US20090243988A1 - Retractable pin tool - Google Patents
Retractable pin tool Download PDFInfo
- Publication number
- US20090243988A1 US20090243988A1 US12/056,849 US5684908A US2009243988A1 US 20090243988 A1 US20090243988 A1 US 20090243988A1 US 5684908 A US5684908 A US 5684908A US 2009243988 A1 US2009243988 A1 US 2009243988A1
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- United States
- Prior art keywords
- pin
- pins
- item
- retractable
- driver
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Definitions
- Exemplary embodiments relate generally to a device and method that may be used in the manufacture of flat panel display devices. More particularly, the exemplary embodiments relate to a device and method that may be used to align a display with one or more drivers.
- a liquid crystal fluid contained between a front plate and a rear plate, is twisted by a voltage which changes the axis of polarization of light, allowing the individual color dots to transmit or block light passing from a backlight source through the individual color filters.
- the color dots are arranged in a grid comprising rows and columns, and there can be several hundred or thousand vertical columns of color dots going across the display as well as hundreds or thousands of horizontal rows of color dots, resulting in most cases in more than 1,000,000 individual color dots.
- Each color dot has a vertical column and horizontal row grid address and is driven by electrical impulses fed along its respective row from a bus located on one of the side edges of the flat panel LCD and along its respective column from a top or bottom edge of the flat panel LCD.
- the horizontal row drivers are referred to as gate drivers and the vertical column drivers are referred to as source drivers, but these may be reversed in practice, as will be known to those of skill in the art.
- the source driver signal provides the gray scale data for a given color dot
- the gate driver signal changes a given line of thin film transistors (“TFTs”) from “off” to “on” for a given “line time.” This signal from the gate driver thereby allows the charging of a capacitor associated with the individual color dot, determining the voltage held by the color dot for an entire frame period.
- TFTs thin film transistors
- the panel that comprises the liquid crystal fluid and the front and rear plates contains flexible printed circuit elements that function as input and output for the gate, source, and heater driver circuit card assemblies.
- These circuit elements, or “tabs”, contain electrical contacts, or “pads”, that must be properly aligned with matching electrical contacts on each respective driver circuit card assembly in order for all the color dots to receive electrical signals and respond properly.
- An anisotropic, electrically conductive adhesive is typically used to make the electrical connection between the pads on the tabs of the LCD and the pads on each driver circuit card assembly, or “driver.” Alignment is key, as misalignment can result in a LCD display where parts of the screen are either partially or completely unresponsive to electrical signals, and is unsuitable for sale.
- the known art has failed to provide a device and method for properly aligning a LCD tab with drivers without damaging the LCD tabs or drivers. Furthermore, the known art has yet to provide a carrier for transporting a LCD with adhered tabs that have been aligned upon a driver.
- An exemplary embodiment includes a retractable pin tool device for aligning a LCD panel with adhered tabs with driver circuit card assemblies. It is also an object of the exemplary embodiments to provide a retractable pin tool device for aligning a LCD panel with adhered tabs to with gate, source, and heater driver circuit card assemblies. An exemplary embodiment provides a method for aligning an LCD panel with adhered tabs to gate, source and heater driver circuit card assemblies using retractable pins.
- Exemplary embodiments may comprise a base upon which a center platform and one or more pin blocks are attached.
- the center platform may be adapted to receive a first item.
- the pin blocks each have a plurality of pins that extend from their surface, and the pin blocks each have a means for retracting said pins into their surface. Handles may also be used in association with the pinion blocks to control the retraction and extension of pins.
- the pin blocks are located around the perimeter of the center platform such that when a first item is placed on the center platform, the pins may hold a second item in fixed position relative to the first item. In some embodiments the pins may hold the first item in place as well as a second item in place.
- the pins may be retracted into the pin blocks. When the pins are retracted any item formerly held in place by the pins is released.
- the center platform may be adapted to receive an LCD panel that has adhered tabs.
- the retractable pins may be used to hold gate, source, and heat drivers in fixed relative positions to the LCD panel and adhered tabs so that they can be bonded together or otherwise manipulated.
- the pins can hold these items in position while preventing shifting of the items and its damaging effects.
- the pins can be retracted into the pin blocks without difficulty and without injuring the LCD panel assembly.
- different amounts of pin blocks may be present, the position of the pin blocks relative to the central platform may vary, and the location and number of pins on each pin block may vary.
- FIG. 1 shows a top perspective view of an exemplary embodiment of a device of the exemplary embodiments.
- FIG. 2 shows a rear perspective view of the exemplary device of FIG. 1 .
- FIG. 3 shows a rear perspective view of the exemplary device of FIG. 1 .
- FIG. 5 shows cross-sectional, fragmented view of an exemplary embodiment of a heat pin block as shown in FIG. 4 .
- FIG. 7 shows a left side elevational view of the exemplary device of FIG. 1 .
- FIG. 8 shows a top plan view of the exemplary device of FIG. 1 with an LCD panel.
- FIG. 10 shows a top plan view of the exemplary device of FIG. 1
- FIG. 11 shows a bottom plan view of the exemplary device of FIG. 1 .
- FIG. 12 shows a top plan view of a second embodiment of a device of the exemplary embodiments.
- FIG. 13 shows a left side elevational view of the exemplary device of FIG. 12 .
- FIG. 14 shows a front elevational view of the exemplary device of FIG. 12 .
- FIGS. 1 and 2 illustrate an exemplary embodiment may be used for aligning one or more source, gate, or heater driver circuit card assemblies (or “drivers”) to the circuit elements (or “tabs”) adhered to a liquid crystal display (LCD) panel.
- the device may consist of a base platform 10 with a substantially square center platform 20 and three rectangular pin blocks 30 positioned along three sides of the center platform 20 .
- Each pin block 30 may align a different type of driver with an LCD display that is positioned on the center platform 20 .
- the gate pin block 50 may be located on the front of base platform 10 while the source pin block 40 and heater pin block 60 maybe located along the left and right sides of the center platform 20 , respectively.
- the center platform 20 is fixedly attached to the base platform 10 .
- a substantially square center cap 70 may cover the top of the center platform 20 .
- the center cap 70 may be shaped such that it can receive an LCD panel and provide proper support and/or prevent shifting of an LCD display without the use of additional tooling to support the LCD and adhered tabs.
- the center cap 70 shown in FIGS. 1 and 2 may be used for those LCD panels that do not have rear laminations. In some embodiments the center caps 70 may be shaped differently to accommodate LCD panels having rear laminations. In some embodiments the center cap 70 may be removable so that different center caps 70 can be attached to the center platform 20 as desired.
- the base platform 10 , center platform 20 , and pin blocks 30 may be made out of any rigid material such as phenolic molding, steel, wood, or hard plastic. Depending on the materials used the base platform 10 and center platform 20 may be formed from one piece of material. In other embodiments the different parts of the base platform 10 and center platform 20 may be created separately and assembled using screws or adhesives. Furthermore, while in some embodiments the center platform 20 may have a substantially square shape, in other embodiments the center platform 20 and center cap 70 may have different shapes to accommodate the shape of the LCD panel being used. Furthermore, in other embodiments the shape of the pin blocks 30 may also be different from those shown in FIGS. 1 and 2 . As shown in FIGS. 1 and 2 the top surface of the pin blocks may not be flat, but may be carved out as desired to provide proper stability and strength to the device.
- each pin block 30 may have a corresponding pinion set 80 .
- Each pinion set 80 may be made of a pinion wire 90 that is located inside the length of its respective pin block 30 .
- the pinion wire 90 extends out of the gate pin block 50 on both ends, where it is encircled by a miter gear 110 on each end, and capped by a handle 120 on each end.
- the pinion wire 90 in the heater pin block 60 and source pin block 40 extend out the front ends of both pin blocks, where they are capped by miter gears 110 .
- the pinion wires are capped with retaining clips 130 .
- the pinion wires 90 may have gear teeth at least along the length of their respective pin block 30 .
- the location of the miter gears 110 on the pinion wires 90 of the gate, heater, and source pinion sets 80 are such that the teeth on the miter gears 110 on left and right side of the gate pinion set 100 engage with the teeth on the miter gear 110 of the source and heater pinion sets 80 respectively.
- each pin block may be a series of pin holes 150 .
- the pin holes 150 may be square.
- the pin holes 150 may be deep enough that they extend beyond the depth of the pinion wires 90 .
- the pin holes 150 may extend through the pin blocks 30 and to the bottom surface of the base platform 10 . However, in other embodiments the pin holes 150 may not reach through the bottom surface of the base platform 10 .
- a pin assembly 160 consisting of a square pin 170 mounted to a square pin base 180 .
- the width of the pin base 180 may be slightly smaller than that of the pin hole 150 so that the pin assembly 160 may move vertically within the pin hole 150 but are restricted from shifting in a horizontal direction.
- the side of the pin bases 180 facing the pinion wires 90 may contain pin base teeth 190 that are sized to engage with the pinion wire teeth 200 .
- the relative location of the pin holes 150 and pin bases 180 to the pinion wires 90 may be such that the pin base teeth 190 are always engaged with the pinion wire teeth 200 .
- pin holes 150 are located on the top surface of the gate pin block 50 , while the source pin block 40 and heater pin block 60 have eight and six pin holes 150 , respectively.
- the pin holes 150 may be located in series.
- the pin holes 150 on the gate pin block 50 are located in two series of two pin holes 150 each, with the pin holes 150 in both series equally spaced from one another.
- the heater pin block 60 has three series of two pin holes 150 each, while the source pin block 40 has three alternating series of pin holes 150 having three, two, and three pin holes 150 respectively.
- the pin holes 150 may be located in different series, may be evenly distributed across the length of the pin blocks 30 , or may be located in any other desirable positions.
- different numbers of pin holes 150 may be located on the pin blocks.
- the movement of the pin assemblies 160 through the pin holes 150 is caused by turning the handles 120 from an “up” to a “down” position, and vice versa. That is, when the handles 120 are located in an “up” position, as shown in FIG. 3 , the pin assemblies 160 are completely within the pin holes 150 and the tops of the pins 170 do not breach the surface of the pin blocks 30 . However, as the handles 120 are pushed downwards, they cause the pinion wire 90 in the gate pinion set 100 to rotate around the axis of the pinion wire 90 .
- the miter gears 110 on each end of the gate pinion set 100 engage with the miter gears 110 on the source and heater pinion sets 80 , which in turn causes the pin wires 90 in the source and heater pinion sets 80 to also rotate about their respective axes.
