CN115598891A - Display panel and display device - Google Patents
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- CN115598891A CN115598891A CN202211193024.4A CN202211193024A CN115598891A CN 115598891 A CN115598891 A CN 115598891A CN 202211193024 A CN202211193024 A CN 202211193024A CN 115598891 A CN115598891 A CN 115598891A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses display panel and display device, display panel include display area and non-display area, and the non-display area is located one side of display area, and the non-display area is including binding district and peripheral zone, and display area and peripheral zone are connected in the binding district. The display panel comprises an array substrate, a color film substrate and a flexible circuit board. The array substrate is located in the display area and the non-display area and provided with a first surface and a second surface which are opposite. The array substrate is provided with a concave part, the concave part is positioned in the peripheral area, and an opening of the concave part is positioned on the second surface. The color film substrate is arranged on the second surface. The flexible circuit board is connected with the array substrate located in the binding area in a binding mode, the flexible circuit board bends towards one side, away from the array substrate, of the color film substrate, and part of the flexible circuit board is arranged in the concave portion in a bending mode.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
Liquid Crystal Displays (LCDs) have the advantages of high image quality, small size, light weight, low voltage driving, low power consumption, and wide application range, and thus are widely used in consumer electronics or computer products such as portable televisions, mobile phones, camcorders, notebook computers, and desktop monitors, and become the mainstream of displays. At present, in order to realize the design of a display panel with no frame on four sides, a long and commonly used technical means is realized by Flip (Flip). Referring to fig. 1, unlike the conventional display panel, in the display panel with no frame on the four sides, the glass substrate of the array substrate 10 is located on a side close to the display surface of the display panel, the color filter substrate 20 is located on a side of the array substrate 10 away from the display surface, and the flexible circuit board 40 is bent towards the side of the color filter substrate 20 away from the array substrate 10, so that the bending of the flexible circuit board 40 deviates from the binding direction, which causes the flexible circuit board 40 to fall off (Peeling) from the array substrate 10, thereby causing the display panel to fail.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, which are used for solving the technical problem that a flexible circuit board falls off from an array substrate, so that the display panel fails.
The embodiment of the application provides a display panel, including display area and non-display area, the non-display area is located at least one side of display area, the non-display area is including binding district and peripheral zone, it connects to bind the district the display area with the peripheral zone, display panel includes:
the array substrate is positioned in the display area and the non-display area, the array substrate is provided with a first surface and a second surface which are opposite, the array substrate is provided with a concave part, the concave part is positioned in the peripheral area, and the opening of the concave part is positioned on the second surface;
the color film substrate is arranged on the second surface;
the flexible circuit board is arranged on the second surface and is in binding connection with the array substrate located in the binding area, the flexible circuit board bends towards one side, away from the array substrate, of the color film substrate, and part of the flexible circuit board is arranged in the concave portion in a bending mode.
Optionally, in some embodiments provided in the present application, the display panel further includes an adhesive member disposed in the recess, and the flexible circuit board is connected to the adhesive member.
Optionally, in some embodiments provided herein, the recess includes a first sub-area and a second sub-area, the first sub-area is located on a side close to the bonding area, the second sub-area is located on a side far from the bonding area, the adhesive member is located in the first sub-area, and a portion of the flexible circuit board is disposed in the second sub-area.
Optionally, in some embodiments provided herein, the width of the second sub-area is between 0.5 mm and 1.5 mm.
Optionally, in some embodiments provided herein, the array substrate further includes a substrate, and a thin film transistor and a plurality of insulating layers disposed on the substrate, where the plurality of insulating layers cover the thin film transistor, and the recess portion penetrates at least one insulating layer.
Optionally, in some embodiments provided herein, the plurality of insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer sequentially disposed on the substrate, the recess penetrates through the third insulating layer, and a bottom of the recess is located on the second insulating layer.
Optionally, in some embodiments provided herein, the plurality of insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer sequentially disposed on the substrate, the recess penetrates through the third insulating layer, the second insulating layer, and the first insulating layer, and a bottom of the recess is located on the substrate.
Optionally, in some embodiments provided herein, the flexible circuit board includes a first portion, a curved portion, and a second portion, where the first portion and the second portion are connected by the curved portion, the first portion is connected to the array substrate and the bonding member, the second portion is disposed on a side of the color filter substrate away from the array substrate, the curved portion is disposed between the first portion and the second portion, and a portion of the curved portion is arranged in the recess in a curved manner.
