US20130264042A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20130264042A1
US20130264042A1 US13/533,989 US201213533989A US2013264042A1 US 20130264042 A1 US20130264042 A1 US 20130264042A1 US 201213533989 A US201213533989 A US 201213533989A US 2013264042 A1 US2013264042 A1 US 2013264042A1
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United States
Prior art keywords
heat
tooth
dissipation device
teeth
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/533,989
Inventor
Ji-Yun Qin
Qiang YAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Champ Tech Optical Foshan Corp
Foxconn Technology Co Ltd
Original Assignee
Champ Tech Optical Foshan Corp
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Champ Tech Optical Foshan Corp, Foxconn Technology Co Ltd filed Critical Champ Tech Optical Foshan Corp
Assigned to FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: QIN, Ji-yun, YAN, QIANG
Publication of US20130264042A1 publication Critical patent/US20130264042A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4878Mechanical treatment, e.g. deforming
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure relates to heat dissipation devices, and particularly to a heat dissipation device comprising at least two heat sinks connected together.
  • heat-generating electronic components such as CPUs (central processing units) provide improved performance such as faster processing speeds.
  • electronic components also tend to generate increased amounts of heat, which requires immediate dissipation.
  • a heat sink is employed to provide such heat dissipation. The heat sink absorbs heat from the electronic component and dissipates the heat to ambient air.
  • the dimension of the heat sink has to be changed.
  • a change of the die for forming the heat sink raises a considerable cost burden.
  • a larger heat sink for a high power electronic component needs to be manufactured by driving an aluminum stock through a large mold, which is difficultly manufactured and requires a high manufacture cost.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device, according to an exemplary embodiment.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is a partial, front view of the heat dissipation device of FIG. 1 , wherein the heat dissipation device is partially assembled.
  • FIG. 4 is partial, front view of the heat dissipation device of FIG. 1 , wherein the heat dissipation device is substantially assembled together.
  • the heat dissipation device 10 includes a first heat sink 100 and a second heat sink 200 jointed to the first heat sink 100 .
  • Each of the first heat sink 100 and the second heat sink 200 is integrally formed of a metal with a good heat conductivity such as aluminum.
  • each of the first heat sink 100 and the second heat sink 200 is made of aluminum extrusion and is extruded along a lengthways direction from a front end to a rear end thereof.
  • the first heat sink 100 includes a first heat spreader 110 and a plurality of spaced fins 120 extending upwardly from a top surface of the first heat spreader 110 .
  • the first heat spreader 110 comprises a receiving structure 130 at a lateral portion thereof.
  • the receiving structure 130 includes a first tooth 131 , two second teeth 132 and two third teeth 133 .
  • the second teeth 132 are spaced to the first tooth 131 and respectively located at a top side and a bottom side of the first tooth 131 .
  • the third teeth 133 are spaced to the second teeth 132 .
  • One of the third teeth 133 is located at a top side of a higher second tooth 132
  • the other third tooth 133 is located at a bottom side of a lower second tooth 132 .
  • each of the second teeth 132 is located between the first tooth 131 and a corresponding third tooth 133 .
  • the first tooth 131 , the second teeth 132 and the third teeth 133 extend along the lengthways direction and each have a length as same as that of the first heat spreader 110 .
  • the first heat spreader 110 defines a first groove 134 between the first tooth 131 and each of the second teeth 132 , and defines a second groove 135 between each of the second teeth 132 and an adjoining third tooth 133 .
  • the first tooth 131 is symmetric about a central horizontal line.
  • the first tooth 131 has a thickness gradually increasing from a root jointed to the first heat spreader 110 to an outer free end thereof.
  • Each of the second teeth 132 has a thickness gradually decreasing from a root jointed to the first heat spreader 110 to an outer free end thereof.
  • the first tooth 131 has a dovetailed section and each of the second teeth 132 has a triangular section as viewed from a front end of the first heat spreader 110 .
  • Each of the third teeth 133 has a rectangular configuration as viewed from the front end of the first heat spreader 110 .
  • the first tooth 131 has an inclined clasping surface 131 a respectively at a top side and a bottom side thereof.
  • the second teeth 132 each have a guiding surface 132 a opposite to the adjoining clasping surface 131 a.
  • Each of the clasping surfaces 131 a of the first tooth 131 and the corresponding guiding surface 132 a cooperatively define and surround the first groove 134 .
  • a top one of the first grooves 134 slants upwardly and the bottom one of the first grooves 134 slants downwards from inside to outside.
  • a top one of the second grooves 135 slants downwards and a bottom one of the second grooves 135 slants upwardly from inside to outside.
  • the second heat sink 200 includes a second heat spreader 210 and a plurality of spaced fins 220 extending upwardly from a top surface of the second heat spreader 210 .
  • the second heat spreader 210 comprises a protruding structure 230 at a lateral portion thereof.
  • the protruding structure 230 comprises two first inserting portions 231 and two second inserting portions 232 at a lateral surface of the second heat spreader 210 .
  • the first inserting portions 231 and the second inserting portions 232 are spaced to each other.
  • the second inserting portions 232 are located at outer sides of the first inserting portions 231 .
  • the first inserting portions 231 are approximately parallel to each other.
  • a top one of the second inserting portions 231 slants upwardly, and the bottom one of the second inserting portions 231 slants downwards.
  • Each of the first inserting portions 231 and the second inserting portions 232 has a smooth free end.
  • the protruding structure 230 of the second heat sink 200 is pushed to insert into the receiving structure 130 of the first heat sink 100 .
  • the second inserting portions 232 are gradually engaged into the second grooves 135 of the first heat spreader 110 .
  • the first inserting portions 231 firstly contact the guiding surfaces 132 a of the second teeth 132 and slide into the second grooves 135 by the guiding surfaces 132 a.
  • the free end of the first tooth 131 abuts the first inserting portions 231 .
  • the first inserting portions 231 are deformed by a press of the first tooth 131 of the first heat spreader 110 .
  • the first inserting portions 231 are substantially inserted into the first grooves 134 of the first heat spreader 110 and tightly contact the clasping surfaces 131 a and the guiding surfaces 132 a. Since the first inserting portions 231 are deformed to have shapes corresponding to shapes of the first grooves 134 , a top one of the first inserting portions 231 extends upwardly from the first heat sink 100 to the second heat sink 200 , and a bottom one of the first inserting portions 231 extends downwards from the first heat sink 100 to the second heat sink 200 . The first inserting portions 231 are clasped by the first tooth 131 and the second teeth 132 , whereby the first heat sink 100 and the second heat sink 200 are secured to each other.
  • the heat dissipation device 10 can include more than two heat sinks each of which simultaneously comprises a receiving structure and a protruding structure opposite to receiving structure, and the heat sinks can be selectively combined together. Since an amount of the heat sinks can be changed, a size of the heat dissipation device 10 can be changed for various requirements. The size of the heat dissipation device 10 in accordance with the present disclosure can be changed without requiring a new mould/die. Thus, the cost for manufacturing the heat dissipation device 10 can be considerably reduced.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a first heat sink and a second heat sink. The first heat sink includes a first heat spreader and a plurality of fins. The first heat spreader includes a receiving structure having a first tooth and two second teeth. The first tooth is located between the second teeth to define two first grooves between the first tooth and the second teeth. The second heat sink includes a second heat spreader and a plurality of fins. The second heat spreader includes a protruding structure having two first inserting portions. When the second heat sink is assembled to the first heat sink, the each of the first inserting portions is inserted in the first groove of the first heat spreader and deformed to be firmly engaged in the first groove and clasped by the first tooth.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to heat dissipation devices, and particularly to a heat dissipation device comprising at least two heat sinks connected together.
