US20120258652A1 - Rotary buffing pad - Google Patents
Rotary buffing pad Download PDFInfo
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- US20120258652A1 US20120258652A1 US13/497,621 US201013497621A US2012258652A1 US 20120258652 A1 US20120258652 A1 US 20120258652A1 US 201013497621 A US201013497621 A US 201013497621A US 2012258652 A1 US2012258652 A1 US 2012258652A1
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- Prior art keywords
- apertures
- buffing pad
- front surface
- inner region
- pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Definitions
- Buffing pads are provided for polishing the surface of a workpiece. More particularly, patterned rotary buffing pads are provided for polishing the surface of a workpiece.
- the visual appearance of painted surfaces is an important aesthetic property.
- Original equipment manufacturer and aftermarket industries have devoted many resources to the development and application of paint systems that provide aesthetic properties such as, for example, low haze and good distinctness of image.
- paint systems that provide aesthetic properties such as, for example, low haze and good distinctness of image.
- the base coat provides the desired color
- the clear coat which is applied over the base coat, provides a transparent scratch and chip-resistant protective coat.
- Such paint systems have the tendency to magnify defects (for example, scratches, haze, and dust nibs) in either the base coat or the clear coat.
- One common method for imparting, or restoring, a high quality appearance to the paint system uses a multi-step process.
- the defects are abraded using a coated abrasive product with a fine abrasive particle size, for example, sandpaper, or a structured abrasive article.
- This step provides rapid removal of the defects, but typically leaves scuff, or “swirl” marks, and sometimes scratches, that need to be removed.
- the swirl marks are removed by buffing using a buffing composition.
- the buffing composition is typically an aqueous or petroleum based medium containing abrasive particles of smaller size than the abrasive particles used in the coated abrasive article.
- the buffing step may result in a surface with a hazy appearance.
- the hazy appearance is removed by a finishing step in which the hazy portion of the paint system is buffed with a finishing composition.
- the finishing composition is typically an aqueous or petroleum based medium containing abrasive particles of smaller size than the abrasive particles used in the buffing composition.
- residue from the buffing and/or finishing compositions is removed, for example, with a soft cloth, thereby producing an aesthetically appealing finish substantially free of surface residue.
- polishing pads used in the above polishing steps are generally compressible to allow even pressure to be applied across the buffing surfaces. Such pads are often made from either wool or a polymeric foam. While the polishing steps may be a manual process, it can be facilitated by attaching the buffing pad to an electric or air-driven pneumatic power tool. As used herein, “polishing steps” include any of the steps used in restoring or improving a surface, including compounding, buffing, and finishing steps.
- the performance of a buffing pad may be appraised on a number of factors.
- the buffing pad provides a certain level of cut performance (or “cut”), defined as the rate at which the moving pad removes surface defects. Cut performance should be adequately high to allow polishing to be completed within a reasonable amount of time.
- the buffing pad provides a certain level of finish. The finish provided by a buffing operation is defined by the smoothness of the resulting surface and can be quantified by measuring “haze”. Haze decreases with increasing smoothness, and thus should be as low as possible.
- the rotary buffing pad can be appraised on user experience.
- a rotary buffing pad engages the surface to be polished in a controlled manner to reduce the incidence of jerking or other unpredictable motions (known as “chatter”) of the power tool during the polishing process. This assists the operator in maintaining a high degree of control over the orientation of the pad and helps avoid inadvertent gouging of the workpiece.
- rotary buffing pads which overcome the dilemma faced by one desiring to achieve both superior cut performance and a fine finish.
- This combination of advantages is provided by using a flat-faced buffing pad that includes a plurality of apertures of variable size.
- the apertures are generally larger in the areas toward the center of the pad, while being generally smaller in the areas toward the periphery of the pad.
- This synergistic arrangement of large and small apertures provides both superior cut performance and a superior finish.
- the center apertures advantageously capture excess abrasive composition thereby reducing the amount of liquid sling during the buffing process and therefore reducing both waste and clean up time after the operation is completed.
- the amount of vibration, or “chatter”, felt by the operator during the buffing process is maintained at low levels. Reduced vibration in turn leads to reduced fatigue and enhanced operator comfort.
- locating the larger apertures toward the center of the pad improves operator control by reducing the drag resistance due to the center of the pad and also preventing the pad from wobbling during the buffing process. Since wobbling can cause the buffing pad to jump or jerk across the surface, this configuration improves operator control and reduces the risk of damaging the surface being polished.
- a rotary buffing pad comprising a substrate having a front surface, back surface, and a rotation axis perpendicular to the front and back surfaces, the substrate further comprising an inner region adjacent to and surrounding the rotation axis, an outer region surrounding the inner region, a plurality of first apertures having a first average size located within the inner region and extending from the front surface toward the back surface; and a plurality of second apertures having a second average size located within the outer region and extending from the front surface toward the back surface, wherein the first average size is larger than the second average size.
- a rotary buffing pad comprising a substrate having a front surface, back surface, and a rotation axis perpendicular to the front and back surfaces, the substrate further comprising an inner region adjacent to and surrounding the rotation axis, an outer region surrounding the inner region, a plurality of first apertures having a first aperture density located within the inner region and extending from the front surface toward the back surface, and a plurality of second apertures having a second aperture density located within the outer region and extending from the front surface toward the back surface, wherein the first aperture density is larger than the second aperture density.
- a rotary buffing pad comprising a substrate having a front surface, back surface, and a rotation axis perpendicular to the front and back surfaces, the substrate further comprising an inner region adjacent to and surrounding the rotation axis, an outer region surrounding the inner region, a plurality of first apertures having a first average size located within the inner region and extending from the front surface toward the back surface, a plurality of second apertures having a second average size located within the outer region and extending from the front surface toward the back surface, wherein the first average size is larger than the second average size, and wherein the outer region further comprises at least one annular region and wherein the plurality of second apertures further comprises a second subset of second apertures located in the at least one annular region, the second subset extending from the front surface toward the back surface and being disposed along at least one circular ring, each circular ring being coplanar with the front surface and generally symmetrical about the rotation axis.
- a rotary buffing pad comprising a substrate having a front surface, back surface, and a rotation axis perpendicular to the front and back surfaces, the substrate further comprising an inner region adjacent to and surrounding the rotation axis, an outer region surrounding the inner region, and a plurality of apertures extending from the front surface toward the back surface, wherein the apertures have a distribution of sizes and the apertures having relatively large size are predominantly located in the inner region relative to the outer region.
- FIG. 1 is a front view of a buffing pad according to one exemplary embodiment of the invention
- FIG. 2 is an elevational cross-sectional view of the buffing pad along the line 2 - 2 in FIG. 1 ;
- FIG. 3 is a perspective view of the buffing pad in FIGS. 1-2 , looking at the back surface;
- FIG. 4 is a magnified fragmentary front view of the buffing pad shown in the rectangular inset 4 of FIG. 1 ;
- FIG. 5 is a front view of a buffing pad according to an alternative embodiment of the invention.
- buffing pads useful for removing defects from a surface and polishing the surface to a fine finish. These buffing pads are especially useful in the automotive and marine applications, where there is a need to polish a painted exterior surface to produce a glossy, aesthetic appearance.
- the buffing pads are not limited to these applications. For example, they may be useful on any other painted surfaces or even non-painted surfaces, and are not limited to polishing operations on any particular type of article.
- workpiece surfaces may include marbled, varnished, composite, or gel coated surfaces.
- buffing pads are not limited to a specific method of use. Any of a wide variety of abrasive polishes and compounds, both in liquid and solid form, may be advantageously used with these buffing pads to achieve a desirable surface finish.
- Various power tools may be used to generate the relative motion between the buffing pad and the surface to be polished.
- the application of these pads is not restricted to any particular stage of a workflow used to polish an article. For example, they may be used as a first step, intermediate step, or last step of a multi-step polishing method. Alternatively, these buffing pads may be used in a single-step polishing method.
- FIGS. 1-4 An exemplary buffing pad according to one embodiment is illustrated in FIGS. 1-4 and designated by the numeral 100 .
- the buffing pad 100 has a substrate 102 with a front surface 104 .
- the front surface 104 is generally flat and has a circular shape in plan view. While not shown here, the front surface 104 may also assume non-circular shapes.
- the substrate 102 further includes a side surface 106 and a back surface 108 .
- a backing layer 110 denoted by the dashed lines, extends across nearly all of the back surface 108 .
- the buffing pad 100 has an overall diameter of about 8.0 inches (20.3 centimeters (cm)) and a thickness of about 1.5 inches (3.8 cm).
- the “front” is defined as the side that contacts the workpiece and the “back” is the opposite surface.
- the buffing pad 100 When used in a buffing operation, the buffing pad 100 rotates about a rotation axis 112 , shown in FIGS. 1 and 2 .
- the rotation axis 112 is perpendicular to the front surface 104 and passes through the center of the buffing pad 100 .
- the substrate 102 is symmetrically disposed about the rotation axis 112 to help minimize wobbling of the buffing pad 100 during operation.
- the substrate 102 is made from a compressible material, such as a polymeric foam.
- exemplary substrates having this property include open-celled polyurethane foams. Open-celled foams are advantageous in that they can be made soft and compliant and do not significantly expand in the side directions when compressed from the top and bottom directions. Open-celled foams may also allow limited permeability to the buffing polish or compound material. Such permeability may advantageously improve overall retention of the polish or compound material on the pad 100 during a polishing operation.
- Other commercial foams are also possible, such as those disclosed in issued U.S. Pat. No. 4,962,562 (Englund, et al.).
- the stiffness of the substrate 102 as measured by the pressure required to produce a compression to 25% of original volume (or 25% Compression Load Deflection), ranges from 0.3 to 1 pound per square inch (2.1 to 6.9 kiloPascals (kPa)).
- the optional backing layer 110 preferably has a flexural modulus greater than that of the substrate 102 and augments the stiffness along the back side of the buffing pad 100 . As increasing the stiffness of the backing layer 110 generally increases the rate of cut, the flexural modulus can be tailored to provide the rate of cut desired for the application.
- the backing layer 110 can be coupled to the back surface 108 of the substrate 102 by physical means such as thermal lamination. Alternatively, the backing layer 110 may be adhesively bonded to the substrate 102 .
- the backing layer 110 may include a fibrous material, such as a scrim or non-woven material.
- the fibrous material can facilitate coupling the buffing pad 100 to a power tool.
- the backing layer 100 includes one-half of a hook and loop attachment system, the other half being disposed on a plate affixed to the power tool. Such an attachment system secures the buffing pad 100 to the power tool while allowing convenient attachment and removal of pads between operations.
- the substrate 102 includes two mutually exclusive regions, an inner region 114 and an outer region 116 .
- the inner region 114 defined as the portion of the substrate 102 located within the hexagonal dashed loop A′, is both adjacent to and surrounding the rotation axis 112 .
- the inner region 114 is symmetrically disposed about the axis 112 . While the inner region 114 depicted in FIG. 1 happens to have a hexagonal shape, other shapes (for example, a square, circle, or octagon) are also possible.
- the inner region 114 has a diameter ranging from 20 to 40 percent of the overall diameter of the substrate 102 .
- the outer region 116 is defined as the portion of the substrate 102 located outside of the dashed loop A′. The outer region 116 surrounds the inner region 114 and is both contiguous and concentric with the inner region 114 .
- both the inner and outer regions 114 , 116 are solid three dimensional shapes. Therefore, these regions 114 , 116 are defined not only by the visible areas of the front surface 104 shown in FIG. 1 but also those portions of the substrate 102 located directly thereunder (i.e. beneath the plane of the page in perpendicular view). That is, the regions 114 and 116 include the front surface 104 of the substrate 102 and also have the depth or thickness of the substrate 102 .
- a plurality of first apertures 120 and a plurality of second apertures 122 extend from the front surface 104 toward the back surface 108 at different locations along the inner and outer regions 114 , 116 of substrate 102 .
- the plurality of first apertures 120 include all of the apertures present within the inner region 114 .
- the first apertures 120 have a generally uniform size and shape and are distributed evenly across the inner region 114 in a close packed (e.g. square, hexagonal) arrangement such that there is a constant spacing between neighboring apertures 120 .
- the apertures 120 may be uniformly spread across the front surface 104 but randomized with irregular spacing between neighboring apertures 120 .
- the apertures 120 may have an overall distribution that is non-uniform across the inner region 114 .
- the plurality of second apertures 122 includes first and second subsets 123 , 124 of apertures.
- the first and second subsets 123 , 124 of apertures include all of the apertures present within the outer region 116 , and are distinguishable from each other based on having different arrangements across the front surface 104 and different size/shape characteristics.
- both subsets 123 , 124 of apertures are shown, the outer region 116 may include only the first subset 123 or only the second subset 124 .
- the first subset 123 of the second apertures 122 are arranged in a series of discrete and replicated polygonal groupings (or clusters) that are spaced apart from each another.
- each grouping is hexagonal in shape and consists of seven apertures each having the same size and shape and being equidistant from its closest neighboring aperture(s).
- the hexagonal groupings shown here are exemplary, however, and other polygonal or even circular groupings can also be used.
- the first subset 123 can be evenly distributed across the outer region 116 in a configuration similar to that of the first apertures 120 .
- the first subset 123 can include all of the apertures present within the outer region 114 .
- the second subset 124 of the second apertures 122 are disposed along three generally circular rings 140 located within the outer region 116 .
- FIG. 4 is a magnified view of the rectangular inset shown in FIG. 1 and shows the outermost ring 140 in more detail.
- the second subset 124 of apertures are located in an annular region 118 within in the outer region 116 .
- the annular region 118 is defined herein as the portion of the outer region 116 bounded between the circular dashed lines B′-B′ and B′′-B′′, shown in fragmentary view in FIG. 4 .
- the lines B′-B′ and B′′-B′′ are imaginary concentric circles located on the front surface 104 and symmetrically disposed about the rotation axis 112 .
- the annular region 118 is a three-dimensional shape that includes not only the portions of the front surface 104 located between the lines B′-B′ and B′′-B′′, but also portions of the substrate 102 located directly thereunder (i.e. beneath the plane of the page in perpendicular view).
- the second subset 124 can include all of the apertures present within the outer region 114 .
- the second subset 124 of apertures have a generally uniform aperture diameter.
- the diameters of the apertures 124 are not only generally uniform along each individual ring 140 but also generally uniform across all three of the rings 140 .
- neighboring apertures 124 display a certain spacing (as measured between the centers of the apertures) which is generally uniform across the rings 140 .
- the ratio between the certain diameter to the certain spacing is at least 0.2. More preferably, the ratio between the certain diameter to the certain spacing is at least 0.3. Most preferably, the ratio between the certain diameter to the certain spacing is at least 0.35. As shown in FIG.
- the three rings 140 are coplanar with the front surface 104 , concentric with each other and symmetrically disposed about the rotation axis 112 .
- the three rings 140 are evenly spaced apart from each other in radial directions, although this need not be the case.
- FIG. 2 shows the apertures 120 , 123 , 124 in cross-section, the cross-section being taken along cutting plane 3 - 3 in FIG. 1 .
- the apertures 120 , 122 within the substrate 102 have a distribution of sizes, where the plurality of first apertures 120 within the inner region 114 have an average size larger than that of the plurality of second apertures 122 within the outer region 116 .
- the apertures 120 , 122 of relatively large average size are predominantly located in the inner region 114 relative to the outer region 116 .
- the “size” of a given aperture can refer to any dimension of the aperture.
- the size may represent the diameter, perimeter, inner surface area, or depth of the aperture, volume occupied by the aperture, or combinations thereof.
- both the average diameter and average depth of the plurality of first apertures 120 is larger than those of the plurality of second apertures 122 .
- the average volume occupied by the plurality of first apertures 120 within the inner region 114 is larger than the average volume occupied by the plurality of second apertures 122 within the outer region 116 .
- the plurality of first apertures 120 have an average depth ranging from 8 to 12 mm, an average diameter ranging from 2 to 4 mm, and average occupied volume ranging from 25 to 150 cubic mm.
- the first subset 123 of apertures have an average depth ranging from 3.5 to 7.5 mm, an average diameter ranging from 3 to 5 mm, and average occupied volume ranging from 25 to 147 cubic mm.
- the second subset 124 of apertures have an average depth ranging from 9 to 13 mm, an average diameter ranging from 0.5 to 1.5 mm, and average occupied volume ranging from 1.6 to 25 cubic mm.
- the aperture density (in apertures per unit area) of the plurality of first apertures 120 over the front side of the inner region 114 is greater than that of the plurality of second apertures 122 over the front side of the outer region 116 .
- the plurality of first apertures 120 have a aperture density ranging from 1.5 to 5.0 per square centimeter, while the plurality of second apertures 122 have a aperture density ranging from 0.8 to 1.5 per square centimeter over their respective areas.
- the apertures 120 , 123 , 124 are generally cylindrical in cross-sectional shape.
- some of the apertures 120 , 123 , 124 are non-cylindrical.
- one or more of the apertures 120 , 123 , 124 may have rounded bottoms, tapered walls, or even reverse tapered walls where the lateral dimension increases with increasing depth.
- the apertures 120 , 123 , 124 have an elongated shape in plan view (i.e. as viewed normal to the front surface 104 ). Such elongated apertures may be oriented in either the radial direction, the tangential direction, or at some intermediate angle between the two.
- the buffing pad 100 uses apertures with a length-to-width aspect ratio, measured in plan view, that does not exceed 2:1.
- Use of discrete apertures with a relatively small aspect ratio is advantageous because such apertures are resistant to undue expansion during a polishing operation. Expansion of an aperture can allow compounding or polishing material to accumulate and become trapped in the pad. Agglomerations of abrasive material, if sufficiently large, can scratch the workpiece and degrade haze performance. It was additionally observed that expansion of an elongated aperture can even cause the sidewalls of the aperture to contact the workpiece, again causing undesirable scratches.
- the plurality of first apertures 120 and the first and second subsets 123 , 124 of apertures each has a uniform aperture size within its respective group.
- any of the apertures 120 , 123 , 124 could display a significant variability in size, either by choice or as a result of manufacturing tolerances. It is further contemplated that this variability may even result in overlap between the size ranges of the apertures 120 , 123 , the apertures 123 , 124 , or even the apertures 120 , 124 (as long as the average size of the apertures 120 is larger than the average size of the apertures 122 ).
- aperture density need not be uniform along the front sides of regions 114 , 116 .
- the plurality of first apertures 120 may have an overall aperture density greater than that of the plurality of second apertures 122 even when the former apertures have a local aperture density within a certain area of the inner region 114 less than that of the latter apertures within some other area of the outer region 116 .
- apertures 120 , 123 , 124 extend from the front surface 104 into the substrate 102 in a generally perpendicular fashion as shown in FIG. 2 , they may also extend into the substrate 102 at an acute angle to the perpendicular direction if so desired.
- the described configuration of the apertures 120 , 123 , 124 along the substrate 102 of the buffing pad 100 has been shown to provide a number of unexpected advantages in a polishing operation.
- the apertures 120 by virtue of their larger average size relative to the apertures 123 , 124 , significantly reduce drag resistance as the center of the rotating pad passes over the surface being polished.
- the generally larger apertures 120 also reduce the degree of buckling of the pad 100 that occurs as a result of uneven friction between the front surface 104 and the surface being polished. As a result, significantly less jerking and jumping of the rotary pad occurs during operation. The alleviation of jerking and jumping in turn improves operator control and reduces strain and fatigue experienced by the operator.
- the concentric circular rings 140 located along the outer region 116 .
- the rings 140 of apertures 124 help isolate localized deformation of the pad 100 that occur during a buffing operation within its particular section. This advantageously prevents propagation of deformation across the entire front surface 104 and again results in a more manageable and predictable buffing operation.
- apertures of larger sizes in areas near the center of the pad 100 also provides superior performance compared with conventional buffing pads.
- these pads 100 provide both increased cut rate and finer finish responses compared with conventional pads in which the average size of the apertures is generally uniform across the front surface. This is also an unexpected advantage, because superior cut and finer finish are often inversely related and it is generally difficult to realize both qualities simultaneously.
- a buffing pad which provides both a superior cut and finer finish allows a polishing job to be completed more efficiently and with less opportunity for operator error.
- the apertures 120 , 123 , 124 in the substrate 102 may be provided using any number of manufacturing methods known to the skilled artisan.
- the apertures 120 , 123 , 124 are formed by providing a suitable substrate 102 , then applying a post-processing method to form the apertures.
- post-processing methods include thermal embossing methods such as those described in U.S. Patent Publication No. 2007/0254567 (McLain) or water jet cutting as described in issued U.S. Pat. No. 5,527,215 (Rubino et al.) and U.S. Patent Publication No. 2007/0204420 (Hornby et al.).
- conventional methods such as engraving, mechanical boring, or cutting are also possible.
- a laser is used vaporize the foam to produce the apertures 120 , 123 , 124 .
- Laser cutting leaves behind a minimum amount of debris, and provides the flexibility for an operator to make nearly any configuration of apertures desired.
- the desired shape can be programmed into a computer aided drafting (CAD) system that interfaces with software that controls the position and intensity of the laser.
- CAD computer aided drafting
- the apertures 120 , 123 , 124 may be provided in situ without need for a post-processing step.
- the apertures 120 , 123 , 124 can be formed by casting and curing of the foam in a suitably shaped mold.
- FIG. 5 shows a buffing pad 200 according to another embodiment of the invention.
- the buffing pad 200 has a substrate 202 with a flat, circular front surface 204 extending across the substrate 202 .
- the buffing pad 200 further includes apertures 220 , 223 , 224 in a pattern having characteristics similar to the respective apertures 120 , 123 , 124 of the buffing pad 100 .
- the buffing pad 200 has a diameter of about 3.25 inches (8.26 cm) and a thickness of about 0.88 inches (2.2 cm).
- Other aspects of the buffing pad 200 are analogous to those already described for pad 100 and shall not be repeated.
- the foam had an average density of 31.4 kilograms per cubic meter (kg/m 3 ) and 40% Compression Load Deflection (CLD) of 8.47 kiloPascals (kPa).
- the front side of the foam buffing pad described in Comparative A was formed into a hexagonal channel array using an Eagle CO 2 Laser, Model No. 500, from LMI Technologies, Royal Oak, Mich., according to the conditions listed in Table 1.
- the pattern was similar to a commercially available foam buffing pad, type “Hex-Logic”, from Chemical Guys, Hawthorne, Calif.
- the buffing pad substrate used in Comparative A was provided and then a series of apertures were subsequently cut into the exposed face of the planar foam sheet to provide the aperture pattern shown in FIG. 5 .
- the pattern cut into the face of the foam includes the first apertures and both the first and second subsets of the second apertures (hexagonal groupings and rings). This was accomplished using the Eagle CO 2 Laser operating according to the conditions listed in Table 2.
- Second apertures First subset (hexagonal Second subset First apertures groupings) (rings) Dimensions Diameter (mm) 3 2 1 Depth (mm) 10 5.5 11 No. of Apertures 7 6 ⁇ 7 11 per radial inch (4.3 per radial cm) Laser Settings Power (%) 15 10 10 Beam Diameter (mm) 1.97 1.97 1.97 Mark Speed (cm/second) 508 635 635 No. of Beam Sweeps 3 1 2
- a loop backed planar, open cell, polyurethane foam compounding pad 8-inch diameter by 1-inch depth (20.3 by 2.54 cm), having an average density of 28.7 kilograms per cubic meter (kg/m 3 ) and 25% CLD of 6.52 kiloPascals (kPa), obtained from Pinta Foamtec, Inc., Minneapolis, Minn.
- the front side of the foam buffing pad Comparative D was formed into a convoluted pattern as described in Comparative B, wherein the peak-to-valley height was increased to 0.44 inches (0.17 cm).
- the front side of the foam buffing pad Comparative D was formed into a hexagonal channel array, as described in Comparative C.
- the complete aperture pattern as shown in FIGS. 1-2 was formed into the front side of foam buffing pad of Comparative D according to the method described in Example 1.
- the first apertures and both first and second subsets of the second apertures were laser cut into the face of the foam.
- a foam buffing pad was made as described in Example 2, except only the second subset of the second apertures (rings) were laser cut into the face of the foam.
- a foam buffing pad was made as described in Example 2, except only the first subset of second apertures were laser cut into the face of the foam.
- a foam buffing pad was made as described in Example 2, except only the first apertures and first subset of second apertures (hexagonal groupings) were laser cut into the face of the foam.
- Example 1 and Comparatives A-C were attached to a 31 ⁇ 4-inch (8.26 cm) diameter foam backup pad available from 3M Company, St. Paul, Minn., under the trade designation “3M Finesse-It Backup Pad, Part No. 84226”.