Optionally, in some embodiments provided in the application, the display panel further includes a shielding layer, a first polarizer, and a sealant, where the first polarizer is located on one side of the array substrate away from the color film substrate, the shielding layer is disposed between the array substrate and the first polarizer, the shielding layer is located in the non-display area, and the sealant is disposed on the first side surface of the array substrate and covers a side surface of the first polarizer on the same side as the first side surface.
Correspondingly, an embodiment of the present application further provides a display device, where the display device includes the display panel, and the display device further includes a backlight module, where the backlight module is located on one side of the color film substrate, which is far away from the array substrate.
The embodiment of the application provides a display panel and a display device, wherein the display panel comprises a display area and a non-display area, the non-display area is located on one side of the display area, the non-display area comprises a binding area and a peripheral area, and the binding area is connected with the display area and the peripheral area. The display panel comprises an array substrate, a color film substrate and a flexible circuit board. The array substrate is located in the display area and the non-display area and provided with a first surface and a second surface which are opposite. The array substrate is provided with a concave part, the concave part is positioned in the peripheral area, and an opening of the concave part is positioned on the second surface. The adhesive member is disposed within the recess. The color film substrate is arranged on the second surface. The flexible circuit board is connected with the array substrate located in the binding area in a binding mode, the flexible circuit board bends towards one side, away from the array substrate, of the color film substrate, and part of the flexible circuit board is arranged in the concave portion in a bending mode. When the flexible circuit board is bent towards one side of the color film substrate away from the array substrate, the bending direction of the flexible circuit board deviates from the binding direction of the flexible circuit board, so that the flexible circuit board is easy to fall off from the array substrate, and the display failure of the display panel is caused. In the embodiment of the application, the concave part is arranged on the array substrate corresponding to the peripheral area, when the flexible circuit board is bent towards one side of the color film substrate far away from the array substrate, the part of the flexible circuit board is bent and arranged in the concave part, so that the stress generated in the bending process of the flexible circuit board is reduced, and the flexible circuit board is prevented from falling off from the array substrate.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to a comparative example of the present application;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure before a flexible circuit board is bent;
fig. 4 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
Detailed Description
For purposes of clarity, technical solutions and advantages of the present application, the present application will be described in further detail with reference to the accompanying drawings, wherein like reference numerals represent like elements throughout the several views, and the following description is based on the illustrated embodiments of the present application and should not be construed as limiting the other embodiments of the present application which are not detailed herein. The word "embodiment" as used herein means example, instance, or illustration.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The embodiment of the application provides a display panel and a display device. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to a comparative embodiment of the present application. In order to realize a narrow frame or even a frameless design, a common technical means is realized by Flip (Flip). The structure of the display panel is different from that of a conventional display panel, in the display panel without frames on four sides, the glass substrate of the array substrate 10 is located on one side close to the display surface of the display panel, the color film substrate 20 is located on one side of the array substrate 10 away from the display surface, and the flexible circuit board 40 is bent towards one side of the color film substrate 20 away from the array substrate 10, so that the bending of the flexible circuit board 40 deviates from the binding direction, and the flexible circuit board 40 is easy to fall off (Peeling) from the array substrate 10, thereby causing the display panel to fail. In addition, due to the material characteristics of the flexible circuit board 40, when the flexible circuit board is bent, the bent portion of the flexible circuit board may exceed the side edge of the sealant, and therefore, when the protective cover is disposed on the display panel to protect the flexible circuit board, a Gap is formed between the side edge of the sealant and the protective cover, which may affect the beauty of the product.
In view of the above technical problems, embodiments of the present application provide a display panel, which is used to solve the technical problem that a flexible circuit board falls off from an array substrate, thereby causing a display panel to fail.
The embodiment of the application provides a display panel, which comprises a display area and a non-display area, wherein the non-display area is positioned on one side of the display area, the non-display area comprises a binding area and a peripheral area, and the binding area is connected with the display area and the peripheral area. The display panel comprises an array substrate, a color film substrate and a flexible circuit board. The array substrate is located in the display area and the non-display area and provided with a first surface and a second surface which are opposite. The array substrate is provided with a concave part, the concave part is positioned in the peripheral area, and an opening of the concave part is positioned on the second surface. The color film substrate is arranged on the second surface. The flexible circuit board is bound with the array substrate located in the binding area and is connected with the side, away from the array substrate, of the color film substrate, and the flexible circuit board is bent towards the side, away from the array substrate, of the color film substrate, and part of the flexible circuit board is arranged in the concave portion in a bending mode.
When the flexible circuit board is bent towards one side of the color film substrate away from the array substrate, the bending direction of the flexible circuit board deviates from the binding direction of the flexible circuit board, so that the flexible circuit board is easy to fall off from the array substrate, and the display failure of the display panel is caused. In the embodiment of the application, the recess is formed in the array substrate corresponding to the peripheral area, when the flexible circuit board is bent towards one side of the color film substrate away from the array substrate, the flexible circuit board is bent and arranged in the recess, stress generated in the bending process of the flexible circuit board is reduced, and therefore the flexible circuit board is prevented from falling off from the array substrate.
The display panel provided by the present application is explained in detail by specific embodiments below.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure. Fig. 3 is a schematic structural diagram of a display panel before a flexible circuit board is bent according to an embodiment of the present disclosure. The embodiment of the application provides a display panel, the display panel 1000 comprises a display area AA and a non-display area NA, the non-display area NA is located on one side of the display area AA, the non-display area NA comprises a binding area BA and a peripheral area PA, and the binding area BA is connected with the display area AA and the peripheral area PA. The display panel 1000 includes an array substrate 10, a color filter substrate 20, a liquid crystal layer 50, an adhesive member 30, a flexible circuit board 40, a driving chip 90, a printed circuit board 100, a first polarizer 60, a second polarizer 110, a shielding layer 70, and a sealant 80.
The array substrate 10 is located in the display area AA and the non-display area NA. The array substrate 10 has a first surface 1a and a second surface 1b opposite to each other. The array substrate 10 has a recess 10a, the recess 10a is located in the peripheral area PA, and an opening of the recess 10a is located on the second surface 1b. The adhesive member 30 is disposed in the recess 10a.
In the embodiment of the present application, the recess 10a includes a first sub-area 10a1 and a second sub-area 10a2, the first sub-area 10a1 is located on a side close to the bonding area BA, and the second sub-area 10a2 is located on a side far from the bonding area BA. The adhesive member 30 is located in the first sub-area 10a1, and a portion of the flexible circuit board 40 is disposed in the second sub-area 10a 2. In the present application, the recess 10a is divided into a first sub-area 10a1 and a second sub-area 10a2, the bonding member 30 is located in the first sub-area 10a1, the second sub-area 10a2 can be used as a stress release area of the flexible circuit board 40, and when the flexible circuit board 40 is bent towards a side of the color filter substrate 20 away from the array substrate 10, the second sub-area 10a2 can be used for releasing stress generated in the bending process, so as to prevent the flexible circuit board 40 from generating cracks.
The width D1 of the second sub-region 10a2 is between 0.5 mm and 1.5 mm. For example, the width of the second sub-area 10a2 may be 0.5 mm, 0.8 mm, 1 mm, 1.2 mm, 1.4 mm and 1.5 mm, and the embodiment of the present application sets the width of the second sub-area 10a2 between 0.5 mm and 1.5 mm, so as to ensure that there is enough space to release the stress generated during the bending of the flexible circuit board 40.
In some embodiments, the adhesive member 30 may be Tuffy glue, which is a resin-based glue specifically used in the electronics industry, which thins after curing on a glue application, presents a thin bluish layer, and is easily torn off. This application can utilize Tuffy as bonding component 30, and on the one hand, tuffy glues and has great viscidity, can prevent that flexible circuit board 40 from breaking away from on array substrate 10, and on the other hand, tuffy has good corrosion resistance to can protect the metal on the array substrate 10 to walk the line.
Referring to fig. 4, fig. 4 is a schematic view illustrating a first structure of an array substrate according to an embodiment of the present disclosure. In some embodiments, the array substrate 10 further includes a substrate 101, a light shielding layer 103, a thin film transistor 102 disposed on the substrate 101, a plurality of insulating layers covering the thin film transistor 102, and a bonding Pad, wherein the recess 10a penetrates at least one of the insulating layers.
The thin film transistor 102 includes a gate 1022, an active layer 1021, a source 1023, and a drain 1024. The plurality of insulating layers includes a first insulating layer 104, a second insulating layer 106, a third insulating layer 108, and a fourth insulating layer 105 which are sequentially disposed on the substrate 101.
In some embodiments, the light shielding layer 103 is disposed on the substrate 101. The material of the light-shielding layer 103 may be at least one of molybdenum, titanium, copper, and manganese.
The first insulating layer 104 is provided on the substrate 101 and covers the light-shielding layer 103. The material of the first insulating layer 104 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride.
The active layer 1021 is disposed on a side of the buffer layer away from the substrate 101. The active layer 1021 may be made of one of indium gallium zinc oxide, indium gallium tin oxide, and indium gallium zinc tin oxide, or the active layer 1021 may also be a low temperature polysilicon active layer 1021 or an a-Si active layer 1021.
The Oxide Thin Film Transistor (OTFT) has the advantages of high carrier mobility, low power consumption, and applicability to low-frequency driving, and is a hot spot in the development of Thin Film transistors. The oxide thin film transistor means that the active layer 1021 in the thin film transistor is formed of a metal oxide semiconductor. The present application uses a metal oxide as a material of the active layer 1021 to improve the driving capability of the driving substrate.
The fourth insulating layer 105 is disposed on a side of the active layer 1021 remote from the first insulating layer 104. The material of the fourth insulating layer 105 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride.
The gate electrode 1022 is disposed on a side of the fourth insulating layer 105 away from the active layer 1021. The material of the gate 1022 may be one of molybdenum, titanium, and copper, or an alloy material.
The second insulating layer 106 is disposed on a side of the gate 1022 far from the fourth insulating layer 105. The material of the second insulating layer 106 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride.
The source electrode 1023 and the drain electrode 1024 are disposed on the second insulating layer 106 at intervals. The material of the source 1023 and the drain 1024 may be one of molybdenum, titanium, copper, manganese, or an alloy material.
The drain electrode 1024 and the light-shielding layer 103 are connected by the connection electrode 107. In the embodiment of the present application, the light shielding layer 103 can be used not only to shield the active layer 1021 from light, but also to prevent illumination from affecting the stability of the active layer 1021; the light-shielding layer 103 is electrically connected to the drain 1024 through the connection electrode 107, and since the light-shielding layer 103 overlaps with the active layer 1021 and the gate 1022 in the orthographic projection on the substrate 101, parasitic capacitances are formed between the light-shielding layer 103 and the active layer 1021 and between the light-shielding layer 103 and the gate 1022, respectively. When the display panel is in operation, the voltage on the drain 1024 changes with the voltage on the data signal line, so that the voltage on the light shielding layer 103 changes with the voltage, thereby affecting the electrical performance of the active layer 1021. By connecting the light-shielding layer 103 and the source 1023 to form an equipotential, voltage variations on the light-shielding layer 103 can be prevented from affecting the electrical performance of the active layer 1021.
The third insulating layer 108 is provided on a side of the second insulating layer 106 remote from the fourth insulating layer 105. The material of the third insulating layer 108 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride.
The bonding Pad is disposed on the third insulating layer 108.
With continued reference to fig. 4, in some embodiments, the recess 10a penetrates through the third insulating layer 108, and the bottom of the recess 10a is located on the second insulating layer 106. In the present application, the recess 10a penetrates through the third insulating layer 108, and therefore, only the third insulating layer 108 of the array substrate 10 needs to be subjected to an edging process to form the recess 10a.
Referring to fig. 5, fig. 5 is a schematic view illustrating a second structure of an array substrate according to an embodiment of the present disclosure. In some embodiments, the recess 10a penetrates through the third insulating layer 108, the second insulating layer 106, and the first insulating layer 104, and the bottom of the recess 10a is located on the substrate 101. In the present application, the recessed portion 10a penetrates through the third insulating layer 108, the second insulating layer 106 and the first insulating layer 104, and the bottom of the recessed portion 10a is located on the substrate 101, so that the recessed portion 10a has a larger depth, and when the flexible circuit board 40 is bent, more accommodating spaces are provided to accommodate the flexible circuit board 40, and the release stress can be further improved.
The color filter substrate 20 is disposed on the second surface 1b. In some embodiments, the width of the color filter substrate 20 is smaller than the width of the array substrate 10, and the color filter substrate 20 is disposed on the array substrate 10 and exposes the array substrate 10 and the recess 10a located in the bonding area BA.
The liquid crystal layer 50 is disposed between the array substrate 10 and the color filter substrate 20, and the liquid crystal layer 50 is located in the display area AA.
The flexible circuit board 40 is bound and connected with a binding Pad located in the binding area BA, the flexible circuit board 40 is connected with the bonding member 30, and the flexible circuit board 40 is bent towards one side of the color film substrate 20 away from the array substrate 10. In this application, since the bending direction of the flexible circuit board 40 deviates from the binding direction of the flexible circuit board 40, the flexible circuit board 40 is likely to fall off from the array substrate 10, thereby causing a problem of display failure of the display panel 1000. In the embodiment of the present application, the concave portion 10a is disposed on the array substrate 10 corresponding to the peripheral area PA, and the bonding member 30 is disposed in the concave portion 10a, so that the bonding member 30 is connected to the flexible circuit board 40, and the flexible circuit board 40 is prevented from falling off from the array substrate 10, therefore, the display panel 1000 provided in the embodiment of the present application can be used for solving the technical problem that the flexible circuit board 40 falls off from the array substrate 10, so as to cause the display panel 1000 to fail.
In some embodiments, the flexible circuit board 40 includes a first portion 40a, a bent portion 40b, and a second portion 40c, the first portion 40a and the second portion 40c being connected by the bent portion 40 b. The first portion 40a is connected with the array substrate 10 and the adhesive member 30. The second portion 40c is disposed on a side of the color filter substrate 20 away from the array substrate 10, the curved portion 40b is disposed between the first portion 40a and the second portion 40c, and a part of the curved portion 40b is arranged in the second sub-area 10a2 of the recess 10a in a curved manner.
The driving chip 90 is disposed on a side of the second portion 40c away from the color filter substrate 20. The printed circuit board 100 is disposed on a side of the second portion 40c away from the color filter substrate 20. In the embodiment of the present application, the flexible circuit board 40 and the driving Chip 90 may be regarded as being packaged by a COF (Chip On Film) technology, that is, the driving Chip 90 is fixed On the flexible circuit board 40, the driving Chip 90 is loaded with an original electrical signal, and further, the driving Chip 90 processes a driving signal formed by the original signal and passes through the flexible circuit board 40, so as to control a display image of the display panel. In addition, in the embodiment of the application, the driving chip 90 is bound to one side of the color film substrate 20 away from the array substrate 10 through the flexible circuit board 40, so that four sides of the color film substrate are visually displayed without a frame.
The first polarizer 60 is located on a side of the array substrate 10 away from the color filter substrate 20. The first polarizer 60 may be used to analyze polarized light after being electrically modulated by liquid crystal to generate contrast, thereby generating a display picture. The first polarizer 60 extends to cover the array substrate 10, the color filter substrate 20 and the flexible circuit board 40. The effect of comprehensive screen without borders on four sides can be achieved.
The shielding layer 70 is disposed between the array substrate 10 and the first polarizer 60, the shielding layer 70 is located in the non-display area NA, and the shielding layer 70 is used for shielding metal lines on the array substrate 10.
The sealant 80 is disposed on the first side surface 1c of the array substrate 10 and covers a side surface of the first polarizer 60 on the same side as the first side surface 1 c. The sealant 80 in the present application covers the first side surface 1c and the side surface of the first polarizer 60 on the same side as the first side surface 1c, thereby preventing light leakage from that side surface of the display panel and further reducing the display quality.
In some embodiments, the side of the sealant 80 away from the first side 1c is flush with the curved portion 40 b. In the embodiment of the present application, since the side of the sealant 80 away from the first side surface 1c is flush with the curved portion 40b, when an external protective cover is disposed to protect the flexible circuit board 40, no gap is generated between the protective cover and the sealant 80, so as to display the ornamental performance of the panel. Therefore, the sealant 80 is disposed flush with the curved portion 40b on the side away from the first side surface 1c, and the display quality of the display panel is further improved.
The second polarizer 110 is disposed on a side of the color filter substrate 20 away from the array substrate 10. The second polarizer 110 is used for converting the light beam generated by the backlight module into polarized light.
Accordingly, please refer to fig. 6, wherein fig. 6 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. The embodiment of the present application further provides a display device, the display device includes a display panel and a backlight module 210, and the backlight module 210 is located on one side of the color film substrate 20 far away from the array substrate 10. The display panel is characterized in that the display line board is the display panel, the display panel comprises a display area AA and a non-display area NA, the non-display area NA is located on one side of the display area AA, the non-display area NA comprises a binding area BA and a peripheral area PA, and the binding area BA is connected with the display area AA and the peripheral area PA. The display panel 1000 includes an array substrate 10, a color filter substrate 20, a liquid crystal layer 50, an adhesive member 30, a flexible circuit board 40, a driving chip 90, a printed circuit board 100, a first polarizer 60, a second polarizer 110, a shielding layer 70, and a sealant 80.
