US20130075885A1 - Lead frame and packaging method - Google Patents

Lead frame and packaging method Download PDF

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Publication number
US20130075885A1
US20130075885A1 US13/615,185 US201213615185A US2013075885A1 US 20130075885 A1 US20130075885 A1 US 20130075885A1 US 201213615185 A US201213615185 A US 201213615185A US 2013075885 A1 US2013075885 A1 US 2013075885A1
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Prior art keywords
lead frame
die pads
die
tie elements
leads
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US8736038B2 (en
Inventor
Huijun Xiong
Pierangelo Magni
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STMicroelectronics Shenzhen R&D Co Ltd
STMicroelectronics SRL
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STMicroelectronics Shenzhen Manufacturing Co Ltd
STMicroelectronics SRL
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Assigned to STMICROELECTRONICS (SHENZHEN) MANUFACTURING Co., Ltd., STMICROELECTRONICS S.R.L. reassignment STMICROELECTRONICS (SHENZHEN) MANUFACTURING Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAGNI, PIERANGELO, XIONG, Huijun
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Assigned to STMicroelectronics (Shenzhen) R&D Co., Ltd. reassignment STMicroelectronics (Shenzhen) R&D Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STMICROELECTRONICS (SHENZHEN) MANUFACTURING Co., Ltd.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector

Definitions

  • This invention relates generally to semiconductor packaging, and more particularly to lead frames.
  • Lead frame also known as leadframe, is used in IC package for providing mechanical support to a die during its assembly into a finished product.
  • a lead frame typically comprises a die pad, to which the die is attached, and leads, which serve as the means for electrically connecting the die to the outside world such as a printed circuit board.
  • the die is connected to the leads by wires through wire bonding or by tape automated bonds.
  • the die pad 1 with the die 2 attached thereon loses proper orientation due to a force exerted on the die pad during transferring the lead frame from one apparatus to another apparatus, or during other operations.
  • the die pad 1 must be reoriented with the expenditure of great operator time and effort.
  • the wires 3 between the leads 4 and the die 2 are susceptible to damage when stretched as shown in FIG. 1 , which leads to electrical connection failure and decrease the yield of package.
  • a lead frame comprising: a first plurality of die pads; a second plurality of leads extending from the first plurality of die pads; and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
  • a method comprising: providing a lead frame having a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another; attaching a first plurality of dice to the first plurality of die pads respectively; attaching at least a wire bond between each of the first plurality of dice and the corresponding die pad respectively; molding the first plurality of dice; and cutting off the third plurality of tie elements.
  • FIG. 1 shows a microscope photo of a lead frame with a die attached thereon and wire bonded thereto ;
  • FIG. 2 shows a partial plan view of an embodiment of the lead frame according to one aspect of the invention
  • FIG. 3 shows a partial plan view of another embodiment of the lead frame according to one aspect of the invention.
  • FIG. 4 shows a flow diagram of an embodiment of the method according to another aspect of the invention.
  • the lead frame 20 comprises a first plurality of die pads for mounting dice thereon (the process of mounting and packaging will be described in the), a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
  • FIG. 2 is a partial plan view of the lead frame 20 and there are shown two die pads 21 , six leads 23 and one complete tie element 25 connecting the two die pads 21 .
  • the lead frame 20 can have a repeating, one-dimensional or two-dimensional pattern of the unit of FIG. 2 .
  • the lead frame 20 has an improved mechanical stability. Accidental external forces may be exerted on one die pad 21 during, for example, transferring the lead frame 20 from one apparatus to another, such forces can be imparted to its adjacent die pads, since the die pad 21 is connected to its adjacent die pads by tie elements 25 . In this way, the die pad 21 is less prone to external forces.
  • the lead frame 20 also has decreased thermal contraction and curvature as a result of the tie elements 25 .
  • a contraction rate test conventional lead frames have shown an average contraction rate of about 40 ppm, and lead frames 20 haven't shown any contraction.
  • a curvature test conventional lead frames have shown an average curvature of about 200 ppm, and lead frames 20 haven't shown any curvature.
  • packages using conventional lead frames have shown an average resin spill of about 540 ppm, and packages using lead frames 20 have shown a reduced resin spill of about 120 ppm.
  • the lead frame 20 can be made from copper, nickel alloy or any other suitable materials and can be formed using industry standard methods of making lead frames, such as stamping and etching, or any other suitable methods.
  • the lead frame 20 is formed by stamping.
  • materials are removed from a metal sheet to define the plurality of die pads 21 interconnected by the plurality of tie elements 25 , and the plurality of die pads 21 may remain integral with the plurality of tie elements 25 .
  • the lead frame 20 is formed by etching.
  • a metal sheet is selectively covered with photoresist in accordance with the intended pattern shown in FIG. 2 and then exposed to chemical etchants that remove areas not covered by photoresist.
  • the plurality of die pads 21 , the plurality of leads 23 and the plurality of tie elements 25 are integrally formed.
  • each of the plurality of die pads 21 may correspond to two, four, five or seven leads 23 according to the type of transistors, integrated circuits or other devices to be packaged.
  • the plurality of tie elements 25 may take various shapes, for example, strip, polygon and so on.
  • the lead frame 20 further comprises a strip element 26 connected to the second plurality of leads 23 so as to facilitate performing operations on the lead frame 20 .
  • FIG. 3 shows a partial plan view of another embodiment of the lead frame according to one aspect of the invention.
  • the lead frame 30 comprises a first plurality of die pads 31 for mounting dice thereon, a second plurality of leads 33 extending from the first plurality of die pads 31 , and a third plurality of tie elements 35 , each of which connects one of the first plurality of die pads 31 to another.
  • the lead frame 30 is different from the lead frame 20 in that each of the die pads 31 comprises a tab portion 35 at an end opposite the second plurality of leads 33 , which can be made of metal and mounted to a heat sink.
  • the tie elements 35 connects one die pad 31 to another at respective tab portions 35 .
  • the lead frame 30 has an improved mechanical stability. Accidental external forces may be exerted on one die pad 31 during, for example, transferring the lead frame 30 from one apparatus to another, such forces can be imparted to its adjacent die pads, since the die pad 31 is connected to its adjacent die pads by tie elements 35 . In this way, the die pad 31 is less prone to external forces.
  • the lead frame 30 also has decreased thermal contraction and curvature as a result of the tie elements 35 .
  • a contraction rate test conventional lead frames have shown an average contraction rate of about 40 ppm, and lead frames 30 haven't shown any contraction.
  • a curvature test conventional lead frames have shown an average curvature of about 200 ppm, and lead frames 30 haven't shown any curvature.
  • packages using conventional lead frames have shown an average resin spill of about 540 ppm, and packages using lead frames 30 have shown a reduced resin spill of about 120 ppm.
  • the lead frame 30 can be made from copper, nickel alloy or any other suitable materials and can be formed using industry standard methods of making lead frames, such as stamping and etching, or any other suitable methods.
  • the lead frame 30 is formed by stamping.
  • materials are removed from a metal sheet to define the plurality of die pads 31 interconnected by the plurality of tie elements 35 , and the plurality of die pads 31 may remain integral with the plurality of tie elements 35 .
  • the lead frame 30 is formed by etching
  • a metal sheet is selectively covered with photoresist in accordance with the intended pattern shown in FIG. 3 and then exposed to chemical etchants that remove areas not covered by photoresist.
  • the plurality of die pads 31 , the plurality of leads 33 and the plurality of tie elements 35 are integrally formed.
  • each of the plurality of die pads 31 may correspond to two, four, five or seven leads 33 according to the type of transistors, integrated circuits or other devices to be packaged.
  • the plurality of tie elements 35 may take various shapes, for example, strip, polygon and so on.
  • the lead frame 30 further comprises a strip element 36 connected to the second plurality of leads 33 so as to facilitate performing operations on the lead frame 30 .
  • FIG. 4 shows a flow diagram of an embodiment of the method according to another aspect of the invention. Steps of the method will be described with reference to the lead frame 20 .
  • step S 41 lead frame 20 is provided.
  • step S 42 a first plurality of dice are attached to the first plurality of die pads 21 of the lead frame 20 by means of solder paste, soft solder, or a silver paste filled epoxy, which is first applied to the die pads 21 before the dice are attached, followed by a solder reflow process or an epoxy curing process.
  • step S 43 wires, which may be aluminum or gold, are bonded at one end to the first plurality of dice and at the other end to the first plurality of die pads 21 , so that electrical connections therebetween are formed.
  • step S 44 the first plurality of dice are molded with encapsulation materials such as resin and plastic.
  • step S 45 the third plurality of tie elements 25 are cut off, and the molded dice are singulated and trimmed.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.

