US20140000854A1 - Heat-dissipation base structure - Google Patents

Heat-dissipation base structure Download PDF

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Publication number
US20140000854A1
US20140000854A1 US13/538,625 US201213538625A US2014000854A1 US 20140000854 A1 US20140000854 A1 US 20140000854A1 US 201213538625 A US201213538625 A US 201213538625A US 2014000854 A1 US2014000854 A1 US 2014000854A1
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US
United States
Prior art keywords
heat
arm portion
main board
dissipation base
base structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/538,625
Inventor
Fu-Jung Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/538,625 priority Critical patent/US20140000854A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WU, FU-JUNG
Publication of US20140000854A1 publication Critical patent/US20140000854A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
    • F28F9/002—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core with fastening means for other structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-dissipation base structure, and more particularly to a heat-dissipation base structure that has increased structural strength and ensures tight contact with a heat source to reduce the thermal resistance thereof.
  • the currently available electronic apparatuses or electronic devices all include a computing electronic element, which would produce heat during operation thereof but could not dissipate heat by itself. Therefore, the electronic apparatuses or devices require a heat dissipation unit to assist in the dissipation of heat produced by the computing electronic element thereof.
  • Some common heat dissipation units include heat sinks, radiating fin assemblies, heat pipes, heat dissipating plates, vapor chambers and so on. Since the heat-producing electronic elements for various electronic devices are different in size and specification, not all the above-mentioned heat dissipation units can be directly connected to a heat source.
  • a heat dissipation unit is first assembled to a heat-dissipation base, and the heat-dissipation base is then brought to contact with a heat-producing electronic element to assist in the dissipation of heat produced by the electronic element.
  • the heat-dissipation base in contact with the heat-producing electronic element must be retained to a desired position.
  • the heat-dissipation base usually includes arm portions extended from four corners thereof, and the arm portions are provided at their respective distal end with a mounting hole. Via the mounting holes, fastening elements can be extended into a circuit board, on which the electronic element is mounted, so that the heat-dissipation base is locked to the circuit board and in tight contact with the heat-producing electronic element.
  • the heat-dissipation base is manufactured by stamping or punching a sheet material.
  • the extended arm portions of the heat-dissipation base are thin and long and therefore have relatively weak structural strength.
  • the arm portions are subject to deformation due to the fastening force applied thereto, making the heat-dissipation base a defective product, which causes inconvenience in mounting and increased production cost.
  • a primary object of the present invention is to provide a heat-dissipation base structure having increased structural strength and ensuring tight contact with a heat source to reduce the thermal resistance thereof.
  • FIG. 2 is an assembled view of FIG. 1 ;
  • FIG. 3 is a sectional side view of FIG. 2 ;
  • the main board 1 has four chamfered corners to form four pressing ends 11 , and is provided on an upper face thereof with at least one retaining section 12 .
  • the mounting member 2 is provided with at least one locating section 21 corresponding to the at least one retaining section 12 .
  • the mounting member 2 is connected to the main board 1 via engagement of the at least one locating section 21 with the at least one retaining section 12 .
  • the retaining section 12 is in the form of a stub and the locating section 21 is in the form of a through hole.
  • the retaining section 12 and the locating section 21 are not necessarily limited to the form of stub and through hole, and the mounting member 2 can be connected to the main board 1 by scarf joint, snap-on joint, or welding.
  • FIG. 4 is an assembled perspective view of a heat-dissipation base structure according to a second embodiment of the present invention.
  • the second embodiment is generally structurally similar to the first embodiment, except that, in the second embodiment, the arm portion 22 further includes a bent section 224 .
  • the downward protruded portion 221 is also formed on one side surface of the bent section 224 facing toward the main board 1 .
  • the downward protruded portion 221 may be a continuously extended single portion or include several serially spaced portions. In the illustrated embodiments, the downward protruded portion 221 is shown as a continuously extended single portion.

Abstract

A heat-dissipation base structure includes a main board and at least one mounting member. The main board has four chamfered corners to form four pressing ends and is provided on an upper face with at least one retaining section. The mounting member is provided with at least one locating section for engaging with the at least one retaining section, and includes at least one outward extended arm portion. The arm portion is formed along a bottom with a downward protruded portion, so an opening is formed on the arm portion at a proximal end of the downward protruded portion for engaging with one pressing end of the main board when the mounting member and the arm portion are mounted to the upper face of the main board. Therefore, the heat-dissipation base structure has increased structural strength and the arm portion is less possibly deformed due to bending stress therein.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat-dissipation base structure, and more particularly to a heat-dissipation base structure that has increased structural strength and ensures tight contact with a heat source to reduce the thermal resistance thereof.
    • BACKGROUND OF THE INVENTION
  • The currently available electronic apparatuses or electronic devices all include a computing electronic element, which would produce heat during operation thereof but could not dissipate heat by itself. Therefore, the electronic apparatuses or devices require a heat dissipation unit to assist in the dissipation of heat produced by the computing electronic element thereof. Some common heat dissipation units include heat sinks, radiating fin assemblies, heat pipes, heat dissipating plates, vapor chambers and so on. Since the heat-producing electronic elements for various electronic devices are different in size and specification, not all the above-mentioned heat dissipation units can be directly connected to a heat source. Usually, a heat dissipation unit is first assembled to a heat-dissipation base, and the heat-dissipation base is then brought to contact with a heat-producing electronic element to assist in the dissipation of heat produced by the electronic element. The heat-dissipation base in contact with the heat-producing electronic element must be retained to a desired position. To do so, the heat-dissipation base usually includes arm portions extended from four corners thereof, and the arm portions are provided at their respective distal end with a mounting hole. Via the mounting holes, fastening elements can be extended into a circuit board, on which the electronic element is mounted, so that the heat-dissipation base is locked to the circuit board and in tight contact with the heat-producing electronic element.
  • Conventionally, the heat-dissipation base is manufactured by stamping or punching a sheet material. The extended arm portions of the heat-dissipation base are thin and long and therefore have relatively weak structural strength. In the process of extending fastening elements through the mounting holes on the distal ends of the arm portions, the arm portions are subject to deformation due to the fastening force applied thereto, making the heat-dissipation base a defective product, which causes inconvenience in mounting and increased production cost.
    • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a heat-dissipation base structure having increased structural strength and ensuring tight contact with a heat source to reduce the thermal resistance thereof.
  • To achieve the above and other objects, the heat-dissipation base structure according to the present invention includes a main board and at least one mounting member. The main board has four chamfered corners to form four pressing ends and is provided on an upper face with at least one retaining section. The mounting member is provided with at least one locating section for engaging with the at least one retaining section, and includes at least one outward extended arm portion. The arm portion is formed along a bottom with a downward protruded portion, such that an opening is formed on the arm portion at a proximal end of the downward protruded portion for engaging with one pressing end of the main board when the mounting member and the arm portion are mounted to the upper face of the main board. With the above arrangements, the heat-dissipation base structure has increased structural strength and the arm portion is less possibly deformed due to a bending stress thereof.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
  • FIG. 1 is an exploded perspective view of a heat-dissipation base structure according to a first embodiment of the present invention;
  • FIG. 2 is an assembled view of FIG. 1;
  • FIG. 3 is a sectional side view of FIG. 2; and
  • FIG. 4 is an assembled perspective view of a heat-dissipation base structure according to a second embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
  • Please refer to FIGS. 1 and 2 that are exploded and assembled perspective views, respectively, of a heat-dissipation base structure according to a first embodiment of the present invention, and to FIG. 3 that is a sectional side view of FIG. 2. As shown, the heat-dissipation base structure in the first embodiment includes a main board 1 and at least one mounting member 2.
  • The main board 1 has four chamfered corners to form four pressing ends 11, and is provided on an upper face thereof with at least one retaining section 12. The mounting member 2 is provided with at least one locating section 21 corresponding to the at least one retaining section 12.
  • The mounting member 2 is connected to the main board 1 via engagement of the at least one locating section 21 with the at least one retaining section 12. In the illustrated first embodiment, the retaining section 12 is in the form of a stub and the locating section 21 is in the form of a through hole. However, it is understood the retaining section 12 and the locating section 21 are not necessarily limited to the form of stub and through hole, and the mounting member 2 can be connected to the main board 1 by scarf joint, snap-on joint, or welding.
  • The mounting member 2 includes at least one arm portion 22 horizontally outward extended from an end thereof. The arm portion 22 is so configured that it has at least one downward protruded portion 221 formed along a bottom thereof, and an opening 222 is formed on the arm portion 22 at a proximal end of the downward protruded portion 221. The arm portion 22 is provided at a distal end thereof with at least one mounting hole 223.
  • The mounting member 2 is mounted to the upper face of the main board 1 with the arm portion 22 angularly projected beyond one corner of the main board 1, such that the downward protruded portion 221 of the arm portion 22 is located below a plane defined by a lower face of the main board 1 and the pressing end 11 at each corner of the main board 1 is aligned and engaged with the opening 222 on the corresponding arm portion 22.
  • To assemble the main board 1 and the mounting member 2 to each other, simply align and engage the locating sections 21 on the mounting member 2 with the retaining sections 12 on the main board 1, and the pressing ends 11 of the main board 1 will respectively engage with the opening 222 on the corresponding arm portion 22 of the mounting member 2. With these arrangements, the mounting member 2 can have effectively increased structural strength to bear the force externally applied to the arm portion 22. The downward protruded portion 221 of the arm portion 22 located lower than the main board 1 also functions to prevent the arm portion 22 from deformation due to the bending moment stress in the arm portion 22 under the force externally applied thereto. With the arm portion 22 having increased structural strength, it is also possible for the main board 1 to more tightly contact with the heat source to reduce the thermal resistance of the heat-dissipation base structure of the present invention.
  • FIG. 4 is an assembled perspective view of a heat-dissipation base structure according to a second embodiment of the present invention. As shown, the second embodiment is generally structurally similar to the first embodiment, except that, in the second embodiment, the arm portion 22 further includes a bent section 224. The downward protruded portion 221 is also formed on one side surface of the bent section 224 facing toward the main board 1. In the present invention, the downward protruded portion 221 may be a continuously extended single portion or include several serially spaced portions. In the illustrated embodiments, the downward protruded portion 221 is shown as a continuously extended single portion. With the bent section 224 and the downward protruded portion 221, the arm portion 22 may have further increased structural strength to resist any deformation thereof when the mounting member 2 is fastened to a circuit board via the mounting hole 223. Again, the arm portion 22 with further increased structural strength also enables the main board 1 to more tightly contact with the heat source to reduce the thermal resistance of the heat-dissipation base structure of the present invention.
  • The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (7)

What is claimed is:
1. A heat-dissipation base structure, comprising:
a main board having four chamfered corners to form a pressing end each, and being provided on an upper face with at least one retaining section; and
at least one mounting member being provided with at least one locating section for correspondingly engaging with the at least one retaining section on the main board, and including at least one horizontally outward extended arm portion; the arm portion being so configured that a downward protruded portion is formed along a bottom thereof and an opening is formed on the arm portion at a proximal end of the downward protruded portion to correspond to one pressing end of the main board.
2. The heat-dissipation base structure as claimed in claim 1, wherein the arm portion is provided on a distal end thereof with at least one mounting hole.
3. The heat-dissipation base structure as claimed in claim 1, wherein the mounting member and the arm portion are connected to the upper face of the main board.
4. The heat-dissipation base structure as claimed in claim 3, wherein the downward protruded portion of the arm portion is located below a plane defined by a lower face of the main board.
5. The heat-dissipation base structure as claimed in claim 1, wherein the pressing end at each corner of the main board is aligned and engaged with the opening at the proximal end of the downward protruded portion of the arm portion.
6. The heat-dissipation base structure as claimed in claim 1, wherein the arm portion further includes a bent section.
7. The heat-dissipation base structure as claimed in claim 6, wherein the downward protruded portion is also formed on one side surface of the bent section facing toward the main board.
US13/538,625 2012-06-29 2012-06-29 Heat-dissipation base structure Abandoned US20140000854A1 (en)

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Application Number Priority Date Filing Date Title
US13/538,625 US20140000854A1 (en) 2012-06-29 2012-06-29 Heat-dissipation base structure

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US13/538,625 US20140000854A1 (en) 2012-06-29 2012-06-29 Heat-dissipation base structure

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3180595A (en) * 1962-03-29 1965-04-27 Ra Ma Company Inc Wall fixture mounting
US4745456A (en) * 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
US6055159A (en) * 1999-08-20 2000-04-25 Compal Electronics, Inc. Heat dissipating module for a heat generating electronic component
US20040070940A1 (en) * 2002-10-15 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component
US20040070935A1 (en) * 2002-10-15 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus having a liquid-coolant circulation path and an electric-signal cable
US20060120053A1 (en) * 2004-12-04 2006-06-08 Foxconn Technology Co., Ltd. Universal locking device for heat sink
US7190586B2 (en) * 2004-03-03 2007-03-13 Hewlett-Packard Development Company, L.P. Heat sink retention assembly and related methods
US7239518B2 (en) * 2005-11-01 2007-07-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Universal locking device for heat sink
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
US7808782B2 (en) * 2007-03-14 2010-10-05 Asia Vital Components Co., Ltd. Support device for heat dissipation module
US20100307719A1 (en) * 2009-06-04 2010-12-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and method of manufacturing the same
US20110149506A1 (en) * 2009-12-23 2011-06-23 Coolit Systems Inc. Adjustable mounting bracket for a computer component

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3180595A (en) * 1962-03-29 1965-04-27 Ra Ma Company Inc Wall fixture mounting
US4745456A (en) * 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
US6055159A (en) * 1999-08-20 2000-04-25 Compal Electronics, Inc. Heat dissipating module for a heat generating electronic component
US20040070940A1 (en) * 2002-10-15 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component
US20040070935A1 (en) * 2002-10-15 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus having a liquid-coolant circulation path and an electric-signal cable
US7190586B2 (en) * 2004-03-03 2007-03-13 Hewlett-Packard Development Company, L.P. Heat sink retention assembly and related methods
US20060120053A1 (en) * 2004-12-04 2006-06-08 Foxconn Technology Co., Ltd. Universal locking device for heat sink
US7239518B2 (en) * 2005-11-01 2007-07-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Universal locking device for heat sink
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
US7808782B2 (en) * 2007-03-14 2010-10-05 Asia Vital Components Co., Ltd. Support device for heat dissipation module
US20100307719A1 (en) * 2009-06-04 2010-12-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and method of manufacturing the same
US20110149506A1 (en) * 2009-12-23 2011-06-23 Coolit Systems Inc. Adjustable mounting bracket for a computer component

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Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WU, FU-JUNG;REEL/FRAME:028472/0795

Effective date: 20120615

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION