US20070128994A1 - Electroplated abrasive tools, methods, and molds - Google Patents

Electroplated abrasive tools, methods, and molds Download PDF

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Publication number
US20070128994A1
US20070128994A1 US11/292,938 US29293805A US2007128994A1 US 20070128994 A1 US20070128994 A1 US 20070128994A1 US 29293805 A US29293805 A US 29293805A US 2007128994 A1 US2007128994 A1 US 2007128994A1
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Prior art keywords
mold
abrasive particles
substrate
pattern
tool
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Abandoned
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US11/292,938
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English (en)
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Chien-Min Sung
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Individual
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Individual
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Priority to US11/292,938 priority Critical patent/US20070128994A1/en
Priority to PCT/US2006/046029 priority patent/WO2007120224A2/en
Priority to CNA2006800521572A priority patent/CN101336147A/zh
Priority to TW095144571A priority patent/TW200800504A/zh
Publication of US20070128994A1 publication Critical patent/US20070128994A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Definitions

  • the present invention relates generally to electroplated abrasive tools and methods and molds for making electroplated abrasive tools. Accordingly, the present invention involves the fields of electrochemistry, materials science, and physics.
  • Abrasive tools have long been used in numerous applications, including the cutting, drilling, sawing, grinding, lapping, and polishing of materials.
  • One common form of an abrasive tool is one that uses abrasive particles on a tool substrate to perform the cutting, grinding, polishing, etc.
  • Superabrasive particles such as diamond, polycrystalline diamond (PCD), cubic boron nitride (CBN), and polycrystalline cubic boron nitride (PCBN) have been widely used for many materials removal applications due to their extreme hardness, atomic density, and high thermal conductivity.
  • PCD polycrystalline diamond
  • CBN cubic boron nitride
  • PCBN polycrystalline cubic boron nitride
  • dressing disks, grinding disks, saw blades, wire saws, and drill bits have all included superabrasive particles attached to a substrate.
  • abrasive tools and methods for making abrasive tools which allow accurate horizontal and vertical placement of abrasive particles, and that can achieve a suitable working surface with little or no post fabrication processing continue to be sought.
  • the present invention provides abrasive tools having particles arranged according to both vertical and horizontal patterns, and which require little or no post production processing, as well as methods for the manufacture and use thereof.
  • the present invention additionally provides devices for use as a part of such manufacturing processes.
  • the present invention provides a mold for the positioning and holding of abrasive particles, which are to be electrolytically attached to an electrically conductive substrate during an electrolytic process.
  • the mold may include, or be made of an insulating material that has a molding surface suitable for holding the abrasive particles in place during the electrolytic deposition of a material that attaches the particles to the electrically conductive substrate.
  • methods for making a tool that has a plurality of abrasive particles coupled to a substrate by an electrodeposited material.
  • the method may include the steps of: 1) temporarily securing the plurality of abrasive particles to a molding surface of a mold, such as the molds described herein, 2) positioning the mold in an electrodeposition chamber with the molding surface oriented toward a substrate to which the abrasive particles are to be electrolytically attached, 3) electrolytically attaching the abrasive particles to the substrate with an electrodeposited material, and 4) removing the mold.
  • the present invention includes abrasive tools that, in some aspects, can be produced by the methods recited herein.
  • Such tools generally include a substrate having a plurality of abrasive particles that are coupled to the substrate by an electrodeposited material. This plurality of abrasive particles can have tips arranged in accordance with a predetermined vertical pattern.
  • FIGS. 1 a through 1 h are various views showing a series of steps for making a tool in accordance with an embodiment of this invention
  • FIG. 1 a is a bottom view of a mold in accordance with an embodiment of this invention showing a molding surface of the mold;
  • FIG. 1 b is a sectional view taken along line A-A of FIG. 1 a in accordance with an embodiment of this invention
  • FIG. 1 c is the sectional view of FIG. 1 b showing an adhesive coating on a molding surface of the mold in accordance with an embodiment of this invention
  • FIG. 1 d is a bottom view of a mold showing placement of abrasive particles on the molding surface in accordance with an embodiment of this invention
  • FIG. 1 e is the sectional view of FIG. 1 c showing placement of abrasive particles on the molding surface in accordance with an embodiment of this invention
  • FIG. 1 f is a partial, sectional view of an electrodeposition chamber showing the orientation of a tool substrate and a mold in accordance with an embodiment of this invention
  • FIG. 1 g is the partial, sectional view of FIG. 1 f showing abrasive particles coupled to the tool substrate by an electrodeposited material in accordance with an embodiment of this invention
  • FIG. 1 h is a sectional view of a tool in accordance with an embodiment of this invention.
  • FIGS. 2 a through 2 c are various views showing a series of steps for making a tool in accordance with another embodiment of this invention.
  • FIG. 2 a is a sectional view of a mold showing placement of abrasive particles on the molding surface in accordance with another embodiment of this invention
  • FIG. 2 b is the sectional view of FIG. 2 a showing a tool substrate and abrasive particles coupled thereto by an electrodeposited material in accordance with another embodiment of this invention
  • FIG. 2 c is a sectional view of a tool in accordance with another embodiment of this invention.
  • an abrasive particle includes reference to one or more of such particles.
  • insulating material refers to a material or materials used to form a mold in a manner the effectively prevents accumulation of electrodeposited material on a molding surface of the insulating material.
  • the insulating material may include electrically nonconductive and/or conductive materials.
  • molding surface refers to a surface on the insulating material to which abrasive particles can be secured.
  • predetermined pattern refers to a non-random arrangement of either abrasive particles or apertures that can be determined prior to fabrication of a tool or device including such particles or apertures.
  • horizontal pattern refers to an arrangement of either abrasive particles or apertures across a surface to which they are, or are to be, attached or placed.
  • vertical pattern refers to an arrangement of heights to which, the exposed tips of abrasive particles extend above the working surface of a tool or tool substrate.
  • working surface refers to the surface of a tool or tool substrate that, during operation, faces toward, or comes in contact with a work piece that is being polished, grinded, sanded, etc.
  • “lattice” refers to a horizontal pattern in which the abrasive particles are equidistant from neighboring abrasive particles or, in the case of apertures, the apertures are equidistant from neighboring apertures.
  • post electrodeposition processing refers to the dressing or grinding required in some conventional methods to expose the working surface of a tool.
  • holding or “temporarily securing” refers to the coupling or supporting of particles in order to prevent the particles from falling from and/or moving on the surface to which they are coupled or supported.
  • gravity may be sufficient to couple or support the particles to the surface.
  • template refers to a device with a plurality of apertures used for positioning abrasive particles onto a mold in a predetermined pattern.
  • the predetermined pattern can be controlled by the configuration of the apertures on the template.
  • one side of the template is positioned against the molding surface of a mold, and diamond particles are spread over the other side.
  • the apertures can be designed so that only one particle will fit in each aperture and fall through to contact the molding surface.
  • the apertures can also be designed so that it accommodates only particles having a grit size in a specified range.
  • the particles in the apertures can contact the molding surface so that they can be secured thereto. The remaining unsecured particles can be removed.
  • the template can then be removed from the mold.
  • substantially refers to a degree of deviation that is sufficiently small so as to not measurably detract from the identified property or circumstance.
  • the present invention encompasses electrodeposition methods of making abrasive tools that allow greater control in the arrangement and securing of abrasive particles according to both vertical and horizontal patterns on a tool substrate, and that require little or no post electrodeposition processing of the working surface of the tool. In other words, the working surface results from the electrodeposition process itself. Applicant has also developed a mold for use with this method as well as abrasive tools produced by this method.
  • FIGS. 1 a through 1 e a mold 10 in accordance with the present invention is shown.
  • the mold may be used in an electrolytic process for the positioning and holding of abrasive particles 22 to the molding surface 18 of the mold.
  • FIGS. 1 f through 1 h show the mold configured for use in a partial view of an electrodeposition chamber 100 in accordance with an embodiment of this invention.
  • FIGS. 2 a through 2 c show other examples of a mold configured for use in accordance with an embodiment of the invention.
  • the mold 10 includes an insulating material 14 .
  • This insulating material can effectively prevent the accumulation of electrodeposited material 58 on the molding surface 18 .
  • the tips 42 of the abrasive particles form part of the working surface 49 of a tool 50 , and these tips are held on the molding surface of the mold during electrodeposition. As such, the accumulation of electrodeposited material can be prevented from occurring on the particle tips and the working surface of the tool.
  • the insulating material 14 has at least one aperture 26 extending through the insulating material.
  • the insulating material has a plurality of apertures extending through the insulating material.
  • the apertures can allow for circulation of an electrolytic fluid 30 from an area outside the mold 34 through the mold 10 and to the surface 56 of the tool substrate 54 in order to effect electrodeposition of the material used to secure the abrasive particles to the tool substrate.
  • Such circulation can be advantageous as it is generally necessary to keep a sufficient concentration of the ions (not shown) in an electrolytic fluid at the location of electrodeposition.
  • the location of electrodeposition is on the surface 56 of the tool substrate 54 .
  • the plurality of apertures 26 can be arranged according to a predetermined pattern.
  • the predetermined pattern can be a lattice as shown in FIGS. 1 a and 1 d .
  • a lattice pattern can help evenly distribute the ions of an electrolytic fluid 30 to the tool substrate 54 .
  • An even distribution of ions helps the electrodeposited material 58 build evenly across the surface of the tool substrate, which in turn can help secure abrasive particles 22 with an even amount of strength.
  • the plurality of apertures 26 can be arranged in order to cause greater electrodeposition to occur in specific areas.
  • FIG. 2 b shows apertures located at the concave portions of the mold. A greater number of ions in the electrolytic fluid 30 may exist near the aperture causing more electrodeposited material 58 to form at that location.
  • the insulating material 14 may be formed in a variety of ways.
  • the insulating material can be formed of a resin material.
  • the resin material can be a synthetic resin or a polymeric material, such as polyimide.
  • the resin material may also include epoxies, lacquers, varnishes, acrylic polymers, or mixtures thereof.
  • the resin material may be a rubber material, including natural and synthetic rubbers, such as styrene-butadiene, polychloroprene elastomers, fluoroelastomers, ethylene propylene diene, nitrile elastomers such as Buna-N, and NBR, polysiloxanes, polyisobutylenes, and urethanes.
  • natural and synthetic rubbers such as styrene-butadiene, polychloroprene elastomers, fluoroelastomers, ethylene propylene diene, nitrile elastomers such as Buna-N, and NBR, polysiloxanes, polyisobutylenes, and urethanes.
  • the insulating material 14 may include electrically conductive components so long as the insulating material effectively, or substantially, prevents the formation of electrodeposited material 58 on the molding surface 18 .
  • the insulating material may be a stainless steel substrate (not shown) covered with an insulating varnish (not shown).
  • the insulating material 14 also includes a molding surface 18 suitable for holding the abrasive particles 22 in place during the electrolytic deposition of a material 58 that attaches the abrasive particles to the surface 56 of an electrically conductive substrate 54 , e.g. the tool substrate 54 .
  • the mold 10 can be configured for holding abrasive particles, such as diamond particles, in a variety of ways.
  • abrasive particles such as diamond particles
  • an adhesive material 38 can be adhered to the molding surface for holding the abrasive particles.
  • the use of adhesive material can allow for the individual placement of abrasive particles.
  • Other methods of holding the abrasive particles in place may include the forces of magnetism, friction, gravity, etc.
  • the molding surface may include a plurality of grooves into which the abrasive particles are friction fitted.
  • the abrasive particles 22 are held so that they contact the molding surface 18 directly.
  • the shape of a vertical pattern 62 to be imparted to a tool 50 can be controlled by configuring the shape of the molding surface.
  • the molding surface can be configured to have a shape that is inverse to a vertical pattern to be imparted to the abrasive particles on a tool substrate 54 .
  • the shape of the molding surface 18 can be adapted to suit many applications for abrasive tools 50 .
  • the molding surface can be substantially flat (as shown in FIGS. 1 a through 1 g ), concave, or convex, or it can include both convex and concave portions (as shown in FIGS. 2 a and 2 b ).
  • the concave shape of the molding surface can have a slope of about 1/1000, or concavity of about 1/1000. This last example can impart a convex shape with a slope of about 1/1000 to the vertical pattern 62 of a polishing tool, which is often desired in CMP applications.