Description

    TECHNICAL FIELD
  • This invention relates generally to semiconductor packaging, and more particularly to lead frames.
    • BACKGROUND
  • Lead frame, also known as leadframe, is used in IC package for providing mechanical support to a die during its assembly into a finished product. A lead frame typically comprises a die pad, to which the die is attached, and leads, which serve as the means for electrically connecting the die to the outside world such as a printed circuit board. The die is connected to the leads by wires through wire bonding or by tape automated bonds.
  • However, as shown in FIG. 1, there may occur a case where the die pad 1 with the die 2 attached thereon loses proper orientation due to a force exerted on the die pad during transferring the lead frame from one apparatus to another apparatus, or during other operations. As a result, the die pad 1 must be reoriented with the expenditure of great operator time and effort. Moreover, the wires 3 between the leads 4 and the die 2 are susceptible to damage when stretched as shown in FIG. 1, which leads to electrical connection failure and decrease the yield of package.
  • Thus, there is a need for a lead frame that is less susceptible to disorientation or deformation.
    • SUMMARY
  • In one aspect, there is provided a lead frame, comprising: a first plurality of die pads; a second plurality of leads extending from the first plurality of die pads; and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
  • In another aspect, there is provided a method, comprising: providing a lead frame having a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another; attaching a first plurality of dice to the first plurality of die pads respectively; attaching at least a wire bond between each of the first plurality of dice and the corresponding die pad respectively; molding the first plurality of dice; and cutting off the third plurality of tie elements.
  • The foregoing has outlined, rather broadly, features of the present disclosure. Additional features of the disclosure will be described, hereinafter, which form the subject of the claims of the invention. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • For a more complete understanding of the present disclosure, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
  • FIG. 1 shows a microscope photo of a lead frame with a die attached thereon and wire bonded thereto ;
  • FIG. 2 shows a partial plan view of an embodiment of the lead frame according to one aspect of the invention;
  • FIG. 3 shows a partial plan view of another embodiment of the lead frame according to one aspect of the invention; and
  • FIG. 4 shows a flow diagram of an embodiment of the method according to another aspect of the invention.
    •
  • Corresponding numerals and symbols in different figures generally refer to corresponding parts unless otherwise indicated. The figures are drawn to clearly illustrate the relevant aspects of embodiments of the present disclosure and are not necessarily drawn to scale. To more clearly illustrate certain embodiments, a letter indicating variations of the same structure, material, or process step may follow a figure number.
    • DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
  • The making and using of embodiments are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that may be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.
  • In one embodiment of the lead frame according to the invention, referred to as 20, the lead frame 20 comprises a first plurality of die pads for mounting dice thereon (the process of mounting and packaging will be described in the), a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another. FIG. 2 is a partial plan view of the lead frame 20 and there are shown two die pads 21, six leads 23 and one complete tie element 25 connecting the two die pads 21. As understood by the skilled in the art, the lead frame 20 can have a repeating, one-dimensional or two-dimensional pattern of the unit of FIG. 2.
  • The lead frame 20 has an improved mechanical stability. Accidental external forces may be exerted on one die pad 21 during, for example, transferring the lead frame 20 from one apparatus to another, such forces can be imparted to its adjacent die pads, since the die pad 21 is connected to its adjacent die pads by tie elements 25. In this way, the die pad 21 is less prone to external forces.
  • The lead frame 20 also has decreased thermal contraction and curvature as a result of the tie elements 25. In a contraction rate test, conventional lead frames have shown an average contraction rate of about 40 ppm, and lead frames 20 haven't shown any contraction. In a curvature test, conventional lead frames have shown an average curvature of about 200 ppm, and lead frames 20 haven't shown any curvature. In a resin spill test, packages using conventional lead frames have shown an average resin spill of about 540 ppm, and packages using lead frames 20 have shown a reduced resin spill of about 120 ppm.
  • The lead frame 20 can be made from copper, nickel alloy or any other suitable materials and can be formed using industry standard methods of making lead frames, such as stamping and etching, or any other suitable methods. In one example, the lead frame 20 is formed by stamping. To be specific, in one or more punching steps, materials are removed from a metal sheet to define the plurality of die pads 21 interconnected by the plurality of tie elements 25, and the plurality of die pads 21 may remain integral with the plurality of tie elements 25. It is also feasible to form the plurality of leads 23 together with the plurality of die pads 21 and the plurality of tie elements 25. In another example, the lead frame 20 is formed by etching. To be specific, a metal sheet is selectively covered with photoresist in accordance with the intended pattern shown in FIG. 2 and then exposed to chemical etchants that remove areas not covered by photoresist. As a result, the plurality of die pads 21, the plurality of leads 23 and the plurality of tie elements 25 are integrally formed.
  • It should be noted that the lead frames described herein are not limited to the configuration shown in FIG. 2. Each of the plurality of die pads 21 may correspond to two, four, five or seven leads 23 according to the type of transistors, integrated circuits or other devices to be packaged. Moreover, the plurality of tie elements 25 may take various shapes, for example, strip, polygon and so on.
  • Still referring to FIG. 2, optionally, the lead frame 20 further comprises a strip element 26 connected to the second plurality of leads 23 so as to facilitate performing operations on the lead frame 20.
  • FIG. 3 shows a partial plan view of another embodiment of the lead frame according to one aspect of the invention. The lead frame 30 comprises a first plurality of die pads 31 for mounting dice thereon, a second plurality of leads 33 extending from the first plurality of die pads 31, and a third plurality of tie elements 35, each of which connects one of the first plurality of die pads 31 to another. The lead frame 30 is different from the lead frame 20 in that each of the die pads 31 comprises a tab portion 35 at an end opposite the second plurality of leads 33, which can be made of metal and mounted to a heat sink. The tie elements 35 connects one die pad 31 to another at respective tab portions 35.
  • The lead frame 30 has an improved mechanical stability. Accidental external forces may be exerted on one die pad 31 during, for example, transferring the lead frame 30 from one apparatus to another, such forces can be imparted to its adjacent die pads, since the die pad 31 is connected to its adjacent die pads by tie elements 35. In this way, the die pad 31 is less prone to external forces.
  • The lead frame 30 also has decreased thermal contraction and curvature as a result of the tie elements 35. In a contraction rate test, conventional lead frames have shown an average contraction rate of about 40 ppm, and lead frames 30 haven't shown any contraction. In a curvature test, conventional lead frames have shown an average curvature of about 200 ppm, and lead frames 30 haven't shown any curvature. In a resin spill test, packages using conventional lead frames have shown an average resin spill of about 540 ppm, and packages using lead frames 30 have shown a reduced resin spill of about 120 ppm.
  • The lead frame 30 can be made from copper, nickel alloy or any other suitable materials and can be formed using industry standard methods of making lead frames, such as stamping and etching, or any other suitable methods. In one example, the lead frame 30 is formed by stamping. To be specific, in one or more punching steps, materials are removed from a metal sheet to define the plurality of die pads 31 interconnected by the plurality of tie elements 35, and the plurality of die pads 31 may remain integral with the plurality of tie elements 35. It is also feasible to form the plurality of leads 33 together with the plurality of die pads 31 and the plurality of tie elements 35. In another example, the lead frame 30 is formed by etching To be specific, a metal sheet is selectively covered with photoresist in accordance with the intended pattern shown in FIG. 3 and then exposed to chemical etchants that remove areas not covered by photoresist. As a result, the plurality of die pads 31, the plurality of leads 33 and the plurality of tie elements 35 are integrally formed.
  • It should be noted that the lead frames described herein are not limited to the configuration shown in FIG. 3. Each of the plurality of die pads 31 may correspond to two, four, five or seven leads 33 according to the type of transistors, integrated circuits or other devices to be packaged. Moreover, the plurality of tie elements 35 may take various shapes, for example, strip, polygon and so on.
  • Still referring to FIG. 3, optionally, the lead frame 30 further comprises a strip element 36 connected to the second plurality of leads 33 so as to facilitate performing operations on the lead frame 30.
  • FIG. 4 shows a flow diagram of an embodiment of the method according to another aspect of the invention. Steps of the method will be described with reference to the lead frame 20.
  • In step S41, lead frame 20 is provided.
  • In step S42, a first plurality of dice are attached to the first plurality of die pads 21 of the lead frame 20 by means of solder paste, soft solder, or a silver paste filled epoxy, which is first applied to the die pads 21 before the dice are attached, followed by a solder reflow process or an epoxy curing process.
  • In step S43, wires, which may be aluminum or gold, are bonded at one end to the first plurality of dice and at the other end to the first plurality of die pads 21, so that electrical connections therebetween are formed.
  • In step S44, the first plurality of dice are molded with encapsulation materials such as resin and plastic.
  • In step S45, the third plurality of tie elements 25 are cut off, and the molded dice are singulated and trimmed.
  • In the disclosure herein, operations of product embodiment(s) may be described with reference to method embodiment(s) for illustrative purposes. However, it should be appreciated that the operations of the products and the implementations of the methods in the disclosure may be independent of one another. That is, the disclosed product embodiments may operate according to other methods and the disclosed method embodiments may be implemented through other products.
  • It will also be readily understood by those skilled in the art that materials and methods may be varied while remaining within the scope of the present invention. It is also appreciated that the present invention provides many applicable inventive concepts other than the specific contexts used to illustrate embodiments. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacturing, compositions of matter, means, methods, or steps.

Claims (8)

What is claimed is:
1. A lead frame, comprising:
a first plurality of die pads;
a second plurality of leads extending from the first plurality of die pads; and
a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
1. The lead frame of claim 1, wherein each of the third plurality of tie elements connects two adjacent die pads.
2. The lead frame of claim 1, wherein each of the first plurality of die pads comprises a tab portion at an end opposite the second plurality of leads.
3. The lead frame of claim 3, wherein each of the third plurality of tie portions connects one die pad to another at respective tab portions.
4. The lead frame of claim 1, wherein each of the third plurality of tie elements is integral with the two die pads connected thereto.
5. The lead frame of claim 1, wherein the lead frame further comprises a strip element connected to the second plurality of leads.
6. A lead frame for discrete package, comprising the lead frame of any of claims 1-6.
7. A method, comprising:
providing a lead frame having a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another;
attaching a first plurality of dice to the first plurality of die pads respectively;
attaching at least a wire bond between each of the first plurality of dice and the corresponding die pad respectively;
molding the first plurality of dice; and
cutting off the third plurality of tie elements.
US13/615,185 2011-09-27 2012-09-13 Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame Active US8736038B2 (en)

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CN2011103049783A CN103021991A (en) 2011-09-27 2011-09-27 Lead frame and encapsulation method
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CN201110304978.3 2011-09-27

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