US20090025906A1 - Cooler device - Google Patents

Cooler device Download PDF

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Publication number
US20090025906A1
US20090025906A1 US12/246,639 US24663908A US2009025906A1 US 20090025906 A1 US20090025906 A1 US 20090025906A1 US 24663908 A US24663908 A US 24663908A US 2009025906 A1 US2009025906 A1 US 2009025906A1
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United States
Prior art keywords
radiation fins
base member
metal
cooler device
bottom mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US12/246,639
Inventor
Tsung-Hsien Huang
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US12/246,639 priority Critical patent/US20090025906A1/en
Publication of US20090025906A1 publication Critical patent/US20090025906A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • F28F2275/122—Fastening; Joining by methods involving deformation of the elements by crimping, caulking or clinching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the present invention relates to a cooler device and more particularly to the mounting arrangement of the metal base member and metal radiation fins of a cooler device, which greatly increases the contact surface area between the metal base member and the metal radiation fins and is environmentally friendly.
  • heat sinks are commonly comprised of a base member and a plurality of radiation fins arranged in parallel on the metal base member.
  • the base member and the radiation fins are generally extruded from aluminum or copper. Therefore, the base member of a conventional heat sink is called the aluminum base or copper base.
  • regular heat sinks include heat sinks with heat tubes and heat sinks without heat tube.
  • the radiation fins are arranged in parallel and fastened to one another by respective hooked portions thereof.
  • heat tubes are fastened to the radiation fins to secure the radiation fins together.
  • a heat sink may be provided with an electric fan to enhance heat dissipation.
  • the radiation fins of a conventional heat sink are soldered to the base member with the application of a solder paste or bonding agent. Further, when fastening copper heat tubes to an aluminum base member, a nickel-plating procedure is necessary. The use of a solder paste or bonding agent or the application of a nickel-plating procedure greatly increases the manufacturing cost of the heat sink. Further, the application of a nickel-plating procedure is not environmentally friendly.
  • the cooler device comprises a metal base member, and a plurality of metal radiation fins mounted on the metal base member.
  • the metal radiation fins each have at least one backwardly curved and crimped bottom mounting portion.
  • the metal base member has a plurality of deep locating grooves, which receive the backwardly curved and crimped bottom mounting portions of the radiation fins; the metal base member is compressed to fixedly secure the backwardly curved and crimped bottom mounting portions of the radiation fins to the metal base member. Therefore, the radiation fins are quickly and easily affixed to the base member without electroplating or the use of solder paste or bonding means, i.e., the mounting procedure of the present invention is environmentally friendly.
  • each radiation fin has a plurality of backwardly curved and crimped bottom mounting portions respectively fastened to the base member. Therefore, the thickness of the bottom side of each radiation fin is relatively increased, i.e., the contact surface area between the radiation fins and the base member is relatively increased for quick transmission of heat energy from the base member to the radiation fins.
  • the backwardly curved and crimped bottom mounting portions of said metal radiation fins can be made to show a U-shaped profile, a L-shaped profile, a triangular profile, an inverted T-shaped profile, or a scroll-shaped profile.
  • each radiation fin has the bottom side turned backwards and crimped, therefore the bottom mounting side of each radiation fin has a certain wall thickness, and the base member can be directly extruded from aluminum or copper to provide the matching locating grooves for the mounting of the backwardly curved and crimped mounting portions of the radiation fins quickly and efficiently without a secondary processing.
  • FIG. 1 is an oblique elevation view of a cooler device in accordance with a first embodiment of the present invention.
  • FIG. 2 is an oblique elevation view of a base member for cooler device before formation of shadow transverse grooves according to the first embodiment of the present invention.
  • FIG. 3 is an exploded view of the cooler device according to the first embodiment of the present invention.
  • FIG. 4 is a sectional view of the cooler device according to the first embodiment of the present invention.
  • FIG. 5 is an exploded view in an enlarged scale of a part of the cooler device according to the first embodiment of the present invention.
  • FIG. 6 is an oblique elevation view of a cooler device according to a second embodiment of the present invention.
  • FIG. 7 is an exploded view of the cooler device according to the second embodiment of the present invention.
  • FIG. 8 is an elevational view showing a second form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 9 shows the backwardly curved and crimped bottom mounting portions of the second form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 10 is an elevational view showing a third form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 11 shows the backwardly curved and crimped bottom mounting portions of the third form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 12 is an elevational view showing a fourth form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 13 shows the backwardly curved and crimped bottom mounting portions of the fourth form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 14 is an elevational view showing a fifth form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 15 shows the backwardly curved and crimped bottom mounting portions of the fifth form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 16 is an oblique elevation view of a cooler device according to a third embodiment of the present invention.
