US20130199768A1 - Apparatus for secure device to edge of plate - Google Patents

Apparatus for secure device to edge of plate Download PDF

Info

Publication number
US20130199768A1
US20130199768A1 US13/366,092 US201213366092A US2013199768A1 US 20130199768 A1 US20130199768 A1 US 20130199768A1 US 201213366092 A US201213366092 A US 201213366092A US 2013199768 A1 US2013199768 A1 US 2013199768A1
Authority
US
United States
Prior art keywords
heat
pcb
plate
dissipate
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/366,092
Inventor
Taiming Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/366,092 priority Critical patent/US20130199768A1/en
Publication of US20130199768A1 publication Critical patent/US20130199768A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates, in general, to a heat emitting electronic device mounted on Printed Circuit Board (PCB) with need to dissipate heat.
  • PCB Printed Circuit Board
  • the present invention relates, in general, to apparatuses for securing device to edge of plate, more particular, this invention relates to mounting heat emitting device, such as high power LED, to heat dissipate plate.
  • Many devices can emit quite a lot of heat and need to be accelerated dissipated. Some devices pass along heat through their mounting leads to Print Circuit Board (PCB).
  • PCB Print Circuit Board
  • Some devices have top or back heat spreader. The ones with top heat spreader can wear a heat sink on top to dissipate heat.
  • Devices with back heat spreader, such as high power LED which has light emitting portion on top and can't have top heat spreader has to press against PCB to dissipate heat.
  • heat sinks are added to against the other side of PCB to help dissipate heat. That's not as efficient as heat has to travel through PCB before reach to heat sink.
  • Apparatuses to secure heat emitting device with back heat spreader to edge of a heat dissipate plate comprising of adapter PCB with device mounting pads and open hole at location of back heat spreader to expose it for access, seating means has a plurality of stubs at edge of said heat dissipate plate to accept and secure said adapter PCB, at least one contact stub at edge of heat dissipate plate to make contact with back heat spreader of each said heat emitting device.
  • FIG. 1 is a section view of traditional LED, PCB and heat sink.
  • FIG. 2 is a perspective view of a surface mount LED
  • FIG. 3 is a top view of adapter PCB
  • FIG. 4 is a perspective view of LED mounted on adapter PCB
  • FIG. 5 is a perspective view of apparatus, before PCB inserted.
  • FIG. 6 is a perspective view of apparatus, with PCB inserted
  • FIG. 7 is a perspective view of apparatus, with PCB inserted.
  • FIG. 8 is a perspective view of a pre-bent plate.
  • FIG. 9 is a perspective view of apparatus before assembly.
  • FIG. 10 is a perspective view of apparatus with LED device.
  • FIG. 11 is a perspective view of apparatus.
  • FIG. 12 is a perspective view of apparatus assembled.
  • FIG. 13 is a perspective view of apparatus.
  • FIG. 1 shows a surface mount LED 1 , mounted on top of a PCB 18 .
  • the diode silicon 1 is where light is emitted, and the diode is sitting on a substrate which connects to back heat spreader 5 , surrounded by case 2 .
  • LED's back heat spreader 5 press against PCB 18 to dissipate heat.
  • Another heat sink 30 is attached to the other side of PCB 18 to further help heat dissipation.
  • FIG. 2 is a perspective view of LED 1 .
  • FIG. 3 shows top view of adapter PCB 10 of presenting apparatus. It has solder pads 11 and open hole 12 . Open hole 12 should reveal back heat spreader 5 when LED is mounted.
  • the shape of PCB 10 is rectangular with narrower side 15 and wider side 16 .
  • FIG. 4 shows device's back heat spreader 5 is revealed through open hole 12 , LED 1 is mounted on adapter PCB 10 .
  • FIG. 5 shows adapter PCB 10 is at close range of seating means opening 21 .
  • the width of narrower side 15 should be match but less than the opening width of cut opening 21 .
  • Contact stub 23 should be able to fit through the open hole 12 of adapter PCB 10 when rotated.
  • FIG. 6 shows adapter PCB 10 is inserted and rotated, so part of PCB body slide into the right angled slots 22 . This holds PCB 10 from dropping out and form a seating means.
  • FIG. 7 shows another view of apparatus as FIG. 6 .
  • the contact stub 23 makes contact to back heat spreader 5 to conduct heat from LED to wider area of plate 20 .
  • FIG. 8 shows a perspective view of heat dissipating metal plate 40 with cut out to form stubs 41 , 42 , 43 , and 44 .
  • FIG. 9 shows a perspective view of an adapter PCB 50 with through opening 51 and surface plating 52 .
  • Through opening 51 is connected first and second through opening in continuous; surface plating 52 is between the position of said device's back heat spreader to through opening 51 .
  • FIG. 9 also shows the same heat dissipating metal plate 40 as FIG. 8 , stub 41 and 42 are bent to right angle to work as stabilizer stubs, stub 41 is bent to one direction vertical to plate 40 , and stub 42 is bent to the other direction vertical to plate 40 .
  • FIG. 10 shows a perspective view of an adapter PCB 50 with a surface mount LED device 1 mounted.
  • FIG. 11 shows a perspective view of apparatus with heat dissipating plate 40 being inserted into the through opening 51 of adapter PCB 50 .
  • Contact stub 43 fills the opening 51 to the surface level of PCB and to against the back of surface mount device 1 .
  • FIG. 12 shows a perspective view of same apparatus as FIG. 11 , with retaining stub 44 bent to hold down adapter PCB 50 in position, retaining stub also makes contact with surface plating 52 .
  • FIG. 13 shows a perspective view of same apparatus as FIG. 11 , without the surface mount device.
  • Surface plating 52 is at position of device's back heat spreader, area where retaining stub will bend over and in close proximity or in contact with contact stub 43 .

