US20130003006A1 - System for display images - Google Patents
System for display images Download PDFInfo
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- US20130003006A1 US20130003006A1 US13/535,249 US201213535249A US2013003006A1 US 20130003006 A1 US20130003006 A1 US 20130003006A1 US 201213535249 A US201213535249 A US 201213535249A US 2013003006 A1 US2013003006 A1 US 2013003006A1
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- layer
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- seal
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133357—Planarisation layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
Definitions
- the disclosure relates to a system for displaying images including a display panel, and more particularly to a display panel with a patterned planarization layer.
- a color filter (CF) substrate and an array substrate are bonded together by a seal. Then, a space between the two substrates is filled with a liquid crystal material to form a liquid crystal display panel.
- CF color filter
- a planarization layer is blanketly formed over the array substrate to cover the TFTs, the scan lines, and the data lines.
- the adhesion between a material of the planarization layer and a metal material used for the scan lines and the data lines and the adhesion between a material of the planarization layer and an inorganic material used for the TFTs, such as silicon oxide or silicon nitride are poor.
- peeling easily occurs between the planarization layer and the metal lines of the scan lines and the data lines, and between the planarization layer and the inorganic material of the TFTs. If so, then, there is poor bonding between the CF substrate and the array substrate, which may lead to the separation of the CF substrate and the array substrate. Therefore, the yield of the conventional liquid crystal display panels is poor.
- embodiments of the invention provide a system for displaying images including a display panel.
- the display panel has a patterned planarization layer which improves a bonding force between two substrates of the display panel.
- the peeling issue found in the manufacturing of conventional liquid crystal display panels is prevented from occurring. Further, the yield of the liquid crystal display panels is enhanced.
- a system for displaying images including a display panel.
- the display panel has a display area and a peripheral area surrounding the display area.
- the display panel comprises a metal layer disposed on a first substrate.
- a patterned planarization layer is disposed on the metal layer, having at least one opening corresponding to the peripheral area, wherein a portion of the metal layer is exposed through the opening.
- a second substrate is disposed opposite to the first substrate.
- a seal is disposed between the first and the second substrates and at the peripheral area, wherein the seal covers the metal layer through the opening of the patterned planarization layer.
- FIGS. 1A-1E show schematic plane views of display panels according to various embodiments of the invention.
- FIG. 2A shows a cross section of a portion of the display panel at the dotted line area 2 A of FIG. 1A according to an embodiment of the invention
- FIG. 2B shows a cross section of a portion of the display panel at the dotted line area 2 B of FIG. 1D according to an embodiment of the invention
- FIG. 2C shows a cross section of a portion of the display panel at the dotted line area 2 C of FIG. 1E according to an embodiment of the invention.
- FIG. 3 schematically shows a system for displaying images including the display panel according to an embodiment of the invention.
- a patterned planarization layer is formed on a substrate of a display panel.
- the patterned planarization layer is disposed between a seal and a metal layer and an insulating layer formed on the substrate.
- a contact area between the seal and the metal layer and the insulating layer is increased through the design of the patterned planarization layer.
- FIG. 1A a plane view of a display panel 100 according to an embodiment of the invention is shown.
- the display panel 100 has a display area 100 A and a peripheral area 100 B surrounding the display area 100 A.
- a seal 110 is disposed at the peripheral area 100 B for bonding two substrates (not shown) of the display panel 100 together.
- the display panel 100 has a patterned planarization layer 108 , which has a loop-shaped opening 109 A disposed corresponding to the peripheral area 100 B.
- the loop-shaped opening 109 A is disposed corresponding to an area of the seal 110 .
- the display panel 100 includes a first substrate 102 , such as an array substrate.
- An insulating layer 104 and a metal layer 106 are formed on the first substrate 102 .
- the material of the insulating layer 104 is for example silicon oxide (SiOx), silicon nitride (SiNx) or a combination thereof, which may be used for an insulating material layer of TFTs.
- the material of the metal layer 106 may be an electrically conductive material such as titanium, aluminum, molybdenum, manganese, copper, zinc, tin, gold or silver, which can be used as metal wires for the scan lines and the data lines to electrically connect with the TFTs.
- the patterned planarization layer 108 is formed on the insulating layer 104 and the metal layer 106 , having the loop-shaped opening 109 A to expose a portion of the insulating layer 104 and a portion of the metal layer 106 .
- the material of the patterned planarization layer 108 is for example an organic photoresist made of acrylic-based materials, which can be processed by an exposure and a development process to form the loop-shaped opening 109 A.
- the display panel 100 further includes a second substrate 120 , such as a CF substrate, which is disposed opposite to the first substrate 102 .
- a color filter layer 122 is formed on the second substrate 120 .
- the seal 110 is disposed between the first substrate 102 and the second substrate 120 for bonding with each other.
- the material of the seal 110 is for example an adhesion agent made of acrylic-based materials or epoxy resin, which can be processed by a coating process to form the seal 110 .
- the adhesion force between the seal 110 , the insulating layer 104 and the metal layer 106 is greater than the adhesion force between the patterned planarization layer 108 , the insulating layer 104 and the metal layer 106 .
- the seal 110 contacts the portions of the insulating layer 104 and the metal layer 106 exposed through the loop-shaped opening 109 A.
- the area of the opening of the patterned planarization layer 108 may be 5% to 100% of the area of the seal 110 , wherein at least greater than 10% is preferred.
- the area of the opening of the patterned planarization layer 108 is larger, and thus a contact area among the seal 110 , the insulating layer 104 and the metal layer 106 on the first substrate 102 is larger. Therefore, the bonding ability between the first substrate 102 and the second substrate 120 is higher.
- the patterned planarization layer 108 has L-shaped holes 109 B disposed at four corners of the peripheral area 100 B of the display panel 100 and the L-shaped holes 109 B correspond to the area of the seal 110 .
- a contact area among the seal 110 , the insulating layer 104 and the metal layer 106 is increased by the design of the L-shaped holes 109 B.
- the peeling issue easily occurs at the four corners of the display panel 100 when stress is applied to the display panel 100 .
- the design of the four L-shaped holes 109 B of the patterned planarization layer 108 prevents the display panel 100 from failing in the shock test due to peeling.
- the patterned planarization layer 108 has a plurality of holes 109 C disposed at the peripheral area 100 B of the display panel 100 and the holes 109 C correspond to the area of the seal 110 .
- a contact area among the seal 110 , the insulating layer 104 and the metal layer 106 is increased by the design of the holes 109 C.
- the shape of the holes 109 C may be any shape. Further, the amount, the size and the distribution position of the holes 109 C are not limited to FIG. 1C .
- the area of the holes 109 C is at least more than 10% of the area of the seal 110 .
- FIG. 1D a plane view of a display panel 100 according to another embodiment of the invention is shown.
- the patterned planarization layer 108 is disposed outside of the seal 110 and at the display area 100 A.
- the patterned planarization layer 108 is not disposed at the peripheral area 100 B, such that the seal 110 completely covers the insulating layer 104 and the metal layer 106 at the peripheral area 100 B to enhance the bonding strength between the first substrate 102 and the second substrate 120 .
- the display panel 100 of FIG. 2B further includes a passivation layer 112 disposed between the patterned planarization layer 108 and the insulating layer 104 and the metal layer 106 . Because the patterned planarization layer 108 of the display panel 100 of FIG. 2B is only disposed at the display area 100 A, the metal layer 106 may be corroded by moisture or oxygen before coating the seal 110 .
- the metal layer 106 After coating the seal 110 , the metal layer 106 also may be corroded due to the seal 110 not being accurately coated at an exact position and the metal layer 106 not completely being covered with the seal 110 .
- the passivation layer 112 is formed on the metal layer 106 to completely cover the insulating layer 104 and the metal layer 106 .
- the material of the passivation layer 112 may be silicon oxide (SiOx), silicon nitride (SiNx) or other suitable insulating materials.
- the adhesion force between the seal 110 and the passivation layer 112 is greater than the adhesion force between patterned planarization layer 108 and the passivation layer 112 .
- the peeling issue occurring between the first substrate 102 and the second substrate 120 is effectively prevented.
- FIG. 1E a plane view of a display panel 100 according to another embodiment of the invention is shown.
- an opening 109 of the patterned planarization layer 108 has an area greater than or equal to the area of the seal 110 . Therefore, the seal 110 completely covers portions of the insulating layer 104 and the metal layer 106 exposed by the opening 109 to enhance the bonding strength between the first substrate 102 and the second substrate 120 .
- the display panel 100 of FIG. 2C further includes a passivation layer 114 disposed above the patterned planarization layer 108 .
- the portions of the insulating layer 104 and the metal layer 106 exposed by the opening 109 are completely covered with the passivation layer 114 .
- the material of the passivation layer 114 may be silicon oxide (SiOx), silicon nitride (SiNx) or other suitable insulating materials.
- the adhesion force between the seal 110 and the passivation layer 114 is greater than the adhesion force between patterned planarization layer 108 and the passivation layer 114 .
- the passivation layer 114 prevents the metal layer 106 from being corroded by moisture or oxygen. After coating the seal 110 , the metal layer 106 may be corroded due to the seal 110 not being accurately coated at an exact position and the metal layer 106 not being completely covered by the seal 110 .
- the passivation layer 114 mitigates the above mentioned issues to prevent the metal layer 106 from corrosion.
- the display panels 100 of the embodiments use the design of the patterned planarization layer 108 to increase the contact area between the seal 110 and the insulating layer 104 and the metal layer 106 on the first substrate 102 , or to increase the contact area between the seal 110 and the passivation layer 112 or 114 on the first substrate 102 . Therefore, the bonding force between first substrate 102 and the second substrate 120 is enhanced to prevent the display panel 100 from failure which is caused by peeling issue. Moreover, the production yield of the display panel 100 is also enhanced.
- a liquid crystal layer (not shown) is sandwiched between the first substrate 102 and the second substrate 120 .
- the display panel 100 can further include a pair of polarizers (not shown) disposed on the outer sides of the first substrate 102 and the second substrate 120 respectively to complete the fabrication of a liquid crystal display panel.
- the system 400 for displaying images includes a display 200 , for example a liquid crystal display.
- the display 200 includes a display panel 100 according to an embodiment of the invention.
- the display 200 can be a part of an electronic device.
- the system 400 for displaying images includes the display 200 and a control unit 300 .
- the control unit 300 is coupled with the display 200 to provide an input to the display 200 , such that the display 200 displays images.
- the above mentioned electronic device can be a mobile phone, a digital camera, a personal data assistant (PDA), a notebook computer, a desktop computer, a television, a car display or a portable DVD player.
- PDA personal data assistant
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Abstract
Description
- This Application claims priority of Taiwan Patent Application No. 100122869, filed on Jun. 29, 2011, the entirety of which is incorporated by reference herein.
- 1. Field of the Invention
- The disclosure relates to a system for displaying images including a display panel, and more particularly to a display panel with a patterned planarization layer.
- 2. Description of the Related Art
- Generally, a color filter (CF) substrate and an array substrate are bonded together by a seal. Then, a space between the two substrates is filled with a liquid crystal material to form a liquid crystal display panel.
- In conventional liquid crystal display panels, after a plurality of thin-film transistors (TFTs) and a plurality of scan lines and data lines are formed on the array substrate, a planarization layer is blanketly formed over the array substrate to cover the TFTs, the scan lines, and the data lines. The adhesion between a material of the planarization layer and a metal material used for the scan lines and the data lines and the adhesion between a material of the planarization layer and an inorganic material used for the TFTs, such as silicon oxide or silicon nitride are poor. Thus, peeling easily occurs between the planarization layer and the metal lines of the scan lines and the data lines, and between the planarization layer and the inorganic material of the TFTs. If so, then, there is poor bonding between the CF substrate and the array substrate, which may lead to the separation of the CF substrate and the array substrate. Therefore, the yield of the conventional liquid crystal display panels is poor.
- Accordingly, embodiments of the invention provide a system for displaying images including a display panel. The display panel has a patterned planarization layer which improves a bonding force between two substrates of the display panel. Thus, the peeling issue found in the manufacturing of conventional liquid crystal display panels is prevented from occurring. Further, the yield of the liquid crystal display panels is enhanced.
- According to an embodiment, a system for displaying images including a display panel is provided. The display panel has a display area and a peripheral area surrounding the display area. The display panel comprises a metal layer disposed on a first substrate. A patterned planarization layer is disposed on the metal layer, having at least one opening corresponding to the peripheral area, wherein a portion of the metal layer is exposed through the opening. A second substrate is disposed opposite to the first substrate. Further, a seal is disposed between the first and the second substrates and at the peripheral area, wherein the seal covers the metal layer through the opening of the patterned planarization layer.
- A detailed description is given in the following embodiments with reference to the accompanying drawings.
