US20130327508A1 - Cold plate assembly incorporating thermal heat spreader - Google Patents

Cold plate assembly incorporating thermal heat spreader Download PDF

Info

Publication number
US20130327508A1
US20130327508A1 US13/490,538 US201213490538A US2013327508A1 US 20130327508 A1 US20130327508 A1 US 20130327508A1 US 201213490538 A US201213490538 A US 201213490538A US 2013327508 A1 US2013327508 A1 US 2013327508A1
Authority
US
United States
Prior art keywords
cold plate
heat spreader
recited
plate assembly
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/490,538
Other languages
English (en)
Inventor
Mark A. Zaffetti
Jeremy M. Strange
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamilton Sundstrand Space System International Inc
Original Assignee
Hamilton Sundstrand Space System International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamilton Sundstrand Space System International Inc filed Critical Hamilton Sundstrand Space System International Inc
Priority to US13/490,538 priority Critical patent/US20130327508A1/en
Assigned to HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC. reassignment HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Strange, Jeremy M., ZAFFETTI, MARK A.
Priority to JP2013111435A priority patent/JP2013254953A/ja
Priority to EP13169616.3A priority patent/EP2672512B1/fr
Publication of US20130327508A1 publication Critical patent/US20130327508A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • FIG. 3 is an exploded view of the example cold plate assembly.
  • FIG. 5 is a perspective view of an example heat spreader assembly.
  • the heat generating devices 12 are mounted to a specific location on the mounting surface 14 . Accordingly, generated heat is not evenly produced across the mounting surface 14 .
  • the example cold plate assembly 10 includes the heat spreader 20 that is attached to a top parting sheet 38 .
  • the parting sheet 38 provides a top layer to seal a conduit through which a fluid medium is provided through inlets 42 .
  • a middle parting sheet 36 is disposed in a middle portion of the cold plate assembly and supports a closure bar 32 .
  • the closure bar 32 surrounds a finned layer 28 . Fluid flows through the fins 28 to remove thermal energy produced by the heat generating devices 12 .
  • additional heat spreaders could be included within the example cold plate assembly 10 .
  • an additional heat spreader could be installed between the finned layers 28 , 30 to further enhance heat removal.
  • the example heat spreader assembly 20 includes a top skin 22 and a bottom skin 26 that sandwiches a middle skin 24 there between.
  • Each of the top and bottom skins 22 , 26 are fabricated of a brazeable material.
  • the middle skin 24 of the example heat spreader assembly is fabricated from an APG material.
  • the APG material provides for the dissipation and spreading of heat in a direction that is perpendicular to a thickness of the heat spreader assembly.
  • the brazed joint 46 between the heat spreader assembly and the remainder of the cold plate assembly 10 provides a less restrictive thermal conduit through which heat may be dissipated from the mounting surface 14 through the top or first parting sheet 38 into the fin sections 28 , 30 where the heat may be carried off by a flow of cooling medium indicated at 58 in FIG. 1 .
  • the example cold plate assembly 10 is assembled by mounting the layer of fins 28 , 30 to first and second sides of the middle sheet 36 .
  • Each of the layers of fins 28 , 30 are then surround by closure bars 32 , 34 to define a boundary for cooling medium.
  • the fin sections 28 , 30 comprise ruffled fins that have an undulating surface.
  • Onto each side of the fin layers 28 , 30 is brazed and attached parting sheets 38 , 40 to define and passages through the fin sections 28 , 30 by closing off one side of the passages 54 through the fins 50 .
  • top (first) parting sheet 38 is attached utilizing a brazed joint 48 to a top surface of the closure bar 32 and the accompanying fin layer 28 .
  • a corresponding bottom (second) sheet 40 is attached through brazed joint 48 to the closure bar 34 and over the fin layer 30 .