Abstract

Apparatuses to secure surface mount heat emitting device with back heat spreader to edge of a heat dissipate plate in order to conduct heat from said heat emitting device to heat dissipate plate directly. Each apparatus comprising of adapter PCB with device mounting pads on surface and opening at location of back heat spreader to expose it for contact access; heat dissipate plate has contact stub to make contact with said back heat spreader and bounding means to bound together said heat dissipate plate and PCB.

Description

    FIELD OF THE INVENTION
  • The present invention relates, in general, to a heat emitting electronic device mounted on Printed Circuit Board (PCB) with need to dissipate heat.
    • BACKGROUND OF THE INVENTION
  • The present invention relates, in general, to apparatuses for securing device to edge of plate, more particular, this invention relates to mounting heat emitting device, such as high power LED, to heat dissipate plate. Many devices can emit quite a lot of heat and need to be accelerated dissipated. Some devices pass along heat through their mounting leads to Print Circuit Board (PCB). Some devices have top or back heat spreader. The ones with top heat spreader can wear a heat sink on top to dissipate heat. Devices with back heat spreader, such as high power LED which has light emitting portion on top and can't have top heat spreader, has to press against PCB to dissipate heat. In some cases, heat sinks are added to against the other side of PCB to help dissipate heat. That's not as efficient as heat has to travel through PCB before reach to heat sink.
    • DESCRIPTION OF PRIOR ART
  • U.S. Pat. No. 5,785,418 to Peter A. Hochstein describes a LED array attach PCB and then to heat sink block to fast dissipate heat.
  • U.S. Pat. No. 7,227,750 to Bishou Chen, Sheng Li describes a LED module has pins to conduct heat to back of PCB.
  • U.S. Pat. No. 7,806,574 to Peter Van Laanen and Jeff Bisberg describes a LED base lighting system which dissipates heat through PCB and structure member.
  • Application Ser. No. 12/928,644 from Taiming chen (same Inventor) describes a LED LAMP comprising of modules with LEDs mounted on edge of plates.
    • BRIEF SUMMARY OF THE INVENTION
  • Apparatuses to secure heat emitting device with back heat spreader to edge of a heat dissipate plate. Said apparatuses comprising of adapter PCB with device mounting pads and open hole at location of back heat spreader to expose it for access, seating means has a plurality of stubs at edge of said heat dissipate plate to accept and secure said adapter PCB, at least one contact stub at edge of heat dissipate plate to make contact with back heat spreader of each said heat emitting device.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a section view of traditional LED, PCB and heat sink.
  • FIG. 2 is a perspective view of a surface mount LED
  • FIG. 3 is a top view of adapter PCB
  • FIG. 4 is a perspective view of LED mounted on adapter PCB
  • FIG. 5 is a perspective view of apparatus, before PCB inserted.
  • FIG. 6 is a perspective view of apparatus, with PCB inserted
  • FIG. 7 is a perspective view of apparatus, with PCB inserted.
  • FIG. 8 is a perspective view of a pre-bent plate.
  • FIG. 9 is a perspective view of apparatus before assembly.
  • FIG. 10 is a perspective view of apparatus with LED device.
  • FIG. 11 is a perspective view of apparatus.
  • FIG. 12 is a perspective view of apparatus assembled.
  • FIG. 13 is a perspective view of apparatus.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Prior to proceeding to the more detailed description of the present invention, it should be noted that, for the sake of clarity and understanding, identical components which have identical functions have been identified with identical reference numerals throughout the several views illustrated in the drawing figures.
  • FIG. 1 shows a surface mount LED 1, mounted on top of a PCB 18. The diode silicon 1 is where light is emitted, and the diode is sitting on a substrate which connects to back heat spreader 5, surrounded by case 2. When mounted on PCB, LED's back heat spreader 5 press against PCB 18 to dissipate heat. Another heat sink 30 is attached to the other side of PCB 18 to further help heat dissipation.
  • FIG. 2 is a perspective view of LED 1.
  • FIG. 3 shows top view of adapter PCB 10 of presenting apparatus. It has solder pads 11 and open hole 12. Open hole 12 should reveal back heat spreader 5 when LED is mounted. The shape of PCB 10 is rectangular with narrower side 15 and wider side 16.
  • FIG. 4 shows device's back heat spreader 5 is revealed through open hole 12, LED 1 is mounted on adapter PCB 10.
  • FIG. 5 shows adapter PCB 10 is at close range of seating means opening 21. The width of narrower side 15 should be match but less than the opening width of cut opening 21. There are two right angle slots 22 with width match to PCB 10 to accept said PCB when inserted and rotated. Contact stub 23 should be able to fit through the open hole 12 of adapter PCB 10 when rotated.
  • FIG. 6 shows adapter PCB 10 is inserted and rotated, so part of PCB body slide into the right angled slots 22. This holds PCB 10 from dropping out and form a seating means.
  • FIG. 7 shows another view of apparatus as FIG. 6. The contact stub 23 makes contact to back heat spreader 5 to conduct heat from LED to wider area of plate 20.
  • FIG. 8 shows a perspective view of heat dissipating metal plate 40 with cut out to form stubs 41, 42, 43, and 44.
  • FIG. 9 shows a perspective view of an adapter PCB 50 with through opening 51 and surface plating 52. Through opening 51 is connected first and second through opening in continuous; surface plating 52 is between the position of said device's back heat spreader to through opening 51. FIG. 9 also shows the same heat dissipating metal plate 40 as FIG. 8, stub 41 and 42 are bent to right angle to work as stabilizer stubs, stub 41 is bent to one direction vertical to plate 40, and stub 42 is bent to the other direction vertical to plate 40.
  • FIG. 10 shows a perspective view of an adapter PCB 50 with a surface mount LED device 1 mounted.
  • FIG. 11 shows a perspective view of apparatus with heat dissipating plate 40 being inserted into the through opening 51 of adapter PCB 50. Contact stub 43 fills the opening 51 to the surface level of PCB and to against the back of surface mount device 1.
  • FIG. 12 shows a perspective view of same apparatus as FIG. 11, with retaining stub 44 bent to hold down adapter PCB 50 in position, retaining stub also makes contact with surface plating 52.
  • FIG. 13 shows a perspective view of same apparatus as FIG. 11, without the surface mount device. Surface plating 52 is at position of device's back heat spreader, area where retaining stub will bend over and in close proximity or in contact with contact stub 43.

Claims (13)

1) An apparatus to secure heat emitting device with back heat spreader to edge of a heat dissipate plate, said apparatus comprising of:
a) An adapter PCB for mounting said heating emitting device and securing to edge of heat dissipate plate, said adapter PCB includes:
i) mounting pads for solder said heat emitting device on to PCB surface,
ii) Hole under said heat emitting device for exposing said device's heat spreader to said heat dissipate plate,
iii) shape of said PCB is narrower at first dimension and wider at second dimension for locking said PCB when rotated,
b) Seating means on edge of said heat dissipate plate to accept said adapter PCB, said seating means include:
i) a first cut out with opening matches the width of said first dimension of adapter PCB and depth greater than thickness of said adapter PCB,
ii) two right angled slots on symmetric location of both sides of first cut out with width matches to thickness of said adapter PCB for accepting said PCB when inserted and rotated,
iii) contact stub at edge of said heat dissipate plate with width that can fit into said hole of adapter PCB and has length to touch heat spreader of said heat emitting device through said adapter PCB when PCB is inserted and secured with said seating means.
2) The apparatus of claim 1, wherein proxy material is applied between said back heat spreader of heat emitting device and said contact stub to help dissipate heat.
3) An apparatus to secure heat emitting device with back heat spreader to edge of a heat dissipate plate, said apparatus comprising of:
a) At least one heat emitting device that has a plurality of mounting points and back heat spreader, said mounting points and back heat spreader is aligned to be mount on a plane surface;
b) A PCB with two sides for mounting at least one said heat emitting device and securing said devices to edge of said heat dissipate plate, said PCB includes:
i) a plurality of mounting pads on first side of PCB surface for soldering said mounting points of heat emitting devices on to said first side of PCB,
ii) at least one through opening between first and the opposite side, or second side, of said PCB to allow contact surface of said heat dissipate plate to pass through said PCB from second side to come out of first side of PCB;
c) At least one heat dissipate plate to dissipate heat from said heat emitting devices, said heat dissipate plate includes:
i) Plate has main body and surface area on both sides of plate to dissipate heat away from said heat emitting device,
ii) A least one contact tab connect to but stick out of said plate main body for the length of equal or greater than the thickness of said PCB for fitting through said PCB through opening,
iii) at least one contact surface on edge side of said contact tab to made proper contact with back heat spreader of said heat emitting device alongside the first side of said PCB;
d) Bounding means to secure said PCB to said heat dissipate plate.
4) The apparatus of claim 3, wherein said through opening is slot with width equal to thickness of said heat dissipate plate.
5) The apparatus of claim 3, wherein said bounding means are a plurality of stabilizer stubs bent off both sides of said heat dissipate plate to support and restrict said PCB from moving or rolling at either directions.
6) The apparatus of claim 3, wherein said bounding mean are a plurality of retaining stubs that went through the said through opening of PCB and got bent down to clamp on first surface of said PCB to hold PCB in position.
7) The apparatus of claim 3, wherein said bounding mean is at least one solder pad on said PCB to provide solder bounding together with said heat dissipate plate.
8) The apparatus of claim 3, wherein said bounding mean is very tight fitting through opening slot to clamp on said heat dissipate plate, the fraction force between said PCB and said plate provide great force to keep them from moving apart.
