US20110214846A1 - Heat sink and method for manufacturing the same - Google Patents

Heat sink and method for manufacturing the same Download PDF

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Publication number
US20110214846A1
US20110214846A1 US12/717,980 US71798010A US2011214846A1 US 20110214846 A1 US20110214846 A1 US 20110214846A1 US 71798010 A US71798010 A US 71798010A US 2011214846 A1 US2011214846 A1 US 2011214846A1
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US
United States
Prior art keywords
heat
dissipating fins
dissipating
heat sink
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/717,980
Inventor
Yu- Po HUANG
Tung-Jung Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN JUE-CHUNG ELECTRONICS Co Ltd
Kunshan Jue Chung Electronics Co
Original Assignee
Kunshan Jue Chung Electronics Co
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Filing date
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Application filed by Kunshan Jue Chung Electronics Co filed Critical Kunshan Jue Chung Electronics Co
Priority to US12/717,980 priority Critical patent/US20110214846A1/en
Assigned to KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD. reassignment KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, YU- PO, KUO, TUNG-JUNG
Publication of US20110214846A1 publication Critical patent/US20110214846A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a heat sink, and in particular to a heat sink and a method for manufacturing the same.
  • the conventional heat sink is constituted of a plurality of heat-dissipating fins. These heat-dissipating fins are mostly made of copper or aluminum. Although the copper-made heat-dissipating fins have the better heat-dissipating efficiency, however, the total weight and cost of such copper-made heat-dissipating fins are large. Although the aluminum-made heat-dissipating fins have a smaller weight and cost, the heat-dissipating efficiency is inferior to that of the copper-made heat-dissipating fins.
  • the present inventor proposes a novel heat sink based on his expert experience and delicate researches.
  • the present invention is to provide a heat sink and a method for manufacturing the same, whereby the heat-dissipating area and thus the heat-dissipating efficiency of the heat sink can be increased greatly, and the stability and soldering ability of different materials can be improved.
  • the present invention further provides a heat sink including a plurality of heat-dissipating fins.
  • One surface of each of the heat-dissipating fins is formed with a metallic coating layer by spraying. At least one end of any one of the heat-dissipating fins is bent to have a fold. Any two adjacent heat-dissipating fins are connected to each other by stacking the respective folds.
  • the present invention provides a method for manufacturing a heat sink, which including steps of: a) preparing a metallic belt; b) providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt; c) providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and d) stacking a plurality of heat-dissipating fins to form the heat sink.
  • the present invention has advantageous features as follows.
  • the surface of aluminum-made heat-dissipating fins are directly sprayed with a copper layer, so that the heat-dissipating fins need not be subjected to a nickel-plating process, which conforms to the requirements for environmental protection and reduces the material cost and manufacturing time.
  • FIG. 1 is a flow chart showing the steps of the method for manufacturing a heat sink according to the present invention
  • FIG. 2 is a schematic view showing a metallic belt of the present invention is sprayed by a spraying device
  • FIG. 3 is a perspective view showing the external appearance of a heat-dissipating fin of the present invention
  • FIG. 4 is an exploded perspective view showing a heat-dissipating fin assembly and a heat-conducting plate of the present invention
  • FIG. 5 is an assembled view showing the heat-dissipating fin assembly and the heat-conducting plate of the present invention
  • FIG. 6 is an assembled cross-sectional view showing the heat-dissipating fin assembly and the heat-conducting plate of the present invention
  • FIG. 7 is a partially enlarged view of the portion A in FIG. 6 ;
  • FIG. 8 is an assembled view showing another embodiment of the heat sink according to the present invention.
  • the present invention provides a heat sink, which is formed by stacking a plurality of heat-dissipating fins 10 .
  • Each of the heat-dissipating fins 10 is made of a material having good heat conductivity such as aluminum or the alloys thereof.
  • One surface 11 of any one heat-dissipating fin 10 is sprayed to form a metallic coating layer 20 .
  • the metallic coating layer 20 may be made of a material having good heat conductivity such as nickel, copper or the alloys thereof. Further, the metallic coating layer 20 forms a rugged configuration on the surface 11 of the heat-dissipating fin 10 .
  • each heat-dissipating fin 10 is bent to form two folds 12 , 13 respectively that correspond to each other.
  • the folds 12 and 13 and an adjacent heat-dissipating fin 10 together form a partitioning channel 14 .
  • the metallic coating layer 20 is formed on the outside surface of each heat-dissipating fin 10 after bending.
  • the heat-dissipating fin 10 may have only one fold 12 or 13 (not shown).
  • the heat sink of the present invention includes a heat-conducting plate 30 , which is made of a material having good heat conductivity such as copper or the alloys thereof.
  • the metallic coating layer 20 formed outside the fold 12 is tightly adhered to the surface of the heat-conducting plate 30 , and then connected to each other by heating.
  • the present invention provides a method for manufacturing a heat sink, which includes steps as follows:
  • a metallic belt 100 is prepared, which is made of a material having good heat conductivity such as aluminum or the alloys thereof.
  • step b) a spraying device 6 is provided for spraying a metallic coating layer 20 on one surface of the metallic belt 100 .
  • This spraying step is performed by a Cu plasma injection on the whole or partial surface of the metallic belt 100 .
  • a stamping device is provided for blanking the metallic belt 100 a subjected to the step b) to form a heat-dissipating fin 10 .
  • the heat-dissipating fin 10 is formed into a U shape with its upper and lower ends being bent to form two folds 12 and 13 respectively that correspond to each other.
  • one of the folds 12 (or 13 ) can be provided with a trough 15 (as shown in FIG. 8 ).
  • the heat-dissipating fin 10 can be formed into other geometrical shapes, but not limited to the specific form shown in the drawings.
  • the upper fold 12 may not be provided.
  • step d a plurality of heat-dissipating fins 10 are stacked to form the heat sink.
  • the two folds 12 and 13 of any two adjacent heat-dissipating fins 10 are stacked in such a manner that a partitioning channel 14 (as shown in FIG. 6 ) is formed between the adjacent heat-dissipating fins 10 .
  • the method of the present invention further includes a step e) after the step d).
  • a heat-conducting plate 30 is provided, on which the heat-dissipating fins 10 are disposed.
  • the method of the present invention further includes a step f) after the step e).
  • a heating device is provided for heating the heat-dissipating fins 10 and the heat-conducting plate 30 , thereby connecting the heat-dissipating fins 10 and the heat-conducting plate 30 with the metallic coating layer 20 .
  • the metallic coating layer 20 is heated to be soldered to the heat-dissipating fins 10 and the heat-conducting plate 30 .
  • the method of the present invention further includes a step e′) to replace the step e).
  • a heat pipe 40 is provided in the step e′.
  • One end of the heat pipe 40 penetrates the trough 15 (as shown in FIG. 8 ).
  • the method of the present invention further includes a step f′) after the step e′).
  • a heating device is provided for heating the heat-dissipating fins 10 and the heat pipe 40 , thereby connecting the heat-dissipating fins 10 and the heat pipe 40 with the metallic coating layer 20 (as shown in FIG. 8 ).
  • the metallic coating layer 20 is heated to be soldered to the heat-dissipating fins 10 and the heat pipe 40 .
  • the heat sink of the present invention further includes a heat-conducting plate 30 and a heat pipe 40 .
  • the center of the lower fold 13 of each heat-dissipating fin 10 is provided with a trough 15 .
  • the heat-conducting plate 30 is provided with a groove 31 . Since the metallic coating layer 20 is sprayed on the respective heat-dissipating fins 10 , after one end of the heat pipe 40 penetrates the trough 15 , the metallic coating layer 20 is heated to be connected with the heat pipe 40 . The other end of the heat pipe 40 penetrates the groove 31 of the heat-conducting plate 30 . In this way, the heat pipe 40 can be combined with the heat-conducting plate 30 to form another embodiment of the heat sink according to the present invention.