  • 2. Description of the Related Art
  • With continuing developments in technology, heat-generating electronic components such as CPUs (central processing units) provide improved performance such as faster processing speeds. However, such electronic components also tend to generate increased amounts of heat, which requires immediate dissipation. Often, a heat sink is employed to provide such heat dissipation. The heat sink absorbs heat from the electronic component and dissipates the heat to ambient air.
  • Generally, for achieving different heat dissipation according to different needs, the dimension of the heat sink has to be changed. However, a change of the die for forming the heat sink raises a considerable cost burden. Furthermore, a larger heat sink for a high power electronic component needs to be manufactured by driving an aluminum stock through a large mold, which is difficultly manufactured and requires a high manufacture cost.
  • It is thus desirable to provide a heat dissipation device which can overcome the described limitations.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The components of the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments of the display device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout several views.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device, according to an exemplary embodiment.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.
  • FIG. 3 is a partial, front view of the heat dissipation device of FIG. 1, wherein the heat dissipation device is partially assembled.
  • FIG. 4 is partial, front view of the heat dissipation device of FIG. 1, wherein the heat dissipation device is substantially assembled together.
  • DETAILED DESCRIPTION
  • Referring to FIG. 1, a heat dissipation device 10 in accordance with an embodiment of the disclosure is shown. The heat dissipation device 10 includes a first heat sink 100 and a second heat sink 200 jointed to the first heat sink 100.
  • Each of the first heat sink 100 and the second heat sink 200 is integrally formed of a metal with a good heat conductivity such as aluminum. In this embodiment, each of the first heat sink 100 and the second heat sink 200 is made of aluminum extrusion and is extruded along a lengthways direction from a front end to a rear end thereof.
  • Referring to FIG. 2, the first heat sink 100 includes a first heat spreader 110 and a plurality of spaced fins 120 extending upwardly from a top surface of the first heat spreader 110.
  • Referring also to FIG. 3, the first heat spreader 110 comprises a receiving structure 130 at a lateral portion thereof. The receiving structure 130 includes a first tooth 131, two second teeth 132 and two third teeth 133. The second teeth 132 are spaced to the first tooth 131 and respectively located at a top side and a bottom side of the first tooth 131. The third teeth 133 are spaced to the second teeth 132. One of the third teeth 133 is located at a top side of a higher second tooth 132, and the other third tooth 133 is located at a bottom side of a lower second tooth 132. Thus, each of the second teeth 132 is located between the first tooth 131 and a corresponding third tooth 133. The first tooth 131, the second teeth 132 and the third teeth 133 extend along the lengthways direction and each have a length as same as that of the first heat spreader 110. The first heat spreader 110 defines a first groove 134 between the first tooth 131 and each of the second teeth 132, and defines a second groove 135 between each of the second teeth 132 and an adjoining third tooth 133.
  • The first tooth 131 is symmetric about a central horizontal line. The first tooth 131 has a thickness gradually increasing from a root jointed to the first heat spreader 110 to an outer free end thereof. Each of the second teeth 132 has a thickness gradually decreasing from a root jointed to the first heat spreader 110 to an outer free end thereof. In this embodiment, the first tooth 131 has a dovetailed section and each of the second teeth 132 has a triangular section as viewed from a front end of the first heat spreader 110. Each of the third teeth 133 has a rectangular configuration as viewed from the front end of the first heat spreader 110. The first tooth 131 has an inclined clasping surface 131 a respectively at a top side and a bottom side thereof. The second teeth 132 each have a guiding surface 132 a opposite to the adjoining clasping surface 131 a. Each of the clasping surfaces 131 a of the first tooth 131 and the corresponding guiding surface 132 a cooperatively define and surround the first groove 134. A top one of the first grooves 134 slants upwardly and the bottom one of the first grooves 134 slants downwards from inside to outside. A top one of the second grooves 135 slants downwards and a bottom one of the second grooves 135 slants upwardly from inside to outside.
  • The second heat sink 200 includes a second heat spreader 210 and a plurality of spaced fins 220 extending upwardly from a top surface of the second heat spreader 210. The second heat spreader 210 comprises a protruding structure 230 at a lateral portion thereof. The protruding structure 230 comprises two first inserting portions 231 and two second inserting portions 232 at a lateral surface of the second heat spreader 210. The first inserting portions 231 and the second inserting portions 232 are spaced to each other. The second inserting portions 232 are located at outer sides of the first inserting portions 231. The first inserting portions 231 are approximately parallel to each other. A top one of the second inserting portions 231 slants upwardly, and the bottom one of the second inserting portions 231 slants downwards. Each of the first inserting portions 231 and the second inserting portions 232 has a smooth free end.
  • Referring to FIGS. 3 and 4, in assembly, the protruding structure 230 of the second heat sink 200 is pushed to insert into the receiving structure 130 of the first heat sink 100. The second inserting portions 232 are gradually engaged into the second grooves 135 of the first heat spreader 110. The first inserting portions 231 firstly contact the guiding surfaces 132 a of the second teeth 132 and slide into the second grooves 135 by the guiding surfaces 132 a. When parts of the first inserting portions 231 are received into the first grooves 134, the free end of the first tooth 131 abuts the first inserting portions 231. The first inserting portions 231 are deformed by a press of the first tooth 131 of the first heat spreader 110. Therefore, the first inserting portions 231 are substantially inserted into the first grooves 134 of the first heat spreader 110 and tightly contact the clasping surfaces 131 a and the guiding surfaces 132 a. Since the first inserting portions 231 are deformed to have shapes corresponding to shapes of the first grooves 134, a top one of the first inserting portions 231 extends upwardly from the first heat sink 100 to the second heat sink 200, and a bottom one of the first inserting portions 231 extends downwards from the first heat sink 100 to the second heat sink 200. The first inserting portions 231 are clasped by the first tooth 131 and the second teeth 132, whereby the first heat sink 100 and the second heat sink 200 are secured to each other.
  • Alternatively, the heat dissipation device 10 can include more than two heat sinks each of which simultaneously comprises a receiving structure and a protruding structure opposite to receiving structure, and the heat sinks can be selectively combined together. Since an amount of the heat sinks can be changed, a size of the heat dissipation device 10 can be changed for various requirements. The size of the heat dissipation device 10 in accordance with the present disclosure can be changed without requiring a new mould/die. Thus, the cost for manufacturing the heat dissipation device 10 can be considerably reduced.
  • It is to be further understood that even though numerous characteristics and advantages have been set forth in the foregoing description of the embodiment(s), together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only; and that changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (16)

What is claimed is:
1. A heat dissipation device comprising:
a first heat sink comprising a first heat spreader and a plurality of fins extending from the first heat spreader, the first heat spreader comprising a receiving structure, the receiving structure comprising a first tooth and two second teeth, the first tooth being located between the second teeth to define two first grooves between the first tooth and the second teeth; and
a second heat sink comprising a second heat spreader and a plurality of fins extending from the second heat spreader, the second heat spreader comprising a protruding structure, the protruding structure comprising two first inserting portions;
wherein when the second heat sink is assembled to the first heat sink, the each of the first inserting portions is inserted in the first groove of the first heat spreader and deformed to be firmly engaged in the first groove and clasped by the first tooth.
2. The heat dissipation device of claim 1, wherein a top one of the first grooves slants upwardly and the bottom one of the first grooves slants downwards from inside to outside.
3. The heat dissipation device of claim 2, wherein the first tooth has a thickness gradually increasing from a root jointed to the first heat spreader to an outer free end of the first tooth, each of the second teeth having a thickness gradually decreasing from a root jointed to the first heat spreader to an outer free end thereof.
4. The heat dissipation device of claim 3, wherein the first tooth has a dovetailed section and each of the second teeth has a triangular section.
5. The heat dissipation device of claim 2, wherein each of the first inserting portions has a smooth free end.
6. The heat dissipation device of claim 2, wherein the first inserting portions are parallel to each other before engaging into the first grooves.
7. The heat dissipation device of claim 6, wherein the first tooth has two clasping surfaces, each of the second teeth having a guiding surface facing the adjoining clasping surface, the first inserting portions being guided by the guiding surfaces into the first grooves and clasped by the clasping surfaces after assembly.
8. The heat dissipation device of claim 1, wherein the receiving structure comprises two third teeth, each of the second teeth and adjoining third tooth together defining a second groove, the protruding structure comprising two second inserting portions to insert into the second grooves.
9. The heat dissipation device of claim 1, wherein each of the first heat sink and the second heat sink is made of aluminum extrusion and is extruded along a lengthways direction from a front end to a rear end thereof.
10. A heat dissipation device comprising a plurality of heat sinks, each of the heat sink comprising a heat spreader and a plurality of fins extending from the heat spreader, the heat spreader comprising a receiving structure and a protruding structure, the receiving structure comprising a first tooth and two second teeth, the first tooth being located between the second teeth to define two first grooves between the first tooth and the second teeth, the protruding structure comprising two first inserting portions, the first inserting portions of the protruding structure of one heat sink being inserted in the first grooves of the receiving structure of another heat sink and deformed to be firmly engaged in the first groove and clasped by the first tooth.
11. The heat dissipation device of claim 10, wherein a top one of the first grooves slants upwardly and the bottom one of the first grooves slants downwards from inside to outside.
12. The heat dissipation device of claim 11, wherein the first tooth has a thickness gradually increasing from a root jointed to the heat spreader to an outer free end of the first tooth, each of the second teeth having a thickness gradually decreasing from a root jointed to the heat spreader to an outer free end thereof.
13. The heat dissipation device of claim 12, wherein the first tooth has a dovetailed section and each of the second teeth has a triangular section.
14. The heat dissipation device of claim 11, wherein each of the first inserting portions has a smooth free end.
15. The heat dissipation device of claim 11, wherein the first inserting portions are parallel to each other before engaging into the first grooves.
16. The heat dissipation device of claim 10, wherein each of the heat sinks is made of aluminum extrusion and is extruded along a lengthways direction from a front end to a rear end thereof.
US13/533,989 2012-04-05 2012-06-27 Heat dissipation device Abandoned US20130264042A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210097100.1A CN103369919A (en) 2012-04-05 2012-04-05 Combined radiating device
CN201210097100.1 2012-04-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140022728A1 (en) * 2010-07-16 2014-01-23 Rockwell Automation Technologies, Inc. Heat sink for power circuits
WO2017138202A1 (en) * 2016-02-09 2017-08-17 ソニー株式会社 Display device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104359331A (en) * 2014-10-29 2015-02-18 太仓陶氏电气有限公司 Combined heat radiator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
EP0867937A2 (en) * 1997-03-26 1998-09-30 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
EP0867937A2 (en) * 1997-03-26 1998-09-30 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140022728A1 (en) * 2010-07-16 2014-01-23 Rockwell Automation Technologies, Inc. Heat sink for power circuits
US9801306B2 (en) * 2010-07-16 2017-10-24 Rockwell Automation Technologies, Inc. Heat sink for power circuits
WO2017138202A1 (en) * 2016-02-09 2017-08-17 ソニー株式会社 Display device
JPWO2017138202A1 (en) * 2016-02-09 2018-12-06 ソニー株式会社 Display device
EP3416154A4 (en) * 2016-02-09 2019-02-20 Sony Corporation Display device
US10775552B2 (en) 2016-02-09 2020-09-15 Sony Corporation Display device

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Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QIN, JI-YUN;YAN, QIANG;REEL/FRAME:028448/0284

Effective date: 20120607

Owner name: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QIN, JI-YUN;YAN, QIANG;REEL/FRAME:028448/0284

Effective date: 20120607

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