US20080070054A1 - Set of resin compositions for preparing system-in-package type semiconductor device - Google Patents
Set of resin compositions for preparing system-in-package type semiconductor device Download PDFInfo
- Publication number
- US20080070054A1 US20080070054A1 US11/898,615 US89861507A US2008070054A1 US 20080070054 A1 US20080070054 A1 US 20080070054A1 US 89861507 A US89861507 A US 89861507A US 2008070054 A1 US2008070054 A1 US 2008070054A1
- Authority
- US
- United States
- Prior art keywords
- composition
- underfill
- resin
- cured product
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 239000011342 resin composition Substances 0.000 title claims abstract description 38
- 239000000203 mixture Substances 0.000 claims abstract description 111
- 238000005538 encapsulation Methods 0.000 claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 230000009477 glass transition Effects 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 82
- 239000003822 epoxy resin Substances 0.000 claims description 79
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 34
- 239000003795 chemical substances by application Substances 0.000 claims description 32
- 239000011256 inorganic filler Substances 0.000 claims description 31
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 27
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- 239000005011 phenolic resin Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- 229920001568 phenolic resin Polymers 0.000 claims description 24
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 22
- 239000004305 biphenyl Substances 0.000 claims description 15
- 235000010290 biphenyl Nutrition 0.000 claims description 15
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- -1 triphenyl phenolic resin Chemical compound 0.000 claims description 11
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 238000004200 deflagration Methods 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- 150000002430 hydrocarbons Chemical group 0.000 claims description 7
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 5
- 125000000524 functional group Chemical group 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000003980 solgel method Methods 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 239000000047 product Substances 0.000 description 43
- 101150091203 Acot1 gene Proteins 0.000 description 28
- 102100025854 Acyl-coenzyme A thioesterase 1 Human genes 0.000 description 28
- 238000012360 testing method Methods 0.000 description 15
- 230000035939 shock Effects 0.000 description 12
- 239000006087 Silane Coupling Agent Substances 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- 239000005350 fused silica glass Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 150000004982 aromatic amines Chemical class 0.000 description 5
- 229940106691 bisphenol a Drugs 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- 0 CN.[1*]C1=C(N)C([2*])=CC(CC2=CC([4*])=C(N)C([3*])=C2)=C1.[1*]C1=C(N)C([2*])=CC(SC2=CC([4*])=C(N)C([3*])=C2)=C1.[1*]C1=C(N)C([2*])=CC(SO(O)C2=CC([4*])=C(N)C([3*])=C2)=C1.[1*]C1=C(N)C([2*])=CC([3*])=C1 Chemical compound CN.[1*]C1=C(N)C([2*])=CC(CC2=CC([4*])=C(N)C([3*])=C2)=C1.[1*]C1=C(N)C([2*])=CC(SC2=CC([4*])=C(N)C([3*])=C2)=C1.[1*]C1=C(N)C([2*])=CC(SO(O)C2=CC([4*])=C(N)C([3*])=C2)=C1.[1*]C1=C(N)C([2*])=CC([3*])=C1 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 3
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- WGCKYCGUJYPRCV-UHFFFAOYSA-N 4,5-dimethyl-7-(2-methylprop-1-enyl)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound CC(C)=CC1C=C(C)C(C)C2C(=O)OC(=O)C12 WGCKYCGUJYPRCV-UHFFFAOYSA-N 0.000 description 3
- IWDCLRJOBJJRNH-UHFFFAOYSA-N CC1=CC=C(O)C=C1 Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 230000000930 thermomechanical effect Effects 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- GQVMHMFBVWSSPF-SOYUKNQTSA-N (4E,6E)-2,6-dimethylocta-2,4,6-triene Chemical compound C\C=C(/C)\C=C\C=C(C)C GQVMHMFBVWSSPF-SOYUKNQTSA-N 0.000 description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- ADJYZMBPOFTWNP-UHFFFAOYSA-N C1=CC(N(CC2CO2)CC2CO2)=CC=C1OCC1CO1.C1=CC(OCC2CO2)=CC(OCC2CO2)=C1.C1=CC=C(OCC2CO2)C=C1.COCC1CO1.C[Rn] Chemical compound C1=CC(N(CC2CO2)CC2CO2)=CC=C1OCC1CO1.C1=CC(OCC2CO2)=CC(OCC2CO2)=C1.C1=CC=C(OCC2CO2)C=C1.COCC1CO1.C[Rn] ADJYZMBPOFTWNP-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N CC1=CC=C(C)C=C1 Chemical compound CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Natural products CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000005998 bromoethyl group Chemical group 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- GQVMHMFBVWSSPF-UHFFFAOYSA-N cis-alloocimene Natural products CC=C(C)C=CC=C(C)C GQVMHMFBVWSSPF-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003921 particle size analysis Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 2
- 235000021286 stilbenes Nutrition 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IHPKGUQCSIINRJ-UHFFFAOYSA-N β-ocimene Natural products CC(C)=CCC=C(C)C=C IHPKGUQCSIINRJ-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N 1H-imidazole Chemical compound C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- OJVQNVMHJWSOSY-UHFFFAOYSA-N 3-methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(O)=O)(C)C2C(O)=O OJVQNVMHJWSOSY-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- KLAJHXCYFZTHGE-UHFFFAOYSA-N 6-[4-[[3,4-bis[(4,7,7-trimethyl-6-bicyclo[4.1.0]heptanyl)oxy]phenyl]methyl]-2-[(4,7,7-trimethyl-6-bicyclo[4.1.0]heptanyl)oxy]phenoxy]-4,7,7-trimethylbicyclo[4.1.0]heptane Chemical compound C1C(C)CCC2C(C)(C)C21OC1=CC(CC=2C=C(OC34C(CCC(C)C3)C4(C)C)C(OC34C(CCC(C)C3)C4(C)C)=CC=2)=CC=C1OC12C(C)(C)C1CCC(C)C2 KLAJHXCYFZTHGE-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N C1=CC(N(CC2CO2)CC2CO2)=CC=C1OCC1CO1 Chemical compound C1=CC(N(CC2CO2)CC2CO2)=CC=C1OCC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N C1=CC(OCC2CO2)=CC=C1CC1=CC=C(OCC2CO2)C=C1 Chemical compound C1=CC(OCC2CO2)=CC=C1CC1=CC=C(OCC2CO2)C=C1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- ZLVSYRYBKNZKEE-UHFFFAOYSA-N C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.CC1=CC=CC(C)=C1OCC1CO1.CC1=CC=CC(C)=C1OCC1CO1.CC1=CC=CC(C)=C1OCC1CO1.CC1=CC=CC=C1OCC1CO1.CC1=CC=CC=C1OCC1CO1.CC1=CC=CC=C1OCC1CO1.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1 Chemical compound C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.CC1=CC=CC(C)=C1OCC1CO1.CC1=CC=CC(C)=C1OCC1CO1.CC1=CC=CC(C)=C1OCC1CO1.CC1=CC=CC=C1OCC1CO1.CC1=CC=CC=C1OCC1CO1.CC1=CC=CC=C1OCC1CO1.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1 ZLVSYRYBKNZKEE-UHFFFAOYSA-N 0.000 description 1
- GNTVJMJCBJRYAF-UHFFFAOYSA-N C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.CC.CC.CC.CC.CC.CC.CC.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1 Chemical compound C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.C1=CC=C(OCC2CO2)C=C1.CC.CC.CC.CC.CC.CC.CC.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1 GNTVJMJCBJRYAF-UHFFFAOYSA-N 0.000 description 1
- OMQVBFGXGNYKCW-UHFFFAOYSA-N CC(C)=CC1C=C(C)C(C)C2C(=O)OC(=O)C12.CC(C)C12C=CC(C)(CC1)C1C(=O)OC(=O)C12 Chemical compound CC(C)=CC1C=C(C)C(C)C2C(=O)OC(=O)C12.CC(C)C12C=CC(C)(CC1)C1C(=O)OC(=O)C12 OMQVBFGXGNYKCW-UHFFFAOYSA-N 0.000 description 1
- DWGQSOBLNCFVEU-UHFFFAOYSA-N CC.CC.CC.CC.CC.CC.CC.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1 Chemical compound CC.CC.CC.CC.CC.CC.CC.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1 DWGQSOBLNCFVEU-UHFFFAOYSA-N 0.000 description 1
- SZWIFXVHDPTSGM-UHFFFAOYSA-N CC1=CC=CC(C)=C1O.CC1=CC=CC(C)=C1O.CC1=CC=CC(C)=C1O.CC1=CC=CC=C1O.CC1=CC=CC=C1O.CC1=CC=CC=C1O.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1 Chemical compound CC1=CC=CC(C)=C1O.CC1=CC=CC(C)=C1O.CC1=CC=CC(C)=C1O.CC1=CC=CC=C1O.CC1=CC=CC=C1O.CC1=CC=CC=C1O.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=C(C)C=C(C2=CC(C)=C(CC)C(C)=C2)C=C1C.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1 SZWIFXVHDPTSGM-UHFFFAOYSA-N 0.000 description 1
- TZXDMIVZAMDOJR-UHFFFAOYSA-N CC1=CC=CC=C1.CC1=CC=CC=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.[H]C Chemical compound CC1=CC=CC=C1.CC1=CC=CC=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.[H]C TZXDMIVZAMDOJR-UHFFFAOYSA-N 0.000 description 1
- SCYVMVXKYHMXKS-UHFFFAOYSA-N CC1CCC2C(=O)OC(=O)C2C1.O=C1OC(=O)C2CCCCC12.[HH].[HH] Chemical compound CC1CCC2C(=O)OC(=O)C2C1.O=C1OC(=O)C2CCCCC12.[HH].[HH] SCYVMVXKYHMXKS-UHFFFAOYSA-N 0.000 description 1
- OXBZHHNZYFVODV-UHFFFAOYSA-N CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1 Chemical compound CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.CCC1=CC=C(C2=CC=C(CC)C=C2)C=C1.OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC=C1 OXBZHHNZYFVODV-UHFFFAOYSA-N 0.000 description 1
- 102100037117 Mas-related G-protein coupled receptor member E Human genes 0.000 description 1
- 101150041973 Mrgpre gene Proteins 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000008394 flocculating agent Substances 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
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Definitions
- the present invention relates to resin compositions suitable for preparing a system-in-package type semiconductor device. Specifically, the present invention relates to a set of resin compositions consisting of an underfill resin composition and encapsulating resin composition. The compositions in combination provide a semiconductor device which is strongly adhered to a substrate and has a high resistance to heat and thermal shock.
- packaging of a semiconductor device is mainly performed by surface mounting method rather than pin insertion method.
- SIP system-in-packaging
- a stack type SIP is used in which at least one semiconductor chip is stacked and wire bonded on another semiconductor chip.
- FIG. 1 is a cross-sectional view of a semiconductor device, in which a semiconductor chip 3 is flip-chip bonded via solder bumps 2 on a surface of a substrate 1 provided with electronic circuits.
- the gaps between the substrate 1 and the semiconductor chip 3 i.e., spaces between the solder bumps, are filled with an underfill composition 4 .