  • FIG. 17 is an oblique elevation view of a cooler device according to a fourth embodiment of the present invention.
  • FIG. 18 is a top view of the cooler device according to the fourth embodiment of the present invention.
  • a cooler device in accordance with a first embodiment of the present invention is shown comprised of a set of radiation fins 1 , a plurality of heat tubes 2 , and a base member 3 .
  • each radiation fin 1 has same or different shapes, and are arranged in parallel. Further, each radiation fin 1 has a plurality of backwardly curved and crimped bottom mounting portion 11 (see FIGS. 4 and 5 ).
  • the heat tubes 2 are double closed-end U-tubes filed with a working fluid (not shown) and fixedly fastened to the radiation fins 1 to keep the radiation fins 1 in parallel.
  • the base member 3 is a solid flat metal block extruded from aluminum or copper, having two longitudinal positioning grooves 31 (of semicircular cross section) formed on the top wall and respectively fitting under the periphery of a part of each of the heat tubes 2 , a plurality of deep transverse locating grooves 32 formed on the top wall and adapted to receive the backwardly curved and crimped bottom mounting portions 11 of the radiation fins 1 , and a plurality of shadow transverse grooves 33 formed on the top wall between each two adjacent deep transverse locating grooves 32 .
  • FIG. 2 is an oblique top elevation view of the base member 3 before the shadow transverse grooves 33 are formed.
  • the base member 3 is compressed (in the direction indicated by the arrowhead signs shown in FIG. 4 ) to secure the radiation fins 1 firmly in place.
  • This radiation fin and base member mounting arrangement is easy and inexpensive. Because the invention eliminates the use of electroplating, solder paste, or other bonding means, the manufacturing cost of the cooler device is low and, the fabrication of the cooler device is environmentally friendly. Further, because extruding the base member 3 from aluminum or copper forms the deep transverse locating grooves 32 , the invention eliminates a secondary processing process to form the transverse locating grooves on the base member.
  • FIGS. 6 and 7 show a cooler device in accordance with a second embodiment of the present invention.
  • the cooler device is comprised of a set of radiation fins 1 , and a base member 3 .
  • the radiation fins 1 each have a plurality of hooked portions 12 protruded from one side, namely, the top side, and a plurality of backwardly curved and crimped bottom mounting portions 11 . Further, the radiation fins 1 are flat metal sheet members of same or different contours. By means of hooking the hooked portions 12 of one radiation fin 1 to another, the radiation fins 1 are fastened together in a parallel manner.
  • the base member 3 is a solid flat metal block extruded from aluminum or copper, having a plurality of deep transverse locating grooves 32 formed on the top wall and adapted to receive the backwardly curved and crimped bottom mounting portions 11 of the radiation fins 1 , and a plurality of shadow transverse grooves 33 formed on the top wall between each two adjacent transverse deep locating grooves 32 .
  • the base member 3 is compressed to deform the shadow transverse grooves 33 , thereby securing the radiation fins 1 firmly to the base member 3 .
  • each radiation fin 1 has a plurality of backwardly curved and crimped bottom mounting portions 11 , the thickness of the bottom side of each radiation fin 1 is relatively increased, i.e., the contact surface area between the radiation fins 1 and the base member 3 is relatively increased for quick transmission of heat energy from the base member 3 to the radiation fins 1 .
  • each backwardly curved bottom mounting portion 11 of the radiation fins 1 may be variously shaped.
  • each backwardly curved bottom mounting portion 11 shows a U-shaped profile.
  • each backwardly curved bottom mounting portion 11 shows an L-shaped profile.
  • each backwardly curved bottom mounting portion 11 shows a substantially triangular profile.
  • each backwardly curved bottom mounting portion 11 shows an inverted T-shaped profile.
  • each backwardly curved bottom mounting portion 11 shows a scroll-shaped profile.
  • FIG. 16 shows a cooler device in accordance with a third embodiment of the present invention.
  • the cooler device is comprised of a base member 3 a and a plurality of radiation fins 1 .
  • the base member 3 a is a metal cylinder having a plurality of deep transverse mounting grooves extending along the length and alternatively arranged in parallel around the periphery.
  • the backwardly curved and crimped bottom mounting portions (not shown) of the radiation fins 1 are respectively fastened to the deep transverse mounting grooves of the base member 3 a.
  • FIGS. 17 and 18 show a cooler device in accordance with a fourth embodiment of the present invention.
  • the cooler device is comprised of a flat panel 34 , a cylindrical base member 3 a perpendicularly extended from the top side of the flat panel 34 , and a plurality of radiation fins 1 radially fastened to the periphery of the cylindrical base member 3 a .
  • the cylindrical base member 3 a and the flat panel 34 can be directly made from a metal material in one integral piece.
  • FIGS. 1 ⁇ 18 A prototype of cooler device has been constructed with the features of FIGS. 1 ⁇ 18 .
  • the cooler device functions smoothly to provide all of the features disclosed earlier.

Abstract

A cooler device includes a metal base member and a plurality of metal radiation fins. The metal base member has parallel locating grooves; the metal radiation fins are fastened to one another in a stack by respective hooked portions thereof or by means of closed-end heat tubes, the metal radiation fins each having backwardly curved and crimped bottom mounting portions respectively fitted into the locating grooves of the metal base and fixedly secured thereto by means of compacting the locating grooves of the metal base member without electroplating or using solder paste or bonding means.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is a divisional application of prior U.S. application Ser. No. 11/530,149, filed Sep. 8, 2006, which is now pending. The entirety of the prior application is incorporated by reference herein.
    • BACKGROUND OF THE INVENTION
  • (a) Field of the Invention
  • The present invention relates to a cooler device and more particularly to the mounting arrangement of the metal base member and metal radiation fins of a cooler device, which greatly increases the contact surface area between the metal base member and the metal radiation fins and is environmentally friendly.
  • (b) Description of the Prior Art
  • Conventional heat sinks are commonly comprised of a base member and a plurality of radiation fins arranged in parallel on the metal base member. The base member and the radiation fins are generally extruded from aluminum or copper. Therefore, the base member of a conventional heat sink is called the aluminum base or copper base. Further, regular heat sinks include heat sinks with heat tubes and heat sinks without heat tube. In a heat sink without heat tube, the radiation fins are arranged in parallel and fastened to one another by respective hooked portions thereof. In a heat sink with heat tubes, heat tubes are fastened to the radiation fins to secure the radiation fins together. Further, a heat sink may be provided with an electric fan to enhance heat dissipation.
  • Further, the radiation fins of a conventional heat sink are soldered to the base member with the application of a solder paste or bonding agent. Further, when fastening copper heat tubes to an aluminum base member, a nickel-plating procedure is necessary. The use of a solder paste or bonding agent or the application of a nickel-plating procedure greatly increases the manufacturing cost of the heat sink. Further, the application of a nickel-plating procedure is not environmentally friendly.
  • There are heat sinks in which the base member is secondarily processed to provide parallel mounting grooves and then the base member is compacted to secure the radiation fins in place after insertion of the radiation fins into the mounting grooves. However, the secondary processing of the base member greatly increases the cost. Further, the limited contact surface area between the base member and the radiation fins does not allow quick transmission of heat energy from the base member to the radiation fins for quick dissipation.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. According to one aspect of the present invention, the cooler device comprises a metal base member, and a plurality of metal radiation fins mounted on the metal base member. The metal radiation fins each have at least one backwardly curved and crimped bottom mounting portion. The metal base member has a plurality of deep locating grooves, which receive the backwardly curved and crimped bottom mounting portions of the radiation fins; the metal base member is compressed to fixedly secure the backwardly curved and crimped bottom mounting portions of the radiation fins to the metal base member. Therefore, the radiation fins are quickly and easily affixed to the base member without electroplating or the use of solder paste or bonding means, i.e., the mounting procedure of the present invention is environmentally friendly.
  • According to another aspect of the present invention, each radiation fin has a plurality of backwardly curved and crimped bottom mounting portions respectively fastened to the base member. Therefore, the thickness of the bottom side of each radiation fin is relatively increased, i.e., the contact surface area between the radiation fins and the base member is relatively increased for quick transmission of heat energy from the base member to the radiation fins.
  • According to still another aspect of the present invention, the backwardly curved and crimped bottom mounting portions of said metal radiation fins can be made to show a U-shaped profile, a L-shaped profile, a triangular profile, an inverted T-shaped profile, or a scroll-shaped profile.
  • According to still another aspect of the present invention, each radiation fin has the bottom side turned backwards and crimped, therefore the bottom mounting side of each radiation fin has a certain wall thickness, and the base member can be directly extruded from aluminum or copper to provide the matching locating grooves for the mounting of the backwardly curved and crimped mounting portions of the radiation fins quickly and efficiently without a secondary processing.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an oblique elevation view of a cooler device in accordance with a first embodiment of the present invention.
  • FIG. 2 is an oblique elevation view of a base member for cooler device before formation of shadow transverse grooves according to the first embodiment of the present invention.
  • FIG. 3 is an exploded view of the cooler device according to the first embodiment of the present invention.
  • FIG. 4 is a sectional view of the cooler device according to the first embodiment of the present invention.
  • FIG. 5 is an exploded view in an enlarged scale of a part of the cooler device according to the first embodiment of the present invention.
  • FIG. 6 is an oblique elevation view of a cooler device according to a second embodiment of the present invention.
  • FIG. 7 is an exploded view of the cooler device according to the second embodiment of the present invention.
  • FIG. 8 is an elevational view showing a second form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 9 shows the backwardly curved and crimped bottom mounting portions of the second form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 10 is an elevational view showing a third form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 11 shows the backwardly curved and crimped bottom mounting portions of the third form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 12 is an elevational view showing a fourth form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 13 shows the backwardly curved and crimped bottom mounting portions of the fourth form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 14 is an elevational view showing a fifth form of the backwardly curved and crimped bottom mounting portion of the radiation fin.
  • FIG. 15 shows the backwardly curved and crimped bottom mounting portions of the fifth form of the radiation fins fastened to the base member according to the present invention.
  • FIG. 16 is an oblique elevation view of a cooler device according to a third embodiment of the present invention.
  • FIG. 17 is an oblique elevation view of a cooler device according to a fourth embodiment of the present invention.
  • FIG. 18 is a top view of the cooler device according to the fourth embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. 1˜5, a cooler device in accordance with a first embodiment of the present invention is shown comprised of a set of radiation fins 1, a plurality of heat tubes 2, and a base member 3.
  • The radiation fins 1 have same or different shapes, and are arranged in parallel. Further, each radiation fin 1 has a plurality of backwardly curved and crimped bottom mounting portion 11 (see FIGS. 4 and 5).
  • The heat tubes 2 are double closed-end U-tubes filed with a working fluid (not shown) and fixedly fastened to the radiation fins 1 to keep the radiation fins 1 in parallel.
  • The base member 3 is a solid flat metal block extruded from aluminum or copper, having two longitudinal positioning grooves 31 (of semicircular cross section) formed on the top wall and respectively fitting under the periphery of a part of each of the heat tubes 2, a plurality of deep transverse locating grooves 32 formed on the top wall and adapted to receive the backwardly curved and crimped bottom mounting portions 11 of the radiation fins 1, and a plurality of shadow transverse grooves 33 formed on the top wall between each two adjacent deep transverse locating grooves 32. FIG. 2 is an oblique top elevation view of the base member 3 before the shadow transverse grooves 33 are formed.
  • After the backwardly curved and crimped bottom mounting portions 11 of the radiation fins 1 are inserted into the deep transverse locating grooves 32, the base member 3 is compressed (in the direction indicated by the arrowhead signs shown in FIG. 4) to secure the radiation fins 1 firmly in place. This radiation fin and base member mounting arrangement is easy and inexpensive. Because the invention eliminates the use of electroplating, solder paste, or other bonding means, the manufacturing cost of the cooler device is low and, the fabrication of the cooler device is environmentally friendly. Further, because extruding the base member 3 from aluminum or copper forms the deep transverse locating grooves 32, the invention eliminates a secondary processing process to form the transverse locating grooves on the base member.
  • FIGS. 6 and 7 show a cooler device in accordance with a second embodiment of the present invention. According to this design, the cooler device is comprised of a set of radiation fins 1, and a base member 3.
  • The radiation fins 1 each have a plurality of hooked portions 12 protruded from one side, namely, the top side, and a plurality of backwardly curved and crimped bottom mounting portions 11. Further, the radiation fins 1 are flat metal sheet members of same or different contours. By means of hooking the hooked portions 12 of one radiation fin 1 to another, the radiation fins 1 are fastened together in a parallel manner.
  • The base member 3 is a solid flat metal block extruded from aluminum or copper, having a plurality of deep transverse locating grooves 32 formed on the top wall and adapted to receive the backwardly curved and crimped bottom mounting portions 11 of the radiation fins 1, and a plurality of shadow transverse grooves 33 formed on the top wall between each two adjacent transverse deep locating grooves 32.
  • After the backwardly curved and crimped bottom mounting portions 11 of the radiation fins 1 are inserted into the deep transverse locating grooves 32, the base member 3 is compressed to deform the shadow transverse grooves 33, thereby securing the radiation fins 1 firmly to the base member 3.
  • Because each radiation fin 1 has a plurality of backwardly curved and crimped bottom mounting portions 11, the thickness of the bottom side of each radiation fin 1 is relatively increased, i.e., the contact surface area between the radiation fins 1 and the base member 3 is relatively increased for quick transmission of heat energy from the base member 3 to the radiation fins 1.
  • The backwardly curved bottom mounting portions 11 of the radiation fins 1 may be variously shaped. In FIG. 5, each backwardly curved bottom mounting portion 11 shows a U-shaped profile. In FIGS. 8 and 9, each backwardly curved bottom mounting portion 11 shows an L-shaped profile. In FIGS. 10 and 11, each backwardly curved bottom mounting portion 11 shows a substantially triangular profile. In FIGS. 12 and 13, each backwardly curved bottom mounting portion 11 shows an inverted T-shaped profile. In FIGS. 14 and 15, each backwardly curved bottom mounting portion 11 shows a scroll-shaped profile.
  • FIG. 16 shows a cooler device in accordance with a third embodiment of the present invention. According to this embodiment, the cooler device is comprised of a base member 3 a and a plurality of radiation fins 1. The base member 3 a is a metal cylinder having a plurality of deep transverse mounting grooves extending along the length and alternatively arranged in parallel around the periphery. The backwardly curved and crimped bottom mounting portions (not shown) of the radiation fins 1 are respectively fastened to the deep transverse mounting grooves of the base member 3 a.
  • FIGS. 17 and 18 show a cooler device in accordance with a fourth embodiment of the present invention. According to this embodiment, the cooler device is comprised of a flat panel 34, a cylindrical base member 3 a perpendicularly extended from the top side of the flat panel 34, and a plurality of radiation fins 1 radially fastened to the periphery of the cylindrical base member 3 a. Alternatively, the cylindrical base member 3 a and the flat panel 34 can be directly made from a metal material in one integral piece.
  • A prototype of cooler device has been constructed with the features of FIGS. 1˜18. The cooler device functions smoothly to provide all of the features disclosed earlier.
  • Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.

Claims (8)

1. A cooler device comprising
a metal base member, which is a solid cylinder having a top side, a bottom side and a lateral periphery between the top side and the bottom side, and
a plurality of metal radiation fins mounted on the lateral periphery of said metal base member, wherein
said metal radiation fins each have an outer side, at least one hooked portion respectively extending from the outer side, an inner side, and at least one backwardly curved and crimped bottom mounting portion respectively extending from the inner side, the at least one hooked portion of one of said metal radiation fins being fastened to the at least one hooked portion of another one of said metal radiation fins;
said metal base member has a plurality of deep locating grooves formed on the lateral periphery, extending along a length of the lateral periphery in parallel with one another and spaced around the lateral periphery, said deep locating grooves respectively receiving the backwardly curved and crimped bottom mounting portions of said radiation fins; and
said metal base member is compressed to fixedly secure the backwardly curved and crimped bottom mounting portions of said radiation fins to said metal base member.
2. The cooler device as claimed in claim 1, wherein said base member has a plurality of shadow grooves formed on the lateral periphery in parallel to said deep locating grooves and respectively spaced between each two adjacent deep locating grooves.
3. The cooler device as claimed in claim 1, wherein the backwardly curved and crimped bottom mounting portions of said metal radiation fins show a U-shaped profile.
4. The cooler device as claimed in claim 1, wherein the backwardly curved and crimped bottom mounting portions of said metal radiation fins show an L-shaped profile.
5. The cooler device as claimed in claim 1, wherein the backwardly curved and crimped bottom mounting portions of said metal radiation fins show a triangular profile.
6. The cooler device as claimed in claim 1, wherein the backwardly curved and crimped bottom mounting portions of said metal radiation fins show an inverted T-shaped profile.
7. The cooler device as claimed in claim 1, wherein the backwardly curved and crimped bottom mounting portions of said metal radiation fins show a scroll-shaped profile.
8. The cooler device as claimed in claim 1, further comprising a metal bottom panel formed integral with the bottom side of said base member.
US12/246,639 2006-09-08 2008-10-07 Cooler device Abandoned US20090025906A1 (en)

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US11/530,149 US20080060793A1 (en) 2006-09-08 2006-09-08 Cooler device
US12/246,639 US20090025906A1 (en) 2006-09-08 2008-10-07 Cooler device

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US12/243,850 Abandoned US20090032221A1 (en) 2006-09-08 2008-10-01 Cooler device
US12/246,639 Abandoned US20090025906A1 (en) 2006-09-08 2008-10-07 Cooler device

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US20130264043A1 (en) * 2012-04-10 2013-10-10 Tsung-Hsien Huang Heat sink radiation fin and base block mounting structure
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