Abstract

A method for manufacturing a heat sink includes steps of: preparing a metallic belt; providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt; providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and stacking a plurality of heat-dissipating fins to form the heat sink. In this way, the heat-dissipating area and efficiency of the heat sink can be increased. The stability and soldering ability of different materials can be improved. The present invention further provides a heat sink.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat sink, and in particular to a heat sink and a method for manufacturing the same.
  • 2. Description of Prior Art
  • With the increase of the operating speed of a processor (such as: CPU) in a computer, the amount of heat generated by the processor also increases accordingly. On the other hand, since an electronic product having such a processor is required to be made more compact, the heat sink associated with the processor has to be designed to meet the requirements for miniaturization, which becomes an important issue for the manufacturers in this art.
  • The conventional heat sink is constituted of a plurality of heat-dissipating fins. These heat-dissipating fins are mostly made of copper or aluminum. Although the copper-made heat-dissipating fins have the better heat-dissipating efficiency, however, the total weight and cost of such copper-made heat-dissipating fins are large. Although the aluminum-made heat-dissipating fins have a smaller weight and cost, the heat-dissipating efficiency is inferior to that of the copper-made heat-dissipating fins. Further, when the aluminum-made heat-dissipating fins are combined with different materials, a nickel-plating process has to be performed to facilitate the combination of the aluminum-made heat-dissipating fins with the copper-made heat-conducting plate or heat pipes.
  • In view of the above, the present inventor proposes a novel heat sink based on his expert experience and delicate researches.
    • SUMMARY OF THE INVENTION
  • The present invention is to provide a heat sink and a method for manufacturing the same, whereby the heat-dissipating area and thus the heat-dissipating efficiency of the heat sink can be increased greatly, and the stability and soldering ability of different materials can be improved.
  • The present invention further provides a heat sink including a plurality of heat-dissipating fins. One surface of each of the heat-dissipating fins is formed with a metallic coating layer by spraying. At least one end of any one of the heat-dissipating fins is bent to have a fold. Any two adjacent heat-dissipating fins are connected to each other by stacking the respective folds.
  • The present invention provides a method for manufacturing a heat sink, which including steps of: a) preparing a metallic belt; b) providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt; c) providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and d) stacking a plurality of heat-dissipating fins to form the heat sink.
  • The present invention has advantageous features as follows. The surface of aluminum-made heat-dissipating fins are directly sprayed with a copper layer, so that the heat-dissipating fins need not be subjected to a nickel-plating process, which conforms to the requirements for environmental protection and reduces the material cost and manufacturing time.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a flow chart showing the steps of the method for manufacturing a heat sink according to the present invention;
  • FIG. 2 is a schematic view showing a metallic belt of the present invention is sprayed by a spraying device;
  • FIG. 3 is a perspective view showing the external appearance of a heat-dissipating fin of the present invention;
  • FIG. 4 is an exploded perspective view showing a heat-dissipating fin assembly and a heat-conducting plate of the present invention;
  • FIG. 5 is an assembled view showing the heat-dissipating fin assembly and the heat-conducting plate of the present invention;
  • FIG. 6 is an assembled cross-sectional view showing the heat-dissipating fin assembly and the heat-conducting plate of the present invention;
  • FIG. 7 is a partially enlarged view of the portion A in FIG. 6; and
  • FIG. 8 is an assembled view showing another embodiment of the heat sink according to the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The detailed description and technical contents of the present invention will be described in more detail with reference to the accompanying drawings. However, it should be noted that the drawings are illustrative only, but not used to limit the scope of the present invention.
  • Please refer to FIG. 4. The present invention provides a heat sink, which is formed by stacking a plurality of heat-dissipating fins 10. Each of the heat-dissipating fins 10 is made of a material having good heat conductivity such as aluminum or the alloys thereof. One surface 11 of any one heat-dissipating fin 10 is sprayed to form a metallic coating layer 20. The metallic coating layer 20 may be made of a material having good heat conductivity such as nickel, copper or the alloys thereof. Further, the metallic coating layer 20 forms a rugged configuration on the surface 11 of the heat-dissipating fin 10. Further, the upper and lower ends of each heat-dissipating fin 10 are bent to form two folds 12, 13 respectively that correspond to each other. The folds 12 and 13 and an adjacent heat-dissipating fin 10 together form a partitioning channel 14. The metallic coating layer 20 is formed on the outside surface of each heat-dissipating fin 10 after bending. Of course, the heat-dissipating fin 10 may have only one fold 12 or 13 (not shown).
  • Furthermore, the heat sink of the present invention includes a heat-conducting plate 30, which is made of a material having good heat conductivity such as copper or the alloys thereof. The metallic coating layer 20 formed outside the fold 12 is tightly adhered to the surface of the heat-conducting plate 30, and then connected to each other by heating.
  • Please refer to FIGS. 1 to 7. The present invention provides a method for manufacturing a heat sink, which includes steps as follows:
  • In step a), a metallic belt 100 is prepared, which is made of a material having good heat conductivity such as aluminum or the alloys thereof.
  • In step b), a spraying device 6 is provided for spraying a metallic coating layer 20 on one surface of the metallic belt 100. This spraying step is performed by a Cu plasma injection on the whole or partial surface of the metallic belt 100.
  • In step c), a stamping device is provided for blanking the metallic belt 100 a subjected to the step b) to form a heat-dissipating fin 10. The heat-dissipating fin 10 is formed into a U shape with its upper and lower ends being bent to form two folds 12 and 13 respectively that correspond to each other. In this step, one of the folds 12 (or 13) can be provided with a trough 15 (as shown in FIG. 8). The heat-dissipating fin 10 can be formed into other geometrical shapes, but not limited to the specific form shown in the drawings. For example, the upper fold 12 may not be provided.
  • In step d), a plurality of heat-dissipating fins 10 are stacked to form the heat sink. The two folds 12 and 13 of any two adjacent heat-dissipating fins 10 are stacked in such a manner that a partitioning channel 14 (as shown in FIG. 6) is formed between the adjacent heat-dissipating fins 10.
  • Further, the method of the present invention further includes a step e) after the step d). In the step e), a heat-conducting plate 30 is provided, on which the heat-dissipating fins 10 are disposed.
  • Further, the method of the present invention further includes a step f) after the step e). In the step f), a heating device is provided for heating the heat-dissipating fins 10 and the heat-conducting plate 30, thereby connecting the heat-dissipating fins 10 and the heat-conducting plate 30 with the metallic coating layer 20. Specifically speaking, the metallic coating layer 20 is heated to be soldered to the heat-dissipating fins 10 and the heat-conducting plate 30.
  • Further, the method of the present invention further includes a step e′) to replace the step e). In the step e′), a heat pipe 40 is provided. One end of the heat pipe 40 penetrates the trough 15 (as shown in FIG. 8).
  • On the other hand, the method of the present invention further includes a step f′) after the step e′). In the step f′), a heating device is provided for heating the heat-dissipating fins 10 and the heat pipe 40, thereby connecting the heat-dissipating fins 10 and the heat pipe 40 with the metallic coating layer 20 (as shown in FIG. 8). Specifically speaking, the metallic coating layer 20 is heated to be soldered to the heat-dissipating fins 10 and the heat pipe 40.
  • Please refer to FIG. 8. The heat sink of the present invention further includes a heat-conducting plate 30 and a heat pipe 40. The center of the lower fold 13 of each heat-dissipating fin 10 is provided with a trough 15. Further, the heat-conducting plate 30 is provided with a groove 31. Since the metallic coating layer 20 is sprayed on the respective heat-dissipating fins 10, after one end of the heat pipe 40 penetrates the trough 15, the metallic coating layer 20 is heated to be connected with the heat pipe 40. The other end of the heat pipe 40 penetrates the groove 31 of the heat-conducting plate 30. In this way, the heat pipe 40 can be combined with the heat-conducting plate 30 to form another embodiment of the heat sink according to the present invention.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (14)

1. A method for manufacturing a heat sink, including steps of:
a) preparing a metallic belt;
b) providing a spraying device for spraying a metallic coating layer on one surface of the metallic belt;
c) providing a stamping device for blanking the metallic belt to form a heat-dissipating fin; and
d) stacking a plurality of heat-dissipating fins to form the heat sink.
2. The method according to claim 1, wherein the heat-dissipating fin in the step c) is formed into a U shape having two folds corresponding to each other.
3. The method according to claim 2, further including a step e) of providing a heat-conducting plate after the step d), the heat-dissipating fins being disposed on the heat-conducting plate.
4. The method according to claim 3, further including a step f) of providing a heating device after the step e), the heating device heating the heat-dissipating fins and the heat-conducting plate, thereby connecting the heat-dissipating fins and the heat-conducting plate with the metallic coating layer.
5. The method according to claim 1, wherein the heat-dissipating fin in the step c) is formed into a U shape having two folds corresponding to each other, one of the folds is formed with a trough.
6. The method according to claim 5, further including a step e′) of providing a heat pipe after the step d), one end of the heat pipe penetrating the trough.
7. The method according to claim 6, further including a step f′) of providing a heating device after the step e′), the heating device heating the heat-dissipating fins and the heat pipe, thereby connecting the heat-dissipating fins and the heat pipe with the metallic coating layer.
8. A heat sink, including a plurality of heat-dissipating fins, wherein one surface of each of the heat-dissipating fins is sprayed to form a metallic coating layer, at least one end of any one of the heat-dissipating fins is bent to have a fold, any two adjacent heat-dissipating fins are connected to each other by stacking the respective folds.
9. The heat sink according to claim 8, wherein the heat-dissipating fin is made of aluminum.
10. The heat sink according to claim 8, wherein the metallic coating layer is made of copper or nickel.
11. The heat sink according to claim 8, wherein the metallic coating layer is formed into a rugged configuration.
12. The heat sink according to claim 11, further including a heat-conducting plate, the metallic coating layer being heated to be connected to the heat-conducting plate.
13. The heat sink according to claim 11, further including a heat pipe, the heat-dissipating fin being formed with a trough, one end of the heat pipe being received in the trough, the metallic coating layer being heated to be connected to the heat pipe.
14. The heat sink according to claim 13, further including a heat-conducting plate in thermal contact with the other end of the heat pipe.
US12/717,980 2010-03-05 2010-03-05 Heat sink and method for manufacturing the same Abandoned US20110214846A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706329B1 (en) * 2002-11-21 2004-03-16 Ming-Ho Chien Local nickel plating for aluminum alloy radiator
US6712129B1 (en) * 2002-10-29 2004-03-30 Taiwan Trigem Information Co., Ltd. Heat dissipation device comprised of multiple heat sinks
US7072181B2 (en) * 2003-01-27 2006-07-04 Kabushiki Kaisha Toshiba Heat dissipating device and electronic apparatus including the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6712129B1 (en) * 2002-10-29 2004-03-30 Taiwan Trigem Information Co., Ltd. Heat dissipation device comprised of multiple heat sinks
US6706329B1 (en) * 2002-11-21 2004-03-16 Ming-Ho Chien Local nickel plating for aluminum alloy radiator
US7072181B2 (en) * 2003-01-27 2006-07-04 Kabushiki Kaisha Toshiba Heat dissipating device and electronic apparatus including the same

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