CN101562964B - Heat-conducting medium protecting cover and heating abstractor with the protecting cover - Google Patents

Heat-conducting medium protecting cover and heating abstractor with the protecting cover Download PDF

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Publication number
CN101562964B
CN101562964B CN2008103011286A CN200810301128A CN101562964B CN 101562964 B CN101562964 B CN 101562964B CN 2008103011286 A CN2008103011286 A CN 2008103011286A CN 200810301128 A CN200810301128 A CN 200810301128A CN 101562964 B CN101562964 B CN 101562964B
Authority
CN
China
Prior art keywords
heat
conducting medium
covering plate
abstractor
ribs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008103011286A
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Chinese (zh)
Other versions
CN101562964A (en
Inventor
徐礼福
王宁宇
张治国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2008103011286A priority Critical patent/CN101562964B/en
Priority to US12/206,966 priority patent/US20090255659A1/en
Publication of CN101562964A publication Critical patent/CN101562964A/en
Application granted granted Critical
Publication of CN101562964B publication Critical patent/CN101562964B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/02Safety or protection arrangements; Arrangements for preventing malfunction in the form of screens or covers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a heat-conducting medium protecting cover which is used for covering a heat abstractor so as to protect the heat-conducting medium smeared on the heating abstractor; the heat-conducting medium protecting cover comprises a cover plate used for covering the heating-conducting medium; the cover plate is provided with a plurality of reinforcing ribs in a convex way; the reinforcing ribs are against the heating abstractor to lead that the cover plate does not contact the heat-conducting medium. The invention also comprises the heating abstractor provided with the heat-conducting medium protecting cover. The protecting cover and the heating abstractor can be applied in the assembly of various electronic devices needing heat dissipation.

Description

Heat conducting medium protective cover and have the heat abstractor of this over cap
Technical field
The present invention is relevant with heat radiation, refers to especially a kind of heat conducting medium protective cover and the heat abstractor with this over cap.
Background technology
Development along with electronic industry, electronic component (particularly central processing unit) running frequency and speed improve constantly, the heat that electronic component produces also increases thereupon, temperature constantly raises, have a strong impact on the normal operation of electronic component, in order to guarantee the normal operation of electronic component, usually at electronical elements surface one radiator is installed, in time get rid of with the heat that electronic component is produced, if but radiator is directly installed on the surface of electronic component, there is the gap between radiator and the electronical elements surface, air in the gap has increased hot biography impedance, make the radiating effect of radiator not good, reduce interface heat for the surperficial close contact that makes radiator and electronic component and pass impedance, industry is coating one deck heat-conducting medium between radiator and electronic component usually, it can fill the gap between radiator and the electronical elements surface on the one hand, make the Surface Contact of radiator and electronic component more abundant and tight, on the other hand, heat-conducting medium has higher pyroconductivity, has strengthened the thermal conduction effect between radiator and the heat-generating electronic elements.
Usually when the assembling computer; first heat-conducting medium is applied in the radiator bottom surface; then radiator is installed on the electronic component; but because heat-conducting medium is the easy contaminative chemical substance of a kind of paste; during the assembling computer; heat-conducting medium is easy on pickup other elements in the computer; therefore it is very inconvenient to implement this operation in the process of assembling computer; for reducing the trouble of assembling process; the dealer is coated with heat-conducting medium usually in advance on the radiator finished product; then an over cap is installed on the radiator with the protection heat-conducting medium; when the needs installation of heat radiator; remove over cap, radiator can be fixed to and treat on the radiating electronic element, prevent that the heat-conducting medium pickup is to other place.A kind of heat conducting medium protective cover that Chinese patent discloses for No. 99235745.4 is installed on the heat abstractor surface that is coated with heat-conducting medium, comprises that lid, guard space reach fixedly ora terminalis.Wherein, this lid is positioned at the central part of this heat conducting medium protective cover and is a concave inward structure; comprise roof and sidewall; this guard space is formed space, lid indent position; be used for hiding the heat-conducting medium of smearing on the heat abstractor; should be fixedly ora terminalis be positioned on the periphery of lid, this fixed part is arranged on fixedly on the ora terminalis, is used for installing this heat conducting medium protective cover on heat abstractor.But because over cap is made of plastics usually; very easily produce the bending distortion, the concave inward structure of above-mentioned over cap often bends distortion owing to being subject to external force, thereby contacts with heat-conducting medium; heat-conducting medium is scratched, be installed to the radiating effect of the radiator on the electronic component after the impact.
Summary of the invention
In view of above content, be necessary to provide a kind of heat conducting medium protective cover that can effectively protect heat-conducting medium.
A kind of heat conducting medium protective cover; be used for covering and spreading upon heat-conducting medium on the heat abstractor with protection on the heat abstractor; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; be convexly equipped with some ribs on the described covering plate, described ribs is against on the described heat abstractor and described covering plate is not contacted with described heat-conducting medium.
The present invention also provides a kind of heat abstractor that is equiped with above-mentioned heat conducting medium protective cover; it comprises a radiator; described radiator is provided with a base; one side of described base is coated with heat-conducting medium; described heat abstractor comprises that also one covers the heat conducting medium protective cover that is used for protecting described heat-conducting medium at described base; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; convex with some ribs on the described covering plate, described ribs offsets with described base and described covering plate and described heat-conducting medium is not contacted.
Compared to prior art, the ribs on the covering plate of the present invention can effectively avoid covering plate to touch heat-conducting medium, better protects heat-conducting medium.
Description of drawings
Fig. 1 is the stereogram that heat conducting medium protective cover of the present invention and can be installed the radiator of this heat conducting medium protective cover.
Fig. 2 is that the heat conducting medium protective cover among Fig. 1 is fixed to the three-dimensional assembly diagram on the radiator.
Fig. 3 is the cutaway view along III-III among Fig. 2.
Embodiment
See also Fig. 1, Figure 1 shows that heat conducting medium protective cover 30 of the present invention and can install the radiator 10 of this heat conducting medium protective cover 30.
This radiator 10 comprises a base 11, one side of base 11 is provided with one and is used for treating the contacted contact-making surface 113 of heat dissipation element with one, the middle part of contact-making surface 113 is coated with a heat-conducting medium layer 15, do not smear heat-conducting medium for four jiaos of contact-making surface 113, radiator 10 is equiped with some radiating fins 14 and two heat pipes 13 at the opposite side of base 11, one end of two heat pipes 13 is located in these radiating fins 14, and the other end is fixed between base 11 and these radiating fins 14.
This heat conducting medium protective cover 30 comprises that one is used for hiding the covering plate 31 of this heat-conducting medium layer 15, and covering plate 31 is all identical with shape, the size of contact-making surface 113.The vertical side plate 32 that extends and form around covering plate 31 of the periphery of covering plate 31, side plate 32 is made by the material of elastically deformable, such as plastics etc.Covering plate 31 and side plate 32 surround one jointly can accommodate base 11 in accommodation space 37 wherein, covering plate 31 has been convexly equipped with some ribs 33 respectively at the Qi Sijiao place in accommodation space 37, these ribs 33 are connected to side plate 32, thereby strengthen the intensity of covering plate 31, prevent that covering plate 31 from larger flexural deformation occuring.The thickness of these ribs 33 is greater than the thickness of this heat-conducting medium layer 15.Corresponding two heat pipes 13 in the relative both sides of side plate 32 are provided with the breach 321 that passes for two heat pipes 13, and the width of breach 321 is slightly less than the width of two heat pipes 13.
See also Fig. 1 to Fig. 3; during assembling; heat conducting medium protective cover 30 is covered on base 11; covering plate 31 hides on contact-making surface 113; ribs 33 on the covering plate 31 is against on the contact-making surface 113, does not contact between the heat-conducting medium layer 15 at contact-making surface 113 middle parts and the covering plate 31, avoids heat-conducting medium layer 15 to be scratched; and ribs 33 has been strengthened the intensity of covering plate 31, thereby prevents that covering plate 31 from contacting with heat-conducting medium layer 15 because external force produces larger flexural deformation.Simultaneously, the side plate 32 of heat conducting medium protective cover 30 is fitted in the periphery of base 11, and heat pipe 13 embeds in the breach 321 of side plate 32, and heat conducting medium protective cover 30 is fixed on the radiator 10.

Claims (6)

1. heat conducting medium protective cover; be used for covering and spreading upon heat-conducting medium on the heat abstractor with protection on the heat abstractor; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; it is characterized in that: be convexly equipped with some ribs on the described covering plate; the periphery of described covering plate extends to form side plate; described side plate comprises extended some sidewalls around covering plate; described covering plate and some sidewalls surround jointly only has the untight accommodation space of one side; described accommodation space can accommodating described heat abstractor; described ribs extend in the accommodation space and directly and at least two sides in some sidewalls link to each other, described ribs is against on the described heat abstractor and described covering plate is not contacted with described heat-conducting medium.
2. heat conducting medium protective cover as claimed in claim 1, it is characterized in that: described ribs is positioned at the Si Jiaochu of described covering plate.
3. heat abstractor; comprise a radiator; described radiator is provided with a base; one side of described base is coated with heat-conducting medium; described heat abstractor comprises that also one covers the heat conducting medium protective cover that is used for protecting described heat-conducting medium at described base; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; it is characterized in that: convex with some ribs on the described covering plate; the periphery of described covering plate extends to form side plate; described side plate comprises extended some sidewalls around covering plate; described covering plate and some sidewalls surround jointly only has the untight accommodation space of one side; described accommodation space can accommodating described radiator base; described ribs extend in the accommodation space and directly and at least two sides in some sidewalls link to each other, described ribs offsets with described base and described covering plate and described heat-conducting medium is not contacted.
4. heat abstractor as claimed in claim 3; it is characterized in that: the opposite side of described base is equiped with heat pipe; the corresponding described heat pipe of described sidewall offers breach; the width of described breach is slightly less than the width of described heat pipe, and described heat pipe embeds in the described breach and described heat conducting medium protective cover is fixed on the described radiator.
5. heat abstractor as claimed in claim 3, it is characterized in that: shape, the size of described covering plate and described base are all identical, and described ribs is arranged on the Si Jiaochu of described covering plate, and described heat-conducting medium spreads upon the middle part of described base.
6. heat abstractor as claimed in claim 3, it is characterized in that: the thickness of described ribs is greater than the thickness of described heat-conducting medium.
CN2008103011286A 2008-04-14 2008-04-14 Heat-conducting medium protecting cover and heating abstractor with the protecting cover Expired - Fee Related CN101562964B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008103011286A CN101562964B (en) 2008-04-14 2008-04-14 Heat-conducting medium protecting cover and heating abstractor with the protecting cover
US12/206,966 US20090255659A1 (en) 2008-04-14 2008-09-09 Protective cap for thermal grease of heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008103011286A CN101562964B (en) 2008-04-14 2008-04-14 Heat-conducting medium protecting cover and heating abstractor with the protecting cover

Publications (2)

Publication Number Publication Date
CN101562964A CN101562964A (en) 2009-10-21
CN101562964B true CN101562964B (en) 2013-01-09

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CN (1) CN101562964B (en)

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TWM311243U (en) * 2006-11-22 2007-05-01 Cooler Master Co Ltd Cover to protect the heat-conduction medium
TWM337725U (en) * 2008-03-11 2008-08-01 Tai Sol Electronics Co Ltd Radiation paste lid
CN101616570B (en) * 2008-06-25 2012-07-04 富准精密工业(深圳)有限公司 Protective cover
WO2012131519A1 (en) * 2011-03-25 2012-10-04 Koninklijke Philips Electronics N.V. Thermal interface pad material with perforated liner
CN107239120B (en) * 2017-05-18 2021-11-30 北京嘉楠捷思信息技术有限公司 Electronic equipment
CN111263552B (en) * 2020-02-05 2020-12-29 环胜电子(深圳)有限公司 Adapter card module with protective cover

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Publication number Publication date
US20090255659A1 (en) 2009-10-15
CN101562964A (en) 2009-10-21

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