US20090168379A1 - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
- Publication number
- US20090168379A1 US20090168379A1 US12/203,818 US20381808A US2009168379A1 US 20090168379 A1 US20090168379 A1 US 20090168379A1 US 20381808 A US20381808 A US 20381808A US 2009168379 A1 US2009168379 A1 US 2009168379A1
- Authority
- US
- United States
- Prior art keywords
- printed circuit
- circuit board
- edge
- module
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- One embodiment of the invention relates to a countermeasure art against deflection and warpage of a printed circuit board installed in a small-sized electronic apparatus and in particular to an electronic apparatus for making it possible to efficiently reinforce a printed circuit board.
- JP-A-4-284692 Described above in JP-A-4-284692 is the warpage prevention structure wherein a reinforcing member provided by bending sheet metal as angular U-shaped in cross section is fitted around a rectangular printed circuit board with a spring property, thereby providing the warpage of the printed circuit board and a structure wherein the sheet metal is attached to three edges of the rectangular printed circuit board and the printed circuit board has a connector on the remaining edge.
- FIG. 1 is an exemplary perspective view showing a configuration of an electronic apparatus according to an embodiment of the invention
- FIG. 2 is an exemplary plan view of the printed circuit board shown in FIG. 1 ;
- FIG. 3 is an exemplary side view of the printed circuit board viewed from direction III shown in FIG. 2 ;
- FIG. 4 is an exemplary side view of the printed circuit board viewed from direction IV shown in FIG. 2 ;
- FIG. 5 is an exemplary perspective view showing a printed circuit board according to another embodiment of the invention.
- FIG. 6 is an exemplary perspective view showing a printed circuit board according to still another embodiment of the invention.
- an electronic apparatus includes: a polygonal printed circuit board provided with a cutout portion at least in a part, the cutout portion defined by at least a first edge and a second edge; and a first electronic component mounted on the printed circuit board; wherein the first electronic component is mounted at a position crossing a line defined by the first edge on the printed circuit board.
- FIG. 1 is a perspective view to schematically show the main part of an electronic apparatus such as a portable personal computer incorporating a reinforcement structure against deflection, warpage, etc., of a printed circuit board
- FIG. 2 is a plan view of the printed circuit board shown in FIG. 1
- FIG. 3 is a side view of the printed circuit board viewed from a direction indicated by arrow III shown in FIG. 2
- FIG. 4 is another side view of the printed circuit board viewed from a direction indicated by arrow IV shown in FIG. 2 (direction perpendicular to the direction indicated by arrow III).
- a polygonal printed circuit board 3 is installed in a casing 2 of an electronic apparatus 1 of the embodiment.
- the printed circuit board 3 is provided with a cutout portion 20 by cutting one edge of a quadrangular board like a letter L on the plan view over a given width and a given length.
- the cutout portion 20 is defined by a first edge 3 a and a second edge 3 b of the printed circuit board 3 .
- the first edge 3 a forming a part of the cutout portion 20 is shorter than a third edge 3 c and a fifth edge 3 e defining the outer periphery of the printed circuit board 3 .
- the second edge 3 b forming a part of the cutout portion 20 like the first edge 3 a is shorter than a fourth edge 3 d defining the outer periphery of the printed circuit board 3 , but is longer than a sixth edge 3 f.
- the cutout portion 20 is a part of a battery housing area 4 of the casing 2 , for example, and the area adjacent to the battery housing area 4 is a housing area 5 of a hard disk drive, etc.
- the printed circuit board 3 is provided with the cutout portion 20 , whereby a bending strength difference occurs between the area where the third edge 3 c exists and the area where the fifth edge 3 e exists with a line X-X as a boundary on the printed circuit board 3 .
- the printed circuit board 3 is provided with the cutout portion 20 , whereby a bending strength difference occurs between the area where the fourth edge 3 d exists and the area where the sixth edge 3 f exists with a line Y-Y as a boundary on the printed circuit board 3 .
