US20070017180A1 - Network floor structure - Google Patents
Network floor structure Download PDFInfo
- Publication number
- US20070017180A1 US20070017180A1 US11/360,625 US36062506A US2007017180A1 US 20070017180 A1 US20070017180 A1 US 20070017180A1 US 36062506 A US36062506 A US 36062506A US 2007017180 A1 US2007017180 A1 US 2007017180A1
- Authority
- US
- United States
- Prior art keywords
- board
- floor structure
- network floor
- base board
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/024—Sectional false floors, e.g. computer floors
- E04F15/02405—Floor panels
- E04F15/02411—Floor panels with integrated feet
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/024—Sectional false floors, e.g. computer floors
- E04F15/02447—Supporting structures
- E04F15/02464—Height adjustable elements for supporting the panels or a panel-supporting framework
- E04F15/0247—Screw jacks
- E04F15/02476—Screw jacks height-adjustable from the upper side of the floor
Definitions
- Another object of the present invention is to enable that a large and thick wire cable and fiber optics can be easily installed without being bended by 90 degrees, and can maintain a quality of signal transmission.
- Yet another object of the present invention is to install a latch bump and a latch groove, which are corresponding to each other and can be latched together, on an edge of each base board, thereby enabling a quick assembly and position between each base board through the latching of the latch bump and the latch groove.
- FIG. 2 shows a schematic view of a first implementation of a base board of the present invention.
- FIG. 12 shows a schematic view of a bottom of a fourth cover board of the present invention.
- a separation board 60 can be installed between the base board 30 and the first cover board 41 .
- a leveling board 61 is located at an edge of a bottom end of the separation board 60 , and is a little lower than the first cover board 40 , such that the conduction conduit 32 between the base board 30 and the first cover board 41 can be divided into an upper and a lower conduits through the separation board 60 , thereby enabling an orderly integration of all wiring materials distributed between the upper and lower conduits, without being easily tied up or twisted together.
- the cover board can be further a fourth cover board 49 in a cross shape and is covered on the conduction conduit 32 .
- restraining strips 44 , conduction conduits 45 , and reinforced ribs 47 are also located at a bottom end of the fourth cover board 49 .
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- General Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094211540 | 2005-07-07 | ||
TW094211540U TWM281040U (en) | 2005-07-07 | 2005-07-07 | The structure of the internet floor |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070017180A1 true US20070017180A1 (en) | 2007-01-25 |
Family
ID=37154189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/360,625 Abandoned US20070017180A1 (en) | 2005-07-07 | 2006-02-24 | Network floor structure |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070017180A1 (zh) |
TW (1) | TWM281040U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015174940A1 (en) * | 2014-05-14 | 2015-11-19 | Sema Plasti̇k Kalip Ve Maki̇ne Sanayi̇ Ve Ti̇caret Ltd.Şti̇. | Production of two-layer composite deck tile by injection molding method |
US9394700B1 (en) * | 2015-07-06 | 2016-07-19 | International Business Machines Corporation | Data center floor management |
US9879434B2 (en) * | 2014-09-04 | 2018-01-30 | QLX Pty Ltd | Flooring module |
USD934452S1 (en) * | 2017-12-04 | 2021-10-26 | Signature Systems Group Llc | Modular flooring tile with cable channels |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2956652A (en) * | 1958-08-15 | 1960-10-18 | Liskey Aluminum | Elevated false floor |
US3789557A (en) * | 1970-06-08 | 1974-02-05 | R Harvey | Raised flooring |
US4258516A (en) * | 1978-06-16 | 1981-03-31 | Bridgestone Tire Company Limited | Apparatus for supporting floor plates above substrate |
US4773196A (en) * | 1986-05-30 | 1988-09-27 | Kyodo Electric Co., Ltd. | Flooring panels for free cable laying |
US4934116A (en) * | 1987-01-12 | 1990-06-19 | Ole Frederiksen | Floor covering of electrically conducting type |
US5386670A (en) * | 1990-11-29 | 1995-02-07 | Kabushiki Kaisha Toshiba | Method for manufacturing system floor and floor base for system floor |
US5434355A (en) * | 1993-10-26 | 1995-07-18 | Sho; Jen-Tai | Floor board assembly |
US5501754A (en) * | 1991-09-11 | 1996-03-26 | Taisei Electronic Industries Co., Ltd. | Method of assembling raised dry-floor |
US5904015A (en) * | 1997-07-18 | 1999-05-18 | Chen; Yao-Chung | Cover plate connecting structure of a network floor |
US6598366B2 (en) * | 2001-11-06 | 2003-07-29 | Juu Rong Hsieh | Modular raised floor system with cable-receiving groove network |
-
2005
- 2005-07-07 TW TW094211540U patent/TWM281040U/zh unknown
-
2006
- 2006-02-24 US US11/360,625 patent/US20070017180A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2956652A (en) * | 1958-08-15 | 1960-10-18 | Liskey Aluminum | Elevated false floor |
US3789557A (en) * | 1970-06-08 | 1974-02-05 | R Harvey | Raised flooring |
US4258516A (en) * | 1978-06-16 | 1981-03-31 | Bridgestone Tire Company Limited | Apparatus for supporting floor plates above substrate |
US4773196A (en) * | 1986-05-30 | 1988-09-27 | Kyodo Electric Co., Ltd. | Flooring panels for free cable laying |
US4934116A (en) * | 1987-01-12 | 1990-06-19 | Ole Frederiksen | Floor covering of electrically conducting type |
US5386670A (en) * | 1990-11-29 | 1995-02-07 | Kabushiki Kaisha Toshiba | Method for manufacturing system floor and floor base for system floor |
US5501754A (en) * | 1991-09-11 | 1996-03-26 | Taisei Electronic Industries Co., Ltd. | Method of assembling raised dry-floor |
US5434355A (en) * | 1993-10-26 | 1995-07-18 | Sho; Jen-Tai | Floor board assembly |
US5904015A (en) * | 1997-07-18 | 1999-05-18 | Chen; Yao-Chung | Cover plate connecting structure of a network floor |
US6598366B2 (en) * | 2001-11-06 | 2003-07-29 | Juu Rong Hsieh | Modular raised floor system with cable-receiving groove network |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015174940A1 (en) * | 2014-05-14 | 2015-11-19 | Sema Plasti̇k Kalip Ve Maki̇ne Sanayi̇ Ve Ti̇caret Ltd.Şti̇. | Production of two-layer composite deck tile by injection molding method |
US9879434B2 (en) * | 2014-09-04 | 2018-01-30 | QLX Pty Ltd | Flooring module |
US9394700B1 (en) * | 2015-07-06 | 2016-07-19 | International Business Machines Corporation | Data center floor management |
US9752329B2 (en) | 2015-07-06 | 2017-09-05 | International Business Machines Corporation | Data center floor management |
USD934452S1 (en) * | 2017-12-04 | 2021-10-26 | Signature Systems Group Llc | Modular flooring tile with cable channels |
Also Published As
Publication number | Publication date |
---|---|
TWM281040U (en) | 2005-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |