US20040090743A1 - Heat dissipating device - Google Patents
Heat dissipating device Download PDFInfo
- Publication number
- US20040090743A1 US20040090743A1 US10/331,487 US33148702A US2004090743A1 US 20040090743 A1 US20040090743 A1 US 20040090743A1 US 33148702 A US33148702 A US 33148702A US 2004090743 A1 US2004090743 A1 US 2004090743A1
- Authority
- US
- United States
- Prior art keywords
- housing
- fan unit
- wall
- walls
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Definitions
- the invention relates to-a heat dissipating device, more particularly to a heat dissipating device of an electronic device.
- a conventional portable computer 1 includes a housing 11 and a heat dissipating device.
- the housing 11 includes a lateral wall 111 that is formed with vent holes 112 therethrough.
- the heat dissipating device includes a fan unit 12 that is mounted in the housing 11 for circulating air within the housing 11 , and that is operable so as to allow cool air to flow into and heated air to flow out of the housing 11 through the vent holes 112 in the lateral wall 111 .
- the fan unit 12 operates, the heated air attributed to a CPU (not shown) and other electronic components (not shown) disposed in the housing 11 is expelled out of the housing 11 through the vent hole 112 in the lateral wall 111 .
- the heated air is not expelled out of the housing 11 quite fast enough, part of the heated air remains in the housing 11 , thereby resulting in a poor heat-dissipating efficiency.
- the object of the present invention is to provide a heat dissipating device that can overcome the aforesaid drawback associated with the prior art.
- a heat dissipating device comprises a housing and a fan unit.
- the housing has a top wall, a bottom wall opposite to the top wall and a lateral wall that interconnects the top and bottom walls.
- Each of the top, bottom and lateral walls is formed with at least one vent hole therethrough.
- the fan unit is mounted in the housing for circulating air within the housing. The fan unit is operable so as to allow cool air to flow into and heated air to flow out of the housing through the vent holes in the top, bottom and lateral walls.
- FIG. 1 is a perspective view showing a conventional heat dissipating device of an electronic device
- FIG. 2 is a perspective view of the preferred embodiment of a heat dissipating device according to the present invention that is implemented in an electronic device;
- FIG. 3 is a fragmentary perspective view of the preferred embodiment.
- FIG. 4 is a fragmentary sectional view of the preferred embodiment.
- the preferred embodiment of the heat dissipating device 2 is implemented in an electronic device (e.g. a portable computer) and includes a housing 21 and a fan unit 22 .
- a keyboard of the electronic device is mounted on the housing 21 .
- the housing 21 has a top wall 211 , a bottom wall 212 opposite to the top wall 211 , and a lateral wall 213 that interconnects the top and bottom walls 211 , 212 .
- Each of the top, bottom and lateral walls 211 , 212 , 213 is formed with at least one vent hole 214 , 215 , 216 therethrough.
- the fan unit 22 is mounted in the housing 21 for circulating air within the housing 21 , and is operable so as to allow cool air to flow into and heated air to flow out of the housing 21 through the vent holes 216 in the top, bottom and lateral walls 211 , 212 , 213 .
- the fan unit 22 is operable so as to draw the cool air into the housing 21 through the vent holes 214 , 215 in the top and bottom walls 211 , 212 for cooling electronic components (not shown), such as a central processing unit (CPU), disposed in the housing 21 , and so as to expel the heated air through the vent holes 216 in the lateral wall 213 . Therefore, heat generated by the electronic components can be dissipated accordingly.
- electronic components such as a central processing unit (CPU)
- CPU central processing unit
- the heat dissipating device 2 of this invention is implemented in an electronic device that includes a housing 21 having top, bottom and lateral walls 211 , 212 , 213 formed with vent holes 214 , 215 , 216 , and a fan unit 22 mounted in the housing 21 .
- the arrangement as such allows the fan unit 22 to draw cool air into the housing 21 through the vent holes 214 , 215 in the top and bottom walls 211 , 212 , and to expel the heated air through the vent holes 216 in the lateral wall 213 .
- the object of the present invention to rapidly and effectively dissipate heat in the housing 21 of the electronic device is thus met.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipating device includes a housing and a fan unit. The housing has a top wall, a bottom wall opposite to the top wall, and a lateral wall that interconnects the top and bottom walls. Each of the top, bottom and lateral walls is formed with at least one vent hole therethrough. The fan unit is mounted in the housing for circulating air within the housing. The fan unit is operable so as to allow cool air to flow into and heated air to flow out of the housing through the vent holes in the top, bottom and lateral walls.
Description
- This application claims priority of Taiwanese application no. 091218426, filed on Nov. 15, 2002.
- 1. Field of the Invention
- The invention relates to-a heat dissipating device, more particularly to a heat dissipating device of an electronic device.
- 2. Description of the Related Art
- As technology advances in the field of portable computers, performance of the portable computer has become more and more powerful and processing speeds are also on the rise. Under such high speed operation, considerable heat is generated by electronic components, such as a central processing unit (CPU), of the portable computer. Thus, heat dissipation is a major concern of portable computer manufacturers.
- As shown in FIG. 1, a conventional portable computer1 includes a
housing 11 and a heat dissipating device. Thehousing 11 includes alateral wall 111 that is formed withvent holes 112 therethrough. The heat dissipating device includes afan unit 12 that is mounted in thehousing 11 for circulating air within thehousing 11, and that is operable so as to allow cool air to flow into and heated air to flow out of thehousing 11 through thevent holes 112 in thelateral wall 111. When thefan unit 12 operates, the heated air attributed to a CPU (not shown) and other electronic components (not shown) disposed in thehousing 11 is expelled out of thehousing 11 through thevent hole 112 in thelateral wall 111. However, since the heated air is not expelled out of thehousing 11 quite fast enough, part of the heated air remains in thehousing 11, thereby resulting in a poor heat-dissipating efficiency. - Therefore, the object of the present invention is to provide a heat dissipating device that can overcome the aforesaid drawback associated with the prior art.
- According to the present invention, a heat dissipating device comprises a housing and a fan unit. The housing has a top wall, a bottom wall opposite to the top wall and a lateral wall that interconnects the top and bottom walls. Each of the top, bottom and lateral walls is formed with at least one vent hole therethrough. The fan unit is mounted in the housing for circulating air within the housing. The fan unit is operable so as to allow cool air to flow into and heated air to flow out of the housing through the vent holes in the top, bottom and lateral walls.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
- FIG. 1 is a perspective view showing a conventional heat dissipating device of an electronic device;
- FIG. 2 is a perspective view of the preferred embodiment of a heat dissipating device according to the present invention that is implemented in an electronic device;
- FIG. 3 is a fragmentary perspective view of the preferred embodiment; and
- FIG. 4 is a fragmentary sectional view of the preferred embodiment.
- Referring to FIGS.2 to 4, the preferred embodiment of the
heat dissipating device 2 according to the present invention is implemented in an electronic device (e.g. a portable computer) and includes ahousing 21 and afan unit 22. A keyboard of the electronic device is mounted on thehousing 21. Thehousing 21 has atop wall 211, abottom wall 212 opposite to thetop wall 211, and alateral wall 213 that interconnects the top andbottom walls lateral walls vent hole fan unit 22 is mounted in thehousing 21 for circulating air within thehousing 21, and is operable so as to allow cool air to flow into and heated air to flow out of thehousing 21 through thevent holes 216 in the top, bottom andlateral walls - In the preferred embodiment, the
fan unit 22 is operable so as to draw the cool air into thehousing 21 through thevent holes bottom walls housing 21, and so as to expel the heated air through thevent holes 216 in thelateral wall 213. Therefore, heat generated by the electronic components can be dissipated accordingly. - It has thus been shown that the
heat dissipating device 2 of this invention is implemented in an electronic device that includes ahousing 21 having top, bottom andlateral walls vent holes fan unit 22 mounted in thehousing 21. The arrangement as such allows thefan unit 22 to draw cool air into thehousing 21 through thevent holes bottom walls vent holes 216 in thelateral wall 213. The object of the present invention to rapidly and effectively dissipate heat in thehousing 21 of the electronic device is thus met. - While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (6)
1. A heat dissipating device comprising:
a housing having a top wall, a bottom wall opposite to said top wall, and a lateral wall that interconnects said top and bottom walls, each of said top, bottom and lateral walls being formed with at least one vent hole therethrough; and
a fan unit mounted in said housing for circulating air within said housing, said fan unit being operable so as to allow cool air to flow into and heated air to flow out of said housing through said vent holes in said top, bottom and lateral walls.
2. The heat dissipating device as claimed in claim 1 , wherein said fan unit draws the cool air into said housing through said vent holes in said top and bottom walls.
3. The heat dissipating device as claimed in claim 1 , wherein said fan unit expels the heated air through said at least one vent hole in said lateral wall.
4. An electronic device comprising:
a housing having a top wall, a bottom wall opposite to said top wall, and a lateral wall that interconnects said top and bottom walls, each of said top, bottom and lateral walls being formed with at least one vent hole therethrough;
a fan unit mounted in said housing for circulating air within said housing, said fan unit being operable so as to allow cool air to flow into and heated air to flow out of said housing through said vent holes in said top, bottom and lateral walls; and
a keyboard mounted on said housing.
5. The electronic device as claimed in claim 4 , wherein said fan unit draws the cool air into said housing through said vent holes in said top and bottom walls.
6. The electronic device as claimed in claim 4 , wherein said fan unit expels the heated air through said at least one vent hole in said lateral wall.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW091218426 | 2002-11-12 | ||
TW91218426U | 2002-11-15 | ||
TW091218426U TWM242991U (en) | 2002-11-15 | 2002-11-15 | Heat sink device with multi-directional air inlets |
Publications (2)
Publication Number | Publication Date |
---|---|
US20040090743A1 true US20040090743A1 (en) | 2004-05-13 |
US6744631B1 US6744631B1 (en) | 2004-06-01 |
Family
ID=32228231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/331,487 Expired - Lifetime US6744631B1 (en) | 2002-11-15 | 2002-12-31 | Heat dissipating device |
Country Status (2)
Country | Link |
---|---|
US (1) | US6744631B1 (en) |
TW (1) | TWM242991U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070201181A1 (en) * | 2006-02-24 | 2007-08-30 | Cisco Technology, Inc. | Method and apparatus for ventilating a computerized device |
US20110164382A1 (en) * | 2010-01-06 | 2011-07-07 | Methode Electronics Inc. | Thermal management for electronic device housing |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060078423A1 (en) * | 2004-10-08 | 2006-04-13 | Nonlinear Tech, Inc. | Bi-directional Blowers for Cooling Laptop Computers |
US7455504B2 (en) * | 2005-11-23 | 2008-11-25 | Hill Engineering | High efficiency fluid movers |
JP4213729B2 (en) * | 2006-05-23 | 2009-01-21 | 株式会社東芝 | Electronics |
JP4199795B2 (en) * | 2006-10-30 | 2008-12-17 | レノボ・シンガポール・プライベート・リミテッド | Electronic device casing temperature suppression structure and portable computer |
JP4607170B2 (en) * | 2007-12-17 | 2011-01-05 | 富士通株式会社 | Electronics |
US9845805B2 (en) | 2010-07-29 | 2017-12-19 | Dell Products, L.P. | Dual operation centrifugal fan apparatus and methods of using same |
TW201301989A (en) * | 2011-06-23 | 2013-01-01 | Hon Hai Prec Ind Co Ltd | Integral information processing device |
CN103857334B (en) * | 2012-08-27 | 2017-02-22 | 东芝医疗系统株式会社 | Magnetic resonance imaging device, gradient magnetic field coil unit for magnetic resonance imaging device, and method for producing gradient magnetic field coil unit for magnetic resonance imaging device |
US11507156B2 (en) * | 2020-01-30 | 2022-11-22 | Dell Products L.P. | Cooling system with hyperbaric fan and evacuative fan |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5694294A (en) * | 1995-01-27 | 1997-12-02 | Hitachi, Ltd. | Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board |
US6111748A (en) * | 1997-05-15 | 2000-08-29 | Intel Corporation | Flat fan heat exchanger and use thereof in a computing device |
US6132170A (en) * | 1998-12-14 | 2000-10-17 | Sunonwealth Electric Machine Industry Co., Ltd. | Miniature heat dissipating fans with minimized thickness |
US6141214A (en) * | 1997-10-02 | 2000-10-31 | Samsung Electronics Co., Ltd. | Cooling apparatus for electronic systems and computer systems with such apparatus |
US6348748B1 (en) * | 1999-03-31 | 2002-02-19 | Toshiba Home Technology Corporation | Fan motor |
US20030161102A1 (en) * | 2002-03-08 | 2003-08-28 | Harrison Lee | Cooler of notebook personal computer and fabrication method thereof |
US20030223864A1 (en) * | 2002-05-30 | 2003-12-04 | Sunonwealth Electric Machine Industry Co., Ltd. | Fan structure having horizontal convection |
-
2002
- 2002-11-15 TW TW091218426U patent/TWM242991U/en not_active IP Right Cessation
- 2002-12-31 US US10/331,487 patent/US6744631B1/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5694294A (en) * | 1995-01-27 | 1997-12-02 | Hitachi, Ltd. | Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board |
US6111748A (en) * | 1997-05-15 | 2000-08-29 | Intel Corporation | Flat fan heat exchanger and use thereof in a computing device |
US6141214A (en) * | 1997-10-02 | 2000-10-31 | Samsung Electronics Co., Ltd. | Cooling apparatus for electronic systems and computer systems with such apparatus |
US6132170A (en) * | 1998-12-14 | 2000-10-17 | Sunonwealth Electric Machine Industry Co., Ltd. | Miniature heat dissipating fans with minimized thickness |
US6348748B1 (en) * | 1999-03-31 | 2002-02-19 | Toshiba Home Technology Corporation | Fan motor |
US20030161102A1 (en) * | 2002-03-08 | 2003-08-28 | Harrison Lee | Cooler of notebook personal computer and fabrication method thereof |
US20030223864A1 (en) * | 2002-05-30 | 2003-12-04 | Sunonwealth Electric Machine Industry Co., Ltd. | Fan structure having horizontal convection |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070201181A1 (en) * | 2006-02-24 | 2007-08-30 | Cisco Technology, Inc. | Method and apparatus for ventilating a computerized device |
US7529087B2 (en) * | 2006-02-24 | 2009-05-05 | Cisco Technology, Inc. | Method and apparatus for ventilating a computerized device |
US20110164382A1 (en) * | 2010-01-06 | 2011-07-07 | Methode Electronics Inc. | Thermal management for electronic device housing |
US8339784B2 (en) * | 2010-01-06 | 2012-12-25 | Methode Electronics, Inc. | Thermal management for electronic device housing |
Also Published As
Publication number | Publication date |
---|---|
TWM242991U (en) | 2004-09-01 |
US6744631B1 (en) | 2004-06-01 |
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