  • the tips 42 of the particles forming part of the working surface 49 of a tool can be set in a predetermined vertical pattern. This can help substantially with even dressing and good finish quality of the object being polished (not shown). Additionally, this can allow for specific dressing patterns on the object being polished.
  • the molding surface 18 can hold the abrasive particles 22 in a predetermined horizontal pattern. Accordingly, the spacing between the particles on the surface 56 of the tool substrate 54 can be controlled. Such control can provide a number of advantages. For instance, controlled spacing of the abrasive particles can result in increased performance by reducing excessive frictional force (or drag) and heat generation caused during the polishing process. In some applications, it is desired to regularly distribute the abrasive particles over the surface of the tool substrate. For such applications, the molding surface can hold the abrasive particles in a lattice pattern.
  • abrasive particles can be individually placed on the molding surface.
  • a template as defined above
  • Other methods can include the use of transfer tape or other transfer medium, whereby particles are temporarily placed on the tape in a predetermined horizontal pattern and then transferred to the molding surface.
  • the molding surface 18 can hold the abrasive particles 22 according to a predetermined pattern that is complimentary with the pattern of apertures 26 .
  • both the abrasive particles and the apertures can each be arranged in lattice patterns as shown in FIG. 1 d .
  • these complimentary patterns can provide for substantially equal concentrations of ions in the electrolytic fluid 30 to reach the site of electrodepostion around each abrasive particle.
  • the amount of electrodeposited material 58 securing each abrasive particle can be substantially equivalent. This can help maximize particle retention by distributing substantially equal work load to each particle.
  • the molding surface 18 can hold the abrasive particles 22 in a pattern that provides for at least one specified area on the molding surface that has a higher concentration of abrasive particles than the remainder of the molding surface.
  • This can be particularly useful in CMP applications. For example, it may be desired to have a higher concentration of abrasive particles near the perimeter of a disc-shaped abrasive tool. The perimeter generally spins faster than the center of the disc-shaped tool and often there is more pressure on the leading edge of the disc. Additional patterns and configurations of abrasive particles may be found in Applicant's co-pending U.S. patent applications having Ser. No. 10/109,531 filed Mar. 27, 2002 and Ser. No. 10/954,956 filed Sep. 29, 2004, each of which are incorporated herein by reference.
  • a method for making a tool 50 that has a plurality of abrasive particles 22 coupled to a substrate 54 by an electrodeposited material 58 .
  • abrasive particles can be temporarily secured to a molding surface 18 of a mold 10 , as described herein.
  • the mold and the secured particles can be positioned into an electrodeposition chamber 100 with the molding surface oriented toward the substrate. Electrodeposition of a material on the surface 56 of the substrate 54 is then performed and the abrasive particles become electrolytically attached to the substrate with the electrodeposited material.
  • the mold can then be removed, revealing a tool, or portion of a tool having abrasive particles attached to the surface of the tool substrate.
  • abrasive particles 22 can be temporarily secured to the molding surface 18 of a mold 10 with an adhesive material 38 as described above. With the molding surface oriented towards the substrate 54 , electrodeposited material 58 can begin to form on the substrate until a portion of the abrasive particles is covered. The electrodeposited material can more firmly attach the particles to the adhesive material, and thus, the mold can be easily removed revealing the exposed tips of the abrasive particles.
  • the substrate 54 can be an electrically conductive material, such as stainless steel. This can allow the substrate to act as one of the electrodes in the electrolytic process.
  • the substrate can itself be the tool body (not shown). Alternatively, the substrate can be later secured to a tool body by other means.
  • the electrodeposited material 58 can be a metallic material, such as a metal or a metallic composite material.
  • the electrodeposited material may be metals such as nickel, chromium, copper, titanium, tungsten, tin, iron, silver, gold, manganese, magnesium, zinc, aluminum, tantalum, or alloys or mixtures thereof.
  • the metallic composite material may be a composite that includes one or more of these metals.
  • a tool 50 produced by the above-described method can have a substrate 54 with a plurality of abrasive particles 22 that are coupled to the substrate by an electrodeposited material 58 .
  • the abrasive particles can be arranged such that the tips 42 of the particles have a predetermined vertical pattern. Additionally, the abrasive particles can have a portion exposed above the electrodeposited material which has never been covered by the electrodeposited material
  • the abrasive particles 22 can each be set at a uniform height, or substantially uniform height above the substrate.
  • the vertical pattern can also be convex, concave, or include both convex and concave areas.
  • the plurality of abrasive particles 22 can be arranged on the substrate 54 according to a predetermined horizontal pattern.
  • the abrasive particles can be arranged in a lattice as defined above.
  • the abrasive particles can also be arranged such that there is a higher concentration of abrasive particles coupled to a specified area of the substrate than to the remainder of the substrate.
  • Such vertical and horizontal patterns provide many advantages such as those described above.
  • an abrasive tool 50 can be provided for that requires little or no post electrodeposition processing.
  • the electrodeposited material 58 forms on the substrate 54 of the tool, and does not occur on the finished working surface 49 of the tool. Because of this, the finished working surface does not require dressing to expose the tips 42 of the abrasive. particles like some other conventional methods. This helps prevent damage to the abrasive particles from the impact of dressing the working surface of the tool.
  • One surface of the polyimide layer i.e. the molding surface
  • an acrylic adhesive 50 microns thick.
  • Diamond grits of 100/120 mesh are attached to the molding surface with each diamond grit located in the center of the four surrounding apertures.
  • the diamond covered molding surface is placed against a disc-shaped stainless steel substrate (being 108 mm in diameter by 6.5 mm in thickness). The diamond grits are between the molding surface and the stainless steel substrate.
  • the mold and the substrate are located in a plastic (PVC) ring 48 to hold them together during electrolytic process.
  • the substrate is placed in contact with a cathode.
  • NiSO 4 solution is used as the electrolytic fluid.
  • the plastic ring, mold, and substrate are submerged in the electrolytic fluid inside a PVC layer for sealing off the electrolytic fluid.
  • Electrolysis is performed causing electrodeposition of the Ni on the substrate. Electrolysis continues until the Ni covers approximately about 2 ⁇ 3 of the average diamond grit size.
  • the polyimide mold is then removed and the substrate with diamond grits attached by electrodeposited Ni is recovered.
  • Each mold is formed of a stainless steel disc that is about 120 mm in diameter and about 120 microns in thickness.
  • Each disc is lithographically etched to form a plurality of apertures thereon distributed in a lattice pattern as described below.
  • the apertures cover a generally circular area on a central portion of each disc of about 100 mm in diameter, leaving a width of about 20 mm around the perimeter of each disc without any apertures.
  • aperture separation Measuring from the approximate center points of adjacent apertures, (the “aperture separation”), a number of discs are formed with the following aperture separations:
  • Each disc is varnished coated, rubber coated, or otherwise coated with an inert or insulative material in order to improve its electrically insulating properties. However, this can be an optional step in certain applications where a less conductive, or non-conductive material is used for the mold itself.
  • the abrasive particles are insulating (e.g. diamond particles)
  • the stainless steel, or other electrically conductive disc can be insulated by its separation from a cathodic substrate by the intervening insulating particles.
  • Each mold is coated on both sides with an adhesive layer and assembled with an abrasive particle template on each side.
  • the abrasive particle templates have been configured and selected to properly accommodate abrasive particles of a desired size, and to allow such particles to adhere between the holes in the mold on which the template is used (i.e. each aperture in each template will be placed so as to compensate for the holes in the mold and ensure that each abrasive particle will be adhered to the surface of the mold rather than falling through the apertures of the mold).
  • Diamond particles (MBG-660 made by Diamond Innovations) of the appropriate size are then dispersed into the apertures of each template so that each template aperture accommodates and receives only a single abrasive particle which becomes adhered to the surface of the mold.
  • the templates are removed leaving diamond particles adhered in the pattern dictated by the template on each surface of the mold.
  • the pattern dictated by the template may result in diamond particles located at the center between each set of four apertures on the mold.
  • Each mold is centered between two stainless steel substrates that are about 100 mm in diameter and about 6.5 mm in thickness, such that the diamond particles are sandwiched between the mold and the substrates. Since the diamond particles generally vary slightly in size, only some, if any of the larger diamond particles will contact the substrate.
  • a heavy steel ring is pressed along the outer periphery of the mold to make sure that moving, shifting, or warping does not occur during the electrodeposition process.
  • the ring may actually bend the periphery of the mold slightly to create a concave shape on each side of the mold.
  • the amount of slope in the concavity may be controlled somewhat using this mechanism, and in some aspects the slope may be about 1/1000. This will cause the diamond particles on the periphery of the working surface of the substrate to be slightly lower (about 50 microns) than at the center of the substrate in the finished tool
  • Each of the mold/substrate assemblies is located in holes of a plastic rack.
  • the bases of the substrates are connected to the cathode of a plating tank.
  • the mold/substrate assemblies are covered with a NiSO 4 electrolyte solution (i.e. placed in an electrolytic solution tank or bath, and as electricity passes through the substrate, nickel cations are reduced and nickel metal deposits onto the substrate.
  • a NiSO 4 electrolyte solution i.e. placed in an electrolytic solution tank or bath, and as electricity passes through the substrate, nickel cations are reduced and nickel metal deposits onto the substrate.
  • the depth to which the particles become buried can be controlled by the operator of the process.
  • the depth of the layer may be from about 1 ⁇ 3 to 2 ⁇ 3 of the distance between the mold and the substrate. The building of the layer can be accomplished evenly and quickly because of the fact that the electrolytic solution is allowed to circulate through the apertures of the mold.
  • the tool and mold are removed from the electroplating solution and separated to reveal the working surface of the tool. The mold can then be reused.
  • the profile of the exposed diamond particle tips on the working surface of the final tool will be dictated by the shape imparted by the molding surface of the mold. In this way, the diamond particle tips can be arranged in a predetermined vertical pattern on the working surface of the finished tool. Further, because of the nature of the process, no post fabrication finishing or work is required in order to provide a finished tool. In other words, in some aspects, a final tool which is ready for use may be produced as soon as the nickel layer is completed and the tool is removed from the electroplating bath.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
US11/292,938 2005-12-02 2005-12-02 Electroplated abrasive tools, methods, and molds Abandoned US20070128994A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US11/292,938 US20070128994A1 (en) 2005-12-02 2005-12-02 Electroplated abrasive tools, methods, and molds
PCT/US2006/046029 WO2007120224A2 (en) 2005-12-02 2006-11-30 Electroplated abrasive tools, methods, and molds
CNA2006800521572A CN101336147A (zh) 2005-12-02 2006-11-30 电镀研磨工具及方法和模具
TW095144571A TW200800504A (en) 2005-12-02 2006-12-01 Electroplated abrasive tools, methods, and molds

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Application Number Priority Date Filing Date Title
US11/292,938 US20070128994A1 (en) 2005-12-02 2005-12-02 Electroplated abrasive tools, methods, and molds

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CN (1) CN101336147A (zh)
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WO (1) WO2007120224A2 (zh)

Cited By (27)

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US20100291844A1 (en) * 2008-02-20 2010-11-18 Nippon Steel Materials Co., Ltd. Dresser for abrasive cloth
US20110250826A1 (en) * 2010-04-08 2011-10-13 Ehwa Diamond Ind. Co., Ltd. Pad conditioner having reduced friction and method of manufacturing the same
US20110306275A1 (en) * 2010-06-13 2011-12-15 Nicolson Matthew D Component finishing tool
EP2529888A1 (en) * 2011-06-01 2012-12-05 Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense Method and apparatus for making a fixed abrasive wire
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US8531026B2 (en) 2010-09-21 2013-09-10 Ritedia Corporation Diamond particle mololayer heat spreaders and associated methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8778784B2 (en) 2010-09-21 2014-07-15 Ritedia Corporation Stress regulated semiconductor devices and associated methods
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
FR3014718A1 (fr) * 2013-12-18 2015-06-19 Saint Gobain Diamantwerkzeuge Gmbh & Co Kg Procede de fabrication d'un superabrasif et produit obtenu
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9475169B2 (en) 2009-09-29 2016-10-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US20170113321A1 (en) * 2015-10-27 2017-04-27 Kinik Company Ltd. Hybridized cmp conditioner
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US20190091832A1 (en) * 2005-05-16 2019-03-28 Chien-Min Sung Composite conditioner and associated methods
WO2022106040A1 (de) * 2020-11-23 2022-05-27 August Rüggeberg Gmbh & Co. Kg Verfahren zur herstellung eines schleifwerkzeugs und schleifwerkzeug
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