US20100067194A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20100067194A1 US20100067194A1 US12/211,957 US21195708A US2010067194A1 US 20100067194 A1 US20100067194 A1 US 20100067194A1 US 21195708 A US21195708 A US 21195708A US 2010067194 A1 US2010067194 A1 US 2010067194A1
- Authority
- US
- United States
- Prior art keywords
- heat
- vapor chamber
- cover
- dissipation device
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat dissipation device, and particularly to a heat dissipation device with a bent vapor chamber.
- the heat generates from the CPU is becoming greater than before.
- a conventional heat dissipation device composed of heat dissipating fins and a fan could not meet the heat dissipating requirement of the CPU.
- a vapor chamber with higher heat conducting efficiency is developed. The vapor chamber is combined with the heat dissipating fins to effectively resolve the heat dissipating problems. The vapor chamber could contact the heat generating electronic element in a large area directly, and these advantages could draw more development on the merit.
- a conventional heat dissipaton device includes a vapor chamber, a heat dissipating fins assembly and a fan.
- the vapor chamber is configured to a flat shape, and the vapor chamber is adhered to a surface of a heat generating element.
- the vapor chamber is also adhered to a surface of the heat dissipating fins assembly.
- the fan is attached to the heat dissipating fins assembly to dissipate heat from both the heat dissipating fins assembly and the vapor chamber. Therefore, heat from the heat generating element can be removed rapidly.
- the conventional heat dissipation device has following disadvantage in practice use: when the fan dissipating heat from the heat dissipating fins assembly and the vapor chamber, the airflow can not be centralized effectively causing insufficient heat dissipation. Thus, the heat dissipating efficiency could be affected. Additionally, the vapor chamber is made in flat shape, however the outer surface thereof is adhered to the heat generating element completely, and further the heat conducting area is limited to the outer surface of the heat generating element. Thus, the heat dissipating efficiency can not be further improved efficiently. If the vapor chamber is broaden to enlarge the outer surface thereof, the other electronic elements on the circuit board may be intervened accordingly to cause the heat dissipation device not be appropriately installed and not be used therefore.
- the present invention relates to a heat dissipation device, the heat dissipation device includes a cover covering on a heat dissipating fins assembly and a fan.
- the airflow from the fan can be centralized to dissipate heat from the heat dissipating fins assembly and a vapor chamber directly to enhance the efficiency of the heat dissipation.
- the present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber to enhance a heat conducting area thereof to enhance the efficiency of the heat dissipation.
- the present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber on opposite sides thereof to avoid interference with the other electronic elements of the mainboard to achieve a better applicability of installation.
- the present invention relates to a heat dissipation device, the heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan.
- the vapor chamber is configured to a bent shape.
- the heat dissipating fins assembly is adhered to a partial surface of the vapor chamber.
- the cover is connected to the vapor camber.
- a flow passage is defined between the vapor chamber and the cover.
- the heat dissipating fins assembly is positioned in the flow passage.
- the cover defines an opening communicating to the flow passage.
- the fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber.
- FIG. 1 is an isometric and exploded view of an exemplary embodiment of the present invention
- FIG. 2 is an isometric and assembled view of the exemplary embodiment of the present invention
- FIG. 3 is a sectional view from 3 - 3 of FIG. 2 ;
- FIG. 4 is a sectional view from 4 - 4 of FIG. 3 ;
- FIG. 5 is a practical application view of the exemplary embodiment of the present invention.
- a heat dissipation device of an exemplary of the present invention includes a vapor chamber 10 , a heat dissipating fins assembly 20 , a cover 30 and a fan 40 .
- the vapor chamber 10 is made in a strip structure and is configured to a bent shape.
- the vapor chamber 10 includes a heat absorbing portion 11 and two heat emitting portion 12 deformedly extending from opposite sides of the absorbing portion 11 .
- the absorbing portion 11 protrudes from the surface of the emitting portions 12 .
- the absorbing portion 11 is adhered to a surface of a heat generating element 62 (as shown in FIG. 5 ).
- a large heat dissipating area is configured at the heat dissipating portion 12 and heat absorbing portion 11 .
- the heat generating element 62 is a CPU, a semiconductor packing part, a wafer or other electronic elements with high heat generation.
- the heat dissipating fins assembly 20 is adhered to a partial surface of the vapor chamber 10 , preferrably, the heat dissipating fins 20 is adhered to the surface of the emitting portions 12 tightly.
- the heat dissipating fins assembly 20 is configured with a plurality of heat dissipating fins 21 aligned in regular space.
- the heat disspating fins 21 are made from aluminum extrusion.
- the cover 30 is attached to the vapor chamber 10 .
- a flow passage 32 is defined between the cover 30 and the vapor chamber 10 .
- the heat dissipating fins assembly 20 is positioned in the flow passage 32 .
- An opening 33 is defined in the cover 30 in communication with the flow passage 32 , and a receiving space 31 is defined within the cover 30 communicating with the opening 33 .
- a plurality of through holes 34 communicating with the opening 33 is defined in the surface of the cover 30 .
- the holes 34 are defined adjacent to the opening 33 .
- a hook 35 is formed at each lateral side of the cover 30 . The two hooks 35 are buckled to the two opposite sides of the heat emitting portion 12 of the vapor chamber 10 .
- the fan 40 is assembled within the receiving space 31 , and facing to the opening 33 and a top surface of the vapor chamber 10 .
- the fan 40 includes a bracket 41 .
- a plurality of screw holes 42 is defined in the bracket 41 corresponding to the through holes 34 .
- a screw 50 can be fastened through each screw hole 42 and the corresponding through hole 34 .
- the fan 40 can be an axial fan or a centrifugal fan.
- the heat dissipating fins assembly 20 when assembling the heat dissipation device, the heat dissipating fins assembly 20 is first attached to an outer surface of the emitting portion 12 of the vapor chamber 10 .
- the heat dissipating fins assembly 20 can be fixed to the emitting portion 12 by welding.
- the fan 40 is then mounted in the receiving space 31 of the cover 30 by fastening the screws 50 to the screw holes 42 of the bracket 41 and the corresponding through holes 34 of the cover 30 .
- the hooks 35 are buckled to the opposite sides of the heat emitting portion 12 of the vapor chamber 10 to assembling the cover 30 to the vapor chamber 10 .
- the cover 30 can be fixed to the vapor chamber 10 by welding
- the heat dissipation device of the exemplary embodiment of the invention is used in an electronic product 60 .
- the electronic product 60 includes a mainboard 61 , a heat generating element 62 and a plurality of electronic elements 63 .
- heat from the heat generating element is conducted to the heat dissipating fins assembly 20 via the vapor chamber 10 .
- Heat from the dissipating fins assembly 20 and the vapor chamber 10 can be dissipated by the fan 40 directly, thereby the heat can be rapidly brought away through the flow passage 32 . The heat dissipating efficiently is therefore improved.
- the heat emitting portions 12 extending from the heat absorbing portion 11 can enhance the conducting area of the vapor camber 10 to improve the heat dissipating efficiently.
- the heat emitting portions 12 are higher than the heat absorbing portion 11 .
- the heat emitting portions 12 can not only enhance the heat conducting area but also avoid interference with the electronic elements 63 of the mainboard 61 .
- the heat dissipation device can be used in anyone of the heat generating elements 62 on the mainboard 61 , regardless of the positions of electronic elements 63 around the heat generating element 62 which can lead to an incapable of the installation. Therefore, the heat dissipation device of the exemplary of the present invention has a better applicability of installation.
- the heat dissipation device of the exemplary of the present invention may be used in the electronic product 60 with a thin thickness, such as notebook computers, personal digital assitants (PDAs), and so on.
- a thin thickness such as notebook computers, personal digital assitants (PDAs), and so on.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- The present invention relates to a heat dissipation device, and particularly to a heat dissipation device with a bent vapor chamber.
- With enhancement of the calculating capability of the central processing unit (CPU), the heat generates from the CPU is becoming greater than before. A conventional heat dissipation device composed of heat dissipating fins and a fan could not meet the heat dissipating requirement of the CPU. A vapor chamber with higher heat conducting efficiency is developed. The vapor chamber is combined with the heat dissipating fins to effectively resolve the heat dissipating problems. The vapor chamber could contact the heat generating electronic element in a large area directly, and these advantages could draw more development on the merit.
- A conventional heat dissipaton device includes a vapor chamber, a heat dissipating fins assembly and a fan. The vapor chamber is configured to a flat shape, and the vapor chamber is adhered to a surface of a heat generating element. The vapor chamber is also adhered to a surface of the heat dissipating fins assembly. The fan is attached to the heat dissipating fins assembly to dissipate heat from both the heat dissipating fins assembly and the vapor chamber. Therefore, heat from the heat generating element can be removed rapidly.
- However, the conventional heat dissipation device has following disadvantage in practice use: when the fan dissipating heat from the heat dissipating fins assembly and the vapor chamber, the airflow can not be centralized effectively causing insufficient heat dissipation. Thus, the heat dissipating efficiency could be affected. Additionally, the vapor chamber is made in flat shape, however the outer surface thereof is adhered to the heat generating element completely, and further the heat conducting area is limited to the outer surface of the heat generating element. Thus, the heat dissipating efficiency can not be further improved efficiently. If the vapor chamber is broaden to enlarge the outer surface thereof, the other electronic elements on the circuit board may be intervened accordingly to cause the heat dissipation device not be appropriately installed and not be used therefore.
- The present invention relates to a heat dissipation device, the heat dissipation device includes a cover covering on a heat dissipating fins assembly and a fan. The airflow from the fan can be centralized to dissipate heat from the heat dissipating fins assembly and a vapor chamber directly to enhance the efficiency of the heat dissipation.
- The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber to enhance a heat conducting area thereof to enhance the efficiency of the heat dissipation.
- The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber on opposite sides thereof to avoid interference with the other electronic elements of the mainboard to achieve a better applicability of installation.
- The present invention relates to a heat dissipation device, the heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber.
- These and other features and advantages of the various embodiments disclosed herein will be better understood with respect to the following description and drawings, in which like numbers refer to like parts throughout, and in which:
-
FIG. 1 is an isometric and exploded view of an exemplary embodiment of the present invention; -
FIG. 2 is an isometric and assembled view of the exemplary embodiment of the present invention; -
FIG. 3 is a sectional view from 3-3 ofFIG. 2 ; -
FIG. 4 is a sectional view from 4-4 ofFIG. 3 ; and -
FIG. 5 is a practical application view of the exemplary embodiment of the present invention; - Referring to
FIG. 1 andFIG. 4 , a heat dissipation device of an exemplary of the present invention includes avapor chamber 10, a heat dissipatingfins assembly 20, acover 30 and afan 40. - The
vapor chamber 10 is made in a strip structure and is configured to a bent shape. Thevapor chamber 10 includes aheat absorbing portion 11 and twoheat emitting portion 12 deformedly extending from opposite sides of the absorbingportion 11. The absorbingportion 11 protrudes from the surface of the emittingportions 12. The absorbingportion 11 is adhered to a surface of a heat generating element 62 (as shown inFIG. 5 ). A large heat dissipating area is configured at theheat dissipating portion 12 andheat absorbing portion 11. The heat generatingelement 62 is a CPU, a semiconductor packing part, a wafer or other electronic elements with high heat generation. - The heat dissipating
fins assembly 20 is adhered to a partial surface of thevapor chamber 10, preferrably, theheat dissipating fins 20 is adhered to the surface of the emittingportions 12 tightly. The heat dissipatingfins assembly 20 is configured with a plurality of heat dissipating fins 21 aligned in regular space. The heat disspatingfins 21 are made from aluminum extrusion. Thecover 30 is attached to thevapor chamber 10. Aflow passage 32 is defined between thecover 30 and thevapor chamber 10. The heat dissipatingfins assembly 20 is positioned in theflow passage 32. Anopening 33 is defined in thecover 30 in communication with theflow passage 32, and areceiving space 31 is defined within thecover 30 communicating with theopening 33. A plurality of throughholes 34 communicating with theopening 33 is defined in the surface of thecover 30. Theholes 34 are defined adjacent to theopening 33. Ahook 35 is formed at each lateral side of thecover 30. The twohooks 35 are buckled to the two opposite sides of theheat emitting portion 12 of thevapor chamber 10. - The
fan 40 is assembled within thereceiving space 31, and facing to the opening 33 and a top surface of thevapor chamber 10. Thefan 40 includes abracket 41. A plurality ofscrew holes 42 is defined in thebracket 41 corresponding to the throughholes 34. Ascrew 50 can be fastened through eachscrew hole 42 and the corresponding throughhole 34. Thefan 40 can be an axial fan or a centrifugal fan. - Referring to
FIG. 1 andFIG. 2 , when assembling the heat dissipation device, the heat dissipatingfins assembly 20 is first attached to an outer surface of the emittingportion 12 of thevapor chamber 10. The heat dissipatingfins assembly 20 can be fixed to the emittingportion 12 by welding. Thefan 40 is then mounted in thereceiving space 31 of thecover 30 by fastening thescrews 50 to thescrew holes 42 of thebracket 41 and the corresponding throughholes 34 of thecover 30. Finally, thehooks 35 are buckled to the opposite sides of theheat emitting portion 12 of thevapor chamber 10 to assembling thecover 30 to thevapor chamber 10. Thecover 30 can be fixed to thevapor chamber 10 by welding - Referring also to
FIG. 5 , the heat dissipation device of the exemplary embodiment of the invention is used in anelectronic product 60. Theelectronic product 60 includes amainboard 61, aheat generating element 62 and a plurality ofelectronic elements 63. First, after theheat absorbing portion 11 is adhered to the surface of theheat generating element 62, heat from the heat generating element is conducted to the heat dissipatingfins assembly 20 via thevapor chamber 10. Heat from the dissipatingfins assembly 20 and thevapor chamber 10 can be dissipated by thefan 40 directly, thereby the heat can be rapidly brought away through theflow passage 32. The heat dissipating efficiently is therefore improved. - The
heat emitting portions 12 extending from theheat absorbing portion 11 can enhance the conducting area of thevapor camber 10 to improve the heat dissipating efficiently. - The
heat emitting portions 12 are higher than theheat absorbing portion 11. Theheat emitting portions 12 can not only enhance the heat conducting area but also avoid interference with theelectronic elements 63 of themainboard 61. The heat dissipation device can be used in anyone of theheat generating elements 62 on themainboard 61, regardless of the positions ofelectronic elements 63 around theheat generating element 62 which can lead to an incapable of the installation. Therefore, the heat dissipation device of the exemplary of the present invention has a better applicability of installation. - The heat dissipation device of the exemplary of the present invention may be used in the
electronic product 60 with a thin thickness, such as notebook computers, personal digital assitants (PDAs), and so on. - The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein, including configurations ways of the recessed portions and materials and/or designs of the attaching structures. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/211,957 US7684187B1 (en) | 2008-09-17 | 2008-09-17 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/211,957 US7684187B1 (en) | 2008-09-17 | 2008-09-17 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
US20100067194A1 true US20100067194A1 (en) | 2010-03-18 |
US7684187B1 US7684187B1 (en) | 2010-03-23 |
Family
ID=42007040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/211,957 Active US7684187B1 (en) | 2008-09-17 | 2008-09-17 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
US (1) | US7684187B1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2384108A3 (en) * | 2010-04-27 | 2011-12-14 | Giga-Byte Technology Co., Ltd. | Dust-disposal heat-dissipation device with double cooling fans |