- FIGS. 2 and 3 show cross-sectional views of system-in-package type semiconductor devices in which one or more of-semiconductor chip is placed on a semiconductor chip flip-chip bonded to the substrate 1 .
- SIP semiconductor devices are required to show no peeling or crack at an interface between an underfill part and a silicon chip or a substrate during a reflow process and a mounting process.
- the underfill part must supplement weaker adhesion of a lead-free solder than that of conventional solder.
- the Japanese Patent Application Laid-Open No. H9-176287 and H9-176294 describe resin compositions comprising a liquid epoxy resin and an alkyl-substituted aromatic amine. It is described that these compositions form cured products strongly adhered to a substrate, metal and solder resist, and give a highly reliable semiconductor package having high reflow- and thermal cycle-resistances. However, when the cured products of these resin compositions are encapsulated with a resin, they were found to crack or peel depending on the encapsulation resin used.
- An object of the present invention is therefore to provide a set of an underfill composition and an encapsulation resin composition which provides semiconductor device packages resistant to heat and thermal shock.
- the present invention is a set of compositions for preparing a system-in-package type semiconductor device, said system-in-package type semiconductor device comprising
- the set of compositions consists of an underfill composition for preparing the underfill part and an encapsulation resin composition for preparing the resin encapsulation part, wherein
- a cured product of the underfill composition has a glass transition temperature, Tg, which is 100° C. or higher and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by 20° C. or smaller,
- a total of a linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg-30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg-30)° C. is 42 ppm/° C. or smaller
- a ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.
- FIG. 1 is a cross-sectional view of an example of a flip-chip type semiconductor device
- FIG. 2 is a cross-sectional view of an example of a system-in-package type semiconductor device.
- FIG. 3 is a cross-sectional vies of another example of a system-in-package type semiconductor device.
- the limitation 1) is a relationship between a glass transition temperature, hereinafter referred to as Tg, of a curing product of the underfill composition and that of a curing product of the encapsulating resin composition.
- Tg can be determined by a known method such as the thermomechanical analysis (TMA) and Theological measurements.
- Tg of the cured product of the underfill composition is higher than 100° C., preferably higher than 120° C.
- a cured product having Tg below 100° C. may be peeled off from a substrate during a reflow process due to a lower adhesion to the substrate.
- An upper limit of Tg is practically about 200° C.
- the Tg of the cured product of the underfill composition is the same with or differs from Tg of the cured product of the encapsulating resin composition by 20° C. or smaller. If the difference between the Tg's are greater than 20° C., stresses between the underfill part and encapsulation part will be so large that an interface between both parts or between the underfill or encapsulation part and a passivation layer of a substrate may peel.
- a linear expansion coefficient can be determined by the thermomechanical analysis (TMA).
- TMA thermomechanical analysis
- a linear expansion coefficient at a temperature of (Tg-30)° C. is substantially constant at any temperature not higher than (Tg-30)° C. In the present invention, it was determined from TMA data at a temperature range of from 50 to 80° C.
- a total of linear expansion coefficients at a temperature of (Tg-30)° C. of a cured product of the underfill composition and that of a cured product of the encapsulation resin composition is 42 ppm/° C. or smaller, preferably 40 ppm/° C. or smaller. If the total exceeds 42 ppm/° C., peeling or crack may occur at an interface between an underfill part and a resin encapsulation part or between the underfill and a passivation layer.
- a ratio of the linear expansion coefficient at a temperature of (Tg-30)° C. of a cured product of the underfill composition to that of a cured product of the encapsulation resin composition ranges from 0.3 to 1.0, preferably from 0.3 to 0.9. If the ratio is outside the aforesaid range, a crack or peeling may occur between an underfill part and a resin encapsulation part.
- the underfill composition comprises
- (C) an inorganic filler in an amount of from 50 to 500 parts by weight per 100 parts by weight of the component (A).
- Preferred examples of the epoxy resin (A) used in the present invention include bisphenol type epoxy resins such as bisphenol F type epoxy resins and bisphenol A type epoxy resins; novolac type epoxy resins such as phenol novolac type epoxy resins and cresol novolac type epoxy resins; naphthalene ring-containing epoxy resins, biphenyl type epoxy resins, cyclopentadiene type epoxy resins, and a mixture of two or more of these epoxy resins.
- bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferred.
- epoxy resins represented by the following formulas are also preferred.
- R is a monovalent hydrocarbon group having 1 to 20, preferably 1 to 10, more preferably 1 to 3, carbon atoms.
- R include alkyl groups such as methyl, ethyl and propyl groups and alkenyl groups such as vinyl and allyl groups; n is an integer of from 1 to 4, particularly 1 or 2.
- the epoxy resin of the aforesaid formula (5) When the epoxy resin of the aforesaid formula (5) is used, its content in the whole epoxy resin (A) ranges from 25 to 100 wt %, preferably from 50 to 100 wt %, more preferably from 75 to 100 wt %. If it is contained in an amount less than the aforesaid lower limit, a viscosity of such a composition is undesirably high and heat resistance of a cured product may be low.
- Example of the epoxy resin of the formula (5) is the one sold under the trade name of MRGE from Nihon Kayaku Co.Ltd.
- Examples of the curing agent (B) include amine type, polymercaptane type, imidazol type, acid anhydride type and dicyanodiamide type curing agents.
- amine type and acid anhydride type curing agents are used.
- Preferred amine curing agent are represented by the following formulas (1) to (4),
- R 1 to R 4 may be the same with or different from each other and are selected from the group consisting of monovalent hydrocarbon groups having 1 to 6 carbon atoms, CH 3 S— and C 2 H 5 S—.
- Preferred examples of monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, and hexyl; alkenyl groups such as vinyl, allyl, propenyl, butenyl, and hexenyl groups; phenyl group; and halogenated groups thereof such as fluoromethyl, bromoethyl, and 3,3,3-trifluoropropyl groups, among which those having 1 to 3 carbon atoms are preferred.
- aromatic amine curing agents are mostly solid at room temperature, so that they tend to thicken the epoxy resin when they are mixed with the epoxy resin as they are. It is therefore preferred to melt-mix the amine curing agent with the epoxy resin at a temperature low enough to avoid reaction with the epoxy resin. That is, the aromatic amine curing agent is preferably melt-mixed at a temperature of from 70 to 150° C. for 1 to 2 hours with the epoxy resin. At a temperature below 70° C., the aromatic amine curing agent may not melt sufficiently, whereas at a temperature above 150° C. it tends to react with the epoxy resin to thicken the composition. A period of mixing time shorter than 1 hour may not enough to thoroughly mix the aromatic amine curing agent with epoxy resin, whereas more than 2 hours may cause reaction with the epoxy resin.
- Examples of the acid anhydride curing agent include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhimic acid anhydride, pyromellitic acid dianhydride, allo-ocimene maleate, benzophenone tetracarboxylic acid anhydride, 3,3′,4,4′-biphenyltetrabisbenzophenone tetracarboxylic acid anhydride, (3,4-dicarboxyphenyl) ether dianhydride, bis(3,4-dicaroxyphenyl)methane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid anhydride, 1-isopropyl-4-methyl-bicyclo[2.2.2]octo-5-ene
- Preferred curing agents are methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid anhydride, 1-isopropyl-4-methyl-bicyclo[2.2.2]octo-5-ene-2,3-dicaroxylic acid anhydride and a mixture thereof.
- These acid anhydrides are sold under the trade names of Rikacid MH700 from New Japan Chemical co., ltd., YH306 and YH307 both from Japan Epoxy Resin Co.
- the curing agent (B) is contained in the composition in such an amount that an equivalent ratio of its epoxy-reactive functional group to the epoxy group-of the epoxy resin (A) of from 0.7 to 1.2, preferably from 0.8 to 1.0. If it is contained less than the aforesaid lower limit, a part of the epoxy resin remains unreacted, resulting in lower glass transition temperature and smaller adhesion to a substrate. If it is contained above the aforesaid upper limit, a cured product may be so hard and brittle that it cracks in a reflow process or a heat cycle test.
- any known inorganic filler can be used.
- the inorganic filler include fused silica, crystalline silica, alumina, boron nitride, aluminum nitride, silicon nitride, magnesia, magnesium silicate, and aluminum.
- fused silica is preferred because it gives a composition having a desirable low viscosity of a composition. More preferred is fused silica prepared by sol-gel method or deflagration method.
- the inorganic filler is surface treated in advance with a coupling agent such as a silane coupling agent or titanate coupling agent to strengthen adhesion between the filler and resins.
- a coupling agent such as a silane coupling agent or titanate coupling agent to strengthen adhesion between the filler and resins.
- Preferred coupling agents are silane coupling agents, for example, epoxy silanes such as ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, and ⁇ -(3,4-epoxycyclohexyl)ethyl trimethoxysilane; aminosilanes such as N- ⁇ (aminoethyl)- ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, and N-phenyl- ⁇ -aminopropyltrimethoxysilane; and mercaptosilane such
- a particle size of the inorganic filler is preferably selected according to a gap size of a semiconductor device, i.e., a distance between a substrate and a semiconductor chip.
- a gap size of a semiconductor device i.e., a distance between a substrate and a semiconductor chip.
- an average particle size ranges from 0.1 to 5 ⁇ m, preferably from 0.5 to 2 ⁇ m because a underfill composition comprising such inorganic filler has a desired viscosity and gives a cured product having a desired linear expansion coefficient.
- a composition containing an inorganic filler having a particle size smaller than the aforesaid lower limit may have a viscosity too high to penetrate smoothly in a gap.
- an inorganic filler having a particle size larger than the aforesaid upper limit may plug the gap to cause a void in a cured product.
- the inorganic filler preferably has such a particle size distribution that a fraction of particles having a particle size of one half the gap size or larger is not more than 0.1 wt %, particularly from 0 to 0.8 wt %, of the whole particles.
- the inorganic filler has an average particle size, i.e., a median size(d 50 ), of about one-tenth of the gap size or smaller, and a maximum particle size, i.e., a particle size at 98 volume % in a cumulative particle size distribution (d 98 ), of one half the gap size of smaller.
- a particle size and its distribution can be measured by a laser diffraction method, for example.
- An amount of the inorganic filler having a particle size larger than one half the gap size can be determined by i) mixing the inorganic filler with pure water in a weight ratio of 1:9, ii) ultrasonicating the mixture to break up flocculants, iii) filtering the mixture with a sieve having a mesh size of one half the gap size, and iv) weighing a residue left on the sieve.
- 80 wt % or more, more preferably 90 to 100 wt %, most preferably 95 to 100 wt % of the inorganic filler is the spherical silica made by the sol-gel method or the deflagration method. If a ratio of the spherical silica is less than the aforesaid lower limit, a fluidity or spreadability of a composition may not be good.
- the inorganic filler (C) is contained in the underfill composition in an amount of from 50 to 500 parts by weight, preferably from 100 to 400 parts by weight, per 100 parts by weight of the epoxy resin (A).
- a composition containing the inorganic filler less than the aforesaid lower limit may give a cured product having a large linear expansion coefficient, whereas a composition containing the inorganic filler larger than the aforesaid upper limit may be too viscous to smoothly penetrate in the gap.
- the underfill composition of the present invention can contain an optional component in an amount not to adversely affect the composition.
- the optional components include resins to provide a cured composition with flexibility, for example, silicone-modified epoxy resin, silicone rubber, silicone oil, liquid polybutadiene rubber, and methyl methacrylate-butadiene-styrene copolymer; silane coupling agents; pigments such as carbon black; dyes, and antioxidants.
- the silicone-modified epoxy resin is a copolymer prepared by addition-reacting an epoxy resin or a phenolic resin having an alkenyl group with an organopolysiloxane represented by the following average compositional formula (6)
- R 5 is a substituted or unsubstituted monovalent hydrocarbon group
- a is a number of from 0.01 to 0.1
- b is a number of from 1.8 to 2.2 with a+b ranging from 1.81 to 2.3, which has 20 to 400 silicon atoms, and 1 to 5, preferably 2 to 4, particularly 2 SiH bonds.
- R 5 include monovalent hydrocarbon group having 1 to 10, particularly 1 to 8, carbon atoms, for example, alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, hexyl, octyl, and decyl groups; alkenyl groups such as vinyl, allyl, propenyl, butenyl and hexenyl groups; aryl groups such as phenyl, xylyl and tolyl groups; aralkyl groups such as benzyl, phenylethyl, and phenylpropyl groups, and halogenated groups thereof such as chloromethyl, bromoethyl, and trifluoropropyl groups.
- alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, hexyl,
- the copolymer is represented by the following formula (7).
- R 5 is as defined above
- R 6 is —CH 2 CH 2 CH 2 —, —OCH 2 —CH(OH)—CH 2 —O—CH 2 CH 2 CH 2 , or —O—CH 2 CH 2 CH 2 —
- R 7 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- n is an integer of from 4 to 199, preferably from 19 to 109
- p is an integer of from 1 to 10
- q is an integer of 1 to 10.
- the silicone-modified epoxy resin is incorporated in the composition in such an amount that a content of the diorganosiloxane units preferably ranges from 1 to 20 parts by weight, particularly from 2 to 15 parts by weight, per 100 parts by weight of the epoxy resin (A).
- the silicone-modified epoxy resin can decrease stress incurred on a cured product and increase adhesion strength to a substrate.
- the content of the diorganosiloxane units is calculated by the following equation:
- a content of diorganosiloxane units (a molecular weight of the diorganosiloxane moiety/a molecular weight of the silicone-modified epoxy resin) ⁇ content of the silicone-modified epoxy resin
- the underfill composition can by prepared by mixing the aforesaid components (A) to (C) and optional components, if desired, altogether or sequentially while heating, if necessary.
- Any mixing apparatus can be used such as an automatic mortar equipped with a heater, a three-roll mill, a ball mill, and a planetary mixer.
- the underfill composition preferably has a viscosity at 25° C. of from 1 to 500 Pa ⁇ s, particularly from 1 to 150 Pa ⁇ s.
- the underfill composition is cured in an oven preferably by heating first at a temperature of from 100 to 120° C. for 0.5 hour or longer and then at a temperature of from 150 to 170° C. for 0.5 hour or longer. If the former heating is performed shorter than 0.5 hour, a final cured product may have a void. If the latter heating is performed shorter than 0.5 hour, a final cured product may not have satisfactory mechanical properties.
- the encapsulation resin composition comprises
- an inorganic filler in an amount of from 500 to 1,100 parts by weight per total 100 parts by weight of the components (a) and (b).
- biphenyl aralkyl epoxy resin An example of the biphenyl aralkyl epoxy resin is represented by the following formula
- R 1 is an alkyl group having 1 to 4 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl and tert-butyl groups, among which methyl group is preferred; a is an integer of from 0 to 4, b is an integer of from 0 to 3, and Q is an integer of from 0 to 10.
- a cured product of the biphenyl aralkyl epoxy resin is flexible with a low modulus of elasticity and is impact-resistant.
- p is a number of from 0.5 to 1.5.
- triphenyl epoxy resin is represented by the following formula,
- the encapsulation resin composition can comprise other type of epoxy resins, for example, novolac type epoxy resins, cresol novolac type epoxy resins, triphenol alkane type epoxy resins, heterocyclic epoxy resins, naphthalene ring-containing epoxy resins, bisphenol-A type epoxy resins, bisphenol-F type epoxy resins, stilbene type epoxy resins, and a mixture thereof.
- novolac type epoxy resins cresol novolac type epoxy resins
- triphenol alkane type epoxy resins triphenol alkane type epoxy resins
- heterocyclic epoxy resins naphthalene ring-containing epoxy resins
- bisphenol-A type epoxy resins bisphenol-F type epoxy resins
- stilbene type epoxy resins and a mixture thereof.
- those having a low melt viscosity are preferred such as bisphenol-A type epoxy resins, bisphenol-F type epoxy resins, and stilbene type epoxy resins.
- the aforesaid aralkyl epoxy resin or triphenyl epoxy resin preferably dominates the component (a) in an amount of from 50 to 100 wt %, more preferably from 70 to 100 wt % of the component (a).
- a preferred biphenyl aralkyl phenolic resin is represented by the following formula because the resin gives a heat- and crack-resistant cured product.
- R 2 is an C 1-4 alkyl group such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl and tert-butyl groups, or a phenyl group, among which methyl and phenyl groups are preferred; a is an integer of from 0 to 4; b is an integer of from 0 to 3; and Q is an integer of from 0 to 10.
- m is a number of from 0.5 to 1.5 on average.
- the triphenol resin is represented by the following formula,
- R is a hydrogen atom or C 1-4 alkyl group such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, or tert-butyl group.
- the triphenol type resin is resistant to heat and has a relatively low viscosity, so that it enables one to formulate a composition which forms a cured product having high glass transition temperature and contains a larger amount of filler.
- An example of the triphenol resin of the above formula is as shown below.
- the component (b) can contain other types of phenolic resins, for example, phenol novolac type resins, naphthalene ring-containing phenolic resins, phenol aralkyl type phenolic resins, biphenyl type phenolic resins, alicyclic phenolic resins, heterocyclic phenolic resins, bisphenol-A type phenolic resins, and bisphenol-F type phenolic resins.
- phenolic resins for example, phenol novolac type resins, naphthalene ring-containing phenolic resins, phenol aralkyl type phenolic resins, biphenyl type phenolic resins, alicyclic phenolic resins, heterocyclic phenolic resins, bisphenol-A type phenolic resins, and bisphenol-F type phenolic resins.
- the other phenolic resin is contained in the composition, it is contained in an amount preferably not more than 50 wt %, more preferably not more than 70 w
- the component (b) is contained in the composition in such an amount that an equivalent ratio of the epoxy group in the component (a) to the phenolic hydroxyl group in the component (b) ranges from 0.8 to 1.2.
- a composition containing the component (a) more than the aforesaid lower upper limit may not be cured well whereas a composition containing the component (a) less than the aforesaid lower limit may form a cured product having worse moisture resistance.
- the inorganic filler (c) commonly used inorganic filler can be used.
- the inorganic filler include silica such as spherical fused silica, crushed fused silica, and crystalline silica, alumina, mullite, silicon nitride, aluminum nitride, boron nitride, titanium oxide, and glass fiber.
- silica particularly, spherical fused silica is preferred.
- the spherical fused silica has an average particle size ranging from 5 to 30 ⁇ m and a weight fraction of particles having a particle size larger than 75 ⁇ m, as measured by wet screening method, is not more than 0.2 wt % because such spherical fused silica gives a composition having good molding property and fluidity.
- the component (c) is contained in the composition in an amount of from 500 to 1,100 parts by weight per total 100 parts by weight of the components (a) and (b). Less than the aforesaid lower limit of the component (c) gives a larger linear expansion coefficient of a cured composition, causing a semiconductor device to warp.
- a composition comprising component (c) in an amount more than the aforesaid upper limit may have a viscosity too high to be molded.
- the inorganic filler is surface treated in advance with a silane coupling agent such as an aminosilane or an epoxy silane.
- a silane coupling agent such as an aminosilane or an epoxy silane.
- the encapsulation resin composition can contain an optional component in an amount not to adversely affect the composition.
- the optional components include resins to provide a cured composition with flexibility such as thermoplastic resins, thermoplastic elastomers, synthetic organic rubbers, and silicones; release agents such as carnauba wax, colorants such as carbon black; flame retardants such as halogenated resins, antimony oxide, and molybdate; and halogen trapping agents.
- the encapsulation resin composition can be prepared by (i) thorouglhly mixing the components (a) to (c), and an optional component, if desired, with a mixer such as a Henschel mixer, (ii) melt-kneading the mixture with a heated roll, kneader, or an extruder, (iii) cooling the molten mixture to solidify, and (iv) pulverizing the solidified mixture.
- a silane coupling agent may be added to the mixture to promote wetting the inorganic filler. The silane coupling agent described above can be used.
- Epoxy resin A1 Tri-functional epoxy resin represented by the following formula, EPIKOTE 630H, ex Japan Epoxy Resin Co., Ltd.
- Epoxy resin A2 Bisphenol-F epoxy resin represented by the following formula, RE303S-L, ex Nihon Kayaku Co., Ltd.
- Curing agent B1 3,3′-diethyl-4,4′-diaminodiphenylmethane, Kayahard AA, ex Nihon Kayaku Co., Ltd.
- Curing agent B2 3,3′,5,5′-tetraethyl-4,4′-diaminodiphenylmethane, C-300S, ex Nihon Kayaku Co., Ltd.
- Curing agent B3 allo-ocimene maleate, a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid anhydride and 1-isopropyl-4-methyl-bicyclo[2.2.2]octo-5-ene-2,3-dicarboxylic acid anhydride, YH307, ex Japan Epoxy Resin Co., Ltd.
- Curing agent B4 a mixture of hexahydrophthalic anhydride, Rikacid MH700, ex New Japan Chemical co., ltd.
- Spherical silica Spherical silica produced by deflagration method which has an average particle size of 2.5 ⁇ m with a fraction of particles having a particle size of 25 ⁇ m or larger of 0.01 wt %, as determined by the following method.
- silica was mixed with pure water with a 1:9 weight ratio, which was then ultrasonicated.
- the dispersion obtained was screened with a filter-1 having a mesh of 25 ⁇ m and then a filer-2 having a mesh size of 10 ⁇ m.
- the residues in wt % of each screening were weighed. The analysis was repeated 5 times and the results were averaged.
- Silane coupling agent ⁇ -glycidoxypropyltrimethoxysilane, KBM403, ex Shin-Etsu Chemical Co., Ltd.
- Solvent polyethyleneglycol methyl ethyl acetate, PGMEA, having a boiling point of 146° C.
- Curing catalyst 2-ethyl-4-methyl imidazol, ex Shikoku Chemical, Co.
- compositions obtained were evaluated according to the following methods.
- Viscosity of each composition was measured according to the Japanese Industrial Standards (JIS) Z-8803 at 25° C. with an E-type viscometer. The reading was made two minutes after placing the composition in the cone.
- JIS Japanese Industrial Standards
- Tg Glass Transition Temperature
- CTE1 Linear Expansion Coefficient at (Tg-30)° C.
- CTE2 Linear Expansion Coefficient at a Temperature Higher than Tg(CTE2)
- a cured product was prepared by heating a composition from room temperature at a temperature increase rate of 10° C./min to a temperature of from 200 to 260° C. and keeping the temperature for a period of time of from 30 seconds to 5 minutes.
- the cured product obtained was cooled to room temperature from which a 5 mm ⁇ 5 mm ⁇ 15 mm test piece was cut out.
- the test piece was subjected to thermomechanical analysis(TMA) to determine Tg, CTE1 and CTE2 with a temperature increase rate of 5° C./min. When (Tg-30)° C.
- CTE1 was determined from TMA data of from ⁇ 30 to 0° C.
- CTE2 was determined from TMA data of from 150 to 180° C.
- Tg-30 100° C. or higher
- CTE1 was determined from TMA data of from 50 to 80° C.
- CTE2 was determined from TMA data of from 200 to 230° C.
- a certain amount of a composition was penetrated in about 50 ⁇ m-gap between a 30 mm ⁇ 30 mm FR-4 substrate and a flip-chip bonded silicon chip coated with a polyimide, and then heated at 165° C. for 30 minutes.
- the underfill thus prepared was observed for voids with a scanning acoustic microscope, C-SAM, ex SONIX K. K.
- a certain amount of a composition was poured in a polytetrafluoroethylene mold in the form of a truncated cone with a bottom surface diameter of 2 mm, a top opening diameter of 5 mm, and a height of 3 mm.
- a silicon chip coated with polyimide was placed, which then was heated at 150° C. for 3 hours to cure the composition.
- a test piece was obtained.
- Initial adhesion strength was measured by pushing at a speed of 1 mm/sec a side surface of the cured composition in the form of truncated cone on the silicon chip.
- Adhesion strength after pressure cooker test was measured in the same manner as above on a test piece which had been kept in a pressure cooker tester at 121° C. and 2.1 atm for 336 hours. Both adhesion strengths were measured on five test pieces, respectively, and results were averaged.
- a composition was cured at 150° C. for 3 hours. Fracture toughness at room temperature of the cured product was measured according to
- EMC-1 to EMC-6 Six encapsulation resin compositions, EMC-1 to EMC-6, were prepared by kneading the components with a three-roller mill according to the formulations shown in the Table 2.
- the substances indicated in the Table 2 are as follows.
- Epoxy resin a1 a biphenyl aralkyl epoxy resin of the following formula, NC-3000, ex Nihon Kayaku Co., Ltd.
- Epoxy resin a2 a tri-functional epoxy resin of the following formula, EPPN-501H, ex Nihon Kayaku Co., Ltd.
- Phenolic resin b1 a tri-functional phenolic resin of the following formula, MEH-7500, Meiwa Plastic Industries, Ltd.
- Phenolic resin b2 a biphenyl aralkyl phenolic resin of the following formula, MEH-7851, Meiwa Plastic Industries, Ltd.
- Spherical silica Spherical silica produced by deflagration method which has an average particle size of 2.5 ⁇ m with a fraction of particles having a particle size of 25 ⁇ m or larger of 0.01 wt % as determined by the aforesaid method of particle size analysis.
- Curing promoter Triphenylphosphine, ex Hokko Chemical Industry Co., Ltd.
- Silane coupling agent ⁇ -glycidoxypropyltrimethoxysilane, KBM403, ex Shin-Etsu Chemical Co., Ltd.
- Releasing agent Carnauba wax, Nikko Fine Products Co.
- compositions obtained were evaluated according to the following methods.
- Tg Glass Transition Temperature
- CTE1 Linear Expansion Coefficient at (Tg-30)° C.
- CTE2 Linear Expansion Coefficient at a Temperature Higher than Tg(CTE2)
- a cured product was obtained by heating a composition at 180° C. for 24 hours.
- Tg, CTE1 and CTE2 of the cured product were determined in the same manner as described above.
- a certain amount of a composition was spread on a hot plate heated at 175° C. and stirred with a spatula.
- a time required for the composition to be released from the hot plate was determined to be a gel time.
- a composition was molded at 175° C. and at 6.9 N/mm 2 for 90 seconds and post-cured at 180° C. for 4 hours. Fracture toughness at room temperature of the cured product was measured according to ASTM #D5045.
- a composition was mold at 175° C. and at 6.9 N/mm 2 for 90 seconds and post-cured at 180° C. for 4 hours. According to JIS #K6911, bending strength and modulus of elasticity at room temperature of the cured product were measured.
- a composition was mold at 175° C. and at 6.9 N/mm 2 for 90 seconds and post-cured at 180° C. for 4 hours.
- a specific gravity at room temperature of the cured product obtained was measured according to JIS #K6911.
- SIP type semiconductor devices were prepared according to the method described below. The devices obtained were subjected to a pressure cooker test and a thermal shock test as described below.
- FIG. 1 A semiconductor device of which cross-sectional view is shown in FIG. 1 was prepared.
- BT bismaleimide-triazine
- nine pieces of 10 ⁇ 10 ⁇ 0.3 mm silicon chip were mounted by using a spacer having a thickness of about 100 ⁇ m.
- An underfill composition was penetrated in a gap between each chip and the substrate and cured by heating at 120° C. for 0.5 hour and then at 165° C. for 3 hours.
- the device thus obtained was encapsulated with an encapsulation resin composition by transfer-molding at 175° C. and at 6.9 N/mm 2 .
- the encapsulated device was heated for 2 minutes and then at 175° C. for 5 hours to cure the encapsulation resin composition.
- the package was diced with a dicer in nine semiconductor device chips each having a size of 12 mm ⁇ 12 mm with a thickness of about 3 mm.
- JEDEC Joint Electron Device Engineering Council
- Eighteen semiconductor device chips prepared as described above were kept in an environment of a temperature of 30° C. and a relative humidity of 65% for 192 hours, and passed in an IR reflow furnace with a maximum temperature of 265° C. five times. Then, the semiconductor device chips were subjected to a thermal shock test in which one cycle consisting of cooling at ⁇ 65° C. for 30 minutes and heating at 150° C. for 30 minutes. After 250, 500, 750 and 1,000 cycles, the semiconductor device chips were inspected with the scanning acoustic microscope. In Tables 3 to 6, percentages of devices in which peeling and/or crack was detected are shown. In Tables 3 to 6, “Ex.” stands for Example and “R.Ex.” stands for Referential Example.
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Abstract
A set of compositions for preparing a system-in-package type semiconductor device, characterized in that the set of compositions consists of an underfill composition for preparing the underfill part and an encapsulation resin composition for preparing the resin encapsulation part, wherein
-
- 1) a cured product of the underfill composition has a glass transition temperature, Tg, which is 100° C. or higher and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by 20° C. or smaller,
- 2) a total of a linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg-30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg-30)° C. is 42 ppm/° C. or smaller, and
- 3) a ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.
Description
- This application claims benefit of Japanese Patent Applications No. 2006-249802 filed on Sep. 14, 2006, and Japanese Patent Applications No. 2007-232555 filed on Sep. 7, 2007, the contents of which are hereby incorporated by reference.
- The present invention relates to resin compositions suitable for preparing a system-in-package type semiconductor device. Specifically, the present invention relates to a set of resin compositions consisting of an underfill resin composition and encapsulating resin composition. The compositions in combination provide a semiconductor device which is strongly adhered to a substrate and has a high resistance to heat and thermal shock.
- Associated with downsizing, lightening, and functionalization of electronic devices, packaging of a semiconductor device is mainly performed by surface mounting method rather than pin insertion method. Recently, the system-in-packaging, hereinafter referred to as SIP, is widely used in which a plurality of silicon dies is packaged in one package. Particularly, a stack type SIP is used in which at least one semiconductor chip is stacked and wire bonded on another semiconductor chip.
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FIG. 1 is a cross-sectional view of a semiconductor device, in which asemiconductor chip 3 is flip-chip bonded viasolder bumps 2 on a surface of asubstrate 1 provided with electronic circuits. The gaps between thesubstrate 1 and thesemiconductor chip 3, i.e., spaces between the solder bumps, are filled with anunderfill composition 4.FIGS. 2 and 3 show cross-sectional views of system-in-package type semiconductor devices in which one or more of-semiconductor chip is placed on a semiconductor chip flip-chip bonded to thesubstrate 1. - SIP semiconductor devices are required to show no peeling or crack at an interface between an underfill part and a silicon chip or a substrate during a reflow process and a mounting process. In addition, the underfill part must supplement weaker adhesion of a lead-free solder than that of conventional solder.
- As resin materials to avoid such peeling or crack, the Japanese Patent Application Laid-Open No. H9-176287 and H9-176294 describe resin compositions comprising a liquid epoxy resin and an alkyl-substituted aromatic amine. It is described that these compositions form cured products strongly adhered to a substrate, metal and solder resist, and give a highly reliable semiconductor package having high reflow- and thermal cycle-resistances. However, when the cured products of these resin compositions are encapsulated with a resin, they were found to crack or peel depending on the encapsulation resin used.
- An object of the present invention is therefore to provide a set of an underfill composition and an encapsulation resin composition which provides semiconductor device packages resistant to heat and thermal shock.
- The present invention is a set of compositions for preparing a system-in-package type semiconductor device, said system-in-package type semiconductor device comprising
- a substrate,
- a first semiconductor element flip-chip bonded to the substrate,
- an underfill part between the first semiconductor element and the substrate,
- at least one second semiconductor element placed on the first semiconductor element, and
- a resin encapsulation part covering the first semiconductor element, the underfill part and the second semiconductor element,
- characterized in that the set of compositions consists of an underfill composition for preparing the underfill part and an encapsulation resin composition for preparing the resin encapsulation part, wherein
- 1) a cured product of the underfill composition has a glass transition temperature, Tg, which is 100° C. or higher and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by 20° C. or smaller,
- 2) a total of a linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg-30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg-30)° C. is 42 ppm/° C. or smaller, and
- 3) a ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.
- Because of the specific combination of glass transition temperatures and linear expansion coefficients, no crack or separation occurs between curing products of the compositions or the curing product and substrate when they are exposed to thermal shock such as reflow process.
-
FIG. 1 is a cross-sectional view of an example of a flip-chip type semiconductor device; -
FIG. 2 is a cross-sectional view of an example of a system-in-package type semiconductor device; and -
FIG. 3 is a cross-sectional vies of another example of a system-in-package type semiconductor device. - Firstly, the limitations from 1) to 3) are explained. The limitation 1) is a relationship between a glass transition temperature, hereinafter referred to as Tg, of a curing product of the underfill composition and that of a curing product of the encapsulating resin composition. The Tg can be determined by a known method such as the thermomechanical analysis (TMA) and Theological measurements. The Tg of the cured product of the underfill composition is higher than 100° C., preferably higher than 120° C. A cured product having Tg below 100° C. may be peeled off from a substrate during a reflow process due to a lower adhesion to the substrate. An upper limit of Tg is practically about 200° C. In addition, the Tg of the cured product of the underfill composition is the same with or differs from Tg of the cured product of the encapsulating resin composition by 20° C. or smaller. If the difference between the Tg's are greater than 20° C., stresses between the underfill part and encapsulation part will be so large that an interface between both parts or between the underfill or encapsulation part and a passivation layer of a substrate may peel.
- The limitations 2) and 3) are relationships between linear expansion coefficients of the cured products of the both compositions. A linear expansion coefficient can be determined by the thermomechanical analysis (TMA). A linear expansion coefficient at a temperature of (Tg-30)° C. is substantially constant at any temperature not higher than (Tg-30)° C. In the present invention, it was determined from TMA data at a temperature range of from 50 to 80° C. A total of linear expansion coefficients at a temperature of (Tg-30)° C. of a cured product of the underfill composition and that of a cured product of the encapsulation resin composition is 42 ppm/° C. or smaller, preferably 40 ppm/° C. or smaller. If the total exceeds 42 ppm/° C., peeling or crack may occur at an interface between an underfill part and a resin encapsulation part or between the underfill and a passivation layer.
- In addition, a ratio of the linear expansion coefficient at a temperature of (Tg-30)° C. of a cured product of the underfill composition to that of a cured product of the encapsulation resin composition ranges from 0.3 to 1.0, preferably from 0.3 to 0.9. If the ratio is outside the aforesaid range, a crack or peeling may occur between an underfill part and a resin encapsulation part.
- Preferably, the underfill composition comprises
- (A) an epoxy resin,
- (B) a curing agent in such an amount that an equivalent ratio of the epoxy group in the component (A) to a functional group in the component (B) ranges from 0.7 to 1.2, said functional group being reactive with the epoxy group, and
- (C) an inorganic filler in an amount of from 50 to 500 parts by weight per 100 parts by weight of the component (A).
- (A) Epoxy Resin
- Preferred examples of the epoxy resin (A) used in the present invention include bisphenol type epoxy resins such as bisphenol F type epoxy resins and bisphenol A type epoxy resins; novolac type epoxy resins such as phenol novolac type epoxy resins and cresol novolac type epoxy resins; naphthalene ring-containing epoxy resins, biphenyl type epoxy resins, cyclopentadiene type epoxy resins, and a mixture of two or more of these epoxy resins. Among these, bisphenol A type epoxy resins and bisphenol F type epoxy resins are preferred.
- The epoxy resins represented by the following formulas are also preferred.
- In the formula (5), R is a monovalent hydrocarbon group having 1 to 20, preferably 1 to 10, more preferably 1 to 3, carbon atoms. Examples of R include alkyl groups such as methyl, ethyl and propyl groups and alkenyl groups such as vinyl and allyl groups; n is an integer of from 1 to 4, particularly 1 or 2.
- When the epoxy resin of the aforesaid formula (5) is used, its content in the whole epoxy resin (A) ranges from 25 to 100 wt %, preferably from 50 to 100 wt %, more preferably from 75 to 100 wt %. If it is contained in an amount less than the aforesaid lower limit, a viscosity of such a composition is undesirably high and heat resistance of a cured product may be low. Example of the epoxy resin of the formula (5) is the one sold under the trade name of MRGE from Nihon Kayaku Co.Ltd.
- (B) Curing Agent
- Examples of the curing agent (B) include amine type, polymercaptane type, imidazol type, acid anhydride type and dicyanodiamide type curing agents. Preferably, amine type and acid anhydride type curing agents are used. Preferred amine curing agent are represented by the following formulas (1) to (4),
- wherein R1 to R4 may be the same with or different from each other and are selected from the group consisting of monovalent hydrocarbon groups having 1 to 6 carbon atoms, CH3S— and C2H5S—.
- Preferred examples of monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, and hexyl; alkenyl groups such as vinyl, allyl, propenyl, butenyl, and hexenyl groups; phenyl group; and halogenated groups thereof such as fluoromethyl, bromoethyl, and 3,3,3-trifluoropropyl groups, among which those having 1 to 3 carbon atoms are preferred.
- Aforesaid aromatic amine curing agents are mostly solid at room temperature, so that they tend to thicken the epoxy resin when they are mixed with the epoxy resin as they are. It is therefore preferred to melt-mix the amine curing agent with the epoxy resin at a temperature low enough to avoid reaction with the epoxy resin. That is, the aromatic amine curing agent is preferably melt-mixed at a temperature of from 70 to 150° C. for 1 to 2 hours with the epoxy resin. At a temperature below 70° C., the aromatic amine curing agent may not melt sufficiently, whereas at a temperature above 150° C. it tends to react with the epoxy resin to thicken the composition. A period of mixing time shorter than 1 hour may not enough to thoroughly mix the aromatic amine curing agent with epoxy resin, whereas more than 2 hours may cause reaction with the epoxy resin.
- Examples of the acid anhydride curing agent include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhimic acid anhydride, pyromellitic acid dianhydride, allo-ocimene maleate, benzophenone tetracarboxylic acid anhydride, 3,3′,4,4′-biphenyltetrabisbenzophenone tetracarboxylic acid anhydride, (3,4-dicarboxyphenyl) ether dianhydride, bis(3,4-dicaroxyphenyl)methane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid anhydride, 1-isopropyl-4-methyl-bicyclo[2.2.2]octo-5-ene-2,3-dicaroxylic acid anhydride and a mixture thereof. Preferred curing agents are methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid anhydride, 1-isopropyl-4-methyl-bicyclo[2.2.2]octo-5-ene-2,3-dicaroxylic acid anhydride and a mixture thereof. These acid anhydrides are sold under the trade names of Rikacid MH700 from New Japan Chemical co., ltd., YH306 and YH307 both from Japan Epoxy Resin Co.
- The curing agent (B) is contained in the composition in such an amount that an equivalent ratio of its epoxy-reactive functional group to the epoxy group-of the epoxy resin (A) of from 0.7 to 1.2, preferably from 0.8 to 1.0. If it is contained less than the aforesaid lower limit, a part of the epoxy resin remains unreacted, resulting in lower glass transition temperature and smaller adhesion to a substrate. If it is contained above the aforesaid upper limit, a cured product may be so hard and brittle that it cracks in a reflow process or a heat cycle test.
- (C) Inorganic Filler
- As the inorganic filler, any known inorganic filler can be used. Examples of the inorganic filler include fused silica, crystalline silica, alumina, boron nitride, aluminum nitride, silicon nitride, magnesia, magnesium silicate, and aluminum. Among these, spherical fused silica is preferred because it gives a composition having a desirable low viscosity of a composition. More preferred is fused silica prepared by sol-gel method or deflagration method.
- Preferably, the inorganic filler is surface treated in advance with a coupling agent such as a silane coupling agent or titanate coupling agent to strengthen adhesion between the filler and resins. Preferred coupling agents are silane coupling agents, for example, epoxy silanes such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β-(3,4-epoxycyclohexyl)ethyl trimethoxysilane; aminosilanes such as N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and N-phenyl-γ-aminopropyltrimethoxysilane; and mercaptosilane such as γ-mercaptosilane. An amount of the silane coupling agent and a method of surface treatment to be used are not limited to particular ones.
- A particle size of the inorganic filler is preferably selected according to a gap size of a semiconductor device, i.e., a distance between a substrate and a semiconductor chip. For a typical device having a gap size ranging from 10 to 200 μm, an average particle size ranges from 0.1 to 5 μm, preferably from 0.5 to 2 μm because a underfill composition comprising such inorganic filler has a desired viscosity and gives a cured product having a desired linear expansion coefficient. A composition containing an inorganic filler having a particle size smaller than the aforesaid lower limit may have a viscosity too high to penetrate smoothly in a gap. On the other hand, an inorganic filler having a particle size larger than the aforesaid upper limit may plug the gap to cause a void in a cured product.
- The inorganic filler preferably has such a particle size distribution that a fraction of particles having a particle size of one half the gap size or larger is not more than 0.1 wt %, particularly from 0 to 0.8 wt %, of the whole particles. Preferably, the inorganic filler has an average particle size, i.e., a median size(d50), of about one-tenth of the gap size or smaller, and a maximum particle size, i.e., a particle size at 98 volume % in a cumulative particle size distribution (d98), of one half the gap size of smaller. A particle size and its distribution can be measured by a laser diffraction method, for example. An amount of the inorganic filler having a particle size larger than one half the gap size can be determined by i) mixing the inorganic filler with pure water in a weight ratio of 1:9, ii) ultrasonicating the mixture to break up flocculants, iii) filtering the mixture with a sieve having a mesh size of one half the gap size, and iv) weighing a residue left on the sieve.
- It was found that a sol-gel method and a deflagration method are most suitable for producing particles having the aforesaid particle size and its distribution. Spherical silica made by these methods has a spherical form and a controlled particle size distribution. The sol-gel method and the deflagration are well known in the art and is not explained here.
- Preferably, 80 wt % or more, more preferably 90 to 100 wt %, most preferably 95 to 100 wt % of the inorganic filler is the spherical silica made by the sol-gel method or the deflagration method. If a ratio of the spherical silica is less than the aforesaid lower limit, a fluidity or spreadability of a composition may not be good.
- The inorganic filler (C) is contained in the underfill composition in an amount of from 50 to 500 parts by weight, preferably from 100 to 400 parts by weight, per 100 parts by weight of the epoxy resin (A). A composition containing the inorganic filler less than the aforesaid lower limit may give a cured product having a large linear expansion coefficient, whereas a composition containing the inorganic filler larger than the aforesaid upper limit may be too viscous to smoothly penetrate in the gap.
- Optional Components
- The underfill composition of the present invention can contain an optional component in an amount not to adversely affect the composition. Examples of the optional components include resins to provide a cured composition with flexibility, for example, silicone-modified epoxy resin, silicone rubber, silicone oil, liquid polybutadiene rubber, and methyl methacrylate-butadiene-styrene copolymer; silane coupling agents; pigments such as carbon black; dyes, and antioxidants.
- Preferably, the silicone-modified epoxy resin is a copolymer prepared by addition-reacting an epoxy resin or a phenolic resin having an alkenyl group with an organopolysiloxane represented by the following average compositional formula (6)
-
HaR5 bSiO(4-a-b) (6) - wherein R5 is a substituted or unsubstituted monovalent hydrocarbon group, a is a number of from 0.01 to 0.1, b is a number of from 1.8 to 2.2 with a+b ranging from 1.81 to 2.3, which has 20 to 400 silicon atoms, and 1 to 5, preferably 2 to 4, particularly 2 SiH bonds.
- Preferred examples of R5include monovalent hydrocarbon group having 1 to 10, particularly 1 to 8, carbon atoms, for example, alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, hexyl, octyl, and decyl groups; alkenyl groups such as vinyl, allyl, propenyl, butenyl and hexenyl groups; aryl groups such as phenyl, xylyl and tolyl groups; aralkyl groups such as benzyl, phenylethyl, and phenylpropyl groups, and halogenated groups thereof such as chloromethyl, bromoethyl, and trifluoropropyl groups.
- Preferably, the copolymer is represented by the following formula (7).