- the direction of rotation of the pinion wire 90 in the heat pinion set 100 around the axis B-B of the pinion wire in the heater pin block 40 during movement of the handles from an “up” to “down” position is shown by arrow 210 in FIG. 5 .
- each pinion wire 90 rotates, the pinion wire teeth 200 engage with the pin base teeth 190 on each pin assembly 160 .
- the rotation of the pinion wire 90 causes the pin assemblies 160 to move in unison upwards towards the top surface of their respective pin block 30 . This movement continues until the handles have reached the “down” position, shown in FIGS. 1 and 2 .
- the movement of the pin assemblies 160 during the movement of the handles 120 from the “up” to “down” position is shown by arrow 220 .
- FIG. 6 shows the arc 230 the handles 120 may make as they move from the “down” position to the “up” position.
- the angle of this arc 230 may be ninety degrees. However, in other embodiments this angle may be smaller or larger.
- the pins 170 and part of the pin bases 180 may extend through the top surface of the pin blocks 30 .
- the height of the pins 170 and pin bases 180 as measured from the top of the pin blocks 30 when the handles are in the “down” position may be the same for all the pins assemblies 160 in the device.
- the handles 120 may be in different positions as the pins 170 are retracted.
- the handles 120 may be in a “down” position when the pins 170 are retracted, and may be moved to an “up” position as the pins 170 are extended.
- the means for retracting the pins 70 may be adjusted accordingly to address a different direction of movement of the handles 120 .
- there may be no handles 120 but instead there may be a switch, button, or other means for engaging the retracting means.
- the pin tool may be automated.
- braces 240 located on the top surface of the pin blocks.
- the braces 240 may aid in the alignment of drivers with the LCD panels.
- the handles 120 may be moved into the “up” position. Because the handles are attached to the gate pinion set 100 , rotation of the handles about axis A-A of the pinion wire 90 in the gate pinion set 100 causes the pinion wire 90 in the gate pinion set 100 to rotate, which in turn rotates the pinion wires 90 in the source and heater pinion sets 80 in a counter-clockwise fashion. Through the engagement of the pin base teeth 190 with the pinion wire teeth 200 , the pin assemblies 160 may be pulled downwards into the pin blocks 30 . As the handles reach the “up” position the pin assemblies 160 may be fully retracted into the pin blocks 30 .
- Some embodiments may include means for locking the handles 120 into the “down” position so that the pins 170 are prevented from moving. In some embodiments, such as that shown in FIGS. 1 and 7 , this may be accomplished through the use of a retractable spring plunger 250 and a modified gate pinion wire 260 .
- the spring plunger 250 may be centrally located on the front side of the gate pin block 50 and extend through the gate pin block 50 to the modified gate pinion wire 260 .
- the modified gate pinion wire 260 has a hole 270 centrally located such that when the handles 120 are in the “down” position the retractable spring plunger 250 snaps into the hole 270 and locks the position of the modified gate pinion wire 260 . This locked position is shown in FIG. 7 .
- the retractable spring plunger 250 can be manually retracted, thereby unlocking the pinion wire 90 in the gate pinion set 100 and allowing the handles 120 to be pushed into the “up” position.
- different means for locking the pinion wire 90 in the gate pinion set 100 into either the “up”, “down”, or any intermediate position may be used.
- driver supports 280 may be located on top of the pin blocks 30 .
- the driver supports 280 have cylindrical shapes and are located between the pin holes 150 and the center platform 20 .
- the height of the driver supports 280 may be the same as the pin bases 180 when the handles 120 are in the “down” position.
- the driver supports 280 may provide support the weight of drivers when they are being aligned with an LCD panel.
- driver supports 280 may be located in different positions on the source blocks or may have different shapes. Other types of supports may also be used depending on the materials that the device of the exemplary embodiments is used to assemble.
- the comparable heights of pin blocks 30 , center platform 20 , center cap 70 , and fully extended pin bases 180 depends on the thickness of the materials being assembled. Because LCD displays, especially LCD membranes, may be very thin, in some embodiments of the present invention the heights of these features may be very similar. For example, in the exemplary embodiment shown in FIG. 1 , where the width of the base platform 10 may be around nine inches, the difference between the height of the center cap 70 as attached to the center platform 20 and the pin bases 180 may be less than 0.02 inches. The difference between the height of a driver support 280 and a pin base 180 may be 0.01 inches or less.
- the pin bases 180 will be flush with the top surface of the pin blocks 30 when fully extended. However, in other embodiments, when fully extended the pin bases 180 will be higher than the top surfaces of the pin blocks 30 .
- the height of the pins 170 may only be as high as the thickness of the materials being assembled on the device. However, in other embodiments the pins 170 may be higher in order to provide extra stability.
- Exemplary embodiments may be used to secure materials in place while other materials are aligned to them, bonded to them, or while other operations are conducted.
- some embodiments of the present invention may be used to hold LCD panels with adhered circuit elements (tabs) in place while driver circuit card assemblies (drivers) are aligned with the circuit elements and bonded.
- an LCD panel 400 with tabs 410 attached may be centered on the center platform 20 .
- gate tabs 420 , source tabs 430 , and heater tabs 440 attached to the LCD panel 400 .
- the handles 120 may be put into the “down” position in preparation for receiving the tabs.
- Each tab 410 has two or more alignment holes 450 that are sized to receive a pin 170 .
- each gate tab 420 , source tab 430 , and heater tab 440 may be set upon its respective pins 170 .
- the alignment holes 450 in the tabs are circular, and the pins 170 are square, which when properly proportioned may help secure the tabs in place and provide for better alignment.
- circular pins 170 used in conjunction with circular alignment holes 450 or square pins 170 used in conjunction with square alignment holes 450 may be preferred.
- Other combinations of pin 170 shapes to alignment hole 450 shapes may be utilized as well.
- the tabs may be prepared for bonding.
- An electrically conductive adhesive such as anisotropic conductive film (ACF) may be placed upon the tops of the tabs.
- ACF anisotropic conductive film
- one or more drivers 460 may be placed on top of one or more tabs in order to bond them together. As shown in FIG. 9 , three drivers 460 may be bonded: a gate driver 470 to be aligned with the gate tabs 420 , a source driver 480 to be aligned with the source tabs 430 , and a heater driver 490 to be aligned with the heater tabs 440 .
- Each driver 460 may have alignment holes of the same size as the tabs 410 in order to receive the pins 170 .
- the positioning of the alignment holes on the drivers 460 is such that when received by the pins 170 , a driver 460 will be in a desired position relative to the tabs 410 . Once in this position, the drivers 460 can be bonded to the tabs 410 either manually or through the use of a tool.
- FIG. 10 shows the features of an exemplary embodiment of the present invention, and also shows that the braces 240 and center platform 20 may be adhered to the base platform 10 by screws 290 .
- FIG. 11 shows where screws 290 may be placed on the bottom of the base platform 10 .
- FIGS. 11 , 12 , 13 , and 14 show an exemplary embodiment made from a single piece of phenolic molding.
- the portion of the pinion wires 90 inside the pin blocks 30 can be viewed from outside the pin blocks 30 .
- FIG. 12 in this embodiment there are four series of pin holes 150 along the top surface of the gate pin block 50 , and each series has two pins holes 150 each.
- the heater pin block 60 and source pin block 40 have two series of two pin holes 150 each.
- FIG. 14 shows the relative position of the pin assemblies 160 in the gate pin block 50 to the pinion wire 90 in the gate pinion set 100 . As shown in FIG. 13 , the handles are in an “up” position and the pins are retracted within the pin holes.
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- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
- This application makes no priority claim.
- Exemplary embodiments relate generally to a device and method that may be used in the manufacture of flat panel display devices. More particularly, the exemplary embodiments relate to a device and method that may be used to align a display with one or more drivers.
- Flat panel displays using liquid crystal display (LCD) technology are widely known and have found application in a number of fields for displaying visual information. In a flat panel LCD, the screen area, which is substantially rectangular, is divided into a large number of individual color dots. Each set of color dots is capable of displaying a full color gamut. It is known for the sets to comprise a three-dot combination of red, green and blue, a four-dot combination of red, green, green and blue, a four-dot combination of red, green, blue and white, and a six-dot combination of red, green, blue, yellow, cyan and magenta, as well as other combinations that allow a full color display. In an active matrix flat panel LCD, each color dot contains a transistor switch. A liquid crystal fluid, contained between a front plate and a rear plate, is twisted by a voltage which changes the axis of polarization of light, allowing the individual color dots to transmit or block light passing from a backlight source through the individual color filters. The color dots are arranged in a grid comprising rows and columns, and there can be several hundred or thousand vertical columns of color dots going across the display as well as hundreds or thousands of horizontal rows of color dots, resulting in most cases in more than 1,000,000 individual color dots. Each color dot has a vertical column and horizontal row grid address and is driven by electrical impulses fed along its respective row from a bus located on one of the side edges of the flat panel LCD and along its respective column from a top or bottom edge of the flat panel LCD. In general, the horizontal row drivers are referred to as gate drivers and the vertical column drivers are referred to as source drivers, but these may be reversed in practice, as will be known to those of skill in the art. In either case, the source driver signal provides the gray scale data for a given color dot, while the gate driver signal changes a given line of thin film transistors (“TFTs”) from “off” to “on” for a given “line time.” This signal from the gate driver thereby allows the charging of a capacitor associated with the individual color dot, determining the voltage held by the color dot for an entire frame period.
- During the manufacture of a flat panel LCD, the panel that comprises the liquid crystal fluid and the front and rear plates contains flexible printed circuit elements that function as input and output for the gate, source, and heater driver circuit card assemblies. These circuit elements, or “tabs”, contain electrical contacts, or “pads”, that must be properly aligned with matching electrical contacts on each respective driver circuit card assembly in order for all the color dots to receive electrical signals and respond properly. An anisotropic, electrically conductive adhesive is typically used to make the electrical connection between the pads on the tabs of the LCD and the pads on each driver circuit card assembly, or “driver.” Alignment is key, as misalignment can result in a LCD display where parts of the screen are either partially or completely unresponsive to electrical signals, and is unsuitable for sale.
- Furthermore, because LCD tabs are very fragile the process of aligning a tab with a driver can damage an LCD if the tabs are allowed to flex, shift, or rub against the drivers or other surfaces during the alignment process.
- One previous attempt at aligning the LCD tabs to the drivers was done by placing tooling holes on both the LCD tabs and drivers such that when the LCD tabs were properly aligned over the drivers the tooling holes on the tabs and the drivers would line up. Electrical pads were located on both the tabs and drivers such that when aligned, the tooling holes would align as well, and pins could be driven through the holes to hold the LCD tabs and the drivers in proper alignment. However, this process has its disadvantages. The alignment of the tabs is difficult due to the delicateness and flexibility of the LCD tabs. Once in place the pins would stick and be difficult to remove without a substantial amount of prying, which had the potential to damage the tabs and drivers. Again, due to the fragility of the tabs, tabs could only sustain so much bending or damage before they would be considered useless under industry standards. For this reason this process often resulted in high product fallout. Furthermore, transportation of the LCD with tabs adhered to the drivers would also cause substantial damage to the tabs and reduce productive output due to unintended bending of the tabs due to handling.
- The known art has failed to provide a device and method for properly aligning a LCD tab with drivers without damaging the LCD tabs or drivers. Furthermore, the known art has yet to provide a carrier for transporting a LCD with adhered tabs that have been aligned upon a driver.
- An exemplary embodiment includes a retractable pin tool device for aligning a LCD panel with adhered tabs with driver circuit card assemblies. It is also an object of the exemplary embodiments to provide a retractable pin tool device for aligning a LCD panel with adhered tabs to with gate, source, and heater driver circuit card assemblies. An exemplary embodiment provides a method for aligning an LCD panel with adhered tabs to gate, source and heater driver circuit card assemblies using retractable pins.
- Exemplary embodiments may comprise a base upon which a center platform and one or more pin blocks are attached. The center platform may be adapted to receive a first item. The pin blocks each have a plurality of pins that extend from their surface, and the pin blocks each have a means for retracting said pins into their surface. Handles may also be used in association with the pinion blocks to control the retraction and extension of pins. The pin blocks are located around the perimeter of the center platform such that when a first item is placed on the center platform, the pins may hold a second item in fixed position relative to the first item. In some embodiments the pins may hold the first item in place as well as a second item in place. Once it is no longer desired for the pins to hold one or more items in place, the pins may be retracted into the pin blocks. When the pins are retracted any item formerly held in place by the pins is released. In some embodiments the center platform may be adapted to receive an LCD panel that has adhered tabs.
- The retractable pins may be used to hold gate, source, and heat drivers in fixed relative positions to the LCD panel and adhered tabs so that they can be bonded together or otherwise manipulated. The pins can hold these items in position while preventing shifting of the items and its damaging effects. Also, the pins can be retracted into the pin blocks without difficulty and without injuring the LCD panel assembly. Depending on the embodiment, different amounts of pin blocks may be present, the position of the pin blocks relative to the central platform may vary, and the location and number of pins on each pin block may vary.
- A better understanding of the disclosed embodiments will be obtained from a reading of the following detailed description and the accompanying drawings wherein identical reference characters refer to identical parts and in which:
-
FIG. 1 shows a top perspective view of an exemplary embodiment of a device of the exemplary embodiments. -
FIG. 2 shows a rear perspective view of the exemplary device ofFIG. 1 . -
FIG. 3 shows a rear perspective view of the exemplary device ofFIG. 1 . -
FIG. 4 shows a front elevational view of a cross-section of the exemplary device ofFIG. 1 as taken along line 4-4. -
FIG. 5 shows cross-sectional, fragmented view of an exemplary embodiment of a heat pin block as shown inFIG. 4 . -
FIG. 6 shows a right side elevational view of the exemplary device ofFIG. 1 . -
FIG. 7 shows a left side elevational view of the exemplary device ofFIG. 1 . -
FIG. 8 shows a top plan view of the exemplary device ofFIG. 1 with an LCD panel. -
FIG. 10 shows a top plan view of the exemplary device ofFIG. 1 -
FIG. 11 shows a bottom plan view of the exemplary device ofFIG. 1 . -
FIG. 12 shows a top plan view of a second embodiment of a device of the exemplary embodiments. -
FIG. 13 shows a left side elevational view of the exemplary device ofFIG. 12 . -
FIG. 14 shows a front elevational view of the exemplary device ofFIG. 12 . -
FIGS. 1 and 2 illustrate an exemplary embodiment may be used for aligning one or more source, gate, or heater driver circuit card assemblies (or “drivers”) to the circuit elements (or “tabs”) adhered to a liquid crystal display (LCD) panel. The device may consist of abase platform 10 with a substantiallysquare center platform 20 and three rectangular pin blocks 30 positioned along three sides of thecenter platform 20. Eachpin block 30 may align a different type of driver with an LCD display that is positioned on thecenter platform 20. As shown inFIGS. 1 and 2 , there may be asource pin block 40, agate pin block 50, and aheater pin block 60. Thegate pin block 50 may be located on the front ofbase platform 10 while thesource pin block 40 andheater pin block 60 maybe located along the left and right sides of thecenter platform 20, respectively. Thecenter platform 20 is fixedly attached to thebase platform 10. A substantiallysquare center cap 70 may cover the top of thecenter platform 20. Thecenter cap 70 may be shaped such that it can receive an LCD panel and provide proper support and/or prevent shifting of an LCD display without the use of additional tooling to support the LCD and adhered tabs. Thecenter cap 70 shown inFIGS. 1 and 2 may be used for those LCD panels that do not have rear laminations. In some embodiments the center caps 70 may be shaped differently to accommodate LCD panels having rear laminations. In some embodiments thecenter cap 70 may be removable so that different center caps 70 can be attached to thecenter platform 20 as desired. - The
base platform 10,center platform 20, and pin blocks 30 may be made out of any rigid material such as phenolic molding, steel, wood, or hard plastic. Depending on the materials used thebase platform 10 andcenter platform 20 may be formed from one piece of material. In other embodiments the different parts of thebase platform 10 andcenter platform 20 may be created separately and assembled using screws or adhesives. Furthermore, while in some embodiments thecenter platform 20 may have a substantially square shape, in other embodiments thecenter platform 20 andcenter cap 70 may have different shapes to accommodate the shape of the LCD panel being used. Furthermore, in other embodiments the shape of the pin blocks 30 may also be different from those shown inFIGS. 1 and 2 . As shown inFIGS. 1 and 2 the top surface of the pin blocks may not be flat, but may be carved out as desired to provide proper stability and strength to the device. - As shown in the exemplary embodiment of
FIG. 1 , eachpin block 30 may have a corresponding pinion set 80. Each pinion set 80 may be made of apinion wire 90 that is located inside the length of itsrespective pin block 30. In the gate pinion set 100 thepinion wire 90 extends out of thegate pin block 50 on both ends, where it is encircled by amiter gear 110 on each end, and capped by ahandle 120 on each end. - The
pinion wire 90 in theheater pin block 60 andsource pin block 40 extend out the front ends of both pin blocks, where they are capped by miter gears 110. On the back surface of theheater pin block 60 andsource pin block 40 the pinion wires are capped with retainingclips 130. In all the pinion sets 80 thepinion wires 90 may have gear teeth at least along the length of theirrespective pin block 30. - The location of the miter gears 110 on the
pinion wires 90 of the gate, heater, and source pinion sets 80 are such that the teeth on the miter gears 110 on left and right side of the gate pinion set 100 engage with the teeth on themiter gear 110 of the source and heater pinion sets 80 respectively. - Located along the length of each pin block may be a series of pin holes 150. As shown in
FIG. 3 where thehandles 120 are located in an “up” position, in some embodiments the pin holes 150 may be square. The pin holes 150 may be deep enough that they extend beyond the depth of thepinion wires 90. In some embodiments the pin holes 150 may extend through the pin blocks 30 and to the bottom surface of thebase platform 10. However, in other embodiments the pin holes 150 may not reach through the bottom surface of thebase platform 10. As shown inFIGS. 4 and 5 , within eachpin hole 150 may be apin assembly 160 consisting of asquare pin 170 mounted to asquare pin base 180. The width of thepin base 180 may be slightly smaller than that of thepin hole 150 so that thepin assembly 160 may move vertically within thepin hole 150 but are restricted from shifting in a horizontal direction. The side of the pin bases 180 facing thepinion wires 90 may containpin base teeth 190 that are sized to engage with thepinion wire teeth 200. The relative location of the pin holes 150 andpin bases 180 to thepinion wires 90 may be such that thepin base teeth 190 are always engaged with thepinion wire teeth 200. - In the embodiment shown in
FIG. 3 , fourpin holes 150 are located on the top surface of thegate pin block 50, while thesource pin block 40 andheater pin block 60 have eight and sixpin holes 150, respectively. As shown inFIG. 3 , the pin holes 150 may be located in series. The pin holes 150 on thegate pin block 50 are located in two series of twopin holes 150 each, with the pin holes 150 in both series equally spaced from one another. Theheater pin block 60 has three series of twopin holes 150 each, while thesource pin block 40 has three alternating series of pin holes 150 having three, two, and threepin holes 150 respectively. In other embodiments the pin holes 150 may be located in different series, may be evenly distributed across the length of the pin blocks 30, or may be located in any other desirable positions. Furthermore, in other embodiments different numbers of pin holes 150 may be located on the pin blocks. - The movement of the
pin assemblies 160 through the pin holes 150 is caused by turning thehandles 120 from an “up” to a “down” position, and vice versa. That is, when thehandles 120 are located in an “up” position, as shown inFIG. 3 , thepin assemblies 160 are completely within the pin holes 150 and the tops of thepins 170 do not breach the surface of the pin blocks 30. However, as thehandles 120 are pushed downwards, they cause thepinion wire 90 in the gate pinion set 100 to rotate around the axis of thepinion wire 90. The miter gears 110 on each end of the gate pinion set 100 engage with the miter gears 110 on the source and heater pinion sets 80, which in turn causes thepin wires 90 in the source and heater pinion sets 80 to also rotate about their respective axes. The direction of rotation of thepinion wire 90 in the heat pinion set 100 around the axis B-B of the pinion wire in theheater pin block 40 during movement of the handles from an “up” to “down” position is shown byarrow 210 inFIG. 5 . - As each
pinion wire 90 rotates, thepinion wire teeth 200 engage with thepin base teeth 190 on eachpin assembly 160. The rotation of thepinion wire 90 causes thepin assemblies 160 to move in unison upwards towards the top surface of theirrespective pin block 30. This movement continues until the handles have reached the “down” position, shown inFIGS. 1 and 2 . The movement of thepin assemblies 160 during the movement of thehandles 120 from the “up” to “down” position is shown byarrow 220. -
FIG. 6 shows the arc 230 thehandles 120 may make as they move from the “down” position to the “up” position. In some embodiments the angle of this arc 230 may be ninety degrees. However, in other embodiments this angle may be smaller or larger. As shown inFIGS. 1 and 2 , when thehandles 120 are in the “down position” thepins 170 and part of the pin bases 180 may extend through the top surface of the pin blocks 30. The height of thepins 170 andpin bases 180, as measured from the top of the pin blocks 30 when the handles are in the “down” position may be the same for all thepins assemblies 160 in the device. In some embodiments thehandles 120 may be in different positions as thepins 170 are retracted. For example, in some embodiments thehandles 120 may be in a “down” position when thepins 170 are retracted, and may be moved to an “up” position as thepins 170 are extended. In these embodiments the means for retracting thepins 70, whether through the use ofpinion wires 90 or not, may be adjusted accordingly to address a different direction of movement of thehandles 120. In still other embodiments there may be nohandles 120, but instead there may be a switch, button, or other means for engaging the retracting means. In other embodiments the pin tool may be automated. - As shown in
FIGS. 1 and 2 , in some embodiments there may bebraces 240 located on the top surface of the pin blocks. Thebraces 240 may aid in the alignment of drivers with the LCD panels. - In order for the
pins 170 to be retracted, thehandles 120 may be moved into the “up” position. Because the handles are attached to the gate pinion set 100, rotation of the handles about axis A-A of thepinion wire 90 in the gate pinion set 100 causes thepinion wire 90 in the gate pinion set 100 to rotate, which in turn rotates thepinion wires 90 in the source and heater pinion sets 80 in a counter-clockwise fashion. Through the engagement of thepin base teeth 190 with thepinion wire teeth 200, thepin assemblies 160 may be pulled downwards into the pin blocks 30. As the handles reach the “up” position thepin assemblies 160 may be fully retracted into the pin blocks 30. - Some embodiments may include means for locking the
handles 120 into the “down” position so that thepins 170 are prevented from moving. In some embodiments, such as that shown inFIGS. 1 and 7 , this may be accomplished through the use of aretractable spring plunger 250 and a modifiedgate pinion wire 260. Thespring plunger 250 may be centrally located on the front side of thegate pin block 50 and extend through thegate pin block 50 to the modifiedgate pinion wire 260. The modifiedgate pinion wire 260 has a hole 270 centrally located such that when thehandles 120 are in the “down” position theretractable spring plunger 250 snaps into the hole 270 and locks the position of the modifiedgate pinion wire 260. This locked position is shown inFIG. 7 . When it is desired to push thehandles 120 into the “up” position, theretractable spring plunger 250 can be manually retracted, thereby unlocking thepinion wire 90 in the gate pinion set 100 and allowing thehandles 120 to be pushed into the “up” position. In other embodiments different means for locking thepinion wire 90 in the gate pinion set 100 into either the “up”, “down”, or any intermediate position may be used. - In some embodiments driver supports 280 may be located on top of the pin blocks 30. In the exemplary embodiment shown in
FIG. 1 the driver supports 280 have cylindrical shapes and are located between the pin holes 150 and thecenter platform 20. As shown inFIG. 5 , the height of the driver supports 280 may be the same as the pin bases 180 when thehandles 120 are in the “down” position. The driver supports 280 may provide support the weight of drivers when they are being aligned with an LCD panel. In other embodiments driver supports 280 may be located in different positions on the source blocks or may have different shapes. Other types of supports may also be used depending on the materials that the device of the exemplary embodiments is used to assemble. - The comparable heights of pin blocks 30,
center platform 20,center cap 70, and fully extendedpin bases 180 depends on the thickness of the materials being assembled. Because LCD displays, especially LCD membranes, may be very thin, in some embodiments of the present invention the heights of these features may be very similar. For example, in the exemplary embodiment shown inFIG. 1 , where the width of thebase platform 10 may be around nine inches, the difference between the height of thecenter cap 70 as attached to thecenter platform 20 and the pin bases 180 may be less than 0.02 inches. The difference between the height of adriver support 280 and apin base 180 may be 0.01 inches or less. However, in different embodiments of the present invention where thicker materials are being assembled, there may be greater differences in height between thecenter cap 70, fully extendedpin bases 180, and driver supports 280. In some embodiments of the present invention the pin bases 180 will be flush with the top surface of the pin blocks 30 when fully extended. However, in other embodiments, when fully extended the pin bases 180 will be higher than the top surfaces of the pin blocks 30. - The height of the
pins 170 may only be as high as the thickness of the materials being assembled on the device. However, in other embodiments thepins 170 may be higher in order to provide extra stability. - Exemplary embodiments may be used to secure materials in place while other materials are aligned to them, bonded to them, or while other operations are conducted. For example, some embodiments of the present invention may be used to hold LCD panels with adhered circuit elements (tabs) in place while driver circuit card assemblies (drivers) are aligned with the circuit elements and bonded. As shown in
FIG. 8 , anLCD panel 400 withtabs 410 attached may be centered on thecenter platform 20. InFIG. 8 there aregate tabs 420,source tabs 430, andheater tabs 440 attached to theLCD panel 400. At the time theLCD panel 400 is placed on the device thehandles 120 may be put into the “down” position in preparation for receiving the tabs. - Each
tab 410 has two ormore alignment holes 450 that are sized to receive apin 170. In this way, eachgate tab 420,source tab 430, andheater tab 440 may be set upon itsrespective pins 170. In the exemplary embodiment ofFIG. 9 , the alignment holes 450 in the tabs are circular, and thepins 170 are square, which when properly proportioned may help secure the tabs in place and provide for better alignment. However, in other embodiments of the present inventioncircular pins 170 used in conjunction with circular alignment holes 450, orsquare pins 170 used in conjunction with square alignment holes 450 may be preferred. Other combinations ofpin 170 shapes toalignment hole 450 shapes may be utilized as well. - Once the
LCD panel 400 withtabs 410 is positioned on theplatform 20 and thepins 170 have been extended by placing thehandles 120 into the “down” position, the tabs may be prepared for bonding. An electrically conductive adhesive such as anisotropic conductive film (ACF) may be placed upon the tops of the tabs. Once the tabs are prepared for bonding, one ormore drivers 460 may be placed on top of one or more tabs in order to bond them together. As shown inFIG. 9 , threedrivers 460 may be bonded: agate driver 470 to be aligned with thegate tabs 420, asource driver 480 to be aligned with thesource tabs 430, and aheater driver 490 to be aligned with theheater tabs 440. Eachdriver 460 may have alignment holes of the same size as thetabs 410 in order to receive thepins 170. The positioning of the alignment holes on thedrivers 460 is such that when received by thepins 170, adriver 460 will be in a desired position relative to thetabs 410. Once in this position, thedrivers 460 can be bonded to thetabs 410 either manually or through the use of a tool. - Other operations may also be performed to the
LCD panel 400,tabs 410, anddrivers 460 while they are aligned. Once all desired operations are complete, in order to remove theLCD panel 400 now with bothtabs 410 anddrivers 460 attached, thehandles 120 are pushed into the “up” position, which retracts thepins 170 in the manner described above. Once the pins are retracted theLCD panel 400 and all attached components can easily be lifted off theplatform 400. -
FIG. 10 shows the features of an exemplary embodiment of the present invention, and also shows that thebraces 240 andcenter platform 20 may be adhered to thebase platform 10 byscrews 290.FIG. 11 shows wherescrews 290 may be placed on the bottom of thebase platform 10. -
FIGS. 11 , 12, 13, and 14 show an exemplary embodiment made from a single piece of phenolic molding. In this embodiment the portion of thepinion wires 90 inside the pin blocks 30 can be viewed from outside the pin blocks 30. As can be seen fromFIG. 12 , in this embodiment there are four series of pin holes 150 along the top surface of thegate pin block 50, and each series has twopins holes 150 each. In comparison, theheater pin block 60 andsource pin block 40 have two series of twopin holes 150 each.FIG. 14 shows the relative position of thepin assemblies 160 in thegate pin block 50 to thepinion wire 90 in the gate pinion set 100. As shown inFIG. 13 , the handles are in an “up” position and the pins are retracted within the pin holes. - There are many additional embodiments of the present invention that vary from those described above. In some embodiments where it is desired to only align
gate drivers 470 andsource drivers 480 with aLCD panel 400 withtabs 410, there may be noheater pin block 60, but just agate pin block 50 and asource pin block 40. In other embodiments of the present invention there may be four pin blocks 30, such thatdrivers 460 can be aligned totabs 410 adhered to all sides of aLCD panel 400. Exemplary embodiments may be used to align any number and combination ofdrivers 460 with aLCD panel 400. In other embodiments of the present invention materials other thandrivers 460 may be aligned with theLCD panel 400 or any type of LCD panel. In still other embodiments materials other thanLCD panel 400 anddrivers 460 may be aligned with one another. In some embodiments of the present invention means other than pinion sets 80 and miter gears 110 may be used to retract thepins 170. - The exemplary embodiments herein disclosed are not intended to be exhaustive or to unnecessarily limit the scope of the invention. The exemplary embodiments were chosen and described in order to explain the principles of the invention so that others skilled in the art may practice the invention. Having shown and described exemplary embodiments of the invention, those skilled in the art will realize that many variations and modifications may be made to affect the described invention. Many of those variations and modifications will provide the same result and fall within the spirit of the claimed invention. It is the intention, therefore, to limit the invention only as indicated by the scope of the claims.
Claims (19)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US12/056,849 US8499437B2 (en) | 2008-03-27 | 2008-03-27 | Device and a method for aligning a panel having circuit elements with a driver |
US12/491,963 US8561976B2 (en) | 2008-03-27 | 2009-06-25 | Transportable carrier compatable with a retractable pin tool |
Applications Claiming Priority (1)
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US12/056,849 US8499437B2 (en) | 2008-03-27 | 2008-03-27 | Device and a method for aligning a panel having circuit elements with a driver |
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US12/491,963 Continuation-In-Part US8561976B2 (en) | 2008-03-27 | 2009-06-25 | Transportable carrier compatable with a retractable pin tool |
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US20090243988A1 true US20090243988A1 (en) | 2009-10-01 |
US8499437B2 US8499437B2 (en) | 2013-08-06 |
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US12/056,849 Active 2032-05-27 US8499437B2 (en) | 2008-03-27 | 2008-03-27 | Device and a method for aligning a panel having circuit elements with a driver |
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US20100028108A1 (en) * | 2008-03-27 | 2010-02-04 | American Panel Corporation | Transportable carrier compatable with a retractable pin tool |
CN109746672A (en) * | 2018-12-25 | 2019-05-14 | 广东天机工业智能系统有限公司 | Positioning tool and assembling carrier |
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CN109746672A (en) * | 2018-12-25 | 2019-05-14 | 广东天机工业智能系统有限公司 | Positioning tool and assembling carrier |
Also Published As
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US8499437B2 (en) | 2013-08-06 |
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