US20080210567A1 - Electrodeposition Material, Process for Providing a Corrosion-Protective Layer of TiO2 on an Electrically Conductive Substrate and Metal Substrate Coated with a Layer of TiO2 - Google Patents

Electrodeposition Material, Process for Providing a Corrosion-Protective Layer of TiO2 on an Electrically Conductive Substrate and Metal Substrate Coated with a Layer of TiO2 Download PDF

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Publication number
US20080210567A1
US20080210567A1 US11/961,095 US96109507A US2008210567A1 US 20080210567 A1 US20080210567 A1 US 20080210567A1 US 96109507 A US96109507 A US 96109507A US 2008210567 A1 US2008210567 A1 US 2008210567A1
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United States
Prior art keywords
electrodeposition material
acid
mol
electrically conductive
tio
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Abandoned
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US11/961,095
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English (en)
Inventor
Subbian Karuppuchamy
Naoki Suzuki
Seishiro Ito
Schweinsberg Matthias
Hans Dolhaine
Frank Wiechmann
Christine Schroeder
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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Assigned to HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN reassignment HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHROEDER, CHRISTINE, WIECHMANN, FRANK, DOLHAINE, HANS, SCHWEINSBERG, MATTHIAS, ITO, SEISHIRO, SUZUKI, NAOKI, KARUPPUCHAMY, SUBBIAN
Publication of US20080210567A1 publication Critical patent/US20080210567A1/en
Abandoned legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/08Electrolytic coating other than with metals with inorganic materials by cathodic processes

Definitions

  • the present invention relates to an electrodeposition material for the electrochemical deposition of a corrosion-protective layer of TiO 2 on an electrically conductive substrate comprising a titanium compound, a complexing agent, an accelerator, water and optionally organic solvents, buffering agents and one or more additives.
  • a corrosion-protective layer of TiO 2 on an electrically conductive substrate comprising a titanium compound, a complexing agent, an accelerator, water and optionally organic solvents, buffering agents and one or more additives.
  • Such TiO 2 layer deposited electrochemically may serve as an appropriate primer layer for subsequent coating treatment (e.g. coating with organic materials, such as for instance lacquers, varnishes, paints, organic polymers, adhesives, etc.).
  • a very common industrial task involves providing metallic or non-metallic substrates with a first coating, which has a corrosion-inhibiting effect and/or which constitutes a primer for the application thereon of a subsequent coating containing e.g. organic polymers.
  • An example of such a task is the pre-treatment of metals prior to lacquer coating, for which various processes are available in the art. Examples of such processes are layer-forming or non-layer-forming phosphating, chromating or a chromium-free conversion treatment, for example using complex fluorides of titanium, zirconium, boron or silicon.
  • Technically simpler to perform, but less effective is the simple application of a primer coat to a metal prior to lacquer-coating thereof. An example of this is the application of red lead.
  • wet processes in which a corrosion-protection or coupling layer is applied by gas phase deposition.
  • Such processes are known, for example, as PVD or CVD processes. They may be assisted electrically, for example by plasma discharge.
  • a layer produced or applied in this way may serve as a corrosion-protective primer for subsequent lacquer coating.
  • the layer may also constitute a primer for subsequent bonding.
  • Metallic substrates in particular, but also substrates of plastics or glass, are frequently pre-treated chemically or mechanically prior to bonding in order to improve adhesion of the adhesive to the substrate.
  • metal or plastic components may be bonded metal to metal, plastic to plastic or metal to plastic.
  • front and rear windshields of vehicles are as a rule bonded directly into the bodywork.
  • Other examples of the use of coupling layers are to be found in the production of rubber/metal composites, in which once again the metal substrate is as a rule pre-treated mechanically or chemically before a coupling layer is applied for the purpose of bonding with rubber.
  • the conventional wet or dry coating processes in each case exhibit particular disadvantages.
  • chromating processes are disadvantageous from both an environmental and an economic point of view owing to the toxic properties of the chromium and the occurrence of highly toxic sludge.
  • chromium-free wet processes such as phosphating, as a rule, also result in the production of sludge containing heavy metals, which has to be disposed of at some expense.
  • Another disadvantage of conventional wet coating processes is that the actual coating stage frequently has to be preceded or followed by further stages, thereby increasing the amount of space required for the treatment line and the consumption of chemicals.
  • phosphating which is used virtually exclusively in automobile construction, entails several cleaning stages, an activation stage and generally a post-passivation stage. In all these stages, chemicals are consumed and waste is produced which requires disposal.
  • dry coating processes entail fewer waste problems, they have the disadvantage of being technically complex to perform (for example requiring a vacuum) or of having high energy requirements. The high operating costs of these processes are therefore a consequence principally of plant costs and energy consumption.
  • thin layers of metals compounds may be produced electrochemically on an electrically conductive substrate.
  • metals compounds for example oxide layers
  • the article by Y. Zhou and J. A. Switzer entitled “Electrochemical Deposition and Microstructure of Copper (I) Oxide Films”, Scripta Materialia, Vol. 38, No. 11, pages 1731 to 1738 (1998) describes the electrochemical deposition and microstructure of copper (I) oxide films on stainless steel.
  • the article investigates above all the influence of deposition conditions on the morphology of the oxide layers; it does not disclose any practical application of the layers.
  • TiO 2 -layers are obtained on a Ti-sheet from H 2 SO 4 aqueous solution by anodic oxidation methods. This is obtained at potentials below 50 V. However, this process can produce TiO 2 only on Ti-substrates by anodic oxidation.
  • TiO 2 is obtained on a Ti-sheet from an aqueous solution containing 0.5 mol/L H 2 SO 4 and 0.03 mol/L HNO 3 by an anodic oxidation method (titanium anodization). Constant current is 1 mAcm 2 .
  • the oxidation is performed in a cooled bath of 278° K. to 283° K. However, this process can produce TiO 2 only on a Ti-substrate by anodic oxidation.
  • EP 1 285 105 B1 discloses a process for producing a coating comprising at least two layers on an electrically conductive surface wherein in a first stage a chromium-free layer of at least one X-ray crystalline inorganic compound of at least one metal is electrochemically deposited on an electrically conductive surface from a solution containing the metal in dissolved form. Besides many other metals, titanium is disclosed.
  • corrosion-protective layers of TiO 2 are electrochemically deposited on a metal substrate from an electrodeposition material comprising titanyl sulfate or titanyl oxalate as a titanium component, citrate or citric acid, tartaric acid and tartrates, lactic acid and lactates as chelating agents and hydroxylamines and their derivates or nitrates as accelerators.
  • this object can be achieved by the use of titanyl sulfate and/or titanyl oxalate as the titanium component combined with a special combination of complexing agents and accelerators.
  • Subject-matter of the present invention is an electrodeposition material as specified above characterized in that the titanium compound is titanyl sulfate and/or titanyl oxalate, the complexing agent is selected from the group consisting of citric acid, citrates, tartaric acid, tartrates, lactic acid, lactates, gluconic acid, gluconates, polyhydroxy-polycarbonic acids, ethylenediaminetetraacetate, methylglycinediacetate, iminodisuccinate, nitrilotriacetic acid and nitrilotriacetate, triethanolamine, phosphonic acid and phosphonates, poly-aspartic acid and polyaspartates, polyacrylic acid and polyacrylates and the accelerator is selected from the group consisting of H 2 O 2 and organic peroxides.
  • the complexing agent is selected from the group consisting of citric acid, citrates, tartaric acid, tartrates, lactic acid, lactates, gluconic acid,
  • the present invention relates to a process for providing a corrosion-protective layer of TiO 2 on an electrically conductive substrate by electrodeposition of an electrodeposition material comprising a titanium compound, a complexing agent, an accelerator, water and optionally organic solvents, buffering agents and one or more additives.
  • the present invention relates to a metal substrate coated with a layer of TiO 2 produced by the process of the invention.
  • the invention provides an electrodeposition material for the electrochemical deposition of a corrosion-protective layer of TiO 2 on an electrically conductive substrate comprising a titanium compound, a complexing agent, an accelerator, water and optionally organic solvents, buffering agents and one or more additives, characterized in that the titanium compound is titanyl sulfate and/or titanyl oxalate, the complexing agent is selected from the group consisting of citric acid, citrates, tartaric acid, tartrates, lactic acid, lactates, gluconic acid, gluconates, polyhydroxy-polycarbonic acids, ethylenediaminetetraacetate, methylglycinediacetate, iminodisuccinate, nitrilotriacetic acid and nitrilotriacetate, triethanolamine, phosphonic acid and phosphonates, poly-aspartic acid and polyaspartates, polyacrylic acid and polyacrylates and the accelerator is selected from the group consisting of H 2 O 2
  • the electrodeposition material characterized in that it comprises 0.05 to 0.3 mol/l titanium compound, 0.01 to 0.2 mol/l complexing agent and 0.02 to 0.2 mol/l accelerator.
  • the electrodeposition material further comprises a polymeric cationic binder. It is a further object of the invention to provide an electrodeposition material that comprises polymeric cationic binder in an amount of 5 to 60% by weight based on the total weight of the electrodeposition material.
  • Another aspect of the invention is a process for providing a corrosion-protective layer of TiO 2 on an electrically conductive substrate by electrodeposition of a electrodeposition material comprising a titanium compound, a complexing agent, an accelerator, water and optionally organic solvents, buffering agents and one or more additives, characterized in that the titanium compound is titanyl sulfate and/or titanyl oxalate;
  • the complexing agent is selected from the group consisting of citric acid, citrates, tartaric acid, tartrates, lactic acid, lactates, gluconic acid, gluconates, polyhydroxy-polycarbonic acids, ethylenediaminetetraacetate, methylglycinediacetate, iminodisuccinate, nitrilotriacetic acid and nitrilotriacetate, triethanolamine, phosphonic acid and phosphonates, poly-aspartic acid and polyaspartates, polyacrylic acid and polyacrylates and the accelerator is selected from the group consisting
  • the electrodeposition is carried out under the following conditions: current density: 0.01 to 100, preferably 0.1 to 20, more preferably 0.5 to 10 mA/cm 2 ; coating time: 0.15 to 20, preferably 0.5 to 10, more preferably 1 to 4 minutes; temperature: 0 to 100, preferably 20 to 60° C.; and pH: 5 to 10, preferably 6 to 9, more preferably 7.5 to 8.0.
  • electroconductive substrate is selected from the group consisting of steel, especially cold rolled steel and galvanized steel, and aluminium.
  • Another aspect of the invention is a metal substrate coated with a layer of TiO 2 produced by the process described herein.
  • the metal substrate is selected from the group consisting of steel, especially cold rolled steel and galvanized steel, and aluminium.
  • the electrodeposition material preferably comprises 0.05 to 0.3 mol/l titanium compound, 0.01 to 0.2 mol/l complexing agent and 0.02 to 0.2 mol/l accelerator.
  • the pH of the electrodeposition material preferably is 5 to 10, more preferably 6 to 9, most preferably 7.5 to 8.0.
  • the electrodeposition material preferably comprises a polymeric cationic binder in addition to the components specified above.
  • a polymeric cationic binder all electrodepositable resins known in the art may be used.
  • cationic film-forming resins include amine salt group-containing resins such as the acid-solubilized reaction products of polyepoxides and primary or secondary amines. Usually, these amine salt group-containing resins are used in combination with a blocked isocyanate curing agent.
  • quaternary ammonium salt group-containing resins can also be employed. Examples of these resins are those which are formed from reacting an organic polyepoxide with a tertiary amine salt.
  • film-forming resins which cure via transesterification can be used.
  • cationic compositions prepared from Mannich bases can be used. From an electrodeposition material comprising the components of the present invention combined with a polymeric cationic binder, a layer of TiO 2 and a resinous layer can be deposited simultaneously.
  • the electrodeposition material of the present invention comprises the polymeric cationic binder in an amount of 5 to 60% by weight based on the total weight of the electrodeposition material.
  • the present invention further relates to a process for providing a corrosion-protective layer of TiO 2 on an electrically conductive substrate by electrodeposition of a electrodeposition material comprising a titanium compound, a complexing agent, an accelerator, water and optionally organic solvents, buffering agents and one or more additives, characterized in that the titanium compound is titanyl sulfate and/or titanyl oxalate, the complexing agent is selected from the group consisting of citric acid, citrates, tartaric acid, tartrates, lactic acid, lactates, gluconic acid, gluconates, polyhydroxy-polycarbonic acids, ethylenediaminetetraacetate, methylglycinediacetate, iminodisuccinate, nitrilotriacetic acid and nitrilotriacetate, triethanolamine, phosphonic acid and phosphonates, poly-aspartic acid and polyaspartates, polyacrylic acid and polyacrylates and the accelerator is selected from the group consisting of
  • the electrodeposition preferably is carried out under the following conditions current density: 0.01 to 100, preferably 0.1 to 20, more preferably 0.5 to 10 mA/cm 2 , coating time: 0.15 to 20, preferably 0.5 to 10, more preferably 1 to 4 minutes, temperature: 0 to 100° C., preferably 20 to 60° C., pH: 5 to 10, preferably 6 to 9, more preferably 7.5 to 8.0.
  • the electroconductive substrate preferably is selected from the group consisting of steel, especially cold rolled steel and galvanized steel, and aluminium.
  • the TiO 2 -layer is deposited on the electrically conductive substrate preferably with an essentially uniform layer thickness, calculated as weight per unit area, in the range of from 0.01 to 3.5 g/m 2 , more preferably in the range of from 0.5 to 1.4 g/m 2 .

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Laminated Bodies (AREA)
US11/961,095 2005-06-22 2007-12-20 Electrodeposition Material, Process for Providing a Corrosion-Protective Layer of TiO2 on an Electrically Conductive Substrate and Metal Substrate Coated with a Layer of TiO2 Abandoned US20080210567A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05013424 2005-06-22
EP05013424.6 2005-06-22
PCT/EP2006/005790 WO2006136333A2 (fr) 2005-06-22 2006-06-16 Materiau d'electrodeposition, procede permettant de fournir une couche anticorrosion de tio2 a un substrat conducteur et substrat metallique revetu de couche de tio2

Related Parent Applications (1)

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PCT/EP2006/005790 Continuation WO2006136333A2 (fr) 2005-06-22 2006-06-16 Materiau d'electrodeposition, procede permettant de fournir une couche anticorrosion de tio2 a un substrat conducteur et substrat metallique revetu de couche de tio2

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US (1) US20080210567A1 (fr)
EP (1) EP1893791A2 (fr)
WO (1) WO2006136333A2 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110062030A1 (en) * 2009-09-17 2011-03-17 Lippert Lothar Electrolyte composition
US20120019476A1 (en) * 2010-07-26 2012-01-26 Samsung Electro-Mechanics Co., Ltd. Capacitive touch panel
WO2013188156A1 (fr) * 2012-06-12 2013-12-19 Flipchip International, Llc Procédé d'application d'une couche métallique finale pour conditionnement sur tranche et dispositif associé
CN106757249A (zh) * 2016-12-15 2017-05-31 河海大学常州校区 一种阴极表面纳秒脉冲电场制备纳米薄膜的溶液及制备方法
US9859038B2 (en) 2012-08-10 2018-01-02 General Cable Technologies Corporation Surface modified overhead conductor
US10246791B2 (en) 2014-09-23 2019-04-02 General Cable Technologies Corporation Electrodeposition mediums for formation of protective coatings electrochemically deposited on metal substrates
US10726975B2 (en) 2015-07-21 2020-07-28 General Cable Technologies Corporation Electrical accessories for power transmission systems and methods for preparing such electrical accessories
US10957468B2 (en) 2013-02-26 2021-03-23 General Cable Technologies Corporation Coated overhead conductors and methods
CN117568878A (zh) * 2024-01-15 2024-02-20 甘肃海亮新能源材料有限公司 钛阳极和电解铜箔的生产设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864224A (en) * 1971-04-28 1975-02-04 Imp Metal Ind Hynoch Limited Preparation of oxides
US4605478A (en) * 1984-07-03 1986-08-12 Ppg Industries, Inc. Cationic electrodepositable compositions containing formaldehyde scavenger
US20040099535A1 (en) * 2000-05-06 2004-05-27 Mattias Schweinsberg Electrochemically produced layers for providing corrosion protection or wash primers

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
GB2298870B (en) * 1995-03-13 1998-09-30 British Steel Plc Passivation treatment of tinplate
JP3573574B2 (ja) * 1996-07-01 2004-10-06 日本パーカライジング株式会社 酸化チタン被覆金属材料の製造方法
JP3867374B2 (ja) * 1997-11-25 2007-01-10 株式会社村田製作所 チタン酸化物被膜作製用水溶液、およびチタン酸化物被膜の製造方法
EP1548157A1 (fr) * 2003-12-22 2005-06-29 Henkel KGaA Protection contre la corrosion par des couches d'oxide de métal électrochimiquement déposées sur des substrats métalliques

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864224A (en) * 1971-04-28 1975-02-04 Imp Metal Ind Hynoch Limited Preparation of oxides
US4605478A (en) * 1984-07-03 1986-08-12 Ppg Industries, Inc. Cationic electrodepositable compositions containing formaldehyde scavenger
US20040099535A1 (en) * 2000-05-06 2004-05-27 Mattias Schweinsberg Electrochemically produced layers for providing corrosion protection or wash primers

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110062030A1 (en) * 2009-09-17 2011-03-17 Lippert Lothar Electrolyte composition
DE102009029558A1 (de) * 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
US20120019476A1 (en) * 2010-07-26 2012-01-26 Samsung Electro-Mechanics Co., Ltd. Capacitive touch panel
WO2013188156A1 (fr) * 2012-06-12 2013-12-19 Flipchip International, Llc Procédé d'application d'une couche métallique finale pour conditionnement sur tranche et dispositif associé
US8980743B2 (en) 2012-06-12 2015-03-17 Flipchip International Llc Method for applying a final metal layer for wafer level packaging and associated device
US9859038B2 (en) 2012-08-10 2018-01-02 General Cable Technologies Corporation Surface modified overhead conductor
US10586633B2 (en) 2012-08-10 2020-03-10 General Cable Technologies Corporation Surface modified overhead conductor
US10957468B2 (en) 2013-02-26 2021-03-23 General Cable Technologies Corporation Coated overhead conductors and methods
US10246791B2 (en) 2014-09-23 2019-04-02 General Cable Technologies Corporation Electrodeposition mediums for formation of protective coatings electrochemically deposited on metal substrates
US10726975B2 (en) 2015-07-21 2020-07-28 General Cable Technologies Corporation Electrical accessories for power transmission systems and methods for preparing such electrical accessories
CN106757249A (zh) * 2016-12-15 2017-05-31 河海大学常州校区 一种阴极表面纳秒脉冲电场制备纳米薄膜的溶液及制备方法
CN117568878A (zh) * 2024-01-15 2024-02-20 甘肃海亮新能源材料有限公司 钛阳极和电解铜箔的生产设备

Also Published As

Publication number Publication date
EP1893791A2 (fr) 2008-03-05
WO2006136333A3 (fr) 2007-08-16
WO2006136333A2 (fr) 2006-12-28

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