- In the formula (7), R5 is as defined above, R6 is —CH2CH2CH2—, —OCH2—CH(OH)—CH2—O—CH2CH2CH2, or —O—CH2CH2CH2—, R7 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, n is an integer of from 4 to 199, preferably from 19 to 109, p is an integer of from 1 to 10, and q is an integer of 1 to 10.
- The silicone-modified epoxy resin is incorporated in the composition in such an amount that a content of the diorganosiloxane units preferably ranges from 1 to 20 parts by weight, particularly from 2 to 15 parts by weight, per 100 parts by weight of the epoxy resin (A). The silicone-modified epoxy resin can decrease stress incurred on a cured product and increase adhesion strength to a substrate. The content of the diorganosiloxane units is calculated by the following equation:
- A content of diorganosiloxane units=(a molecular weight of the diorganosiloxane moiety/a molecular weight of the silicone-modified epoxy resin)×content of the silicone-modified epoxy resin
- Preparation of the Underfill Composition
- The underfill composition can by prepared by mixing the aforesaid components (A) to (C) and optional components, if desired, altogether or sequentially while heating, if necessary. Any mixing apparatus can be used such as an automatic mortar equipped with a heater, a three-roll mill, a ball mill, and a planetary mixer.
- The underfill composition preferably has a viscosity at 25° C. of from 1 to 500 Pa·s, particularly from 1 to 150 Pa·s. The underfill composition is cured in an oven preferably by heating first at a temperature of from 100 to 120° C. for 0.5 hour or longer and then at a temperature of from 150 to 170° C. for 0.5 hour or longer. If the former heating is performed shorter than 0.5 hour, a final cured product may have a void. If the latter heating is performed shorter than 0.5 hour, a final cured product may not have satisfactory mechanical properties.
- Now, the encapsulation resin composition of the present invention is explained. The encapsulation resin composition comprises
- (a) a biphenyl aralkyl epoxy resin or triphenyl epoxy resin,
- (b) a biphenyl aralkyl phenolic resin or triphenyl phenolic resin in such an amount that an equivalent ratio of the epoxy group in the component (a) to the phenolic hydroxyl group in the component (b) ranges from 0.8 to 1.2, and
- (c) an inorganic filler in an amount of from 500 to 1,100 parts by weight per total 100 parts by weight of the components (a) and (b).
- (a) A biphenyl aralkyl Epoxy Resin or triphenyl Epoxy Resin
- An example of the biphenyl aralkyl epoxy resin is represented by the following formula
- wherein R1 is an alkyl group having 1 to 4 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl and tert-butyl groups, among which methyl group is preferred; a is an integer of from 0 to 4, b is an integer of from 0 to 3, and Q is an integer of from 0 to 10. A cured product of the biphenyl aralkyl epoxy resin is flexible with a low modulus of elasticity and is impact-resistant.
- Examples of the biphenyl aralkyl epoxy resin represented by the above formula are as shown below,
- wherein p is a number of from 0.5 to 1.5.
- An example of the triphenyl epoxy resin is represented by the following formula,
- wherein Gr represents a glycidyl group. This resin gives a cured product highly resistant to heat.
- The encapsulation resin composition can comprise other type of epoxy resins, for example, novolac type epoxy resins, cresol novolac type epoxy resins, triphenol alkane type epoxy resins, heterocyclic epoxy resins, naphthalene ring-containing epoxy resins, bisphenol-A type epoxy resins, bisphenol-F type epoxy resins, stilbene type epoxy resins, and a mixture thereof. Among these, those having a low melt viscosity are preferred such as bisphenol-A type epoxy resins, bisphenol-F type epoxy resins, and stilbene type epoxy resins. When the other type of epoxy resin is incorporated in the composition, the aforesaid aralkyl epoxy resin or triphenyl epoxy resin preferably dominates the component (a) in an amount of from 50 to 100 wt %, more preferably from 70 to 100 wt % of the component (a).
- (b) A biphenyl aralkyl phenolic Resin or triphenyl phenolic Resin
- A preferred biphenyl aralkyl phenolic resin is represented by the following formula because the resin gives a heat- and crack-resistant cured product.
- In the above formula, R2 is an C1-4 alkyl group such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl and tert-butyl groups, or a phenyl group, among which methyl and phenyl groups are preferred; a is an integer of from 0 to 4; b is an integer of from 0 to 3; and Q is an integer of from 0 to 10.
- Examples of the phenol resin represented by the above formula are as shown below,
- wherein m is a number of from 0.5 to 1.5 on average.
- The triphenol resin is represented by the following formula,
- wherein R is a hydrogen atom or C1-4 alkyl group such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, or tert-butyl group.
- The triphenol type resin is resistant to heat and has a relatively low viscosity, so that it enables one to formulate a composition which forms a cured product having high glass transition temperature and contains a larger amount of filler. An example of the triphenol resin of the above formula is as shown below.
- The component (b) can contain other types of phenolic resins, for example, phenol novolac type resins, naphthalene ring-containing phenolic resins, phenol aralkyl type phenolic resins, biphenyl type phenolic resins, alicyclic phenolic resins, heterocyclic phenolic resins, bisphenol-A type phenolic resins, and bisphenol-F type phenolic resins. When the other phenolic resin is contained in the composition, it is contained in an amount preferably not more than 50 wt %, more preferably not more than 70 wt %.
- The component (b) is contained in the composition in such an amount that an equivalent ratio of the epoxy group in the component (a) to the phenolic hydroxyl group in the component (b) ranges from 0.8 to 1.2. A composition containing the component (a) more than the aforesaid lower upper limit may not be cured well whereas a composition containing the component (a) less than the aforesaid lower limit may form a cured product having worse moisture resistance.
- (c) Inorganic Filler
- As the inorganic filler (c), commonly used inorganic filler can be used. Examples of the inorganic filler include silica such as spherical fused silica, crushed fused silica, and crystalline silica, alumina, mullite, silicon nitride, aluminum nitride, boron nitride, titanium oxide, and glass fiber. Among these, silica, particularly, spherical fused silica is preferred. More preferably, the spherical fused silica has an average particle size ranging from 5 to 30 μm and a weight fraction of particles having a particle size larger than 75 μm, as measured by wet screening method, is not more than 0.2 wt % because such spherical fused silica gives a composition having good molding property and fluidity.
- The component (c) is contained in the composition in an amount of from 500 to 1,100 parts by weight per total 100 parts by weight of the components (a) and (b). Less than the aforesaid lower limit of the component (c) gives a larger linear expansion coefficient of a cured composition, causing a semiconductor device to warp. A composition comprising component (c) in an amount more than the aforesaid upper limit may have a viscosity too high to be molded.
- Preferably, the inorganic filler is surface treated in advance with a silane coupling agent such as an aminosilane or an epoxy silane. An amount and a method of surface treatment are not limited to particular ones.
- The encapsulation resin composition can contain an optional component in an amount not to adversely affect the composition. Examples of the optional components include resins to provide a cured composition with flexibility such as thermoplastic resins, thermoplastic elastomers, synthetic organic rubbers, and silicones; release agents such as carnauba wax, colorants such as carbon black; flame retardants such as halogenated resins, antimony oxide, and molybdate; and halogen trapping agents.
- The encapsulation resin composition can be prepared by (i) thorouglhly mixing the components (a) to (c), and an optional component, if desired, with a mixer such as a Henschel mixer, (ii) melt-kneading the mixture with a heated roll, kneader, or an extruder, (iii) cooling the molten mixture to solidify, and (iv) pulverizing the solidified mixture. In the step (i), a silane coupling agent may be added to the mixture to promote wetting the inorganic filler. The silane coupling agent described above can be used.
- The present invention will be further explained with reference to the following Examples, but shall not be limited thereto.
- Preparation of Underfill Compositions
- Twelve underfill compositions, UF-1 to UF-12, were prepared by kneading the components with a three-roller mill according to the formulations shown in the Table 1. The substances indicated in the Table 1 are as follows.
- (A) Epoxy Resin
- Epoxy resin A1: Tri-functional epoxy resin represented by the following formula, EPIKOTE 630H, ex Japan Epoxy Resin Co., Ltd.
- Epoxy resin A2: Bisphenol-F epoxy resin represented by the following formula, RE303S-L, ex Nihon Kayaku Co., Ltd.
- (B) Curing Agent
- Curing agent B1: 3,3′-diethyl-4,4′-diaminodiphenylmethane, Kayahard AA, ex Nihon Kayaku Co., Ltd.
- Curing agent B2: 3,3′,5,5′-tetraethyl-4,4′-diaminodiphenylmethane, C-300S, ex Nihon Kayaku Co., Ltd.
- Curing agent B3: allo-ocimene maleate, a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid anhydride and 1-isopropyl-4-methyl-bicyclo[2.2.2]octo-5-ene-2,3-dicarboxylic acid anhydride, YH307, ex Japan Epoxy Resin Co., Ltd.
- Curing agent B4: a mixture of hexahydrophthalic anhydride, Rikacid MH700, ex New Japan Chemical co., ltd.
- (C) Inorganic
- Filler
- Spherical silica: Spherical silica produced by deflagration method which has an average particle size of 2.5 μm with a fraction of particles having a particle size of 25 μm or larger of 0.01 wt %, as determined by the following method.
- A Method of Particle Size Analysis of Silica
- A certain amount of silica was mixed with pure water with a 1:9 weight ratio, which was then ultrasonicated. The dispersion obtained was screened with a filter-1 having a mesh of 25 μm and then a filer-2 having a mesh size of 10 μm. The residues in wt % of each screening were weighed. The analysis was repeated 5 times and the results were averaged.
- Additives
- Silane coupling agent: γ-glycidoxypropyltrimethoxysilane, KBM403, ex Shin-Etsu Chemical Co., Ltd.
- Solvent: polyethyleneglycol methyl ethyl acetate, PGMEA, having a boiling point of 146° C.
- Curing catalyst: 2-ethyl-4-methyl imidazol, ex Shikoku Chemical, Co.
- The compositions obtained were evaluated according to the following methods.
- (1) Viscosity
- Viscosity of each composition was measured according to the Japanese Industrial Standards (JIS) Z-8803 at 25° C. with an E-type viscometer. The reading was made two minutes after placing the composition in the cone.
- (2) Glass Transition Temperature (Tg), Linear Expansion Coefficient at (Tg-30)° C. (CTE1), and Linear Expansion Coefficient at a Temperature Higher than Tg(CTE2)
- A cured product was prepared by heating a composition from room temperature at a temperature increase rate of 10° C./min to a temperature of from 200 to 260° C. and keeping the temperature for a period of time of from 30 seconds to 5 minutes. The cured product obtained was cooled to room temperature from which a 5 mm×5 mm×15 mm test piece was cut out. The test piece was subjected to thermomechanical analysis(TMA) to determine Tg, CTE1 and CTE2 with a temperature increase rate of 5° C./min. When (Tg-30)° C. of the test piece was found to be lower than 100° C., CTE1 was determined from TMA data of from −30 to 0° C., and CTE2 was determined from TMA data of from 150 to 180° C. When (Tg-30)° C. of the test piece was found to be 100° C. or higher, CTE1 was determined from TMA data of from 50 to 80° C. and CTE2 was determined from TMA data of from 200 to 230° C.
- (3) Void
- A certain amount of a composition was penetrated in about 50 μm-gap between a 30 mm×30 mm FR-4 substrate and a flip-chip bonded silicon chip coated with a polyimide, and then heated at 165° C. for 30 minutes. The underfill thus prepared was observed for voids with a scanning acoustic microscope, C-SAM, ex SONIX K. K.
- (4) Adhesion Strength
- A certain amount of a composition was poured in a polytetrafluoroethylene mold in the form of a truncated cone with a bottom surface diameter of 2 mm, a top opening diameter of 5 mm, and a height of 3 mm. On the top surface of the composition a silicon chip coated with polyimide was placed, which then was heated at 150° C. for 3 hours to cure the composition. By removing the mold from the cured composition, a test piece was obtained. Initial adhesion strength was measured by pushing at a speed of 1 mm/sec a side surface of the cured composition in the form of truncated cone on the silicon chip. Adhesion strength after pressure cooker test was measured in the same manner as above on a test piece which had been kept in a pressure cooker tester at 121° C. and 2.1 atm for 336 hours. Both adhesion strengths were measured on five test pieces, respectively, and results were averaged.
- (5) Fracture Toughness (K1c)
- A composition was cured at 150° C. for 3 hours. Fracture toughness at room temperature of the cured product was measured according to
-
TABLE 1 Component, parts by weight UF-1 UF-2 UF-3 UF-4 UF-5 UF-6 UF-7 UF-8 UF-9 UF-10 UF-11 UF-12 (A) Epoxy resin A1 20 29 58 44 44 19 19 44 44 44 44 Epoxy resin A2 69 46 29 19 19 19 19 19 19 19 19 (B) Curing agent B1 14 16 20 20 Curing agent B2 14 16 20 20 35 35 35 35 35 35 Curing agent B3 30 30 Curing agent B4 30 30 (C) Inorganic filler 150 150 150 150 150 250 150 200 100 200 250 350 Others Silane coupling agent 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 Solvent 3 3 3 3 3 3 3 3 3 3 Curing promoter 1 1 Equivalent ratio of 0.80 0.80 0.80 0.80 0.80 0.80 1.00 1.00 0.80 0.80 0.80 0.80 (A)/(B) Weight ratio of (C) 0.60 0.59 0.59 0.59 0.59 0.71 0.60 0.66 0.49 0.66 0.71 0.77 Results Viscosity Pa · s@ 15.9 13.1 10.6 7.7 5.9 18.9 28.4 28.4 5.8 25.4 68 150 25° C. Void None None None None None None None None None None None None Fracture MPam1/2 2.4 2.2 2.2 2.2 2.2 2.2 1.3 1.3 2.3 2.2 2.3 2.2 toughness, K1c Tg ° C. 95 110 125 160 137 136 140 137 137 137 137 137 CTE1 ppm/° C. 29 29 29 29 28 27 29 25 42 28 24 17 CTE2 ppm/° C. 107 105 102 103 106 91 113 100 121 90 72 64 Adhesion Initial 197 210 210 207 221 203 185 186 234 234 229 231 strength, After 185 180 186 196 195 196 96 83 200 196 184 189 MPa PCT336hr - Preparation of Encapsulation Resin Compositions
- Six encapsulation resin compositions, EMC-1 to EMC-6, were prepared by kneading the components with a three-roller mill according to the formulations shown in the Table 2. The substances indicated in the Table 2 are as follows.
- (a) Epoxy Resin
- Epoxy resin a1: a biphenyl aralkyl epoxy resin of the following formula, NC-3000, ex Nihon Kayaku Co., Ltd.
- Epoxy resin a2: a tri-functional epoxy resin of the following formula, EPPN-501H, ex Nihon Kayaku Co., Ltd.
- (b) Phenolic Resin
- Phenolic resin b1: a tri-functional phenolic resin of the following formula, MEH-7500, Meiwa Plastic Industries, Ltd.
- Phenolic resin b2: a biphenyl aralkyl phenolic resin of the following formula, MEH-7851, Meiwa Plastic Industries, Ltd.
- (c) Inorganic Filler
- Spherical silica: Spherical silica produced by deflagration method which has an average particle size of 2.5 μm with a fraction of particles having a particle size of 25 μm or larger of 0.01 wt % as determined by the aforesaid method of particle size analysis.
- Additives
- Curing promoter: Triphenylphosphine, ex Hokko Chemical Industry Co., Ltd.
- Silane coupling agent: γ-glycidoxypropyltrimethoxysilane, KBM403, ex Shin-Etsu Chemical Co., Ltd.
- Carbon black, Denki Kagaku Kogyo Kabushiki Kaisha
- Releasing agent: Carnauba wax, Nikko Fine Products Co.
- The compositions obtained were evaluated according to the following methods.
- (1) Spiral Flow
- Using a mold according to Epoxy Molding Materials Institute (E.M.M.I) standard, a spiral flow was measured at 175° C. and at a pressure of 6.9 N/mm2.
- (2) Melt Viscosity
- Using a Koka-shiki type flow tester equipped with a nozzle having a diameter of 1 mm, a melt viscosity was measured at 175° C. and at a pressure of 10 kgf.
- (3) Glass Transition Temperature (Tg), Linear Expansion Coefficient at (Tg-30)° C. (CTE1), Linear Expansion Coefficient at a Temperature Higher than Tg(CTE2)
- A cured product was obtained by heating a composition at 180° C. for 24 hours. Tg, CTE1 and CTE2 of the cured product were determined in the same manner as described above.
- (4) Gel Time
- A certain amount of a composition was spread on a hot plate heated at 175° C. and stirred with a spatula. A time required for the composition to be released from the hot plate was determined to be a gel time.
- (5) Fracture Toughness (K1c)
- A composition was molded at 175° C. and at 6.9 N/mm2 for 90 seconds and post-cured at 180° C. for 4 hours. Fracture toughness at room temperature of the cured product was measured according to ASTM #D5045.
- (6) Bending Strength and Modulus of Elasticity
- A composition was mold at 175° C. and at 6.9 N/mm2 for 90 seconds and post-cured at 180° C. for 4 hours. According to JIS #K6911, bending strength and modulus of elasticity at room temperature of the cured product were measured.
- (7) Specific Gravity
- A composition was mold at 175° C. and at 6.9 N/mm2 for 90 seconds and post-cured at 180° C. for 4 hours. A specific gravity at room temperature of the cured product obtained was measured according to JIS #K6911.
-
TABLE 2 Component, parts by weight EMC-1 EMC-2 EMC-3 EMC-4 EMC-5 EMC-6 (a) Epoxy resin a1 55.44 71.40 71.40 71.40 71.40 Epoxy resin a2 69.16 (b) Phenolic resin b1 28.60 30.84 28.60 28.60 28.60 Phenolic resin b2 44.56 (c) Inorganic filler 800.0 800.0 800.0 900.0 700.0 500.0 Others Curing promoter 1.0 1.0 1.0 1.0 1.0 1.0 Releasing agent 1.5 1.5 1.5 1.5 1.5 1.5 Carbon black 1.0 1.0 1.0 1.0 1.0 1.0 Silane coupling agent 2.0 2.0 2.0 2.0 2.0 2.0 Results Spiral flow inch 58 50 45 35 58 70 Viscosity Pa · s 6 8 9 13 5 2 Gel time sec 25 24 20 21 23 23 Specific gravity g/cm3 1.99 1.99 1.99 2.02 1.92 1.88 Bending strength Kgf/mm2 155 145 139 140 142 141 Modulus of Kgf/mm2 22200 21500 22500 28900 17580 15300 elasticity Fracture MPam1/2 2.4 2.4 2.2 2.4 2.4 2.4 toughness, K1c Tg ° C. 125 155 182 155 155 155 CTE1 ppm/° C. 10 10 10 8 12 15 CTE2 ppm/° C. 38 38 37 32 43 50 - Using the underfill compositions and encapsulation resin compositions as indicated in Table 3, SIP type semiconductor devices were prepared according to the method described below. The devices obtained were subjected to a pressure cooker test and a thermal shock test as described below.
- Preparation of a Semiconductor Device
- A semiconductor device of which cross-sectional view is shown in
FIG. 1 was prepared. On a 0.4 mm-thick bismaleimide-triazine(BT) resin substrate for preparing a 32×32×1.2 mm package, nine pieces of 10×10×0.3 mm silicon chip were mounted by using a spacer having a thickness of about 100 μm. An underfill composition was penetrated in a gap between each chip and the substrate and cured by heating at 120° C. for 0.5 hour and then at 165° C. for 3 hours. - The device thus obtained was encapsulated with an encapsulation resin composition by transfer-molding at 175° C. and at 6.9 N/mm2. The encapsulated device was heated for 2 minutes and then at 175° C. for 5 hours to cure the encapsulation resin composition. Subsequently, the package was diced with a dicer in nine semiconductor device chips each having a size of 12 mm×12 mm with a thickness of about 3 mm.
- (1) Pressure Cooker Test
- Eighteen semiconductor device chips prepared as described above were kept in an environment of the
level 3 of the Joint Electron Device Engineering Council (JEDEC) classification, i.e., a temperature of 30° C. and a relative humidity of 65%, for 192 hours, and then passed in an IR reflow furnace with a maximum temperature of 265° C. five times. The semiconductor device chips were inspected for peeling or cracks with a scanning acoustic microscope, C-SAM, ex SONIX K. K. - The semiconductor device chips were then kept in a pressure cooker at 121° C. and at 2.1 atm for 336 hours followed by inspection with the scanning acoustic microscope. Results are as shown in Tables 3 to 6 in which “G” indicates that no peeling or crack was detected and “NG” indicates a peeling and/or crack was detected.
- (2) Thermal Shock Test
- Eighteen semiconductor device chips prepared as described above were kept in an environment of a temperature of 30° C. and a relative humidity of 65% for 192 hours, and passed in an IR reflow furnace with a maximum temperature of 265° C. five times. Then, the semiconductor device chips were subjected to a thermal shock test in which one cycle consisting of cooling at −65° C. for 30 minutes and heating at 150° C. for 30 minutes. After 250, 500, 750 and 1,000 cycles, the semiconductor device chips were inspected with the scanning acoustic microscope. In Tables 3 to 6, percentages of devices in which peeling and/or crack was detected are shown. In Tables 3 to 6, “Ex.” stands for Example and “R.Ex.” stands for Referential Example.
-
TABLE 3 Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Ex. 9 Ex. 10 Ex. 11 Underfill composition (UF) UF-5 UF-10 UF-11 UF-12 UF-11 UF-12 UF-10 UF-11 UF-12 UF-11 UF-12 Encapsulation resin EMC-2 EMC-2 EMC-2 EMC-2 EMC-4 EMC-4 EMC-5 EMC-5 EMC-5 EMC-6 EMC-6 composition (EMC) CTE1 of UF, ppm/° C. 28 28 24 17 24 17 28 24 17 24 17 CTE1 of EMC, ppm/° C. 10 10 10 10 8 8 12 12 12 15 15 Total of CTE1, ppm/° C. 38 38 34 27 32 25 40 36 29 39 32 (CTE1 of EMC)/(CTE1 of UF) 0.36 0.36 0.42 0.59 0.33 0.47 0.43 0.50 0.71 0.63 0.88 Tg of UF, ° C. 137 137 137 137 137 137 137 137 137 137 137 Tg of EMC, ° C. 155 155 155 155 155 155 155 155 155 155 155 (Tg of EMC) − (Tg of UF), ° C. −18 −18 −18 −18 −18 −18 −18 −18 −18 −18 −18 JEDEC Level 3 and G G G G G G G G G G G IR265° C. 5 passes After PCT336hr G G G G G G G G G G G Thermal shock 250 cycles, % 0 0 0 0 0 0 0 0 0 0 0 500 cycles, % 0 0 0 0 0 0 0 0 0 0 0 750 cycles, % 0 0 0 0 0 0 0 0 0 0 0 -
TABLE 4 Ex. 12 Ex. 13 Ex. 14 Ex. 15 Ex. 16 Ex. 17 Ex. 18 Ex. 19 Ex. 20 Ex. 21 Ex. 22 Underfill composition (UF) UF-2 UF-3 UF-5 UF-6 UF-7 UF-8 UF-4 UF-6 UF-7 UF-8 UF-5 Encapsulation resin EMC-1 EMC-1 EMC-1 EMC-1 EMC-1 EMC-1 EMC-2 EMC-2 EMC-2 EMC-2 EMC-2 composition (EMC) CTE1 of UF, ppm/° C. 29 29 29 29 29 29 29 29 29 29 29 CTE1 of EMC, ppm/° C. 10 10 10 10 10 10 10 10 10 10 10 Total of CTE1, ppm/° C. 39 39 39 39 39 39 39 39 39 39 39 (CTE1 of EMC)/(CTE1 of UF) 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 Tg of UF, ° C. 110 125 137 136 140 137 160 136 140 137 137 Tg of EMC, ° C. 125 125 125 125 125 125 155 155 155 155 155 (Tg of EMC) − (Tg of UF), ° C. −15 0 12 11 15 12 5 −19 −15 −18 −18 JEDEC Level 3 and G G G G G G G G G G G IR265° C. 5 passes After PCT336hr G G G G G G G G G G G Thermal shock 250 cycles, % 0 0 0 0 0 0 0 0 0 0 0 500 cycles, % 0 0 0 0 0 0 0 0 0 0 0 750 cycles, % 0 0 0 0 0 0 0 0 0 0 0 -
TABLE 5 R. Ex. 1 R. Ex. 2 R. Ex. 3 R. Ex. 4 R. Ex. 5 R. Ex. 6 R. Ex. 7 R. Ex. 8 R. Ex. 9 Underfill composition (UF) UF-9 UF-9 UF-10 UF-9 UF-9 UF-10 UF-1 UF-4 UF-1 Encapsulation resin EMC-2 EMC-4 EMC-4 EMC-5 EMC-6 EMC-6 EMC-1 EMC-1 EMC-2 composition (EMC) CTE1 of UF, ppm/° C. 42 42 28 42 42 28 29 29 29 CTE1 of EMC, ppm/° C. 10 8 8 12 15 15 10 10 10 Total of CTE1, ppm/° C. 52 50 36 54 57 43 39 39 39 (CTE1 of EMC)/(CTE1 of UF) 0.24 0.19 0.29 0.29 0.36 0.54 0.34 0.34 0.34 Tg of UF, ° C. 137 137 137 137 137 137 95 160 95 Tg of EMC, ° C. 155 155 155 155 155 155 125 125 155 (Tg of EMC) − (Tg of UF), ° C. −18 −18 −18 −18 −18 −18 −30 35 −60 JEDEC Level 3 and NG NG NG NG NG NG NG NG NG IR265° C. 5 passes After PCT336hr NG NG G NG NG G NG NG NG Thermal shock 250 cycles, % 50 0 0 50 0 0 10 0 10 500 cycles, % 100 0 0 100 0 0 50 0 50 750 cycles, % — 0 0 — 0 0 100 0 100 -
TABLE 6 R. Ex. R. Ex. R. Ex. R. Ex. R. Ex. R. Ex. R. Ex. R. Ex. R. Ex. R. Ex. 10 11 12 13 14 15 16 17 18 19 Underfill composition (UF) UF-2 UF-3 UF-1 UF-2 UF-3 UF-4 UF-5 UF-6 UF-7 UF-8 Encapsulation resin EMC-2 EMC-2 EMC-3 EMC-3 EMC-3 EMC-3 EMC-3 EMC-3 EMC-3 EMC-3 composition (EMC) CTE1 of UF, ppm/° C. 29 29 29 29 29 29 29 29 29 29 CTE1 of EMC, ppm/° C. 10 10 10 10 10 10 10 10 10 10 Total of CTE1, ppm/° C. 39 39 39 39 39 39 39 39 39 39 (CTE1 of EMC)/(CTE1 of UF) 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 Tg of UF, ° C. 110 125 95 110 125 160 137 136 140 137 Tg of EMC, ° C. 155 155 182 182 182 182 182 182 182 182 (Tg of EMC) − (Tg of UF), ° C. −45 −30 −87 −72 −57 −22 −45 −46 −42 −45 JEDEC Level 3 and NG NG NG NG NG NG NG NG NG NG IR265° C. 5 passes After PCT336hr NG NG NG NG NG NG NG NG NG NG Thermal shock 250 cycles, % 25 0 60 60 0 0 0 0 0 0 500 cycles, % 64 0 100 100 0 0 0 0 0 0 750 cycles, % 100 0 — — 0 0 0 0 0 0 - Referential Examples 10 to 22 in which differences in Tg between the cured products of the underfill and the encapsulation resin compositions were larger than 20° C. showed peeling after the pressure cooker test as shown in Tables 5 and 6. Referential Examples 1, 2, 4 and 5 in which a total of linear expansion coefficients at (Tg-30)° C. exceeded 45 ppm/° C. showed peeling after the reflow process. Referential Example 3 in which a ratio of the linear expansion coefficient of the cured encapsulation resin composition to that of the cured underfill composition was smaller than 0.3 showed peeling after the reflow process. In contrast to these, the devices in Examples 1 to 22 did not show any peeling or cracks, and were resistant to the thermal shock. The composition set of the present invention is therefore suitable for preparing a system-in-package type semiconductor device resistant to heat and thermal shock.
Claims (7)
1. A set of compositions for preparing a system-in-package type semiconductor device, said system-in-package type semiconductor device comprising
a substrate,
a first semiconductor element flip-chip bonded to the substrate,
an underfill part between the first semiconductor element and the substrate,
at least one second semiconductor element placed on the first semiconductor element, and
a resin encapsulation part covering the first semiconductor element, the underfill part and the second semiconductor element,
characterized in that the set of compositions consists of an underfill composition for preparing the underfill part and an encapsulation resin composition for preparing the resin encapsulation part, wherein
1) a cured product of the underfill composition has a glass transition temperature, Tg, which is 100° C. or higher and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by 20° C. or smaller,
2) a total of a linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg-30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg-30)° C. is 42 ppm/° C. or smaller, and
3) a ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.
2. The set according to claim 1 , wherein the underfill composition comprises
(A) an epoxy resin,
(B) a curing agent in such an amount that an equivalent ratio of the epoxy group in the component (A) to a functional group in the component (B) ranges from 0.7 to 1.2, said functional group being reactive with the epoxy group, and
(C) an inorganic filler in an amount of from 50 to 500 parts by weight per 100 parts by weight of the component (A), and
the encapsulating resin composition comprises
(a) a biphenyl aralkyl epoxy resin or triphenyl epoxy resin,
(b) a biphenyl aralkyl phenolic resin or triphenyl phenolic resin in such an amount that an equivalent ratio of the epoxy group in the component (a) to the phenolic hydroxyl group in the component (b) ranges from 0.8 to 1.2, and
(c) an inorganic filler in an amount of from 500 to 1,100 parts by weight per total 100 parts by weight of the components (a) and (b).
3. The set according to claim 2 , wherein the curing agent (B) is an amine curing agent or a peroxide curing agent.
4. The set according to claim 3 , wherein the curing agent (B) is at least one selected from the group consisting of the aromatic amine compounds represented by the following formulas (1), (2), (3) and (4),
5. The set according to claim 2 , wherein the inorganic filler (C) is a spherical silica which is produced by a sol-gel method or a deflagration method and has an average particle size of from 0.1 to 5 μm.
6. The set according to claim 2 , wherein the component (A) is selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and the epoxy resins represented by the following three formulas,
7. A system-in-package type semiconductor device, comprising
a substrate,
a first semiconductor element flip-chip bonded to the substrate,
an underfill part between the first semiconductor element and the substrate,
at least one second semiconductor element placed on the first semiconductor element, and
a resin encapsulation part covering the first semiconductor element, the underfill part and the second semiconductor element, characterized in that
the underfill part and the encapsulation part are composed of a cured products of the underfill composition and the encapsulating resin composition, respectively, of the set according to any one of claims 1 to 6 .
Priority Applications (1)
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US13/289,619 US9018281B2 (en) | 2006-09-14 | 2011-11-04 | Set of resin compositions for preparing system-in-package type semiconductor device |
Applications Claiming Priority (4)
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JP2006-249802 | 2006-09-14 | ||
JP2006249802 | 2006-09-14 | ||
JP2007-232555 | 2007-09-07 | ||
JP2007232555A JP5502268B2 (en) | 2006-09-14 | 2007-09-07 | Resin composition set for system-in-package semiconductor devices |
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US13/289,619 Division US9018281B2 (en) | 2006-09-14 | 2011-11-04 | Set of resin compositions for preparing system-in-package type semiconductor device |
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US20080070054A1 true US20080070054A1 (en) | 2008-03-20 |
Family
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Family Applications (2)
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US11/898,615 Abandoned US20080070054A1 (en) | 2006-09-14 | 2007-09-13 | Set of resin compositions for preparing system-in-package type semiconductor device |
US13/289,619 Active 2028-04-25 US9018281B2 (en) | 2006-09-14 | 2011-11-04 | Set of resin compositions for preparing system-in-package type semiconductor device |
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US13/289,619 Active 2028-04-25 US9018281B2 (en) | 2006-09-14 | 2011-11-04 | Set of resin compositions for preparing system-in-package type semiconductor device |
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US (2) | US20080070054A1 (en) |
JP (1) | JP5502268B2 (en) |
CN (1) | CN103295924B (en) |
TW (1) | TWI445729B (en) |
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Also Published As
Publication number | Publication date |
---|---|
CN103295924A (en) | 2013-09-11 |
US9018281B2 (en) | 2015-04-28 |
US20120074596A1 (en) | 2012-03-29 |
TWI445729B (en) | 2014-07-21 |
JP2008098620A (en) | 2008-04-24 |
TW200821337A (en) | 2008-05-16 |
JP5502268B2 (en) | 2014-05-28 |
CN103295924B (en) | 2016-08-31 |
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