US20130048249A1 - Heat pipe manufacturing method and heat pipe thereof - Google Patents
Heat pipe manufacturing method and heat pipe thereof Download PDFInfo
- Publication number
- US20130048249A1 US20130048249A1 US13/218,580 US201113218580A US2013048249A1 US 20130048249 A1 US20130048249 A1 US 20130048249A1 US 201113218580 A US201113218580 A US 201113218580A US 2013048249 A1 US2013048249 A1 US 2013048249A1
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- US
- United States
- Prior art keywords
- pipe
- heat pipe
- evaporating section
- heat
- condensing sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Definitions
- the present invention generally relates to a heat pipe, and more particularly, to a method of manufacturing a heat pipe and a heat pipe thereof.
- a conventional heat pipe generally includes a round pipe with a fixed diameter, a capillary structure, and a working fluid.
- the round pipe has a containing chamber in its interior.
- the capillary structure is set inside the containing chamber and stuck to the inner surface of the pipe.
- the working fluid is filled in the containing chamber and accumulated in the capillary structure. As a whole, these parts form a conventional heat pipe.
- the heat pipe's heat conduction efficiency is relatively limited.
- the capillary structure is a homogeneous structure, its flow-back rate is relatively low and hence might not prevent the heat pipe from drying out.
- the heat pipe's evaporation section has a small sectional area, the heat pipe cannot provide a large area to contact with the heat source. Therefore, the heat pipe can only generate a small amount of steam, and the amount is insufficient to prevent heat accumulation. As a result, it's difficult to effectively improve the conventional heat pipe's heat dissipation efficiency.
- Embodiments of the present invention provide a method of manufacturing a heat pipe and a heat pipe thereof. Because in each of these embodiments the peripheral dimension of an evaporating section is different from the peripheral dimensions of a plurality of condensing sections, the inner air's flow rate is increased and the heat conduction efficiency is improved.
- an embodiment of the present invention provides a method of manufacturing a heat pipe.
- the method includes the following steps: a) providing a hollow pipe, an inner wall of the hollow pipe having a plurality of grooves; b) shrinking a part of the hollow pipe so as to convert the hollow pipe into a step pipe having varying peripheral dimensions; c) inserting an insertion rod into the step pipe, and filling a metal powder into a space between the step pipe and the insertion rod; and d) after step c), sintering the step pipe and the insertion rod so as to form a sintered powder structure on an inner wall of the step pipe.
- the heat pipe includes a step pipe and a sintered powder structure.
- An inner wall of the step pipe has a plurality of grooves.
- the step pipe has an evaporating section and two condensing sections.
- the two condensing sections are on two ends of the step pipe, respectively.
- the evaporating section lies between the two condensing sections.
- the inner spaces of the two condensing sections and the evaporating section are interconnected.
- the peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections.
- the sintered powder structure is bounded inside each of the condensing sections.
- the embodiments have the following advantages.
- the composite capillary structure in each of the condensing sections improves the liquid flow-back rate and hence prevents dry out.
- the relatively larger sectional area of the evaporating section increases the contact area between the evaporating section and a heat source, allows more steam to be generated, and hence improves the heat dissipation efficiency. Because the sectional area of the evaporating section is larger than the sectional areas of the condensing sections and because sectional area is inversely proportional to flow rate, when the working fluid receives enough heat and evaporates, the resulting air will have a higher flow rate.
- FIG. 1 shows a flowchart of a heat pipe manufacturing method according to an embodiment of the present invention
- FIG. 2 shows a perspective view of a hollow pipe
- FIG. 3 shows a perspective view of the hollow pipe after being shaped
- FIG. 4 shows a sectional view of a step pipe inserted with an insertion rod
- FIG. 5 shows a sectional view of the step pipe and a sintered powder structure
- FIG. 6 shows a perspective view of the heat pipe
- FIG. 7 shows a sectional view of the heat pipe
- FIG. 8 shows a perspective view of the heat pipe after being flattened
- FIG. 9 shows a sectional view of the heat pipe after being flattened
- FIG. 10 shows a section view along the line 10 - 10 of FIG. 9 ;
- FIG. 11 shows a section view along the line 11 - 11 of FIG. 9 ;
- FIG. 12 shows a sectional view of an evaporating section of a heat pipe according to another embodiment of the present invention.
- FIG. 13 shows a sectional view of an evaporating section of a heat pipe according to further another embodiment of the present invention.
- An embodiment of the present invention provides a method of manufacturing a heat pipe. The method includes the following steps.
- Step a) Provide a hollow pipe 10 .
- the hollow pipe 10 has a plurality of grooves 12 on its inner wall. Please refer to FIG. 2 .
- the hollow pipe 10 is composed of, but not limited to, materials with good heat-conductivity and ductility, such as copper and copper alloy.
- the hollow pipe 10 in this embodiment is a straight round pipe with a containing chamber 11 in its interior.
- the inner wall of the hollow pipe 10 has a plurality of grooves 12 that are parallel to each other.
- a convex stripe 13 lies between each pair of adjacent grooves 12 .
- Each of the grooves 12 is parallel to an axis of the hollow pipe 10 , and extends from one end of the hollow pipe 10 to the other end.
- the hollow pipe 10 with fixed peripheral dimension is placed in a shaping mold, which is not shown in the figure. This shaping mold is used to shrink the areas on the two ends of the hollow pipe 10 , causing the peripheral dimension in the middle area to be larger than the peripheral dimensions on the two ends.
- Step c) Insert an insertion rod 5 into the step pipe 10 a, and fill in the space between the step pipe 10 a and the insertion rod 5 with metal powder 20 .
- the insertion rod 5 is inserted into a terminal area inside the step pipe 10 a.
- the metal powder 20 is stuffed between the step pipe 10 a and the insertion rod 5 .
- the metal powder 20 is stuffed inside the shrunk areas on the two ends of the step pipe 10 a.
- Step d) Sinter the step pipe 10 a and the insertion rod 5 that are combined at step c), causing a sintered powder structure 20 a to be formed on the inner wall of the step pipe 10 a .
- the step pipe 10 a and the insertion rod 5 are sintered in a sintering furnace, which is not depicted in the figure. Then, the insertion rod 5 is extracted from the step pipe 10 a.
- the metal powder 20 remains on the two ends of the step pipe 10 a and form a sintered powder structure 20 a.
- the embodiment can further include a step e) after step d).
- step e) the step pipe 10 a is sealed up, filled with a working fluid 30 , and degassed.
- a sealing apparatus which is not depicted in the figure, is used to solder and seal an end of the step pipe 10 a.
- the working fluid 30 is filled into the step pipe 10 a through the not yet sealed end of the step pipe 10 a.
- the step pipe 10 a that is filled with the working fluid 30 is degassed.
- the other end of the step pipe 10 a is then soldered and sealed.
- the heat pipe 1 of the embodiment is finished, where the heat pipe 1 is now a straight step pipe with round traverse sections.
- the embodiment can further include a step f) after step e).
- step f) the step pipe 10 a is flattened.
- a tool which is not depicted in the figure, is used to press the heat pipe 1 .
- the heat pipe 1 becomes a straight step pipe with flat traverse sections.
- FIG. 8 to FIG. 11 Another embodiment of the present invention provides a heat pipe that includes a step pipe 10 a and a sintered powder structure 20 a.
- the inner wall of the step pipe 10 a has a plurality of grooves 12 that are parallel to each other.
- a convex stripe 13 lies between each pair of adjacent grooves 12 .
- the step pipe 10 a has an evaporating section 101 and two condensing sections 102 and 103 .
- the two condensing sections 102 and 103 are on two different ends of the step pipe 10 a, respectively.
- the evaporating section 101 lies between the two condensing sections 102 and 103 .
- the evaporating section 101 can have a thermal contact with an electronic heat source, which is not depicted in the figure.
- Each of the condensing sections 102 and 103 can conduct heat to cooling components such as cooling fins and cooling blocks, which are not depicted in the figure.
- the interior of each of the condensing sections 102 and 103 is connected to the interior of the evaporating section 101 .
- the peripheral dimension of the evaporating section 101 is larger than the peripheral dimensions of the condensing sections 102 and 103 .
- the cross section of the evaporating section 101 is larger than the cross sections of the condensing sections 102 and 103 .
- the sintered powder structure 20 a is inside the condensing section 102 or 103 or both.
- the evaporating section 101 is round and the condensing sections 102 and 103 are flat.
- the evaporating section 101 is flat and the condensing sections 102 and 103 are round.
- the evaporating section 101 is semicircular, as shown in FIG. 12 , and the condensing sections 102 and 103 are round.
- the evaporating section 101 is semicircular and the condensing sections 102 and 103 are flat.
- each of the grooves 12 in the evaporating sections 101 is filled with the sintered powder structure 20 a.
- the sintered powder structure 20 a stores much working fluid 30 to prevent dry-out.
- FIG. 13 shows another embodiment of the evaporating section 101 of the heat pipe 1 .
- a mesh 40 is surrounded by the convex stripes 13
- a supporting component 45 is surrounded by the mesh 40 .
- the mesh 40 is clipped between the convex stripes 13 and the supporting component 45 .
- the supporting component 45 in this embodiment is a helical spring. This embodiment allows the evaporating section 101 to store much working fluid 30 to prevent dry-out.
Abstract
A heat pipe includes a step pipe and a sintered powder structure. The inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections, improving the heat pipe's inner air flow rate and heat conduction efficiency.
Description
- 1. Technical Field
- The present invention generally relates to a heat pipe, and more particularly, to a method of manufacturing a heat pipe and a heat pipe thereof.
- 2. Related Art
- The exacerbating problems caused by electronic heat sources can be resolved by using heat pipes to dissipate heat in electronic products. Replacing cooling structures formed by cooling fins with heat pipes is apparently the future development trend. In addition to fit in with the premises that electronic products need to be light, thin, short, and small, it's also desirable to further enhance a heat pipe's heat-conduction efficiency.
- A conventional heat pipe generally includes a round pipe with a fixed diameter, a capillary structure, and a working fluid. The round pipe has a containing chamber in its interior. The capillary structure is set inside the containing chamber and stuck to the inner surface of the pipe. The working fluid is filled in the containing chamber and accumulated in the capillary structure. As a whole, these parts form a conventional heat pipe.
- However, because the diameter of the round pipe is fixed, the inner working fluid could not speed up the heat dissipation rate when it evaporates. Therefore, the heat pipe's heat conduction efficiency is relatively limited. Furthermore, because the capillary structure is a homogeneous structure, its flow-back rate is relatively low and hence might not prevent the heat pipe from drying out. In addition, because the heat pipe's evaporation section has a small sectional area, the heat pipe cannot provide a large area to contact with the heat source. Therefore, the heat pipe can only generate a small amount of steam, and the amount is insufficient to prevent heat accumulation. As a result, it's difficult to effectively improve the conventional heat pipe's heat dissipation efficiency.
- Embodiments of the present invention provide a method of manufacturing a heat pipe and a heat pipe thereof. Because in each of these embodiments the peripheral dimension of an evaporating section is different from the peripheral dimensions of a plurality of condensing sections, the inner air's flow rate is increased and the heat conduction efficiency is improved.
- To achieve the aforementioned objectives, an embodiment of the present invention provides a method of manufacturing a heat pipe. The method includes the following steps: a) providing a hollow pipe, an inner wall of the hollow pipe having a plurality of grooves; b) shrinking a part of the hollow pipe so as to convert the hollow pipe into a step pipe having varying peripheral dimensions; c) inserting an insertion rod into the step pipe, and filling a metal powder into a space between the step pipe and the insertion rod; and d) after step c), sintering the step pipe and the insertion rod so as to form a sintered powder structure on an inner wall of the step pipe.
- Another embodiment of the present invention provides a heat pipe. The heat pipe includes a step pipe and a sintered powder structure. An inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The two condensing sections are on two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections.
- The embodiments have the following advantages. The composite capillary structure in each of the condensing sections improves the liquid flow-back rate and hence prevents dry out. The relatively larger sectional area of the evaporating section increases the contact area between the evaporating section and a heat source, allows more steam to be generated, and hence improves the heat dissipation efficiency. Because the sectional area of the evaporating section is larger than the sectional areas of the condensing sections and because sectional area is inversely proportional to flow rate, when the working fluid receives enough heat and evaporates, the resulting air will have a higher flow rate.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
-
FIG. 1 shows a flowchart of a heat pipe manufacturing method according to an embodiment of the present invention; -
FIG. 2 shows a perspective view of a hollow pipe; -
FIG. 3 shows a perspective view of the hollow pipe after being shaped; -
FIG. 4 shows a sectional view of a step pipe inserted with an insertion rod; -
FIG. 5 shows a sectional view of the step pipe and a sintered powder structure; -
FIG. 6 shows a perspective view of the heat pipe; -
FIG. 7 shows a sectional view of the heat pipe; -
FIG. 8 shows a perspective view of the heat pipe after being flattened; -
FIG. 9 shows a sectional view of the heat pipe after being flattened; -
FIG. 10 shows a section view along the line 10-10 ofFIG. 9 ; -
FIG. 11 shows a section view along the line 11-11 ofFIG. 9 ; -
FIG. 12 shows a sectional view of an evaporating section of a heat pipe according to another embodiment of the present invention; and -
FIG. 13 shows a sectional view of an evaporating section of a heat pipe according to further another embodiment of the present invention. - Please refer to
FIG. 1 toFIG. 5 . An embodiment of the present invention provides a method of manufacturing a heat pipe. The method includes the following steps. - Step a) Provide a
hollow pipe 10. Thehollow pipe 10 has a plurality ofgrooves 12 on its inner wall. Please refer toFIG. 2 . In this embodiment, thehollow pipe 10 is composed of, but not limited to, materials with good heat-conductivity and ductility, such as copper and copper alloy. Thehollow pipe 10 in this embodiment is a straight round pipe with a containingchamber 11 in its interior. The inner wall of thehollow pipe 10 has a plurality ofgrooves 12 that are parallel to each other. Aconvex stripe 13 lies between each pair ofadjacent grooves 12. Each of thegrooves 12 is parallel to an axis of thehollow pipe 10, and extends from one end of thehollow pipe 10 to the other end. - Step b) Shrink some parts of the
hollow pipe 10 so as to convert thehollow pipe 10 into astep pipe 10 a with varying peripheral dimensions. Please refer toFIG. 3 , at this step, thehollow pipe 10 with fixed peripheral dimension is placed in a shaping mold, which is not shown in the figure. This shaping mold is used to shrink the areas on the two ends of thehollow pipe 10, causing the peripheral dimension in the middle area to be larger than the peripheral dimensions on the two ends. - Step c) Insert an
insertion rod 5 into thestep pipe 10 a, and fill in the space between thestep pipe 10 a and theinsertion rod 5 withmetal powder 20. Please refer toFIG. 4 , at this step theinsertion rod 5 is inserted into a terminal area inside thestep pipe 10 a. Then themetal powder 20 is stuffed between thestep pipe 10 a and theinsertion rod 5. In this embodiment, themetal powder 20 is stuffed inside the shrunk areas on the two ends of thestep pipe 10 a. - Step d) Sinter the
step pipe 10 a and theinsertion rod 5 that are combined at step c), causing asintered powder structure 20 a to be formed on the inner wall of thestep pipe 10 a. Please refer toFIG. 5 , at this step, thestep pipe 10 a and theinsertion rod 5 are sintered in a sintering furnace, which is not depicted in the figure. Then, theinsertion rod 5 is extracted from thestep pipe 10 a. Themetal powder 20 remains on the two ends of thestep pipe 10 a and form asintered powder structure 20 a. - In addition, the embodiment can further include a step e) after step d). At step e) the
step pipe 10 a is sealed up, filled with a workingfluid 30, and degassed. Please refer toFIG. 6 andFIG. 7 , at this step, a sealing apparatus, which is not depicted in the figure, is used to solder and seal an end of thestep pipe 10 a. Then, the workingfluid 30 is filled into thestep pipe 10 a through the not yet sealed end of thestep pipe 10 a. Next, thestep pipe 10 a that is filled with the workingfluid 30 is degassed. The other end of thestep pipe 10 a is then soldered and sealed. Eventually, theheat pipe 1 of the embodiment is finished, where theheat pipe 1 is now a straight step pipe with round traverse sections. - Moreover, the embodiment can further include a step f) after step e). At step f), the
step pipe 10 a is flattened. Please refer toFIG. 8 , at this step, a tool, which is not depicted in the figure, is used to press theheat pipe 1. As a result, theheat pipe 1 becomes a straight step pipe with flat traverse sections. - Please refer to
FIG. 8 toFIG. 11 . Another embodiment of the present invention provides a heat pipe that includes astep pipe 10 a and asintered powder structure 20 a. The inner wall of thestep pipe 10 a has a plurality ofgrooves 12 that are parallel to each other. Aconvex stripe 13 lies between each pair ofadjacent grooves 12. Thestep pipe 10 a has an evaporatingsection 101 and two condensingsections sections step pipe 10 a, respectively. The evaporatingsection 101 lies between the two condensingsections section 101 can have a thermal contact with an electronic heat source, which is not depicted in the figure. Each of the condensingsections sections section 101. The peripheral dimension of the evaporatingsection 101 is larger than the peripheral dimensions of the condensingsections section 101 is larger than the cross sections of the condensingsections sintered powder structure 20 a is inside the condensingsection - In addition to the aforementioned configuration, the followings are some alternative configurations. In a first alternative, the evaporating
section 101 is round and the condensingsections section 101 is flat and the condensingsections section 101 is semicircular, as shown inFIG. 12 , and the condensingsections section 101 is semicircular and the condensingsections FIG. 12 , each of thegrooves 12 in the evaporatingsections 101 is filled with thesintered powder structure 20 a. Thesintered powder structure 20 a stores much workingfluid 30 to prevent dry-out. - Please refer to
FIG. 13 , which shows another embodiment of the evaporatingsection 101 of theheat pipe 1. In this embodiment, amesh 40 is surrounded by theconvex stripes 13, and a supportingcomponent 45 is surrounded by themesh 40. In other words, themesh 40 is clipped between theconvex stripes 13 and the supportingcomponent 45. The supportingcomponent 45 in this embodiment is a helical spring. This embodiment allows the evaporatingsection 101 to store much workingfluid 30 to prevent dry-out. - The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.
Claims (15)
1. A method of manufacturing a heat pipe, comprising:
a) providing a hollow pipe, an inner wall of the hollow pipe having a plurality of grooves;
b) shrinking a part of the hollow pipe so as to convert the hollow pipe into a step pipe having varying peripheral dimensions;
c) inserting an insertion rod into the step pipe, and filling a metal powder into a space between the step pipe and the insertion rod; and
d) after step c), sintering the step pipe and the insertion rod so as to form a sintered powder structure on an inner wall of the step pipe;
2. The method of claim 1 , further comprising a step e) of sealing the step pipe, filling in a working fluid, and degassing the step pipe after step d).
3. The method of claim 2 , further comprising a step f) of flatting the step pipe after step e).
4. A heat pipe, comprising:
a step pipe, wherein the step pipe's inner wall has a plurality of grooves, the step pipe has an evaporating section and two condensing sections, the two condensing sections are formed on two ends of the step pipe, respectively, the evaporating section lies between the two condensing sections, inner spaces of the two condensing sections and the evaporating section are interconnected, and a peripheral dimension of the evaporating section is larger than a peripheral dimension of each of the condensing sections; and
a sintered powder structure, bounded inside at least one of the condensing sections.
5. The heat pipe of claim 4 , wherein the heat pipe is a straight step pipe with round traverse sections.
6. The heat pipe of claim 4 , wherein the heat pipe is a straight step pipe with flat traverse sections.
7. The heat pipe of claim 4 , wherein each of the grooves is parallel to an axis of the step pipe.
8. The heat pipe of claim 4 , wherein the sintered powder structure adheres to each of the grooves within the evaporating section.
9. The heat pipe of claim 4 , wherein the sintered powder structure adheres to each of the grooves within at least one of the condensing sections.
10. The heat pipe of claim 4 , wherein the evaporating section is round, semicircular, or flat.
11. The heat pipe of claim 10 , wherein the condensing sections are round or flat.
12. The heat pipe of claim 4 , further comprising a working fluid, the working fluid being filled inside the step pipe.
13. The heat pipe of claim 4 , further comprising a mesh, the mesh being contained inside the evaporating section.
14. The heat pipe of claim 13 , further comprising a supporting component, the supporting component being contained inside the mesh and contacting the mesh.
15. The heat pipe of claim 14 , wherein the supporting component is a helical spring.
Priority Applications (1)
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US13/218,580 US20130048249A1 (en) | 2011-08-26 | 2011-08-26 | Heat pipe manufacturing method and heat pipe thereof |
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US13/218,580 US20130048249A1 (en) | 2011-08-26 | 2011-08-26 | Heat pipe manufacturing method and heat pipe thereof |
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US20130048249A1 true US20130048249A1 (en) | 2013-02-28 |
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US13/218,580 Abandoned US20130048249A1 (en) | 2011-08-26 | 2011-08-26 | Heat pipe manufacturing method and heat pipe thereof |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140174704A1 (en) * | 2012-12-20 | 2014-06-26 | Asia Vital Components Co., Ltd. | Heat dissipation device |
-
2011
- 2011-08-26 US US13/218,580 patent/US20130048249A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140174704A1 (en) * | 2012-12-20 | 2014-06-26 | Asia Vital Components Co., Ltd. | Heat dissipation device |
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