- a stress concentrates on the line X-X and the line Y-Y as compared with other areas on the printed circuit board 3 because of the bending strength difference on the printed circuit board 3 .
- the connector 9 is placed on the line X-X on which a stress concentrates on the printed circuit board 3 , and is joined to the printed circuit board 3 .
- the connector 9 is placed crossing the line X-X on which a stress concentrates, whereby it is used as a reinforcement member against deflection and warpage of the printed circuit board so as to reinforce the printed circuit board 3 and lightening the bending stress.
- the module 10 is placed on the line Y-Y on which a stress concentrates like the line X-X on the printed circuit board 3 , and is joined to the printed circuit board 3 .
- the module 10 is placed crossing the line Y-Y on which a stress concentrates, whereby it is used as a reinforcement member against deflection and warpage of the printed circuit board so as to reinforce the printed circuit board 3 and lighten the bending stress.
- FIG. 3 is a side view showing a state in which the connector 9 and the module 10 are viewed from the direction indicated by the arrow III shown in FIG. 2 ; it shows a layout of the connector 9 and the module 10 relative to the printed circuit board 3 .
- the connector 9 includes a solder fixing terminal 11 provided in a side end part, signal connection terminals 12 , and peripheral terminals (not shown) and a joint part 9 a to the printed circuit board 3 is welded and joined roughly as a whole through the terminals.
- the printed circuit board 3 and the connector 9 are integrated into one by the welding, so that the strength against the bending of the printed circuit hoard 3 is still more enhanced.
- the connector 9 is provided with the signal connection terminals 12 , as shown in FIGS. 1 to 3 .
- the connector 9 includes the solder fixing pad 11 provided in the side end part and a peripheral pad (not shown), and the joint part 9 a to the printed circuit hoard 3 is welded and joined roughly as a whole through the pad.
- the printed circuit board 3 and the connector 9 are integrated into one by the welding, so that the strength against the bending of the printed circuit board 3 is still more enhanced.
- the connector 9 is provided with the signal connection terminals 12 , as shown in FIGS. 1 to 3 .
- FIG. 4 is a side view showing a state in which the connector 9 and the module 10 are viewed from the direction indicated by the arrow IV shown in FIG. 2 ; it also shows the layout of the connector 9 and the module 10 relative to the printed circuit board 3 .
- a module board 13 is placed at a distance from the printed circuit board 3 .
- the module board 13 is supported by a hollow tubular metal spacer 14 joined to the printed circuit board 3 , a screw member 15 screwed into the metal spacer 14 , and housings 16 and 17 projected from the printed circuit board 3 .
- the housings 16 and 17 include connection terminals 16 a and 17 a having a spring property and connect the printed circuit board 3 and the module board 13 by the connection terminals.
- the described module 10 is not directly joined to the printed circuit board 3 unlike the connector 9 .
- the module 10 is placed crossing the line Y-Y on which a stress concentrates through the metal spacer 14 , the screw member 15 , and the housings 16 and 17 , whereby it can reinforce the printed circuit board 3 .
- the module 10 functions as a reinforcement member against deflection and warpage of the printed circuit board 3 as it lightens the bending stress imposed on the printed circuit board 3 .
- the connector 9 and the module 10 as the electronic components mounted on the printed circuit board 3 are placed at the positions crossing the lines on which a stress concentrates, whereby the connector 9 and the module 10 can be used as reinforcement members against deflection and warpage of the printed circuit board. Therefore, they can also be applied as the reinforcement members against deflection and warpage of the printed circuit board 3 to the configuration including an oddly shaped board having a part on which the bending stress in the board thickness direction concentrates because of the difference of the board width, the length, etc., a special component dedicated to reinforcement is not required, an increase in the weight of the electronic apparatus 1 can be prevented, and a large mount space and sheet metal are not required.
- the advantages of reducing the cost, improvement of applicability to a small-sized electronic apparatus, etc. are provided.
- the connector 9 of the electronic component as the reinforcement member is joined and fixed to the board face containing the part of the printed circuit board 3 on which a stress concentrates, so that a large reinforcement effect can be provided.
- the connector 9 includes the solder fixing terminal 11 and the joint strength can be enhanced by welding to the printed circuit board 3 .
- the module 10 used as the reinforcement member is not directly joined to the printed circuit board 3 , but crosses the stress concentration point through the metal spacer 14 , the screw member 15 , the housings 16 and 17 , and the connection terminals 16 a and 17 a and can reinforce the printed circuit board 3 .
- the shape of the printed circuit board 3 to which the invention is applied is not limited to that in the embodiment described above.
- a polygonal shape having a recess part 22 provided by removing one of long edges of the printed circuit board 21 having long edges 21 a and short edges 21 b as a rectangle can also be applied.
- a bending stress concentrates on the straight line directions of the portions where the length defined by the long edge 21 a and the board width defined by the short edge 21 b differ, namely, X 1 -X 1 line direction, X 2 -X 2 line direction, and Y 1 -Y 1 line direction, but the connectors 9 , the module 10 , and the like of the electronic components are placed on the lines on which a stress concentrates, so that advantages similar to those of the embodiment described above can be provided.
- first edges 22 a and a second edge 22 b forming the recess part 22 form a cutout portion 26 .
- the connectors 9 are provided at the positions crossing the line X 1 -X 1 and the line X 2 -X 2 defined by the first edges 22 a forming the cutout portion 26 .
- the module 10 is provided at the position crossing the line Y 1 -Y 1 defined by the second edge 22 b forming the cutout portion 26 .
- a polygonal shape having a convex part 24 shaped like a rectangle on one long edge of the printed circuit board 23 having a long edge 23 a and a short edge 23 b can also be applied.
- a bending stress concentrates on the straight line directions of the portions where the length defined by the long edge 23 a and the board width defined by the short edge 23 b differ, namely, X 3 -X 3 line direction, X 4 -X 4 line direction, and Y 2 -Y 2 line direction, but the connectors 9 , the module 10 , and the like of the electronic components are placed on the lines on which a stress concentrates, so that advantages similar to those of the embodiment described above can be provided.
- a first edge 24 a and second edges 24 b form the convex part 24 . It can also be said that the second edges 24 b and third edges 24 c form cutout portions 27 .
- the connectors 9 are provided at the positions crossing the line X 3 -X 3 and the line X 4 -X 4 defined by the second edges 24 b forming the cutout portions 27 .
- the module 10 is provided at the position crossing the line Y 2 -Y 2 defined by the third edges 24 c forming the cutout portions 27 .
- an electronic apparatus for making it possible to reinforce a printed circuit board without adding a dedicated reinforcement member onto the printed circuit board.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
According to one embodiment, an electronic apparatus includes: a polygonal printed circuit board provided with a cutout portion at least in a part, the cutout portion defined by at least a first edge and a second edge; and a first electronic component mounted on the printed circuit board; wherein the first electronic component is mounted at a position crossing a line defined by the first edge on the printed circuit board.
Description
- This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2007-338230, filed on Dec. 27, 2007, the entire contents of which are incorporated herein by reference.
- 1. Field
- One embodiment of the invention relates to a countermeasure art against deflection and warpage of a printed circuit board installed in a small-sized electronic apparatus and in particular to an electronic apparatus for making it possible to efficiently reinforce a printed circuit board.
- 2. Description of the Related Art
- Hitherto, the slimming down and miniaturization of a portable personal computer and other small-sized electronic apparatuses have proceeded and usage of easily carrying out the electronic apparatuses has increased. However, as a casing of a small-sized electronic apparatus and a printed circuit board installed therein are also slimmed down, deflection or warpage occurs due to overload, etc., and the apparatus performance may be affected.
- Hitherto, various printed circuit board reinforcing measures have been adopted. For example, an art has been proposed wherein a reinforcing member provided by bending sheet metal as angular U-shaped in cross section is fitted into a periphery of a printed circuit board with a spring property, thereby providing a warpage prevention structure of the printed circuit board (see JP-A-4-284692, for instance).
- Described above in JP-A-4-284692 is the warpage prevention structure wherein a reinforcing member provided by bending sheet metal as angular U-shaped in cross section is fitted around a rectangular printed circuit board with a spring property, thereby providing the warpage of the printed circuit board and a structure wherein the sheet metal is attached to three edges of the rectangular printed circuit board and the printed circuit board has a connector on the remaining edge.
- However, to provide a not rectangular but polygonal printed circuit board, for example, with such a reinforcing member, dedicated components to the polygonal printed circuit board is required and the number of components and a weight are increased. The art is hard to apply to an electronic apparatus including a certain shaped board having an area where the bending stress in a board thickness direction concentrates because of the difference of at least either of the board width and the length, such as the polygonal printed circuit board.
- A general architecture that implements the various feature of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate embodiments of the invention and not to limit the scope of the invention.
-
FIG. 1 is an exemplary perspective view showing a configuration of an electronic apparatus according to an embodiment of the invention; -
FIG. 2 is an exemplary plan view of the printed circuit board shown inFIG. 1 ; -
FIG. 3 is an exemplary side view of the printed circuit board viewed from direction III shown inFIG. 2 ; -
FIG. 4 is an exemplary side view of the printed circuit board viewed from direction IV shown inFIG. 2 ; -
FIG. 5 is an exemplary perspective view showing a printed circuit board according to another embodiment of the invention; and -
FIG. 6 is an exemplary perspective view showing a printed circuit board according to still another embodiment of the invention. - Various embodiments according to the invention will be described hereinafter with reference to the accompanying drawings. In general, according to one embodiment of the invention, an electronic apparatus includes: a polygonal printed circuit board provided with a cutout portion at least in a part, the cutout portion defined by at least a first edge and a second edge; and a first electronic component mounted on the printed circuit board; wherein the first electronic component is mounted at a position crossing a line defined by the first edge on the printed circuit board.
- An embodiment of an electronic apparatus according to the invention will be discussed with reference to the accompanying drawings.
-
FIG. 1 is a perspective view to schematically show the main part of an electronic apparatus such as a portable personal computer incorporating a reinforcement structure against deflection, warpage, etc., of a printed circuit board, andFIG. 2 is a plan view of the printed circuit board shown inFIG. 1 .FIG. 3 is a side view of the printed circuit board viewed from a direction indicated by arrow III shown inFIG. 2 , andFIG. 4 is another side view of the printed circuit board viewed from a direction indicated by arrow IV shown inFIG. 2 (direction perpendicular to the direction indicated by arrow III). - As shown in
FIG. 1 , a polygonalprinted circuit board 3 is installed in acasing 2 of anelectronic apparatus 1 of the embodiment. The printedcircuit board 3 is provided with acutout portion 20 by cutting one edge of a quadrangular board like a letter L on the plan view over a given width and a given length. Thecutout portion 20 is defined by afirst edge 3 a and asecond edge 3 b of the printedcircuit board 3. Thefirst edge 3 a forming a part of thecutout portion 20 is shorter than athird edge 3 c and afifth edge 3 e defining the outer periphery of the printedcircuit board 3. On the other hand, thesecond edge 3 b forming a part of thecutout portion 20 like thefirst edge 3 a is shorter than afourth edge 3 d defining the outer periphery of the printedcircuit board 3, but is longer than asixth edge 3 f. - The
cutout portion 20 is a part of abattery housing area 4 of thecasing 2, for example, and the area adjacent to thebattery housing area 4 is a housing area 5 of a hard disk drive, etc. - Three corners other than the corner to which the
cutout portion 20 belongs in the printedcircuit board 3 are fixed to thecasing 2 withfasteners connector 9 and amodule board 10 are provided on aback 3 g of the printedcircuit board 3. - As shown in
FIG. 2 , the printedcircuit board 3 is provided with thecutout portion 20, whereby a bending strength difference occurs between the area where thethird edge 3 c exists and the area where thefifth edge 3 e exists with a line X-X as a boundary on the printedcircuit board 3. Likewise, theprinted circuit board 3 is provided with thecutout portion 20, whereby a bending strength difference occurs between the area where thefourth edge 3 d exists and the area where thesixth edge 3 f exists with a line Y-Y as a boundary on the printedcircuit board 3. At this time, a stress concentrates on the line X-X and the line Y-Y as compared with other areas on the printedcircuit board 3 because of the bending strength difference on the printedcircuit board 3. - Then, in the embodiment, the
connector 9 is placed on the line X-X on which a stress concentrates on the printedcircuit board 3, and is joined to the printedcircuit board 3. Theconnector 9 is placed crossing the line X-X on which a stress concentrates, whereby it is used as a reinforcement member against deflection and warpage of the printed circuit board so as to reinforce the printedcircuit board 3 and lightening the bending stress. - The
module 10 is placed on the line Y-Y on which a stress concentrates like the line X-X on the printedcircuit board 3, and is joined to the printedcircuit board 3. Themodule 10 is placed crossing the line Y-Y on which a stress concentrates, whereby it is used as a reinforcement member against deflection and warpage of the printed circuit board so as to reinforce the printedcircuit board 3 and lighten the bending stress. -
FIG. 3 is a side view showing a state in which theconnector 9 and themodule 10 are viewed from the direction indicated by the arrow III shown inFIG. 2 ; it shows a layout of theconnector 9 and themodule 10 relative to the printedcircuit board 3. - The
connector 9 includes asolder fixing terminal 11 provided in a side end part,signal connection terminals 12, and peripheral terminals (not shown) and ajoint part 9 a to the printedcircuit board 3 is welded and joined roughly as a whole through the terminals. The printedcircuit board 3 and theconnector 9 are integrated into one by the welding, so that the strength against the bending of the printedcircuit hoard 3 is still more enhanced. Theconnector 9 is provided with thesignal connection terminals 12, as shown inFIGS. 1 to 3 . - The
connector 9 includes thesolder fixing pad 11 provided in the side end part and a peripheral pad (not shown), and thejoint part 9 a to the printedcircuit hoard 3 is welded and joined roughly as a whole through the pad. The printedcircuit board 3 and theconnector 9 are integrated into one by the welding, so that the strength against the bending of the printedcircuit board 3 is still more enhanced. Theconnector 9 is provided with thesignal connection terminals 12, as shown inFIGS. 1 to 3 . -
FIG. 4 is a side view showing a state in which theconnector 9 and themodule 10 are viewed from the direction indicated by the arrow IV shown inFIG. 2 ; it also shows the layout of theconnector 9 and themodule 10 relative to the printedcircuit board 3. - As shown in
FIG. 4 , as themodule 10, amodule board 13 is placed at a distance from the printedcircuit board 3. Themodule board 13 is supported by a hollowtubular metal spacer 14 joined to the printedcircuit board 3, ascrew member 15 screwed into themetal spacer 14, andhousings circuit board 3. Thehousings connection terminals circuit board 3 and themodule board 13 by the connection terminals. - The described
module 10 is not directly joined to the printedcircuit board 3 unlike theconnector 9. However, themodule 10 is placed crossing the line Y-Y on which a stress concentrates through themetal spacer 14, thescrew member 15, and thehousings circuit board 3. Accordingly, themodule 10 functions as a reinforcement member against deflection and warpage of the printedcircuit board 3 as it lightens the bending stress imposed on the printedcircuit board 3. - As described above, in the embodiment, the
connector 9 and themodule 10 as the electronic components mounted on the printedcircuit board 3 are placed at the positions crossing the lines on which a stress concentrates, whereby theconnector 9 and themodule 10 can be used as reinforcement members against deflection and warpage of the printed circuit board. Therefore, they can also be applied as the reinforcement members against deflection and warpage of the printedcircuit board 3 to the configuration including an oddly shaped board having a part on which the bending stress in the board thickness direction concentrates because of the difference of the board width, the length, etc., a special component dedicated to reinforcement is not required, an increase in the weight of theelectronic apparatus 1 can be prevented, and a large mount space and sheet metal are not required. Thus, the advantages of reducing the cost, improvement of applicability to a small-sized electronic apparatus, etc., are provided. - According to the embodiment, the
connector 9 of the electronic component as the reinforcement member is joined and fixed to the board face containing the part of the printedcircuit board 3 on which a stress concentrates, so that a large reinforcement effect can be provided. Particularly, theconnector 9 includes thesolder fixing terminal 11 and the joint strength can be enhanced by welding to the printedcircuit board 3. - The
module 10 used as the reinforcement member is not directly joined to the printedcircuit board 3, but crosses the stress concentration point through themetal spacer 14, thescrew member 15, thehousings connection terminals circuit board 3. - The shape of the printed
circuit board 3 to which the invention is applied is not limited to that in the embodiment described above. - For example, like a printed
circuit board 21 shown inFIG. 5 , a polygonal shape having arecess part 22 provided by removing one of long edges of the printedcircuit board 21 havinglong edges 21 a andshort edges 21 b as a rectangle can also be applied. That is, in the structure, a bending stress concentrates on the straight line directions of the portions where the length defined by thelong edge 21 a and the board width defined by theshort edge 21 b differ, namely, X1-X1 line direction, X2-X2 line direction, and Y1-Y1 line direction, but theconnectors 9, themodule 10, and the like of the electronic components are placed on the lines on which a stress concentrates, so that advantages similar to those of the embodiment described above can be provided. - Even in the printed
circuit board 21 shown inFIG. 5 , it can be said that first edges 22 a and asecond edge 22 b forming therecess part 22 form acutout portion 26. Theconnectors 9 are provided at the positions crossing the line X1-X1 and the line X2-X2 defined by thefirst edges 22 a forming thecutout portion 26. Likewise, themodule 10 is provided at the position crossing the line Y1-Y1 defined by thesecond edge 22 b forming thecutout portion 26. - Like a printed
circuit board 23 shown inFIG. 6 , a polygonal shape having a convex part 24 shaped like a rectangle on one long edge of the printedcircuit board 23 having along edge 23 a and ashort edge 23 b can also be applied. That is, in the structure, a bending stress concentrates on the straight line directions of the portions where the length defined by thelong edge 23 a and the board width defined by theshort edge 23 b differ, namely, X3-X3 line direction, X4-X4 line direction, and Y2-Y2 line direction, but theconnectors 9, themodule 10, and the like of the electronic components are placed on the lines on which a stress concentrates, so that advantages similar to those of the embodiment described above can be provided. - In the printed
circuit board 23 shown inFIG. 6 , afirst edge 24 a andsecond edges 24 b form the convex part 24. It can also be said that thesecond edges 24 b andthird edges 24 cform cutout portions 27. Theconnectors 9 are provided at the positions crossing the line X3-X3 and the line X4-X4 defined by thesecond edges 24 b forming thecutout portions 27. Likewise, themodule 10 is provided at the position crossing the line Y2-Y2 defined by thethird edges 24 c forming thecutout portions 27. - As described above, according to the embodiment of the invention, there can be provided an electronic apparatus for making it possible to reinforce a printed circuit board without adding a dedicated reinforcement member onto the printed circuit board.
- It is to be understood that the invention is not limited to the above-described specific embodiment thereof and various modifications may be made without departing from the spirit and the scope of the invention.
Claims (6)
1. An electronic apparatus comprising:
a polygonal printed circuit board provided with a cutout portion at least in a part, the cutout portion defined by at least a first edge and a second edge; and
a first electronic component mounted on the printed circuit board;
wherein the first electronic component is mounted at a position crossing a line defined by the first edge on the printed circuit board.
2. The apparatus according to claim 1 further comprising a second electronic component mounted at a position crossing a line defined by the second edge on the printed circuit board.
3. The apparatus according to claim 1 , wherein the first electronic component includes a connector or a module.
4. The apparatus according to claim 2 , wherein the second electronic component includes a connector or a module.
5. The apparatus according to claim 3 further comprising a spacer, wherein the module includes a module board, and wherein the spacer is interposed between the printed circuit board and a module board for connecting and fixing the module board to the printed circuit board.
6. The apparatus according to claim 4 further comprising a spacer, wherein the module includes a module board, and wherein the spacer is interposed between the printed circuit board and a module board for connecting and fixing the module board to the printed circuit board.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-338230 | 2007-12-27 | ||
JP2007338230A JP2009158865A (en) | 2007-12-27 | 2007-12-27 | Electronic apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090168379A1 true US20090168379A1 (en) | 2009-07-02 |
Family
ID=40798081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/203,818 Abandoned US20090168379A1 (en) | 2007-12-27 | 2008-09-03 | Electronic apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090168379A1 (en) |
JP (1) | JP2009158865A (en) |
CN (1) | CN101472435A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120320548A1 (en) * | 2011-06-17 | 2012-12-20 | Huang-Ping Lu | Fixing mechanism for fixing a board card on a circuit board and electronic device therewith |
US20130128477A1 (en) * | 2011-11-22 | 2013-05-23 | Fujitsu Limited | Method of determining reinforcement position of circuit substrate and substrate assembly |
US11375605B2 (en) | 2019-08-08 | 2022-06-28 | Sony Interactive Entertainment Inc. | Electronic device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013157565A (en) * | 2012-01-31 | 2013-08-15 | Toshiba Corp | Electronic apparatus |
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US6813165B2 (en) * | 2002-11-18 | 2004-11-02 | Wistron Corporation | Board-locking fastener for fastening a motherboard on a housing of a computer |
US6913470B1 (en) * | 2000-11-22 | 2005-07-05 | Matrox Electronics Systems Ltd. | Adaptable computer card I/O connection |
US7007159B2 (en) * | 2002-05-10 | 2006-02-28 | Intel Corporation | System and method for loading and integrating a firmware extension onto executable base system firmware during initialization |
US7294009B1 (en) * | 2006-05-05 | 2007-11-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Printed circuit board module and locking apparatus thereof |
US7710741B1 (en) * | 2005-05-03 | 2010-05-04 | Nvidia Corporation | Reconfigurable graphics processing system |
-
2007
- 2007-12-27 JP JP2007338230A patent/JP2009158865A/en active Pending
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2008
- 2008-09-03 US US12/203,818 patent/US20090168379A1/en not_active Abandoned
- 2008-09-23 CN CNA2008101659167A patent/CN101472435A/en active Pending
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US6913470B1 (en) * | 2000-11-22 | 2005-07-05 | Matrox Electronics Systems Ltd. | Adaptable computer card I/O connection |
US7007159B2 (en) * | 2002-05-10 | 2006-02-28 | Intel Corporation | System and method for loading and integrating a firmware extension onto executable base system firmware during initialization |
US6813165B2 (en) * | 2002-11-18 | 2004-11-02 | Wistron Corporation | Board-locking fastener for fastening a motherboard on a housing of a computer |
US7710741B1 (en) * | 2005-05-03 | 2010-05-04 | Nvidia Corporation | Reconfigurable graphics processing system |
US7294009B1 (en) * | 2006-05-05 | 2007-11-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Printed circuit board module and locking apparatus thereof |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120320548A1 (en) * | 2011-06-17 | 2012-12-20 | Huang-Ping Lu | Fixing mechanism for fixing a board card on a circuit board and electronic device therewith |
US20130128477A1 (en) * | 2011-11-22 | 2013-05-23 | Fujitsu Limited | Method of determining reinforcement position of circuit substrate and substrate assembly |
US9053262B2 (en) * | 2011-11-22 | 2015-06-09 | Fujitsu Limited | Method of determining reinforcement position of circuit substrate and substrate assembly |
US11375605B2 (en) | 2019-08-08 | 2022-06-28 | Sony Interactive Entertainment Inc. | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
JP2009158865A (en) | 2009-07-16 |
CN101472435A (en) | 2009-07-01 |
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