9) The apparatus of claim 3, wherein said PCB has heat conducting surface plating from said heat emitting device's back heat spreader to a close proximity of said contact surface to help dissipate heat.
10) The apparatus of claim 3, wherein proxy conducting material, such as heat conducting paste, is applied between said back heat spreader of heat emitting device and said contact stub to help dissipate heat.
11) The apparatus of claim 3, wherein proxy bounding material, such as glue or solder, is applied between said heat dissipate plate and said PCB to provide bounding between these two.
12) The apparatus of claim 3, wherein said adapter PCB has a plurality of said heat emitting devices mounted along the edge of said heat dissipate plate, each said device has at least one said contact surface to make contact with.
13) The apparatus of claim 3, wherein said adapter PCB has circuit printed on and use said heat dissipate plate as common grounding.
US13/366,092 2012-02-03 2012-02-03 Apparatus for secure device to edge of plate Abandoned US20130199768A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/366,092 US20130199768A1 (en) 2012-02-03 2012-02-03 Apparatus for secure device to edge of plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/366,092 US20130199768A1 (en) 2012-02-03 2012-02-03 Apparatus for secure device to edge of plate

Publications (1)

Publication Number Publication Date
US20130199768A1 true US20130199768A1 (en) 2013-08-08

Family

ID=48901880

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/366,092 Abandoned US20130199768A1 (en) 2012-02-03 2012-02-03 Apparatus for secure device to edge of plate

Country Status (1)

Country Link
US (1) US20130199768A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103672810A (en) * 2013-12-04 2014-03-26 浙江欧珑电气有限公司 LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator
WO2015055792A1 (en) * 2013-10-17 2015-04-23 Annerose Streibl Lighting unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015055792A1 (en) * 2013-10-17 2015-04-23 Annerose Streibl Lighting unit
CN103672810A (en) * 2013-12-04 2014-03-26 浙江欧珑电气有限公司 LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator

Similar Documents

Publication Publication Date Title
JP5594892B2 (en) Socket assembly having thermal management structure
AU2008326432B2 (en) Apparatus and methods for thermal management of light emitting diodes
US7841740B2 (en) LED assembly for LED lamp consisting of multiple LED units each having a heat sink
CA2706098C (en) Apparatus and method for thermal dissipation in a light
US8400771B2 (en) Apparatus and methods for thermal management of electronic devices
JP2010182674A (en) Jumper connector for lighting assembly
US20100008094A1 (en) Led lamp with a heat dissipation device
US20140233245A1 (en) LED-Based Lighting With Reflector Mounted On PCB
JP2004055229A (en) Led lighting system and lighting equipment
WO2016162991A1 (en) Semiconductor device and semiconductor device manufacturing method
CN109556074B (en) Lamp unit and vehicle lamp
US8545054B2 (en) Array of scalable ceramic diode carriers with LEDs
US20130199768A1 (en) Apparatus for secure device to edge of plate
JPWO2012066925A1 (en) Electronics
KR20130059871A (en) Light emitting modul
US6812562B2 (en) Method and apparatus for surface mounted power transistor with heat sink
US20020109220A1 (en) Method for surface mounted power transistor with heat sink
US20140078736A1 (en) High power LED apparatus attaches to heat conductive object
CN210123135U (en) LED lamp apparatus for vehicle
CN109923346B (en) Heat radiator
EP2325556A2 (en) Illumination device
KR101625895B1 (en) The apparatus for lighting uv light
US20230304655A1 (en) Electronic device, light emitting device and method for manufacturing an electronic device
KR100691005B1 (en) Semiconductor device module
JP6895065B2 (en) Electronic component mounts and power supplies

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION