US20090065477A1 - Pulsed-continuous etching - Google Patents
Pulsed-continuous etching Download PDFInfo
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- US20090065477A1 US20090065477A1 US12/095,626 US9562606A US2009065477A1 US 20090065477 A1 US20090065477 A1 US 20090065477A1 US 9562606 A US9562606 A US 9562606A US 2009065477 A1 US2009065477 A1 US 2009065477A1
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- 238000005530 etching Methods 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims description 95
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 7
- 229910052724 xenon Inorganic materials 0.000 claims 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 4
- 238000007599 discharging Methods 0.000 abstract 1
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 description 25
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 3
- 238000000859 sublimation Methods 0.000 description 3
- 230000008022 sublimation Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- -1 halogen fluorides Chemical class 0.000 description 2
- FQFKTKUFHWNTBN-UHFFFAOYSA-N trifluoro-$l^{3}-bromane Chemical compound FBr(F)F FQFKTKUFHWNTBN-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- QGOSZQZQVQAYFS-UHFFFAOYSA-N krypton difluoride Chemical compound F[Kr]F QGOSZQZQVQAYFS-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Definitions
- Vapor etching of semiconductor materials and/or substrates is accomplished using gases such as xenon difluoride. Specifically, in xenon difluoride etching, the xenon difluoride gas reacts with solid materials such as silicon and molybdenum such that the materials are converted to a gas phase and removed. This removal of these materials is known as etching.
- xenon difluoride etching is through the pulsed method of etching.
- xenon difluoride is sublimated from a solid to a gas in an intermediate chamber, referred to as an expansion chamber, which can then be mixed with other gases.
- the gas(es) in the expansion chamber can then flow into an etching chamber to etch the sample, referred to as the etching step.
- the main chamber is then emptied through a vacuum pump and this cycle, including the etching step, is referred to as an etching cycle.
- xenon difluoride etching can be accomplished using a continuous method such as that described in McQuarrie et al., U.S. Pat. No. 6,409,876 where single reservoir is connected to a flow controller to provide a constant flow of xenon difluoride gas to the sample to be etched.
- a means of mixing an additional, inert, gas to the etch gas between the outlet side of the flow controller and the inlet of the chamber is described.
- an additional gas typically an inert or minimally reacting gas, such as nitrogen
- the partial pressure of the additional, non-etching gas is higher than the sublimation pressure, which is the pressure below which that xenon difluoride is a gas and above which is a solid, of the xenon difluoride.
- the sublimation pressure of xenon difluoride is approximately 4 torr.
- the gases can be any inert gas such as helium, nitrogen, or argon. Mixtures of inert gases are also possible. Note that the term inert is used to refer to any gas that minimally reacts with the etching chemistry and is also referred to as a non-etching gas.
- vapor phased etching gases such as bromine trifluoride, could be used in addition to or in place of xenon difluoride.
- a vapor etching gas source 120 which is usually a cylinder of gas, such as xenon difluoride, is connected to a shutoff valve 1118 .
- Shutoff valves 112 and 114 are connected to expansion chambers 106 and 108 which are used as an intermediate chamber to regulate the quantity of etching gas in each cycle.
- the expansion chambers 106 and 108 can be optionally independently evacuated through shutoff valves 111 and 115 .
- the expansion chambers 106 and 108 also have pressure sensors 105 and 107 which are typically capacitance diaphragm gauges.
- the expansion chambers have additional connections to shutoff valves 116 and 117 to allow mixing gases such as nitrogen to be mixed with the xenon difluoride in the expansion chambers.
- shutoff valves 116 and 117 can also be a needle valve and additional shutoff valves to provide additional control of the flow of the incoming mixing gases.
- the expansion chambers 106 and 108 are connected to the main chamber 123 via a flow path that includes shutoff valves 109 and 110 which then split into two paths, one through a flow controller 101 with additional shutoff valves 100 and 102 or another which bypasses the flow controller 101 via shutoff valve 104 .
- the flow controller is one that is designed for controlling flow with low pressure drops such as those designed for SDS, or Safe Delivery Systems, like those provided by Celerity.
- Xenon difluoride gas can also be introduced into the main chamber 123 without flowing through the expansion chambers 106 or 108 by flowing directly through shutoff valve 113 .
- the main chamber can be vented, or filled with an inert gas to raise the pressure to atmosphere for opening, via shutoff valve 103 .
- This shutoff valve could alternatively be located on the flow path to the chamber on the other side of shutoff valve 104 .
- the main chamber pressure is monitored using a pressure sensor 122 which is preferably a capacitance diaphragm gauge.
- the pressure in the main chamber 123 is controlled using an automatic pressure controller 124 which adjusts the conductance between the main chamber 123 and the vacuum pump 126 .
- Such pressure controllers are available from MKS Instruments.
- the vacuum pump is preferably a dry vacuum pump.
- the connection between the chamber 123 and the vacuum pump 126 can be fully isolated using vacuum valve 125 .
- noble gas fluorides such as krypton difluoride or halogen fluorides, such as bromine trifluoride
- halogen fluorides such as bromine trifluoride
- a typical etching sequence is to load the sample into the main chamber 123 .
- the main chamber 123 is then evacuated through opening vacuum valve 125 which connects the vacuum pump 126 to the main chamber 123 .
- the main chamber is pumped down to 0.3 Torr.
- the main chamber 123 may be further purged of atmosphere by first closing vacuum valve 125 , opening shutoff valves 103 and 104 , and flowing the venting gas, which is typically nitrogen, into the chamber to approximately 400 Torr (anywhere from 1 Torr to 600 Torr would be useful, though).
- These pumps and purges are repeated typically three or more times to minimize moisture and undesired atmospheric gases in the chamber 123 .
- moisture can react with xenon difluoride and other etching gases to form hydrofluoric acid which will attack non-silicon materials.
- Expansion chamber one ( 106 ) is evacuated through shutoff valve 111 , typically to around 0.3 torr as monitored by 105 , and is then filled to the desired pressure of etching gas as monitored by 105 by opening and then closing shutoff valves 118 and 112 . Expansion chamber one can then be further filled with the additional mixing gas to a specific pressure as monitored by 105 by opening and then closing shutoff valve 116 .
- the second expansion chamber 108 can then be similarly prepared for use through the control of shutoff valves 115 , 118 , 114 , and 117 using 107 to monitor the pressure.
- the preparation of the second expansion chamber 108 can be executed while the first expansion chamber 106 is being used for etching.
- the flow controller 101 is set to a given flow rate, typically in the range of a few standard cubic centimeters (sccm) of flow.
- the pressure controller 124 is also set to reach a specified pressure, typically around one torr.
- Etching commences by opening shutoff valves 109 , 100 , 102 , and 125 .
- the flow of the gas mixture will be controlled to the setpoint and the pressure in the chamber will also rise to its setpoint.
- the pressure in the expansion chamber 106 will fall and the flow controller 101 will need to continue to open its control valve. Once the valve is nearing approximately 90% of fully open, there is sufficiently likelihood that the flow rate through the flow controller 101 will begin to drop below the setpoint.
- shutoff valve 109 is then closed and shutoff valve 110 is then opened so that the etching gas mixture is coming from expansion chamber two 108 .
- expansion chamber one 106 is then evacuated and refilled so that it is ready for use when expansion chamber two 108 can no longer support sufficient etching gas mixture flow. This cycle of alternating between expansion chambers 106 and 108 continues until the end of the desired etching time has been reached.
- valve position in the flow controller 101 is one way to measure the capacity of an expansion chamber to support a given flow
- other means including examining the pressure in the expansion chamber via sensors 105 or 107 is also possible.
- determinations from look-up tables, previous results, or analytical models can be used to decide at what pressure to switch between expansion chambers during an etch.
- variable volume expansion chambers can be used which can be collapsed in a continuous fashion to maintain a constant pressure at the inlet of the flow controller 101 .
- the percent that the expansion chamber has been collapsed it would be necessary to incorporate the percent that the expansion chamber has been collapsed to decide when to switch between expansion chambers. Specifically, when one expansion chamber is nearing fully collapsed, the other expansion chamber should be used.
- the pressure at the inlet of the flow controller can be controlled by the speed at which the expansion chamber is collapsed during the etch.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
- Vapor etching of semiconductor materials and/or substrates is accomplished using gases such as xenon difluoride. Specifically, in xenon difluoride etching, the xenon difluoride gas reacts with solid materials such as silicon and molybdenum such that the materials are converted to a gas phase and removed. This removal of these materials is known as etching.
- Adding non-etching gases have been described by Kirt Reed Williams, “Micromachined Hot-Filament Vacuum Devices,” Ph.D. Dissertation, UC Berkeley, May 1997, p. 3961, U.S. Pat. No. 6,409,876, and U.S. Pat. No. 6,290,864, to the xenon difluoride can offer improvements to the etch process. The advantages of using non-etchant gases to xenon difluoride etching gas are noted in U.S. Pat. No. 6,290,864 which include improved selectivity, which is the ratio of etching of the material to be etched versus those materials that are intended to remain and uniformity. Increases in both of these parameters ultimately lead to improved yield. 1 Kirt Reed Williams, “Micromachined Hot-Filament Vacuum Devices,” Ph.D. Dissertation, UB Berkeley, May 1997, p. 396.
- A common approach to xenon difluoride etching is through the pulsed method of etching.2 In this mode, xenon difluoride is sublimated from a solid to a gas in an intermediate chamber, referred to as an expansion chamber, which can then be mixed with other gases. The gas(es) in the expansion chamber can then flow into an etching chamber to etch the sample, referred to as the etching step. The main chamber is then emptied through a vacuum pump and this cycle, including the etching step, is referred to as an etching cycle. These cycles are repeated as necessary to achieve the desired amount of etching. 2 Chu, P. B.; J. T. Chen; R. Yeh; G. Lin; J. C. P. Huang; B. A. Warneke; K. S. J. Pister “Controlled PulseEtching with Xenon Difluoride”; 1997 International Conference on Solid State Sensors and Actuators—TRANSDUCERS '97, Chicago, USA, June 16-19, p. 665-668
- Alternatively, xenon difluoride etching can be accomplished using a continuous method such as that described in McQuarrie et al., U.S. Pat. No. 6,409,876 where single reservoir is connected to a flow controller to provide a constant flow of xenon difluoride gas to the sample to be etched. In addition, a means of mixing an additional, inert, gas to the etch gas between the outlet side of the flow controller and the inlet of the chamber is described.
- Adding an additional gas, typically an inert or minimally reacting gas, such as nitrogen, to the etching process, must be accomplished keeping in mind the sublimation pressure of xenon difluoride. Often, the partial pressure of the additional, non-etching gas is higher than the sublimation pressure, which is the pressure below which that xenon difluoride is a gas and above which is a solid, of the xenon difluoride. At 25 C, the sublimation pressure of xenon difluoride is approximately 4 torr. It is not uncommon during pulsed etching to mix in high pressures of other gases, such as nitrogen, into the expansion chamber, after the expansion chamber has been filled with a few torr of xenon difluoride, to high pressures such as 30 torr. However, in a continuous process, such as that described in U.S. Pat. No. 6,409,876, the pressures of the additional gas mixed into the xenon difluoride would have to be less than the pressure of the supplied xenon difluoride gas. The reason for this limitation is that additional gas pressures higher than the xenon difluoride pressure between the outlet of the flow controller and inlet to the chamber would cause the xenon difluoride to stop flowing through the controller.
- We herein describe a process sequence to allow the continuous flowing of xenon difluoride gas with mixture of high pressures of additional gases. To maintain long duration, continuous etches, it uses multiple expansion chambers, which allows one expansion chamber to be used for etching while the other is being prepared.
- The gases can be any inert gas such as helium, nitrogen, or argon. Mixtures of inert gases are also possible. Note that the term inert is used to refer to any gas that minimally reacts with the etching chemistry and is also referred to as a non-etching gas.
- In addition, other vapor phased etching gases, such as bromine trifluoride, could be used in addition to or in place of xenon difluoride.
- Shown in
FIG. 1 , a vaporetching gas source 120, which is usually a cylinder of gas, such as xenon difluoride, is connected to a shutoff valve 1118.Shutoff valves expansion chambers expansion chambers shutoff valves expansion chambers pressure sensors shutoff valves shutoff valves - The
expansion chambers main chamber 123 via a flow path that includesshutoff valves flow controller 101 withadditional shutoff valves flow controller 101 viashutoff valve 104. The flow controller is one that is designed for controlling flow with low pressure drops such as those designed for SDS, or Safe Delivery Systems, like those provided by Celerity. - Xenon difluoride gas can also be introduced into the
main chamber 123 without flowing through theexpansion chambers shutoff valve 113. - The main chamber can be vented, or filled with an inert gas to raise the pressure to atmosphere for opening, via
shutoff valve 103. This shutoff valve could alternatively be located on the flow path to the chamber on the other side ofshutoff valve 104. - The main chamber pressure is monitored using a
pressure sensor 122 which is preferably a capacitance diaphragm gauge. The pressure in themain chamber 123 is controlled using anautomatic pressure controller 124 which adjusts the conductance between themain chamber 123 and thevacuum pump 126. Such pressure controllers are available from MKS Instruments. The vacuum pump is preferably a dry vacuum pump. In addition, the connection between thechamber 123 and thevacuum pump 126 can be fully isolated usingvacuum valve 125. - Not shown in the figures is that the system is controlled using either a computer or other similar controller, such as a programmable logic controller. Manual operation is possible but is difficult.
- Other modifications to the aforementioned system design are envisioned such as those described in U.S. Pat. No. 6,887,337 (assigned to XACTIX) including, but not limited to, variable volume expansion chambers, more than two expansion chambers, and multiple gas sources. The addition of multiple gas sources is shown in
FIG. 2 whereadditional gas source 121 andvalve 119 have been added. Additional gas sources could be added in a similar fashion. - In addition, the use of other noble gas fluorides, such as krypton difluoride or halogen fluorides, such as bromine trifluoride, are also considered for etching. In addition, combinations of these gases are also considered.
- A typical etching sequence is to load the sample into the
main chamber 123. Themain chamber 123 is then evacuated through openingvacuum valve 125 which connects thevacuum pump 126 to themain chamber 123. Typically, the main chamber is pumped down to 0.3 Torr. Themain chamber 123 may be further purged of atmosphere by firstclosing vacuum valve 125, openingshutoff valves chamber 123. Most critically, moisture can react with xenon difluoride and other etching gases to form hydrofluoric acid which will attack non-silicon materials. - The etching sequence then proceeds generally as described in
FIG. 3 . Expansion chamber one (106) is evacuated throughshutoff valve 111, typically to around 0.3 torr as monitored by 105, and is then filled to the desired pressure of etching gas as monitored by 105 by opening and then closingshutoff valves shutoff valve 116. Thesecond expansion chamber 108 can then be similarly prepared for use through the control ofshutoff valves - The preparation of the
second expansion chamber 108 can be executed while thefirst expansion chamber 106 is being used for etching. To use thefirst expansion chamber 106 for etching, theflow controller 101 is set to a given flow rate, typically in the range of a few standard cubic centimeters (sccm) of flow. Thepressure controller 124 is also set to reach a specified pressure, typically around one torr. Etching commences by openingshutoff valves expansion chamber 106 will fall and theflow controller 101 will need to continue to open its control valve. Once the valve is nearing approximately 90% of fully open, there is sufficiently likelihood that the flow rate through theflow controller 101 will begin to drop below the setpoint. - After the indication that the flow is about to drop below the setpoint,
shutoff valve 109 is then closed andshutoff valve 110 is then opened so that the etching gas mixture is coming from expansion chamber two 108. Immediately following this change between expansion chambers, expansion chamber one 106 is then evacuated and refilled so that it is ready for use when expansion chamber two 108 can no longer support sufficient etching gas mixture flow. This cycle of alternating betweenexpansion chambers - It should be noted that although the valve position in the
flow controller 101 is one way to measure the capacity of an expansion chamber to support a given flow, other means including examining the pressure in the expansion chamber viasensors - It should also be noted that during the switch between expansion chambers that the pressure on the inlet side of the flow controller will rapidly increase. To counteract this sudden pressure jump, it may be necessary to make a preemptive adjustment to the valve position in the
flow controller 101 when switching between expansion chambers. As described in U.S. Pat. No. 6,887,337, variable volume expansion chambers can be used which can be collapsed in a continuous fashion to maintain a constant pressure at the inlet of theflow controller 101. However, in this case, it would be necessary to incorporate the percent that the expansion chamber has been collapsed to decide when to switch between expansion chambers. Specifically, when one expansion chamber is nearing fully collapsed, the other expansion chamber should be used. It should be noted that the pressure at the inlet of the flow controller can be controlled by the speed at which the expansion chamber is collapsed during the etch.
Claims (16)
Priority Applications (1)
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US12/095,626 US8257602B2 (en) | 2005-12-01 | 2006-11-30 | Pulsed-continuous etching |
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US74151705P | 2005-12-01 | 2005-12-01 | |
PCT/US2006/045879 WO2007064812A2 (en) | 2005-12-01 | 2006-11-30 | Pulsed-continuous etching |
US12/095,626 US8257602B2 (en) | 2005-12-01 | 2006-11-30 | Pulsed-continuous etching |
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US20090065477A1 true US20090065477A1 (en) | 2009-03-12 |
US20100126963A9 US20100126963A9 (en) | 2010-05-27 |
US8257602B2 US8257602B2 (en) | 2012-09-04 |
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US (1) | US8257602B2 (en) |
JP (1) | JP5695817B2 (en) |
CN (1) | CN101336312B (en) |
WO (1) | WO2007064812A2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011068959A1 (en) * | 2009-12-02 | 2011-06-09 | Xactix, Inc. | High-selectivity etching system and method |
WO2014176405A1 (en) * | 2013-04-26 | 2014-10-30 | Stc. Unm | Determination of etching parameters for pulsed xenon difluoride (xef2) etching of silicon using chamber pressure data |
WO2015054044A3 (en) * | 2013-10-08 | 2015-08-06 | Stc.Unm | Method and system for the determination of volumes of vacuum chambers and equilibrium times for a vaccuum system |
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JP6107327B2 (en) * | 2013-03-29 | 2017-04-05 | 東京エレクトロン株式会社 | Film forming apparatus, gas supply apparatus, and film forming method |
CN115025324A (en) * | 2015-07-31 | 2022-09-09 | 赛诺菲-安万特德国有限公司 | Sensor for a drug delivery device |
US11007322B2 (en) | 2015-07-31 | 2021-05-18 | Sanofi-Aventis Deutschland Gmbh | Sensor, cartridge and drug delivery device |
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US6290864B1 (en) * | 1999-10-26 | 2001-09-18 | Reflectivity, Inc. | Fluoride gas etching of silicon with improved selectivity |
US20020033229A1 (en) * | 2000-09-19 | 2002-03-21 | Lebouitz Kyle S. | Apparatus for etching semiconductor samples and a source for providing a gas by sublimination thereto |
US6409876B1 (en) * | 1997-05-13 | 2002-06-25 | Surface Technology Systems, Plc | Apparatus for etching a workpiece |
US20060248934A9 (en) * | 2004-12-27 | 2006-11-09 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and method for supplying liquid and apparatus for processing substrate |
US8003934B2 (en) * | 2004-02-23 | 2011-08-23 | Andreas Hieke | Methods and apparatus for ion sources, ion control and ion measurement for macromolecules |
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JPH03211281A (en) | 1990-01-17 | 1991-09-17 | Matsushita Electron Corp | Gas piping device of cylinder box |
WO2005106936A1 (en) * | 2004-04-30 | 2005-11-10 | Ebara Corporation | Apparatus for treating substrate |
-
2006
- 2006-11-30 CN CN2006800520480A patent/CN101336312B/en active Active
- 2006-11-30 US US12/095,626 patent/US8257602B2/en active Active
- 2006-11-30 JP JP2008543471A patent/JP5695817B2/en active Active
- 2006-11-30 WO PCT/US2006/045879 patent/WO2007064812A2/en active Application Filing
Patent Citations (7)
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US6409876B1 (en) * | 1997-05-13 | 2002-06-25 | Surface Technology Systems, Plc | Apparatus for etching a workpiece |
US6290864B1 (en) * | 1999-10-26 | 2001-09-18 | Reflectivity, Inc. | Fluoride gas etching of silicon with improved selectivity |
US20020033229A1 (en) * | 2000-09-19 | 2002-03-21 | Lebouitz Kyle S. | Apparatus for etching semiconductor samples and a source for providing a gas by sublimination thereto |
US6887337B2 (en) * | 2000-09-19 | 2005-05-03 | Xactix, Inc. | Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto |
US20050230046A1 (en) * | 2000-09-19 | 2005-10-20 | Lebouitz Kyle S | Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto |
US8003934B2 (en) * | 2004-02-23 | 2011-08-23 | Andreas Hieke | Methods and apparatus for ion sources, ion control and ion measurement for macromolecules |
US20060248934A9 (en) * | 2004-12-27 | 2006-11-09 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and method for supplying liquid and apparatus for processing substrate |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011068959A1 (en) * | 2009-12-02 | 2011-06-09 | Xactix, Inc. | High-selectivity etching system and method |
WO2014176405A1 (en) * | 2013-04-26 | 2014-10-30 | Stc. Unm | Determination of etching parameters for pulsed xenon difluoride (xef2) etching of silicon using chamber pressure data |
WO2015054044A3 (en) * | 2013-10-08 | 2015-08-06 | Stc.Unm | Method and system for the determination of volumes of vacuum chambers and equilibrium times for a vaccuum system |
Also Published As
Publication number | Publication date |
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WO2007064812A3 (en) | 2008-01-17 |
US8257602B2 (en) | 2012-09-04 |
JP5695817B2 (en) | 2015-04-08 |
WO2007064812A2 (en) | 2007-06-07 |
JP2009518826A (en) | 2009-05-07 |
US20100126963A9 (en) | 2010-05-27 |
CN101336312A (en) | 2008-12-31 |
CN101336312B (en) | 2011-07-06 |
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