DE202012000325U1 (en) | 2012-01-13 | 2012-03-05 | Osram Ag | LED module with improved cooling |
US20130319641A1 (en) * | 2012-06-01 | 2013-12-05 | Asustek Computer Inc. | Heat dissipating module |
WO2015167419A1 (en) * | 2014-04-28 | 2015-11-05 | Hewlett-Packard Development Company, L.P. | A heat-dissipating device including a vapor chamber and a radial fin assembly |
US20160091264A1 (en) * | 2014-09-28 | 2016-03-31 | Sungrow Power Supply Co., Ltd. | Inverter heat-dissipation device and inverter |
US20170153676A1 (en) * | 2015-11-27 | 2017-06-01 | Inventec (Pudong) Technology Corporation | Heat dissipation component |
CN110731009A (en) * | 2017-06-28 | 2020-01-24 | 株式会社自动网络技术研究所 | Circuit arrangement |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM337966U (en) * | 2008-03-06 | 2008-08-01 | Celsia Technologies Taiwan Inc | Flat plate heat sink |
CN101754657B (en) * | 2008-12-10 | 2013-04-24 | 富准精密工业(深圳)有限公司 | Radiating device |
CN102236397B (en) * | 2010-04-30 | 2015-04-01 | 技嘉科技股份有限公司 | Double-fan heat dissipation device with dust extraction function as well as control circuit and fin group thereof |
US8331091B2 (en) * | 2010-09-01 | 2012-12-11 | Hamilton Sundstrand Corporation | Electronics package with radial heat sink and integrated blower |
KR20120073619A (en) * | 2010-12-27 | 2012-07-05 | 삼성전자주식회사 | Cooling apparatus and display device having the same |
US9121645B2 (en) * | 2013-02-11 | 2015-09-01 | Google Inc. | Variable thickness heat pipe |
CN104202949B (en) * | 2014-08-28 | 2017-07-28 | 北京京东方茶谷电子有限公司 | A kind of heat abstractor and portable equipment |
CN105744798A (en) * | 2014-12-08 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | Heat radiation device |
CN105744799A (en) * | 2014-12-12 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation apparatus and heat dissipation system |
WO2020059978A1 (en) * | 2018-09-20 | 2020-03-26 | Lg Electronics Inc. | Display device |
EP3686535B1 (en) | 2019-01-22 | 2024-03-06 | Hitachi Energy Ltd | Condenser |
US11343902B2 (en) * | 2020-07-08 | 2022-05-24 | Dell Products L.P. | System for parallel cooling of components on a circuit board |
DE102021211599A1 (en) * | 2021-10-14 | 2023-04-20 | Continental Automotive Technologies GmbH | Electronic device with active cooling |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5924481A (en) * | 1995-06-22 | 1999-07-20 | Calsonic Corporation | Cooling device for electronic component |
US6109341A (en) * | 1998-04-30 | 2000-08-29 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus including elongated heat sink |
US6834712B2 (en) * | 2001-11-27 | 2004-12-28 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
US6913070B2 (en) * | 2003-09-03 | 2005-07-05 | Chin Wen Wang | Planar heat pipe structure |
US7051791B2 (en) * | 2003-09-16 | 2006-05-30 | Sony Corporation | Cooling apparatus and electronic equipment |
US7150312B2 (en) * | 2001-11-27 | 2006-12-19 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
US7277285B2 (en) * | 2004-04-07 | 2007-10-02 | Delta Electronics, Inc. | Heat dissipation module |
US7342785B2 (en) * | 2005-04-22 | 2008-03-11 | Foxconn Technology Co., Ltd. | Cooling device incorporating boiling chamber |
US7382616B2 (en) * | 2005-01-21 | 2008-06-03 | Nvidia Corporation | Cooling system for computer hardware |
US20080266800A1 (en) * | 2007-04-30 | 2008-10-30 | Lankston Robert J | Heat sink with surface-formed vapor chamber base |
US7497249B2 (en) * | 2007-03-30 | 2009-03-03 | Delphi Technologies, Inc. | Thermosiphon for laptop computer |
US7529090B2 (en) * | 2007-08-29 | 2009-05-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7583502B2 (en) * | 2006-06-13 | 2009-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC) |
-
2008
- 2008-09-17 US US12/211,957 patent/US7684187B1/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5924481A (en) * | 1995-06-22 | 1999-07-20 | Calsonic Corporation | Cooling device for electronic component |
US6109341A (en) * | 1998-04-30 | 2000-08-29 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus including elongated heat sink |
US7150312B2 (en) * | 2001-11-27 | 2006-12-19 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
US6834712B2 (en) * | 2001-11-27 | 2004-12-28 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
US6913070B2 (en) * | 2003-09-03 | 2005-07-05 | Chin Wen Wang | Planar heat pipe structure |
US7051791B2 (en) * | 2003-09-16 | 2006-05-30 | Sony Corporation | Cooling apparatus and electronic equipment |
US7458415B2 (en) * | 2003-09-16 | 2008-12-02 | Sony Corporation | Cooling apparatus and electronic equipment |
US7277285B2 (en) * | 2004-04-07 | 2007-10-02 | Delta Electronics, Inc. | Heat dissipation module |
US7382616B2 (en) * | 2005-01-21 | 2008-06-03 | Nvidia Corporation | Cooling system for computer hardware |
US7342785B2 (en) * | 2005-04-22 | 2008-03-11 | Foxconn Technology Co., Ltd. | Cooling device incorporating boiling chamber |
US7583502B2 (en) * | 2006-06-13 | 2009-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC) |
US7497249B2 (en) * | 2007-03-30 | 2009-03-03 | Delphi Technologies, Inc. | Thermosiphon for laptop computer |
US20080266800A1 (en) * | 2007-04-30 | 2008-10-30 | Lankston Robert J | Heat sink with surface-formed vapor chamber base |
US7529090B2 (en) * | 2007-08-29 | 2009-05-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2384108A3 (en) * | 2010-04-27 | 2011-12-14 | Giga-Byte Technology Co., Ltd. | Dust-disposal heat-dissipation device with double cooling fans |
DE202012000325U1 (en) | 2012-01-13 | 2012-03-05 | Osram Ag | LED module with improved cooling |
US20130319641A1 (en) * | 2012-06-01 | 2013-12-05 | Asustek Computer Inc. | Heat dissipating module |
US9383787B2 (en) * | 2012-06-01 | 2016-07-05 | Asustek Computer Inc. | Heat dissipating module |
WO2015167419A1 (en) * | 2014-04-28 | 2015-11-05 | Hewlett-Packard Development Company, L.P. | A heat-dissipating device including a vapor chamber and a radial fin assembly |
US20160091264A1 (en) * | 2014-09-28 | 2016-03-31 | Sungrow Power Supply Co., Ltd. | Inverter heat-dissipation device and inverter |
US20170153676A1 (en) * | 2015-11-27 | 2017-06-01 | Inventec (Pudong) Technology Corporation | Heat dissipation component |
US9720466B2 (en) * | 2015-11-27 | 2017-08-01 | Inventec (Pudong) Technology Corporation | Heat dissipation component |
CN110731009A (en) * | 2017-06-28 | 2020-01-24 | 株式会社自动网络技术研究所 | Circuit arrangement |
Also Published As
Publication number | Publication date |
---|---|
US7684187B1 (en) | 2010-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7684187B1 (en) | Heat dissipation device | |
US7426112B2 (en) | Heat dissipating module | |
US7640968B2 (en) | Heat dissipation device with a heat pipe | |
US20080158820A1 (en) | Heat dissipation device for computer add-on cards | |
US7508667B2 (en) | Heat sink backplate module, circuit board, and electronic apparatus having the same | |
US20110075369A1 (en) | Electronic device | |
US7859843B2 (en) | Heat dissipation structure | |
US20050030719A1 (en) | Heat dissipating device for dissipating heat generated by an electronic component inside a housing | |
US20090059525A1 (en) | Heat dissipation device for computer add-on cards | |
US7365975B2 (en) | Heat dissipation device having a fan holder for attachment of a fan | |
US7929302B2 (en) | Cooling device | |
US20110017430A1 (en) | Thermal module | |
US20080212285A1 (en) | Electronic equipment and heat dissipating device in the electronic equipment | |
US7423873B2 (en) | Heat dissipation device having fan holder for attachment of a fan | |
US20090027855A1 (en) | Heat dissipation device having fixing bracket | |
US20110090647A1 (en) | Printed circuit board assembly | |
TW201319786A (en) | Heat dissipation device | |
US20140182818A1 (en) | Heat sink | |
US7688590B2 (en) | Thermal module and electronic apparatus using the same | |
US20140218864A1 (en) | Electronic device with cooling assembly | |
US20140133102A1 (en) | Heat dissipating assembly and electronic device assembly with heat dissipating assembly | |
US20130014920A1 (en) | Heat sink assembly | |
US7821789B1 (en) | Heat dissipating apparatus for chips | |
JP2006245025A (en) | Heat dissipation structure of electronic apparatus | |
US20060067057A1 (en) | Heat sink module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CELSIA TECHNOLOGIES TAIWAN, INC.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;REEL/FRAME:021541/0783 Effective date: 20080905 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2553); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY Year of fee payment: 12 |