US20070240851A1 - Heat pipe - Google Patents

Heat pipe Download PDF

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Publication number
US20070240851A1
US20070240851A1 US11/309,312 US30931206A US2007240851A1 US 20070240851 A1 US20070240851 A1 US 20070240851A1 US 30931206 A US30931206 A US 30931206A US 2007240851 A1 US2007240851 A1 US 2007240851A1
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US
United States
Prior art keywords
heat
heat pipe
section
reservoir
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/309,312
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English (en)
Inventor
Tay-Jian Liu
Chao-Nien Tung
Chuen-Shu Hou
Ji-Feng Wang
Qian-Hua He
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HE, QIAN-HUA, HOU, CHUEN-SHU, LIU, TAY-JIAN, TUNG, CHAO-NIEN, WANG, JI-FENG
Publication of US20070240851A1 publication Critical patent/US20070240851A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Definitions

  • the present invention relates generally to a heat pipe as heat transfer/dissipating device, and more particularly to a heat pipe which has a heat reservoir for quickly absorbing heat received from an electronic component such as a Central Processing Unit (CPU) to increase the maximum heat transfer capacity and reduce the temperature differential across the length of the heat pipe.
  • CPU Central Processing Unit
  • a heat pipe is generally a vacuum-sealed pipe.
  • a porous wick structure is provided on an inner face of the pipe, and where the pipe is filled with at least a phase changeable working media employed to carry heat.
  • the heat pipe has three sections, namely, an evaporating section, a condensing section and an adiabatic section between the evaporating section and the condensing section.
  • the heat pipe transfers heat from one place to another place mainly by virtue of phase change of the working media taking place therein.
  • the working media is liquid such as alcohol, water and the like.
  • the working media in the evaporating section of the heat pipe is heated up, it evaporates, and a pressure difference is thus produced between the evaporating section and the condensing section in the heat pipe.
  • vapor with high enthalpy flows to the condensing section and condenses there.
  • the condensed liquid reflows to the evaporating section along the wick structure.
  • This evaporating/condensing cycle continues in the heat pipe; consequently, heat can be continuously transferred from the evaporating section to the condensing section. Due to the continual phase change of the working media, the evaporating section is kept at or near the same temperature as the condensing section of the heat pipe.
  • the resultant vapor and the condensed liquid flows along two opposite directions, which reduces the speed of the condensed liquid in returning back to the evaporating section and therefore limits the maximum heat transfer capacity (Qmax) of the heat pipe.
  • Qmax maximum heat transfer capacity
  • the heat pipe often suffers dry-out problem at the evaporating section as the condensed liquid cannot be timely sent back to the evaporating section of the heat pipe.
  • the heat pipe has a high ratio of length to radius so that the heat is dissipated during transmission of the vapor and a part of the vapor prematurely changes into condensed liquid before reaching the condensing section. The prematurely condensed liquid is mixed in the vapor to block transfer of the vapor.
  • the heat pipe has a uniform thickness of the wick structure and a uniform vapor channel for passage of the vapor so that a speed of the vapor transferring from the evaporating section to the condensing section is reduced, whereby the temperature difference ( ⁇ T) between the evaporating section and the condensing section is increased.
  • a conventional method for increasing the maximum heat transfer capacity of the heat pipe is increasing the total thickness of the wick structure of the heat pipe to increase the quantity of the working media contained in the wick structure.
  • the response time of the heat pipe for the liquid at the evaporating section to become the liquid is increased and the temperature difference between the evaporating section and the condensing section is increased accordingly.
  • a conventional method for reducing the temperature difference between the evaporating section and the condensing section is reducing the total thickness of the wick structure of the heat pipe to reduce the quantity of the working media contained in the wick structure.
  • the maximum heat transfer capacity of the heat pipe is reduced accordingly.
  • a heat pipe includes a hollow metal casing.
  • the casing has an evaporating section and a condensing section at respective opposite ends thereof, and an adiabatic section located between the evaporating section and the condensing section.
  • a capillary wick structure is arranged at an inner surface of the hollow metal casing.
  • a sealed heat reservoir is mounted on the evaporating section of the heat pipe to increase heat absorbing area of the heat pipe.
  • the heat pipe is so configured to simultaneously reduce heat resistance and enhance maximum heat transfer capacity of the heat pipe.
  • FIG. 1 is a longitudinally cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention
  • FIG. 2 is a transversely cross-sectional view taken along lines II-II of FIG. 1 ;
  • FIG. 3 is a transversely cross-sectional view of a heat pipe in accordance with a second embodiment of the present invention.
  • FIG. 4 is a transversely cross-sectional view of a heat pipe in accordance with a third embodiment of the present invention.
  • FIG. 5 is a transversely cross-sectional view of a heat pipe in accordance with a fourth embodiment of the present invention.
  • FIG. 6 is a transversely cross-sectional view of a heat pipe in accordance with a fifth embodiment of the present invention.
  • FIGS. 1 and 2 show a heat pipe in accordance with one embodiment of the present invention.
  • the heat pipe has a cylindrical configuration and includes a metal casing 10 made of highly thermally conductive materials such as copper or copper alloys, a first working fluid (not shown) contained in the casing 10 and a first capillary wick structure 12 arranged in an inner surface of the casing 10 .
  • the casing 10 includes an evaporating section 120 at one end, a condensing section 160 at the other end and an adiabatic section 140 arranged between the evaporating section 120 and the condensing section 160 .
  • a sealed heat reservoir 20 is mounted on the evaporating section 120 .
  • a vapor channel 14 is defined along an axial direction of the heat pipe and is located at a center of the casing 10 .
  • the vapor channel 14 is surrounded by an inner surface of the first capillary wick structure 12 so as to guide vapor to flow therein.
  • the heat reservoir 20 has a hollow cylindrical configuration and made of highly thermally conductive materials such as aluminum or copper or copper alloys.
  • the heat reservoir 20 has a bigger radius than that of the heat pipe.
  • the evaporating section 120 of the heat pipe extends through the heat reservoir 20 , thereby to position the heat reservoir 20 thereon.
  • the heat reservoir 20 comprises an outer wall 211 and a pair of lateral sides 221 connecting with two opposite ends of the outer wall 211 to form a sealed chamber.
  • a second capillary wick structure 22 is formed at an inner surface of the heat reservoir 20 and an outer surface of the evaporating section 120 .
  • a second working fluid (not shown) is contained in the heat reservoir 20 .
  • a vapor channel 24 is defined along an axial direction of the heat reservoir 20 and is located at a center of the heat reservoir 20 to guide vapor to flow therein.
  • the heat reservoir 20 is vacuum-exhausted to make the second working fluid easy to evaporate.
  • the heat reservoir 20 mounted on the evaporating section 120 of the heat pipe first absorbs heat from heat resource; the heat is transferred to the second working fluid contained in the heat reservoir 20 whereby the second working fluid evaporates into vapor. The vapor condenses and releases the heat. Then the heat is transferred to the first working fluid contained in the evaporating section 120 so that the first working fluid quickly evaporates into vapor. The generated vapor moves towards and carries the heat simultaneously to the condensing section 160 where the vapor is condensed into liquid after releasing the heat into ambient environment.
  • the heat reservoir 20 has a so large heat absorbing area that the heat from the heat resource can be quickly absorbed by the heat reservoir 20 . The absorbed heat is then quickly transferred to the evaporating section 120 and released at the condensing section 160 , thereby to reduce the heat resistance of the heat pipe and enhance the maximum heat transfer capacity of the heat pipe.
  • a cylinder inner wall (not shown) is formed in the heat reservoir 20 .
  • the inner wall interconnects the two opposite lateral sides 221 .
  • the evaporating section 120 of the heat pipe is inserted into the heat reservoir 20 and is interferentially engaged with the inner wall of the heat reservoir 20 , whereby the heat reservoir 20 is positioned on evaporating section 120 of the heat pipe.
  • the heat reservoir 20 is positioned on the evaporating section 120 of the heat pipe by solder means or glue means.
  • FIG. 3 illustrates a heat pipe according to a second embodiment of the present invention.
  • the heat pipe of the second embodiment is similar to that of the previous first embodiment.
  • a heat reservoir 20 a replaces the heat reservoir 20 of the previous first embodiment.
  • the heat reservoir 20 a has a square cross section.
  • FIG. 4 illustrates a heat pipe according to a third embodiment of the present invention.
  • the heat pipe has a similar structure to the heat pipe of the previous first embodiment.
  • a casing 10 b of the heat pipe replaces the casing 10 of the previous first embodiment.
  • the casing 10 b has a square cross section.
  • FIG. 5 illustrates a heat pipe according to a fourth embodiment of the present invention.
  • the heat pipe has a similar structure to the heat pipe of the previous first embodiment.
  • a heat reservoir 20 c replaces the heat reservoir 20 of the previous first embodiment.
  • the heat reservoir 20 a has a triangular cross section.
  • FIG. 6 illustrates a heat pipe according to a fifth embodiment of the present invention.
  • the heat pipe has a similar structure to the heat pipe of the previous third embodiment.
  • a heat reservoir 20 d replaces the heat reservoir 20 of the previous third embodiment.
  • the heat reservoir 20 a has a square cross section.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US11/309,312 2006-04-14 2006-07-25 Heat pipe Abandoned US20070240851A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200610060306.1 2006-04-14
CNB2006100603061A CN100513973C (zh) 2006-04-14 2006-04-14 热管

Publications (1)

Publication Number Publication Date
US20070240851A1 true US20070240851A1 (en) 2007-10-18

Family

ID=38603727

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/309,312 Abandoned US20070240851A1 (en) 2006-04-14 2006-07-25 Heat pipe

Country Status (2)

Country Link
US (1) US20070240851A1 (zh)
CN (1) CN100513973C (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240852A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with heat reservoirs at both evaporating and condensing sections thereof
US20070240856A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US10139137B1 (en) * 2017-06-20 2018-11-27 The United States Of America As Represented By The Secretary Of The Navy Heat exchanger reactive to internal and external temperatures
US20210325120A1 (en) * 2020-04-15 2021-10-21 Asia Vital Components Co., Ltd. Dual heat transfer structure
CN114018078A (zh) * 2021-11-30 2022-02-08 中国华能集团清洁能源技术研究院有限公司 一种用于工业蒸汽供热疏水废热回收系统及其工作方法
CN114294986A (zh) * 2022-01-13 2022-04-08 广州大学 一种基于气道反向阻流结构的单向热管

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103126381A (zh) * 2011-11-23 2013-06-05 青岛立德热能设备有限公司 安装热管的床垫取暖装置
CN113056157B (zh) * 2019-12-27 2022-08-26 广州力及热管理科技有限公司 薄型热管理组件
CN113340139A (zh) * 2021-07-07 2021-09-03 佛山宇仁智能科技有限公司 一种热壳构件

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3613773A (en) * 1964-12-07 1971-10-19 Rca Corp Constant temperature output heat pipe
US3792318A (en) * 1972-02-01 1974-02-12 Siemens Ag Cooling apparatus for flat semiconductors using one or more heat pipes
US3801446A (en) * 1968-06-05 1974-04-02 Atomic Energy Commission Radioisotope fueled heat transfer system
US3880230A (en) * 1973-06-01 1975-04-29 Isothermics Heat transfer system
US4007777A (en) * 1975-07-02 1977-02-15 Hughes Aircraft Company Switchable heat pipe assembly
US4042757A (en) * 1975-04-10 1977-08-16 Chloride Silent Power Limited Thermo-electric generators
US4857421A (en) * 1988-11-14 1989-08-15 Thermacore, Inc. Alkali metal thermoelectric genreator
US5039351A (en) * 1989-11-17 1991-08-13 Westinghouse Electric Corp. High performance thin film alkali metal thermoelectric device
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5219516A (en) * 1992-06-16 1993-06-15 Thermacore, Inc. Thermionic generator module with heat pipes
US5309457A (en) * 1992-12-22 1994-05-03 Minch Richard B Micro-heatpipe cooled laser diode array
US5579830A (en) * 1995-11-28 1996-12-03 Hudson Products Corporation Passive cooling of enclosures using heat pipes
US6675887B2 (en) * 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3613773A (en) * 1964-12-07 1971-10-19 Rca Corp Constant temperature output heat pipe
US3801446A (en) * 1968-06-05 1974-04-02 Atomic Energy Commission Radioisotope fueled heat transfer system
US3792318A (en) * 1972-02-01 1974-02-12 Siemens Ag Cooling apparatus for flat semiconductors using one or more heat pipes
US3880230A (en) * 1973-06-01 1975-04-29 Isothermics Heat transfer system
US4042757A (en) * 1975-04-10 1977-08-16 Chloride Silent Power Limited Thermo-electric generators
US4007777A (en) * 1975-07-02 1977-02-15 Hughes Aircraft Company Switchable heat pipe assembly
US4857421A (en) * 1988-11-14 1989-08-15 Thermacore, Inc. Alkali metal thermoelectric genreator
US5039351A (en) * 1989-11-17 1991-08-13 Westinghouse Electric Corp. High performance thin film alkali metal thermoelectric device
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5219516A (en) * 1992-06-16 1993-06-15 Thermacore, Inc. Thermionic generator module with heat pipes
US5309457A (en) * 1992-12-22 1994-05-03 Minch Richard B Micro-heatpipe cooled laser diode array
US5579830A (en) * 1995-11-28 1996-12-03 Hudson Products Corporation Passive cooling of enclosures using heat pipes
US6675887B2 (en) * 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240852A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with heat reservoirs at both evaporating and condensing sections thereof
US20070240856A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US10139137B1 (en) * 2017-06-20 2018-11-27 The United States Of America As Represented By The Secretary Of The Navy Heat exchanger reactive to internal and external temperatures
US20210325120A1 (en) * 2020-04-15 2021-10-21 Asia Vital Components Co., Ltd. Dual heat transfer structure
US11598584B2 (en) * 2020-04-15 2023-03-07 Asia Vital Components Co., Ltd. Dual heat transfer structure
CN114018078A (zh) * 2021-11-30 2022-02-08 中国华能集团清洁能源技术研究院有限公司 一种用于工业蒸汽供热疏水废热回收系统及其工作方法
CN114294986A (zh) * 2022-01-13 2022-04-08 广州大学 一种基于气道反向阻流结构的单向热管

Also Published As

Publication number Publication date
CN100513973C (zh) 2009-07-15
CN101055157A (zh) 2007-10-17

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, TAY-JIAN;TUNG, CHAO-NIEN;HOU, CHUEN-SHU;AND OTHERS;REEL/FRAME:017995/0559

Effective date: 20060706

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION