US20080259561A1 - Cooling-fan-free system module - Google Patents
Cooling-fan-free system module Download PDFInfo
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- US20080259561A1 US20080259561A1 US11/764,807 US76480707A US2008259561A1 US 20080259561 A1 US20080259561 A1 US 20080259561A1 US 76480707 A US76480707 A US 76480707A US 2008259561 A1 US2008259561 A1 US 2008259561A1
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- heat
- system module
- fan
- cooling
- rear case
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to a cooling-fan-free system module, and more particularly to a system module provided with heat radiating unit and employing thermal convection and thermal transmission to achieve good heat radiating effect.
- the currently available system module usually includes a housing and a circuit module provided in the housing.
- the circuit module consists of a mainboard, and a plurality of electronic elements mounted on the main board, such as a central processing unit (CPU), a hard disk, a memory, and integrated circuits (IC's).
- CPU central processing unit
- IC integrated circuits
- vents and cooling fans are normally provided on the system module at proper positions corresponding to the heat-producing electronic elements to prevent the electronic elements from overheated to result in failure or abnormal operation of the system module.
- Another object of the present invention is to provide a cooling-fan-free system module that allows good utilization of an inner space thereof.
- a further object of the present invention is to provide a cooling-fan-free system module that includes a noise-free and failure-free heat radiating unit.
- the cooling-fan-free system module includes a housing unit, a circuit module, a heat radiating unit, and a tightening unit.
- the housing unit includes a front and a rear case assembled together to define a receiving space therebetween, and the rear case is made of a highly heat conducting metal material.
- the circuit module is received in the receiving space of the housing unit, and includes a circuit board, and at least one heat-producing element mounted and electrically connected to the circuit board. Two opposite sides of the rear case facing toward and facing away from the heat-producing element are defined as an inner and a back side of the rear case, respectively.
- the heat radiating unit includes a heat-conducting pad and at least one heat radiating member.
- the heat-conducting pad is arranged on and raised from the inner side of the rear case at a position corresponding to the heat-producing element for transferring the heat produced by the heat-producing element to the rear case.
- the at least one heat radiating member is integrally formed on a back side of the rear case and in the form of a radiating fin.
- the tightening unit includes at least two internally threaded posts, at least two screw fasteners, and at least two elastic elements. The internally threaded posts are provided on the inner side of the rear case at two opposite sides of the heat-conducting pad.
- Each of the internally threaded posts includes two integrally formed portions, namely, a base portion projected from the inner side of the rear case, and a hollow sleeve portion adapted to extend through the circuit board to a front side thereof.
- the two screw fasteners are separately screwed into the two hollow sleeve portions.
- the two elastic elements are separately put around the two hollow sleeve portions to locate between the screw fasteners and the circuit board.
- the rear case is provided at a rear lower edge and a rear upper edge with a first and a second cutaway portion, respectively, to communicate the receiving space with an outer side of the housing unit.
- the circuit module further includes at least one signal transmission element mounted on and electrically connected to the circuit board, and at least one bracket assembled to an inner lower side of the housing unit.
- the bracket is provided with at least one opening corresponding to the at least one signal transmission element, and at least one aperture communicating with the first and the second cutaway portion.
- the second cutaway portion consists of a row of densely spaced vents.
- the at least one heat-producing element is selected from the group consisting of a CPU, a hard disk, a memory, and an IC.
- the rear case includes a first cover that is assembled to the front case and has a third cutaway portion, and a second cover that is detachably connected to and openably closes the third cutaway portion of the first cover.
- the first cover further includes at least one locating mortise formed at an inner lateral edge of the third cutaway portion, and the second cover further includes at least one locating tenon corresponding to and adapted to engage with the locating mortise.
- the heat-conducting pad may be integrally formed on the inner side of the rear case, or a separately formed pad.
- the heat-radiating unit may further include a heat-conducting medium arranged between the heat-producing element and the heat-conducting pad, as well as between the heat-conducting pad and the rear case.
- the heat-conducting medium may be a flexible insulating heat-conducting member, or a type of thermal-conductive compound.
- the rear case is also provided near lateral upper and lower positions with a plurality of air outlets and air inlets, respectively.
- the system module of the present invention includes a display module; and both of the system module and the display module are mounted on a base.
- FIG. 1 is an assembled rear perspective view of a cooling-fan-free system module according to a preferred embodiment of the present invention mounted on a base;
- FIG. 2 is an assembled rear perspective view of the system module according to the preferred embodiment of the present invention.
- FIG. 3 is an exploded rear perspective view showing a housing unit, a circuit module, and a heat radiating unit of the system module of the present invention
- FIG. 4 is a rear perspective view of the system module of FIG. 2 with a second cover removed from a first cover thereof;
- FIG. 5 is an exploded front perspective view showing a heat-conducting pad and a compressing unit provided in the system module according to the present invention
- FIG. 6 is a sectioned side view showing the positional relation between the heat-conducting pad and a central processing unit in the system module of the present invention.
- FIG. 7 is a sectioned side view showing another embodiment of the heat-conducting pad in the system module of the present invention.
- FIG. 8 is a sectioned side view showing a further embodiment of the heat-conducting pad in the system module of the present invention.
- FIG. 9 is a sectioned side view showing a still further embodiment of the heat-conducting pad in the system module of the present invention.
- FIG. 1 is a rear perspective view of a cooling-fan-free system module 2 according to a preferred embodiment of the present invention mounted on a base 1 , and to FIGS. 2 and 3 that are assembled and exploded rear perspective views, respectively, of the system module 2 .
- the system module 2 includes a housing unit 3 , a circuit module 4 , a heat radiating unit 5 , and a tightening unit 6 .
- the housing unit 3 includes a front case 32 and a rear case 33 , which are assembled together to define an internal receiving space 31 therebetween.
- the rear case 33 is made of a highly heat conducting metal material, such as aluminum, copper, or alloys thereof.
- the circuit module 4 is located in the receiving space 31 defined by the housing unit 3 , and includes a circuit board 41 , and at least one heat-producing element 42 mounted on and electrically connected to one side of the circuit board 41 facing toward the rear case 33 .
- the circuit module 4 further includes at least one signal transmission element 43 (see FIG. 3 ) mounted on and electrically connected to the circuit board 41 , and a bracket 44 assembled to a lower inner side of the rear case 33 of the housing unit 3 , such that the at least one signal transmission element 43 is outward extended from the circuit board 41 through the bracket 44 to be held in place.
- one side of the rear case 33 facing toward the at least one heat-producing element 42 is defined as an inner side 331 of the rear case 33
- another side of the rear case 33 facing away from the at least one heat-producing element 42 is defined as a back side 332 of the rear case 33
- there are five heat-producing elements 42 provided on the circuit board 41 namely, a central processing unit (CPU) 42 a, a hard disk 42 b, a memory 42 c , and two integrated circuits (IC's) 42 d, 42 e.
- the bracket 44 is provided with at least one opening 441 to communicate spaces above and below the bracket 44 .
- An exact number and shape of the opening 441 is correspondent to that of the signal transmission element 43 , so that the signal transmission element 43 may be outward extended from the circuit board 41 through the corresponding opening 441 and firmly held thereto.
- the at least one signal transmission element 43 may be a universal serial bus (USB), an audio/video (AV) terminal, or a PS2 port.
- the bracket 44 is further provided with a plurality of apertures 442 communicating spaces above and below the bracket 44 .
- the hard disk 42 b and the memory 42 c are removably connected to the circuit board 41 to enable convenient and easy replacement thereof.
- the rear case 33 is divided into a first cover 333 , which is assembled to the front case 32 and having a third cutaway portion 335 at a position corresponding to the hard disk 42 b and the memory 42 c; and a second cover 334 , which is detachably connected to the first cover 333 at the third cutaway portion 335 to openably close the latter.
- the third cutaway portion 335 is further provided at a lateral inner edge with at least one locating mortise 336
- the second cover 334 is further provided with at least one locating tenon 337 corresponding to the at least one locating notch 336 , so that the second cover 334 is removable connected to the first cover 333 to openably close the third cutaway portion 335 and form a complete rear case 33 via engagement of the at least one locating tenon 337 with the at least one locating mortise 336 .
- heat produced by the heat-producing elements 42 during operation thereof is carried away from the cooling-fan-free system module 2 by employing two different ways, namely, by thermal convection and heat transmission.
- the first cover 333 of the rear case 33 is formed at a rear lower edge with a first cutaway portion 34 , at a rear upper edge with a second cutaway portion 35 , and near lateral upper and lower positions with a plurality of air outlets 53 b and air inlets 53 a, respectively.
- Both the first and the second cutaway portion 34 , 35 are communicable with the apertures 442 on the bracket 44 .
- the second cutaway portion 35 consists of a row of spaced vents 351 formed at a top of the first cover 333 .
- Hot air in the receiving space 31 of the system module 2 moves upward and is released from the second cutaway portion 35 at the rear upper edge of the rear case 33 and the air outlets 53 b at the lateral upper positions of the first cover 333 , and cold air moves into the receiving space 31 via the first cutaway portion 34 at the rear lower edge of the rear case 33 , the air inlets 53 a at the lateral lower positions of the first cover 333 , and the apertures 442 on the bracket 44 to replenish the air in the receiving space 31 , and to further exchange heat with the heat-producing elements 42 .
- heat produced by the heat-producing elements 42 may be effectively carried away from the system module 2 .
- the heat radiating unit 5 To carry away heat through heat transmission, the heat radiating unit 5 is utilized. Moreover, a tightening unit 6 is provided to help in maintaining good heat radiating performance of the heat radiating unit 5 .
- the heat radiating unit 5 includes at least one heat-conducting pad 51 and a plurality of heat radiating members 52 .
- the heat-conducting pad 51 is provided on and raised from the inner side 331 of the rear case corresponding to the at least one heat-producing element 42 , such as the CPU, so as to transfer heat produced by the heat-producing element 42 to the rear case 33 .
- the heat radiating members 52 are in the form of radiating fins, and are integrally formed at the back side 332 of the first cover 333 and the second cover 334 of the rear case 33 , that is, at the side of the rear case 33 facing away from the circuit module 4 . Heat absorbed by the rear case 33 is dissipated into air via the heat radiating members 52 .
- the tightening unit 6 includes four screw fasteners 61 , four internally threaded posts 62 , and four elastic elements 63 .
- Each of the screw fasteners 61 includes a screw 611 and a snap ring 612 .
- the screw 611 has a head portion 613 and a shank portion 614 connected to each other.
- the snap ring 612 is fitted around the head portion 613 of the screw 611 .
- the internally threaded posts 62 are integrally formed on and perpendicularly projected from the inner side 331 of the rear case 33 to space from one another and locate in the vicinity of the heat-producing element 42 ( 42 a ) at two opposite sides of the heat-conducting pad 51 .
- Each of the internally threaded posts 62 includes a base portion 621 integrally formed on the inner side 331 of the rear case 33 , and a hollow sleeve portion 622 forward extended from the base portion 621 .
- the sleeve portions 622 are adapted to extend through the circuit board 41 to receive and mesh with the shank portion 614 of the screw 611 .
- the screw fastener 61 , the internally threaded post 62 , and the elastic element 63 fitted around the screw fastener 61 together tighten the circuit board 41 to the rear case 33 , and accordingly compress the CPU 42 a against the heat-conducting pad 51 .
- the hollow threaded posts 62 have a height smaller than that of other internally threaded posts used to assemble the rear case 33 to the front case 32 , so as to enable successful connection of the front case 32 to the rear case 33 .
- the elastic elements 63 are configured as compression springs for fitting around the sleeve portions 622 while being limited between the circuit board 41 and the snap ring 612 .
- the elastic elements 63 When the elastic elements 63 are compressed, they provide a buffering effect to protect the circuit board 41 against damage possibly caused by an excessively tight fastening of the screw fasteners 61 into the threaded posts 62 . Meanwhile, due to a spring force thereof, the compressed elastic elements 63 tightly push the heat-producing element 42 ( 42 a ) against the heat-conducting pad 51 to ensure good contact therebetween.
- the heat radiating unit 5 and the tightening unit 6 With the heat radiating unit 5 and the tightening unit 6 , the heat produced by the heat-producing element 42 ( 42 a ) during the operation thereof may be directly and quickly transferred via the heat-conducting pad 51 to the rear case 33 and the heat radiating members 52 to finally dissipate into the ambient air. Therefore, the heat radiating unit 5 and the tightening unit 6 together effectively protect the heat-producing element 42 from failure caused by overheating.
- the screws 611 and the elastic elements 63 are of general specifications, and the heads 613 of the screws 611 have a cross section smaller than that of the elastic elements 63 .
- the snap ring 612 is fitted around the head 613 of the screw 611 .
- the threaded posts 62 , the screw fasteners 61 , and the elastic elements 63 are separately in the number of four. However, the numbers of the threaded posts 62 , the screw fasteners 61 , and the elastic elements 63 maybe adjusted according to actual needs.
- the heat-conducting pad 51 may be integrally formed on the inner side 331 of the rear case 33 .
- the heat-conducting pad 51 may be otherwise separately formed and then assembled to the inner side 331 of the rear case 33 to become raised therefrom, as shown in FIG. 7 .
- the heat-conducting pad 51 may have a size and thickness determined according to the amount of heat produced by the heat-producing elements 42 . In the structure as shown in FIG.
- the heat-conducting pad 51 may be made of a material with even higher thermal conductivity, so that the heat produced by the heat-producing elements 42 may be more quickly transferred via the heat-conducting pad 51 to the rear case 33 and dissipated into air to achieve upgraded heat radiation efficiency.
- the heat radiating unit 5 further includes a heat-conducting medium 54 arranged between the heat-producing element 42 ( 42 a ) and the heat-conducting pad 51 , and/or between the heat-conducting pad 51 and the rear case 33 .
- the heat-conducting medium 54 may be a flexible insulating heat-conducting member, or a type of thermal-conductive compound.
- the heat-conducting medium 54 enables an improved bonding of the heat-conducting pad 51 to and between the rear case 33 and the heat-producing elements 42 , and accordingly, upgraded heat radiating efficiency.
- the system module 2 further includes a display module 7 , and both of the system module 2 and the display module 7 are mounted on the base 1 for a user to conveniently watch the display module 7 .
- the cooling-fan-free system module of the present invention does not require any additional heat radiating device mounted thereto.
- the present invention utilizes the convection mechanism consisting of the first cutaway portion 34 , the apertures 442 , and the second cutaway portion 35 ; the fin-like heat radiating members 52 integrally formed on the back side 332 of the rear case 33 ; the heat-conducting pad 51 transferring heat produced by the heat-producing elements 42 ; and the tightening unit 6 and the heat-conducting medium 54 enhancing tight contact between the heat-conducting pad 51 and the heat-producing element 42 to achieve a highly efficient heat radiating effect at reduced cost, without producing any noise, and free of mechanical failure.
- the components 51 , 52 , 53 a, 53 b, and 54 of the heat-radiating unit 5 occupy only a very small space, allowing a user to effectively utilize the receiving space 31 in the housing unit 3 .
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Abstract
Description
- This application claims priority to Taiwan Application Serial Number 96206389, filed Apr. 20, 2007, which is herein incorporated by reference.
- The present invention relates to a cooling-fan-free system module, and more particularly to a system module provided with heat radiating unit and employing thermal convection and thermal transmission to achieve good heat radiating effect.
- The currently available system module usually includes a housing and a circuit module provided in the housing. The circuit module consists of a mainboard, and a plurality of electronic elements mounted on the main board, such as a central processing unit (CPU), a hard disk, a memory, and integrated circuits (IC's).
- Since the electronic elements produce heat during operation thereof, vents and cooling fans are normally provided on the system module at proper positions corresponding to the heat-producing electronic elements to prevent the electronic elements from overheated to result in failure or abnormal operation of the system module.
- Following disadvantages are found in the conventional system module which uses the cooling fan to carry away heat produced by the electronic elements during operation thereof:
-
- (1) The cooling fan requires high manufacturing cost.
- (2) The cooling fan occupies a large space to adversely affect good utilization of an inner space of the system module.
- (3) The cooling fan tends to produce noise during operation thereof.
- (4) The cooling fan tends to become failed after having been used over a long time.
- It is therefore a primary object of the present invention to provide a cooling-fan-free system module that has lowered manufacturing cost and allows good applicability.
- Another object of the present invention is to provide a cooling-fan-free system module that allows good utilization of an inner space thereof.
- A further object of the present invention is to provide a cooling-fan-free system module that includes a noise-free and failure-free heat radiating unit.
- To achieve the above and other objects, the cooling-fan-free system module according to the present invention includes a housing unit, a circuit module, a heat radiating unit, and a tightening unit. The housing unit includes a front and a rear case assembled together to define a receiving space therebetween, and the rear case is made of a highly heat conducting metal material. The circuit module is received in the receiving space of the housing unit, and includes a circuit board, and at least one heat-producing element mounted and electrically connected to the circuit board. Two opposite sides of the rear case facing toward and facing away from the heat-producing element are defined as an inner and a back side of the rear case, respectively. The heat radiating unit includes a heat-conducting pad and at least one heat radiating member. The heat-conducting pad is arranged on and raised from the inner side of the rear case at a position corresponding to the heat-producing element for transferring the heat produced by the heat-producing element to the rear case. The at least one heat radiating member is integrally formed on a back side of the rear case and in the form of a radiating fin. The tightening unit includes at least two internally threaded posts, at least two screw fasteners, and at least two elastic elements. The internally threaded posts are provided on the inner side of the rear case at two opposite sides of the heat-conducting pad. Each of the internally threaded posts includes two integrally formed portions, namely, a base portion projected from the inner side of the rear case, and a hollow sleeve portion adapted to extend through the circuit board to a front side thereof. The two screw fasteners are separately screwed into the two hollow sleeve portions. The two elastic elements are separately put around the two hollow sleeve portions to locate between the screw fasteners and the circuit board.
- The rear case is provided at a rear lower edge and a rear upper edge with a first and a second cutaway portion, respectively, to communicate the receiving space with an outer side of the housing unit. And, the circuit module further includes at least one signal transmission element mounted on and electrically connected to the circuit board, and at least one bracket assembled to an inner lower side of the housing unit. The bracket is provided with at least one opening corresponding to the at least one signal transmission element, and at least one aperture communicating with the first and the second cutaway portion.
- The second cutaway portion consists of a row of densely spaced vents.
- The at least one heat-producing element is selected from the group consisting of a CPU, a hard disk, a memory, and an IC.
- The rear case includes a first cover that is assembled to the front case and has a third cutaway portion, and a second cover that is detachably connected to and openably closes the third cutaway portion of the first cover.
- The first cover further includes at least one locating mortise formed at an inner lateral edge of the third cutaway portion, and the second cover further includes at least one locating tenon corresponding to and adapted to engage with the locating mortise.
- The heat-conducting pad may be integrally formed on the inner side of the rear case, or a separately formed pad.
- The heat-radiating unit may further include a heat-conducting medium arranged between the heat-producing element and the heat-conducting pad, as well as between the heat-conducting pad and the rear case.
- The heat-conducting medium may be a flexible insulating heat-conducting member, or a type of thermal-conductive compound.
- The rear case is also provided near lateral upper and lower positions with a plurality of air outlets and air inlets, respectively.
- The system module of the present invention includes a display module; and both of the system module and the display module are mounted on a base.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
-
FIG. 1 is an assembled rear perspective view of a cooling-fan-free system module according to a preferred embodiment of the present invention mounted on a base; -
FIG. 2 is an assembled rear perspective view of the system module according to the preferred embodiment of the present invention; -
FIG. 3 is an exploded rear perspective view showing a housing unit, a circuit module, and a heat radiating unit of the system module of the present invention; -
FIG. 4 is a rear perspective view of the system module ofFIG. 2 with a second cover removed from a first cover thereof; -
FIG. 5 is an exploded front perspective view showing a heat-conducting pad and a compressing unit provided in the system module according to the present invention; -
FIG. 6 is a sectioned side view showing the positional relation between the heat-conducting pad and a central processing unit in the system module of the present invention; and -
FIG. 7 is a sectioned side view showing another embodiment of the heat-conducting pad in the system module of the present invention; -
FIG. 8 is a sectioned side view showing a further embodiment of the heat-conducting pad in the system module of the present invention; and -
FIG. 9 is a sectioned side view showing a still further embodiment of the heat-conducting pad in the system module of the present invention. - Please refer to
FIG. 1 that is a rear perspective view of a cooling-fan-free system module 2 according to a preferred embodiment of the present invention mounted on abase 1, and toFIGS. 2 and 3 that are assembled and exploded rear perspective views, respectively, of thesystem module 2. As shown, thesystem module 2 includes ahousing unit 3, acircuit module 4, aheat radiating unit 5, and atightening unit 6. - The
housing unit 3 includes afront case 32 and arear case 33, which are assembled together to define aninternal receiving space 31 therebetween. Therear case 33 is made of a highly heat conducting metal material, such as aluminum, copper, or alloys thereof. - Please refer to
FIGS. 2 to 5 at the same time. Thecircuit module 4 is located in thereceiving space 31 defined by thehousing unit 3, and includes acircuit board 41, and at least one heat-producingelement 42 mounted on and electrically connected to one side of thecircuit board 41 facing toward therear case 33. Thecircuit module 4 further includes at least one signal transmission element 43 (seeFIG. 3 ) mounted on and electrically connected to thecircuit board 41, and abracket 44 assembled to a lower inner side of therear case 33 of thehousing unit 3, such that the at least onesignal transmission element 43 is outward extended from thecircuit board 41 through thebracket 44 to be held in place. Herein, one side of therear case 33 facing toward the at least one heat-producingelement 42 is defined as aninner side 331 of therear case 33, and another side of therear case 33 facing away from the at least one heat-producingelement 42 is defined as aback side 332 of therear case 33. In the illustrated preferred embodiment of the present invention, there are five heat-producingelements 42 provided on thecircuit board 41, namely, a central processing unit (CPU) 42 a, ahard disk 42 b, amemory 42 c, and two integrated circuits (IC's) 42 d, 42 e. - The
bracket 44 is provided with at least one opening 441 to communicate spaces above and below thebracket 44. An exact number and shape of theopening 441 is correspondent to that of thesignal transmission element 43, so that thesignal transmission element 43 may be outward extended from thecircuit board 41 through thecorresponding opening 441 and firmly held thereto. In the illustrated preferred embodiment of the present invention, the at least onesignal transmission element 43 may be a universal serial bus (USB), an audio/video (AV) terminal, or a PS2 port. Thebracket 44 is further provided with a plurality ofapertures 442 communicating spaces above and below thebracket 44. - In the illustrated preferred embodiment of the present invention, the
hard disk 42 b and thememory 42 c are removably connected to thecircuit board 41 to enable convenient and easy replacement thereof. And, therear case 33 is divided into afirst cover 333, which is assembled to thefront case 32 and having athird cutaway portion 335 at a position corresponding to thehard disk 42 b and thememory 42 c; and asecond cover 334, which is detachably connected to thefirst cover 333 at thethird cutaway portion 335 to openably close the latter. Thethird cutaway portion 335 is further provided at a lateral inner edge with at least one locatingmortise 336, and thesecond cover 334 is further provided with at least one locatingtenon 337 corresponding to the at least one locatingnotch 336, so that thesecond cover 334 is removable connected to thefirst cover 333 to openably close thethird cutaway portion 335 and form a completerear case 33 via engagement of the at least one locatingtenon 337 with the at least one locatingmortise 336. When it is desired to remove thehard disk 42 b or thememory 42 c from thecircuit board 41, simply disengage the locatingtenon 337 of thesecond cover 334 from the locatingmortise 336 of thefirst cover 333. - In the present invention, heat produced by the heat-producing
elements 42 during operation thereof is carried away from the cooling-fan-free system module 2 by employing two different ways, namely, by thermal convection and heat transmission. - To carry away heat through thermal convection, the
first cover 333 of therear case 33 is formed at a rear lower edge with afirst cutaway portion 34, at a rear upper edge with asecond cutaway portion 35, and near lateral upper and lower positions with a plurality ofair outlets 53 b andair inlets 53 a, respectively. Both the first and thesecond cutaway portion apertures 442 on thebracket 44. In the illustrated preferred embodiment of the present invention, thesecond cutaway portion 35 consists of a row of spacedvents 351 formed at a top of thefirst cover 333. When the heat-producingelements 42 operate and produce heat, they exchange heat with ambient cold air. Hot air in the receivingspace 31 of thesystem module 2 moves upward and is released from thesecond cutaway portion 35 at the rear upper edge of therear case 33 and theair outlets 53 b at the lateral upper positions of thefirst cover 333, and cold air moves into the receivingspace 31 via thefirst cutaway portion 34 at the rear lower edge of therear case 33, theair inlets 53 a at the lateral lower positions of thefirst cover 333, and theapertures 442 on thebracket 44 to replenish the air in the receivingspace 31, and to further exchange heat with the heat-producingelements 42. When the thermal convection continues, heat produced by the heat-producingelements 42 may be effectively carried away from thesystem module 2. - To carry away heat through heat transmission, the
heat radiating unit 5 is utilized. Moreover, atightening unit 6 is provided to help in maintaining good heat radiating performance of theheat radiating unit 5. Theheat radiating unit 5 includes at least one heat-conductingpad 51 and a plurality ofheat radiating members 52. The heat-conductingpad 51 is provided on and raised from theinner side 331 of the rear case corresponding to the at least one heat-producingelement 42, such as the CPU, so as to transfer heat produced by the heat-producingelement 42 to therear case 33. Theheat radiating members 52 are in the form of radiating fins, and are integrally formed at theback side 332 of thefirst cover 333 and thesecond cover 334 of therear case 33, that is, at the side of therear case 33 facing away from thecircuit module 4. Heat absorbed by therear case 33 is dissipated into air via theheat radiating members 52. - In the illustrated preferred embodiment of the present invention, the tightening
unit 6 includes fourscrew fasteners 61, four internally threadedposts 62, and fourelastic elements 63. Each of thescrew fasteners 61 includes ascrew 611 and asnap ring 612. Thescrew 611 has ahead portion 613 and ashank portion 614 connected to each other. Thesnap ring 612 is fitted around thehead portion 613 of thescrew 611. - The internally threaded
posts 62 are integrally formed on and perpendicularly projected from theinner side 331 of therear case 33 to space from one another and locate in the vicinity of the heat-producing element 42 (42 a) at two opposite sides of the heat-conductingpad 51. Each of the internally threadedposts 62 includes abase portion 621 integrally formed on theinner side 331 of therear case 33, and ahollow sleeve portion 622 forward extended from thebase portion 621. Thesleeve portions 622 are adapted to extend through thecircuit board 41 to receive and mesh with theshank portion 614 of thescrew 611. With these arrangements, thescrew fastener 61, the internally threadedpost 62, and theelastic element 63 fitted around thescrew fastener 61 together tighten thecircuit board 41 to therear case 33, and accordingly compress theCPU 42 a against the heat-conductingpad 51. It is noted the hollow threadedposts 62 have a height smaller than that of other internally threaded posts used to assemble therear case 33 to thefront case 32, so as to enable successful connection of thefront case 32 to therear case 33. - The
elastic elements 63 are configured as compression springs for fitting around thesleeve portions 622 while being limited between thecircuit board 41 and thesnap ring 612. When theelastic elements 63 are compressed, they provide a buffering effect to protect thecircuit board 41 against damage possibly caused by an excessively tight fastening of thescrew fasteners 61 into the threaded posts 62. Meanwhile, due to a spring force thereof, the compressedelastic elements 63 tightly push the heat-producing element 42 (42 a) against the heat-conductingpad 51 to ensure good contact therebetween. - With the
heat radiating unit 5 and thetightening unit 6, the heat produced by the heat-producing element 42 (42 a) during the operation thereof may be directly and quickly transferred via the heat-conductingpad 51 to therear case 33 and theheat radiating members 52 to finally dissipate into the ambient air. Therefore, theheat radiating unit 5 and thetightening unit 6 together effectively protect the heat-producingelement 42 from failure caused by overheating. - In the illustrated embodiment, the
screws 611 and theelastic elements 63 are of general specifications, and theheads 613 of thescrews 611 have a cross section smaller than that of theelastic elements 63. To allow theelastic elements 63 to stably locate between the heat-producing element 42 (42 a) and the heat-conductingpad 51, thesnap ring 612 is fitted around thehead 613 of thescrew 611. However, it is also acceptable to direct select screws having a cross section larger than that of theelastic elements 63. Moreover, in the illustrated embodiment, the threadedposts 62, thescrew fasteners 61, and theelastic elements 63 are separately in the number of four. However, the numbers of the threadedposts 62, thescrew fasteners 61, and theelastic elements 63 maybe adjusted according to actual needs. - Please refer to
FIG. 6 . In implementing the present invention, the heat-conductingpad 51 may be integrally formed on theinner side 331 of therear case 33. However, the heat-conductingpad 51 may be otherwise separately formed and then assembled to theinner side 331 of therear case 33 to become raised therefrom, as shown inFIG. 7 . The heat-conductingpad 51 may have a size and thickness determined according to the amount of heat produced by the heat-producingelements 42. In the structure as shown inFIG. 7 , the heat-conductingpad 51 may be made of a material with even higher thermal conductivity, so that the heat produced by the heat-producingelements 42 may be more quickly transferred via the heat-conductingpad 51 to therear case 33 and dissipated into air to achieve upgraded heat radiation efficiency. - Please refer to
FIGS. 8 and 9 . Theheat radiating unit 5 further includes a heat-conductingmedium 54 arranged between the heat-producing element 42 (42 a) and the heat-conductingpad 51, and/or between the heat-conductingpad 51 and therear case 33. The heat-conductingmedium 54 may be a flexible insulating heat-conducting member, or a type of thermal-conductive compound. The heat-conductingmedium 54 enables an improved bonding of the heat-conductingpad 51 to and between therear case 33 and the heat-producingelements 42, and accordingly, upgraded heat radiating efficiency. - As can be seen from
FIG. 1 , thesystem module 2 further includes adisplay module 7, and both of thesystem module 2 and thedisplay module 7 are mounted on thebase 1 for a user to conveniently watch thedisplay module 7. - With the above arrangements, the cooling-fan-free system module of the present invention does not require any additional heat radiating device mounted thereto. In stead, the present invention utilizes the convection mechanism consisting of the
first cutaway portion 34, theapertures 442, and thesecond cutaway portion 35; the fin-likeheat radiating members 52 integrally formed on theback side 332 of therear case 33; the heat-conductingpad 51 transferring heat produced by the heat-producingelements 42; and thetightening unit 6 and the heat-conductingmedium 54 enhancing tight contact between the heat-conductingpad 51 and the heat-producingelement 42 to achieve a highly efficient heat radiating effect at reduced cost, without producing any noise, and free of mechanical failure. Moreover, thecomponents unit 5 occupy only a very small space, allowing a user to effectively utilize the receivingspace 31 in thehousing unit 3. - The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096206389U TWM325532U (en) | 2007-04-20 | 2007-04-20 | System module without fan for heat dissipation |
TW96206389 | 2007-04-20 |
Publications (2)
Publication Number | Publication Date |
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US7440276B1 US7440276B1 (en) | 2008-10-21 |
US20080259561A1 true US20080259561A1 (en) | 2008-10-23 |
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Application Number | Title | Priority Date | Filing Date |
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US11/764,807 Expired - Fee Related US7440276B1 (en) | 2007-04-20 | 2007-06-19 | Cooling-fan-free system module |
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US (1) | US7440276B1 (en) |
TW (1) | TWM325532U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20150293567A1 (en) * | 2014-04-09 | 2015-10-15 | Ray Broadwell | Secondary cooling system for laptop computer |
US11271458B2 (en) * | 2016-08-22 | 2022-03-08 | Bmc Co., Ltd. | Laminated core manufacturing apparatus capable of heating inner diameter of laminated core |
Families Citing this family (4)
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US20090212967A1 (en) * | 2004-10-15 | 2009-08-27 | Leviton Manufacturing Company, Inc | Circuit Interrupting System with Remote Test And Reset Activation |
US20100254140A1 (en) * | 2009-04-07 | 2010-10-07 | Fong-Yuan Wen | Lamp holder of led streetlamp with heat-conducting and heat-dissipating capability |
DE102011086196A1 (en) | 2011-11-11 | 2013-05-16 | Mekra Lang Gmbh & Co. Kg | Monitor and back panel for a monitor |
CN111294776A (en) * | 2020-03-27 | 2020-06-16 | 乌鲁木齐明华智能电子科技有限公司 | Embedded intelligent terminal based on 5G communication |
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US11271458B2 (en) * | 2016-08-22 | 2022-03-08 | Bmc Co., Ltd. | Laminated core manufacturing apparatus capable of heating inner diameter of laminated core |
Also Published As
Publication number | Publication date |
---|---|
TWM325532U (en) | 2008-01-11 |
US7440276B1 (en) | 2008-10-21 |
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