US20120194963A1 - Electronic component and substrate module - Google Patents
Electronic component and substrate module Download PDFInfo
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- US20120194963A1 US20120194963A1 US13/359,520 US201213359520A US2012194963A1 US 20120194963 A1 US20120194963 A1 US 20120194963A1 US 201213359520 A US201213359520 A US 201213359520A US 2012194963 A1 US2012194963 A1 US 2012194963A1
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- 239000000758 substrate Substances 0.000 title claims description 56
- 239000004020 conductor Substances 0.000 claims abstract description 345
- 239000003990 capacitor Substances 0.000 claims abstract description 111
- 239000007787 solid Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 description 86
- 238000003780 insertion Methods 0.000 description 19
- 230000037431 insertion Effects 0.000 description 19
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- -1 rare earth compound Chemical class 0.000 description 3
- 229910002971 CaTiO3 Inorganic materials 0.000 description 2
- 229910002976 CaZrO3 Inorganic materials 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Definitions
- the present invention relates to an electronic component and a substrate module, and more particularly to an electronic component and a substrate module, which include a built-in capacitor.
- FIG. 25 is a cross-sectional structure diagram of a multilayer ceramic capacitor 500 disclosed therein.
- the multilayer ceramic capacitor 500 includes dielectric layers 502 , internal electrode layers 504 a , 504 b and terminal electrodes 506 a , 506 b.
- the dielectric layers 502 are stacked and form a multilayered body.
- the internal electrode layers 504 a and 504 b are included inside the multilayered body, and form a capacitor by facing each other over the dielectric layer 502 .
- the internal electrode layers 504 a and 504 b are each led out to an opposite end surface of the multilayered body.
- the terminal electrodes 506 a and 506 b are each provided on the opposite end surface of the multilayered body, and connect to the internal electrode layers 504 a and 504 b , respectively.
- Preferred embodiments of the present invention provide an electronic component and a substrate module, which are significantly reduce insertion loss in high frequency bands.
- an electronic component includes a multilayered body having a substantially rectangular solid shape and including a plurality of dielectric layers stacked on each other; a plurality of first capacitor conductors each being provided on a different one of the dielectric layers; a plurality of first lead conductors each connected to the first capacitor conductor and being led out to a first end surface of the multilayered body; a plurality of third lead conductors each connected to the first capacitor conductor and being led out to a first side surface of the multilayered body, the third lead conductor not touching the first lead conductor; a plurality of second capacitor conductors each being provided on a different one of the dielectric layers; a plurality of second lead conductors each connected to the second capacitor conductor and being led out to a second end surface of the multilayered body; a plurality of fourth lead conductors each connected to the second capacitor conductor and being led out to the first side surface, the fourth lead conductor not touching the second lead conductor; a third capacitor conductor provided on
- an electronic component includes a multilayered body having a substantially rectangular solid shape and including a plurality of dielectric layers stacked on each other; a plurality of first capacitor conductors each being provided on a different one of the dielectric layers; a plurality of first lead conductors each connected to the first capacitor conductor and being led out to a first end surface of the multilayered body; a plurality of third lead conductors each connected to the first capacitor conductor and being led out to a first side surface of the multilayered body, the third lead conductor not touching the first lead conductor; a plurality of second capacitor conductors each being provided on a different one of the dielectric layers and facing one of the first capacitor conductors over the dielectric layer; a plurality of second lead conductors each connected to the second capacitor conductor and being led out to a second end surface of the multilayered body; a plurality of fourth lead conductors each connected to the second capacitor conductor and being led out to the first side surface, the fourth lead conductor not touching
- a substrate module includes a circuit substrate including a first land and a second land; and an electronic component according to a preferred embodiment of the present invention described above mounted on the circuit substrate; wherein the first external electrode is connected to the first land; and the second external electrode is connected to the second land.
- the insertion loss in the high frequency bands is significantly reduced.
- FIG. 1 is an external perspective view of an electronic component according to a first preferred embodiment of the present invention.
- FIG. 2 is an exploded perspective view of a multilayered body of the electronic component illustrated in FIG. 1 .
- FIG. 3A and FIG. 3B are internal plane views of the electronic component illustrated in FIG. 1 .
- FIG. 4A is a cross-sectional structure diagram of a substrate module
- FIG. 4B is a plane view of the substrate module viewed from the positive side of a Z-axis direction.
- FIG. 5 is an equivalent circuit schematic of the substrate module illustrated in FIG. 4A and FIG. 4B .
- FIG. 6 is an external perspective view of an electronic component to be used as a comparative example.
- FIG. 7 is an exploded perspective view of a multilayered body of the electronic component to be used as a comparative example.
- FIG. 8 is a graph representing insertion losses (S 21 ) of a first sample and a second sample.
- FIG. 9 is a graph representing insertion losses (S 21 ) of a third sample and a fourth sample.
- FIG. 10 is a graph representing insertion losses (S 21 ) of a fifth sample and a sixth sample.
- FIG. 11 is a graph representing insertion losses (S 21 ) of a seventh sample and an eighth sample.
- FIG. 12 is an internal plane view of an electronic component according to a second preferred embodiment of the present invention.
- FIG. 13 is an internal plane view of an electronic component according to a third preferred embodiment of the present invention.
- FIG. 14 is an internal plane view of an electronic component according to a fourth preferred embodiment of the present invention.
- FIG. 15 is an internal plane view of an electronic component according to a fifth preferred embodiment of the present invention.
- FIG. 16 is an internal plane view of an electronic component according to a sixth preferred embodiment of the present invention.
- FIG. 17A and FIG. 17B are internal plane views of an electronic component according to a seventh preferred embodiment of the present invention.
- FIG. 18 is an exploded perspective view of a multilayered body of an electronic component according to an eighth preferred embodiment of the present invention.
- FIG. 19A and FIG. 19B are internal plane views of an electronic component of FIG. 18 .
- FIG. 20 is a cross-sectional structure diagram of a substrate module.
- FIG. 21A and FIG. 21B are internal plane views of an electronic component according to a ninth preferred embodiment of the present invention.
- FIG. 22A and FIG. 22B are internal plane views of an electronic component according to a tenth preferred embodiment of the present invention.
- FIG. 23 is an external perspective view of an electronic component according to an eleventh preferred embodiment of the present invention.
- FIG. 24 is an external perspective view of an electronic component according to a twelfth preferred embodiment of the present invention.
- FIG. 25 is a cross-sectional structure diagram of the multilayer ceramic capacitor disclosed in Japanese Unexamined Patent Application Publication No. 2000-306762.
- FIG. 1 is an external perspective view of the electronic component 10 according to the first preferred embodiment.
- FIG. 2 is an exploded perspective view of a multilayered body 11 of the electronic component 10 illustrated in FIG. 1 .
- FIG. 3A and FIG. 3B are internal plane views of the electronic component 10 illustrated in FIG. 1 .
- a stacking direction in the multilayered body 11 is defined as a Z-axis.
- An x-direction is defined as a direction in which a longer side of the multilayered body 11 extends in a plane view when the multilayered body 11 is viewed along the Z-axis direction.
- a y-direction is defined as a direction in which a shorter side of the multilayered body 11 extends in a plane view when the multilayered body 11 is viewed along the Z-axis direction.
- the electronic component 10 is, for example, a chip capacitor and includes, for example as illustrated in FIG. 1 to FIG. 3A and FIG. 3B , the multilayered body 11 , external electrodes 12 ( 12 a , 12 b ) and internal conductors 30 ( 30 a - 30 c ), 31 ( 31 a - 31 c ), 32 ( 32 a , 32 b ) (not shown in FIG. 1 ).
- the multilayered body 11 preferably has a substantially rectangular solid shape except corners and ridges that are chamfered and define roundish shapes, for example.
- a surface at the positive side of the z-axis direction is defined as an upper surface S 1
- a surface at the negative side of the z-axis direction is defined as a lower surface S 2 .
- a surface at the negative side of the x-axis direction is defined as an end surface S 3
- a surface at the positive side of the x-axis direction is defined as an end surface S 4 .
- a surface at the positive side of the y-axis direction is defined as a side surface S 5
- a surface at the negative side of the y-axis direction is defined as a side surface S 6 .
- the multilayered body 11 is constructed in such a way that a plurality of ceramic layers 17 ( 17 a - 17 g ) are stacked in order of appearance from the positive side to the negative side of the z-axis direction.
- the ceramic layer 17 preferably has a substantially rectangular shape and is made of dielectric ceramic.
- a principle surface of the ceramic layer 17 at the positive side of the z-axis direction is referred to as a top surface
- a principle surface of the ceramic layer 17 at the negative side of the z-axis direction is referred to as a back surface.
- the upper surface S 1 of the multilayered body 11 is constructed of the top surface of the ceramic layer 17 arranged at the most positive side of the z-axis direction.
- the lower surface S 2 of the multilayered body 11 is constructed of the back surface of the ceramic layer 17 arranged at the most negative side of the z-axis direction.
- the end surface S 3 is constructed of stacked shorter sides of the ceramic layers 17 a - 17 g at the most negative side of the x-axis direction.
- the end surface S 4 is constructed of stacked shorter sides of the ceramic layers 17 a - 17 g at the most positive side of the x-axis direction.
- the side surface S 5 is constructed of stacked longer sides of the ceramic layers 17 a - 17 g at the most positive side of the y-axis direction.
- the side surface S 6 is constructed of stacked longer sides of the ceramic layers 17 a - 17 g at the most negative side of the y-axis direction.
- the plural internal conductors 30 a - 30 c , 31 a - 31 c are provided on the top surfaces of the different ceramic layers 17 b , 17 d , 17 f , respectively, and embedded inside the multilayered body 11 .
- the internal conductors 32 a and 32 b are provided on the top surfaces of the ceramic layers 17 c and 17 e , respectively, and embedded inside the multilayered body 11 .
- the internal conductors 30 , 31 and the internal conductors 32 are stacked alternately in the z-axis direction.
- the internal conductor 30 includes a capacitor conductor 18 ( 18 a - 18 c ) and lead conductors 20 ( 20 a - 20 c ), ( 22 a - 22 c ) and 23 ( 23 a - 23 c ).
- the capacitor conductors 18 a - 18 c have substantially rectangular shapes, and are arranged on the top surfaces of different ceramic layers 17 b , 17 d , 17 f , respectively, such that they do not touch external edges of the corresponding ceramic layers 17 b , 17 d , 17 f .
- the capacitor conductor 18 is provided within an area of the ceramic layer 17 , which is about one-half of the whole area of the ceramic layer 17 at the negative side of the x-axis direction.
- the lead conductors 20 a - 20 c are connected to the capacitor conductors 18 a - 18 c , respectively, and led to the end surface S 3 of the multilayered body 11 to be exposed at the end surface S 3 . More specifically, the lead conductor 20 protrudes toward the negative side of the x-axis direction from the longer side of the capacitor conductor 18 at the negative side of the x-axis direction. Accordingly, the lead conductor 20 is led out to the shorter side of the ceramic layer 17 at the negative side of the x-axis direction.
- the width of the lead conductor 20 in the y-axis direction is substantially the same as the width of the capacitor conductor 18 in the y-axis direction.
- the lead conductors 22 a - 22 c are connected to the capacitor conductors 18 a - 18 c , respectively, and are led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 . More specifically, the lead conductor 22 extends toward the positive side of the y-axis direction from an end at the positive side of the x-axis direction of the shorter side of the capacitor conductor 18 at the positive side of the y-axis direction. Accordingly, the lead conductor 22 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of the ceramic layer 17 at the positive side of the y-axis direction. The lead conductor 22 does not touch the lead conductor 20 .
- the lead conductors 23 a - 23 c are connected to the corresponding capacitor conductors 18 a - 18 c , respectively, and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 . More specifically, the lead conductor 23 extends toward the negative side of the y-axis direction from an end at the positive side of the x-axis direction of the shorter side of the capacitor conductor 18 at the negative side of the y-axis direction. Accordingly, the lead conductor 23 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of the ceramic layer 17 at the negative side of the y-axis direction. The lead conductor 23 does not touch the lead conductor 20 .
- the internal conductor 31 includes a capacitor conductor 19 ( 19 a - 19 c ) and lead conductors 21 ( 21 a - 21 c ), ( 24 a - 24 c ) and 25 ( 25 a - 25 c ).
- the capacitor conductors 19 a - 19 c have substantially rectangular shapes, and are arranged on the top surfaces of different ceramic layers 17 b , 17 d and 17 f such that they do not touch external edges of the corresponding ceramic layers 17 b , 17 d and 17 f .
- the capacitor conductor 19 is provided within an area of the ceramic layer 17 , which is one-half of the whole area of the ceramic layer 17 at the positive side of the x-axis direction.
- the capacitor conductors 18 and 19 are provided on the same top surface of the ceramic layer 17 , and face each other.
- the lead conductors 21 a - 21 c are connected to the corresponding capacitor conductors 19 a - 19 c , respectively, and led to the end surface S 4 of the multilayered body 11 to be exposed at the end surface S 4 . More specifically, the lead conductor 21 protrudes toward the positive side of the x-axis direction from the longer side of the capacitor conductor 19 at the positive side of the x-axis direction. Accordingly, the lead conductor 21 is led out to the shorter side of the ceramic layer 17 at the positive side of the x-axis direction.
- the width of the lead conductor 21 in the y-axis direction is substantially the same as the width of the capacitor conductor 19 in the y-axis direction.
- the lead conductors 24 a - 24 c are connected to the capacitor conductors 19 a - 19 c , respectively, and led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 . More specifically, the lead conductor 24 extends toward the positive side of the y-axis direction from an end at the negative side of the x-axis direction in the shorter side of the capacitor conductor 19 at the positive side of the y-axis direction. Accordingly, the lead conductor 24 is led out to a position at a further positive side of the x-axis direction than the middle point of the longer side of the ceramic layer 17 at the positive side of the y-axis direction. In other words, the lead conductor 24 is disposed at a further positive side of the x-axis direction than the lead conductor 22 in a plane viewed in the z-axis direction. The lead conductor 24 does not touch the lead conductor 21 .
- the lead conductors 25 a - 25 c are connected to the capacitor conductors 19 a - 19 c , respectively, and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 . More specifically, the lead conductor 25 extends toward the negative side of the y-axis direction from an end at the negative side of the x-axis direction of the shorter side of the capacitor conductor 19 at the negative side of the y-axis direction. Accordingly, the lead conductor 25 is led out to a position at a further positive side of the x-axis direction than a middle point of the longer side of the ceramic layer 17 at the negative side of the y-axis direction. In other words, the lead conductor 25 is disposed at a further positive side of the x-axis direction than the lead conductor 23 in a plane viewed in the z-axis direction. The lead conductor 25 does not touch the lead conductor 21 .
- the internal conductors 32 a and 32 b have substantially rectangular shapes, and are arranged on the top surfaces of the ceramic layers 17 c and 17 e , respectively, such that they do not touch external edges of the corresponding ceramic layers 17 c and 17 e .
- the internal conductor 32 is provided on the top surface of the ceramic layer 17 that is different from the ceramic layer 17 in which the capacitor conductors 18 and 19 are provided, and faces the capacitor conductors 18 and 19 over the ceramic layer 17 .
- capacitors are defined between the capacitor conductor 18 and the internal conductor 32 and between the capacitor conductor 19 and the internal conductor 32 .
- the capacitor located between the capacitor conductor 18 and the internal conductor 32 is connected in series to the capacitor formed between the capacitor conductor 19 and the internal conductor 32 .
- the external electrode 12 a is arranged so as to straddle the end surface S 3 , the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 , and to connect with all the lead conductors 20 a - 20 c , 22 a - 22 c and 23 a - 23 c . More specifically, the external electrode 12 a covers the whole area of the end surface S 3 of the multilayered body 11 so as to cover portions of the lead conductors 20 a - 20 c exposed from the end surface S 3 . Furthermore, the external electrode 12 a is folded down from the end surface S 3 to the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 . The external electrode 12 a covers the side surfaces S 5 and S 6 of the multilayered body 11 so as to cover portions of the lead conductors 22 a - 22 c , 23 a - 23 c exposed from the side surfaces S 5 and S 6 .
- the external electrode 12 b is arranged so as to straddle the end surface S 4 , the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 , and to connect with all the lead conductors 21 a - 21 c , 24 a - 24 c and 25 a - 25 c . More specifically, the external electrode 12 b covers the whole area of the end surface S 4 of the multilayered body 11 so as to cover portions of the lead conductors 21 a - 21 c exposed from the end surface S 4 . Furthermore, the external electrode 12 b is folded down from the end surface S 4 to the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 . The external electrode 12 b covers the side surfaces S 5 and S 6 of the multilayered body 11 so as to cover portions of the lead conductors 24 a - 24 c , 25 a - 25 c exposed from the side surfaces S 5 and S 6 .
- the widths of the external electrode 12 a along the x-axis direction in the side surfaces S 5 and S 6 are wider than the widths of the external electrode 12 a along the x-axis direction in the upper surface S 1 and the lower surface S 2 .
- the widths of the external electrode 12 b along the x-axis direction in the side surfaces S 5 and S 6 are wider than the widths of the external electrode 12 b along the x-axis direction in the upper surface S 1 and the lower surface S 2 .
- gaps D 1 between the external electrode 12 a and the external electrode 12 b in the side surfaces S 5 and S 6 are smaller than a gap D 2 between the external electrode 12 a and the external electrode 12 b in the bottom surface S 2 .
- no external electrode that retains a different electrical potential from those of the external electrodes 12 a and 12 b is provided in between the external electrode 12 a and the external electrode 12 b .
- FIG. 1 , FIG. 2 , FIG. 3A and FIG. 3B are used.
- BaTiO 3 , CaTiO 3 , SrTiO 3 or CaZrO 3 which is used as a primary component
- a Mn compound, a Mg compound, a Si compound, a Co compound, a Ni compound or a rare earth compound, which is used as an accessory component are weighed at a predetermined ratio and are then put in a ball mill, and wet mixing is performed. An obtained mixture is dried and pulverized. Then, an obtained powder is calcined. After a calcined powder is wet-pulverized by a ball mill, drying and pulverizing are performed to obtain a dielectric ceramic powder.
- the thickness of the ceramic layer 17 after the firing is preferably about 0.5 ⁇ m to about 10 ⁇ m, for example.
- the internal conductors 30 - 32 are formed on the ceramic green sheets, which are to be formed into the ceramic layers 17 , by applying a paste including a conductive material using a method such as a screen printing or a photolithographic method.
- a paste including a conductive material for example, a paste formed by adding an organic binder and an organic solvent to a metal powder may preferably be used.
- the metal powder may be, for example, Ni, Cu, Ag, Pd, Ag—Pd alloy, Au or the like.
- the thicknesses of the internal conductors 30 - 32 after the firing are preferably about 0.3 ⁇ m to about 2.0 ⁇ m, for example.
- the ceramic green sheets that are to be formed into the ceramic layers 17 are stacked to obtain a non-fired mother multilayered body. Subsequently, pressure bonding is performed on the non-fired mother multilayered body by using a hydrostatic pressure press.
- the non-fired mother multilayered body is cut to predetermined sizes to obtain a plurality of non-fired multilayered bodies 11 . Subsequently, a barrel polishing process is performed on the surfaces of the multilayered body 11 .
- the non-fired multilayered body 11 is fired.
- the firing temperature for example, a temperature of about 900° C. to about 1,300° C., for example, is preferable. With the foregoing steps, the preparation of the multilayered body 11 is completed.
- the external electrode 12 is formed on the multilayered body 11 . More specifically, an electrically conductive paste is applied on the surfaces of the multilayered body 11 by using a well-known dip method, a slit method or the like. The electrically conductive paste is then baked at a temperature of about 700° C. to about 900° C., for example, to produce an underlayer electrode of the external electrode 12 .
- As a material for the electrically conductive paste Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example.
- the thickness of the underlayer electrode is preferably about 10 ⁇ m to about 50 ⁇ m, for example.
- plating is performed on the underlayer electrode to complete the external electrode 12 .
- the electronic component 10 is completed.
- Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example.
- the plating may be repeated plural times to form layers of the plating on the underlayer electrode. With the foregoing steps, the electronic component 10 is completed.
- FIG. 1 A method for manufacturing the electronic component 10 is described. As the drawings, FIG. 1 , FIG. 2 , FIG. 3A and FIG. 3 B are used.
- BaTiO 3 , CaTiO 3 , SrTiO 3 or CaZrO 3 which is used as a primary component
- a Mn compound, a Mg compound, a Si compound, a Co compound, a Ni compound or a rare earth compound, which is used as an accessory component are weighed at a predetermined ratio and are then put in a ball mill, and wet mixing is performed. An obtained mixture is dried and pulverized. Then, an obtained powder is calcined. After a calcined powder is wet-pulverized by a ball mill, drying and pulverizing are performed to obtain a dielectric ceramic powder.
- the thickness of the ceramic layer 17 after the firing is preferably about 0.5 ⁇ m to about 10 ⁇ m, for example.
- the internal conductors 30 - 32 are formed on the ceramic green sheets which are to be formed into the ceramic layers 17 by applying a paste including a conductive material using a method such as a screen printing or a photolithographic method.
- a paste including a conductive material for example, a paste formed by adding an organic binder and an organic solvent to a metal powder may preferably be used.
- the metal powder may be, for example, Ni, Cu, Ag, Pd, Ag—Pd alloy, Au or other suitable material.
- the thicknesses of the internal conductors 30 - 32 after the firing are preferably about 0.3 ⁇ m to about 2.0 ⁇ m, for example.
- the ceramic green sheets that are to be formed into the ceramic layers 17 are stacked to obtain a non-fired mother multilayered body. Subsequently, pressure bonding is performed on the non-fired mother multilayered body by using a hydrostatic pressure press.
- the non-fired mother multilayered body is cut to predetermined sizes to obtain a plurality of non-fired multilayered bodies 11 . Subsequently, a barrel polishing process is performed on the surfaces of the multilayered body 11 .
- the non-fired multilayered body 11 is fired.
- the firing temperature for example, a temperature of about 900° C. to about 1,300° C., for example, is preferable. With the foregoing steps, the preparation of the multilayered body 11 is completed.
- the external electrode 12 is formed on the multilayered body 11 . More specifically, an electrically conductive paste is applied on the surfaces of the multilayered body 11 by using a well-known dip method, a slit method or the like. The electrically conductive paste is then baked at a temperature of about 700° C. to about 900° C., for example, to produce an underlayer electrode of the external electrode 12 .
- As a material for the electrically conductive paste Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example.
- the thickness of the underlayer electrode is preferably about 10 ⁇ m to about 50 ⁇ m, for example.
- plating is performed on the underlayer electrode to complete the external electrode 12 .
- the electronic component 10 is completed.
- Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example.
- the plating may be repeated plural times to form layers of the plating on the underlayer electrode. With the foregoing steps, the electronic component 10 is completed.
- FIG. 4A is a cross-sectional structure diagram of the substrate module 40
- FIG. 4B is a plane view of the substrate module 40 viewed from the positive side of a Z-axis direction.
- FIG. 5 is an equivalent circuit schematic of the substrate module 40 of FIG. 4A and FIG. 4B .
- the substrate module 40 includes the electronic component 10 and a circuit substrate 51 .
- the circuit substrate 51 includes a substrate body 52 , a signal conductor 54 , a ground electrode 55 , a via-hole conductor 56 and a ground conductor G.
- the substrate body 52 is a multilayer substrate including a plurality of ceramic layers and conductor layers stacked on each other, and includes electronic circuitry on its principle surface and therein.
- the signal conductor 54 is provided on the principle surface of the substrate body 52 at the positive side of the z-axis direction, and extends in the y-axis direction as illustrated in FIG. 4B .
- an input port P 1 (not shown in the figure) is provided on an end of the signal conductor 54 at the positive side of the y-axis direction.
- an output port P 2 (not shown in the figure) is provided.
- the ground electrode 55 is provided on the principle surface of the circuit substrate 51 at the positive side of the z-axis direction, and has a substantially rectangular shape as illustrated in FIG. 4B .
- the ground conductor G is provided in the substrate body 52 and kept at the ground potential.
- the ground conductor G connects to a ground port P 3 , which is not shown in the figure.
- the via-hole conductor 56 is provided in the substrate body 52 , and connects to the ground electrode 55 and the ground conductor G. According to the above, the ground electrode 55 is also kept at the ground potential.
- the electronic component 10 is mounted on the circuit substrate 51 . More specifically, the external electrode 12 a is connected to the signal conductor 54 by a solder 60 a . Similarly, the external electrode 12 b is connected to the ground conductor 55 by a solder 60 b . Accordingly, the substrate module 40 has a circuit structure illustrated in FIG. 5 . In other words, the signal conductor 54 connects the input port P 1 and the output port P 2 , and the electronic component 10 is provided between the signal conductor 54 and the ground port P 3 . In FIG. 5 , a capacitor C, a resistor R and an inductor L represent the capacitance, electrical resistance and inductance that the electronic component 10 has. Having the structure illustrated in FIG.
- a high frequency signal is input to the input port P 1 and output from the output port P 2 . Furthermore, of the high frequency signal input from the input port P 1 , components of the high frequency signal equal to resonance frequencies of the electronic component 10 are output from the ground P 3 and not output from the output port P 2 .
- the circuitry structure of the substrate module 40 is not limited to that illustrated in FIG. 5 . Alternatively, the electronic component 10 may be provided in between the input port P 1 and the output port P 2 in the substrate module 40 .
- FIG. 6 is an external perspective view of an electronic component 110 to be used as a comparative example.
- FIG. 7 is an exploded perspective view of a multilayered body 111 of the electronic component 110 to be used as a comparative example.
- the comparative example electronic component 110 has the same structure as the electronic component 10 except that the lead electrodes 22 - 25 and the external electrodes 12 on the side surfaces S 5 , S 6 are eliminated therefrom.
- portions substantially similar or identical to those of the electronic component 10 are denoted by reference numerals that are produced by adding 100 to the corresponding reference numerals of the electronic component 10 .
- a high frequency signal is input into the electronic component 110 from a signal conductor via an external electrode 112 a and output to a ground electrode via an external electrode 112 b .
- the high frequency signal flows in the order of the signal conductor, the external electrode 112 a , a lead conductor 120 , a capacitor conductor 118 , an internal conductor 132 , a capacitor conductor 119 , a lead conductor 121 , the external electrode 112 b and the ground electrode.
- the high frequency signal passes through only one path.
- the high frequency signal is input into the electronic component 10 from the signal conductor 54 via the external electrode 12 a and output to the ground electrode 55 via the external electrode 12 b .
- the following first to fifth paths may be available as paths through which the high frequency signal flows.
- the first path is a path such that the high frequency signal flows in the order of the signal conductor 54 , the external electrode 12 a , the lead conductor 20 , the capacitor conductor 18 , the internal conductor 32 , the capacitor conductor 19 , the lead conductor 21 , the external electrode 12 b and the ground electrode 55 .
- the second path is a path such that the high frequency signal flows in the order of the signal conductor 54 , the external electrode 12 a , the lead conductor 20 , the capacitor conductor 18 , the lead conductors 22 , 23 , the external electrode 12 a , the external electrode 12 b and the ground electrode 55 .
- the third path is a path such that the high frequency signal flows in the order of the signal conductor 54 , the external electrode 12 a , the lead conductors 22 , 23 , the capacitor conductor 18 , the internal conductor 32 , the capacitor conductor 19 , the lead conductor 21 , the external electrode 12 b and the ground electrode 55 .
- the fourth path is a path such that the high frequency signal flows in the order of the signal conductor 54 , the external electrode 12 a , the lead conductors 22 , 23 , the capacitor conductor 18 , the internal conductor 32 , the capacitor conductor 19 , the lead conductors 24 , 25 , the external electrode 12 b and the ground electrode 55 .
- the fifth path is a path such that the high frequency signal flows in the order of the signal conductor 54 , the external electrode 12 a , the external electrode 12 b and the ground electrode 55 .
- the high frequency signal flows from the external electrode 12 a to the external electrode 12 b by passing through inside the multilayered body 11 in between the external electrode 12 a and the external electrode 12 b .
- High frequency signals having frequencies higher than the first resonance point may flow through these paths.
- the gap between the external electrode 12 a and the external electrode 12 b may be made minimal, and more preferably about 50 ⁇ m to about 200 ⁇ m, for example.
- the electronic component 10 in comparison with the electronic component 110 , includes more paths, i.e., the second to fifth paths. That feature may contribute to the reduction of ESL. Furthermore, that feature may result the shifting of the first resonance point and the second resonance point in the electronic component 10 to higher frequency sides and the reduction of the insertion loss thereof in the high frequency bands, in comparison with the electronic component 110 .
- the shift width of the first resonance point tends to become larger in comparison with that of the second resonance point. This may be caused by having the second to fifth paths in the electronic component 10 .
- the flow of high frequency signals having frequencies higher than the first resonance point may tend to concentrate in part close to the circuit substrate 51 . This may provide a relatively small capacitor in a vicinity of the lower surface, and its resonance point may appeared as the second resonance point.
- the large shifting of the second resonance point toward the higher frequency side may be caused by the particular reduction of ESL in a relatively small capacitor due to the high frequency signals flowing through the second to fifth paths.
- the separation of the second resonance point from the first resonance point and the shallow valley at the second resonance point as described in the above may prevent a device, which operates at a frequency between the first resonance point and the second resonance point, from malfunctioning.
- the possibility of a short-circuit may be reduced with the electronic component 10 when it is mounted on the circuit substrate 51 .
- the gaps D 1 between the external electrode 12 a and the external electrode 12 b in the side surfaces S 5 and S 6 are smaller than the gap D 2 between the external electrode 12 a and the external electrode 12 b in the bottom surface S 2 .
- the gap between the external electrode 12 a and the external electrode 12 b is made larger in the bottom surface S 2 .
- the risk of connecting the external electrode 12 a and the external electrode 12 b by solder is smaller. Accordingly, the possibility of a short-circuit may be reduced with the electronic component 10 when mounting on the circuit substrate 51 .
- the possibility of delamination may be reduced.
- delamination is prone to occur at corners of multilayered body.
- delamination may occur between a lead electrode and a ceramic layer.
- the lead electrodes 20 and 21 are not led out to corners of the multilayered body 10 .
- the possibility of delamination is reduced.
- the lead electrodes 20 and 21 are not exposed in the corners of the multilayered body 11 . This improves moisture resistance of the electronic component 10 .
- samples hereinafter referred to as first sample, third sample, fifth sample and seventh sample
- samples second sample, fourth sample, sixth sample and eighth sample
- the first to eighth samples were each mounted in a circuit substrate as illustrated in FIG. 4A and FIG. 4B
- ESL and the insertion loss (S 21 ) between the input port P 1 and the output port P 2 were measured by using an network analyzer (Product No. 8722D manufactured by Agilent Technologies).
- Outer layer's thickness (distance from the internal conductors 30 a , 31 a to the upper surface S 1 of the multilayered body 11 and distance from the internal conductors 30 c , 31 c to the lower surface S 2 of the multilayered body 11 ): 88 ⁇ m
- Table 1 indicates the condition of each sample.
- the electronic component 10 had about 20% less ESL than the electronic component 110 .
- FIG. 8 is a graph representing the insertion loss (S 21 ) of the first sample and the second sample.
- FIG. 9 is a graph representing the insertion loss (S 21 ) of the third sample and the fourth sample.
- FIG. 10 is a graph representing the insertion loss (S 21 ) of the fifth sample and the sixth sample.
- FIG. 11 is a graph representing the insertion loss (S 21 ) of the seventh sample and the eighth sample.
- the vertical axis represents the insertion loss
- the horizontal axis represents the frequency.
- the first resonance points f 1 of the first sample, the third sample, the fifth sample and the seventh sample are higher than the corresponding first resonance points f 1 of the second sample, the fourth sample, the sixth sample and the eighth sample, respectively.
- Table 3 indicates the first resonance points of the first to eighth samples.
- the first resonance point f 1 of the electronic component 10 is higher than the first resonance point f 1 of the electronic component 110 . Accordingly, it is clear that the high frequency characteristic of the electronic component 10 is superior to that of the electronic component 110 . More specifically, the first resonance point f 1 of the electronic component 10 is about 10% higher than that of the electronic component 110 .
- the second resonance point f 2 of the electronic component 10 is higher than that of the electronic component 110 .
- the second resonance point f 2 of the eighth sample is about 8 GHz while the second resonance point f 2 of the seventh sample is about 10 GHz.
- the insertion loss of the electronic component 10 at its second resonance point f 2 is less than that of electronic component 110 at its second resonance point f 2 . Accordingly, with the electronic component 10 , the insertion loss in the high frequency bands is significantly reduced.
- FIG. 12 is an internal plane view of the electronic component 10 a according to the second preferred embodiment.
- An external perspective view of the electronic component 10 a is the same as that of the electronic component 10 , and thus FIG. 1 is also used below.
- a difference between the electronic component 10 and the electronic component 10 a lies in the shape of the internal conductors 30 and 31 . More specifically, the internal conductors and 31 (capacitor conductors 18 and 19 ) of the electronic component 10 a are closer to each other than those of the electronic component 10 . According to the above, in the electronic component 10 a , areas of portions where the capacitor conductors 18 , 19 are facing to the internal conductor 32 are larger than corresponding areas of the electronic component 10 . Accordingly, the electronic component 10 a has a significantly larger capacitance.
- FIG. 13 is an internal plane view of the electronic component 10 b according to the third preferred embodiment.
- An external perspective view of the electronic component 10 b is the same as that of the electronic component 10 , and thus FIG. 1 is also used below.
- a difference between the electronic component 10 and the electronic component 10 b lies in whether or not there are lead electrodes 72 ( 72 a - 72 c ), 73 ( 73 a - 73 c ), 74 ( 74 a - 74 c ) and 75 ( 75 a - 75 c ).
- the lead conductor 72 is connected to a connecting conductor 20 , and led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 .
- the lead conductor 72 is in contact with the shorter side of the ceramic layer 17 at the negative side of the x-axis direction. Accordingly, the lead conductor 72 connects to the external electrode 12 a at the longer side at the positive side of the y-axis direction and the shorter side at the negative side of the x-axis direction of the ceramic layer 17 .
- the lead conductor 73 is connected to a connecting conductor 20 , and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 .
- the lead conductor 73 is in contact with the shorter side of the ceramic layer 17 at the negative side of the x-axis direction. Accordingly, the lead conductor 73 connects to the external electrode 12 a at the longer side at the negative side of the y-axis direction and the shorter side at the negative side of the x-axis direction of the ceramic layer 17 .
- the lead conductor 74 is connected to a connecting conductor 21 , and led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 .
- the lead conductor 74 is in contact with the shorter side of the ceramic layer 17 at the positive side of the x-axis direction. Accordingly, the lead conductor 74 connects to the external electrode 12 b at the longer side at the positive side of the y-axis direction and the shorter side at the positive side of the x-axis direction of the ceramic layer 17 .
- the lead conductor 75 is connected to a connecting conductor 21 , and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 .
- the lead conductor 75 is in contact with the shorter side of the ceramic layer 17 at the positive side of the x-axis direction. Accordingly, the lead conductor 75 is connected to the external electrode 12 b at the longer side at the negative side of the y-axis direction and the shorter side at the positive side of the x-axis direction of the ceramic layer 17 .
- the electronic component 10 b is provided with the lead conductors 72 - 75 , more electric current flow paths are available in the electronic component 10 b than the electronic component 10 . As a result, in the electronic component 10 b , the reduction of ESL is achieved more effectively.
- FIG. 14 is an internal plane view of the electronic component 10 c according to the fourth preferred embodiment.
- An external perspective view of the electronic component 10 c is the same as that of the electronic component 10 , and thus FIG. 1 is also used.
- a difference between the electronic component 10 and the electronic component 10 c lies in positions of the lead electrodes 72 ( 72 a - 72 c ), 73 ( 73 a - 73 c ), 74 ( 74 a - 74 c ) and 75 ( 75 a - 75 c ). More specifically, in the electronic component 10 c , none of the lead conductors 72 - 75 is in contact with the shorter sides of the ceramic layer 17 at the positive and negative sides of the x-axis direction. In other words, in the corners of the ceramic layer 17 , none of the lead conductors 72 - 75 are provided.
- none of the lead conductors 72 - 75 is provided in the corner of the multilayered body 11 . Accordingly, the possibility of delamination is significantly reduced.
- FIG. 15 is an internal plane view of the electronic component 10 d according to the fifth preferred embodiment.
- An external perspective view of the electronic component 10 d is the same as that of the electronic component 10 , and thus FIG. 1 is also used.
- a difference between the electronic component 10 and the electronic component 10 d lies in the shapes of the lead conductors 20 and 21 . More specifically, the widths of the lead conductors 20 , 21 of the electronic component 10 d in the y-axis direction are narrower than those of the electronic component 10 .
- the widths of the lead conductors 20 , 21 are narrower, and thus areas of portions of the internal conductors 30 , 31 exposed at the multilayered body 11 are smaller. As a result, in the electronic component 10 d , the entering of moisture into the multilayered body 11 is prevented.
- FIG. 16 is an internal plane view of the electronic component 10 e according to the sixth preferred embodiment.
- the electronic component 10 e differs from the electronic component 10 in not having the lead conductors 23 and 25 .
- the electronic component 10 e is mounted on the circuit substrate 51 in such a way that the side surface S 5 faces the circuit substrate 51 .
- FIG. 17A and FIG. 17B are internal plane views of the electronic component 10 f according to the seventh preferred embodiment.
- thicknesses of the external electrodes 12 a and 12 b in the side surfaces S 5 and S 6 may be made smaller than thicknesses of the external electrodes 12 a and 12 b in the end surfaces S 3 and S 4 .
- the external electrode 12 may be manufactured by the following steps. First, an electrically conductive paste is applied on the end surfaces S 5 and S 6 of the multilayered body 11 by the use of a dip method to form underlayer electrodes. Then, the electrically conductive paste is baked at a temperature of about 700° C. to about 900° C., for example. Next, plating is performed on the underlayer electrodes and the lead conductors 22 - 25 to complete the external electrodes 12 . At this time, the external electrodes 12 on the side surfaces S 5 and S 6 are formed when the plating layer spreads toward surroundings of the lead electrodes 22 - 25 .
- FIG. 18 is an exploded perspective view of the multilayered body 11 of the electronic component 10 g according to the eighth preferred embodiment.
- FIG. 19A and FIG. 19B are internal plane views of the electronic component 10 g illustrated in FIG. 18 .
- An external perspective view of the electronic component 10 g is the same as that of the electronic component 10 , and thus FIG. 1 is also used.
- the electronic component 10 g includes, for example as illustrated in FIG. 1 , FIG. 18 , FIG. 19A and FIG. 19B , the multilayered body 11 , external electrodes 12 ( 12 a , 12 b ) and internal conductors 230 ( 230 a - 230 c ), 231 ( 231 a - 231 c ) (not shown in FIG. 1 ).
- the multilayered body 11 has a substantially rectangular solid shape except corners and ridges that are chamfered and form roundish shapes.
- the multilayered body 11 is constructed in such a way that a plurality of ceramic layers 17 ( 17 a - 17 g ) are stacked in order of appearance from the positive side to the negative side of the z-axis direction.
- the plural internal conductors 230 a - 230 c are provided on the top surfaces of different ceramic layers 17 b , 17 d , 17 f , respectively, and embedded inside the multilayered body 11 .
- the internal conductors 231 a and 231 b are provided on the top surfaces of different ceramic layers 17 c and 17 e , respectively, and embedded inside the multilayered body 11 .
- the internal conductor 230 and the internal conductor 231 are stacked alternately in the z-axis direction.
- the internal conductors 230 have capacitor conductors 218 ( 218 a - 218 c ) and lead conductors 220 ( 220 a - 220 c ), 222 ( 222 a - 222 c ) and 223 ( 223 a - 223 c ).
- the capacitor conductors 218 a - 218 c have substantially rectangular shapes, and are provided on the top surfaces of different ceramic layers 17 b , 17 d , 17 f , respectively, in such a way that they do not touch external edges of the corresponding ceramic layers 17 b , 17 d , 17 f.
- the lead conductors 220 a - 220 c are connected to the capacitor conductors 218 a - 218 c , respectively, and led to the end surface S 3 of the multilayered body 11 to be exposed at the end surface S 3 . More specifically, the lead conductor 220 protrudes toward the negative side of the x-axis direction from the shorter side of the capacitor conductor 218 at the negative side of the x-axis direction. Accordingly, the lead conductor 220 is led out to the shorter side of the ceramic layer 17 at the negative side of the x-axis direction.
- the lead conductors 222 a - 222 c are connected to the capacitor conductors 218 a - 218 c , respectively, and led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 . More specifically, the lead conductor 222 extends toward the positive side of the y-axis direction from a position at a further negative side of the x-axis direction than a middle point of the longer side of the capacitor conductor 218 at the positive side of the y-axis direction. Accordingly, the lead conductor 222 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of the ceramic layer 17 at the positive side of the y-axis direction.
- the lead conductors 223 a - 223 c are connected to the capacitor conductors 218 a - 218 c , respectively, and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 . More specifically, the lead conductor 223 extends toward the negative side of the y-axis direction from a position at a further negative side of the x-axis direction than a middle point of the longer side of the capacitor conductor 218 at the negative side of the y-axis direction. Accordingly, the lead conductor 223 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of the ceramic layer 17 at the negative side of the y-axis direction.
- the internal conductor 231 ( 231 a , 231 b ) includes a capacitor conductor 219 ( 219 a , 219 b ) and lead conductors 221 ( 221 a , 221 b ), 224 ( 224 a , 224 b ) and 225 ( 225 a , 225 b ).
- the capacitor conductors 219 a and 219 b have substantially rectangular shapes, and are provided on the top surfaces of the ceramic layers 17 c and 17 e , respectively, in such a way that they do not touch external edges of the corresponding ceramic layers 17 c and 17 e .
- the capacitor conductor 219 faces the capacitor conductor 218 over the ceramic layer 17 . Accordingly, capacitance (i.e., capacitor) is formed between the capacitor conductors 218 and 219 .
- the lead conductors 221 a and 221 b are connected to the capacitor conductors 219 a and 219 b , respectively, and led to the side surface S 4 of the multilayered body 11 to be exposed at the side surface S 4 . More specifically, the lead conductor 221 protrudes toward the positive side of the x-axis direction from the shorter side of the capacitor conductor 219 at the positive side of the x-axis direction. Accordingly, the lead conductor 221 is led out to the shorter side of the ceramic layer 17 at the positive side of the x-axis direction.
- the lead conductors 224 a and 224 b are connected to the capacitor conductors 219 a and 219 b , respectively, and led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 . More specifically, the lead conductor 224 extends toward the positive side of the y-axis direction from a position at a further positive side of the x-axis direction than a middle point of the longer side of the capacitor conductor 219 at the positive side of the y-axis direction. Accordingly, the lead conductor 224 is led out to a position at a further positive side of the x-axis direction than a middle point of the longer side of the ceramic layer 17 at the positive side of the y-axis direction. In other words, the lead conductor 224 is disposed at a further positive side of the x-axis direction than the lead conductor 222 in a plane viewed in the z-axis direction.
- the lead conductors 225 a and 225 b are connected to the capacitor conductors 219 a and 219 b , respectively, and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 . More specifically, the lead conductor 225 extends toward the negative side of the y-axis direction from a position at a further positive side of the x-axis direction than a middle point of the longer side of the capacitor conductor 219 at the negative side of the y-axis direction. Accordingly, the lead conductor 225 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of the ceramic layer 17 at the negative side of the y-axis direction. In other words, the lead conductor 225 is disposed at a further positive side of the x-axis direction than the lead conductor 223 in a plane viewed in the z-axis direction.
- the external electrode 12 a is arranged so as to straddle the end surface S 3 , the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 , and to connect with all the lead conductors 220 a - 220 c , 222 a - 222 c and 223 a - 223 c . More specifically, the external electrode 12 a covers the whole area of the end surface S 3 of the multilayered body 11 so as to cover portions of the lead conductors 220 a - 220 c exposed from the end surface S 3 . Furthermore, the external electrode 12 a is folded down from the end surface S 3 to the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 .
- the external electrode 12 a further covers the side surfaces S 5 and S 6 of the multilayered body 11 so as to cover portions of the lead conductors 222 a - 222 c , 223 a - 223 c exposed from the side surfaces S 5 and S 6 .
- the external electrode 12 b is arranged so as to straddle the end surface S 4 , the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 , and to connect with all the lead conductors 221 a , 221 b , 224 a , 224 b , 225 a and 225 b . More specifically, the external electrode 12 b covers the whole area of the end surface S 4 of the multilayered body 11 so as to cover portions of the lead conductors 221 a and 221 b exposed from the end surface S 4 . Furthermore, the external electrode 12 b is folded down from the end surface S 4 to the upper surface S 1 , the lower surface S 2 and the side surfaces S 5 , S 6 .
- the external electrode 12 b further covers the side surfaces S 5 and S 6 of the multilayered body 11 so as to cover portions of the lead conductors 224 a , 224 b , 225 a and 225 b exposed from the side surfaces S 5 and S 6 .
- the widths of the external electrode 12 a along the x-axis direction in the side surfaces S 5 and S 6 are wider than the widths of the external electrode 12 a along the x-axis direction in the upper surface S 1 and the lower surface S 2 .
- the widths of the external electrode 12 b along the x-axis direction in the side surfaces S 5 and S 6 are wider than the widths of the external electrode 12 b along the x-axis direction in the upper surface S 1 and the lower surface S 2 .
- the gaps D 1 between the external electrode 12 a and the external electrode 12 b in the side surfaces S 5 and S 6 are smaller than the gap D 2 between the external electrode 12 a and the external electrode 12 b in the bottom surface S 2 .
- no external electrode that retains a different electrical potential from those of the external electrodes 12 a and 12 b is provided in between the external electrodes 12 a and 12 b .
- FIG. 20 is a cross-sectional structure diagram of the substrate module 40 a.
- the substrate module 40 a includes the electronic component 10 g and a circuit substrate 51 .
- the circuit substrate 51 of FIG. 20 is the same as the circuit substrate 51 of FIG. 4A and FIG. 4B , and the description thereof is omitted.
- the electronic component 10 g is mounted on the circuit substrate 51 . More specifically, the external electrode 12 a is connected to the signal conductor 54 by the solder 60 a . The external electrode 12 b is connected to the ground conductor 55 by the solder 60 b.
- the insertion loss in the high frequency bands may be reduced in a similar way as in the electronic component 10 .
- the possibility of a short-circuit may be reduced with the electronic component 10 g when mounting on the circuit substrate 51 .
- the reduction of ESL may be achieved with the electronic component 10 g in a similar way as in the electronic component 10 .
- the possibility of delamination may be reduced in a similar way as in the electronic component 10 .
- the lead electrodes 220 and 221 are not exposed at the corners of the multilayered body 11 in a similar way as in the electronic component 10 . Accordingly, the moisture resistance of the electronic component 10 g may be improved.
- FIG. 21A and FIG. 21B are internal plane views of the electronic component 10 h according to the ninth preferred embodiment.
- An external perspective view of the electronic component 10 h is the same as that of the electronic component 10 , and thus FIG. 1 is also used.
- a difference between the electronic component 10 g and the electronic component 10 h lies in whether or not there are lead electrodes 272 ( 272 a - 272 c ), 273 ( 273 a - 273 c ), 274 ( 274 a - 274 c ) and 275 ( 275 a , 275 b ).
- the lead conductor 272 is connected to a connecting conductor 220 , and led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 .
- the lead conductor 272 is not in contact with the shorter side of the ceramic layer 17 at the negative side of the x-axis direction.
- the lead conductor 273 is connected to a connecting conductor 220 , and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 .
- the lead conductor 273 is not in contact with the shorter side of the ceramic layer 17 at the negative side of the x-axis direction.
- the lead conductor 274 is connected to a connecting conductor 221 , and led to the side surface S 5 of the multilayered body 11 to be exposed at the side surface S 5 .
- the lead conductor 274 is not in contact with the shorter side of the ceramic layer 17 at the positive side of the x-axis direction.
- the lead conductor 275 is connected to a connecting conductor 221 , and led to the side surface S 6 of the multilayered body 11 to be exposed at the side surface S 6 .
- the lead conductor 275 is not in contact with the shorter side of the ceramic layer 17 at the positive side of the x-axis direction.
- the electronic component 10 h is provided with the lead conductors 272 - 275 , more electric current flow paths are available in the electronic component 10 h than the electronic component 10 g . As a result, in the electronic component 10 h , the reduction of ESL is achieved more effectively.
- FIG. 22A and FIG. 22B are internal plane views of the electronic component 10 i according to the tenth preferred embodiment.
- the electronic component 10 i differs from the electronic component 10 g in not having the lead conductors 223 and 225 .
- the electronic component 10 i is mounted on the circuit substrate 51 in such a way that the side surface S 5 faces the circuit substrate 51 .
- FIG. 23 is an external perspective view of the electronic component 10 j according to the eleventh preferred embodiment.
- the external electrodes 12 a and the external electrodes 12 b each cover edges between the upper surface S 1 and the side surfaces S 5 , S 6 and edges between the lower surface S 2 and the side surfaces S 5 , S 6 .
- the external electrodes 12 a and 12 b are folded down from the side surfaces S 5 and S 6 to the upper surface S 1 and the lower surface S 2 .
- the y-axis direction widths of the folded-down portions of the external electrodes 12 a and 12 b , which are folded down on the upper surface S 1 and the lower surface S 2 do not exceed about one-quarter of the width of the multilayered body 11 along the y-axis direction. According to the above, the possibility of a short-circuit may be reduced when the electronic component 10 j is mounted on the circuit substrate 51 .
- any one of the internal structures of the electronic components 10 , 10 a - 10 j may be adopted.
- FIG. 24 is an external perspective view of the electronic component 10 k according to the twelfth preferred embodiment.
- the gaps D 1 between the external electrode 12 a and the external electrode 12 b in the side surfaces S 5 and S 6 may be set to equal to or approximately the same as the gap D 2 between the external electrode 12 a and the external electrode 12 b in the bottom surface S 2 .
- Preferred embodiments of the present invention are not limited to the electronic components 10 , 10 a - 10 k and the substrate modules 40 , 40 a described above, and modifications may be possible within the scope of the present invention.
- a resin material such as epoxy resin, polypropylene, etc. may be used.
- preferred embodiments of the present invention are useful for electronic components and substrate modules, and particularly valuable to significantly reduce the insertion loss in the high frequency bands.
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Abstract
Description
- 1. Field of the Invention
- The present invention relates to an electronic component and a substrate module, and more particularly to an electronic component and a substrate module, which include a built-in capacitor.
- 2. Description of the Related Art
- As a related electronic component, for example, a multilayer ceramic capacitor disclosed in Japanese Unexamined Patent Application Publication No. 2000-306762 is known.
FIG. 25 is a cross-sectional structure diagram of a multilayerceramic capacitor 500 disclosed therein. - The multilayer
ceramic capacitor 500 includesdielectric layers 502,internal electrode layers 504 a, 504 b and terminal electrodes 506 a, 506 b. - The
dielectric layers 502 are stacked and form a multilayered body. Theinternal electrode layers 504 a and 504 b are included inside the multilayered body, and form a capacitor by facing each other over thedielectric layer 502. Theinternal electrode layers 504 a and 504 b are each led out to an opposite end surface of the multilayered body. The terminal electrodes 506 a and 506 b are each provided on the opposite end surface of the multilayered body, and connect to theinternal electrode layers 504 a and 504 b, respectively. - With regard to the multilayer
ceramic capacitor 500, there is a need to reduce the insertion loss in high frequency bands. - Preferred embodiments of the present invention provide an electronic component and a substrate module, which are significantly reduce insertion loss in high frequency bands.
- According to a preferred embodiment of the present invention, an electronic component includes a multilayered body having a substantially rectangular solid shape and including a plurality of dielectric layers stacked on each other; a plurality of first capacitor conductors each being provided on a different one of the dielectric layers; a plurality of first lead conductors each connected to the first capacitor conductor and being led out to a first end surface of the multilayered body; a plurality of third lead conductors each connected to the first capacitor conductor and being led out to a first side surface of the multilayered body, the third lead conductor not touching the first lead conductor; a plurality of second capacitor conductors each being provided on a different one of the dielectric layers; a plurality of second lead conductors each connected to the second capacitor conductor and being led out to a second end surface of the multilayered body; a plurality of fourth lead conductors each connected to the second capacitor conductor and being led out to the first side surface, the fourth lead conductor not touching the second lead conductor; a third capacitor conductor provided on the dielectric layer, the third capacitor conductor facing the first capacitor conductor and the second capacitor conductor over the dielectric layer; a first external electrode arranged so as to straddle the first end surface, the first side surface and a bottom surface of the multilayered body, the first external electrode connected to the plurality of first lead conductors and the plurality of third lead conductors; and a second external electrode arranged so as to straddle the second end surface, the first side surface and the bottom surface, the second external electrode connected to the plurality of second lead conductors and the plurality of fourth lead conductors.
- According to another preferred embodiment of the present invention, an electronic component includes a multilayered body having a substantially rectangular solid shape and including a plurality of dielectric layers stacked on each other; a plurality of first capacitor conductors each being provided on a different one of the dielectric layers; a plurality of first lead conductors each connected to the first capacitor conductor and being led out to a first end surface of the multilayered body; a plurality of third lead conductors each connected to the first capacitor conductor and being led out to a first side surface of the multilayered body, the third lead conductor not touching the first lead conductor; a plurality of second capacitor conductors each being provided on a different one of the dielectric layers and facing one of the first capacitor conductors over the dielectric layer; a plurality of second lead conductors each connected to the second capacitor conductor and being led out to a second end surface of the multilayered body; a plurality of fourth lead conductors each connected to the second capacitor conductor and being led out to the first side surface, the fourth lead conductor not touching the second lead conductor; a first external electrode arranged so as to straddle the first end surface, the first side surface and a bottom surface of the multilayered body, the first external electrode connected to the plurality of first lead conductors and the plurality of third lead conductors; and a second external electrode arranged so as to straddle the second end surface, the first side surface and the bottom surface, the second external electrode connected to the plurality of second lead conductors and the plurality of fourth lead conductors.
- According to still another preferred embodiment of the present invention, a substrate module includes a circuit substrate including a first land and a second land; and an electronic component according to a preferred embodiment of the present invention described above mounted on the circuit substrate; wherein the first external electrode is connected to the first land; and the second external electrode is connected to the second land.
- According to various preferred embodiments of the present invention, the insertion loss in the high frequency bands is significantly reduced.
- The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.
-
FIG. 1 is an external perspective view of an electronic component according to a first preferred embodiment of the present invention. -
FIG. 2 is an exploded perspective view of a multilayered body of the electronic component illustrated inFIG. 1 . -
FIG. 3A andFIG. 3B are internal plane views of the electronic component illustrated inFIG. 1 . -
FIG. 4A is a cross-sectional structure diagram of a substrate module, andFIG. 4B is a plane view of the substrate module viewed from the positive side of a Z-axis direction. -
FIG. 5 is an equivalent circuit schematic of the substrate module illustrated inFIG. 4A andFIG. 4B . -
FIG. 6 is an external perspective view of an electronic component to be used as a comparative example. -
FIG. 7 is an exploded perspective view of a multilayered body of the electronic component to be used as a comparative example. -
FIG. 8 is a graph representing insertion losses (S21) of a first sample and a second sample. -
FIG. 9 is a graph representing insertion losses (S21) of a third sample and a fourth sample. -
FIG. 10 is a graph representing insertion losses (S21) of a fifth sample and a sixth sample. -
FIG. 11 is a graph representing insertion losses (S21) of a seventh sample and an eighth sample. -
FIG. 12 is an internal plane view of an electronic component according to a second preferred embodiment of the present invention. -
FIG. 13 is an internal plane view of an electronic component according to a third preferred embodiment of the present invention. -
FIG. 14 is an internal plane view of an electronic component according to a fourth preferred embodiment of the present invention. -
FIG. 15 is an internal plane view of an electronic component according to a fifth preferred embodiment of the present invention. -
FIG. 16 is an internal plane view of an electronic component according to a sixth preferred embodiment of the present invention. -
FIG. 17A andFIG. 17B are internal plane views of an electronic component according to a seventh preferred embodiment of the present invention. -
FIG. 18 is an exploded perspective view of a multilayered body of an electronic component according to an eighth preferred embodiment of the present invention. -
FIG. 19A andFIG. 19B are internal plane views of an electronic component ofFIG. 18 . -
FIG. 20 is a cross-sectional structure diagram of a substrate module. -
FIG. 21A andFIG. 21B are internal plane views of an electronic component according to a ninth preferred embodiment of the present invention. -
FIG. 22A andFIG. 22B are internal plane views of an electronic component according to a tenth preferred embodiment of the present invention. -
FIG. 23 is an external perspective view of an electronic component according to an eleventh preferred embodiment of the present invention. -
FIG. 24 is an external perspective view of an electronic component according to a twelfth preferred embodiment of the present invention. -
FIG. 25 is a cross-sectional structure diagram of the multilayer ceramic capacitor disclosed in Japanese Unexamined Patent Application Publication No. 2000-306762. - Preferred embodiments of an electronic component and a substrate module according to the present invention will be described below with reference to drawings.
- A structure of an electronic component according to the first preferred embodiment will be described with reference to drawings.
FIG. 1 is an external perspective view of theelectronic component 10 according to the first preferred embodiment.FIG. 2 is an exploded perspective view of amultilayered body 11 of theelectronic component 10 illustrated inFIG. 1 .FIG. 3A andFIG. 3B are internal plane views of theelectronic component 10 illustrated inFIG. 1 . Below, a stacking direction in themultilayered body 11 is defined as a Z-axis. An x-direction is defined as a direction in which a longer side of themultilayered body 11 extends in a plane view when themultilayered body 11 is viewed along the Z-axis direction. A y-direction is defined as a direction in which a shorter side of themultilayered body 11 extends in a plane view when themultilayered body 11 is viewed along the Z-axis direction. - The
electronic component 10 is, for example, a chip capacitor and includes, for example as illustrated inFIG. 1 toFIG. 3A andFIG. 3B , themultilayered body 11, external electrodes 12 (12 a, 12 b) and internal conductors 30 (30 a-30 c), 31 (31 a-31 c), 32 (32 a, 32 b) (not shown inFIG. 1 ). - The
multilayered body 11 preferably has a substantially rectangular solid shape except corners and ridges that are chamfered and define roundish shapes, for example. Below, in themultilayered body 11, a surface at the positive side of the z-axis direction is defined as an upper surface S1, and a surface at the negative side of the z-axis direction is defined as a lower surface S2. Furthermore, a surface at the negative side of the x-axis direction is defined as an end surface S3, and a surface at the positive side of the x-axis direction is defined as an end surface S4. Furthermore, a surface at the positive side of the y-axis direction is defined as a side surface S5, and a surface at the negative side of the y-axis direction is defined as a side surface S6. - As illustrated in
FIG. 2 , themultilayered body 11 is constructed in such a way that a plurality of ceramic layers 17 (17 a-17 g) are stacked in order of appearance from the positive side to the negative side of the z-axis direction. Theceramic layer 17 preferably has a substantially rectangular shape and is made of dielectric ceramic. Below, a principle surface of theceramic layer 17 at the positive side of the z-axis direction is referred to as a top surface, and a principle surface of theceramic layer 17 at the negative side of the z-axis direction is referred to as a back surface. - The upper surface S1 of the
multilayered body 11 is constructed of the top surface of theceramic layer 17 arranged at the most positive side of the z-axis direction. The lower surface S2 of themultilayered body 11 is constructed of the back surface of theceramic layer 17 arranged at the most negative side of the z-axis direction. Furthermore, the end surface S3 is constructed of stacked shorter sides of theceramic layers 17 a-17 g at the most negative side of the x-axis direction. The end surface S4 is constructed of stacked shorter sides of theceramic layers 17 a-17 g at the most positive side of the x-axis direction. The side surface S5 is constructed of stacked longer sides of theceramic layers 17 a-17 g at the most positive side of the y-axis direction. The side surface S6 is constructed of stacked longer sides of theceramic layers 17 a-17 g at the most negative side of the y-axis direction. - As illustrated in
FIG. 2 andFIG. 3A , the pluralinternal conductors 30 a-30 c, 31 a-31 c are provided on the top surfaces of the differentceramic layers multilayered body 11. Furthermore, as illustrated inFIG. 2 andFIG. 3B , theinternal conductors ceramic layers multilayered body 11. In other words, theinternal conductors internal conductors 32 are stacked alternately in the z-axis direction. - The internal conductor 30 (30 a-30 c) includes a capacitor conductor 18 (18 a-18 c) and lead conductors 20 (20 a-20 c), (22 a-22 c) and 23 (23 a-23 c). The
capacitor conductors 18 a-18 c have substantially rectangular shapes, and are arranged on the top surfaces of differentceramic layers ceramic layers capacitor conductor 18 is provided within an area of theceramic layer 17, which is about one-half of the whole area of theceramic layer 17 at the negative side of the x-axis direction. - The
lead conductors 20 a-20 c are connected to thecapacitor conductors 18 a-18 c, respectively, and led to the end surface S3 of themultilayered body 11 to be exposed at the end surface S3. More specifically, thelead conductor 20 protrudes toward the negative side of the x-axis direction from the longer side of thecapacitor conductor 18 at the negative side of the x-axis direction. Accordingly, thelead conductor 20 is led out to the shorter side of theceramic layer 17 at the negative side of the x-axis direction. The width of thelead conductor 20 in the y-axis direction is substantially the same as the width of thecapacitor conductor 18 in the y-axis direction. - The
lead conductors 22 a-22 c are connected to thecapacitor conductors 18 a-18 c, respectively, and are led to the side surface S5 of themultilayered body 11 to be exposed at the side surface S5. More specifically, thelead conductor 22 extends toward the positive side of the y-axis direction from an end at the positive side of the x-axis direction of the shorter side of thecapacitor conductor 18 at the positive side of the y-axis direction. Accordingly, thelead conductor 22 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of theceramic layer 17 at the positive side of the y-axis direction. Thelead conductor 22 does not touch thelead conductor 20. - The
lead conductors 23 a-23 c are connected to thecorresponding capacitor conductors 18 a-18 c, respectively, and led to the side surface S6 of themultilayered body 11 to be exposed at the side surface S6. More specifically, thelead conductor 23 extends toward the negative side of the y-axis direction from an end at the positive side of the x-axis direction of the shorter side of thecapacitor conductor 18 at the negative side of the y-axis direction. Accordingly, thelead conductor 23 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of theceramic layer 17 at the negative side of the y-axis direction. Thelead conductor 23 does not touch thelead conductor 20. - The internal conductor 31 (31 a-31 c) includes a capacitor conductor 19 (19 a-19 c) and lead conductors 21 (21 a-21 c), (24 a-24 c) and 25 (25 a-25 c). The
capacitor conductors 19 a-19 c have substantially rectangular shapes, and are arranged on the top surfaces of differentceramic layers ceramic layers capacitor conductor 19 is provided within an area of theceramic layer 17, which is one-half of the whole area of theceramic layer 17 at the positive side of the x-axis direction. Thecapacitor conductors ceramic layer 17, and face each other. - The lead conductors 21 a-21 c are connected to the
corresponding capacitor conductors 19 a-19 c, respectively, and led to the end surface S4 of themultilayered body 11 to be exposed at the end surface S4. More specifically, the lead conductor 21 protrudes toward the positive side of the x-axis direction from the longer side of thecapacitor conductor 19 at the positive side of the x-axis direction. Accordingly, the lead conductor 21 is led out to the shorter side of theceramic layer 17 at the positive side of the x-axis direction. The width of the lead conductor 21 in the y-axis direction is substantially the same as the width of thecapacitor conductor 19 in the y-axis direction. - The
lead conductors 24 a-24 c are connected to thecapacitor conductors 19 a-19 c, respectively, and led to the side surface S5 of themultilayered body 11 to be exposed at the side surface S5. More specifically, thelead conductor 24 extends toward the positive side of the y-axis direction from an end at the negative side of the x-axis direction in the shorter side of thecapacitor conductor 19 at the positive side of the y-axis direction. Accordingly, thelead conductor 24 is led out to a position at a further positive side of the x-axis direction than the middle point of the longer side of theceramic layer 17 at the positive side of the y-axis direction. In other words, thelead conductor 24 is disposed at a further positive side of the x-axis direction than thelead conductor 22 in a plane viewed in the z-axis direction. Thelead conductor 24 does not touch the lead conductor 21. - The
lead conductors 25 a-25 c are connected to thecapacitor conductors 19 a-19 c, respectively, and led to the side surface S6 of themultilayered body 11 to be exposed at the side surface S6. More specifically, thelead conductor 25 extends toward the negative side of the y-axis direction from an end at the negative side of the x-axis direction of the shorter side of thecapacitor conductor 19 at the negative side of the y-axis direction. Accordingly, thelead conductor 25 is led out to a position at a further positive side of the x-axis direction than a middle point of the longer side of theceramic layer 17 at the negative side of the y-axis direction. In other words, thelead conductor 25 is disposed at a further positive side of the x-axis direction than thelead conductor 23 in a plane viewed in the z-axis direction. Thelead conductor 25 does not touch the lead conductor 21. - The
internal conductors ceramic layers ceramic layers internal conductor 32 is provided on the top surface of theceramic layer 17 that is different from theceramic layer 17 in which thecapacitor conductors capacitor conductors ceramic layer 17. As a result, capacitors are defined between thecapacitor conductor 18 and theinternal conductor 32 and between thecapacitor conductor 19 and theinternal conductor 32. The capacitor located between thecapacitor conductor 18 and theinternal conductor 32 is connected in series to the capacitor formed between thecapacitor conductor 19 and theinternal conductor 32. - The
external electrode 12 a is arranged so as to straddle the end surface S3, the upper surface S1, the lower surface S2 and the side surfaces S5, S6, and to connect with all thelead conductors 20 a-20 c, 22 a-22 c and 23 a-23 c. More specifically, theexternal electrode 12 a covers the whole area of the end surface S3 of themultilayered body 11 so as to cover portions of thelead conductors 20 a-20 c exposed from the end surface S3. Furthermore, theexternal electrode 12 a is folded down from the end surface S3 to the upper surface S1, the lower surface S2 and the side surfaces S5, S6. Theexternal electrode 12 a covers the side surfaces S5 and S6 of themultilayered body 11 so as to cover portions of thelead conductors 22 a-22 c, 23 a-23 c exposed from the side surfaces S5 and S6. - The
external electrode 12 b is arranged so as to straddle the end surface S4, the upper surface S1, the lower surface S2 and the side surfaces S5, S6, and to connect with all the lead conductors 21 a-21 c, 24 a-24 c and 25 a-25 c. More specifically, theexternal electrode 12 b covers the whole area of the end surface S4 of themultilayered body 11 so as to cover portions of the lead conductors 21 a-21 c exposed from the end surface S4. Furthermore, theexternal electrode 12 b is folded down from the end surface S4 to the upper surface S1, the lower surface S2 and the side surfaces S5, S6. Theexternal electrode 12 b covers the side surfaces S5 and S6 of themultilayered body 11 so as to cover portions of thelead conductors 24 a-24 c, 25 a-25 c exposed from the side surfaces S5 and S6. - Note that, as illustrated in
FIG. 1 , the widths of theexternal electrode 12 a along the x-axis direction in the side surfaces S5 and S6 are wider than the widths of theexternal electrode 12 a along the x-axis direction in the upper surface S1 and the lower surface S2. Similarly, the widths of theexternal electrode 12 b along the x-axis direction in the side surfaces S5 and S6 are wider than the widths of theexternal electrode 12 b along the x-axis direction in the upper surface S1 and the lower surface S2. According to the above, gaps D1 between theexternal electrode 12 a and theexternal electrode 12 b in the side surfaces S5 and S6 are smaller than a gap D2 between theexternal electrode 12 a and theexternal electrode 12 b in the bottom surface S2. - Furthermore, in the side surface S5 and S6, no external electrode that retains a different electrical potential from those of the
external electrodes external electrode 12 a and theexternal electrode 12 b. In other words, there is no external electrode provided between theexternal electrodes - A non-limiting example of a method for manufacturing the
electronic component 10 is described. As the drawings,FIG. 1 ,FIG. 2 ,FIG. 3A andFIG. 3B are used. - First, BaTiO3, CaTiO3, SrTiO3 or CaZrO3, which is used as a primary component, and a Mn compound, a Mg compound, a Si compound, a Co compound, a Ni compound or a rare earth compound, which is used as an accessory component, are weighed at a predetermined ratio and are then put in a ball mill, and wet mixing is performed. An obtained mixture is dried and pulverized. Then, an obtained powder is calcined. After a calcined powder is wet-pulverized by a ball mill, drying and pulverizing are performed to obtain a dielectric ceramic powder.
- To this dielectric ceramic powder, an organic binder and an organic solvent are added, and mixing is then performed using a ball mill. An obtained ceramic slurry is formed into sheets on a carrier sheet by a doctor blade method. The sheets are then dried to form ceramic green sheets that are to be used as the ceramic layers 17. The thickness of the
ceramic layer 17 after the firing is preferably about 0.5 μm to about 10 μm, for example. - Next, the internal conductors 30-32 are formed on the ceramic green sheets, which are to be formed into the
ceramic layers 17, by applying a paste including a conductive material using a method such as a screen printing or a photolithographic method. As the paste including a conductive material, for example, a paste formed by adding an organic binder and an organic solvent to a metal powder may preferably be used. The metal powder may be, for example, Ni, Cu, Ag, Pd, Ag—Pd alloy, Au or the like. The thicknesses of the internal conductors 30-32 after the firing are preferably about 0.3 μm to about 2.0 μm, for example. - The ceramic green sheets that are to be formed into the
ceramic layers 17 are stacked to obtain a non-fired mother multilayered body. Subsequently, pressure bonding is performed on the non-fired mother multilayered body by using a hydrostatic pressure press. - The non-fired mother multilayered body is cut to predetermined sizes to obtain a plurality of non-fired
multilayered bodies 11. Subsequently, a barrel polishing process is performed on the surfaces of themultilayered body 11. - The non-fired
multilayered body 11 is fired. As the firing temperature, for example, a temperature of about 900° C. to about 1,300° C., for example, is preferable. With the foregoing steps, the preparation of themultilayered body 11 is completed. - Next, the
external electrode 12 is formed on themultilayered body 11. More specifically, an electrically conductive paste is applied on the surfaces of themultilayered body 11 by using a well-known dip method, a slit method or the like. The electrically conductive paste is then baked at a temperature of about 700° C. to about 900° C., for example, to produce an underlayer electrode of theexternal electrode 12. As a material for the electrically conductive paste, Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example. The thickness of the underlayer electrode is preferably about 10 μm to about 50 μm, for example. Next, plating is performed on the underlayer electrode to complete theexternal electrode 12. As a material for the plating, Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example. The plating may be repeated plural times to form layers of the plating on the underlayer electrode. With the foregoing steps, theelectronic component 10 is completed. - A method for manufacturing the
electronic component 10 is described. As the drawings,FIG. 1 ,FIG. 2 ,FIG. 3A and FIG. 3B are used. - First, BaTiO3, CaTiO3, SrTiO3 or CaZrO3, which is used as a primary component, and a Mn compound, a Mg compound, a Si compound, a Co compound, a Ni compound or a rare earth compound, which is used as an accessory component, are weighed at a predetermined ratio and are then put in a ball mill, and wet mixing is performed. An obtained mixture is dried and pulverized. Then, an obtained powder is calcined. After a calcined powder is wet-pulverized by a ball mill, drying and pulverizing are performed to obtain a dielectric ceramic powder.
- To this dielectric ceramic powder, an organic binder and an organic solvent are added, and mixing is then performed using a ball mill. An obtained ceramic slurry is formed into sheets on a carrier sheet by a doctor blade method. The sheets are then dried to form ceramic green sheets that are to be used as the ceramic layers 17. The thickness of the
ceramic layer 17 after the firing is preferably about 0.5 μm to about 10 μm, for example. - Next, the internal conductors 30-32 are formed on the ceramic green sheets which are to be formed into the
ceramic layers 17 by applying a paste including a conductive material using a method such as a screen printing or a photolithographic method. As the paste including a conductive material, for example, a paste formed by adding an organic binder and an organic solvent to a metal powder may preferably be used. The metal powder may be, for example, Ni, Cu, Ag, Pd, Ag—Pd alloy, Au or other suitable material. The thicknesses of the internal conductors 30-32 after the firing are preferably about 0.3 μm to about 2.0 μm, for example. - The ceramic green sheets that are to be formed into the
ceramic layers 17 are stacked to obtain a non-fired mother multilayered body. Subsequently, pressure bonding is performed on the non-fired mother multilayered body by using a hydrostatic pressure press. - The non-fired mother multilayered body is cut to predetermined sizes to obtain a plurality of non-fired
multilayered bodies 11. Subsequently, a barrel polishing process is performed on the surfaces of themultilayered body 11. - The non-fired
multilayered body 11 is fired. As the firing temperature, for example, a temperature of about 900° C. to about 1,300° C., for example, is preferable. With the foregoing steps, the preparation of themultilayered body 11 is completed. - Next, the
external electrode 12 is formed on themultilayered body 11. More specifically, an electrically conductive paste is applied on the surfaces of themultilayered body 11 by using a well-known dip method, a slit method or the like. The electrically conductive paste is then baked at a temperature of about 700° C. to about 900° C., for example, to produce an underlayer electrode of theexternal electrode 12. As a material for the electrically conductive paste, Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example. The thickness of the underlayer electrode is preferably about 10 μm to about 50 μm, for example. Next, plating is performed on the underlayer electrode to complete theexternal electrode 12. As a material for the plating, Cu, Ni, Ag, Pd, Ag—Pd alloy, Au or the like may be used, for example. The plating may be repeated plural times to form layers of the plating on the underlayer electrode. With the foregoing steps, theelectronic component 10 is completed. - A
substrate module 40 including theelectronic component 10 is described with reference to the drawings.FIG. 4A is a cross-sectional structure diagram of thesubstrate module 40, andFIG. 4B is a plane view of thesubstrate module 40 viewed from the positive side of a Z-axis direction.FIG. 5 is an equivalent circuit schematic of thesubstrate module 40 ofFIG. 4A andFIG. 4B . - As illustrated in
FIG. 4A , thesubstrate module 40 includes theelectronic component 10 and acircuit substrate 51. Thecircuit substrate 51 includes asubstrate body 52, asignal conductor 54, aground electrode 55, a via-hole conductor 56 and a ground conductor G. - The
substrate body 52 is a multilayer substrate including a plurality of ceramic layers and conductor layers stacked on each other, and includes electronic circuitry on its principle surface and therein. Thesignal conductor 54 is provided on the principle surface of thesubstrate body 52 at the positive side of the z-axis direction, and extends in the y-axis direction as illustrated inFIG. 4B . On an end of thesignal conductor 54 at the positive side of the y-axis direction, an input port P1 (not shown in the figure) is provided. On an end of thesignal conductor 54 at the negative side of the y-axis direction, an output port P2 (not shown in the figure) is provided. Theground electrode 55 is provided on the principle surface of thecircuit substrate 51 at the positive side of the z-axis direction, and has a substantially rectangular shape as illustrated inFIG. 4B . - The ground conductor G is provided in the
substrate body 52 and kept at the ground potential. The ground conductor G connects to a ground port P3, which is not shown in the figure. The via-hole conductor 56 is provided in thesubstrate body 52, and connects to theground electrode 55 and the ground conductor G. According to the above, theground electrode 55 is also kept at the ground potential. - The
electronic component 10 is mounted on thecircuit substrate 51. More specifically, theexternal electrode 12 a is connected to thesignal conductor 54 by asolder 60 a. Similarly, theexternal electrode 12 b is connected to theground conductor 55 by asolder 60 b. Accordingly, thesubstrate module 40 has a circuit structure illustrated inFIG. 5 . In other words, thesignal conductor 54 connects the input port P1 and the output port P2, and theelectronic component 10 is provided between thesignal conductor 54 and the ground port P3. InFIG. 5 , a capacitor C, a resistor R and an inductor L represent the capacitance, electrical resistance and inductance that theelectronic component 10 has. Having the structure illustrated inFIG. 5 in thesubstrate module 40, a high frequency signal is input to the input port P1 and output from the output port P2. Furthermore, of the high frequency signal input from the input port P1, components of the high frequency signal equal to resonance frequencies of theelectronic component 10 are output from the ground P3 and not output from the output port P2. Note that the circuitry structure of thesubstrate module 40 is not limited to that illustrated inFIG. 5 . Alternatively, theelectronic component 10 may be provided in between the input port P1 and the output port P2 in thesubstrate module 40. - According to the
electronic component 10 described above, the insertion loss in high frequency bands may be reduced as described below.FIG. 6 is an external perspective view of anelectronic component 110 to be used as a comparative example.FIG. 7 is an exploded perspective view of amultilayered body 111 of theelectronic component 110 to be used as a comparative example. The comparative exampleelectronic component 110 has the same structure as theelectronic component 10 except that the lead electrodes 22-25 and theexternal electrodes 12 on the side surfaces S5, S6 are eliminated therefrom. Thus, in theelectronic component 110, portions substantially similar or identical to those of theelectronic component 10 are denoted by reference numerals that are produced by adding 100 to the corresponding reference numerals of theelectronic component 10. - In the comparative example
electronic component 110, a high frequency signal is input into theelectronic component 110 from a signal conductor via an external electrode 112 a and output to a ground electrode via anexternal electrode 112 b. In this arrangement, the high frequency signal flows in the order of the signal conductor, the external electrode 112 a, alead conductor 120, acapacitor conductor 118, aninternal conductor 132, acapacitor conductor 119, alead conductor 121, theexternal electrode 112 b and the ground electrode. In other words, in the comparative exampleelectronic component 110, the high frequency signal passes through only one path. - On the other hand, in the
electronic component 10, the high frequency signal is input into theelectronic component 10 from thesignal conductor 54 via theexternal electrode 12 a and output to theground electrode 55 via theexternal electrode 12 b. In this arrangement, the following first to fifth paths may be available as paths through which the high frequency signal flows. - The first path is a path such that the high frequency signal flows in the order of the
signal conductor 54, theexternal electrode 12 a, thelead conductor 20, thecapacitor conductor 18, theinternal conductor 32, thecapacitor conductor 19, the lead conductor 21, theexternal electrode 12 b and theground electrode 55. The second path is a path such that the high frequency signal flows in the order of thesignal conductor 54, theexternal electrode 12 a, thelead conductor 20, thecapacitor conductor 18, thelead conductors external electrode 12 a, theexternal electrode 12 b and theground electrode 55. The third path is a path such that the high frequency signal flows in the order of thesignal conductor 54, theexternal electrode 12 a, thelead conductors capacitor conductor 18, theinternal conductor 32, thecapacitor conductor 19, the lead conductor 21, theexternal electrode 12 b and theground electrode 55. The fourth path is a path such that the high frequency signal flows in the order of thesignal conductor 54, theexternal electrode 12 a, thelead conductors capacitor conductor 18, theinternal conductor 32, thecapacitor conductor 19, thelead conductors external electrode 12 b and theground electrode 55. The fifth path is a path such that the high frequency signal flows in the order of thesignal conductor 54, theexternal electrode 12 a, theexternal electrode 12 b and theground electrode 55. - Note that, in the second to fifth paths, the high frequency signal flows from the
external electrode 12 a to theexternal electrode 12 b by passing through inside themultilayered body 11 in between theexternal electrode 12 a and theexternal electrode 12 b. High frequency signals having frequencies higher than the first resonance point may flow through these paths. - Note that, to ensure the flow of the high frequency signals from the
external electrode 12 a to theexternal electrode 12 b, it is preferable to have no external electrode, which retains a different electrical potential from those of theexternal electrodes external electrode 12 a and theexternal electrode 12 b on the side surfaces S5, S6. - Furthermore, to ensure the flow of the high frequency signal from the
external electrode 12 a to theexternal electrode 12 b, it is preferable that the gap between theexternal electrode 12 a and theexternal electrode 12 b may be made minimal, and more preferably about 50 μm to about 200 μm, for example. - As described in the above, in comparison with the
electronic component 110, theelectronic component 10 includes more paths, i.e., the second to fifth paths. That feature may contribute to the reduction of ESL. Furthermore, that feature may result the shifting of the first resonance point and the second resonance point in theelectronic component 10 to higher frequency sides and the reduction of the insertion loss thereof in the high frequency bands, in comparison with theelectronic component 110. - When the
electronic component 10 and theelectronic component 110 are compared, the shift width of the first resonance point tends to become larger in comparison with that of the second resonance point. This may be caused by having the second to fifth paths in theelectronic component 10. In theelectronic component 10 and theelectronic component 110, the flow of high frequency signals having frequencies higher than the first resonance point may tend to concentrate in part close to thecircuit substrate 51. This may provide a relatively small capacitor in a vicinity of the lower surface, and its resonance point may appeared as the second resonance point. In theelectronic component 10, the large shifting of the second resonance point toward the higher frequency side may be caused by the particular reduction of ESL in a relatively small capacitor due to the high frequency signals flowing through the second to fifth paths. - Furthermore, when the
electronic component 10 and theelectronic component 110 are compared, a valley of the second resonance point in theelectronic component 10 tends to be shallower. - The separation of the second resonance point from the first resonance point and the shallow valley at the second resonance point as described in the above may prevent a device, which operates at a frequency between the first resonance point and the second resonance point, from malfunctioning.
- Furthermore, the possibility of a short-circuit may be reduced with the
electronic component 10 when it is mounted on thecircuit substrate 51. More specifically, the gaps D1 between theexternal electrode 12 a and theexternal electrode 12 b in the side surfaces S5 and S6 are smaller than the gap D2 between theexternal electrode 12 a and theexternal electrode 12 b in the bottom surface S2. In other words, the gap between theexternal electrode 12 a and theexternal electrode 12 b is made larger in the bottom surface S2. Thus, the risk of connecting theexternal electrode 12 a and theexternal electrode 12 b by solder is smaller. Accordingly, the possibility of a short-circuit may be reduced with theelectronic component 10 when mounting on thecircuit substrate 51. - With the
electronic component 10, the possibility of delamination may be reduced. In electronic components, delamination is prone to occur at corners of multilayered body. Particularly, in the case where lead electrodes and ceramic layers are stacked at a corner, delamination may occur between a lead electrode and a ceramic layer. In view of the above, in theelectronic component 10, thelead electrodes 20 and 21 are not led out to corners of themultilayered body 10. As a result, in theelectronic component 10, the possibility of delamination is reduced. Furthermore, in theelectronic component 10, thelead electrodes 20 and 21 are not exposed in the corners of themultilayered body 11. This improves moisture resistance of theelectronic component 10. - The inventors of the present application carried out the following experiment to further clarify advantageous effects produced by the
electronic component 10. Specifically, samples (hereinafter referred to as first sample, third sample, fifth sample and seventh sample) of theelectronic component 10 illustrated inFIG. 1 andFIG. 2 , and samples (second sample, fourth sample, sixth sample and eighth sample) of theelectronic component 110 illustrated inFIG. 6 andFIG. 7 were prepared. Subsequently, the first to eighth samples were each mounted in a circuit substrate as illustrated inFIG. 4A andFIG. 4B , and ESL and the insertion loss (S21) between the input port P1 and the output port P2 were measured by using an network analyzer (Product No. 8722D manufactured by Agilent Technologies). First, the condition of each sample is described. - Dimension: 1.60 mm (L)×0.85 mm (W)×1.70 mm (T)
- Material of the internal conductor and the external electrode: Cu
- Relative permittivity (∈) of the ceramic layer: 27
- Device thickness (gap between the
internal conductors 30, 31): 122 μm - Outer layer's thickness (distance from the
internal conductors multilayered body 11 and distance from theinternal conductors - Table 1 indicates the condition of each sample.
-
TABLE 1 EXISTENCE OF EXTERNAL GAP BETWEEN ELECTRODE 12 ANDCAPACITOR NUMBER OF LEAD CONDUCTORS CONDUCTOR 18, 19, INTERNAL 22-25 ON SIDE 118, 119 AND INTERNAL CONDUCTORS CAPACITANCE SURFACES S5, S6 CONDUCTOR 32, 132 30-32, 130-132 (pF) FIRST SAMPLE YES 77 7 3.01 SECOND SAMPLE NO 77 7 3.01 THIRD SAMPLE YES 55 9 5.13 FOURTH SAMPLE NO 55 9 5.13 FIFTH SAMPLE YES 44 11 7.61 SIXTH SAMPLE NO 44 11 7.61 SEVENTH SAMPLE YES 33 15 13.8 EIGHTH SAMPLE NO 33 15 13.8 - With the first to eighth samples with the above conditions, the following ESL values were obtained. These ESL values were measured in the frequency band from 0.5-20 GHz. Table 2 indicates the ESL values of the first to eighth samples.
-
TABLE 2 ESL (pH) FIRST SAMPLE 388 SECOND SAMPLE 489 THIRD SAMPLE 373 FOURTH SAMPLE 480 FIFTH SAMPLE 383 SIXTH SAMPLE 489 SEVENTH SAMPLE 363 EIGHTH SAMPLE 459 - According to this experiment, it is clear that the
electronic component 10 had about 20% less ESL than theelectronic component 110. -
FIG. 8 is a graph representing the insertion loss (S21) of the first sample and the second sample.FIG. 9 is a graph representing the insertion loss (S21) of the third sample and the fourth sample.FIG. 10 is a graph representing the insertion loss (S21) of the fifth sample and the sixth sample.FIG. 11 is a graph representing the insertion loss (S21) of the seventh sample and the eighth sample. The vertical axis represents the insertion loss, and the horizontal axis represents the frequency. - According to
FIG. 8 toFIG. 11 , it is clear that the first resonance points f1 of the first sample, the third sample, the fifth sample and the seventh sample are higher than the corresponding first resonance points f1 of the second sample, the fourth sample, the sixth sample and the eighth sample, respectively. Table 3 indicates the first resonance points of the first to eighth samples. -
TABLE 3 SELF-RESONANT FREQUENCY (GHz) FIRST SAMPLE 4.66 SECOND SAMPLE 4.15 THIRD SAMPLE 3.64 FOURTH SAMPLE 3.21 FIFTH SAMPLE 2.95 SIXTH SAMPLE 2.61 SEVENTH SAMPLE 2.25 EIGHTH SAMPLE 2.00 - As described in the above, according to the experiment results illustrated in
FIG. 8 toFIG. 11 , it is clear that the first resonance point f1 of theelectronic component 10 is higher than the first resonance point f1 of theelectronic component 110. Accordingly, it is clear that the high frequency characteristic of theelectronic component 10 is superior to that of theelectronic component 110. More specifically, the first resonance point f1 of theelectronic component 10 is about 10% higher than that of theelectronic component 110. - Furthermore, according to the experimental results illustrated in
FIG. 8 toFIG. 11 , it is clear that the second resonance point f2 of theelectronic component 10 is higher than that of theelectronic component 110. For example, in the graph ofFIG. 11 , the second resonance point f2 of the eighth sample is about 8 GHz while the second resonance point f2 of the seventh sample is about 10 GHz. Furthermore, the insertion loss of theelectronic component 10 at its second resonance point f2 is less than that ofelectronic component 110 at its second resonance point f2. Accordingly, with theelectronic component 10, the insertion loss in the high frequency bands is significantly reduced. - A structure of an electronic component 10 a according to the second preferred embodiment will be described below with reference to drawings.
FIG. 12 is an internal plane view of the electronic component 10 a according to the second preferred embodiment. An external perspective view of the electronic component 10 a is the same as that of theelectronic component 10, and thusFIG. 1 is also used below. - A difference between the
electronic component 10 and the electronic component 10 a lies in the shape of theinternal conductors capacitor conductors 18 and 19) of the electronic component 10 a are closer to each other than those of theelectronic component 10. According to the above, in the electronic component 10 a, areas of portions where thecapacitor conductors internal conductor 32 are larger than corresponding areas of theelectronic component 10. Accordingly, the electronic component 10 a has a significantly larger capacitance. - A structure of an
electronic component 10 b according to the third preferred embodiment will be described below with reference to drawings.FIG. 13 is an internal plane view of theelectronic component 10 b according to the third preferred embodiment. An external perspective view of theelectronic component 10 b is the same as that of theelectronic component 10, and thusFIG. 1 is also used below. - A difference between the
electronic component 10 and theelectronic component 10 b lies in whether or not there are lead electrodes 72 (72 a-72 c), 73 (73 a-73 c), 74 (74 a-74 c) and 75 (75 a-75 c). - The lead conductor 72 is connected to a connecting
conductor 20, and led to the side surface S5 of themultilayered body 11 to be exposed at the side surface S5. The lead conductor 72 is in contact with the shorter side of theceramic layer 17 at the negative side of the x-axis direction. Accordingly, the lead conductor 72 connects to theexternal electrode 12 a at the longer side at the positive side of the y-axis direction and the shorter side at the negative side of the x-axis direction of theceramic layer 17. - The lead conductor 73 is connected to a connecting
conductor 20, and led to the side surface S6 of themultilayered body 11 to be exposed at the side surface S6. The lead conductor 73 is in contact with the shorter side of theceramic layer 17 at the negative side of the x-axis direction. Accordingly, the lead conductor 73 connects to theexternal electrode 12 a at the longer side at the negative side of the y-axis direction and the shorter side at the negative side of the x-axis direction of theceramic layer 17. - The lead conductor 74 is connected to a connecting conductor 21, and led to the side surface S5 of the
multilayered body 11 to be exposed at the side surface S5. The lead conductor 74 is in contact with the shorter side of theceramic layer 17 at the positive side of the x-axis direction. Accordingly, the lead conductor 74 connects to theexternal electrode 12 b at the longer side at the positive side of the y-axis direction and the shorter side at the positive side of the x-axis direction of theceramic layer 17. - The lead conductor 75 is connected to a connecting conductor 21, and led to the side surface S6 of the
multilayered body 11 to be exposed at the side surface S6. The lead conductor 75 is in contact with the shorter side of theceramic layer 17 at the positive side of the x-axis direction. Accordingly, the lead conductor 75 is connected to theexternal electrode 12 b at the longer side at the negative side of the y-axis direction and the shorter side at the positive side of the x-axis direction of theceramic layer 17. - Since the
electronic component 10 b is provided with the lead conductors 72-75, more electric current flow paths are available in theelectronic component 10 b than theelectronic component 10. As a result, in theelectronic component 10 b, the reduction of ESL is achieved more effectively. - A structure of an
electronic component 10 c according to the fourth preferred embodiment will be described below with reference to drawings.FIG. 14 is an internal plane view of theelectronic component 10 c according to the fourth preferred embodiment. An external perspective view of theelectronic component 10 c is the same as that of theelectronic component 10, and thusFIG. 1 is also used. - A difference between the
electronic component 10 and theelectronic component 10 c lies in positions of the lead electrodes 72 (72 a-72 c), 73 (73 a-73 c), 74 (74 a-74 c) and 75 (75 a-75 c). More specifically, in theelectronic component 10 c, none of the lead conductors 72-75 is in contact with the shorter sides of theceramic layer 17 at the positive and negative sides of the x-axis direction. In other words, in the corners of theceramic layer 17, none of the lead conductors 72-75 are provided. - In the
electronic component 10 c, none of the lead conductors 72-75 is provided in the corner of themultilayered body 11. Accordingly, the possibility of delamination is significantly reduced. - A structure of an
electronic component 10 d according to the fifth preferred embodiment will be described below with reference to drawings.FIG. 15 is an internal plane view of theelectronic component 10 d according to the fifth preferred embodiment. An external perspective view of theelectronic component 10 d is the same as that of theelectronic component 10, and thusFIG. 1 is also used. - A difference between the
electronic component 10 and theelectronic component 10 d lies in the shapes of thelead conductors 20 and 21. More specifically, the widths of thelead conductors 20, 21 of theelectronic component 10 d in the y-axis direction are narrower than those of theelectronic component 10. - In the
electronic component 10 d, the widths of thelead conductors 20, 21 are narrower, and thus areas of portions of theinternal conductors multilayered body 11 are smaller. As a result, in theelectronic component 10 d, the entering of moisture into themultilayered body 11 is prevented. - A structure of an electronic component 10 e according to the sixth preferred embodiment will be described below with reference to drawings.
FIG. 16 is an internal plane view of the electronic component 10 e according to the sixth preferred embodiment. - As illustrated in
FIG. 16 , the electronic component 10 e differs from theelectronic component 10 in not having thelead conductors circuit substrate 51 in such a way that the side surface S5 faces thecircuit substrate 51. - An
electronic component 10 f according to the seventh preferred embodiment will be described below with reference to drawings.FIG. 17A andFIG. 17B are internal plane views of theelectronic component 10 f according to the seventh preferred embodiment. - As illustrated in
FIG. 17A andFIG. 17B , thicknesses of theexternal electrodes external electrodes - The
external electrode 12 may be manufactured by the following steps. First, an electrically conductive paste is applied on the end surfaces S5 and S6 of themultilayered body 11 by the use of a dip method to form underlayer electrodes. Then, the electrically conductive paste is baked at a temperature of about 700° C. to about 900° C., for example. Next, plating is performed on the underlayer electrodes and the lead conductors 22-25 to complete theexternal electrodes 12. At this time, theexternal electrodes 12 on the side surfaces S5 and S6 are formed when the plating layer spreads toward surroundings of the lead electrodes 22-25. - An
electronic component 10 g according to the eighth preferred embodiment will be described below with reference to drawings.FIG. 18 is an exploded perspective view of themultilayered body 11 of theelectronic component 10 g according to the eighth preferred embodiment.FIG. 19A andFIG. 19B are internal plane views of theelectronic component 10 g illustrated inFIG. 18 . An external perspective view of theelectronic component 10 g is the same as that of theelectronic component 10, and thusFIG. 1 is also used. - The
electronic component 10 g includes, for example as illustrated inFIG. 1 ,FIG. 18 ,FIG. 19A andFIG. 19B , themultilayered body 11, external electrodes 12 (12 a, 12 b) and internal conductors 230 (230 a-230 c), 231 (231 a-231 c) (not shown inFIG. 1 ). - The
multilayered body 11 has a substantially rectangular solid shape except corners and ridges that are chamfered and form roundish shapes. - As illustrated in
FIG. 18 , themultilayered body 11 is constructed in such a way that a plurality of ceramic layers 17 (17 a-17 g) are stacked in order of appearance from the positive side to the negative side of the z-axis direction. - As illustrated in
FIG. 18 andFIG. 19A , the pluralinternal conductors 230 a-230 c are provided on the top surfaces of differentceramic layers multilayered body 11. Theinternal conductors ceramic layers multilayered body 11. In other words, theinternal conductor 230 and the internal conductor 231 are stacked alternately in the z-axis direction. - The internal conductors 230 (230 a-230 c) have capacitor conductors 218 (218 a-218 c) and lead conductors 220 (220 a-220 c), 222 (222 a-222 c) and 223 (223 a-223 c). The
capacitor conductors 218 a-218 c have substantially rectangular shapes, and are provided on the top surfaces of differentceramic layers ceramic layers - The
lead conductors 220 a-220 c are connected to thecapacitor conductors 218 a-218 c, respectively, and led to the end surface S3 of themultilayered body 11 to be exposed at the end surface S3. More specifically, thelead conductor 220 protrudes toward the negative side of the x-axis direction from the shorter side of thecapacitor conductor 218 at the negative side of the x-axis direction. Accordingly, thelead conductor 220 is led out to the shorter side of theceramic layer 17 at the negative side of the x-axis direction. - The
lead conductors 222 a-222 c are connected to thecapacitor conductors 218 a-218 c, respectively, and led to the side surface S5 of themultilayered body 11 to be exposed at the side surface S5. More specifically, thelead conductor 222 extends toward the positive side of the y-axis direction from a position at a further negative side of the x-axis direction than a middle point of the longer side of thecapacitor conductor 218 at the positive side of the y-axis direction. Accordingly, thelead conductor 222 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of theceramic layer 17 at the positive side of the y-axis direction. - The
lead conductors 223 a-223 c are connected to thecapacitor conductors 218 a-218 c, respectively, and led to the side surface S6 of themultilayered body 11 to be exposed at the side surface S6. More specifically, thelead conductor 223 extends toward the negative side of the y-axis direction from a position at a further negative side of the x-axis direction than a middle point of the longer side of thecapacitor conductor 218 at the negative side of the y-axis direction. Accordingly, thelead conductor 223 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of theceramic layer 17 at the negative side of the y-axis direction. - The internal conductor 231 (231 a, 231 b) includes a capacitor conductor 219 (219 a, 219 b) and lead conductors 221 (221 a, 221 b), 224 (224 a, 224 b) and 225 (225 a, 225 b). The
capacitor conductors ceramic layers ceramic layers capacitor conductor 219 faces thecapacitor conductor 218 over theceramic layer 17. Accordingly, capacitance (i.e., capacitor) is formed between thecapacitor conductors - The
lead conductors capacitor conductors multilayered body 11 to be exposed at the side surface S4. More specifically, thelead conductor 221 protrudes toward the positive side of the x-axis direction from the shorter side of thecapacitor conductor 219 at the positive side of the x-axis direction. Accordingly, thelead conductor 221 is led out to the shorter side of theceramic layer 17 at the positive side of the x-axis direction. - The
lead conductors capacitor conductors multilayered body 11 to be exposed at the side surface S5. More specifically, thelead conductor 224 extends toward the positive side of the y-axis direction from a position at a further positive side of the x-axis direction than a middle point of the longer side of thecapacitor conductor 219 at the positive side of the y-axis direction. Accordingly, thelead conductor 224 is led out to a position at a further positive side of the x-axis direction than a middle point of the longer side of theceramic layer 17 at the positive side of the y-axis direction. In other words, thelead conductor 224 is disposed at a further positive side of the x-axis direction than thelead conductor 222 in a plane viewed in the z-axis direction. - The
lead conductors capacitor conductors multilayered body 11 to be exposed at the side surface S6. More specifically, thelead conductor 225 extends toward the negative side of the y-axis direction from a position at a further positive side of the x-axis direction than a middle point of the longer side of thecapacitor conductor 219 at the negative side of the y-axis direction. Accordingly, thelead conductor 225 is led out to a position at a further negative side of the x-axis direction than a middle point of the longer side of theceramic layer 17 at the negative side of the y-axis direction. In other words, thelead conductor 225 is disposed at a further positive side of the x-axis direction than thelead conductor 223 in a plane viewed in the z-axis direction. - The
external electrode 12 a is arranged so as to straddle the end surface S3, the upper surface S1, the lower surface S2 and the side surfaces S5, S6, and to connect with all thelead conductors 220 a-220 c, 222 a-222 c and 223 a-223 c. More specifically, theexternal electrode 12 a covers the whole area of the end surface S3 of themultilayered body 11 so as to cover portions of thelead conductors 220 a-220 c exposed from the end surface S3. Furthermore, theexternal electrode 12 a is folded down from the end surface S3 to the upper surface S1, the lower surface S2 and the side surfaces S5, S6. Theexternal electrode 12 a further covers the side surfaces S5 and S6 of themultilayered body 11 so as to cover portions of thelead conductors 222 a-222 c, 223 a-223 c exposed from the side surfaces S5 and S6. - The
external electrode 12 b is arranged so as to straddle the end surface S4, the upper surface S1, the lower surface S2 and the side surfaces S5, S6, and to connect with all thelead conductors external electrode 12 b covers the whole area of the end surface S4 of themultilayered body 11 so as to cover portions of thelead conductors external electrode 12 b is folded down from the end surface S4 to the upper surface S1, the lower surface S2 and the side surfaces S5, S6. Theexternal electrode 12 b further covers the side surfaces S5 and S6 of themultilayered body 11 so as to cover portions of thelead conductors - Note that, as illustrated in
FIG. 1 , the widths of theexternal electrode 12 a along the x-axis direction in the side surfaces S5 and S6 are wider than the widths of theexternal electrode 12 a along the x-axis direction in the upper surface S1 and the lower surface S2. Similarly, the widths of theexternal electrode 12 b along the x-axis direction in the side surfaces S5 and S6 are wider than the widths of theexternal electrode 12 b along the x-axis direction in the upper surface S1 and the lower surface S2. According to the above, the gaps D1 between theexternal electrode 12 a and theexternal electrode 12 b in the side surfaces S5 and S6 are smaller than the gap D2 between theexternal electrode 12 a and theexternal electrode 12 b in the bottom surface S2. - Furthermore, in the side surface S5 and S6, no external electrode that retains a different electrical potential from those of the
external electrodes external electrodes external electrodes - A substrate module 40 a on which the
electronic component 10 g is mounted is described with reference to the drawings.FIG. 20 is a cross-sectional structure diagram of the substrate module 40 a. - As illustrated in
FIG. 20 , the substrate module 40 a includes theelectronic component 10 g and acircuit substrate 51. Thecircuit substrate 51 ofFIG. 20 is the same as thecircuit substrate 51 ofFIG. 4A andFIG. 4B , and the description thereof is omitted. - The
electronic component 10 g is mounted on thecircuit substrate 51. More specifically, theexternal electrode 12 a is connected to thesignal conductor 54 by thesolder 60 a. Theexternal electrode 12 b is connected to theground conductor 55 by thesolder 60 b. - According to the aforementioned
electronic component 10 g, the insertion loss in the high frequency bands may be reduced in a similar way as in theelectronic component 10. Furthermore, in a similar way as in theelectronic component 10, the possibility of a short-circuit may be reduced with theelectronic component 10 g when mounting on thecircuit substrate 51. Furthermore, the reduction of ESL may be achieved with theelectronic component 10 g in a similar way as in theelectronic component 10. Furthermore, in theelectronic component 10 g, the possibility of delamination may be reduced in a similar way as in theelectronic component 10. Furthermore, in theelectronic component 10 g, thelead electrodes multilayered body 11 in a similar way as in theelectronic component 10. Accordingly, the moisture resistance of theelectronic component 10 g may be improved. - A structure of an
electronic component 10 h according to the ninth preferred embodiment will be described below with reference to drawings.FIG. 21A andFIG. 21B are internal plane views of theelectronic component 10 h according to the ninth preferred embodiment. An external perspective view of theelectronic component 10 h is the same as that of theelectronic component 10, and thusFIG. 1 is also used. - A difference between the
electronic component 10 g and theelectronic component 10 h lies in whether or not there are lead electrodes 272 (272 a-272 c), 273 (273 a-273 c), 274 (274 a-274 c) and 275 (275 a, 275 b). - The lead conductor 272 is connected to a connecting
conductor 220, and led to the side surface S5 of themultilayered body 11 to be exposed at the side surface S5. The lead conductor 272 is not in contact with the shorter side of theceramic layer 17 at the negative side of the x-axis direction. - The lead conductor 273 is connected to a connecting
conductor 220, and led to the side surface S6 of themultilayered body 11 to be exposed at the side surface S6. The lead conductor 273 is not in contact with the shorter side of theceramic layer 17 at the negative side of the x-axis direction. - The lead conductor 274 is connected to a connecting
conductor 221, and led to the side surface S5 of themultilayered body 11 to be exposed at the side surface S5. The lead conductor 274 is not in contact with the shorter side of theceramic layer 17 at the positive side of the x-axis direction. - The lead conductor 275 is connected to a connecting
conductor 221, and led to the side surface S6 of themultilayered body 11 to be exposed at the side surface S6. The lead conductor 275 is not in contact with the shorter side of theceramic layer 17 at the positive side of the x-axis direction. - Since the
electronic component 10 h is provided with the lead conductors 272-275, more electric current flow paths are available in theelectronic component 10 h than theelectronic component 10 g. As a result, in theelectronic component 10 h, the reduction of ESL is achieved more effectively. - A structure of an electronic component 10 i according to the tenth preferred embodiment will be described below with reference to drawings.
FIG. 22A andFIG. 22B are internal plane views of the electronic component 10 i according to the tenth preferred embodiment. - As illustrated in
FIG. 22A andFIG. 22B , the electronic component 10 i differs from theelectronic component 10 g in not having thelead conductors circuit substrate 51 in such a way that the side surface S5 faces thecircuit substrate 51. - A structure of an electronic component 10 j according to the eleventh preferred embodiment will be described below with reference to drawings.
FIG. 23 is an external perspective view of the electronic component 10 j according to the eleventh preferred embodiment. - In the electronic component 10 j, the
external electrodes 12 a and theexternal electrodes 12 b each cover edges between the upper surface S1 and the side surfaces S5, S6 and edges between the lower surface S2 and the side surfaces S5, S6. In other words, theexternal electrodes - Note, however, that it is preferable that the y-axis direction widths of the folded-down portions of the
external electrodes multilayered body 11 along the y-axis direction. According to the above, the possibility of a short-circuit may be reduced when the electronic component 10 j is mounted on thecircuit substrate 51. - With regard to the internal structure of the electronic component 10 j, any one of the internal structures of the
electronic components - A structure of an
electronic component 10 k according to the twelfth preferred embodiment will be described below with reference to drawings.FIG. 24 is an external perspective view of theelectronic component 10 k according to the twelfth preferred embodiment. - As illustrated in
FIG. 24 , the gaps D1 between theexternal electrode 12 a and theexternal electrode 12 b in the side surfaces S5 and S6 may be set to equal to or approximately the same as the gap D2 between theexternal electrode 12 a and theexternal electrode 12 b in the bottom surface S2. - Preferred embodiments of the present invention are not limited to the
electronic components substrate modules 40, 40 a described above, and modifications may be possible within the scope of the present invention. - For example, in place of the
ceramic layer 17, a resin material such as epoxy resin, polypropylene, etc. may be used. - As mentioned in the above, preferred embodiments of the present invention are useful for electronic components and substrate modules, and particularly valuable to significantly reduce the insertion loss in the high frequency bands.
- While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
Claims (10)
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Also Published As
Publication number | Publication date |
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JP2012156471A (en) | 2012-08-16 |
JP5353911B2 (en) | 2013-11-27 |
US8576538B2 (en) | 2013-11-05 |
CN102623179A (en) | 2012-08-01 |
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