US20070228106A1 - Process and device for form locked joining of two components - Google Patents

Process and device for form locked joining of two components Download PDF

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Publication number
US20070228106A1
US20070228106A1 US11/747,572 US74757207A US2007228106A1 US 20070228106 A1 US20070228106 A1 US 20070228106A1 US 74757207 A US74757207 A US 74757207A US 2007228106 A1 US2007228106 A1 US 2007228106A1
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US
United States
Prior art keywords
component
welding
form locking
radiation
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US11/747,572
Inventor
Frank Brunnecker
Alexander Hofmann
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LPKF Laser and Electronics AG
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Publication of US20070228106A1 publication Critical patent/US20070228106A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1464—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
    • B29C65/1467—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B29C65/1667—Laser beams characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/60—Riveting or staking
    • B29C65/606—Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7829—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being integral with at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
    • B29C66/81411—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined characterised by its cross-section, e.g. transversal or longitudinal, being non-flat
    • B29C66/81421—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined characterised by its cross-section, e.g. transversal or longitudinal, being non-flat being convex or concave
    • B29C66/81423—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined characterised by its cross-section, e.g. transversal or longitudinal, being non-flat being convex or concave being concave
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/843—Machines for making separate joints at the same time in different planes; Machines for making separate joints at the same time mounted in parallel or in series
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B29K2995/0027—Transparent for light outside the visible spectrum
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the invention relates to a process and a device for form locked joining of two components and to a device for performing the process.
  • a possibility to establish disengageable connections is using threaded connections.
  • the disadvantage of this process is that the housing then has to be provided with a thread.
  • a threaded metal insert is therefore often integrated during the injection molding process in order to obtain a load bearing thread. Consequently, manufacturing a respective connection is very expensive.
  • non disengageable connection techniques e.g. encasing the printed circuit board in the housing or so-called hot caulking are being used.
  • a rod shaped component briefly also called pin
  • the pin is run through a hole in the printed circuit board, so that it rests on a shoulder.
  • the pin protruding beyond the thickness of the printed circuit board is deformed under thermal energy, so that the pin forms a rivet head for form locked fixation of the printed circuit board.
  • a respective process using ultrasound energy for generating the necessary heat is described in DE 4215041 C3 (Siemens AG).
  • JP 62064528 A Toyota Motor Corp.
  • radiation energy is used to achieve the plastic state of one of the joining partners.
  • the hot caulking processes according to the state of the art have the disadvantage that forming the rivet head is being performed through a contact tool. When using such processes for hot caulking of plastic housings or printed circuit boards, this bears the risk of material sticking to the shaping tool.
  • the media tight closing of the housing is an important part of the value creation process of mechatronic systems.
  • laser through transmission welding is industrially established.
  • two joining partners which can be welded through melting, are being combined, one of which has a high degree of optical transmission for the wavelength of the welding laser that has been used, and however, the other joining partner strongly absorbs this wavelength.
  • the welding radiation can transmit through the joining partner facing it and is subsequently absorbed at the contact surface of the two components.
  • the absorbing joining partner is being heated until both joining partners are melted in their contact area through heat conduction.
  • the object of the present invention is to provide a reliable and error tolerant process for form locking connection of two components, which does not have the disadvantages of the current state of the art processes. Furthermore, it is part of the object of the invention to perform the form locking connection of two components simultaneously with the adhesive bonding of a third component, in order to integrate two process steps, and to thereby achieve a cost saving shortening of the process chain.
  • a third component in order to achieve the object, it is suggested according to the invention, to create the form locking connection between a first and a second component through plastic deformations of the first component by a third component.
  • the third component thereby, does not have to be in contact with the second component, it is rather being used to plastically deform the first component, so that a form locking connection between the first and the second component can occur.
  • the third component preferably enters into an adhesive bond with the first component, while establishing the form locking connection between the first and the second component.
  • the invention is characterized in that the plastic deformation to achieve form locking is generated through a third component participating in the joining process, which by itself enters into an adhesive bond with one of the joining partners.
  • a respective process is used e.g. for mounting printed circuit boards in a housing made from thermoplastic plastic material.
  • the advantage of this procedure is that the tool, imparting the force for the plastic deformation, is not in direct contact with the plasticized component, so that an unwanted material adhesion on the tool can be avoided.
  • the invention thereby utilizes the state of the art trough transmission welding process, in order to create the adhesive bond between the first and the third respective component, each weldable through melting, preferably made from thermoplastic plastic material, and to provide the energy to transform the first component into a state, where it can be plastically deformed.
  • the invention is characterized in that, the first and the third component perform a feed motion relative to each other under the influence of a compression force during the welding process, according to the explanations in the state of the art, and that this feed motion is being used in order to produce the plastic deformation of the first component necessary for the form locking connection of the first and second component.
  • FIG. 1 is a schematic sectional view of a portion of three components to be connected to each other in a first process step according to a first embodiment of the invention
  • FIG. 2 is a schematic sectional view according to FIG. 1 in a second process step
  • FIG. 3 is a schematic sectional view of three components to be connected to each other according to a second embodiment of the invention.
  • FIG. 1 A first exemplary embodiment of the invention is illustrated in FIG. 1 .
  • the radiation absorbing joining partner ( 1 ) is depicted as a cutout, e.g. from an electronics housing.
  • a pass-through hole ( 5 ) of the component ( 2 ) to be connected in a form locking manner, e.g. a printed circuit board, a column shaped riser ( 4 ), also called a pin, reaches through in the non joined state.
  • An additional component ( 3 ) is placed onto this pin, initially in a loose manner, which is sufficiently transparent for the imparted welding radiation ( 6 ).
  • the radiation transmitting component ( 3 ) has a concave cross section ( 7 ) in the contact area with the pin, which supports the creation of the material flow of the absorbing component ( 1 ) during the plastic deformation.
  • the radiation transmitting component is pressed down onto the pin ( 4 ) through a down holder ( 10 ) mounted coaxial with the welding radiation. After the pin ( 4 ) has been exposed to the welding radiation ( 6 ) for a certain amount of time, and has been imparted with the compression force through the down holder ( 10 ), a plastic deformation of the pin ( 4 ) with a lateral material flow occurs, so that the assembly shown in FIG. 2 is created at the end of the process.
  • material of the pin ( 4 ) is plasticized through the heating of the welding radiation, until it is displaced laterally under the influence of the compression force, so that cooler material layers of the pin are exposed again to the radiation and can be heated.
  • the down holder element ( 10 ) can perform a constant feed motion in the direction of the absorbing joining partner ( 1 ).
  • the concave indentation in the transmissive joining partner ( 7 ) supports the formation of the rivet head ( 8 ), necessary for the form locking connection, during the feed motion by determining the flow direction of the material.
  • the joining partner ( 2 ) to be joined through form locking is connected in a solid manner with the absorbing joining partner ( 1 ). Since the pin ( 4 ) is made from laser absorbing material, however, the initially loosely placed component ( 3 ) transmits the welding radiation ( 6 ), heat generation and adhesively bonded welding finally occurs at the contact surface of the two components.
  • FIG. 3 A particularly advantageous embodiment of the process according to the invention is shown in FIG. 3 before the joining process.
  • the transmissive component which produces the plastic deformation of the pin ( 4 )
  • the transmissive component is a component of the complete assembly at the same time, which has further functions besides creating form locking.
  • the cover of an electronics housing ( 13 ) which is supposed to close the housing tight against media, can simultaneously be used for forming the rivet head.
  • the radiation field of the welding radiation ( 6 ) is run along a welding bar ( 11 ), as described in the state of the art literature.
  • the control means of the device for performing the process allow that, besides the welding bar ( 11 ), also the pin ( 4 ) is radiated within a short time interval from the radiation of the welding bar.
  • a compression force which is imparted along the circumferential welding rim with the assistance of a compression frame ( 12 ) onto the component cover ( 13 ) and the welding rim ( 11 )
  • a feed motion of the compression frame ( 12 ) and the housing cover ( 13 ) occurs in the direction of the radiation absorbing joining partner ( 1 ).
  • the process of media tight welding is decoupled from the creation of the hot caulk with respect to the geometric tolerances of the components.
  • the third component ( 13 ) were directly used for form locking mounting of the printed circuit board ( 2 )
  • typical manufacturing tolerances of the components could cause the housing cover ( 13 ) to already make contact with the printed circuit board, before the welding rim ( 11 ) has been melted down by the desired height.
  • the welding rim ( 11 ) and the pin ( 4 ) could already be melted down by a predetermined value, so that the entire joining process is terminated without the printed circuit board ( 2 ) being firmly pressed against the lower joining partner ( 1 ).
  • the creation of form locking according to the invention through the displaced material of the pin ( 4 ) as a component of the lower joining partner eliminates this problem.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Of Plates (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.

Description

    FIELD OF THE INVENTION
  • The invention relates to a process and a device for form locked joining of two components and to a device for performing the process.
    • BACKGROUND OF THE INVENTION
  • In many mechatronic systems, e.g. in automotive sensorics, there is a requirement to integrate printed circuit boards into a housing. Since the electronics have to interface via connectors or other sensoric interfaces with the system periphery, the printed circuit board has to be fixated in the surrounding housing in a defined position. For accomplishing this object, a multitude of solutions is available in the state of the art.
  • A possibility to establish disengageable connections is using threaded connections. The disadvantage of this process is that the housing then has to be provided with a thread. When using plastic housings, a threaded metal insert is therefore often integrated during the injection molding process in order to obtain a load bearing thread. Consequently, manufacturing a respective connection is very expensive.
  • Among the non disengageable connection techniques, e.g. encasing the printed circuit board in the housing or so-called hot caulking are being used. During hot caulking, a rod shaped component, briefly also called pin, is run through a hole in the printed circuit board, so that it rests on a shoulder. Subsequently, the pin protruding beyond the thickness of the printed circuit board is deformed under thermal energy, so that the pin forms a rivet head for form locked fixation of the printed circuit board. A respective process using ultrasound energy for generating the necessary heat is described in DE 4215041 C3 (Siemens AG). A similar process is disclosed in JP 62064528 A (Toyota Motor Corp.), in which radiation energy is used to achieve the plastic state of one of the joining partners. The hot caulking processes according to the state of the art, however, have the disadvantage that forming the rivet head is being performed through a contact tool. When using such processes for hot caulking of plastic housings or printed circuit boards, this bears the risk of material sticking to the shaping tool.
  • Besides mounting the printed circuit board in the housing, also the media tight closing of the housing is an important part of the value creation process of mechatronic systems. As a process which creates particularly high quality welded connections, laser through transmission welding is industrially established. In this process, two joining partners, which can be welded through melting, are being combined, one of which has a high degree of optical transmission for the wavelength of the welding laser that has been used, and however, the other joining partner strongly absorbs this wavelength. In an overlapping assembly of both joining partners, the welding radiation can transmit through the joining partner facing it and is subsequently absorbed at the contact surface of the two components. The absorbing joining partner is being heated until both joining partners are melted in their contact area through heat conduction. In order to facilitate heat conduction between the joining partners, these are loaded with a compressing force. Since the widely used plastic materials have low heat conductivity, the induced welding energy remains in the joining zone for a certain period of time, depending on how the process is performed, so that material, which is still soft, mostly from the absorbing joining partner can be displaced out of the joining plane under the influence of the compression force. Under continued application of a compression force, the joining partners thus can perform a relative motion towards each other, in order to compensate for possible gaps in the weld. A respective process is disclosed e.g. in DE 102004004985 A1 (Laserquipment AG). The process described therein, like other current processes for closing housings, does not provide for a possibility to mount the enclosed printed circuit board, so that separate precursory process steps are necessary, which is disadvantageous.
    • SUMMARY OF THE INVENTION
  • The object of the present invention is to provide a reliable and error tolerant process for form locking connection of two components, which does not have the disadvantages of the current state of the art processes. Furthermore, it is part of the object of the invention to perform the form locking connection of two components simultaneously with the adhesive bonding of a third component, in order to integrate two process steps, and to thereby achieve a cost saving shortening of the process chain.
  • In order to achieve the object, it is suggested according to the invention, to create the form locking connection between a first and a second component through plastic deformations of the first component by a third component. The third component, thereby, does not have to be in contact with the second component, it is rather being used to plastically deform the first component, so that a form locking connection between the first and the second component can occur. The third component preferably enters into an adhesive bond with the first component, while establishing the form locking connection between the first and the second component.
  • The invention is characterized in that the plastic deformation to achieve form locking is generated through a third component participating in the joining process, which by itself enters into an adhesive bond with one of the joining partners. A respective process is used e.g. for mounting printed circuit boards in a housing made from thermoplastic plastic material.
  • The advantage of this procedure is that the tool, imparting the force for the plastic deformation, is not in direct contact with the plasticized component, so that an unwanted material adhesion on the tool can be avoided. The invention thereby utilizes the state of the art trough transmission welding process, in order to create the adhesive bond between the first and the third respective component, each weldable through melting, preferably made from thermoplastic plastic material, and to provide the energy to transform the first component into a state, where it can be plastically deformed. Furthermore, the invention is characterized in that, the first and the third component perform a feed motion relative to each other under the influence of a compression force during the welding process, according to the explanations in the state of the art, and that this feed motion is being used in order to produce the plastic deformation of the first component necessary for the form locking connection of the first and second component.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic sectional view of a portion of three components to be connected to each other in a first process step according to a first embodiment of the invention,
  • FIG. 2 is a schematic sectional view according to FIG. 1 in a second process step, and
  • FIG. 3 is a schematic sectional view of three components to be connected to each other according to a second embodiment of the invention.
    • PREFERRED EMBODIMENTS OF THE INVENTION
  • A first exemplary embodiment of the invention is illustrated in FIG. 1. The radiation absorbing joining partner (1) is depicted as a cutout, e.g. from an electronics housing. Through a pass-through hole (5) of the component (2) to be connected in a form locking manner, e.g. a printed circuit board, a column shaped riser (4), also called a pin, reaches through in the non joined state. An additional component (3) is placed onto this pin, initially in a loose manner, which is sufficiently transparent for the imparted welding radiation (6). The radiation transmitting component (3) has a concave cross section (7) in the contact area with the pin, which supports the creation of the material flow of the absorbing component (1) during the plastic deformation. The radiation transmitting component is pressed down onto the pin (4) through a down holder (10) mounted coaxial with the welding radiation. After the pin (4) has been exposed to the welding radiation (6) for a certain amount of time, and has been imparted with the compression force through the down holder (10), a plastic deformation of the pin (4) with a lateral material flow occurs, so that the assembly shown in FIG. 2 is created at the end of the process. During the joining process, material of the pin (4) is plasticized through the heating of the welding radiation, until it is displaced laterally under the influence of the compression force, so that cooler material layers of the pin are exposed again to the radiation and can be heated. Once the rate of material displacement is in equilibrium with the rate of plasticization through the welding radiation, the down holder element (10) can perform a constant feed motion in the direction of the absorbing joining partner (1). The concave indentation in the transmissive joining partner (7) supports the formation of the rivet head (8), necessary for the form locking connection, during the feed motion by determining the flow direction of the material. After a sufficient amount of material has been displaced for forming the rivet head, the joining partner (2) to be joined through form locking, is connected in a solid manner with the absorbing joining partner (1). Since the pin (4) is made from laser absorbing material, however, the initially loosely placed component (3) transmits the welding radiation (6), heat generation and adhesively bonded welding finally occurs at the contact surface of the two components.
  • A particularly advantageous embodiment of the process according to the invention is shown in FIG. 3 before the joining process. Hereby, the transmissive component, which produces the plastic deformation of the pin (4), is a component of the complete assembly at the same time, which has further functions besides creating form locking. Thus in the sense of this functional integration, e.g. the cover of an electronics housing (13), which is supposed to close the housing tight against media, can simultaneously be used for forming the rivet head. Thereby, the radiation field of the welding radiation (6) is run along a welding bar (11), as described in the state of the art literature. The control means of the device for performing the process allow that, besides the welding bar (11), also the pin (4) is radiated within a short time interval from the radiation of the welding bar. Under the influence of the compression force, which is imparted along the circumferential welding rim with the assistance of a compression frame (12) onto the component cover (13) and the welding rim (11), according to the process described in the state of the art, a feed motion of the compression frame (12) and the housing cover (13) occurs in the direction of the radiation absorbing joining partner (1). Through the alternating irradiation of the welding rim (11) and the pin (4), a plasticization of the pin (4) occurs, which can then form the rivet head necessary for form locking through material displacement, as described in the above embodiment. Between the welding rim (11) and the housing cover (13), as well as between the pin and the housing cover (13), an adhesive bond occurs, while a form locking connection was created between the pin (4) as a component of the lower joining partner (1), and the printed circuit board (2). The adhesive bond between the pin (4) and the housing cover (13) increases the mechanical stiffness of the entire assembly, while the circumferential weld closes the housing tight against media. It is particularly advantageous in this embodiment of the invention, that the process of media tight welding is decoupled from the creation of the hot caulk with respect to the geometric tolerances of the components. If the third component (13) were directly used for form locking mounting of the printed circuit board (2), typical manufacturing tolerances of the components could cause the housing cover (13) to already make contact with the printed circuit board, before the welding rim (11) has been melted down by the desired height. On the other hand, the welding rim (11) and the pin (4) could already be melted down by a predetermined value, so that the entire joining process is terminated without the printed circuit board (2) being firmly pressed against the lower joining partner (1). The creation of form locking according to the invention through the displaced material of the pin (4) as a component of the lower joining partner, however, eliminates this problem.
    • REFERENCE NUMERALS
    • 1 radiation absorbing joining partner
    • 2 joining partner to be connected through form locking
    • 3 radiation transmitting joining partner
    • 4 pin
    • 5 pass-through hole for pin
    • 6 welding radiation cone
    • 7 shape of rivet head in third joining partner
    • 8 plastically deformed pin (rivet head)
    • 9 area of adhesive bond joint
    • 10 down holder tool (punctiform)
    • 11 welding rim
    • 12 down holder tool (shaped according to contour of seam)
    • 13 housing cover

Claims (8)

1. A process for form locking joining of two components, comprising the steps of:
positioning of a first and second component relative to each other, which are to be joined through form locking,
welding the first of the said components with a third component by a through transmission welding process, and
loading the third component with a joining force during the through transmissions welding process, wherein through a feed motion of the third component during the through transmission welding process relative to the first component, material is displaced from plastically deformable areas of the first component, so that the displaced material creates a form locking connection between the first and the second component.
2. The process according to claim 1, wherein during the form locking joining process, in addition, areas of the first and the third component are welded together by adhesive bonding, whose plastic deformation does not create form locking with the second component.
3. The process according to claim 1, wherein the first and the third components are made from thermoplastic plastic material.
4. The process according to claim 1, wherein the first component is an electronics housing, and the third component is a cover for this housing.
5. The process according to claim 1, wherein the second component is a printed circuit board.
6. The process according to claim 1, wherein a radiation used for plasticizing and welding the components is a laser radiation in a range of near infrared wavelength.
7. The process according to claim 1, wherein a radiation, which is used for plasticizing and welding the components, is a polychromatic radiation, generated by a halogen- or short arc lamp.
8. A device for creating form locking between a first and a second component, simultaneously creating an adhesive bond of the first component with a third component, comprising:
a radiation source for creating electromagnetic welding radiation
means for focusing the welding radiation into a welding radiation field,
means for positioning the welding radiation field relative to the components to be joined,
means for loading the first and the third component with a joining force, which enabling a feed motion, and
control means of the device enabling an alternating irradiation of material sections, which are to enter into an adhesive bond between the first and the third component, without creating form locking with the second component, and sections, which are to enter an adhesive bond between the first and the third component, and additionally a form locking connection between the first and the second component through plastic deformation.
US11/747,572 2005-11-21 2007-05-11 Process and device for form locked joining of two components Abandoned US20070228106A1 (en)

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DE102005000160A DE102005000160B4 (en) 2005-11-21 2005-11-21 Method for the positive connection of two components

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US20070204954A1 (en) 2007-09-06
DE102005000160A1 (en) 2007-05-24
US8759710B2 (en) 2014-06-24

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