US20090159240A1

US20090159240A1 - Mobile cooling structure and machine case having the same

Info

Publication number: US20090159240A1
Application number: US11/960,925
Authority: US
Inventors: Chung-Jun Chu
Original assignee: Individual
Current assignee: Chemtron Research LLC
Priority date: 2007-12-20
Filing date: 2007-12-20
Publication date: 2009-06-25

Abstract

A cooling structure, through a design of rail installed on an inner wall of a machine case, can be adjusted in corresponding to various electronic heating components disposed in the machine case, and freely moved to a position, where an electronic heating component is needed to conduct heat generated thereof to the machine case.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention generally relates to a cooling technique, in particular, to a cooling structure, applicable to a machine case requiring cooling in a computer, and especially adaptable to a machine case in an industrial computer.
2. Description of Prior Art
At present, cooling problem has become a crucial factor influencing the operation of current computer or relative multimedia computer host. Its importance is without mention, because computer requires an enhancing function day by day.
Regarding to the cooling requirement for any heating source in a computer, the prior art is not only to provide a most basically needed cooling capability, but also to continuously research and develop toward the improvement of cooling efficiency. However, in terms of desktop computer or laptop computer, since they have an inevitable trend in standardized design, so their corresponding cooling structure or device also has a specifically disposing position and relationship. Therefore, they sometimes resort to redesign, only aiming to improve the cooling efficiency, without considering the match up of different interior structures in various computers at times. However, with respect to industrial computer, because the positions of electronic heating components disposed therein are sometimes changed according to different functions of various models, different cooling structures or devices must be customized according to different models, and thus the correspondingly disposing position and relationship may be then fulfilled. Accordingly, if a cooling structure capable of being adjusted in corresponding to different positions of heating sources is proposed, then it can be applied so comprehensively to any type of industrial computer that a large amount of human labor and material resource regarding to R&D may be saved.
Accordingly, aiming to solve aforementioned shortcomings, after a substantially devoted study, in cooperation with the application of relatively academic principles, the inventor has finally proposed the present invention that is designed reasonably to possess the capability to improve the prior arts significantly.

SUMMARY OF THE INVENTION

The invention is mainly to provide a mobile cooling structure and a machine case having the same through a special design of rail, by which the cooling structure may be freely adjusted to specific positions in corresponding to the disposing positions of the electronic heating components in various machine cases, and thus a more flexibility may be achieved.
The invention is to provide a mobile cooling structure particularly arranged in a machine case to facilitate a heating component arranged therein for a heat conduction. The cooling structure includes: two rails, respectively arranged on two inner side faces of the machine case; a heat-conducting plate, arranged between two rails; at least one heat pipe, attached onto the heat-conducting plate; and a heat-conducting block. According to the present invention, the heat-conducting plate is glided, in cooperation with two rails, to a corresponding position, where an electronic heating component is intended to be cooled. Then, the heat-conducting block is engaged between the heat-conducting plate and the electronic heating component to undertake a heat-transferring contact, making the heat generated from the electronic heating component conducted to the heat-conducting plate and then extended toward the positioning direction of two rails in the heat-conducting plate through the heat pipe, thereby, the heat being able to be conducted to the machine case for facilitating a cooling effect.
The invention is also to provide a machine case having the aforementioned cooling structure. According to the present invention, the machine case is to provide a motherboard disposed therein, on which an electronic heating component is arranged. Meanwhile, the machine case has two cooling lids interspaced in parallel to each other and a cooling structure therein. The cooling structure includes: two rails, respectively arranged on two inner side faces of the machine case; a heat-conducting plate, arranged between two rails; at least one heat pipe, attached onto the heat-conducting plate; and a heat-conducting block. According to the present invention, the heat-conducting plate is glided, in cooperation with two rails, to a corresponding position, where the electronic heating component is intended to be cooled. Then, the heat-conducting block is engaged between the heat-conducting plate and the electronic heating component to undertake a heat-transferring contact, making the heat generated from the electronic heating component conducted to the heat-conducting plate, and then extended toward the positioning direction of two rails in the heat-conducting plate through the heat pipe, thereby, the heat being able to be conducted to the machine case for facilitating a cooling effect.

BRIEF DESCRIPTION OF DRAWING

The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is an explosive illustration for showing an interior of a machine case according to the present invention;

FIG. 2 is an assembled illustration for showing an interior of a machine case according to the present invention;

FIG. 3 is a cross-sectional illustration for showing an interior of a machine case according to the present invention;

FIG. 4 is a cross-sectional illustration for showing a heat-conducting block in a machine case according to another embodiment of the present invention; and,

FIG. 5 is an explosive illustration for showing an interior of a machine case according to a further embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
Please refer to FIG. 1 and FIG. 2, which respectively are an explosive illustration and an assembled illustration for showing an interior of a machine case according to one preferable embodiment of the present invention. The invention is to provide a mobile cooling structure and a machine case having it. The machine case 1 may be a machine case of industrial computer and includes two cooling lids 10 interspaced in parallel to each other, a supporting plate 11 laid between two cooling lids 10, and an outer shell 12 accommodating the supporting plate 11 therein.
According to above description, two cooling lids 10 are all constructed by metallic materials with excellent cooling quality and have a plurality of cooling fins 100 arranged on outer side faces thereof. The supporting plate 11 is horizontally connected between two inner side faces of two cooling lids 10 in a lower position of the machine case 1, such that a motherboard 2 is fixedly disposed on the supporting plate 11. Furthermore, the outer shell 12 is assembled between two cooling lids, as shown in FIG. 2, making the motherboard 2 accommodated in the machine case 1.
Please refer to FIG. 1 and FIG. 3 together. In this preferable embodiment, the motherboard 2 has at least one electronic heating component 20 arranged thereon, for example, CPU. The cooling structure of the invention is provided for undertaking a cooling process to the electronic heating component 20 on the motherboard 2. The cooling structure 3 includes: two rails 30; a heat-conducting plate 31 capable of gliding on the rails 30; at least one heat pipe 32, attached on the heat-conducting plate 31; and a heat-conducting block 33 thermally contacted under the heat-conducting plate 31. In this case, two rails 30 are respectively arranged on each inner side face of two cooling lids 10 in an upper position of the machine case 1. Two rails 30 are arranged horizontally, corresponded to each other, and extended along a longitudinal direction of two cooling lids 10, making the heat-conducting plate 31 capable of being moved between two cooling lids 10 horizontally, by arranging the heat-conducting plate 31 along a longitudinal direction of two rails 30. Two rails 30 are respectively constructed by two side plates 300, which are formed as long stripes 300, interspaced to each other vertically, and arranged on the inner side faces of the cooling lids 10.
In this case, the heat-conducting plate 31 includes: a plate body 310, formed as a flat plate; and two gliding arms 311 extended from the plate body 310. Two gliding arms 311 can be respectively cooperative with aforementioned two rails 30, as shown in FIG. 3, making the plate body 310 laid between two rails 30. The heat-conducting plate 31 can be displaced along a longitudinal direction of two rails 30, by the cooperation between its gliding arms 311 and the rails 30. In addition, the heat-conducting plate 31 can be further arranged a groove 312, which is extended from the plate body 310 toward two gliding arms 311, such that the heat pipe 32 may be embedded in the groove 312 cooperatively.
Accordingly, as shown in FIG. 3, the heat-conducting plate 31 is firstly moved along two rails 30, making the plate body 310 of the heat-conducting plate 31 moved to a position, which is above an electronic heating component 20 of a motherboard 2, such that the heat-conducting block 33 is engaged between the heat-conducting plate 31 and the electronic heating component 20. After the heat-conducting block 33 has contacted with the electronic heating component 20, the heat generated from the electronic heating component 20 may be transferred to the heat-conducting plate 31 via the heat-conducting block 33. The heat absorbed by the heat pipe 32 arranged on the heat-conducting plate 31 is further transferred to at least one gliding arm 311, which contacts with two cooling lids 10, or the heat can be conducted to the cooling lids 10 through two side plates 300. In the cooling lids 10, the conducted heat may be dissipated to the ambience via a plurality of cooling fins 100 arranged thereon.
Thereby, according to aforementioned structural composition, a mobile cooling structure and a machine case having it of the present invention may be obtained.
Furthermore, as shown in FIG. 4, regarding to the cooling requirement of a plurality of electronic heating components 20, an extending plate 330 may be extended laterally from the bottom of the heat-conducting block 33 and contacted with other heat sources, such that the all heat generated from each heat sources on the motherboard 2 may be conducted out via the heat-conducting block 33.
In addition, as shown in FIG. 5, a specific aforementioned groove 312 in the heat-conducting plate 31 may be respectively corresponded to two gliding arms 311. Since an aforementioned heat pipe 32 is respectively embedded in the groove 312, two heat pipes 32 may be respectively corresponded to a gliding arm 311 to conduct heat.
Therefore, a mobile cooling structure and a machine case having the cooling structure according to the present invention may be adjusted, in corresponding to the positions of the electronic heating components 20 in a machine case 1, and particularly adaptable to an industrial computer. The positions of the electronic heating components 20 in an industrial computer are so frequently changed due to the differences of machine model that the cooling structure 3 of the invention as aforementioned is indeed needed. Especially, the invention applies two rails 30, which are capable of position adjusting function to fulfill the cooling requirement needed by the heat sources in each kind of industrial computers.
Summarizing aforementioned description, the invention is an indispensable product of novelty indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
However, the aforementioned description is only a preferable embodiment according to the present invention, being not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.

