US20100038054A1 - Heat dispensing unit for memory chip - Google Patents
Heat dispensing unit for memory chip Download PDFInfo
- Publication number
- US20100038054A1 US20100038054A1 US12/230,639 US23063908A US2010038054A1 US 20100038054 A1 US20100038054 A1 US 20100038054A1 US 23063908 A US23063908 A US 23063908A US 2010038054 A1 US2010038054 A1 US 2010038054A1
- Authority
- US
- United States
- Prior art keywords
- heat dispensing
- plates
- heat
- dispensing
- dispensing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat dispensing unit for removing heat from memory chips and the heat dispensing unit includes two clamps clamping tow ends of the heat dispensing unit.
- a conventional heat dispensing unit 30 for memory chips is shown in FIG. 4 and generally includes two heat conductive pads 301 , two heat dispensing plates 302 and two clamps 303 , wherein the heat conductive pads 301 are attached to in sides of the two heat dispensing plates 302 which have hooks 302 a , engaging holes 302 b and engaging pieces 302 c on a top thereof.
- the engaging pieces 302 c each have a downward positioning plates 302 d which are located corresponding to the U-shaped restriction slots 304 on outsides of the heat dispensing plates 302 .
- a through hole 305 is located above the restriction slot 304 and a guide slot 306 is located above the through hole 305 so that when the two clamps 303 clamp the two heat dispensing plates 302 , the two clamps 303 are mounted onto the two positioning plates 302 d and the hoods 303 a are engaged with the through hole 305 via the guide slots 306 so that the two heat dispensing plates 302 can clamp the memory chip 20 .
- the heat generated from the memory chip 2 is conducted to the heat dispensing unit 30 and releases to air.
- the conventional heat dispensing unit 30 includes a complicated structure which includes hooks 303 a , restriction slots 304 , through holes 305 and guide slots 306 .
- the complicated structure makes the heat dispensing unit 30 to be expensive and time consuming when manufacturing.
- the two clamps 303 clamp at the top edges of the two heat dispensing plates 302 so that it is impossible to add extra heat dispensing plates 302 onto the top edges.
- the existed heat dispensing unit cannot efficiently dispense the high temperature generated from the latest chips which operate at very high speed and the low efficient heat dispensing unit restricts the use of the high end CPU in computers.
- the present invention intends to provide a heat dispensing unit for memory chips wherein the heat dispensing plates are securely connected to each other by two clamps clamping two ends of the heat dispensing plates. The clamps further hook the notches of the chip.
- the present invention relates to a heat dispensing unit which comprises two heat dispensing plates between which the chip is clamped.
- Each heat dispensing plate has multiple ridges extending from an outside thereof and two holes are defined through two ends of each heat dispensing plate.
- Two clamps clamp the two ends of the two heat dispensing plates.
- Each clamp having two side plates and a flexible plate connected between the two side plates, two protrusions extend from two respective insides of the two side plates. The two protrusions are engaged with the holes of the two heat dispensing plates.
- the primary object of the present invention is to provide a heat dispending unit for chips wherein the two heat dispensing plates are securely connected to each other by two clamps from two ends of the heat dispensing plates.
- FIG. 1 is an exploded view to show the heat dispensing unit of the present invention
- FIG. 2 is a perspective view to show that the chip is clamped between the two heat dispensing plates of the heat dispensing unit of the present invention
- FIG. 3 is a perspective view to show the clamp for clamping the two heat dispensing plates of the present invention.
- FIG. 4 is an exploded view to show the conventional heat dispensing unit.
- the heat dispensing unit 1 of the present invention comprises two heat dispensing plates 1 and each heat dispensing plate 1 includes multiple parallel ridges 14 extending from an outside thereof.
- Each of the heat dispensing plates 1 is an aluminum extruding plate.
- a heat conductive pad 13 is attached to the inside of each heat dispensing plate 1 and two holes 12 are defined through two ends of each of the two heat dispensing plates 1 .
- the chip 2 that is clamped between the two heat dispensing plates 1 includes circuit pieces 21 extending therefrom which are in contact with the heat conductive pad 13 . Two notches are defined in two ends of the chip 2 .
- Two clamps 3 clamp the two ends of the two heat dispensing plates 1 and each clamp 3 has two side plates 31 and a flexible plate 32 connected between the two side plates 31 .
- Two protrusions 34 extend from two respective insides of the two side plates 31 so that the two protrusions 34 are engaged with the holes 12 of the two heat dispensing plates 1 to connect the two heat dispensing plates 1 .
- Two hooks 33 extend from a lower edge of the flexible plate 32 and hook the two notches defined in two ends of the chip 2 .
- Two heat dispensing parts 15 extend from a top of each of the heat dispensing plates 1 and the heat dispensing parts 15 extend inward from the top of each of the heat dispensing plates 1 .
- Each heat dispensing part 15 includes three fins so as to increase the efficiency of removal of heat.
- the heat dispensing parts 15 of the two heat dispensing plates 1 are located so that when the two heat dispensing plates 1 are connected to each other by the clamps 3 , the four heat dispensing part 15 are located head-to-tail to form a row of fins.
- the heat dispensing plates 1 include the ridges 14 , the heat conductive pad 13 , the fins of the heat dispensing parts 15 to effectively remove heat from the chip 2 .
- the clamps 3 are easily used and able to securely connect the heat dispensing plates 1 and the chip 2 to ensure that the chip 2 is in contact with the heat dispensing plates 1 .
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip.
Description
- (1) Field of the Invention
- The present invention relates to a heat dispensing unit for removing heat from memory chips and the heat dispensing unit includes two clamps clamping tow ends of the heat dispensing unit.
- (2) Description of the Prior Art
- A conventional
heat dispensing unit 30 for memory chips is shown inFIG. 4 and generally includes two heatconductive pads 301, twoheat dispensing plates 302 and twoclamps 303, wherein the heatconductive pads 301 are attached to in sides of the twoheat dispensing plates 302 which havehooks 302 a, engagingholes 302 b andengaging pieces 302 c on a top thereof. When the twoheat dispensing plates 302 are combined, a space is defined therebetween and thememory chip 2 is clamped. Theengaging pieces 302 c each have adownward positioning plates 302 d which are located corresponding to theU-shaped restriction slots 304 on outsides of theheat dispensing plates 302. A throughhole 305 is located above therestriction slot 304 and aguide slot 306 is located above the throughhole 305 so that when the twoclamps 303 clamp the twoheat dispensing plates 302, the twoclamps 303 are mounted onto the twopositioning plates 302 d and thehoods 303 a are engaged with the throughhole 305 via theguide slots 306 so that the twoheat dispensing plates 302 can clamp the memory chip 20. The heat generated from thememory chip 2 is conducted to theheat dispensing unit 30 and releases to air. - However, the conventional
heat dispensing unit 30 includes a complicated structure which includeshooks 303 a,restriction slots 304, throughholes 305 andguide slots 306. The complicated structure makes theheat dispensing unit 30 to be expensive and time consuming when manufacturing. Besides, the twoclamps 303 clamp at the top edges of the twoheat dispensing plates 302 so that it is impossible to add extraheat dispensing plates 302 onto the top edges. - The existed heat dispensing unit cannot efficiently dispense the high temperature generated from the latest chips which operate at very high speed and the low efficient heat dispensing unit restricts the use of the high end CPU in computers.
- The present invention intends to provide a heat dispensing unit for memory chips wherein the heat dispensing plates are securely connected to each other by two clamps clamping two ends of the heat dispensing plates. The clamps further hook the notches of the chip.
- The present invention relates to a heat dispensing unit which comprises two heat dispensing plates between which the chip is clamped. Each heat dispensing plate has multiple ridges extending from an outside thereof and two holes are defined through two ends of each heat dispensing plate. Two clamps clamp the two ends of the two heat dispensing plates. Each clamp having two side plates and a flexible plate connected between the two side plates, two protrusions extend from two respective insides of the two side plates. The two protrusions are engaged with the holes of the two heat dispensing plates.
- The primary object of the present invention is to provide a heat dispending unit for chips wherein the two heat dispensing plates are securely connected to each other by two clamps from two ends of the heat dispensing plates.
- The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
-
FIG. 1 is an exploded view to show the heat dispensing unit of the present invention; -
FIG. 2 is a perspective view to show that the chip is clamped between the two heat dispensing plates of the heat dispensing unit of the present invention; -
FIG. 3 is a perspective view to show the clamp for clamping the two heat dispensing plates of the present invention, and -
FIG. 4 is an exploded view to show the conventional heat dispensing unit. - Referring to
FIGS. 1 to 3 , theheat dispensing unit 1 of the present invention comprises twoheat dispensing plates 1 and eachheat dispensing plate 1 includes multipleparallel ridges 14 extending from an outside thereof. Each of theheat dispensing plates 1 is an aluminum extruding plate. A heatconductive pad 13 is attached to the inside of eachheat dispensing plate 1 and twoholes 12 are defined through two ends of each of the twoheat dispensing plates 1. Thechip 2 that is clamped between the twoheat dispensing plates 1 includescircuit pieces 21 extending therefrom which are in contact with the heatconductive pad 13. Two notches are defined in two ends of thechip 2. - Two
clamps 3 clamp the two ends of the twoheat dispensing plates 1 and eachclamp 3 has twoside plates 31 and aflexible plate 32 connected between the twoside plates 31. Twoprotrusions 34 extend from two respective insides of the twoside plates 31 so that the twoprotrusions 34 are engaged with theholes 12 of the twoheat dispensing plates 1 to connect the twoheat dispensing plates 1. Twohooks 33 extend from a lower edge of theflexible plate 32 and hook the two notches defined in two ends of thechip 2. By this arrangement, the heat dispensingplates 1, thechip 2 and the twoclamps 3 are securely connected to each other. - Two
heat dispensing parts 15 extend from a top of each of theheat dispensing plates 1 and theheat dispensing parts 15 extend inward from the top of each of theheat dispensing plates 1. Eachheat dispensing part 15 includes three fins so as to increase the efficiency of removal of heat. Theheat dispensing parts 15 of the twoheat dispensing plates 1 are located so that when the two heat dispensingplates 1 are connected to each other by theclamps 3, the fourheat dispensing part 15 are located head-to-tail to form a row of fins. - The
heat dispensing plates 1 include theridges 14, the heatconductive pad 13, the fins of theheat dispensing parts 15 to effectively remove heat from thechip 2. Theclamps 3 are easily used and able to securely connect theheat dispensing plates 1 and thechip 2 to ensure that thechip 2 is in contact with theheat dispensing plates 1. - While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.
Claims (5)
1. A heat dispensing unit comprising:
two heat dispensing plates and a chip being clamped between the two heat dispensing plates, each heat dispensing plate having multiple ridges extending from an outside thereof and two holes defined through two ends thereof, and
Two clamps clamping the two ends of the two heat dispensing plates, each clamp having two side plates and a flexible plate connected between the two side plates, two protrusions extending from two respective insides of the two side plates, the two protrusions engaged with the holes of the two heat dispensing plates.
2. The heat dispensing unit as claimed in claim 1 , wherein two hooks extending from a lower edge of the flexible plate and hook two notches defined in two ends of the chip.
3. The heat dispensing unit as claimed in claim 1 , wherein a heat conductive pad is applied to an inside of each of the heat dispensing plates.
4. The heat dispensing unit as claimed in claim 1 , wherein two heat dispensing parts extend from a top of each of the heat dispensing plates and the heat dispensing parts extend inward from the top of each of the heat dispensing plates.
5. The heat dispensing unit as claimed in claim 1 , wherein each of the heat dispensing plates is an aluminum extruding plate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097214762 | 2008-08-18 | ||
TW097214762U TWM355001U (en) | 2008-08-18 | 2008-08-18 | Lateral locking memory heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100038054A1 true US20100038054A1 (en) | 2010-02-18 |
Family
ID=41680458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/230,639 Abandoned US20100038054A1 (en) | 2008-08-18 | 2008-09-03 | Heat dispensing unit for memory chip |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100038054A1 (en) |
TW (1) | TWM355001U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD761744S1 (en) | 2012-07-18 | 2016-07-19 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD892753S1 (en) * | 2018-10-31 | 2020-08-11 | Bitmain Technologies Inc. | Heat sink |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109318A (en) * | 1990-05-07 | 1992-04-28 | International Business Machines Corporation | Pluggable electronic circuit package assembly with snap together heat sink housing |
US6233150B1 (en) * | 1998-12-28 | 2001-05-15 | Foxconn Precision Components Co., Ltd. | Memory module assembly |
US20030026076A1 (en) * | 2001-08-06 | 2003-02-06 | Wen-Chen Wei | Memory heat sink device |
US6535387B2 (en) * | 2001-06-28 | 2003-03-18 | Intel Corporation | Heat transfer apparatus |
US6728107B2 (en) * | 2002-07-26 | 2004-04-27 | Hon Hai Precision Ind. Co., Ltd. | Mounting assembly for heat sink |
US7221569B2 (en) * | 2004-09-15 | 2007-05-22 | Comptake Technology Co., Ltd. | Memory heat-dissipating device |
US20070151705A1 (en) * | 2005-12-30 | 2007-07-05 | Kwan Rita Y | Heat dissipating clamp for dissipating heat of chips in an electrical device |
US20070165382A1 (en) * | 2006-01-16 | 2007-07-19 | Nanya Technology Corporation | Heat sink assembly |
US7312996B2 (en) * | 2005-03-14 | 2007-12-25 | Wan Chien Chang | Heat sink for memory strips |
US7365985B1 (en) * | 2004-09-29 | 2008-04-29 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
US20080101036A1 (en) * | 2006-10-26 | 2008-05-01 | Chiung Yi Chen | Heat-dissipating assembly structure |
US7391613B2 (en) * | 2006-05-12 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US20080151487A1 (en) * | 2004-09-29 | 2008-06-26 | Super Talent Electronics, Inc. | Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive |
US7532477B2 (en) * | 2007-01-22 | 2009-05-12 | June-On Co., Ltd. | Memory module and heat sink arrangement |
US7626823B2 (en) * | 2008-04-11 | 2009-12-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly |
US7920383B2 (en) * | 2007-11-05 | 2011-04-05 | Samsung Electronics Co., Ltd. | Heat sink for dissipating heat and apparatus having the same |
-
2008
- 2008-08-18 TW TW097214762U patent/TWM355001U/en not_active IP Right Cessation
- 2008-09-03 US US12/230,639 patent/US20100038054A1/en not_active Abandoned
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109318A (en) * | 1990-05-07 | 1992-04-28 | International Business Machines Corporation | Pluggable electronic circuit package assembly with snap together heat sink housing |
US6233150B1 (en) * | 1998-12-28 | 2001-05-15 | Foxconn Precision Components Co., Ltd. | Memory module assembly |
US6535387B2 (en) * | 2001-06-28 | 2003-03-18 | Intel Corporation | Heat transfer apparatus |
US6765797B2 (en) * | 2001-06-28 | 2004-07-20 | Intel Corporation | Heat transfer apparatus |
US20030026076A1 (en) * | 2001-08-06 | 2003-02-06 | Wen-Chen Wei | Memory heat sink device |
US6728107B2 (en) * | 2002-07-26 | 2004-04-27 | Hon Hai Precision Ind. Co., Ltd. | Mounting assembly for heat sink |
US7221569B2 (en) * | 2004-09-15 | 2007-05-22 | Comptake Technology Co., Ltd. | Memory heat-dissipating device |
US20080151487A1 (en) * | 2004-09-29 | 2008-06-26 | Super Talent Electronics, Inc. | Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive |
US7365985B1 (en) * | 2004-09-29 | 2008-04-29 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
US7768785B2 (en) * | 2004-09-29 | 2010-08-03 | Super Talent Electronics, Inc. | Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive |
US7312996B2 (en) * | 2005-03-14 | 2007-12-25 | Wan Chien Chang | Heat sink for memory strips |
US20070151705A1 (en) * | 2005-12-30 | 2007-07-05 | Kwan Rita Y | Heat dissipating clamp for dissipating heat of chips in an electrical device |
US20070165382A1 (en) * | 2006-01-16 | 2007-07-19 | Nanya Technology Corporation | Heat sink assembly |
US7382617B2 (en) * | 2006-01-16 | 2008-06-03 | Nanya Technology Corporation | Heat sink assembly |
US7391613B2 (en) * | 2006-05-12 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US20080101036A1 (en) * | 2006-10-26 | 2008-05-01 | Chiung Yi Chen | Heat-dissipating assembly structure |
US7532477B2 (en) * | 2007-01-22 | 2009-05-12 | June-On Co., Ltd. | Memory module and heat sink arrangement |
US7920383B2 (en) * | 2007-11-05 | 2011-04-05 | Samsung Electronics Co., Ltd. | Heat sink for dissipating heat and apparatus having the same |
US7626823B2 (en) * | 2008-04-11 | 2009-12-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD761744S1 (en) | 2012-07-18 | 2016-07-19 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD892753S1 (en) * | 2018-10-31 | 2020-08-11 | Bitmain Technologies Inc. | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
TWM355001U (en) | 2009-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: COMPTAKE TECHNOLOGY INC.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, WEI-HAU;YEN, STEVEN;REEL/FRAME:021520/0439 Effective date: 20080828 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |