US20100212862A1 - Cooling structure for a housing - Google Patents
Cooling structure for a housing Download PDFInfo
- Publication number
- US20100212862A1 US20100212862A1 US12/379,623 US37962309A US2010212862A1 US 20100212862 A1 US20100212862 A1 US 20100212862A1 US 37962309 A US37962309 A US 37962309A US 2010212862 A1 US2010212862 A1 US 2010212862A1
- Authority
- US
- United States
- Prior art keywords
- cooling
- housing
- side board
- cooling structure
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to a cooling structure for a housing.
- this invention relates to a cooling structure for a housing having a cooling chip that can exhaust the heat.
- a cooling fan is generally installed in computer housings so that the heat generated from the electronic elements in the housing is exhausted out of the housing by the air flow generated by the cooling fan.
- the cooling fan of the prior art guides the external air into the computer housing and the temperature of the air may not be low enough, the cooling effect may be insufficient, especially when the outside temperature is high (such as in summer).
- One particular aspect of the present invention is to provide a cooling structure for a housing that has a cooling chip so that the temperature in the housing can be lowered.
- the cooling structure for a housing is located on the side board of the housing.
- the side board has a through hole.
- the cooling structure for a housing includes a cooling device and a fan device.
- the cooling device includes a cooling chip located on the through hole of the side board, a cooler and a heater.
- the cooling chip has a cold end and a hot end.
- the cooler is connected with the cold end of the cooling chip.
- the heater is connected with the hot end of the cooling chip.
- the surface area of the heater is larger than 1 ⁇ 3 surface area of the side board.
- the fan device is located at one side of the side board, and corresponds to the heater.
- the present invention has the following characteristics.
- the present invention has the cooling chip so that the temperature in the housing can be rapidly lowered. Furthermore, by utilizing the fan device located at the side board of the housing and the heater that its surface area is larger than 1 ⁇ 3 surface area of the side board, the heat generated from the cooling chip can be effectively exhausted.
- FIG. 1 is an assembly perspective view of the cooling structure for a housing of the present invention
- FIG. 2 is an exploded perspective view of the cooling structure for a housing of the present invention that part of the housing is omitted and the side board is shown;
- FIG. 3 is a front view of the cooling structure for a housing of the present invention.
- FIG. 4 is a cross-sectional view of cross-section 4 - 4 in FIG. 3 ;
- FIG. 5 is an exploded perspective view of the cooling structure for a housing having a protection mask of the present invention.
- FIG. 6 is an assembly perspective view of the cooling structure for a housing having a protection mask of the present invention.
- the cooling structure for a housing is located on the side board 11 of the housing 1 .
- the side board 11 has a through hole 111 (as shown in FIG. 2 ).
- the cooling structure for a housing includes a cooling device 2 and a fan device 3 .
- the cooling device 2 includes a cooling chip 21 , a cooler 22 , a frame 26 , a heat-conducting unit 23 , a heater 24 , and a plurality of heat pipes 28 .
- the cooling chip 21 After the cooling chip 21 is conducted with electric power, a cold end 211 and a hot end 212 that is opposite to the cold end 211 are generated.
- the cooling chip 21 is located on the through hole 111 of the side board 11 .
- the cooling chip 21 is parallel to the side board 11 .
- the cooler 22 is made of metal and has a plurality of cooling fins 221 that are disposed at intervals, but not limited to above.
- the frame 26 is also made of metal and wraps around the cooler 22 .
- the frame 26 can be fastened onto the inner surface of the side board 11 by screws or other means so that the cooler 22 is located inside housing 1 .
- the front end surface of the frame 26 is pasted onto the cold end 211 of the cooling chip 21 .
- the cooler 22 is connected with the cold end 211 of the cooling chip 21 via the frame 26 , but not limited to above.
- the cooler 22 also can be directly connected with the cold end 211 of the cooling chip 21 .
- the heat-conducting unit 23 includes a board 233 and a base 231 .
- the board 233 is pasted onto the hot end 212 of the cooling chip 21 .
- the back surface of the base 231 has a plurality of grooves 232 for receiving the heat pipes 28 .
- the heater 24 includes a plurality of cooling fin sets 241 .
- the cool fin sets 241 are radially disposed, and each of the cool fin sets 241 includes a plurality of cooling fins 2411 .
- the cooling fins 2411 are disposed at intervals and are vertical to the external surface of the side board 11 (as shown in FIG. 4 ), but not limited to above.
- the surface area of the heater 24 is larger than 1 ⁇ 3 surface area of the side board 11 (as shown in FIG. 3 ).
- each heat pipe 28 is received in the groove 232 of the base 231 of the heat-conducting unit 23 , and is clipped between the board 233 and the base 231 to connect the hot end 212 of the cooling chip 21 .
- Another end of each heat pipe 28 extends along the direction that is parallel to the side board 11 , and is connected with the corresponding cooling fin set 241 .
- the heater 24 is connected with the hot end 212 of the cooling chip 21 via the heat pipe 28 and the heat-conducting unit 23 .
- the heater 24 is located outside the housing 1 , and is parallel to the side board 11 .
- the type of the fan device 3 is not limited to a specific type, and is located at one side of the side board 11 .
- the fan device 3 includes a protection screen 31 and a set of fan blades 32 .
- the protection screen 31 is made of metal or other material (such as plastic).
- the center of the protection screen 31 has a base 311 .
- the base 311 has a plurality of fastening holes 312 for receiving the screws.
- the set of fan blades 32 is rotatably located on the center of the base 311 .
- the dimension of the set of fan blades 32 is not limited. In the figure, the dimension of the set of fan blades 32 is 18 cm.
- the fan device 3 is located at the front side of the heater 24 , and the dimension of the fan device 3 is matched with the dimension of the heater 24 .
- the fan device 24 also can be a cooling fan with a fan frame.
- the cold end 211 of the cooling chip 21 cooperates with the cooler 22 to generate cold air between the cooling fins 221 of the cooler 22 to lower the temperature in the housing 1 .
- the cooling effect is good.
- the hot end 212 of the cooling chip 21 cooperates with the heat pipes 28 and the heater 24 to guide the heat generated from the cooling chip 21 to the heater 24 . Thereby, the large surface area of the heater 24 is used for exhausting heat.
- the fan device 3 rotates to exhaust hot air of the heater 24 to outside.
- the cooler 22 is installed with a fan device 4 (as shown in FIG. 4 ).
- the fan device 4 includes two cooling fans 41 , but is not limited to above. The airflow generated by the fan device 4 will pass through the cooling fins 221 of the cooler 22 to forcedly blow cold air into the housing 1 to enhance the cooling efficiency.
- the cooling device 2 further includes a shell 25 , a plurality of covering boards 29 , and a fastening structure 27 .
- the shell 25 has a plurality of openings 251 that respectively correspond to the heat pipes 28 .
- the shell 25 is installed onto the side board 11 by screws or other fasteners, and covers the heat-conducting unit 23 and the cooling chip 21 to protect the heat-conducting unit 23 and the cooling chip 21 .
- the heat pipes 28 pass through the shell 25 via the openings 251 .
- the covering boards 29 are located between the heater 24 and the side board 11 , and are disposed in a hollow disk shape so that the heater 24 does not directly contact the side board 11 .
- the front end surface of the frame 26 further has four screw holders 261 .
- the four screw holders 261 are respectively located at the four corners of the cooling chip 21 .
- the fastening structure 27 includes two arc-shaped blocking pieces 271 . Two ends of each blocking piece 271 respectively have a screw 272 .
- the two blocking pieces 271 are located at two opposite sides of the base 231 , and located at the front side of part of heat pipes 28 .
- the four screws 272 pass through the board 233 and are screwed into the four screw holders 261 of the frame 26 so that the board 233 and the frame 26 are respectively and tightly pasted onto the hot end 212 and the cold end 211 of the cooling chip 21 to conduct heat well.
- the cooling structure for a housing further is installed with an installation frame 5 between the fan device 3 and the cooling device 2 (referring to FIGS. 2 and 4 ).
