US20090038784A1 - Heat Exchanger - Google Patents

Heat Exchanger Download PDF

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Publication number
US20090038784A1
US20090038784A1 US11/815,148 US81514806A US2009038784A1 US 20090038784 A1 US20090038784 A1 US 20090038784A1 US 81514806 A US81514806 A US 81514806A US 2009038784 A1 US2009038784 A1 US 2009038784A1
Authority
US
United States
Prior art keywords
heat transfer
plate
locating means
plates
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/815,148
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English (en)
Inventor
Roland Larsson
Kerstin Drakarve
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alfa Laval Corporate AB
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to ALFA LAVAL CORPORATE AB reassignment ALFA LAVAL CORPORATE AB ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DRAKARVE, KERSTIN, LARSSON, ROLAND
Publication of US20090038784A1 publication Critical patent/US20090038784A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0043—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
    • F28D9/005—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another the plates having openings therein for both heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
    • F28F3/046—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being linear, e.g. corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/04—Means for preventing wrong assembling of parts

Definitions

  • the present invention relates to a heat exchanger according to the preamble of claim 1 .
  • Permanently connected heat exchangers are traditionally made up of a number of heat transfer plates forming a plate stack.
  • the soldering process involves the plate stack being placed in a furnace whereby the solder connects the plates to one another.
  • the handling operations relating to the soldering it may easily happen that unflanged plates lying on one another become mutually displaced.
  • fixtures it is usual for fixtures to be used during heat exchanger manufacture.
  • a usual such means is that the plates are placed within so-called support pins which therefore prevent the plates from shifting sideways.
  • Japanese patent specification JP 09-113170 refers to a heat transfer plate with locating means in the form of pressed ridges situated in its edge portion. During plate stacking, the locating means engages mechanically with the locating means of an adjacent plate, thereby preventing mutual displacement between the plates.
  • the disadvantage of having locating means situated in edge portions is that the edges will be relatively large. As the edges constitute so-called dead surface (because no heat transfer takes place in the edge portion), it is desirable from the material point of view to be able to minimise the edges as much as possible. What determines the size of edges is their width, measured from the outer edge of the plate to the heat transfer surface.
  • the edge portion As the edge portion has to be soldered to the corresponding edge of an adjacent plate, the edge portion needs to be wide enough to be able to fulfil the tightness and pressure requirements for the heat exchanger. With today's manufacturing and assembly technology, the edge width needs to be at least about 2 mm from the outer edge to the heat transfer surface.
  • a further disadvantage of the invention according to Japanese patent specification JP 09-113170 is that the locating means only prevents movement of the plates transversely to the direction of the edge portion. Two plates placed against one another are not prevented from moving in the direction of the plate longitudinally with the edge portions. The result during soldering of the plates is that the plates might shift in a longitudinal direction relative to one another, rendering the heat exchanger impossible to use.
  • a heat transfer plate with locating means comprises an edge portion which extends round the periphery of the plate, and a heat transfer surface which is surrounded by the edge portion.
  • the heat transfer surface normally exhibits a pattern of crests and valleys. The crests and valleys are situated within a first (upper) plane and a second (lower) plane. The lateral mid-portion of the heat transfer surface is in a normal plane situated between the first and second planes.
  • the heat transfer plate is stacked on top of a plate which is similar but oriented differently in a plate stack in a heat exchanger. Flow channels which accommodate different media are formed between the plates in the plate stack. During operation there is temperature exchange between the media in mutually adjacent channels.
  • An object of the present invention is to provide a heat transfer plate for a permanently connected heat exchanger comprising a unflanged plate stack which can be set up during manufacture without the plate stack having to be supported externally by walls or guiding elements to prevent mutual displacement of the stacked plates during handling relating to the soldering process.
  • An object of the present invention is to provide a heat transfer plate for a permanently connected heat exchanger comprising a unflanged plate stack whereby the plates in the plate stack cannot rotate relative to one another during the manufacturing process.
  • An object of the present invention is to provide a heat exchanger which is made up of heat transfer plates stacked on, and permanently connected to, one another.
  • a further object of the present invention is to provide a design which makes it possible to reduce the time required for making heat exchanger plate stacks so that the manufacturing process will be quick and cost-effective.
  • An advantage afforded by a unflanged heat transfer plate with locating means according to the characterising part of claim 1 is that a number of plates can be stacked on top of one another to form a plate stack which does not need to be supported in lateral or longitudinal directions during soldering.
  • edges comprise no locating means, the width and thickness of the edges can be minimised, with the result that less material need be used in manufacturing the plates.
  • a further advantage is that reduced width of the edges results in less solder consumption for joining together the edges of the plates than the case, for example, of traditional plates, since part of the width of the latter's edges is used to form an angled locating flange.
  • a further advantage is that there is no need for a locating flange round the periphery of a plate, since the function performed by the locating means on the unflanged plate corresponds to that of such a locating flange as regards the positioning of plates in a plate stack.
  • Preferred embodiments of a heat transfer plate according to the invention have the further characteristics indicated by subclaims 2 - 11 .
  • a second locating means is disposed between the second plane of the heat transfer surface and a fourth plane placed laterally parallel below the second plane.
  • a locating means is disposed on the heat transfer surface.
  • the locating means is placed on regions which are not subject to high pressure. The fact that the number of contact points is reduced locally in a region where the locating means is situated results in local weakening between mutually adjacent plates.
  • the locating means is therefore not situated in port regions where contact and solder points of mutually adjacent plates are subject to high pressure in the heat exchanger. Instead, the locating means is situated at a distance from the port regions on the heat transfer surface so that the total pressure resistance of the heat exchanger is not affected.
  • the locating means on a first plate is adapted to fitting into a first accommodating device intended for the locating means and disposed on an adjacent second plate.
  • the second locating means on an adjacent second plate is adapted to fitting into a second accommodating device intended for the locating means and disposed on the adjacent first plate in the plate stack, thereby fixing the plates relative to one another in their lateral directions.
  • the fact that the locating means on each plate fits into accommodating devices of the adjacent plates results in the plates being firmly locked to one another, thereby countering both shear and rotation between the plates.
  • the heat transfer plate is adjacent to a second heat transfer plate, with the result that they together comprise at least two locating means, thereby effectively counteracting rotation between two mutually adjacent plates through the fact that the two points fix the plates to one another.
  • the locating means takes the form of nibs.
  • nibs are used as locating means. Pressing the heat transfer surface results in the creation in it of small elevations and depressions to form nibs.
  • the nibs are situated in the region between the first and third planes and in the region between the second and fourth planes. Using nibs as locating means minimises the amount of heat transfer surface which needs to be used for them. This is because it is desirable to have as large a heat transfer surface (with maximum heat transfer) as possible.
  • the locating means takes the form of grooves. Providing locating means in the form of grooves makes it possible for a heat exchanger with such plates to be subject to high pressure. This is because the locating means also serves as stiffening elements of the heat exchanger. The heat exchanger will therefore be strong and can be subject to high pressure stresses.
  • the locating means is situated on or in the immediate vicinity of the edge portion. Enlarging the edge locally in various portions of the edge region makes it possible for locating means to be situated on or in the immediate vicinity of the edge portion. Local enlargement of the region for the locating means is achieved by the edge in the region being widened so that a locating means can be situated there.
  • FIG. 1 depicts a plate stack for a heat exchanger.
  • FIG. 2 depicts a view of a heat transfer plate according to the invention.
  • FIG. 3 depicts from the side in cutaway view a number of heat transfer plates according to the invention in a plate stack.
  • FIG. 1 depicts a heat exchanger with a plate stack ( 1 ) comprising unflanged heat transfer plates stacked on top of one another.
  • the expression “heat transfer plate” is synonymous with “plate”.
  • FIG. 2 depicts a plate ( 2 ). The plate comprises an edge portion ( 3 ) which extends round the periphery of the plate ( 2 ). A heat transfer surface ( 4 ) is situated within the edge portion ( 3 ). At each corner of the plate, a port ( 5 a - d ) is provided for inflow and outflow of medium.
  • the heat transfer plate has a pattern ( 6 ) for optimising the heat transfer in the heat exchanger.
  • the pattern ( 6 ) comprises crests and valleys, which on mutually adjacent plates abut against one another locally so as to constitute contact points which in a known manner are used for connecting the plates to one another during the soldering together of the heat exchanger.
  • Flow channels ( 7 , see FIG. 3 ) are formed between mutually adjacent plates ( 2 ) in a plate stack ( 1 ) comprising a number of plates ( 2 ) stacked on one another.
  • Mutually adjacent flow channels ( 7 ) accommodate different media between which there is temperature exchange through the heat transfer surfaces ( 4 ) of the plates.
  • the plate according to FIG. 2 has on the heat transfer surface a number of nibs ( 8 a - d ).
  • the function of the nibs ( 8 a - d ) is to fit into accommodating means of an adjacent plate ( 2 ) in order thereby to prevent the plates ( 2 ) from being able to move laterally relative to one another.
  • Plates bearing accommodating means have the latter in positions on the plate which correspond to the nibs ( 8 a - d ). This is not depicted in the drawing.
  • FIG. 3 shows how the plates ( 2 ) with nibs ( 8 ) are fixed to one another in a plate stack ( 1 ).
  • the heat transfer surface of a first plate ( 2 a ) comprises a normal plane ( 9 ) situated in the lateral “mid-plane” of the plate. Above the normal plane ( 9 ) there is a first plane ( 10 ). Below the normal plane ( 9 ) there is a second plane ( 11 ). The heat transfer surface ( 4 ) with its crests and valleys is disposed between the first plane ( 10 ) and the second plane ( 11 ). Above the first plane ( 10 ) there is a third plane ( 12 ). Below the second plane ( 11 ) there is a fourth plane ( 13 ).
  • All the planes ( 9 - 13 ) are parallel to one another.
  • the plate with the relating planes described is drawn black in the diagram.
  • Nibs ( 8 ) are disposed in the region between the first plane ( 10 ) and the third plane ( 12 ).
  • Nibs ( 8 ) are disposed correspondingly in the region between the second plane ( 11 ) and the fourth plane ( 13 ).
  • Accommodating means ( 14 ) are disposed in the region between the first and second planes ( 10 and 11 ).
  • the accommodating means ( 14 ) are adapted to accommodating the nibs ( 8 ) on an adjacent plate ( 2 ) and thereby positively fixing the plates ( 2 ) in a lateral plane relative to one another.
  • the plates ( 2 ) in the plate stack ( 1 , see FIG. 1 ) are stacked on one another by every second plate being turned 180°. This means that the first plane ( 10 ) of each plate ( 2 ) abuts against the first plane ( 10 ) of an adjacent plate. The second plane ( 11 ) of each plate ( 2 ) correspondingly abuts against the second plane ( 11 ) of an adjacent plate ( 2 ).
  • a first plate and a fourth plate ( 2 a, d , see FIG. 1 ) have a nib ( 8 ) situated on the heat transfer surface ( 4 , see FIG. 2 ) in the region between the second plane ( 11 ) and the fourth plane ( 13 ).
  • Three accommodating means ( 14 ) are disposed in the region between the first plane ( 10 ) and the second plane ( 11 ). This is not depicted in the drawing. Two of the accommodating means ( 14 ) open towards the first plane ( 10 ) and the third opens towards the second plane ( 11 ).
  • a second plate and a third plate ( 2 b, c , see FIG. 1 ) have two nibs ( 8 ) situated in the region between the first plane ( 10 ) and the third plane ( 12 ).
  • One nib ( 8 ) is situated in the region between the second plane ( 11 ) and the fourth plane ( 13 ).
  • One accommodating means ( 14 ) is disposed between the first plane ( 10 ) and the second plane ( 11 ) and opens towards the second plane ( 11 ).
  • the second plate ( 2 b , see FIG. 1 ) is placed on the first plate ( 2 a , see FIG. 1 ) in such a way that the first planes ( 10 ) on the respective plates ( 2 a, b ) abut against one another.
  • the two nibs ( 8 ) in the region of the second plate ( 2 b ) between the first and third planes ( 10 , 12 ) fit into accommodating means ( 14 ) of the first plate ( 2 a ) which are situated between the first and second planes ( 10 , 11 ) and open towards the first plane ( 10 ). This is not depicted in the drawing.
  • the third plate ( 2 c , see FIG. 1 ) is placed on the second plate ( 2 b , see FIG. 1 ) in such a way that the second planes ( 11 ) on the respective plates ( 2 b, c ) abut against one another.
  • the nib ( 8 ) on the third plate ( 2 c ), situated in the region between the second and fourth planes ( 11 , 13 ) fits into the accommodating means ( 14 ) on the second plate ( 2 b ), which opens towards the second plane. This is not depicted in the drawing.
  • the fourth plate ( 2 d , see FIG. 1 ) is placed on the third plate ( 2 c , see FIG. 1 ) in such a way that the first planes ( 10 ) on the respective plates ( 2 c, d ) abut against one another.
  • the two nibs ( 8 ) in the region of the third plate ( 2 c ) between the first and third planes ( 10 , 12 ) fit into accommodating means ( 14 ) of the fourth plate ( 2 d ) which are situated between the first and second planes ( 10 , 11 ) and open towards the first plane ( 10 ). This is not depicted in the drawing.
  • the first plate ( 2 a , see FIG. 1 ) is placed on the fourth plate ( 2 d , see FIG. 1 ) in such a way that the second planes ( 11 ) on the respective plates ( 2 d , a) abut against one another.
  • the nib ( 8 ) on the first plate ( 2 a ), situated in the region between the second and fourth planes ( 11 , 13 ) fits into the accommodating means ( 14 ) on the fourth plate ( 2 d ), which opens towards the second plane.
  • the plates ( 2 ) are fixed relative to one another in their lateral plane. Fixing by at least two points between adjacent plates ( 2 ) also prevents the plates ( 2 ) from rotating relative to one another.
  • An alternative embodiment according to the invention is that the locating means, instead of nibs, takes the form of beams or they have the shape of an X, Y, Z or some other configuration which prevents movement in the lateral plane between two plates.
  • the advantage of such alternative locating means is that only one locating means will be needed for fixing the plates relative to one another.
  • the disadvantage is that such locating means needs to be made larger than a nib. The surface available for heat transfer will thus be smaller, resulting in inferior heat transfer capacity.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
US11/815,148 2005-02-15 2006-02-06 Heat Exchanger Abandoned US20090038784A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0500351A SE528275C2 (sv) 2005-02-15 2005-02-15 Värmeöverföringsplatta med styrorgan samt värmeväxlare som innefattar sådana plattor
SE0500351-2 2005-02-15
PCT/SE2006/000160 WO2006088409A1 (en) 2005-02-15 2006-02-06 Heat exchanger

Publications (1)

Publication Number Publication Date
US20090038784A1 true US20090038784A1 (en) 2009-02-12

Family

ID=36916727

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/815,148 Abandoned US20090038784A1 (en) 2005-02-15 2006-02-06 Heat Exchanger

Country Status (7)

Country Link
US (1) US20090038784A1 (zh)
EP (1) EP1848947A4 (zh)
JP (1) JP2008530495A (zh)
KR (1) KR20070107041A (zh)
CN (1) CN100585319C (zh)
SE (1) SE528275C2 (zh)
WO (1) WO2006088409A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110209861A1 (en) * 2010-02-26 2011-09-01 Mitsubishi Electric Corporation Method of manufacturing plate heat exchanger and plate heat exchanger
EP2267391A3 (en) * 2009-06-26 2014-02-26 SWEP International AB Asymmetric heat exchanger
WO2021154152A1 (en) * 2020-01-30 2021-08-05 Swep International Ab A brazed plate heat exchanger and use thereof

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE531472C2 (sv) * 2005-12-22 2009-04-14 Alfa Laval Corp Ab Värmeväxlare med värmeöverföringsplatta med jämn lastfördelning på kontaktpunkter vid portområden
SE532780C2 (sv) * 2008-08-28 2010-04-06 Airec Ab Plattvärmeväxlare med isolerande kantparti
SE534413C2 (sv) * 2009-08-04 2011-08-16 Airec Ab Låsanordning mellan plattor i en värmeväxlare.
MX368708B (es) * 2013-09-19 2019-10-11 Howden Uk Ltd Perfil de elemento de intercambio de calor con caracteristicas de capacidad de limpieza mejoradas.
CN105333757A (zh) * 2015-12-15 2016-02-17 浙江鸿远制冷设备有限公司 一种不等容积通道结构的换热器
CN106017190A (zh) * 2016-07-15 2016-10-12 甘肃蓝科石化高新装备股份有限公司 一种热交换器板组定位装置
JP6492148B1 (ja) * 2017-10-24 2019-03-27 株式会社日阪製作所 プレート式熱交換器
CN109724436A (zh) * 2018-12-29 2019-05-07 潍柴动力股份有限公司 一种热交换器
CN112146484B (zh) * 2019-06-28 2021-07-06 浙江三花智能控制股份有限公司 板式换热器

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US1448451A (en) * 1918-06-28 1923-03-13 Trenton Auto Radiator Works Automobile radiator
US1478489A (en) * 1922-03-09 1923-12-25 Charles F Spery Radiator core
US1606643A (en) * 1919-03-20 1926-11-09 Kramer Nathan Radiator
US1960345A (en) * 1932-12-23 1934-05-29 Gen Motors Corp Radiator
US2594008A (en) * 1950-02-07 1952-04-22 Bishop & Babcock Mfg Co Cellular core for heat exchange units
US5918664A (en) * 1997-02-26 1999-07-06 Denso Corporation Refrigerant evaporator constructed by a plurality of tubes
US6016865A (en) * 1996-04-16 2000-01-25 Alfa Laval Ab Plate heat exchanger
US20040040697A1 (en) * 2002-05-03 2004-03-04 Pierre Michel St. Heat exchanger with nested flange-formed passageway

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DE1003773B (de) * 1954-04-28 1957-03-07 Schmidt & Clemens Waermeaustauschplatte fuer Waermeaustauschvorrichtungen
FR1448155A (fr) * 1965-06-17 1966-01-28 Chausson Usines Sa Faisceau de radiateur à éléments empilés
JPS57120892U (zh) * 1981-01-21 1982-07-27
JPH0654197B2 (ja) * 1985-09-25 1994-07-20 日本電装株式会社 積層型熱交換器
SE502984C2 (sv) * 1993-06-17 1996-03-04 Alfa Laval Thermal Ab Plattvärmeväxlare med speciellt utformade portpartier
JP3541092B2 (ja) * 1995-09-22 2004-07-07 株式会社日阪製作所 プレート式熱交換器
JP3612826B2 (ja) * 1995-11-29 2005-01-19 三菱電機株式会社 熱交換素子
JPH10103883A (ja) * 1996-09-26 1998-04-24 Hisaka Works Ltd プレート式熱交換器
FR2777644B1 (fr) * 1998-04-21 2000-09-08 Valeo Thermique Moteur Sa Echangeur de chaleur de vehicule automobile comprenant un faisceau de tubes paralleles plats en materiau thermoplastique preforme, et son procede de fabrication
JP2001041679A (ja) * 1999-08-02 2001-02-16 Mitsubishi Heavy Ind Ltd 熱交換器
ES2170016B1 (es) * 2000-10-25 2003-12-01 Valeo Termico Sa Sistema de seguridad para la correcta colocacion de dos placas entre si.
JP4889869B2 (ja) * 2001-03-26 2012-03-07 パナソニックエコシステムズ株式会社 熱交換器
CA2383649C (en) * 2002-04-24 2009-08-18 Long Manufacturing Ltd. Inverted lid sealing plate for heat exchanger

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1448451A (en) * 1918-06-28 1923-03-13 Trenton Auto Radiator Works Automobile radiator
US1606643A (en) * 1919-03-20 1926-11-09 Kramer Nathan Radiator
US1478489A (en) * 1922-03-09 1923-12-25 Charles F Spery Radiator core
US1960345A (en) * 1932-12-23 1934-05-29 Gen Motors Corp Radiator
US2594008A (en) * 1950-02-07 1952-04-22 Bishop & Babcock Mfg Co Cellular core for heat exchange units
US6016865A (en) * 1996-04-16 2000-01-25 Alfa Laval Ab Plate heat exchanger
US5918664A (en) * 1997-02-26 1999-07-06 Denso Corporation Refrigerant evaporator constructed by a plurality of tubes
US20040040697A1 (en) * 2002-05-03 2004-03-04 Pierre Michel St. Heat exchanger with nested flange-formed passageway

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2267391A3 (en) * 2009-06-26 2014-02-26 SWEP International AB Asymmetric heat exchanger
US20110209861A1 (en) * 2010-02-26 2011-09-01 Mitsubishi Electric Corporation Method of manufacturing plate heat exchanger and plate heat exchanger
WO2021154152A1 (en) * 2020-01-30 2021-08-05 Swep International Ab A brazed plate heat exchanger and use thereof
US20230036224A1 (en) * 2020-01-30 2023-02-02 Swep International Ab A brazed plate heat exchanger and use thereof

Also Published As

Publication number Publication date
EP1848947A1 (en) 2007-10-31
SE528275C2 (sv) 2006-10-10
KR20070107041A (ko) 2007-11-06
SE0500351L (sv) 2006-08-16
CN101120223A (zh) 2008-02-06
CN100585319C (zh) 2010-01-27
EP1848947A4 (en) 2011-09-07
WO2006088409A1 (en) 2006-08-24
JP2008530495A (ja) 2008-08-07

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