US20080137317A1 - Method and system for angled rf connection using a flexible substrate - Google Patents
Method and system for angled rf connection using a flexible substrate Download PDFInfo
- Publication number
- US20080137317A1 US20080137317A1 US11/609,806 US60980606A US2008137317A1 US 20080137317 A1 US20080137317 A1 US 20080137317A1 US 60980606 A US60980606 A US 60980606A US 2008137317 A1 US2008137317 A1 US 2008137317A1
- Authority
- US
- United States
- Prior art keywords
- flexible substrate
- bonding pad
- tab
- angled
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09318—Core having one signal plane and one power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Definitions
- This disclosure is directed to printed wiring boards and more particularly, to an angled RE connection using a flexible substrate.
- Each module in general, includes a distribution network, a chip carrier, and a radiator.
- High frequency RF signals from a vertically oriented chip set are connected to a horizontally oriented radiator board, also referred to as an Antenna Integrated Printed Wiring Board (AIPWB). Reduction of radiated power during transmit operation and an increase of noise during receive operation are directly proportional to losses caused by this connection.
- Traditional designs use manually formed wirebonds for connecting these vertical and horizontal assemblies
- a method for producing an angled RF connection between a first element and a second element using a flexible substrate includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element.
- a structure for an angled RF connection includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
- FIG. 1 shows a conventional connection between an AIPWB and a chip carrier
- FIGS. 2A and 2B show a top view and a cross sectional view, respectively, of a printed circuit board, according to an embodiment
- FIG. 3 shows an angled connection between an AIPWB to a chip carrier, according to an embodiment
- FIG. 4A shows a unit cell of a microwave antenna using an AIPWB and chip carrier interface, according to an embodiment
- FIG. 4B shows details of a connection between an AIPWB and chip carrier interface, according to an embodiment
- FIG. 5 is a flowchart showing a method of producing a connection between an AIPWB and a chip carrier; according to an embodiment.
- FIGS. 6A and 6B graphically illustrate simulated performance of an angled interconnect, according to an embodiment.
- a “rigid-flexible printed circuit board” or “rigid-flex printed circuit board” is a multi layer interconnect medium where some parts of a circuit board are rigid and other parts maintain some level of flexibility.
- the term “flex” as used throughout this disclosure means flexible.
- a “stackup” is an arrangement where various layers are stacked to form a multi-layer printed circuit board.
- Wire bonding is a method of making interconnections between two electronic components using a thin round or flattened gold, copper or aluminum wire.
- FIG. 1 shows a conventional interconnect configuration 100 connecting chip carrier 112 with AIPWB 102 via bondwire 108 .
- Bondwire 108 is drawn so that it has enough length to connect AIPWB 102 and chip carrier 112 .
- Bondwire 108 is attached to layer 110 of chip carrier 112 via bonding-pad 106 and connection 114 .
- the 90 degree RF connection is established when bondwire 108 is connected to AIPWB 102 using conductive epoxy 104 .
- Plural wirebonds are created for a module, for example, 80 wirebonds per module may be created. Wires are manipulated manually and the conductive epoxy is also applied manually. The manual process steps are tedious and can be very expensive.
- FIGS. 2A and 2B show a rigid-flex AIPWB 200 , in accordance with an embodiment of the present disclosure.
- Rigid-flex AIPWB 200 includes an AIPWB structure 102 and a flexible (“Flex”) substrate 218 .
- Flex substrate 218 is laminated on AIPWB 102 as an outer layer.
- Flex substrate 218 may include a micro-strip construction; which typically includes a signal trace 204 , and a single ground plane 206 , separated by a low-loss dielectric material 202 .
- Dielectric material 202 functions as an insulating interposer.
- Flex substrate 218 is pre-routed along a cutout 210 to define a tab 212 .
- Prepreg 214 is pre-routed to create a void area 216 under tab 212 to allow the tab to be formed at a desired angle.
- Tab 212 includes signal trace 204 .
- Signal trace 212 is connected to an internal signal trace (not shown) of AIPWB 102 by metal-plated via 208 .
- Signal trace 212 includes bonding-pad 220 whose function is described below with respect to FIG. 3 .
- FIG. 3 shows an assembly 300 with an angled RF connection between rigid-flex AIPWB 200 and chip carrier 112 , in accordance with an embodiment of the present disclosure.
- Tab 212 is formed at an angle, for example, 90 degrees.
- Tab 212 provides a flexible link between rigid-flex AIPWB 200 and chip carrier 112 .
- wire bond pad 306 on chip carrier 212 Due to the flexible structure of tab 212 , wire bond pad 306 on chip carrier 212 , and wire bond pad 220 on tab 212 , are in close proximity and on the same plane. This allows one to use an automated wire bonder to create bond 114 on chip carrier 112 , and bond 302 on tab 212 , respectively. Bondwire 304 is short and tightly controlled, which minimizes signal degradation.
- Assembly 300 provides an impedance controlled signal environment, since trace 204 and ground plane 206 form a micro-strip, which keeps the impedance controlled throughout the length of the transition.
- ground plane 206 may be connected to chip carrier 212 by conductive epoxy 308 .
- FIGS. 4A and 4B show a three-dimensional assembly 400 of an embodiment of the present disclosure.
- Assembly 400 includes a radiator cell for a microwave antenna assembly.
- Each actual microwave antenna assembly (not shown) has between 8 and 16 of these unit cells on a single board.
- Assembly 400 is constructed using rigid-flex AIPWB 200 .
- FIG. 4B shows a close up view of a 90 degree angled connection.
- Tab 212 has two signal traces 402 , which are connected to chip carrier 112 with bond wires 304 , the close proximity of wire bonding pads 302 and 114 allows the use of short bond wires 304 .
- the illustrated configuration was used as a model, to simulate electrical performance of the angled interconnect, as described below.
- FIG. 5 shows a process flow diagram of method 500 for producing an angled RF connection between two elements using a flexible substrate, according to one embodiment.
- step S 502 when flexible substrate 202 is obtained.
- Various flexible substrates may be used, for example, Rogers R/flex 3600 or 3850 LDP laminate.
- step S 504 flexible substrate 202 and Prepreg 216 are pre-routed with the proper pattern 210 that will form tab 212 .
- step S 506 flexible substrate 202 is laminated on to AIPWB 102 using Prepreg 216 .
- step S 508 an outside metal layer of flex substrate 202 is etched, via holes 208 are drilled and plated, creating rigid-flex AIPWB 200 .
- step S 510 tabs 212 are formed to 90 degree, by lifting and bending it away from a surface of rigid-flex AIPWB 200 , whereby providing a favorable wire bonding configuration.
- step S 512 chip carrier 112 is attached to a rigid portion of rigid-flex AIPWB 200 , using epoxy or some other means.
- step S 514 chip carrier 112 is wirebonded to rigid-flex AIPWB 200 .
- This approach is advantageous because it allows the use of COTS automatic wire bonding machines, which produce well-controlled, uniform, and reliable bonds.
- FIG. 6A shows favorable simulation results, where return loss 604 at 30 GHz is ⁇ 25 dB, probe isolation 606 and cross-polarization 608 , are less than ⁇ 20 dB at 30 GHz, while insertion loss 602 is ⁇ 0.3 dB.
- FIG. 6B shows normalized impedance of rigid-flex AIPWB 200 .
- Trace 610 shows that 50 Ohm input impedance is closely maintained for various frequencies.
- the present disclosure provides solutions for numerous communication and radar phased array industry applications.
- the foregoing approach reduces assembly time. By providing impedance controlled signal environment throughout a signal propagation path, higher operating frequencies can be achieved.
Abstract
Description
- None
- 1. Field of the Invention
- This disclosure is directed to printed wiring boards and more particularly, to an angled RE connection using a flexible substrate.
- 2. Related Art
- Many high-density, high performance electronic systems use a three-dimensional packaging architecture. Many current phased array architectures utilize this three dimensional packaging concept, where the modules are vertically oriented to allow proper lattice spacing for a given frequency. Each module, in general, includes a distribution network, a chip carrier, and a radiator.
- High frequency RF signals from a vertically oriented chip set are connected to a horizontally oriented radiator board, also referred to as an Antenna Integrated Printed Wiring Board (AIPWB). Reduction of radiated power during transmit operation and an increase of noise during receive operation are directly proportional to losses caused by this connection. Traditional designs use manually formed wirebonds for connecting these vertical and horizontal assemblies
- Manual wire bonding is typically used because Commercial Off-the-Shelf (COTS) wirebonders cannot produce bonds having bonding pads in different, angled planes with limited access. This manual approach is tedious, consuming assembly time, often requiring manual repairs (touch-up) to produce an acceptable connection, and does not produce a consistently performing RF connection.
- Therefore, a structure and method are needed that support an angled RF interconnection between two elements without expensive manual wire bonding, while preserving or enhancing design integrity.
- In one aspect, a method for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element.
- In another aspect, a structure for an angled RF connection is provided. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
- This brief summary has been provided so that the nature of the invention may be understood quickly. A more complete understanding of the invention may be obtained by reference to the following detailed description of embodiments thereof in connection with the attached drawings.
- The foregoing and other features of the embodiments will now be described with reference to the drawings. In the drawings, the same components have the same reference numerals. The illustrated embodiment is intended to illustrate, the adaptive aspects of the present disclosure. The drawings include the following Figures:
-
FIG. 1 shows a conventional connection between an AIPWB and a chip carrier; -
FIGS. 2A and 2B show a top view and a cross sectional view, respectively, of a printed circuit board, according to an embodiment; -
FIG. 3 shows an angled connection between an AIPWB to a chip carrier, according to an embodiment; -
FIG. 4A shows a unit cell of a microwave antenna using an AIPWB and chip carrier interface, according to an embodiment; -
FIG. 4B shows details of a connection between an AIPWB and chip carrier interface, according to an embodiment; -
FIG. 5 is a flowchart showing a method of producing a connection between an AIPWB and a chip carrier; according to an embodiment; and -
FIGS. 6A and 6B graphically illustrate simulated performance of an angled interconnect, according to an embodiment. - The following definitions are provided as they are typically (but not exclusively) used in relation to printed wiring board technology, referred to by various aspects of the present disclosure.
- A “rigid-flexible printed circuit board” or “rigid-flex printed circuit board” is a multi layer interconnect medium where some parts of a circuit board are rigid and other parts maintain some level of flexibility. The term “flex” as used throughout this disclosure means flexible.
- A “stackup” is an arrangement where various layers are stacked to form a multi-layer printed circuit board.
- “Wire bonding” is a method of making interconnections between two electronic components using a thin round or flattened gold, copper or aluminum wire.
- To facilitate an understanding of the preferred embodiment, the general structure and process of making interconnects will be described. The specific structure and process will then be described with reference to the general structure and process.
- Conventional processes use a multi-step manual process to produce an angled RF connection. Manual wire bonding is used, because assemblies are not in the same plane and physical access to the assemblies is limited.
-
FIG. 1 shows aconventional interconnect configuration 100 connectingchip carrier 112 with AIPWB 102 via bondwire 108. Bondwire 108 is drawn so that it has enough length to connect AIPWB 102 andchip carrier 112. Bondwire 108 is attached tolayer 110 ofchip carrier 112 via bonding-pad 106 andconnection 114. - The 90 degree RF connection is established when
bondwire 108 is connected to AIPWB 102 usingconductive epoxy 104. Plural wirebonds are created for a module, for example, 80 wirebonds per module may be created. Wires are manipulated manually and the conductive epoxy is also applied manually. The manual process steps are tedious and can be very expensive. -
FIGS. 2A and 2B show a rigid-flex AIPWB 200, in accordance with an embodiment of the present disclosure. Rigid-flex AIPWB 200 includes anAIPWB structure 102 and a flexible (“Flex”)substrate 218.Flex substrate 218 is laminated on AIPWB 102 as an outer layer.Flex substrate 218 may include a micro-strip construction; which typically includes asignal trace 204, and asingle ground plane 206, separated by a low-lossdielectric material 202.Dielectric material 202 functions as an insulating interposer. -
Flex substrate 218 is pre-routed along acutout 210 to define atab 212.Prepreg 214 is pre-routed to create avoid area 216 undertab 212 to allow the tab to be formed at a desired angle.Tab 212 includessignal trace 204.Signal trace 212 is connected to an internal signal trace (not shown) ofAIPWB 102 by metal-plated via 208.Signal trace 212 includes bonding-pad 220 whose function is described below with respect toFIG. 3 . -
FIG. 3 shows anassembly 300 with an angled RF connection between rigid-flex AIPWB 200 andchip carrier 112, in accordance with an embodiment of the present disclosure.Tab 212 is formed at an angle, for example, 90 degrees.Tab 212 provides a flexible link between rigid-flex AIPWB 200 andchip carrier 112. - Due to the flexible structure of
tab 212,wire bond pad 306 onchip carrier 212, andwire bond pad 220 ontab 212, are in close proximity and on the same plane. This allows one to use an automated wire bonder to createbond 114 onchip carrier 112, andbond 302 ontab 212, respectively.Bondwire 304 is short and tightly controlled, which minimizes signal degradation. -
Assembly 300 provides an impedance controlled signal environment, sincetrace 204 andground plane 206 form a micro-strip, which keeps the impedance controlled throughout the length of the transition. During the assembly process,ground plane 206 may be connected tochip carrier 212 byconductive epoxy 308. -
FIGS. 4A and 4B show a three-dimensional assembly 400 of an embodiment of the present disclosure.Assembly 400 includes a radiator cell for a microwave antenna assembly. Each actual microwave antenna assembly (not shown) has between 8 and 16 of these unit cells on a single board.Assembly 400 is constructed using rigid-flex AIPWB 200. -
FIG. 4B shows a close up view of a 90 degree angled connection.Tab 212 has two signal traces 402, which are connected to chipcarrier 112 withbond wires 304, the close proximity ofwire bonding pads short bond wires 304. The illustrated configuration was used as a model, to simulate electrical performance of the angled interconnect, as described below. -
FIG. 5 shows a process flow diagram ofmethod 500 for producing an angled RF connection between two elements using a flexible substrate, according to one embodiment. - The process starts in step S502, when
flexible substrate 202 is obtained. Various flexible substrates may be used, for example, Rogers R/flex 3600 or 3850 LDP laminate. - In step S504,
flexible substrate 202 andPrepreg 216 are pre-routed with theproper pattern 210 that will formtab 212. - In step S506,
flexible substrate 202 is laminated on to AIPWB 102 usingPrepreg 216. - In step S508, an outside metal layer of
flex substrate 202 is etched, viaholes 208 are drilled and plated, creating rigid-flex AIPWB 200. - In step S510,
tabs 212 are formed to 90 degree, by lifting and bending it away from a surface of rigid-flex AIPWB 200, whereby providing a favorable wire bonding configuration. - In step S512,
chip carrier 112 is attached to a rigid portion of rigid-flex AIPWB 200, using epoxy or some other means. - Thereafter, in step S514,
chip carrier 112 is wirebonded to rigid-flex AIPWB 200. - This approach is advantageous because it allows the use of COTS automatic wire bonding machines, which produce well-controlled, uniform, and reliable bonds.
-
Simulation using assembly 400 was performed using Ansoft's High Frequency Simulation Software Suite. Ansoft's High Frequency Simulation is a commercially available simulation tool for RF and microwave applications. The simulations covered both Ka band (30 GHz) and Q band 44 GHz) frequencies.FIG. 6A shows favorable simulation results, wherereturn loss 604 at 30 GHz is −25 dB,probe isolation 606 andcross-polarization 608, are less than −20 dB at 30 GHz, whileinsertion loss 602 is −0.3 dB. -
FIG. 6B shows normalized impedance of rigid-flex AIPWB 200.Trace 610 shows that 50 Ohm input impedance is closely maintained for various frequencies. - In one aspect, the present disclosure provides solutions for numerous communication and radar phased array industry applications. The foregoing approach reduces assembly time. By providing impedance controlled signal environment throughout a signal propagation path, higher operating frequencies can be achieved.
- Although the present disclosure has been described with reference to specific embodiments, these embodiments are illustrative only and not limiting. Many other applications and embodiments of the present disclosure will be apparent in light of this disclosure and the following claims.
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/609,806 US7388756B1 (en) | 2006-12-12 | 2006-12-12 | Method and system for angled RF connection using a flexible substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/609,806 US7388756B1 (en) | 2006-12-12 | 2006-12-12 | Method and system for angled RF connection using a flexible substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080137317A1 true US20080137317A1 (en) | 2008-06-12 |
US7388756B1 US7388756B1 (en) | 2008-06-17 |
Family
ID=39497751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/609,806 Active US7388756B1 (en) | 2006-12-12 | 2006-12-12 | Method and system for angled RF connection using a flexible substrate |
Country Status (1)
Country | Link |
---|---|
US (1) | US7388756B1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009150133A1 (en) * | 2008-06-13 | 2009-12-17 | Epcos Ag | Circuit board with a flexible region and method for production thereof |
US20100157562A1 (en) * | 2008-12-19 | 2010-06-24 | Honeywell International Inc. | Systems and methods for affixing a silicon device to a support structure |
US20110199473A1 (en) * | 2010-02-15 | 2011-08-18 | Olympus Corporation | Semiconductor apparatus and endoscope apparatus |
CN103796416A (en) * | 2012-10-31 | 2014-05-14 | 富葵精密组件(深圳)有限公司 | Circuit board combining flexible board with hard board and method for manufacturing same |
WO2014139506A1 (en) * | 2013-03-15 | 2014-09-18 | Würth Elektronik GmbH & Co. KG | Flexirigid circuit board |
TWI673510B (en) * | 2018-07-17 | 2019-10-01 | 昇雷科技股份有限公司 | Doppler radar with bondwire interconnection structure |
WO2020157314A1 (en) * | 2019-01-31 | 2020-08-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Support assembly and method for producing a support assembly |
EP4191309A4 (en) * | 2020-08-31 | 2024-04-17 | Huawei Tech Co Ltd | Optoelectronic apparatus and optoelectronic integration method |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100659826B1 (en) * | 2005-12-20 | 2006-12-19 | 삼성에스디아이 주식회사 | Circuit board of battery pack |
US7982684B2 (en) | 2006-12-06 | 2011-07-19 | The Boeing Company | Method and structure for RF antenna module |
US7444737B2 (en) * | 2006-12-07 | 2008-11-04 | The Boeing Company | Method for manufacturing an antenna |
US7690107B2 (en) * | 2007-06-15 | 2010-04-06 | The Boeing Company | Method for aligning and installing flexible circuit interconnects |
US7868830B2 (en) * | 2008-05-13 | 2011-01-11 | The Boeing Company | Dual beam dual selectable polarization antenna |
JP5488024B2 (en) * | 2010-02-17 | 2014-05-14 | ミツミ電機株式会社 | AC adapter |
KR101301425B1 (en) * | 2011-10-25 | 2013-08-28 | 삼성전기주식회사 | Multi-apparatus for wireless charging and manufacturing method thereof |
US9160183B2 (en) * | 2012-06-27 | 2015-10-13 | Bren-Tronics, Inc. | Foldable battery charger |
US9178361B2 (en) * | 2012-09-27 | 2015-11-03 | ConvenientPower, Ltd. | Methods and systems for detecting foreign objects in a wireless charging system |
US9078352B2 (en) * | 2012-10-29 | 2015-07-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Low inductance flex bond with low thermal resistance |
US10476148B2 (en) | 2017-06-07 | 2019-11-12 | The Boeing Company | Antenna integrated printed wiring board (AiPWB) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5557142A (en) * | 1991-02-04 | 1996-09-17 | Motorola, Inc. | Shielded semiconductor device package |
US6201689B1 (en) * | 1997-12-05 | 2001-03-13 | Olympus Optical Co., Ltd. | Electronic appliance |
US20020053735A1 (en) * | 2000-09-19 | 2002-05-09 | Neuhaus Herbert J. | Method for assembling components and antennae in radio frequency identification devices |
US6950314B2 (en) * | 2004-02-27 | 2005-09-27 | Infineon Technologies Ag | Arrangement for the electrical connection of an optoelectronic component to an electrical component |
US20060237537A1 (en) * | 2002-09-30 | 2006-10-26 | Nanosys, Inc. | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
-
2006
- 2006-12-12 US US11/609,806 patent/US7388756B1/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5688584A (en) * | 1988-06-10 | 1997-11-18 | Sheldahl, Inc. | Multilayer electronic circuit having a conductive adhesive |
US5557142A (en) * | 1991-02-04 | 1996-09-17 | Motorola, Inc. | Shielded semiconductor device package |
US6201689B1 (en) * | 1997-12-05 | 2001-03-13 | Olympus Optical Co., Ltd. | Electronic appliance |
US20020053735A1 (en) * | 2000-09-19 | 2002-05-09 | Neuhaus Herbert J. | Method for assembling components and antennae in radio frequency identification devices |
US20060237537A1 (en) * | 2002-09-30 | 2006-10-26 | Nanosys, Inc. | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
US6950314B2 (en) * | 2004-02-27 | 2005-09-27 | Infineon Technologies Ag | Arrangement for the electrical connection of an optoelectronic component to an electrical component |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9035189B2 (en) | 2008-06-13 | 2015-05-19 | Epcos Ac | Circuit board with flexible region and method for production thereof |
US20110214905A1 (en) * | 2008-06-13 | 2011-09-08 | Epcos Ag | Circuit Board with Flexible Region and Method for Production Thereof |
WO2009150133A1 (en) * | 2008-06-13 | 2009-12-17 | Epcos Ag | Circuit board with a flexible region and method for production thereof |
US20100157562A1 (en) * | 2008-12-19 | 2010-06-24 | Honeywell International Inc. | Systems and methods for affixing a silicon device to a support structure |
US8257119B2 (en) * | 2008-12-19 | 2012-09-04 | Honeywell International | Systems and methods for affixing a silicon device to a support structure |
US20110199473A1 (en) * | 2010-02-15 | 2011-08-18 | Olympus Corporation | Semiconductor apparatus and endoscope apparatus |
US8471392B2 (en) * | 2010-02-15 | 2013-06-25 | Olympus Corporation | Semiconductor apparatus and endoscope apparatus |
CN103796416A (en) * | 2012-10-31 | 2014-05-14 | 富葵精密组件(深圳)有限公司 | Circuit board combining flexible board with hard board and method for manufacturing same |
WO2014139506A1 (en) * | 2013-03-15 | 2014-09-18 | Würth Elektronik GmbH & Co. KG | Flexirigid circuit board |
TWI673510B (en) * | 2018-07-17 | 2019-10-01 | 昇雷科技股份有限公司 | Doppler radar with bondwire interconnection structure |
US11156695B2 (en) | 2018-07-17 | 2021-10-26 | Sil Radar Technology Inc. | Doppler radar sensor with bondwire interconnection |
WO2020157314A1 (en) * | 2019-01-31 | 2020-08-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Support assembly and method for producing a support assembly |
CN113615324A (en) * | 2019-01-31 | 2021-11-05 | 弗劳恩霍夫应用研究促进协会 | Carrier arrangement and method for producing a carrier arrangement |
US20220095450A1 (en) * | 2019-01-31 | 2022-03-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Carrier arrangement and method for producing a carrier arrangement |
EP4191309A4 (en) * | 2020-08-31 | 2024-04-17 | Huawei Tech Co Ltd | Optoelectronic apparatus and optoelectronic integration method |
Also Published As
Publication number | Publication date |
---|---|
US7388756B1 (en) | 2008-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7388756B1 (en) | Method and system for angled RF connection using a flexible substrate | |
EP2224794B1 (en) | Printed circuit board, manufacturing method and radio-frequency apparatus thereof | |
KR101397748B1 (en) | Radio frequency(rf) integated circuit(ic) packages with integrated aperture-coupled patch antenna(s) | |
US7471175B2 (en) | Planar mixed-signal circuit board | |
US4859806A (en) | Discretionary interconnect | |
US6911733B2 (en) | Semiconductor device and electronic device | |
KR20180133784A (en) | Antenna Integrated Printed Wiring Board (AiPWB) | |
CN108028249A (en) | Antenna-integrated communication module and its manufacture method | |
US9899341B2 (en) | Antenna on integrated circuit package | |
US9538636B1 (en) | Blind via edge castellation | |
JPH11177247A (en) | Wiring board | |
JP2010219364A (en) | Method of modifying printed wiring board, and modified printed wiring board | |
JP3998562B2 (en) | Semiconductor device | |
JP2007235149A (en) | Semiconductor device and electronic device | |
CN107484339A (en) | A kind of earthed circuit implementation method for improving microwave multi-layer boards matching properties | |
JP4099072B2 (en) | Built-in module | |
KR101434114B1 (en) | Transmitting/receiving circuit module | |
JP2019016929A (en) | Multilayer Substrate Array Antenna | |
US20230395968A1 (en) | A multi-layered structure having antipad formations | |
CN102714927B (en) | A microwave unit and method therefore | |
US20140111292A1 (en) | Module and Coupling Arrangement | |
JP2006269627A (en) | Via structure for printed wiring board | |
WO2023146447A1 (en) | An array antenna formed by subarray antennas | |
CN116990760A (en) | On-chip antenna impedance matching method and radar system | |
JP2010161416A (en) | Electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: THE BOEING COMPANY, ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WORL, ROBERT T.;BLASER, BRUCE L.;HEISEN, PETER T.;AND OTHERS;REEL/FRAME:018622/0112;SIGNING DATES FROM 20061204 TO 20061211 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 12 |