US20130000873A1 - Heat dissipation system - Google Patents

Heat dissipation system Download PDF

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Publication number
US20130000873A1
US20130000873A1 US13/216,269 US201113216269A US2013000873A1 US 20130000873 A1 US20130000873 A1 US 20130000873A1 US 201113216269 A US201113216269 A US 201113216269A US 2013000873 A1 US2013000873 A1 US 2013000873A1
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United States
Prior art keywords
heat dissipation
receiving frame
hole
liquid
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/216,269
Inventor
Xian-Xiu Tang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TANG, XIAN-XIU
Publication of US20130000873A1 publication Critical patent/US20130000873A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to heat dissipation systems, and particularly, to a heat dissipation system having higher heat dissipation efficiency.
  • Electronic components such as central processing units (CPUs), video card, or audio card can general a large amount of heat when operating at high speeds or a high capacity in a computer case.
  • CPUs central processing units
  • video card video card
  • audio card can general a large amount of heat when operating at high speeds or a high capacity in a computer case.
  • heat dissipation systems such as heat sinks, or heat pipes have been developed.
  • the heat sinks or heat pipes are positioned in the computer case. Since the volumes of the heat sink or the heat pipe are limited, and heat dissipation efficiency is lower.
  • FIG. 1 is an isometric view of a computer case having a heat dissipation system according to an exemplary embodiment.
  • FIG. 2 is an exploded isometric view of an add-on heat dissipation module of the heat dissipation system of FIG. 1 .
  • FIG. 3 is an assembled isometric view of the add-on heat dissipation module of FIG. 2 .
  • the heat dissipation system 100 includes a built-in heat dissipation module 10 , a liquid pump 20 , and an add-on heat dissipation module 30 .
  • the built-in heat dissipation module 10 is configured for being positioned in a computer case 200 .
  • the computer case 200 includes a shell 210 , a motherboard 220 , and a heat emitter 230 .
  • the motherboard 220 is received in the shell 210 .
  • the heat emitter 230 is an electronic element (e.g. CPU, video card, network card, etc), which generates heat in work process.
  • the heat emitter 230 is fixed on the motherboard 220 .
  • the built-in heat dissipation module 10 is positioned on the heat emitter 230 for dissipating heat from the heat emitter 230 .
  • the built-in heat dissipation module 10 includes a case 10 a , a cooling fluid 11 received in the case 10 a , a first liquid inlet 12 defined in the case 10 a for the cooling fluid 11 entering into the case 10 a , and a first liquid outlet 13 defined in the case 10 a for the cooling fluid 11 exiting the case 10 a.
  • the liquid pump 20 is connected to the built-in heat dissipation module 10 for circulating the cooling fluid 11 to dissipate heat.
  • the liquid pump 20 includes a second liquid inlet 21 , and a second liquid outlet 22 .
  • the second liquid outlet 22 communicates with the first liquid inlet 12 .
  • the heat dissipation system 100 dissipates heat from two or more heat emitter 230 , there may be a plurality of built-in heat dissipation modules 10 connected in series, such that the cooling fluid 11 can be circulated in the built-in heat dissipation modules 10 .
  • the add-on heat dissipation module 30 is configured for being fixed on the outer surface of the shell 210 .
  • the add-on heat dissipation module 30 is fixed on the top plate 211 of the shell 210 by screw 7 .
  • the add-on heat dissipation module 30 includes a receiving frame 31 , a heat dissipation device 32 , and a fan 33 .
  • the receiving frame 31 includes a bottom plate 31 a , a sidewall 31 b protruding from and surrounding the bottom plate 31 a , and a runner 31 c .
  • the receiving frame 31 a is a substantially square container having an opening.
  • the runner 31 a is formed by a plurality of parallel and spaced strips 311 protruding from the bottom plate 31 a .
  • a first through hole 31 d and a second through hole 31 e are defined in the bottom plate 31 a .
  • One end of the runner 31 c communicates with the first liquid outlet 13 via the first through hole 31 d
  • the other end of the runner 31 c communicates with the second liquid inlet 21 via the second through hole 31 e .
  • the first through hole 31 d communicates with the first liquid outlet 13 by one hollow tube 8
  • the second through hole 31 e communicates with the second liquid inlet 21 by another one hollow tube 8 .
  • the hollow tubes 8 are soft tubes.
  • the top plate 211 defines two third through holes 211 a spatially corresponding to the first and second through holes 31 d and 31 e .