In some embodiments, the display device 2000 further includes a protective cover 220, the protective cover 220 being disposed outside the second portion 40c and the bent portion 40b of the flexible circuit board 40. In the present embodiment, the side of the sealant 80 away from the first side 1c is flush with the curved portion 40 b. Since the side of the sealant 80 away from the first side surface 1c is flush with the bent portion 40b, no gap is generated between the protective cover and the sealant 80 when the protective cover 220 is disposed to protect the flexible circuit board 40. Therefore, the present embodiment provides the sealant 80 in a flush manner with the curved portion 40b on the side away from the first side surface 1c, which further improves the display quality of the display device 2000.
It should be noted that the display device 2000 in the embodiment of the present application may be a mobile phone, and may also be any electronic product with a display function, including but not limited to the following categories: the mobile terminal comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the application is not particularly limited to this.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.
Claims (10)
1. A display panel, comprising a display area and a non-display area, the non-display area being located on at least one side of the display area, the non-display area comprising a binding area and a peripheral area, the binding area connecting the display area and the peripheral area, the display panel comprising:
the array substrate is positioned in the display area and the non-display area, the array substrate is provided with a first surface and a second surface which are opposite, the array substrate is provided with a concave part, the concave part is positioned in the peripheral area, and the opening of the concave part is positioned on the second surface;
the color film substrate is arranged on the second surface;
the flexible circuit board is partially arranged on the second surface, is in binding connection with the array substrate located in the binding area, bends towards one side of the color film substrate far away from the array substrate, and is partially arranged in the concave part in a bending mode.
2. The display panel according to claim 1, further comprising an adhesive member provided in the recess, the flexible circuit board and the adhesive member being connected.
3. The display panel according to claim 2, wherein the recess portion includes a first sub-area and a second sub-area, the first sub-area being located on a side close to the bonding area, the second sub-area being located on a side far from the bonding area, the adhesive member being located in the first sub-area, and a portion of the flexible circuit board being disposed in the second sub-area.
4. The display panel according to claim 3, wherein the width of the second sub-region is between 0.5 mm and 1.5 mm.
5. The display panel according to claim 1, wherein the array substrate further comprises a substrate, and a thin film transistor and a plurality of insulating layers provided over the substrate, wherein the plurality of insulating layers cover the thin film transistor, and wherein the recess portion penetrates at least one of the insulating layers.
6. The display panel according to claim 5, wherein the insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer which are sequentially provided over the substrate, wherein the recess portion penetrates the third insulating layer, and wherein a bottom of the recess portion is located on the second insulating layer.
7. The display panel according to claim 5, wherein the plurality of insulating layers comprises a first insulating layer, a second insulating layer, and a third insulating layer which are sequentially provided over the substrate, wherein the recess portion penetrates through the third insulating layer, the second insulating layer, and the first insulating layer, and wherein a bottom of the recess portion is located over the substrate.
8. The display panel according to claim 2, wherein the flexible circuit board includes a first portion, a bent portion, and a second portion, the first portion and the second portion are connected by the bent portion, the first portion is connected to the array substrate and the adhesive member, the second portion is disposed on a side of the color filter substrate away from the array substrate, the bent portion is disposed between the first portion and the second portion, and a portion of the bent portion is bent and disposed in the recess.
9. The display panel according to claim 8, further comprising a shielding layer, a first polarizer, and a sealant, wherein the first polarizer is located on a side of the array substrate away from the color filter substrate, the shielding layer is disposed between the array substrate and the first polarizer, the shielding layer is located in the non-display area, and the sealant is disposed on a first side of the array substrate and covers a side of the first polarizer on the same side as the first side.
10. A display device, comprising the display panel according to any one of claims 1 to 9, and further comprising a backlight module, wherein the backlight module is located on a side of the color filter substrate away from the array substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211193024.4A CN115598891A (en) | 2022-09-28 | 2022-09-28 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211193024.4A CN115598891A (en) | 2022-09-28 | 2022-09-28 | Display panel and display device |
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| CN115598891A true CN115598891A (en) | 2023-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211193024.4A Pending CN115598891A (en) | 2022-09-28 | 2022-09-28 | Display panel and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024193078A1 (en) * | 2023-03-22 | 2024-09-26 | 武汉华星光电技术有限公司 | Display module and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024193078A1 (en) * | 2023-03-22 | 2024-09-26 | 武汉华星光电技术有限公司 | Display module and display device |
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