- the base 311 of the protection screen 31 of the fan device 3 can be screwed to the front side of the installation frame 5 via the fastening holes 312 .
- the rear side of the installation frame 5 also can be combined with the shell 25 by screwing or other fastening ways to increase the distance between the fan device 3 and the cooling device 2 so that the fan device 3 can draw more hot air.
- the cooling structure for a housing further includes a protection cover 6 .
- the protection cover 6 includes a cover body 61 and a protection screen 62 .
- the cover body 61 is hollow and its end surface has an opening hole 611 .
- the outer edge of the cover body 61 has a plurality of openings 612 .
- the protection screen 62 is made of metal, and its shape matches the shape of the cover body 61 .
- the surface of the protection screen 62 has a plurality of cooling holes 621 .
- the protection screen 62 is located inside of the cover body 61 so that the cooling holes 621 expose to the opening hole 611 and the openings 612 to exhaust the hot air.
- the protection cover 6 covers the fan device 3 , and the cover body 61 is installed on the side board 11 by screwing or other fastening ways to prevent the user form touching the set of fan blades 32 to affect the operation of the fan device 3 .
- the present invention has the cooling device of the cooling chip so that the temperature in the housing can be rapidly lowered.
- the present invention utilizes the cooling fan located at the side wall of the housing and the heater that its surface area is larger than the surface area of the side board to exhaust the heat generated by the cooling chip.
- the present invention can cooperate with a fan device having a large dimension. It utilizes the characteristic of the fan device having a large air-exhausting flow to rapidly exhaust heat.
- the cooling fan can achieve the large air-exhausting flow under merely being operated at a low rotation speed. The noise can be substantially reduced.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling structure for a housing is located on the side board of the housing. The side board has a through hole. The cooling structure for a housing includes a cooling device and a fan device. The cooling device includes a cooling chip, a cooler and a heater. The cooling chip is located on the through hole of the side board, and has a cold end and a hot end. The cold end of the cooling chip is connected with the cooler. The hot end of the cooling chip is connected with the heater. The surface area of the heater is larger than ⅓ surface area of the side board. The fan device is located at one side of the side board, and corresponds to the heater. Thereby, the cooling device of the cooling chip is used for lowering the temperature in the housing.
Description
- 1. Field of the Invention
- The present invention relates to a cooling structure for a housing. In particular, this invention relates to a cooling structure for a housing having a cooling chip that can exhaust the heat.
- 2. Description of Related Art
- There are a plurality of circuit boards and electronic elements in a computer housing. When the computer operates, the electronic elements (such as chips, ICs, etc.) on the circuit boards in the computer housing generate heat so that the temperature in the computer housing rises. When the temperature in the housing exceeds the temperature specified for the electronic elements, the electronic elements may fail and the computer become damaged. Therefore, a cooling fan is generally installed in computer housings so that the heat generated from the electronic elements in the housing is exhausted out of the housing by the air flow generated by the cooling fan.
- However, because the cooling fan of the prior art guides the external air into the computer housing and the temperature of the air may not be low enough, the cooling effect may be insufficient, especially when the outside temperature is high (such as in summer).
- One particular aspect of the present invention is to provide a cooling structure for a housing that has a cooling chip so that the temperature in the housing can be lowered.
- The cooling structure for a housing is located on the side board of the housing. The side board has a through hole. The cooling structure for a housing includes a cooling device and a fan device. The cooling device includes a cooling chip located on the through hole of the side board, a cooler and a heater. The cooling chip has a cold end and a hot end. The cooler is connected with the cold end of the cooling chip. The heater is connected with the hot end of the cooling chip. The surface area of the heater is larger than ⅓ surface area of the side board. The fan device is located at one side of the side board, and corresponds to the heater.
- The present invention has the following characteristics. The present invention has the cooling chip so that the temperature in the housing can be rapidly lowered. Furthermore, by utilizing the fan device located at the side board of the housing and the heater that its surface area is larger than ⅓ surface area of the side board, the heat generated from the cooling chip can be effectively exhausted.
- For further understanding of the invention, reference is made to the following detailed description illustrating the embodiments and examples of the invention. The description is for illustrative purpose only and is not intended to limit the scope of the claim.
- The drawings included herein provide a further understanding of the invention. A brief introduction of the drawings is as follows:
-
FIG. 1 is an assembly perspective view of the cooling structure for a housing of the present invention; -
FIG. 2 is an exploded perspective view of the cooling structure for a housing of the present invention that part of the housing is omitted and the side board is shown; -
FIG. 3 is a front view of the cooling structure for a housing of the present invention; -
FIG. 4 is a cross-sectional view of cross-section 4-4 inFIG. 3 ; -
FIG. 5 is an exploded perspective view of the cooling structure for a housing having a protection mask of the present invention; and -
FIG. 6 is an assembly perspective view of the cooling structure for a housing having a protection mask of the present invention. - Reference is made to
FIGS. 1˜3 . The cooling structure for a housing is located on theside board 11 of thehousing 1. Theside board 11 has a through hole 111 (as shown inFIG. 2 ). The cooling structure for a housing includes acooling device 2 and afan device 3. Thecooling device 2 includes acooling chip 21, acooler 22, aframe 26, a heat-conductingunit 23, aheater 24, and a plurality ofheat pipes 28. - After the
cooling chip 21 is conducted with electric power, acold end 211 and ahot end 212 that is opposite to thecold end 211 are generated. Thecooling chip 21 is located on the throughhole 111 of theside board 11. Thecooling chip 21 is parallel to theside board 11. - The
cooler 22 is made of metal and has a plurality ofcooling fins 221 that are disposed at intervals, but not limited to above. Theframe 26 is also made of metal and wraps around the cooler 22. Theframe 26 can be fastened onto the inner surface of theside board 11 by screws or other means so that thecooler 22 is located insidehousing 1. The front end surface of theframe 26 is pasted onto thecold end 211 of thecooling chip 21. In this embodiment, thecooler 22 is connected with thecold end 211 of thecooling chip 21 via theframe 26, but not limited to above. Thecooler 22 also can be directly connected with thecold end 211 of thecooling chip 21. - The heat-conducting
unit 23 includes aboard 233 and abase 231. Theboard 233 is pasted onto thehot end 212 of thecooling chip 21. The back surface of thebase 231 has a plurality ofgrooves 232 for receiving theheat pipes 28. - In this embodiment, the
heater 24 includes a plurality ofcooling fin sets 241. Thecool fin sets 241 are radially disposed, and each of thecool fin sets 241 includes a plurality ofcooling fins 2411. Thecooling fins 2411 are disposed at intervals and are vertical to the external surface of the side board 11 (as shown inFIG. 4 ), but not limited to above. The surface area of theheater 24 is larger than ⅓ surface area of the side board 11 (as shown inFIG. 3 ). - One end of each
heat pipe 28 is received in thegroove 232 of thebase 231 of the heat-conductingunit 23, and is clipped between theboard 233 and thebase 231 to connect thehot end 212 of thecooling chip 21. Another end of eachheat pipe 28 extends along the direction that is parallel to theside board 11, and is connected with the corresponding cooling fin set 241. Thereby, theheater 24 is connected with thehot end 212 of thecooling chip 21 via theheat pipe 28 and the heat-conductingunit 23. Theheater 24 is located outside thehousing 1, and is parallel to theside board 11. - The type of the
fan device 3 is not limited to a specific type, and is located at one side of theside board 11. In this embodiment, thefan device 3 includes aprotection screen 31 and a set offan blades 32. Theprotection screen 31 is made of metal or other material (such as plastic). The center of theprotection screen 31 has abase 311. Thebase 311 has a plurality offastening holes 312 for receiving the screws. The set offan blades 32 is rotatably located on the center of thebase 311. The dimension of the set offan blades 32 is not limited. In the figure, the dimension of the set offan blades 32 is 18 cm. Thefan device 3 is located at the front side of theheater 24, and the dimension of thefan device 3 is matched with the dimension of theheater 24. Thefan device 24 also can be a cooling fan with a fan frame. - The
cold end 211 of thecooling chip 21 cooperates with the cooler 22 to generate cold air between the coolingfins 221 of the cooler 22 to lower the temperature in thehousing 1. The cooling effect is good. Thehot end 212 of thecooling chip 21 cooperates with theheat pipes 28 and theheater 24 to guide the heat generated from thecooling chip 21 to theheater 24. Thereby, the large surface area of theheater 24 is used for exhausting heat. At the same time, thefan device 3 rotates to exhaust hot air of theheater 24 to outside. - Furthermore, one side of the cooler 22 is installed with a fan device 4 (as shown in
FIG. 4 ). In this embodiment, thefan device 4 includes two coolingfans 41, but is not limited to above. The airflow generated by thefan device 4 will pass through the coolingfins 221 of the cooler 22 to forcedly blow cold air into thehousing 1 to enhance the cooling efficiency. - Reference is made to
FIGS. 2 and 4 . thecooling device 2 further includes ashell 25, a plurality of coveringboards 29, and afastening structure 27. Theshell 25 has a plurality ofopenings 251 that respectively correspond to theheat pipes 28. When thecooling device 2 is assembled, theshell 25 is installed onto theside board 11 by screws or other fasteners, and covers the heat-conductingunit 23 and thecooling chip 21 to protect the heat-conductingunit 23 and thecooling chip 21. Theheat pipes 28 pass through theshell 25 via theopenings 251. The coveringboards 29 are located between theheater 24 and theside board 11, and are disposed in a hollow disk shape so that theheater 24 does not directly contact theside board 11. - The front end surface of the
frame 26 further has fourscrew holders 261. The fourscrew holders 261 are respectively located at the four corners of thecooling chip 21. Thefastening structure 27 includes two arc-shapedblocking pieces 271. Two ends of each blockingpiece 271 respectively have ascrew 272. The two blockingpieces 271 are located at two opposite sides of thebase 231, and located at the front side of part ofheat pipes 28. The fourscrews 272 pass through theboard 233 and are screwed into the fourscrew holders 261 of theframe 26 so that theboard 233 and theframe 26 are respectively and tightly pasted onto thehot end 212 and thecold end 211 of thecooling chip 21 to conduct heat well. - The cooling structure for a housing further is installed with an
installation frame 5 between thefan device 3 and the cooling device 2 (referring toFIGS. 2 and 4 ). Thebase 311 of theprotection screen 31 of thefan device 3 can be screwed to the front side of theinstallation frame 5 via the fastening holes 312. The rear side of theinstallation frame 5 also can be combined with theshell 25 by screwing or other fastening ways to increase the distance between thefan device 3 and thecooling device 2 so that thefan device 3 can draw more hot air. - Reference is made to
FIGS. 5 and 6 . The cooling structure for a housing further includes aprotection cover 6. Theprotection cover 6 includes acover body 61 and aprotection screen 62. Thecover body 61 is hollow and its end surface has anopening hole 611. The outer edge of thecover body 61 has a plurality ofopenings 612. Theprotection screen 62 is made of metal, and its shape matches the shape of thecover body 61. The surface of theprotection screen 62 has a plurality of cooling holes 621. Theprotection screen 62 is located inside of thecover body 61 so that the cooling holes 621 expose to theopening hole 611 and theopenings 612 to exhaust the hot air. Theprotection cover 6 covers thefan device 3, and thecover body 61 is installed on theside board 11 by screwing or other fastening ways to prevent the user form touching the set offan blades 32 to affect the operation of thefan device 3. - The cooling structure for a housing of the present invention has the following characteristics:
- 1. The present invention has the cooling device of the cooling chip so that the temperature in the housing can be rapidly lowered.
- 2. The present invention utilizes the cooling fan located at the side wall of the housing and the heater that its surface area is larger than the surface area of the side board to exhaust the heat generated by the cooling chip.
- 3. The present invention can cooperate with a fan device having a large dimension. It utilizes the characteristic of the fan device having a large air-exhausting flow to rapidly exhaust heat. The cooling fan can achieve the large air-exhausting flow under merely being operated at a low rotation speed. The noise can be substantially reduced.
- The description above only illustrates specific embodiments and examples of the invention. The invention should therefore cover various modifications and variations made to the herein-described structure and operations of the invention, provided they fall within the scope of the invention as defined in the following appended claims.
Claims (15)
1. A cooling structure for a housing, located on a side board of the housing,
wherein the side board has a through hole, comprising:
a cooling device, comprising:
a cooling chip located on the through hole of the side board, wherein the cooling chip has a cold end and a hot end;
a cooler connected to the cold end of the cooling chip; and
a heater connected to the hot end of the cooling chip, wherein the surface area of the heater is larger than ⅓ surface area of the side board; and
a fan device located at one side of the side board, wherein the fan device corresponds to the heater.
2. The cooling structure for a housing as claimed in claim 1 , wherein one side of the cooler has another fan device.
3. The cooling structure for a housing as claimed in claim 1 , wherein the heater of the cooling device is located outside of the housing, and the cooler is located inside of the housing.
4. The cooling structure for a housing as claimed in claim 1 , wherein the heater is parallel to the side board.
5. The cooling structure for a housing as claimed in claim 1 , wherein the fan device comprises a protection screen and a set of fan blades, the center of the protection screen has a base, and the set of fan blades is rotatably located on the base.
6. The cooling structure for a housing as claimed in claim 1 , wherein the fan device is a cooling fan.
7. The cooling structure for a housing as claimed in claim 1 , wherein the cooling device further includes a plurality of heat pipes, the heater includes a plurality of cooling fin sets, one end of each heat pipe is connected with the hot end of the cooling chip, and another end of each heat pipe extends along a direction that is parallel to the side board and correspondingly connected with the cooling fin set.
8. The cooling structure for a housing as claimed in claim 7 , wherein the cooling fin sets are radially disposed.
9. The cooling structure for a housing as claimed in claim 7 , wherein each of the cooling fin sets includes a plurality of cooling fins, the cooling fins are disposed at intervals and are vertical to the side board.
10. The cooling structure for a housing as claimed in claim 7 , wherein the cooling device further comprises a heat-conducting unit, the heat-conducting unit is located at the hot end of the cooling chip, and one end of the heat pipes is connected with the heat-conducting unit.
11. The cooling structure for a housing as claimed in claim 10 , wherein the heat-conducting unit includes a board and a base, the board is pasted onto the hot end of the cooling chip, and one end of the heat pipes is clipped between the board and the base.
12. The cooling structure for a housing as claimed in claim 1 , wherein the cooling device further comprises a frame, the frame wraps around the cooler, and the front end surface of the frame is pasted onto the cold end of the cooling chip.
13. The cooling structure for a housing as claimed in claim 12 , wherein the cooling device further includes a fastening structure, the fastening structure includes two blocking pieces, two ends of the blocking piece respectively have a screw, the frame has four screw holders, the two blocking pieces are opposite to each other and are located at the front side of part of the heat pipes, and the four screws are respectively screwed into the four screw holders of the frame.
14. The cooling structure for a housing as claimed in claim 1 , further comprising an installation frame, wherein the installation frame is located between the fan device and the cooling device.
15. The cooling structure for a housing as claimed in claim 1 , further comprising a protection cover, wherein the protection cover is located outside the fan device, and the protection cover has a plurality of cooling holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/379,623 US20100212862A1 (en) | 2009-02-26 | 2009-02-26 | Cooling structure for a housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/379,623 US20100212862A1 (en) | 2009-02-26 | 2009-02-26 | Cooling structure for a housing |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100212862A1 true US20100212862A1 (en) | 2010-08-26 |
Family
ID=42629917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/379,623 Abandoned US20100212862A1 (en) | 2009-02-26 | 2009-02-26 | Cooling structure for a housing |
Country Status (1)
Country | Link |
---|---|
US (1) | US20100212862A1 (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6411510B2 (en) * | 2000-02-08 | 2002-06-25 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US6538888B1 (en) * | 2001-09-28 | 2003-03-25 | Intel Corporation | Radial base heatsink |
US6947281B2 (en) * | 2002-02-28 | 2005-09-20 | Sun Microsystems, Inc. | Cooling units |
US7145771B2 (en) * | 2003-06-17 | 2006-12-05 | Wistron Neweb Corp. | System structure and fan module thereof |
US7178583B2 (en) * | 2004-07-30 | 2007-02-20 | Asia Vital Components Co., Ltd. | Fan module for a heat dissipating device |
US7249627B2 (en) * | 2003-01-24 | 2007-07-31 | Icurie Lab Holdings Limited | Cooling device of hybrid-type |
US20070195499A1 (en) * | 2006-02-21 | 2007-08-23 | Ping-Chun Chu | Computer housing assembly with a cooling device |
US7515417B2 (en) * | 2005-04-11 | 2009-04-07 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
US20090223239A1 (en) * | 2008-03-10 | 2009-09-10 | Chun-Ju Lin | Cooling structure for a housing |
-
2009
- 2009-02-26 US US12/379,623 patent/US20100212862A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6411510B2 (en) * | 2000-02-08 | 2002-06-25 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US6538888B1 (en) * | 2001-09-28 | 2003-03-25 | Intel Corporation | Radial base heatsink |
US6947281B2 (en) * | 2002-02-28 | 2005-09-20 | Sun Microsystems, Inc. | Cooling units |
US7249627B2 (en) * | 2003-01-24 | 2007-07-31 | Icurie Lab Holdings Limited | Cooling device of hybrid-type |
US7145771B2 (en) * | 2003-06-17 | 2006-12-05 | Wistron Neweb Corp. | System structure and fan module thereof |
US7178583B2 (en) * | 2004-07-30 | 2007-02-20 | Asia Vital Components Co., Ltd. | Fan module for a heat dissipating device |
US7515417B2 (en) * | 2005-04-11 | 2009-04-07 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
US20070195499A1 (en) * | 2006-02-21 | 2007-08-23 | Ping-Chun Chu | Computer housing assembly with a cooling device |
US20090223239A1 (en) * | 2008-03-10 | 2009-09-10 | Chun-Ju Lin | Cooling structure for a housing |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI463939B (en) | Electronic device | |
US20040095723A1 (en) | Internal heat sink construction for CPU cabinet | |
US20050030714A1 (en) | Heat dissipating structure for computer host | |
US7986521B2 (en) | Heat dissipation device and computer using same | |
TWI437951B (en) | Heat dispensing module | |
US20080117569A1 (en) | Power-supplying device | |
US20080019092A1 (en) | Heat-dissipating assembly of computer housing | |
WO2009046647A1 (en) | A heat sink system, a heat sink apparatus and a heat sink method for a computer | |
US9033028B2 (en) | Heat dissipation module | |
TW200506220A (en) | Cooling device and centrifugal pump to be used in the same device | |
TWI496992B (en) | Heat dissipation device | |
US9058158B2 (en) | Electronic device | |
US6215660B1 (en) | Electronic appliance with a thermoelectric heat-dissipating apparatus | |
US5873407A (en) | Windblown-type heat-dissipating device for computer mother board | |
US20040090743A1 (en) | Heat dissipating device | |
CN115863841B (en) | Outdoor lithium battery mobile power supply combined structure and use method | |
CN102026520A (en) | Radiation device | |
TW201538063A (en) | Electronic device and cooling fan thereof | |
CN100410841C (en) | Heat sink of computer system | |
US20100212862A1 (en) | Cooling structure for a housing | |
TWI464323B (en) | Fan | |
CN210864590U (en) | Supplementary heat dissipation formula all-in-one | |
US20090223239A1 (en) | Cooling structure for a housing | |
US20080055853A1 (en) | Heat dissipating module and assembly of the heat dissipating module and a computer housing | |
CN208090843U (en) | Cooling fin and air conditioner with the cooling fin |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ENERMAX TECHNOLOGY CORPORATION, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, CHUN-JU;REEL/FRAME:022376/0980 Effective date: 20090225 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |