US20070028629A1 - Evaporator arrangement for the coating of substrates - Google Patents

Evaporator arrangement for the coating of substrates Download PDF

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Publication number
US20070028629A1
US20070028629A1 US11/449,397 US44939706A US2007028629A1 US 20070028629 A1 US20070028629 A1 US 20070028629A1 US 44939706 A US44939706 A US 44939706A US 2007028629 A1 US2007028629 A1 US 2007028629A1
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US
United States
Prior art keywords
zone
evaporator
melt
crucible
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/449,397
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English (en)
Inventor
Gunter Klemm
Marcus Bender
Ulrich Englert
Andreas Kloppel
Uwe Hoffmann
Hans-Georg Lotz
Stefan Hein
Stefan Keller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials GmbH and Co KG
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to APPLIED FILMS GMBH & CO. KG reassignment APPLIED FILMS GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BENDER, MARCUS, ENGLERT, ULRICH, HEIN, STEFAN, HOFFMANN, UWE, KELLER, STEFAN, KLEMM, GUNTER, KLOPPEL, ANDREAS, LOTZ, HANS-GEORG
Assigned to APPLIED MATERIALS GMBH & CO. KG reassignment APPLIED MATERIALS GMBH & CO. KG CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED FILMS GMBH & CO. KG
Publication of US20070028629A1 publication Critical patent/US20070028629A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/60—Heating arrangements wherein the heating current flows through granular powdered or fluid material, e.g. for salt-bath furnace, electrolytic heating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material

Definitions

  • the invention relates to an evaporator arrangement for the coating of substrates with at least one material.
  • the coating of a substrate with a material can also take place by sputtering or by vapor deposition.
  • the layer generated in this manner often serves for protecting the coated material; however, it may also have purely decorative or functional relevance.
  • evaporator units For coating substrates evaporator units are known in which several evaporator boats are disposed in an evacuated space. Into these evaporator boats is introduced, frequently in a continuous process, material in the form of a wire which is evaporated. This vapor rises and condenses on the substrate to be coated, and the substrate, often in the form of a band, is guided over the evaporator boats.
  • splatters are generated during the direct evaporation, since irregular vapor pressures are formed due to impurities and gaseous components. The splatters are moreover formed by rapid movement of the melt in hot zones of the evaporator boats.
  • the melting off of the wire which to some extent is discontinuous, leads to different evaporation rates since these are dependent on the target site of the wire.
  • DE 40 27 034 C1 discloses an evaporator arrangement for coating band-shaped substrates in a vacuum coating chamber.
  • the evaporator boats utilized in this case form an evaporator bank, the boats being disposed longitudinally with respect to the running direction of the band and parallel and approximately equidistantly with respect to one another.
  • An arrangement for the evaporation of metal is furthermore known, wherein a wire is inserted into a groove which is in flow connection with an evaporator crucible (DE 34 28 651 A1). Due to the different vapor pressures, impurities and gaseous components can lead during the melting of the wire to the generation of splatters, which reach the substrate. To avoid this, above the groove a cooled screening or cover is disposed. This ensures that the substrate is only coated by the material rising from the evaporator crucible.
  • evaporator boats are also known, in which between a first zone and a second zone a screening in the form of a wall is located. This wall is intended to prevent splatters generated during the melting of the metal from reaching the substrate to be coated (U.S. Pat. No. 3,467,058, EP0 430 210 B1).
  • the problem underlying the invention comprises providing an evaporator arrangement for coating substrates with materials, in particular with metals, which is conceptualized such that no splatters can reach the substrate, wherein the installation of walls or other screenings is not necessary.
  • the invention therewith relates to an evaporator arrangement with a crucible, wherein the crucible is divided into at least three zones, each of which is heated to different temperatures.
  • the first zone is a melt-down zone and the second zone the heating zone and the third zone the evaporator zone.
  • the evaporator arrangement is preferably suitable for the evaporation of metals. If metals are evaporated, a metal wire is preferably guided into the melt-down zone. However, metal alloys can also be evaporated thereby that one or several metal wires comprised of different materials are introduced into the melt-down zone.
  • the advantage attained with the invention consists in particular therein that a splatter-free and highly uniform evaporation rate is achieved for qualitatively high-grade layers on organic substrates, for example OLEDs, and synthetic films. This is of importance for example in the production of capacitors, where splatter-free layers must be applied onto extremely thin films with good uniformity and under low radiative loading. It is also advantageous that no high demands must be made of the precision of the wire guidance, since the target point of the wire on the heated crucible is unimportant to the evaporation rate. Since in the melt-down zone lower temperatures obtain than in the evaporator zone, the wire guidance is also under low thermal loading and low vapor deposits. Through the division into melt-down and evaporator zone, impurities such as grime or oxide layers can largely be kept away from the evaporator zone. The service life of the crucible is also increased since the liquid material to be evaporated only moves slowly.
  • FIG. 1 is a perspective view of an evaporator arrangement with three zones
  • FIG. 2 is a perspective view of a variant of the arrangement depicted in FIG. 1 , each of the three zones having a separate heater,
  • FIG. 3 is a top view onto the evaporator arrangement according to FIG. 2 .
  • FIG. 4 is a section of the evaporator arrangement according to FIG. 3 along A-A,
  • FIG. 5 is a section through another embodiment of the evaporator arrangement
  • FIG. 6 is an evaporator bank with several evaporator boats.
  • FIG. 1 shows a perspective view of an evaporator arrangement 1 with a crucible 6 comprised of three zones.
  • the so-called melt-down zone the material to be evaporated is introduced where it is melted. If the material is a metal, it can be introduced in the form of a wire 3 into the melt-down zone 2 .
  • the wire 3 can be, as for example in U.S. Pat. No. 3,467,058, on a spool, from which it is continuously introduced into the melt-down zone 2 . If an alloy is to be applied onto the substrate, the wire 3 can already be comprised of this alloy or the alloy can be produced by the simultaneous melting of several wires of the desired metals which are to form the alloy.
  • Such metals, or their alloys, are preferably to be evaporated which comprise Ag, Cu or Al.
  • the melt-down zone 2 of the crucible 6 is followed by a so-called heating zone 4 , where a temperature obtains which must not reach the boiling temperature of the metal having the lowest boiling point, but which is higher than the temperature of the melt-down zone 2 .
  • this heating zone 4 low boiling impurities are removed such that metals are obtained which have a very high degree of purity.
  • the heating zone 4 of crucible 6 has a form adapted to the material of the melt 25 and the particular temperature-dependent surface tensions. It often has the form of a channel, as shown here, which connects the melt-down zone 2 with an evaporator zone 5 .
  • the heating zone 4 is smaller than the zones 2 and 5 and prevents the interchange of the melt 25 in zones 2 and 5 , since it is important that the colder region 2 is separated from the hotter region 5 , for it is to be avoided that evaporation occurs already in the melt-down zone 2 .
  • the size of the heating zone 4 is a function of the material; it may in practice have a length of, for example, 10 mm.
  • the temperature of the melt 25 increases continuously from zone 2 to zone 5 .
  • the melt 25 When the melt 25 has passed through the heating zone 4 of the crucible 6 , it reaches the evaporator zone 5 , where the material is lastly vapor deposited onto the substrate, which is disposed over the evaporator zone 5 .
  • the melting point of the material of the crucible 6 must be far above the evaporation temperature of the metals which are to be evaporated.
  • Possible materials for the crucible 6 are high-melting compounds, and the crucible 6 can also be comprised of several compounds of this type. Apart from graphite, compounds of the metallic borides, nitrides or carbides for example can be utilized as well as compounds of the non-metallic borides, nitrides or carbides. TiB 2 together with BN are suitable as materials of the crucible 6 .
  • the crucible 6 is heated in such manner that the temperature in region 2 is lowest and in region 5 highest, wherein the heating can take place via only one or via several heaters operated separately of one another.
  • the heating takes place through a current which flows through the crucible 6 , and specifically in its longitudinal direction.
  • the temperature in the melt-down zone 2 is higher by approximately 300 to 500° C. than the melting point and in the evaporator zone 5 higher by approximately 900° C.
  • the temperatures in zones 2 to 4 are selected such that in them no evaporation of the material occurs. It would theoretically be sufficient for the temperature in the melt-down zone to be only marginally above the melting temperature. However, since the introduced metal wire leads to a cooling down, the temperature in the melt-down zone is selected higher.
  • the rising vapor lobe of the metal to be evaporated remains nearly constant during the evaporation, whereby the coating becomes highly uniform.
  • the evaporator boats are oriented such that the substrate is uniformly coated. This can be achieved not only through the disposition of the evaporator boats with respect to one another, but also thereby that the substrate is guided over the evaporator bank at such distance that uniform coating results.
  • the evaporation rate can be controlled via the speed of the melting-down of the wire and the geometry of the crucible 6 .
  • regulation of the level of fill of the melt 25 of the wire advance and of the evaporator output can be provided.
  • an evaporator arrangement 1 is suitable for the coating of, for example, synthetic films with metal.
  • the evaporation rate is therein determined via the surface of the evaporator zone 5 , the temperature of the evaporator crucible as well as the wire feed, i.e. the quantity of molten wire 3 per unit time.
  • Such an arrangement can for example be utilized for the fabrication of capacitors, since here splatter-free layers are applied onto extremely thin films and the layers, moreover, must be highly uniform.
  • a further application field is also the production of metallic yarn, since here the requirements made of the evaporator arrangement 1 are also very high.
  • FIG. 2 shows a perspective view of a variant of the evaporator arrangement 1 shown in FIG. 1 .
  • the melt-down zone 2 , the heating zone 4 and the evaporator zone 5 of the crucible 6 have each their own electrical resistance heater 21 , 22 , 23 . Therewith the three zones can be brought to different temperatures. Between the individual zones 2 , 4 and 4 , 5 , respectively, are located insulating layers 39 to 42 , such that the currents clearly flow in the transverse direction.
  • the DC voltage sources 18 are in this case all at their own resistance, to which they can be connected via switches 19 . Instead of constant DC voltage sources 18 , regulatable DC voltage sources can also be employed. In addition, AC voltage sources can be utilized.
  • the zones may be comprised of different materials or have different current flow cross sections.
  • FIG. 3 shows a top view onto the evaporator arrangement 1 depicted in FIG. 2 .
  • the wire 3 is introduced obliquely from above into the melt-down zone 2 , where the metal or the alloy melts.
  • This melt 25 migrates via the heating zone 4 into the evaporator zone 5 , where lastly evaporation occurs.
  • the heating zone 4 narrowing toward the evaporator zone 5 , which is implemented as a channel. This channel is formed in a manner as is required by the molten material and its temperature-dependent surface tension.
  • FIG. 4 shows a section along A-A in FIG. 3 .
  • the wire 3 is brought into the melt-down zone 2 , which is connected via the heating zone 4 with the evaporator zone 5 .
  • the basin 24 of the melt-down zone 2 is deeper than the basin 26 of the evaporator zone 5 . Since the bottom of the heating zone 4 is above the bottom of the melt-down zone 2 , the molten metal can only flow into the evaporator zone 5 if sufficient metal has been melted from the wire in order to reach the level which corresponds at least to the height of the heating zone 4 .
  • the bottom of basin 26 of the evaporator zone 5 lies below the bottom of the heating zone 4 .
  • the basins of the different zones can however all be at the same level or only the basins of zones 4 and 5 can lie at the same level.
  • a flow of the material from the melt-down zone 2 to the evaporator zone 5 takes place in this case also since the level of the material in the evaporator zone 5 decreases due to the evaporation and therewith draws material from the melt-down zone 2 .
  • FIG. 5 shows a variant of the arrangement depicted in FIG. 4 .
  • the heating zone 4 has a gradient toward the evaporator zone 5 .
  • FIG. 6 is shown the manner in which several crucibles or evaporator boats 45 to 54 can be disposed in a coating unit.
  • Each evaporator boat 45 to 54 is therein fed with its own wire 55 to 64 , and specifically via, not shown, wire supplies.
  • the substrate to be coated is here a film 65 , which is guided past via a coating roller 66 in the evaporator boats.
  • the direction of movement of the film 65 corresponds therein to the longitudinal direction of the evaporator boats.
  • the three zones of the evaporator boats 45 to 54 are not shown in FIG. 6 .
  • the evaporator boats 45 to 54 are disposed on an evaporator bank 67 , which can be slid under the coating roller 66 .
  • the evaporator boats 45 to 54 are disposed on a slide-in cart, which can also be slid under a coating roller.
  • a distributor tube perpendicularly above the evaporator zone 5 , this distributor tube comprising numerous throughbores linearly disposed in the vertical direction, via which the vapor is directed onto a substrate.
  • a distributor tube is known for example from DE 102 56 038 A1.
  • inductive heaters can also be provided, which are so laid out such that they generate different temperatures in different zones of an evaporator boat.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Liquid Crystal (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
US11/449,397 2005-08-03 2006-06-08 Evaporator arrangement for the coating of substrates Abandoned US20070028629A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05016832A EP1760169B1 (de) 2005-08-03 2005-08-03 Verdampfervorrichtung zum Beschichten von Substraten
EP05016832 2005-08-03

Publications (1)

Publication Number Publication Date
US20070028629A1 true US20070028629A1 (en) 2007-02-08

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US11/449,397 Abandoned US20070028629A1 (en) 2005-08-03 2006-06-08 Evaporator arrangement for the coating of substrates

Country Status (7)

Country Link
US (1) US20070028629A1 (zh)
EP (1) EP1760169B1 (zh)
JP (1) JP2007039809A (zh)
CN (1) CN1908224A (zh)
AT (1) ATE392492T1 (zh)
DE (1) DE502005003755D1 (zh)
TW (1) TW200706667A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2019156A1 (en) * 2007-07-27 2009-01-28 Applied Materials, Inc. Shaped crucible and evaporation apparatus having same
GB2574400A (en) * 2018-06-04 2019-12-11 Dyson Technology Ltd A device
GB2574401A (en) * 2018-06-04 2019-12-11 Dyson Technology Ltd A device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5621269B2 (ja) * 2010-02-09 2014-11-12 パナソニック株式会社 蒸着用ボートおよびこれを用いた蒸着装置
JP5611086B2 (ja) * 2011-03-10 2014-10-22 パナソニック株式会社 蒸着用ボートとこれを使用した成膜方法
JP6121639B1 (ja) * 2015-06-09 2017-04-26 株式会社アルバック 巻取式成膜装置及び巻取式成膜方法
CN113215547B (zh) * 2021-05-21 2023-03-14 辽宁分子流科技有限公司 一种智能可控的线性蒸发源
CN113235053B (zh) * 2021-05-21 2023-03-28 辽宁分子流科技有限公司 一种蒸发速率智能可调的蒸发镀膜方法
DE102022105889A1 (de) * 2022-03-14 2023-09-14 Thyssenkrupp Steel Europe Ag Verfahren zum Beschichten eines Substrats mit einer Metalllegierungsbeschichtung, die wenigstens zwei Metalle enthält
CN116334572A (zh) * 2023-03-29 2023-06-27 铜陵市超越电子股份有限公司 柔性基材卷绕镀膜机

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665227A (en) * 1950-06-30 1954-01-05 Nat Res Corp Apparatus and method of coating by vapor deposition
US2909149A (en) * 1957-11-15 1959-10-20 Cons Electrodynamics Corp Apparatus for evaporating metal
US3020177A (en) * 1959-05-13 1962-02-06 Continental Can Co Art of vaporizing materials
US3467058A (en) * 1965-12-03 1969-09-16 United States Steel Corp Apparatus for vaporizing metal
US3582611A (en) * 1969-11-24 1971-06-01 Sylvania Electric Prod Apparatus and method of metal evaporation including an evaporation boat having lower electrical resistivity ends than the center thereof
US20040163600A1 (en) * 2002-11-30 2004-08-26 Uwe Hoffmann Vapor deposition device

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
DE880529C (de) * 1951-06-16 1953-06-22 Hydrawerk Ag Vorrichtung zum Verdampfen von Materialien
JPS57169088A (en) * 1981-04-09 1982-10-18 Olympus Optical Co Ltd Crucible
DE10200909A1 (de) * 2002-01-12 2003-07-24 Applied Films Gmbh & Co Kg Verdampferschiffchen für eine Vorrichtung zur Beschichtung von Substraten

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665227A (en) * 1950-06-30 1954-01-05 Nat Res Corp Apparatus and method of coating by vapor deposition
US2909149A (en) * 1957-11-15 1959-10-20 Cons Electrodynamics Corp Apparatus for evaporating metal
US3020177A (en) * 1959-05-13 1962-02-06 Continental Can Co Art of vaporizing materials
US3467058A (en) * 1965-12-03 1969-09-16 United States Steel Corp Apparatus for vaporizing metal
US3582611A (en) * 1969-11-24 1971-06-01 Sylvania Electric Prod Apparatus and method of metal evaporation including an evaporation boat having lower electrical resistivity ends than the center thereof
US20040163600A1 (en) * 2002-11-30 2004-08-26 Uwe Hoffmann Vapor deposition device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2019156A1 (en) * 2007-07-27 2009-01-28 Applied Materials, Inc. Shaped crucible and evaporation apparatus having same
GB2574400A (en) * 2018-06-04 2019-12-11 Dyson Technology Ltd A device
GB2574401A (en) * 2018-06-04 2019-12-11 Dyson Technology Ltd A device
WO2019234398A1 (en) 2018-06-04 2019-12-12 Dyson Technology Limited A vapour deposition evaporator device
WO2019234395A1 (en) 2018-06-04 2019-12-12 Dyson Technology Limited A vapour deposition evaporator device
GB2574401B (en) * 2018-06-04 2022-11-23 Dyson Technology Ltd A Device
GB2574400B (en) * 2018-06-04 2022-11-23 Dyson Technology Ltd A Device
US11613804B2 (en) 2018-06-04 2023-03-28 Dyson Technology Limited Vapour deposition evaporator device

Also Published As

Publication number Publication date
DE502005003755D1 (de) 2008-05-29
EP1760169A1 (de) 2007-03-07
ATE392492T1 (de) 2008-05-15
CN1908224A (zh) 2007-02-07
TW200706667A (en) 2007-02-16
EP1760169B1 (de) 2008-04-16
JP2007039809A (ja) 2007-02-15

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AS Assignment

Owner name: APPLIED FILMS GMBH & CO. KG, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KLEMM, GUNTER;BENDER, MARCUS;ENGLERT, ULRICH;AND OTHERS;REEL/FRAME:018091/0603

Effective date: 20060628

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Owner name: APPLIED MATERIALS GMBH & CO. KG, GERMANY

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