  • the two third through holes 211 a align with the corresponding through holes 31 d and 31 e , respectively, and connect to the hollow tubes 8 by two connector heads 9 .
  • Each of the connector heads 9 includes a hollow screw 9 a and a nut 9 b communicating with and connected to a respective one of the hollow tubes 8 .
  • One end of one of the hollow screws 9 a is connected to the first through hole 31 d , and the other end of the one hollow screw 9 a passes through the top plate 211 and is connected to the nut 9 b .
  • One end of the other hollow screw 9 a is connected to the second through hole 31 e , and the other end of the other hollow screw 9 a passes through the top plate 211 and is connected to the nut 9 b.
  • the receiving frame 31 replaces a traditionally water tank to receive the cooling fluid 11 , and the receiving frame 31 is positioned outside of the computer case 200 . Accordingly, the volume of the receiving frame 31 can be designed by the user based on need, more cooling fluid 11 can be received in the receiving frame, and the heat dissipation efficiency can be improved.
  • the heat dissipation device 32 includes a connecting surface 32 a , a heat dissipation surface 32 b opposite to the connecting surface 32 a , and a plurality of heat dissipation fins 32 c on the connecting surface 32 a , and a sealing screw 32 d .
  • the connecting surface 32 a is thermally coupled to the receiving frame 31 .
  • the connecting surface 32 a is welded on the top surface of the sidewall 31 b , and covers the receiving frame 31 .
  • the heat dissipation fins 32 c are thermally coupled to the heat dissipation surface 32 b .
  • a liquid filling hole 32 e is defined in the heat dissipation device 32 , and passes through the connecting surface 32 a and the heat dissipation surface 32 b .
  • the liquid filling hole 32 e communicates with the receiving frame 31 .
  • the cooling fluid 11 may decrease gradually, and the cooling fluid 11 can be added into the receiving frame 31 by the liquid filling hole 32 e .
  • the sealing screw 32 d engages with the liquid filling hole 32 e , such that the liquid filling hole 32 e can be sealed when there is no need to add the cooling fluid 11 into the receiving frame 31 .
  • the fan 33 is fixed on the heat dissipation fins 32 c for further improving heat dissipation efficiency of the heat dissipation system 100 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An exemplary heat dissipation system includes a built-in heat dissipation module for being positioned in a computer case, a liquid pump communicating with the built-in heat dissipation module, and an add-on heat dissipation module for being positioned outside of the computer case. The built-in heat dissipation module includes cooling fluid. The add-on heat dissipation module includes a receiving frame and a heat dissipation device fixed to the receiving frame. The receiving frame engages with the heat dissipation device to receive the cooling fluid. The receiving frame communicates with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to heat dissipation systems, and particularly, to a heat dissipation system having higher heat dissipation efficiency.
  • 2. Description of Related Art
  • Electronic components, such as central processing units (CPUs), video card, or audio card can general a large amount of heat when operating at high speeds or a high capacity in a computer case. To cool the electronic components, heat dissipation systems such as heat sinks, or heat pipes have been developed. Conventionally, the heat sinks or heat pipes are positioned in the computer case. Since the volumes of the heat sink or the heat pipe are limited, and heat dissipation efficiency is lower.
  • Therefore, what is needed is a new heat dissipation system that can overcome the described limitations.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of a computer case having a heat dissipation system according to an exemplary embodiment.
  • FIG. 2 is an exploded isometric view of an add-on heat dissipation module of the heat dissipation system of FIG. 1.
  • FIG. 3 is an assembled isometric view of the add-on heat dissipation module of FIG. 2.
    •  DETAILED DESCRIPTION
  • Embodiments will now be described in detail with reference to the drawings.
  • Referring to FIGS. 1, 2 and 3, a heat dissipation system 100, in accordance with an exemplary embodiment, is shown. The heat dissipation system 100 includes a built-in heat dissipation module 10, a liquid pump 20, and an add-on heat dissipation module 30.
  • The built-in heat dissipation module 10 is configured for being positioned in a computer case 200. The computer case 200 includes a shell 210, a motherboard 220, and a heat emitter 230. The motherboard 220 is received in the shell 210. The heat emitter 230 is an electronic element (e.g. CPU, video card, network card, etc), which generates heat in work process. The heat emitter 230 is fixed on the motherboard 220.
  • The built-in heat dissipation module 10 is positioned on the heat emitter 230 for dissipating heat from the heat emitter 230. The built-in heat dissipation module 10 includes a case 10 a, a cooling fluid 11 received in the case 10 a, a first liquid inlet 12 defined in the case 10 a for the cooling fluid 11 entering into the case 10 a, and a first liquid outlet 13 defined in the case 10 a for the cooling fluid 11 exiting the case 10 a.
  • The liquid pump 20 is connected to the built-in heat dissipation module 10 for circulating the cooling fluid 11 to dissipate heat.
  • The liquid pump 20 includes a second liquid inlet 21, and a second liquid outlet 22. The second liquid outlet 22 communicates with the first liquid inlet 12.
  • In other embodiments, if the heat dissipation system 100 dissipates heat from two or more heat emitter 230, there may be a plurality of built-in heat dissipation modules 10 connected in series, such that the cooling fluid 11 can be circulated in the built-in heat dissipation modules 10.
  • The add-on heat dissipation module 30 is configured for being fixed on the outer surface of the shell 210. In the present embodiment, the add-on heat dissipation module 30 is fixed on the top plate 211 of the shell 210 by screw 7.
  • The add-on heat dissipation module 30 includes a receiving frame 31, a heat dissipation device 32, and a fan 33.
  • The receiving frame 31 includes a bottom plate 31 a, a sidewall 31 b protruding from and surrounding the bottom plate 31 a, and a runner 31 c. In the present embodiment, the receiving frame 31 a is a substantially square container having an opening.
  • The runner 31 a is formed by a plurality of parallel and spaced strips 311 protruding from the bottom plate 31 a. A first through hole 31 d and a second through hole 31 e are defined in the bottom plate 31 a. One end of the runner 31 c communicates with the first liquid outlet 13 via the first through hole 31 d, and the other end of the runner 31 c communicates with the second liquid inlet 21 via the second through hole 31 e. In the present embodiment, the first through hole 31 d communicates with the first liquid outlet 13 by one hollow tube 8, and the second through hole 31 e communicates with the second liquid inlet 21 by another one hollow tube 8. The hollow tubes 8 are soft tubes.
  • The top plate 211 defines two third through holes 211 a spatially corresponding to the first and second through holes 31 d and 31 e. The two third through holes 211 a align with the corresponding through holes 31 d and 31 e, respectively, and connect to the hollow tubes 8 by two connector heads 9.
  • Each of the connector heads 9 includes a hollow screw 9 a and a nut 9 b communicating with and connected to a respective one of the hollow tubes 8. One end of one of the hollow screws 9 a is connected to the first through hole 31 d, and the other end of the one hollow screw 9 a passes through the top plate 211 and is connected to the nut 9 b. One end of the other hollow screw 9 a is connected to the second through hole 31 e, and the other end of the other hollow screw 9 a passes through the top plate 211 and is connected to the nut 9 b.
  • The receiving frame 31 replaces a traditionally water tank to receive the cooling fluid 11, and the receiving frame 31 is positioned outside of the computer case 200. Accordingly, the volume of the receiving frame 31 can be designed by the user based on need, more cooling fluid 11 can be received in the receiving frame, and the heat dissipation efficiency can be improved.
  • The heat dissipation device 32 includes a connecting surface 32 a, a heat dissipation surface 32 b opposite to the connecting surface 32 a, and a plurality of heat dissipation fins 32 c on the connecting surface 32 a, and a sealing screw 32 d. The connecting surface 32 a is thermally coupled to the receiving frame 31. In detail, the connecting surface 32 a is welded on the top surface of the sidewall 31 b, and covers the receiving frame 31. The heat dissipation fins 32 c are thermally coupled to the heat dissipation surface 32 b. A liquid filling hole 32 e is defined in the heat dissipation device 32, and passes through the connecting surface 32 a and the heat dissipation surface 32 b. The liquid filling hole 32 e communicates with the receiving frame 31. After long time usage of the heat dissipation system 100, the cooling fluid 11 may decrease gradually, and the cooling fluid 11 can be added into the receiving frame 31 by the liquid filling hole 32 e. The sealing screw 32 d engages with the liquid filling hole 32 e, such that the liquid filling hole 32 e can be sealed when there is no need to add the cooling fluid 11 into the receiving frame 31. The fan 33 is fixed on the heat dissipation fins 32 c for further improving heat dissipation efficiency of the heat dissipation system 100.
  • While certain embodiments have been described and exemplified above, various other embodiments will be apparent from the foregoing disclosure to those skilled in the art. The disclosure is not limited to the particular embodiments described and exemplified but is capable of considerable variation and modification without departure from the scope and spirit of the appended claims.

Claims (10)

1. A heat dissipation system comprising:
a built-in heat dissipation module for being positioned in a computer case, the built-in heat dissipation module comprising cooling fluid;
a liquid pump communicating with the built-in heat dissipation module, and
an add-on heat dissipation module for being positioned outside of the computer case, the add-on heat dissipation module comprising a receiving frame and a heat dissipation device fixed to the receiving frame, the receiving frame and the heat dissipation device cooperatively receiving the cooling fluid, the receiving frame communicating with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.
2. The heat dissipation system of claim 1, wherein the heat dissipation device comprises a plurality of heat dissipation fins, a heat dissipation surface thermally coupled to the heat dissipation fins, a connecting surface opposite to the heat dissipation surface, and the connecting surface is thermally coupled to the receiving frame, and covers the receiving frame.
3. The heat dissipation system of claim 2, wherein the heat dissipation device further comprises a liquid filling hole passing through the heat dissipation surface and the connecting surface, and a sealing screw, the liquid filling hole communicates with the receiving frame, and the sealing screw engages with the liquid filling hole to seal the liquid filling hole.
4. The heat dissipation system of claim 2, wherein the add-on dissipation module further comprises a fan fixed on the heat dissipation fins.
5. The heat dissipation system of claim 1, wherein the built-in heat dissipation module comprises a first liquid inlet and a first liquid outlet, the liquid pump comprises a second liquid inlet and a second liquid outlet, the second liquid outlet communicates with the first liquid outlet, and the receiving frame communicates with the first liquid outlet and the second liquid inlet.
6. The heat dissipation system of claim 5, wherein the receiving frame comprises a runner, one end of the runner communicates with the first liquid outlet, and the other end of the runner communicates with the second liquid inlet.
7. The heat dissipation system of claim 6, wherein the receiving frame comprises a first through hole and a second through hole, one end of the runner communicates with the first liquid outlet via the first through hole, and the other end of the runner communicates with the second liquid inlet via the second through hole.
8. The heat dissipation system of claim 6, further comprising two hollow tubes and two connector heads, the built-in heat dissipation module and the liquid pump being communicated between the first through hole and the second through hole by the two hollow tubes, the first through hole and the second through hole communicating with the respective hollow tubes by the respective connector heads, each of the connector heads comprising a hollow screw and a nut, one end of each hollow screw being connected to a respective one of the first and second through holes, and the other end of each hollow screw being connected to one of the nuts.
9. The heat dissipation system of claim 6, wherein the receiving frame comprises a bottom plate and a sidewall protruding from and surrounding the bottom plate, the first through hole and the second through hole are defined in the bottom plate.
10. The heat dissipation system of claim 9, wherein the runner comprises a plurality of parallel and spaced strips protruding from the bottom plate.
US13/216,269 2011-06-29 2011-08-24 Heat dissipation system Abandoned US20130000873A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110179082.7 2011-06-29
CN2011101790827A CN102856275A (en) 2011-06-29 2011-06-29 Cooling system

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CN106888565A (en) * 2015-12-15 2017-06-23 技嘉科技股份有限公司 Radiating module
CN106912179A (en) * 2015-12-23 2017-06-30 技嘉科技股份有限公司 Radiating module
CN107908265A (en) * 2017-11-17 2018-04-13 常州信息职业技术学院 A kind of novel computer network equipment
CN111240438A (en) * 2020-04-27 2020-06-05 深圳市智微智能软件开发有限公司 Wide-screen computer case capable of quickly adjusting temperature in case and use method thereof
WO2020244543A1 (en) * 2019-06-04 2020-12-10 姜海波 Modularized case

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CN105353853A (en) * 2015-12-03 2016-02-24 浪潮电子信息产业股份有限公司 Liquid-cooling radiator liquid guide pipe connecting method
CN107436657B (en) * 2016-05-26 2019-11-01 刘小明 PC terminal and its radiator
CN108601309A (en) * 2018-06-06 2018-09-28 奇鋐科技股份有限公司 Heat dissipation circulation structure
CN110147152B (en) * 2019-05-29 2022-02-15 上海航天科工电器研究院有限公司 Intelligent adjusting case of integrated liquid cooling heat dissipation system
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