Claims

1. A mobile cooling structure arranged in a machine case to facilitate an electronic heating component arranged therein for a heat conduction, the mobile cooling structure including:

two rails, respectively arranged on two inner side faces of the machine case;

a heat-conducting plate, arranged between each inner side face of the two rails, and moved along the two rails to generate a gliding motion;

a heat pipe, attached onto the heat-conducting plate, and extended toward at least one disposing direction of the two rails; and

a heat-conducting block, engaged between the heat-conducting plate and the electronic heating component to make a heat-transferring contact;

wherein, the heat-conducting plate is glided along the two rails to a corresponding position, where the electronic heating component is intended to be cooled, and wherein the heat-conducting block is contacted between the heat-conducting plate and the electronic heating component in a way, such that a heat generated from the electronic heating component is conducted to the machine case.

2. The mobile cooling structure according to claim 1, wherein the two rails are respectively constructed by two side plates that are formed as two long stripes, which are interspaced in parallel to each other.

3. The mobile cooling structure according to claim 2, wherein the two side plates are arranged on two inner side faces of the machine case.

4. The mobile cooling structure according to claim 1, wherein the heat-conducting plate has a plate body and two gliding arms that are extended respectively from the plate body and matched with the two rails.

5. The mobile cooling structure according to claim 4, wherein a groove is arranged on the heat-conducting plate and is extended from the plate body toward the two gliding arms; and the heat pipe is embedded along a direction of the groove.

6. The mobile cooling structure according to claim 4, wherein two grooves respectively cooperated with the two gliding arms are arranged on the heat-conducting plate and embed the heat pipe therein.

7. A machine case with a mobile cooling structure to provide a motherboard disposed therein, on which an electronic heating component is arranged, having two cooling lids interspaced to each other, and being arranged the cooling structure therein, the cooling structure including:

two rails, respectively arranged on each inner side face of the two cooling lids;

a heat-conducting plate, arranged between each inner side face of two rails, and moved along the two rails to generate a gliding motion;

a heat pipe, attached onto the heat-conducting plate, and extended toward at least one disposing direction of two rails; and

wherein, the heat-conducting plate is glided along the two rails to a corresponding position, where the electronic heating component is intended to be cooled, and wherein the heat-conducting block is contacted between the heat-conducting plate and the electronic heating component in a way, such that a heat generated from the electronic heating component is conducted to two cooling lids.

8. The machine case with mobile cooling structure according to claim 7, wherein a plurality of cooling fins are arranged on each outer side face of the two cooling lids.

9. The machine case with mobile cooling structure according to claim 7, wherein the two rails are respectively constructed by two side plates that are formed as two long stripes, which are interspaced in parallel to each other.

10. The machine case with mobile cooling structure according to claim 9, wherein the two side plates are respectively arranged on an inner side face of the cooling lid.

11. The machine case with mobile cooling structure according to claim 7, wherein the heat-conducting plate of the cooling structure has a plate body and two gliding arms that are extended respectively from the plate body and matched with the two rails.

12. The machine case with mobile cooling structure according to claim 11, wherein a groove is arranged on the heat-conducting plate of the cooling structure and is extended from the plate body toward the two gliding arms; and the heat pipe is embedded along a direction of the groove.

13. The machine case with mobile cooling structure according to claim 11, wherein two grooves respectively cooperated with the two gliding arms are arranged on the heat-conducting plate of the cooling structure and embed the heat pipe therein.