- The disclosure can be more fully understood by reading the subsequent detailed description and examples with reference to the accompanying drawings, wherein:
-
FIGS. 1A-1E show schematic plane views of display panels according to various embodiments of the invention; -
FIG. 2A shows a cross section of a portion of the display panel at thedotted line area 2A ofFIG. 1A according to an embodiment of the invention; -
FIG. 2B shows a cross section of a portion of the display panel at thedotted line area 2B ofFIG. 1D according to an embodiment of the invention; -
FIG. 2C shows a cross section of a portion of the display panel at thedotted line area 2C ofFIG. 1E according to an embodiment of the invention; and -
FIG. 3 schematically shows a system for displaying images including the display panel according to an embodiment of the invention. - The description is provided for illustrating the general principles of the invention and is not meant to be limiting. The scope of the invention is best determined by reference to the appended claims.
- In embodiments of the invention, a patterned planarization layer is formed on a substrate of a display panel. The patterned planarization layer is disposed between a seal and a metal layer and an insulating layer formed on the substrate. A contact area between the seal and the metal layer and the insulating layer is increased through the design of the patterned planarization layer. Thus, a bonding force between two substrates of the display panel is enhanced to prevent the peeling issue found in the manufacturing of conventional liquid crystal display panels from occurring.
- Referring to
FIG. 1A , a plane view of adisplay panel 100 according to an embodiment of the invention is shown. Thedisplay panel 100 has adisplay area 100A and aperipheral area 100B surrounding thedisplay area 100A. Aseal 110 is disposed at theperipheral area 100B for bonding two substrates (not shown) of thedisplay panel 100 together. Furthermore, thedisplay panel 100 has a patternedplanarization layer 108, which has a loop-shaped opening 109A disposed corresponding to theperipheral area 100B. Moreover, the loop-shaped opening 109A is disposed corresponding to an area of theseal 110. - Referring to
FIG. 2A , a cross section of a portion of thedisplay panel 100 at thedotted line area 2A ofFIG. 1A according to an embodiment of the invention is shown. As shown inFIG. 2A , thedisplay panel 100 includes afirst substrate 102, such as an array substrate. Aninsulating layer 104 and ametal layer 106 are formed on thefirst substrate 102. The material of theinsulating layer 104 is for example silicon oxide (SiOx), silicon nitride (SiNx) or a combination thereof, which may be used for an insulating material layer of TFTs. The material of themetal layer 106 may be an electrically conductive material such as titanium, aluminum, molybdenum, manganese, copper, zinc, tin, gold or silver, which can be used as metal wires for the scan lines and the data lines to electrically connect with the TFTs. The patternedplanarization layer 108 is formed on theinsulating layer 104 and themetal layer 106, having the loop-shaped opening 109A to expose a portion of theinsulating layer 104 and a portion of themetal layer 106. The material of the patternedplanarization layer 108 is for example an organic photoresist made of acrylic-based materials, which can be processed by an exposure and a development process to form the loop-shaped opening 109A. - The
display panel 100 further includes asecond substrate 120, such as a CF substrate, which is disposed opposite to thefirst substrate 102. Acolor filter layer 122 is formed on thesecond substrate 120. Theseal 110 is disposed between thefirst substrate 102 and thesecond substrate 120 for bonding with each other. The material of theseal 110 is for example an adhesion agent made of acrylic-based materials or epoxy resin, which can be processed by a coating process to form theseal 110. - According to the characteristics of the materials of the
seal 110, the insulatinglayer 104, themetal layer 106 and the patternedplanarization layer 108, the adhesion force between theseal 110, the insulatinglayer 104 and themetal layer 106 is greater than the adhesion force between the patternedplanarization layer 108, the insulatinglayer 104 and themetal layer 106. In an embodiment, using the design of the loop-shapedopening 109A of the patternedplanarization layer 108, theseal 110 contacts the portions of the insulatinglayer 104 and themetal layer 106 exposed through the loop-shapedopening 109A. Thus, bonding ability between thefirst substrate 102 and thesecond substrate 120 is enhanced. In an embodiment, the area of the opening of the patternedplanarization layer 108 may be 5% to 100% of the area of theseal 110, wherein at least greater than 10% is preferred. The area of the opening of the patternedplanarization layer 108 is larger, and thus a contact area among theseal 110, the insulatinglayer 104 and themetal layer 106 on thefirst substrate 102 is larger. Therefore, the bonding ability between thefirst substrate 102 and thesecond substrate 120 is higher. - Referring to
FIG. 1B , a plane view of adisplay panel 100 according to another embodiment of the invention is shown. In this embodiment, the patternedplanarization layer 108 has L-shapedholes 109B disposed at four corners of theperipheral area 100B of thedisplay panel 100 and the L-shapedholes 109B correspond to the area of theseal 110. A contact area among theseal 110, the insulatinglayer 104 and themetal layer 106 is increased by the design of the L-shapedholes 109B. The peeling issue easily occurs at the four corners of thedisplay panel 100 when stress is applied to thedisplay panel 100. Thus, when a shock test is performed to thedisplay panel 100, the design of the four L-shapedholes 109B of the patternedplanarization layer 108 prevents thedisplay panel 100 from failing in the shock test due to peeling. - Referring to
FIG. 1C , a plane view of adisplay panel 100 according to further another embodiment of the invention is shown. In this embodiment, the patternedplanarization layer 108 has a plurality ofholes 109C disposed at theperipheral area 100B of thedisplay panel 100 and theholes 109C correspond to the area of theseal 110. A contact area among theseal 110, the insulatinglayer 104 and themetal layer 106 is increased by the design of theholes 109C. In the embodiments, the shape of theholes 109C may be any shape. Further, the amount, the size and the distribution position of theholes 109C are not limited toFIG. 1C . The area of theholes 109C is at least more than 10% of the area of theseal 110. - Referring to
FIG. 1D , a plane view of adisplay panel 100 according to another embodiment of the invention is shown. In this embodiment, the patternedplanarization layer 108 is disposed outside of theseal 110 and at thedisplay area 100A. The patternedplanarization layer 108 is not disposed at theperipheral area 100B, such that theseal 110 completely covers the insulatinglayer 104 and themetal layer 106 at theperipheral area 100B to enhance the bonding strength between thefirst substrate 102 and thesecond substrate 120. - Referring to
FIG. 2B , a cross section of a portion of thedisplay panel 100 at the dottedline area 2B ofFIG. 1D according to an embodiment of the invention is shown. As compared with the display panel ofFIG. 2A , thedisplay panel 100 ofFIG. 2B further includes apassivation layer 112 disposed between the patternedplanarization layer 108 and the insulatinglayer 104 and themetal layer 106. Because the patternedplanarization layer 108 of thedisplay panel 100 ofFIG. 2B is only disposed at thedisplay area 100A, themetal layer 106 may be corroded by moisture or oxygen before coating theseal 110. After coating theseal 110, themetal layer 106 also may be corroded due to theseal 110 not being accurately coated at an exact position and themetal layer 106 not completely being covered with theseal 110. In order to overcome the above mentioned problems, in this embodiment, thepassivation layer 112 is formed on themetal layer 106 to completely cover the insulatinglayer 104 and themetal layer 106. The material of thepassivation layer 112 may be silicon oxide (SiOx), silicon nitride (SiNx) or other suitable insulating materials. According to the characteristics of the materials of theseal 110, thepassivation layer 112 and the patternedplanarization layer 108, the adhesion force between theseal 110 and thepassivation layer 112 is greater than the adhesion force between patternedplanarization layer 108 and thepassivation layer 112. Thus, the peeling issue occurring between thefirst substrate 102 and thesecond substrate 120 is effectively prevented. - Referring to
FIG. 1E , a plane view of adisplay panel 100 according to another embodiment of the invention is shown. In this embodiment, anopening 109 of the patternedplanarization layer 108 has an area greater than or equal to the area of theseal 110. Therefore, theseal 110 completely covers portions of the insulatinglayer 104 and themetal layer 106 exposed by theopening 109 to enhance the bonding strength between thefirst substrate 102 and thesecond substrate 120. - Referring to
FIG. 2C , a cross section of a portion of thedisplay panel 100 at the dottedline area 2C ofFIG. 1E according to an embodiment of the invention is shown. As compared with the display panel ofFIG. 2A , thedisplay panel 100 ofFIG. 2C further includes apassivation layer 114 disposed above the patternedplanarization layer 108. The portions of the insulatinglayer 104 and themetal layer 106 exposed by theopening 109 are completely covered with thepassivation layer 114. The material of thepassivation layer 114 may be silicon oxide (SiOx), silicon nitride (SiNx) or other suitable insulating materials. According to the characteristics of the materials of theseal 110, thepassivation layer 114 and the patternedplanarization layer 108, the adhesion force between theseal 110 and thepassivation layer 114 is greater than the adhesion force between patternedplanarization layer 108 and thepassivation layer 114. Thus, the peeling issue occurring between thefirst substrate 102 and thesecond substrate 120 is effectively prevented. Moreover, before coating theseal 110, thepassivation layer 114 prevents themetal layer 106 from being corroded by moisture or oxygen. After coating theseal 110, themetal layer 106 may be corroded due to theseal 110 not being accurately coated at an exact position and themetal layer 106 not being completely covered by theseal 110. However, thepassivation layer 114 mitigates the above mentioned issues to prevent themetal layer 106 from corrosion. - As the above mentions, the
display panels 100 of the embodiments use the design of the patternedplanarization layer 108 to increase the contact area between theseal 110 and the insulatinglayer 104 and themetal layer 106 on thefirst substrate 102, or to increase the contact area between theseal 110 and thepassivation layer first substrate 102. Therefore, the bonding force betweenfirst substrate 102 and thesecond substrate 120 is enhanced to prevent thedisplay panel 100 from failure which is caused by peeling issue. Moreover, the production yield of thedisplay panel 100 is also enhanced. - In an embodiment of the
display panel 100, a liquid crystal layer (not shown) is sandwiched between thefirst substrate 102 and thesecond substrate 120. Moreover, thedisplay panel 100 can further include a pair of polarizers (not shown) disposed on the outer sides of thefirst substrate 102 and thesecond substrate 120 respectively to complete the fabrication of a liquid crystal display panel. - Referring to
FIG. 3 , asystem 400 for displaying images according to an embodiment of the invention is shown. Thesystem 400 for displaying images includes adisplay 200, for example a liquid crystal display. Thedisplay 200 includes adisplay panel 100 according to an embodiment of the invention. Thedisplay 200 can be a part of an electronic device. In general, thesystem 400 for displaying images includes thedisplay 200 and acontrol unit 300. Thecontrol unit 300 is coupled with thedisplay 200 to provide an input to thedisplay 200, such that thedisplay 200 displays images. The above mentioned electronic device can be a mobile phone, a digital camera, a personal data assistant (PDA), a notebook computer, a desktop computer, a television, a car display or a portable DVD player. - While the invention has been described by way of example and in terms of embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims (16)
Priority Applications (8)
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US14/714,560 US9176345B2 (en) | 2011-06-29 | 2015-05-18 | System for display images |
US14/875,031 US9377654B2 (en) | 2011-06-29 | 2015-10-05 | System for display images |
US14/874,919 US9372367B2 (en) | 2011-06-29 | 2015-10-05 | System for display images |
US15/050,363 US9544959B2 (en) | 2012-06-15 | 2016-02-22 | Solid-state lighting compatible with ballasts and operable with AC mains |
US15/132,167 US9801241B2 (en) | 2012-06-15 | 2016-04-18 | Solid-state lighting without operational uncertainty and free of fire hazard |
US15/163,851 US9690143B2 (en) | 2011-06-29 | 2016-05-25 | System for display images |
US15/199,365 US9668308B2 (en) | 2012-06-15 | 2016-06-30 | Linear solid-state lighting compatible with ballasts in double ends and operable with AC mains in a single end |
US15/275,220 US9913330B2 (en) | 2012-06-15 | 2016-09-23 | Solid-state lighting operable with compact fluorescent ballasts and AC mains |
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TW100122869 | 2011-06-29 | ||
TW100122869A TWI471661B (en) | 2011-06-29 | 2011-06-29 | System for display images |
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US14/135,116 Continuation-In-Part US9163818B2 (en) | 2012-06-15 | 2013-12-19 | Linear solid-state lighting with degenerate voltage sensing free of fire and shock hazards |
US14/714,560 Division US9176345B2 (en) | 2011-06-29 | 2015-05-18 | System for display images |
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US14/874,919 Active US9372367B2 (en) | 2011-06-29 | 2015-10-05 | System for display images |
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Also Published As
Publication number | Publication date |
---|---|
US20160026020A1 (en) | 2016-01-28 |
US20160266424A1 (en) | 2016-09-15 |
US9176345B2 (en) | 2015-11-03 |
US9377654B2 (en) | 2016-06-28 |
TW201300906A (en) | 2013-01-01 |
US9690143B2 (en) | 2017-06-27 |
US20150248028A1 (en) | 2015-09-03 |
TWI471661B (en) | 2015-02-01 |
US20160026021A1 (en) | 2016-01-28 |
US9372367B2 (en) | 2016-06-21 |
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