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US13/490,538 2012-06-07 2012-06-07 Cold plate assembly incorporating thermal heat spreader Abandoned US20130327508A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/490,538 US20130327508A1 (en) 2012-06-07 2012-06-07 Cold plate assembly incorporating thermal heat spreader
JP2013111435A JP2013254953A (ja) 2012-06-07 2013-05-28 冷却板アセンブリおよびその製造方法
EP13169616.3A EP2672512B1 (fr) 2012-06-07 2013-05-29 Ensemble de plaque froide incorporant un dissipateur de chaleur thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/490,538 US20130327508A1 (en) 2012-06-07 2012-06-07 Cold plate assembly incorporating thermal heat spreader

Publications (1)

Publication Number Publication Date
US20130327508A1 true US20130327508A1 (en) 2013-12-12

Family

ID=48576751

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/490,538 Abandoned US20130327508A1 (en) 2012-06-07 2012-06-07 Cold plate assembly incorporating thermal heat spreader

Country Status (3)

Country Link
US (1) US20130327508A1 (fr)
EP (1) EP2672512B1 (fr)
JP (1) JP2013254953A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150096719A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Apparatus for Dissipating Heat
DE102018205568A1 (de) * 2018-04-12 2019-10-17 Volkswagen Aktiengesellschaft Bauteil mit verbesserter Kühlleistung und Kraftfahrzeug mit zumindest einem Bauteil
WO2021086893A3 (fr) * 2019-10-30 2021-07-15 Raytheon Company Plaques froides fabriquées de manière additive par ultrasons sur des dissipateurs thermiques

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018518020A (ja) * 2015-05-15 2018-07-05 モーメンティブ・パフォーマンス・マテリアルズ・インク 熱管理のための熱分解グラファイトを用いた発光ダイオードアセンブリ
GB2569306A (en) 2017-12-12 2019-06-19 Rolls Royce Plc Thermal management device
US11877425B2 (en) 2021-05-28 2024-01-16 Gm Cruise Holdings Llc Heat spreader with integrated fins

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375570A (en) * 1965-03-15 1968-04-02 Mcdonnell Aircraft Corp Fluxless brazing of aluminum heat exchangers
US4373243A (en) * 1977-04-23 1983-02-15 Sumitomo Precision Products Co. Ltd. Method of forming reinforced plate-type heat exchanger
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
US20050111188A1 (en) * 2003-11-26 2005-05-26 Anandaroop Bhattacharya Thermal management device for an integrated circuit
US6944022B1 (en) * 2002-08-30 2005-09-13 Themis Computer Ruggedized electronics enclosure
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement
US20060086493A1 (en) * 2004-10-06 2006-04-27 Kikuo Fujiwara Sandwiched thermal solution
US20060225874A1 (en) * 2005-04-11 2006-10-12 Shives Gary D Sandwiched thermal article
US20070023168A1 (en) * 2005-07-27 2007-02-01 Behr Industry Gmbh & Co. Kg Apparatus for cooling electronic components
US20100276135A1 (en) * 2007-12-14 2010-11-04 Toyota Jidosha Kabushiki Kaisha Cooling fin and manufacturing method of the cooling fin
US8804337B2 (en) * 2012-03-26 2014-08-12 Hamilton Sundstrand Space Systems International, Inc. Structural assembly for cold plate cooling

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7393587B2 (en) * 2004-09-17 2008-07-01 Graftech International Holdings Inc. Sandwiched finstock
US7539019B2 (en) * 2007-07-31 2009-05-26 Adc Telecommunications, Inc. Apparatus for transferring heat from a heat spreader
US8522861B2 (en) * 2010-03-29 2013-09-03 Hamilton Sundstrand Space Systems International, Inc. Integral cold plate and structural member

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375570A (en) * 1965-03-15 1968-04-02 Mcdonnell Aircraft Corp Fluxless brazing of aluminum heat exchangers
US4373243A (en) * 1977-04-23 1983-02-15 Sumitomo Precision Products Co. Ltd. Method of forming reinforced plate-type heat exchanger
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
US6944022B1 (en) * 2002-08-30 2005-09-13 Themis Computer Ruggedized electronics enclosure
US20050111188A1 (en) * 2003-11-26 2005-05-26 Anandaroop Bhattacharya Thermal management device for an integrated circuit
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement
US20060086493A1 (en) * 2004-10-06 2006-04-27 Kikuo Fujiwara Sandwiched thermal solution
US20060225874A1 (en) * 2005-04-11 2006-10-12 Shives Gary D Sandwiched thermal article
US20070023168A1 (en) * 2005-07-27 2007-02-01 Behr Industry Gmbh & Co. Kg Apparatus for cooling electronic components
US20100276135A1 (en) * 2007-12-14 2010-11-04 Toyota Jidosha Kabushiki Kaisha Cooling fin and manufacturing method of the cooling fin
US8804337B2 (en) * 2012-03-26 2014-08-12 Hamilton Sundstrand Space Systems International, Inc. Structural assembly for cold plate cooling

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150096719A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Apparatus for Dissipating Heat
DE102018205568A1 (de) * 2018-04-12 2019-10-17 Volkswagen Aktiengesellschaft Bauteil mit verbesserter Kühlleistung und Kraftfahrzeug mit zumindest einem Bauteil
WO2021086893A3 (fr) * 2019-10-30 2021-07-15 Raytheon Company Plaques froides fabriquées de manière additive par ultrasons sur des dissipateurs thermiques
US11305373B2 (en) 2019-10-30 2022-04-19 Raytheon Company Ultrasonic additively manufactured coldplates on heat spreaders

Also Published As

Publication number Publication date
JP2013254953A (ja) 2013-12-19
EP2672512B1 (fr) 2019-05-22
EP2672512A3 (fr) 2017-04-05
EP2672512A2 (fr) 2013-12-11

Similar Documents

Publication Publication Date Title
EP2672512B1 (fr) Ensemble de plaque froide incorporant un dissipateur de chaleur thermique
US8561673B2 (en) Sealed self-contained fluidic cooling device
US10641558B2 (en) Multi-layered counterflow expanding microchannel cooling architecture and system thereof
KR101865635B1 (ko) 액체 냉각을 위한 내부 캐비티를 갖는 히트싱크
US20180154754A1 (en) Apparatus for supporting a battery
US10842047B1 (en) Phased array antenna
US10212862B2 (en) Cooling apparatus and method
JP5681487B2 (ja) ヒートパイプの放散システムと方法
CN102209456A (zh) 整体式冷板和结构构件
US9939212B2 (en) Method for improving fluid flow characteristics, heat exchanger, distillation apparatus and deodorizing apparatus with the same applied thereto, and expanded metal used for the same
US8082978B2 (en) Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
JP6879722B2 (ja) 熱電発電システム及びこれを含む車両用排気マニホールド
US20040179338A1 (en) Loop thermosyphon with wicking structure and semiconductor die as evaporator
EP3850662B1 (fr) Base de module avec diffuseur thermique intégré et dissipateur thermique pour la gestion thermique et structurelle de circuits intégrés à haute performance ou d'autres dispositifs
JP7049849B2 (ja) 冷却装置
JP2011069552A (ja) 熱交換器
US20210247151A1 (en) Fluid-based cooling device for cooling at least two distinct first heat-generating elements of a heat source assembly
US20220192050A1 (en) Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamber
JP2011159663A (ja) 半導体装置
JP7031524B2 (ja) 冷却器
JP2014115054A (ja) 自励振動式ヒートパイプ
CN113646886A (zh) 板层叠型热交换器
CN206273029U (zh) 电源模块用基座
JP2014053471A (ja) 冷却装置
JP2009264719A (ja) 熱交換器

Legal Events

Date Code Title Description
AS Assignment

Owner name: HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, I

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZAFFETTI, MARK A.;STRANGE, JEREMY M.;REEL/FRAME:028333/0166

Effective date: 20120606

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION