling of drop on the surface is caused by the light-shielding layer 330 during the user touches the touch panel 300 .
- the layer of conductive lines 360 can be directly disposed on the device mounting surface 314 in the present embodiment to enhance the manufacturing yield rate of the bonding process of the touch chip 340 and reduce the cost.
- the shape of the light-shielding layer 330 can be changed to form the transparent regions A 1 with different shapes as shown in FIGS. 4B and 5 .
- the touch device is directly formed on the transparent cover in the present invention, and thus no extra substrate is required to be disposed between the touch device and the transparent cover so that the total volume and the manufacturing cost of the touch panel are reduced.
- the total thickness of the light-shielding layer and the layer of conductive lines in the present invention is smaller than the diameter of the conductive particles. Therefore, the diameter of the conductive particles is large enough to ensure the connection between the layer of conductive lines and the touch chip during the chip-on-glass bonding process.
- the light-shielding layer of the invention can be made of hard diamond-like carbon thereby providing sufficient support and high abrasion resistance and capable of being disposed on the device mounting surface or the touch surface.
- the thickness of the light-shielding layer is quite thin and still has desirable light-shielding effect. Therefore, the disposition of the light-shielding layer on the touch surface would not cause the touch feeling of drop during the user uses the touch panel.
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Abstract
A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.
Description
- This application is a continuation application of and claims the priority benefit of a prior application Ser. No. 12/732,193, filed on Mar. 26, 2010, now pending. The prior application Ser. No. 12/732,193 claims the priority benefit of Taiwan application serial no. 98142749, filed on Dec. 14, 2009. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
- 1. Field of the Invention
- The invention relates to a touch panel. More particularly, the invention relates to a touch panel having a light-shielding layer.
- 2. Description of Related Art
- A conventional touch display panel includes a display panel, a touch panel disposed on the display panel, and a transparent cover disposed on the touch panel, wherein the transparent cover is used to protect the underlying touch panel and the display panel. A signal generated by an operation of a user is transmitted to a touch chip disposed on a flexible printed circuit board, and the touch chip analyses the signal to determine a position of the user's touch on the touch panel.
- For transmitting the signals, a wiring region is configured at the peripheral region of the touch panel for disposing a plurality of conductive lines. When the touch panel is combined with the display panel, the transparent cover having a black ink layer is additionally used to prevent the exposition of the conductive lines inside the wiring region of the touch panel, wherein the black ink layer is usually disposed on the location corresponding to the wiring region of the transparent cover so as to cover the conductive lines. Accordingly, the invention is provided for reducing the layering structure of the touch panel so as to lower the manufacturing cost.
- The invention is directed to a touch panel, wherein the conductive particles disposed between the touch chip and the conductive lines steadily connect the touch chip to the layer of conductive lines.
- The invention is directed to a touch panel having a hard light-shielding layer to prevent from collapse.
- The invention provides a touch panel having a transparent region and a peripheral region surrounding the transparent region and including a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.
- In view of the above, the invention facilitates the enhancement of the reliance of the connection between the touch chip and the layer of the conductive lines in the chip-on-glass process through thinning the thickness of the light-shielding layer or increasing the hardness of the light-shielding layer.
- In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanying figures are described in detail below.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
-
FIG. 1A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to an embodiment of the invention. -
FIG. 1B illustrates a partial top view of the transparent region of the touch panel inFIG. 1A . -
FIG. 2A illustrates a cross-sectional view of a different structure of the touch panel inFIG. 1A . -
FIG. 2B illustrates a partial top view of the transparent region of the touch panel inFIG. 2A . -
FIG. 2C is a cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ inFIG. 2B . -
FIG. 2D is another cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ inFIG. 2B . -
FIG. 3 illustrates a cross-sectional view showing a touch panel disposed on a display panel according to another embodiment of the invention. -
FIG. 4A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to further another embodiment of the invention. -
FIG. 4B illustrates a top view of the touch panel ofFIG. 4A . -
FIG. 5 illustrates a top view of a different structure of the touch panel ofFIG. 4B . -
FIG. 1A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to an embodiment of the invention, andFIG. 1B illustrates a partial top view of the transparent region of the touch panel inFIG. 1A .FIG. 2A illustrates a cross-sectional view of a different structure of the touch panel inFIG. 1A , andFIG. 2B illustrates a partial top view of the transparent region of the touch panel inFIG. 2A . - Referring to
FIGS. 1A and 1B , thetouch panel 100 of the present embodiment has a transparent region A1 and a peripheral region A2 surrounding the transparent region A1, wherein the peripheral region A2 is exemplified as a non-transparent region. In thetouch panel 100, the transparent elements such as the transparent touch electrodes are disposed in the transparent region A1, and the non-transparent elements such as the touch chips and the conductive layers having the transmitting lines are disposed in the peripheral region A2 so that the non-transparent elements are prevented from negatively influencing on the visual effect when a user views thetouch panel 100. - The
touch panel 100 includes atransparent cover 110, atouch device 120, a light-shielding layer 130, a layer ofconductive lines 140, and atouch chip 150. Thetransparent cover 110 has atouch surface 112 and adevice mounting surface 114 opposite thereto, wherein thetouch surface 112 serves a surface to be directly touched by the user for operating thetouch panel 100. The light-shielding layer 130 is disposed on thetransparent cover 114 and located inside the peripheral region A2. In the present embodiment, the thickness T1 of the light-shielding layer 130 is ranged from 0.5 μm to 6 μm. A material of the light-shielding layer 130 includes non-transparent materials such as resin, and in an embodiment, the non-transparent resin can be a black resin or a white resin. The layer ofconductive lines 140 is disposed on the light-shielding layer 130 and the conductive lines in thelayer 140 can be metal such as Cr, Al, Cu, Mo, Mo/Al alloy, Ti, Ti/Al alloy, Ag, Ag/Pd alloy, or a combination thereof. - The
touch device 120 is disposed on thedevice mounting surface 114, located inside the transparent region A1, and electrically connected to the layer ofconductive lines 140. In the present embodiment, thetouch device 120 includes a plurality offirst touch electrodes 122, aninsulator layer 124, and a plurality ofsecond touch electrodes 126. Thefirst touch electrodes 122 are disposed on thedevice mounting surface 114 along a first direction V1. Theinsulator layer 124 is disposed on thedevice mounting surface 114 to cover thefirst touch electrodes 122. Thesecond touch electrodes 126 are disposed on asurface 124 a of theinsulator layer 124 away from thefirst touch electrodes 122 along a second direction V2 perpendicular to the first direction V1. In addition, thefirst touch electrodes 122 are partially overlapped thesecond touch electrodes 126. Thefirst touch electrodes 122 and thesecond touch electrodes 126 are exemplified as band-like electrodes. In the present embodiment, the layer ofconductive lines 140 can have a plurality of conductive lines (not shown), and eachfirst touch electrode 122 is electrically connected to the corresponding conductive line. Eachsecond touch electrode 126 is also electrically connected to the corresponding conductive line. - The
first touch electrodes 122 and thesecond touch electrodes 126 can be made of a transparent conductive material, such as indium tin oxide (ITO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium zinc oxide (IZO), zinc oxide (ZnO), tin oxide (SnO), or a combination thereof. - It is noted that the
touch device 120 is directly formed on thetransparent cover 110 in the present embodiment, and thus no extra substrate is required to be disposed between thetouch device 120 and thetransparent cover 110 so that the total volume and the manufacturing cost of thetouch panel 100 are reduced. In other embodiments, thefirst touch electrodes 122 a and thesecond touch electrodes 126 a can be disposed respectively on two opposite substrates. - The
touch chip 150 is directly bonded on the layer ofconductive lines 140 through a chip-on-glass process, wherein an anisotropic conductive film (ACF) I is disposed between thetouch chip 150 and the layer ofconductive lines 140. The ACF I has a glue layer G and a plurality ofconductive particles 160 distributed in the glue layer G, and thetouch chip 150 is electrically connected to the layer ofconductive lines 140 through theconductive particles 160 of the ACF I. - It is noted that the light-
shielding layer 130 may be caved in due to the pressure generating during the process of bonding thetouch chip 150 on the layer ofconductive lines 140. Once the caving depth is too deep for theconductive particles 160 to firmly connect the layer ofconductive lines 140 to thetouch chip 150, the connection between the layer ofconductive lines 140 and thetouch chip 150 is insufficiently reliable. The thickness T1 of the light-shielding layer 130 is reduced in the present embodiment and a diameter D of eachconductive particle 160 is larger than the thickness T1 of the light-shielding layer 130 and also larger than the thickness T2 of the layer ofconductive lines 140. Accordingly, the diameter D of theconductive particles 160 is large enough to compensate the caving effect of the light-shielding layer 130 during the process of bonding thetouch chip 150 to the layer ofconductive lines 140. In other words, theconductive particles 160 are firmly connected with thetouch chip 150 and the layer ofconductive lines 140 simultaneously during the bonding process of thetouch chip 150 in the present embodiment, the yield rate is thus improved, and the cost is reduced. - Besides, the
touch panel 100 can further includes a flexible printedcircuit board 170 in the present embodiment which connects to the margin of thetransparent cover 110 and electrically connects the layer ofconductive lines 140. Moreover, thetouch panel 100 can be disposed on a display panel S, such as a liquid crystal display panel (LCD), a plasma display panel (PDP), an electronic paper display (EPD) panel, or an organic light emitting display (OLED) panel, and the display panel S can be selectively connected to thetouch chip 150. When a position of the user's touch on thetransparent cover 110 is determined by thetouch chip 150, a driving signal can be transmitted to the display panel S through thetouch chip 150 so that the display panel S is driven based on the signal to display a corresponding image. - In other embodiments, referring to
FIGS. 2A and 2B , thetouch device 120 a includes a plurality offirst touch electrodes 122 a and a plurality ofsecond touch electrodes 126 a. Thefirst touch electrodes 122 a are disposed on thedevice mounting surface 114 and eachfirst touch electrode 122 a extends along the first direction V1, and thesecond touch electrodes 126 a are disposed on thedevice mounting surface 114 and eachsecond touch electrode 126 a extends along the second direction V2, wherein thesecond touch electrodes 126 a are intersecting with thefirst touch electrodes 122 a. Besides, the first direction V1 is perpendicular to the second direction V2. Specifically, thefirst touch electrodes 122 a are electrode series consisting of a plurality of diamond patterns B1 serially connected through a plurality of connecting lines C1 and thesecond touch electrodes 126 a are electrode series consisting of a plurality of diamond patterns B2 serially connected through a plurality of connecting lines C2. It is noted that the diamond patterns B1 and B2 can be coplanar disposed. - In the aforesaid embodiments, the layer of
conductive lines 140 is fabricated before the fabrication of the diamond patterns B1 and B2. The layer ofconductive lines 140 are generally made of metal material and the diamond patterns B1 and B2 are made of transparent conductive material. Therefore, for the continuity of the lines in the layer of theconductive lines 140, a less-corrosive etching solution must be used in the patterning process for forming the diamond patterns B1 and B2 so that the damage of the layer ofconductive lines 140 is prevented. Nevertheless, based on the less-corrosive requirement, the transparent conductive layer including the diamond patterns B1 and B2 are fabricated by using a low temperature process. However, the transparent conductive layer fabricated through the low temperature process has relative poor light transmission characteristic and is not conducive to the application of thetouch panel 100. Accordingly, the dispositions of the layer ofconductive lines 140 and the diamond patterns B1 and B2 can be shown inFIG. 2C andFIG. 2D to enhance the process yield rate and the quality of thetouch panel 100. -
FIG. 2C is a cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ inFIG. 2B . Referring toFIG. 2C , thetransparent cover 110 is configured with thelight shielding layer 130, the layer ofconductive lines 140, thefirst touch electrodes 122 a, and thesecond touch electrodes 126 a, wherein thefirst touch electrode 122 a is formed by serially connecting of the diamond patterns B1 and the connecting lines C1. The drawing only shows the connecting line C2 of thesecond touch electrode 126 a while thesecond touch electrode 126 a is formed by serially connecting of the diamond patterns (not shown) and the connecting line C2. In addition, the insulatinglayer 180 is further disposed between the connecting line C1 and the connecting line C2 for the electrically insulation between the connecting lines C1 and the connecting line C2. It is noted that the layer ofconductive lines 140 and the connecting lines C1 are made of metal material and the diamond pattern B1 located at the terminal area is extended to the layer of theconductive lines 140 so as to form a plurality oftransparent pads 142. That is to say, the layer ofconductive lines 140 and the connecting lines C1 are completely covered by the insulating layer and elements made of transparent conductive material. Furthermore, thetransparent cover 110 is covered by apassivation layer 190 having a plurality ofopenings 192 exposing thetransparent pads 142. Accordingly, thetransparent pads 142 can be electrically connected to a plurality ofbumps 152 of thechip 150 through the ACF I. - Specifically, after the formation of the
light shielding layer 130, a patterned metal layer including the connecting lines C1 and the layer ofconductive lines 140 are subsequently formed. Thereafter, the patterned insulatinglayer 180 and a patterned transparent conductive layer including the diamond patterns B1 and B2, the connecting lines C2, and thetransparent pads 142 are formed. Subsequently, thepassivation layer 190 and theopenings 192 exposing thetransparent pads 142 are fabricated to form thetouch panel 100. In the present embodiment, the layer ofconductive lines 140 is not exposed during the process for patterning the transparent conductive layer so as to prevent from being damaged by the etching solution. Therefore, a high temperature process can be used to form the transparent conductive layer without damaging the layer ofconductive lines 140. Accordingly, the layer ofconductive lines 140 has desirable quality and reliability, and the diamond patterns B1 and B2 can have desirable light transmission characteristic. -
FIG. 2D is another cross-sectional view of the touch panel illustrated along the cross-sectional line X-X′ inFIG. 2B . Referring toFIG. 2D , the difference betweenFIG. 2C andFIG. 2D lies in that thetransparent pads 144 are not directly connected to the diamond pattern B1 located at the terminal area and theopenings 192 of thepassivation layer 190 substantially exposes thetransparent pads 144. It is noted that the layer ofconductive layer 140 shown inFIG. 2C andFIG. 2D is completely covered by the patterned transparent conductive layer and the insulatinglayer 180. Accordingly, the layer ofconductive lines 140 is not damaged by the etching solution used for patterning the transparent conductive layer and the transparent conductive layer can be fabricated by using a high temperature process to enhance the light transmission characteristic. - As shown in
FIG. 2A , thetouch panel 100 of the invention is not restricted to be adhered on the display panel S to form a touch display panel. In other embodiments, a transparent substrate or a protecting layer (not shown) can further be disposed on thedevice mounting surface 114, wherein thetouch device 120 is located between the transparent substrate (or the protecting layer) and thetransparent cover 110. That is to say, thetouch panel 100 of the present embodiment can be used individually or assembled with other display apparatus such as the display panel S to form a touch display panel. - As described above, for improving the poor reliance of the connection between the touch chip and the layer of conductive lines in the conventional design, the thickness of the light-
shielding layer 130 is reduced in the embodiment depicted inFIG. 1A so as to minimize the negative influence caused by the light-shielding layer 130 during the bonding process of thetouch chip 150. Accordingly, the layer ofconductive lines 140 and thetouch chip 150 are steadily electrically connected. Nevertheless, other methods can be adopted for achieving the aforesaid effect, e.g. a material with high hardness can be used to form the light-shielding layer 130 to enhance the supporting property of the light-shielding layer 130 and the embodiment ofFIG. 3 is provided to describe the example. -
FIG. 3 illustrates a cross-sectional view showing a touch panel disposed on a display panel according to another embodiment of the invention. Referring toFIG. 3 , thetouch panel 200 of the present embodiment is similar to thetouch panel 100 inFIG. 1A , and the difference between the two touch panels lies mainly in that the material of the light-shielding layer 130 intouch panel 200 is diamond-like carbon. Generally, the diamond-like carbon has high hardness so that the light-shielding layer 130 is difficultly caved in during the bonding process of thetouch chip 130 if the light-shielding layer 130 is made of the diamond-like carbon. Accordingly, the manufacturing yield rate is enhanced and the cost can be decreased. In the present embodiment, the material of the layer ofconductive lines 140 includes Al, Cu, Mo, Mo/Al alloy, Ti, Ti/Al alloy, Ag, Ag/Pd alloy or any combination of the foregoing. - In addition, the diamond-like carbon has good light-shielding property so that the thickness of the light-
shielding layer 130 can be relatively thin while still provides superior light-shielding effect. For example, the thickness of the light-shielding layer 130, e.g. 0.5 μm to 6 μm, can be smaller than the thickness the user's hand can feel, e.g. 0.5 μm to 6 μm. Therefore, in addition to be disposed on thedevice mounting surface 114, the light-shielding layer 130 can be disposed on thetouch surface 112 without generating the feeling of drop on the surface when the user touches thetouch panel 200. Herein,FIG. 4A andFIG. 4B are shown to exemplify the embodiment which has the light-shielding layer disposed on the touch surface. -
FIG. 4A illustrates a cross-sectional view showing a touch panel disposed on a display panel according to further another embodiment of the invention, andFIG. 4B illustrates a top view of the touch panel inFIG. 4A .FIG. 5 illustrates a top view of a different structure of the touch panel inFIG. 4B . - Referring to
FIGS. 4A and 4B , thetouch panel 300 of the present embodiment has a transparent region A1 and a peripheral region A2 surrounding the transparent region A1. Thetouch panel 300 includes atransparent cover 310, atouch device 320, a light-shielding layer 330, atouch chip 340, and a layer ofconductive lines 360. - The
transparent cover 310 has atouch surface 312 and adevice mounting surface 314 opposite thereto. Thetouch device 320 is disposed on thedevice mounting surface 314 and located at the transparent region A1. Thetouch chip 340 is disposed on thedevice mounting surface 314, located inside the peripheral region A2, and electrically connected to thetouch device 320. - In the present embodiment, the light-
shielding layer 330 can be disposed on thetouch surface 312 and located in the peripheral region A2 for shielding thetouch chip 340, wherein the material of the light-shielding layer 330 is diamond-like carbon. The diamond-like carbon has dense structure and is very hard so as to provide desirable light-shielding property and abrasion resistance. Accordingly, the light-shielding layer 330 is quite thin while still has good light-shielding effect. When the light-shielding layer 330 is configured on thetouch surface 312, no touch feeling of drop on the surface is caused by the light-shielding layer 330 during the user touches thetouch panel 300. - Accordingly, the layer of
conductive lines 360 can be directly disposed on thedevice mounting surface 314 in the present embodiment to enhance the manufacturing yield rate of the bonding process of thetouch chip 340 and reduce the cost. Moreover, the shape of the light-shielding layer 330 can be changed to form the transparent regions A1 with different shapes as shown inFIGS. 4B and 5 . - In summary, the touch device is directly formed on the transparent cover in the present invention, and thus no extra substrate is required to be disposed between the touch device and the transparent cover so that the total volume and the manufacturing cost of the touch panel are reduced. In addition, the total thickness of the light-shielding layer and the layer of conductive lines in the present invention is smaller than the diameter of the conductive particles. Therefore, the diameter of the conductive particles is large enough to ensure the connection between the layer of conductive lines and the touch chip during the chip-on-glass bonding process. Moreover, the light-shielding layer of the invention can be made of hard diamond-like carbon thereby providing sufficient support and high abrasion resistance and capable of being disposed on the device mounting surface or the touch surface. When the material of the light-shielding layer is diamond-like carbon, the thickness of the light-shielding layer is quite thin and still has desirable light-shielding effect. Therefore, the disposition of the light-shielding layer on the touch surface would not cause the touch feeling of drop during the user uses the touch panel.
- Although the invention has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiment may be made without departing from the spirit of the invention. Accordingly, the scope of the invention will be defined by the attached claims not by the above detailed descriptions.
Claims (16)
1. A touch panel with a transparent region and a peripheral region surrounding the transparent region comprising:
a transparent cover comprising a touch surface and a device mounting surface opposite thereto;
a touch device disposed on the device mounting surface and mainly located at the transparent region;
a layer of conductive lines disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device; and
a touch chip disposed on the layer of conductive lines through a chip-on-glass process.
2. The touch panel of claim 1 , further comprising an anisotropic conductive film disposed between the layer of conductive lines and the touch chip.
3. The touch panel of claim 2 , wherein the anisotropic conductive film comprises a plurality of conductive particles, and a diameter of each conductive particle is larger than a thickness of the layer of conductive lines.
4. The touch panel of claim 1 , wherein the touch device comprises:
a plurality of first touch electrodes disposed on the device mounting surface wherein each first touch electrode extends along a first direction;
an insulator layer disposed on the device mounting surface and covering the first touch electrodes; and
a plurality of second touch electrodes disposed on a surface of the insulator layer away from the first touch electrodes wherein each second touch electrode extends along a second direction substantially perpendicular to the first direction.
5. The touch panel of claim 4 , wherein the first touch electrodes and the second touch electrodes are band-like electrodes.
6. The touch panel of claim 4 , wherein the first touch electrodes and the second touch electrodes are electrode series consisting of a plurality of diamond patterns and connecting lines serially connected the diamond patterns.
7. The touch panel of claim 1 , wherein the touch device comprises:
a plurality of first touch electrodes disposed on the device mounting surface wherein each first touch electrode extends along a first direction; and
a plurality of second touch electrodes disposed on the device mounting surface to intersect the first touch electrodes wherein each second touch electrode extends along a second direction substantially perpendicular to the first direction.
8. The touch panel of claim 7 , wherein the first touch electrodes and the second touch electrodes are electrode series consisting of a plurality of diamond patterns and connecting lines serially connected the diamond patterns.
9. The touch panel of claim 8 , wherein the first touch electrodes and the second touch electrodes comprise a plurality of connection pads overlapping the layer of conductive lines.
10. The touch panel of claim 9 , wherein the touch chip comprises a plurality of connection bumps electrically connected with the connection pads.
11. The touch panel of claim 1 , further comprising:
a flexible printed circuit board electrically connected to the layer of conductive lines.
12. The touch panel of claim 1 , wherein a material of the layer of conductive lines comprises Cr, Al, Cu, Mo, Mo/Al alloy, Ti, Ti/Al alloy, Ag, Ag/Pd alloy, or a combination thereof.
13. A touch display panel comprising:
a touch panel with a transparent region and a peripheral region surrounding the transparent region comprising:
a transparent cover comprising a touch surface and a device mounting surface opposite thereto;
a touch device disposed on the device mounting surface and mainly located at the transparent region;
a layer of conductive lines disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device; and
a touch chip disposed on the layer of conductive lines through a chip-on-glass process; and
a display disposed on the touch panel.
14. The touch display panel of claim 13 , wherein the touch device comprises:
a plurality of first touch electrodes disposed on the device mounting surface wherein each first touch electrode extends along a first direction;
an insulator layer disposed on the device mounting surface and covering the first touch electrodes; and
a plurality of second touch electrodes disposed on the display wherein each second touch electrode extends along a second direction substantially perpendicular to the first direction.
15. The touch panel of claim 14 , wherein the first touch electrodes and the second touch electrodes are band-like electrodes.
16. The touch panel of claim 14 , wherein the first touch electrodes and the second touch electrodes are electrode series consisting of a plurality of diamond patterns and connecting lines serially connected the diamond patterns.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016101291A1 (en) * | 2014-12-24 | 2016-06-30 | 深圳市华星光电技术有限公司 | Touch display panel and touch display device |
CN110580113A (en) * | 2019-08-09 | 2019-12-17 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201124766A (en) * | 2010-01-08 | 2011-07-16 | Wintek Corp | Display device with touch panel |
KR101706232B1 (en) * | 2010-06-29 | 2017-02-15 | 엘지디스플레이 주식회사 | Touch Panel |
TWM394531U (en) * | 2010-07-07 | 2010-12-11 | Wistron Corp | Touch display device and electronic device using the same |
KR20120044501A (en) * | 2010-10-28 | 2012-05-08 | 삼성모바일디스플레이주식회사 | Display device having a touch screen panel and manufacturing method of the same |
US9652089B2 (en) | 2010-11-09 | 2017-05-16 | Tpk Touch Solutions Inc. | Touch panel stackup |
KR101094151B1 (en) * | 2011-03-03 | 2011-12-14 | 에쓰이에이치에프코리아 (주) | Method for fabricating transparent circuit substrate for touchscreen |
CN102681709B (en) * | 2011-03-17 | 2016-01-27 | 宸鸿光电科技股份有限公司 | Touch control display device and manufacture method thereof |
CN102955603B (en) * | 2011-08-17 | 2016-05-25 | 宸鸿科技(厦门)有限公司 | Contact panel and manufacture method thereof |
CN102999197B (en) * | 2011-09-10 | 2016-06-08 | 宸鸿科技(厦门)有限公司 | There is contact panel and the manufacture method thereof of shielding construction |
TWI471786B (en) * | 2011-10-13 | 2015-02-01 | Tpk Holding Co Ltd | Touch panel |
US9259904B2 (en) | 2011-10-20 | 2016-02-16 | Apple Inc. | Opaque thin film passivation |
US8780079B2 (en) * | 2011-11-15 | 2014-07-15 | Shenzhen Chi Na Star Optoelectronics Technology Co., Ltd. | Touch panel and method for detecting touch position thereof and touch display apparatus |
JP2013152562A (en) * | 2012-01-24 | 2013-08-08 | Japan Display West Co Ltd | Touch panel, manufacturing method of the same, display device and electronic apparatus |
WO2013141292A1 (en) * | 2012-03-21 | 2013-09-26 | 京セラ株式会社 | Input device, display device, electronic device, and mobile terminal |
JP6415798B2 (en) * | 2012-04-05 | 2018-10-31 | 大日本印刷株式会社 | Front protective plate for display device and display device |
CN102778973A (en) * | 2012-06-29 | 2012-11-14 | 苏州瀚瑞微电子有限公司 | Double-layer ITO (indium tin oxide) wiring structure |
JP5942725B2 (en) | 2012-09-18 | 2016-06-29 | デクセリアルズ株式会社 | Conductive sheet |
JP5917354B2 (en) * | 2012-09-27 | 2016-05-11 | アルプス電気株式会社 | Front panel with detection function |
US9323365B2 (en) * | 2012-10-29 | 2016-04-26 | Google Inc. | Masking an outer perimeter of a touch screen |
TWI559194B (en) * | 2012-11-05 | 2016-11-21 | 明興光電股份有限公司 | Touch panel and fabricating method thereof |
TWI466003B (en) * | 2012-12-26 | 2014-12-21 | Hannstouch Solution Inc | Touch panel |
TWI492114B (en) * | 2013-02-05 | 2015-07-11 | Quanta Comp Inc | Optical multi-touch device and its optical touch module |
KR101376342B1 (en) | 2013-02-25 | 2014-03-28 | (주)스마트로직 | Touch sensor integrated glass for touch screen |
US20140253459A1 (en) * | 2013-03-06 | 2014-09-11 | Maxim Integrated Products, Inc. | Chip-on-glass for touch applications |
KR20140122338A (en) * | 2013-04-09 | 2014-10-20 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Touch Panel, Preparing Method Thereof, and Ag-Pd-Nd Alloy for Touch Panel |
FR3008809B1 (en) | 2013-07-18 | 2017-07-07 | Fogale Nanotech | CUSTOM ACCESSORY DEVICE FOR AN ELECTRONIC AND / OR COMPUTER APPARATUS, AND APPARATUS EQUIPPED WITH SUCH AN ACCESSORY DEVICE |
US9292141B2 (en) | 2013-10-30 | 2016-03-22 | Apple Inc. | Double sided touch sensor on transparent substrate |
FR3013472B1 (en) | 2013-11-19 | 2016-07-08 | Fogale Nanotech | COVERING ACCESSORY DEVICE FOR AN ELECTRONIC AND / OR COMPUTER PORTABLE APPARATUS, AND APPARATUS EQUIPPED WITH SUCH AN ACCESSORY DEVICE |
KR20150061065A (en) * | 2013-11-25 | 2015-06-04 | 주성엔지니어링(주) | Apparatus, system and method of manufacturing a touch panel |
KR102174819B1 (en) * | 2014-06-25 | 2020-11-06 | 엘지디스플레이 주식회사 | Display device |
KR102237135B1 (en) * | 2014-07-14 | 2021-04-08 | 삼성디스플레이 주식회사 | Organic light emitting display device and method of manufacturing an organic light emitting display device |
CN105446511B (en) * | 2014-07-24 | 2019-03-05 | 宸鸿科技(厦门)有限公司 | Touch control display device |
CN104536603B (en) * | 2014-12-18 | 2018-01-09 | 深圳市华星光电技术有限公司 | Display and the panel with touch controllable function |
CN104503617B (en) * | 2014-12-26 | 2017-10-13 | 合肥鑫晟光电科技有限公司 | Border structure and its manufacture method, the touch-screen and display device of touch-screen |
CN104656990B (en) * | 2015-02-10 | 2018-01-09 | 业成光电(深圳)有限公司 | Touch module and its manufacture method |
US10114411B2 (en) * | 2015-03-20 | 2018-10-30 | Lg Electronics Inc. | Electronic device and manufacturing method therefor |
CN105045424B (en) * | 2015-08-06 | 2018-07-06 | 业成光电(深圳)有限公司 | Touch panel, bonding structure and flexible circuit board |
CN106484165B (en) * | 2015-08-31 | 2023-10-24 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
JP6411389B2 (en) * | 2016-02-04 | 2018-10-24 | 大日本印刷株式会社 | Front protective plate for display device and display device |
TWI601046B (en) * | 2016-04-07 | 2017-10-01 | 速博思股份有限公司 | Sensing device and method with functions of force measurement, touch control and fingerprint identification |
KR102521876B1 (en) | 2016-04-12 | 2023-04-18 | 삼성디스플레이 주식회사 | Electronic device and method of manufacturing the same |
KR102427303B1 (en) * | 2018-09-10 | 2022-08-01 | 삼성디스플레이 주식회사 | Display device |
US11290677B2 (en) | 2019-05-31 | 2022-03-29 | Apple Inc. | Ambient light sensor windows for electronic devices |
CN113012567A (en) * | 2019-12-19 | 2021-06-22 | 上海和辉光电有限公司 | Display panel and display device |
CN213241112U (en) * | 2020-09-28 | 2021-05-18 | 广州视睿电子科技有限公司 | Touch panel and electronic equipment |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5847690A (en) * | 1995-10-24 | 1998-12-08 | Lucent Technologies Inc. | Integrated liquid crystal display and digitizer having a black matrix layer adapted for sensing screen touch location |
US20100007627A1 (en) * | 2008-07-09 | 2010-01-14 | Chi Hsin Electronics Corp. | Touch signal transmission circuit and liquid crystal display using the same |
US20100085326A1 (en) * | 2008-10-03 | 2010-04-08 | Hitachi Displays, Ltd. | Display device |
US20100164881A1 (en) * | 2008-12-25 | 2010-07-01 | Au Optronics Corp. | Touch Panel Structure |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4869497B2 (en) * | 2001-05-30 | 2012-02-08 | 株式会社半導体エネルギー研究所 | Display device |
TWI268615B (en) * | 2005-04-08 | 2006-12-11 | Au Optronics Corp | Methods for fabricating array substrate and thin film transistor array substrate |
TWI322374B (en) | 2006-04-14 | 2010-03-21 | Ritdisplay Corp | Light transmission touch panel and manufacturing method thereof |
JP5051690B2 (en) * | 2007-01-30 | 2012-10-17 | 株式会社ジャパンディスプレイウェスト | Display device with input function |
TWI358832B (en) * | 2007-02-26 | 2012-02-21 | Au Optronics Corp | Semiconductor device and manufacturing method ther |
US9007309B2 (en) * | 2007-04-05 | 2015-04-14 | Japan Display Inc. | Input device, and electro-optical device |
TW200842681A (en) | 2007-04-27 | 2008-11-01 | Tpk Touch Solutions Inc | Touch pattern structure of a capacitive touch panel |
TWI334503B (en) * | 2007-10-12 | 2010-12-11 | Au Optronics Corp | Touch-sensing flat panel display and method for manufacturing the same |
TWM329818U (en) * | 2007-10-17 | 2008-04-01 | Universal Scient Ind Co Ltd | Portable electronic device with anisotropic conductive unit |
TW200941305A (en) * | 2008-03-19 | 2009-10-01 | Chi Hsin Electronics Corp | A touch-control signal transmission circuit and a liquid crystal display using the same |
TWI361996B (en) * | 2008-03-21 | 2012-04-11 | Elan Microelectronics Corp | Touch panel device |
TW200943160A (en) * | 2008-04-14 | 2009-10-16 | Emerging Display Tech Corp | Circuit configuration of capacitor-type touch panel |
TWM357659U (en) | 2008-07-09 | 2009-05-21 | Chi Hsin Electronics Corp | Touch panel structure |
US8115751B2 (en) * | 2008-12-30 | 2012-02-14 | Young Fast Optoelectronics Co., Ltd. | Capacitive touch sensing assembly |
TWM368846U (en) * | 2009-06-26 | 2009-11-11 | Young Fast Optoelectronics Co | Improved structure of touch panel |
-
2009
- 2009-12-14 TW TW098142749A patent/TWI404994B/en not_active IP Right Cessation
-
2010
- 2010-03-26 US US12/732,193 patent/US8570288B2/en not_active Expired - Fee Related
-
2013
- 2013-09-24 US US14/034,568 patent/US20140022469A1/en not_active Abandoned
- 2013-09-24 US US14/034,567 patent/US20140022468A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5847690A (en) * | 1995-10-24 | 1998-12-08 | Lucent Technologies Inc. | Integrated liquid crystal display and digitizer having a black matrix layer adapted for sensing screen touch location |
US20100007627A1 (en) * | 2008-07-09 | 2010-01-14 | Chi Hsin Electronics Corp. | Touch signal transmission circuit and liquid crystal display using the same |
US20100085326A1 (en) * | 2008-10-03 | 2010-04-08 | Hitachi Displays, Ltd. | Display device |
US20100164881A1 (en) * | 2008-12-25 | 2010-07-01 | Au Optronics Corp. | Touch Panel Structure |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016101291A1 (en) * | 2014-12-24 | 2016-06-30 | 深圳市华星光电技术有限公司 | Touch display panel and touch display device |
CN110580113A (en) * | 2019-08-09 | 2019-12-17 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
WO2021027161A1 (en) * | 2019-08-09 | 2021-02-18 | 武汉华星光电半导体显示技术有限公司 | Oled display panel and display apparatus |
US11329106B2 (en) | 2019-08-09 | 2022-05-10 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Organic light emitting diode (OLED) display panel and display device |
Also Published As
Publication number | Publication date |
---|---|
US8570288B2 (en) | 2013-10-29 |
TW201120511A (en) | 2011-06-16 |
US20140022469A1 (en) | 2014-01-23 |
US20110141034A1 (en) | 2011-06-16 |
TWI404994B (en) | 2013-08-11 |
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