- the backup pad was then attached to an air driven pneumatic buffer, available under the trade designation “Dyna Buffer #57240” from Dynabrade USA, Clarence, N.Y., with a down weight of 5 pounds (2.27 kg), and air pressure of 94 pounds per square inch (psi) (648.1 kiloPascals (kPa)) at the face).
- the test panel had the following coatings: E-Coat ED6060; Primer 764204; Basecoat 542AB921 BLACK; Clearcoat RK8148”.
- the panel was cleaned and dried using a 50% by weight aqueous solution of isopropanol and a soft lint-free cloth.
- the panel was then fixed horizontally in place and 10 grams of buffing compound, type “Finesse-it Purple Polish, Part No. 51056”, obtained from 3M Company, was applied to the center of the panel.
- the entire panel uniformly buffed for 2 minutes, using lateral motion and without applying substantial downward hand-force, after which the panel was cleaned and dried as described above.
- the buffing process was repeated 8 times.
- Cut was calculated as the difference between the initial and final weight of the panel. Higher cut values are better.
- Example 2 and Comparatives D-I were attached to an 8-inch (20.3 cm) diameter foam backup pad available from 3M Company, St. Paul, Minn., under the trade designation “3M Finesse-It Backup Pad, Part No. 5717”, using an adapter type “5710”, also from 3M Company.
- the backup pad was then attached to an electric buffer, available under the trade designation “DeWALT DW849” from DeWALT Industrial Tool Company, Baltimore, Md., with a down weight of 5 pounds (2.27 kg).
- the test panel had the following coatings: E-Coat ED6060; Primer 765224EH; Basecoat 270AB921 BLACK; Clearcoat RK8148”.
- 10 grams of rubbing compound, type “Perfect-it Rubbing Compound, Part no. 6085”, obtained from 3M Company was applied to the test panel and manually buffed for 1 minute at 1,400 revolutions per minute (rpm).
- the panel was cleaned and dried as described above and the buffing process repeated four more times, using successively less amounts of rubbing compound of 8, 6, 5 and 4 gram, respectively.
- After the fifth buffing step the test panel was cleaned, dried and reweighed, and the cut in grams determined.
- Each Example and Comparative was run in duplicate. As before, higher cut values are better.
- Haze was measured using a haze gloss meter, Catalog no. “AG-4601” from Byk-Gardener USA, Columbia, Md. Measurements were made before and after Cut Test 1, at the approximate center of each of the four quadrants of the test panel (that is, resulting in four measurements), at a 20 degree measurement angle. Lower haze values are better.
- Comparative Samples A-C and Example 1 were subjected to Cut Test 1 and Haze Measurement. Results are listed in Table 3. Tests on Comparatives A and B, and Example 1, were run in triplicate.
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- Engineering & Computer Science (AREA)
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- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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US13/497,621 US20120258652A1 (en) | 2009-11-12 | 2010-11-09 | Rotary buffing pad |
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US26049809P | 2009-11-12 | 2009-11-12 | |
PCT/US2010/055905 WO2011059935A1 (en) | 2009-11-12 | 2010-11-09 | Rotary buffing pad |
US13/497,621 US20120258652A1 (en) | 2009-11-12 | 2010-11-09 | Rotary buffing pad |
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EP (1) | EP2498951A1 (pt) |
CN (1) | CN102639299A (pt) |
BR (1) | BR112012011210A2 (pt) |
RU (1) | RU2012116583A (pt) |
WO (1) | WO2011059935A1 (pt) |
Cited By (3)
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US9643294B2 (en) * | 2015-07-14 | 2017-05-09 | K&D Pads LLC | Buffing pad and methods of making and using the same |
USD876195S1 (en) | 2018-06-13 | 2020-02-25 | Kenneth Luna | Polishing pad |
US20220390303A1 (en) * | 2016-09-14 | 2022-12-08 | Sony Group Corporation | Sensor, input device, and electronic apparatus |
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TWI551396B (zh) | 2013-10-03 | 2016-10-01 | 三芳化學工業股份有限公司 | 拋光墊及其製造方法 |
CN104625945B (zh) * | 2013-11-07 | 2017-03-01 | 三芳化学工业股份有限公司 | 抛光垫及其制造方法 |
KR102436416B1 (ko) * | 2014-10-17 | 2022-08-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성 |
CN113635216A (zh) * | 2021-08-26 | 2021-11-12 | 业成科技(成都)有限公司 | 砂纸、金相研磨方法和装置 |
CN115026705B (zh) * | 2022-06-28 | 2024-04-12 | 广东先导微电子科技有限公司 | 抛光机 |
Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5329734A (en) * | 1993-04-30 | 1994-07-19 | Motorola, Inc. | Polishing pads used to chemical-mechanical polish a semiconductor substrate |
US5441598A (en) * | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
US5527215A (en) * | 1992-01-10 | 1996-06-18 | Schlegel Corporation | Foam buffing pad having a finishing surface with a splash reducing configuration |
US6165904A (en) * | 1998-10-07 | 2000-12-26 | Samsung Electronics Co., Ltd. | Polishing pad for use in the chemical/mechanical polishing of a semiconductor substrate and method of polishing the substrate using the pad |
US6241522B1 (en) * | 1997-01-10 | 2001-06-05 | Gebruder Brasseler Gmbh & Co. | Grinding tool for dental purposes |
US6273806B1 (en) * | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
US6331137B1 (en) * | 1998-08-28 | 2001-12-18 | Advanced Micro Devices, Inc | Polishing pad having open area which varies with distance from initial pad surface |
US6409586B2 (en) * | 1997-08-22 | 2002-06-25 | Micron Technology, Inc. | Fixed abrasive polishing pad |
US6443809B1 (en) * | 1999-11-16 | 2002-09-03 | Chartered Semiconductor Manufacturing, Ltd. | Polishing apparatus and method for forming an integrated circuit |
USRE37997E1 (en) * | 1990-01-22 | 2003-02-18 | Micron Technology, Inc. | Polishing pad with controlled abrasion rate |
US6520834B1 (en) * | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
US6620031B2 (en) * | 2001-04-04 | 2003-09-16 | Lam Research Corporation | Method for optimizing the planarizing length of a polishing pad |
US6875096B2 (en) * | 2001-08-16 | 2005-04-05 | Skc Co., Ltd. | Chemical mechanical polishing pad having holes and or grooves |
USD536714S1 (en) * | 2005-09-16 | 2007-02-13 | 3M Innovative Properties Company | Abrasive article with holes |
USD538312S1 (en) * | 2005-09-16 | 2007-03-13 | 3M Innovative Properties Company | Abrasive article with holes |
US7244170B2 (en) * | 2005-09-16 | 2007-07-17 | 3M Innovative Properties Co. | Abrasive article and methods of making same |
US20070243798A1 (en) * | 2006-04-18 | 2007-10-18 | 3M Innovative Properties Company | Embossed structured abrasive article and method of making and using the same |
US20070254567A1 (en) * | 2006-05-01 | 2007-11-01 | Mclain Scott S | Foam Buffing Pad with Random or Strategically Placed Collapsed Cell Structures |
USD554813S1 (en) * | 2006-02-11 | 2007-11-06 | Boler Jr Lewyn B | Buffing pad |
US20080216414A1 (en) * | 2007-03-05 | 2008-09-11 | 3M Innovative Properties Company | Laser cut abrasive article, and methods |
US20080216413A1 (en) * | 2007-03-05 | 2008-09-11 | 3M Innovative Properties Company | Abrasive article with supersize coating, and methods |
US20080229672A1 (en) * | 2007-03-20 | 2008-09-25 | 3M Innovative Properties Company | Abrasive article and method of making and using the same |
US20080233850A1 (en) * | 2007-03-20 | 2008-09-25 | 3M Innovative Properties Company | Abrasive article and method of making and using the same |
US7452265B2 (en) * | 2006-12-21 | 2008-11-18 | 3M Innovative Properties Company | Abrasive article and methods of making same |
USD586370S1 (en) * | 2007-08-09 | 2009-02-10 | 3M Innovative Properties Company | Random hole abrasive disc |
US7867066B2 (en) * | 2004-12-29 | 2011-01-11 | Toho Engineering Kabushiki Kaisha | Polishing pad |
US8123597B2 (en) * | 2008-10-23 | 2012-02-28 | Bestac Advanced Material Co., Ltd. | Polishing pad |
US8287793B2 (en) * | 2004-07-21 | 2012-10-16 | Nexplanar Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4962562A (en) | 1989-01-18 | 1990-10-16 | Minnesota Mining And Manufacturing Company | Compounding, glazing or polishing pad |
US20060022368A1 (en) * | 2002-11-18 | 2006-02-02 | Kyu-Don Lee | Method of fabricating polyurethane foam with micro pores and polishing pad therefrom |
US20070204420A1 (en) | 2006-03-06 | 2007-09-06 | Hornby David M | Polishing pad and method of making |
-
2010
- 2010-11-09 CN CN2010800511806A patent/CN102639299A/zh active Pending
- 2010-11-09 WO PCT/US2010/055905 patent/WO2011059935A1/en active Application Filing
- 2010-11-09 EP EP10779390A patent/EP2498951A1/en not_active Withdrawn
- 2010-11-09 US US13/497,621 patent/US20120258652A1/en not_active Abandoned
- 2010-11-09 BR BR112012011210A patent/BR112012011210A2/pt not_active IP Right Cessation
- 2010-11-09 RU RU2012116583/02A patent/RU2012116583A/ru not_active Application Discontinuation
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5297364A (en) * | 1990-01-22 | 1994-03-29 | Micron Technology, Inc. | Polishing pad with controlled abrasion rate |
USRE37997E1 (en) * | 1990-01-22 | 2003-02-18 | Micron Technology, Inc. | Polishing pad with controlled abrasion rate |
US5527215A (en) * | 1992-01-10 | 1996-06-18 | Schlegel Corporation | Foam buffing pad having a finishing surface with a splash reducing configuration |
US5329734A (en) * | 1993-04-30 | 1994-07-19 | Motorola, Inc. | Polishing pads used to chemical-mechanical polish a semiconductor substrate |
US5441598A (en) * | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
US6241522B1 (en) * | 1997-01-10 | 2001-06-05 | Gebruder Brasseler Gmbh & Co. | Grinding tool for dental purposes |
US6273806B1 (en) * | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
US6409586B2 (en) * | 1997-08-22 | 2002-06-25 | Micron Technology, Inc. | Fixed abrasive polishing pad |
US6331137B1 (en) * | 1998-08-28 | 2001-12-18 | Advanced Micro Devices, Inc | Polishing pad having open area which varies with distance from initial pad surface |
US6165904A (en) * | 1998-10-07 | 2000-12-26 | Samsung Electronics Co., Ltd. | Polishing pad for use in the chemical/mechanical polishing of a semiconductor substrate and method of polishing the substrate using the pad |
US6443809B1 (en) * | 1999-11-16 | 2002-09-03 | Chartered Semiconductor Manufacturing, Ltd. | Polishing apparatus and method for forming an integrated circuit |
US6520834B1 (en) * | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
US6620031B2 (en) * | 2001-04-04 | 2003-09-16 | Lam Research Corporation | Method for optimizing the planarizing length of a polishing pad |
US6875096B2 (en) * | 2001-08-16 | 2005-04-05 | Skc Co., Ltd. | Chemical mechanical polishing pad having holes and or grooves |
US8287793B2 (en) * | 2004-07-21 | 2012-10-16 | Nexplanar Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
US7867066B2 (en) * | 2004-12-29 | 2011-01-11 | Toho Engineering Kabushiki Kaisha | Polishing pad |
USD538312S1 (en) * | 2005-09-16 | 2007-03-13 | 3M Innovative Properties Company | Abrasive article with holes |
US7244170B2 (en) * | 2005-09-16 | 2007-07-17 | 3M Innovative Properties Co. | Abrasive article and methods of making same |
USD536714S1 (en) * | 2005-09-16 | 2007-02-13 | 3M Innovative Properties Company | Abrasive article with holes |
USD554813S1 (en) * | 2006-02-11 | 2007-11-06 | Boler Jr Lewyn B | Buffing pad |
US20070243798A1 (en) * | 2006-04-18 | 2007-10-18 | 3M Innovative Properties Company | Embossed structured abrasive article and method of making and using the same |
US20070254567A1 (en) * | 2006-05-01 | 2007-11-01 | Mclain Scott S | Foam Buffing Pad with Random or Strategically Placed Collapsed Cell Structures |
US7452265B2 (en) * | 2006-12-21 | 2008-11-18 | 3M Innovative Properties Company | Abrasive article and methods of making same |
US20080216414A1 (en) * | 2007-03-05 | 2008-09-11 | 3M Innovative Properties Company | Laser cut abrasive article, and methods |
US20080216413A1 (en) * | 2007-03-05 | 2008-09-11 | 3M Innovative Properties Company | Abrasive article with supersize coating, and methods |
US20080233850A1 (en) * | 2007-03-20 | 2008-09-25 | 3M Innovative Properties Company | Abrasive article and method of making and using the same |
US20080229672A1 (en) * | 2007-03-20 | 2008-09-25 | 3M Innovative Properties Company | Abrasive article and method of making and using the same |
USD586370S1 (en) * | 2007-08-09 | 2009-02-10 | 3M Innovative Properties Company | Random hole abrasive disc |
US8123597B2 (en) * | 2008-10-23 | 2012-02-28 | Bestac Advanced Material Co., Ltd. | Polishing pad |
Non-Patent Citations (2)
Title |
---|
McMaster Carr - Polyurethane Foam, 12, 2014 - show typical commercial availability of materials * |
McMaster Carr Catalog Page 3578, 12-2014 - reference provides supporting evidence in rejection * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9643294B2 (en) * | 2015-07-14 | 2017-05-09 | K&D Pads LLC | Buffing pad and methods of making and using the same |
US20220390303A1 (en) * | 2016-09-14 | 2022-12-08 | Sony Group Corporation | Sensor, input device, and electronic apparatus |
US11867580B2 (en) * | 2016-09-14 | 2024-01-09 | Sony Group Corporation | Sensor, input device, and electronic apparatus |
USD876195S1 (en) | 2018-06-13 | 2020-02-25 | Kenneth Luna | Polishing pad |
Also Published As
Publication number | Publication date |
---|---|
EP2498951A1 (en) | 2012-09-19 |
RU2012116583A (ru) | 2013-12-20 |
WO2011059935A1 (en) | 2011-05-19 |
BR112012011210A2 (pt) | 2016-07-05 |
CN102639299A (zh) | 2012-08-15 |
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Owner name: 3M INNOVATIVE PROPERTIES COMPANY, MINNESOTA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KOEHNLE, GREGORY A.;CULLER, SCOTT R.;MOEGENBURG, BRANT A.;AND OTHERS;SIGNING DATES FROM 20110208 TO 20110210;REEL/FRAME:027909/0299 |
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Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |