US20070157627A1 - Projection apparatus provided with a heatsink - Google Patents

Projection apparatus provided with a heatsink Download PDF

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Publication number
US20070157627A1
US20070157627A1 US11/603,171 US60317106A US2007157627A1 US 20070157627 A1 US20070157627 A1 US 20070157627A1 US 60317106 A US60317106 A US 60317106A US 2007157627 A1 US2007157627 A1 US 2007157627A1
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US
United States
Prior art keywords
heat conduction
conduction member
section
cooling fin
cold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/603,171
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English (en)
Inventor
Nien-Hui Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CORECTRONIC Corp
Aixin Technologies LLC
Original Assignee
Coretronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coretronic Corp filed Critical Coretronic Corp
Assigned to CORECTRONIC CORPORATION reassignment CORECTRONIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, NIEN-HUI
Publication of US20070157627A1 publication Critical patent/US20070157627A1/en
Assigned to AIXIN TECHNOLOGIES, LLC reassignment AIXIN TECHNOLOGIES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CORETRONIC CORPORATION
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00—Details of colour television systems
    • H04N9/12—Picture reproducers
    • H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
    • H04N9/3141—Constructional details thereof
    • H04N9/3144—Cooling systems

Definitions

  • the invention relates to a projection apparatus, and more particularly to a heatsink for use in the projection apparatus in order to dissipate heat generated due to operation of the projection apparatus.
  • FIG. 1 is a top sectional view showing a conventional projection apparatus 2 and includes a light source 8 , an optical engine 6 and a heatsink 4 .
  • the optical engine 6 includes a light valve 602 receiving the light rays emitted from the light source 8 continuously during operation of the conventional projection apparatus and becomes hot intensively. In case, the intensive heat of the light valve 602 is not properly dissipated, the light valve 602 is tending to be ruined.
  • the heatsink 4 is used to dissipate the intensive heat from the light valve 602 .
  • the heatsink 4 includes a cooling fin unit 402 mounted directly onto the light valve 602 so as to cause a free convection to lower the temperature of the outer surface of the light valve 602 .
  • a fan 404 is employed to enhance the convection in order to lower the ambient temperature of the cooling fin unit 402 .
  • Such type of heat dissipation method is known as “force convection”.
  • the light valve 602 becomes intensively hot and the fan 404 provides a limited heat dissipating effect.
  • the light valve 602 has a temperature of 65° C. at the outer surface thereof while a portion of the cooling fin unit 402 in contact with the outer surface of the light valve 602 has 53° C.
  • the environmental temperature is 35° C.
  • the rotation power of the fan 404 is increased.
  • the increase in the rotation power generates noise in addition to extra production cost.
  • utilization of the fan 404 eliminates the problems encountered by the projection apparatus having 3600 lumens below. Utilization the fan 404 cannot solve the heat dissipation problems encountered by the projection apparatus having 3600 lumens and above.
  • the object of the present invention to provide a heatsink for use in a projection apparatus.
  • the heatsink has a structure to effectively dissipate the intensive heat of the light valve generated during operation of the projection apparatus.
  • a heatsink for cooling a light valve and includes: a heat conduction member having a first section for coupling to the light valve and a second section; a thermoelectric cooler having a cold end connected to the second section of the heat conduction member and a hot end; a first cooling fin unit connected to the hot end of the thermoelectric cooler; and a fan disposed adjacent to the second section of the heat conduction member and the first cooling fin unit for generating an airflow in order to lower temperature within the heatsink.
  • a projection apparatus in a second aspect of the present invention, includes: an optical engine including a light valve; and a heatsink.
  • the heatsink includes: a heat conduction member having a first section coupled to the light valve and a second section, a thermoelectric cooler having a cold end connected to the second section of the heat conduction member and a hot end, a first cooling fin unit connected to the hot end of the thermoelectric cooler, and a fan disposed adjacent to the second section of the heat conduction member and the first cooling fin unit for generating an airflow in order to lower temperature within the projection apparatus.
  • FIG. 1 is a top sectional view showing a conventional projection apparatus with a heatsink
  • FIG. 2 is a top sectional view showing the first embodiment of a projection apparatus of the present invention
  • FIG. 3 is a fragmentary sectional view showing the second embodiment of the projection apparatus of the present invention.
  • FIG. 4 is a fragmentary sectional view showing the third embodiment of the projection apparatus of the present invention.
  • FIG. 5 is a fragmentary sectional view showing the fourth embodiment of the projection apparatus of the present invention.
  • FIG. 6 is a fragmentary sectional view showing the fifth embodiment of the present invention.
  • FIG. 7 is a fragmentary sectional view showing a thermoelectric cooler employed in the heatsink of the projection apparatus according to the present invention.
  • FIG. 2 is a top sectional view showing the first embodiment of a projection apparatus 30 of the present invention, and includes a light source 38 , an optical engine 34 and a heatsink 32 .
  • the light source 38 is capable of generating light rays for the optical engine 34 .
  • the optical engine 34 includes a projection lens 37 and a light valve 36 that converts the light rays into image rays so that the projection lens 37 projects the image rays as an image onto a distal screen (not shown).
  • the projection apparatus 30 in this embodiment is a Digital Light Processing projector while the light valve 36 is a Digital Micromirror Device.
  • the heatsink 32 includes a heat conduction member 40 , a thermoelectric cooler 42 , a first cooling fin unit 44 and a fan 46 .
  • the heat conduction member 40 has a first section 4002 coupled to the light valve 36 and a second section 4004 .
  • a cooling element serves as the heat conduction member 40 in the first embodiment.
  • the thermoelectric cooler 42 has a cold end 4202 connected to the second section 4004 of the heat conduction member 40 and a hot end 4204 .
  • the first cooling fin unit 44 is connected to the hot end 4204 of the thermoelectric cooler 42 . Under this condition, convection is caused so as to guide the intensive heat from the light valve 36 toward the first cooling fin unit 44 when the projection apparatus 30 is under operation.
  • the light valve 36 and the thermoelectric cooler 42 are mounted on the same side of the heat conduction member 40 .
  • the thermoelectric cooler 42 includes a cold insulation layer 4212 defining the cold end 4202 , a cold metal layer 4214 , a semiconductor layer 4215 , a hot insulation layer 4216 defining the hot end 4204 , and a hot metal layer 4218 which are arranged horizontally.
  • the cold and hot insulation layers 4212 4216 are disposed respectively outboard to the cold and hot metal layers 4214 , 4218 , which sandwich the semiconductor layer 4215 therebetween.
  • the semiconductor layer 4215 preferably includes a plurality of vertically extending N-type semiconductor sections 82 and a plurality of vertically extending P-type semiconductor sections 84 . Each P-type semiconductor section 84 is disposed between adjacent pair of the N-type semiconductor sections 82 .
  • the cold and hot insulation layers 4212 , 4216 are preferably made from a ceramic material.
  • the thermoelectric cooler 42 When the thermoelectric cooler 42 is powered on, the electrons flow through the P-type sections 84 towards the N-type sections 82 in order to absorb the heat from the cold end toward the hot end. The heat is absorbed or convection is caused whenever the electrons pass through a set of N-type semiconductor section 82 and P-type semiconductor section 84 . It is noted that some dissipation paste is applied onto the cold and hot insulation layers 4212 , 4216 and also on other layers in order to enhance the smooth convection.
  • the fan 46 is disposed adjacent to the second section 4004 of the heat conduction member 40 and the first cooling fin unit 44 for generating an airflow in order to lower temperature within the projection apparatus. In each embodiment of the present invention, the fan 46 exhausts or blows the heat effectively from the heat conduction member 40 and the first cooling fin unit 44 .
  • the heat generated at the light valve 36 due to operation of the projection apparatus of the present invention is guided by the heat conduction member 40 toward the thermoelectric cooler 42 , and is later passed toward the first cooling fin unit 44 , thereby preventing the temperature of the outer surface of the light valve 36 from being raised. Since the first fin unit 44 has a large total outer surface, the heat is dissipated effectively into the ambient surrounding. In addition, the presence of the fan 46 enhances the heat dissipation ability.
  • FIG. 3 is a fragmentary sectional view showing the second embodiment of the present invention.
  • the second embodiment has the structure similar to the previous embodiment, except in the heat conduction member 40 .
  • the heat conduction member 40 of the second embodiment preferably includes a second cooling fin unit 50 coupled to the light valve 36 and the cooling fins 51 extending outwardly from the second cooling fin unit 50 .
  • the heat generated at the light valve 36 is guided by the second cooling fin unit 50 to the thermoelectric cooler 42 , which is latter guided toward the first cooling fin unit 44 .
  • the fan 46 cools down the first and second fin units 44 and 50 .
  • FIG. 4 is a fragmentary sectional view showing the third embodiment of the present invention, and has the structure similar to the second embodiment, except in the second cooling fin unit 50 .
  • a first heat pipe 52 is embedded within the second cooling fin unit 50 in such a manner to extend through the first and second sections 4002 , 4004 thereof. The employment of the first heat pipe 52 accelerates the convection from the light valve 36 toward the thermoelectric cooler 42 .
  • FIG. 5 is a fragmentary sectional view showing a the fourth embodiment of the present invention and has the structure similar to the first embodiment except in the heat conduction member 40 .
  • the heat conduction member 40 includes a third cooling fin unit 60 coupled to the light valve 36 , a fourth cooling fin unit 64 connected to the cold end 4202 of the thermoelectric cooler 42 , and a second heat pipe 62 that is interposed between and that has two opposite ends connected to the third and fourth cooling fin units 60 , 64 respectively.
  • the third and fourth cooling fin units 60 , 64 respectively define the first and second sections 4002 , 4004 of the heat conduction member 40 .
  • FIG. 6 is a fragmentary sectional view showing the fifth embodiment of the present invention and has the structure similar to the first embodiment except in the heat conduction member 40 .
  • the heat conduction member 40 is a third heat pipe 70 having two distal sections respectively defining the first and second sections, which are respectively connected to the light valve 36 , and the thermoelectric cooler 42 .
  • the employment of the third heat pipe 70 quickens the convection from the light valve 36 toward the thermoelectric cooler 42 and later toward the first fin unit 44 .
  • the fan 46 cools down the first fin unit 44 .

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Projection Apparatus (AREA)
US11/603,171 2006-01-10 2006-11-22 Projection apparatus provided with a heatsink Abandoned US20070157627A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW095100958A TW200727067A (en) 2006-01-10 2006-01-10 Projector and heat dissipation apparatus thereof
TW95100958 2006-01-10

Publications (1)

Publication Number Publication Date
US20070157627A1 true US20070157627A1 (en) 2007-07-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
US11/603,171 Abandoned US20070157627A1 (en) 2006-01-10 2006-11-22 Projection apparatus provided with a heatsink

Country Status (2)

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US (1) US20070157627A1 (enrdf_load_stackoverflow)
TW (1) TW200727067A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070025107A1 (en) * 2005-06-08 2007-02-01 Martin Kavanagh Heat transfer apparatus
US20070139887A1 (en) * 2005-12-21 2007-06-21 Premier Image Technology Corporation Portable projector using an LED and related heat dissipating system
US20090046425A1 (en) * 2007-08-09 2009-02-19 Martin Kavanagh Heat transfer apparatus
CN101989030A (zh) * 2010-07-19 2011-03-23 深圳雅图数字视频技术有限公司 Lcos投影机
US20140085612A1 (en) * 2012-09-27 2014-03-27 Coretronic Corporation Illumination system and projection apparatus
US20170302895A1 (en) * 2016-04-18 2017-10-19 Panasonic Intellectual Property Management Co., Ltd. Cooling device and projection image display device
US20200081333A1 (en) * 2018-09-07 2020-03-12 Coretronic Corporation Projection device
US20230129185A1 (en) * 2021-03-08 2023-04-27 Shenzhen Leaflife Tech. Co., Ltd. Semiconductor light source hair removal device with optimized heat dissipation

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405026B (zh) 2009-07-29 2013-08-11 Qisda Corp 投影機及其鏡頭
JP2011033747A (ja) * 2009-07-31 2011-02-17 Seiko Epson Corp プロジェクター、プログラム、情報記憶媒体および冷却制御方法
CN112711163A (zh) 2019-10-25 2021-04-27 台达电子工业股份有限公司 投影装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6447121B1 (en) * 1999-05-17 2002-09-10 Samsung Electronics, Co., Ltd. Reflection type projector
US6711904B1 (en) * 2003-03-06 2004-03-30 Texas Instruments Incorporated Active thermal management of semiconductor devices
US20050012905A1 (en) * 2003-07-17 2005-01-20 Kenichi Morinaga Projector
US6880346B1 (en) * 2004-07-08 2005-04-19 Giga-Byte Technology Co., Ltd. Two stage radiation thermoelectric cooling apparatus
US20050126184A1 (en) * 2003-12-12 2005-06-16 Cauchy Matt J. Thermoelectric heat pump with direct cold sink support
US20060009749A1 (en) * 2004-02-19 2006-01-12 Weckwerth Mark V Efficient diffuse light source assembly and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6447121B1 (en) * 1999-05-17 2002-09-10 Samsung Electronics, Co., Ltd. Reflection type projector
US6711904B1 (en) * 2003-03-06 2004-03-30 Texas Instruments Incorporated Active thermal management of semiconductor devices
US20050012905A1 (en) * 2003-07-17 2005-01-20 Kenichi Morinaga Projector
US20050126184A1 (en) * 2003-12-12 2005-06-16 Cauchy Matt J. Thermoelectric heat pump with direct cold sink support
US20060009749A1 (en) * 2004-02-19 2006-01-12 Weckwerth Mark V Efficient diffuse light source assembly and method
US6880346B1 (en) * 2004-07-08 2005-04-19 Giga-Byte Technology Co., Ltd. Two stage radiation thermoelectric cooling apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070025107A1 (en) * 2005-06-08 2007-02-01 Martin Kavanagh Heat transfer apparatus
US7988301B2 (en) 2005-06-08 2011-08-02 Digital Projection Limited Heat transfer apparatus
US20070139887A1 (en) * 2005-12-21 2007-06-21 Premier Image Technology Corporation Portable projector using an LED and related heat dissipating system
US20090046425A1 (en) * 2007-08-09 2009-02-19 Martin Kavanagh Heat transfer apparatus
US7796383B2 (en) * 2007-08-09 2010-09-14 Digital Protection Limited Heat transfer apparatus
CN101989030A (zh) * 2010-07-19 2011-03-23 深圳雅图数字视频技术有限公司 Lcos投影机
US20140085612A1 (en) * 2012-09-27 2014-03-27 Coretronic Corporation Illumination system and projection apparatus
US9261760B2 (en) * 2012-09-27 2016-02-16 Coretronic Corporation Projection apparatus having illumination system and associated ion fan
US20170302895A1 (en) * 2016-04-18 2017-10-19 Panasonic Intellectual Property Management Co., Ltd. Cooling device and projection image display device
US10057552B2 (en) * 2016-04-18 2018-08-21 Panasonic Intellectual Property Management Co., Ltd. Cooling device and projection image display device
US20200081333A1 (en) * 2018-09-07 2020-03-12 Coretronic Corporation Projection device
US10824061B2 (en) * 2018-09-07 2020-11-03 Coretronic Corporation Projection device applying heat dissipating module with a better heat dissipating effect
US20230129185A1 (en) * 2021-03-08 2023-04-27 Shenzhen Leaflife Tech. Co., Ltd. Semiconductor light source hair removal device with optimized heat dissipation

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Publication number Publication date
TWI306983B (enrdf_load_stackoverflow) 2009-03-01
TW200727067A (en) 2007-07-16

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AS Assignment

Owner name: CORECTRONIC CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HSU, NIEN-HUI;REEL/FRAME:018632/0437

Effective date: 20061108

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: AIXIN TECHNOLOGIES, LLC, DELAWARE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CORETRONIC CORPORATION;REEL/FRAME:027547/0904

Effective date: 20111216