US20060201571A1 - Textile information carrier and method for producing a textile information carrier - Google Patents
Textile information carrier and method for producing a textile information carrier Download PDFInfo
- Publication number
- US20060201571A1 US20060201571A1 US11/369,091 US36909106A US2006201571A1 US 20060201571 A1 US20060201571 A1 US 20060201571A1 US 36909106 A US36909106 A US 36909106A US 2006201571 A1 US2006201571 A1 US 2006201571A1
- Authority
- US
- United States
- Prior art keywords
- textile
- information carrier
- antenna
- carrier according
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000001514 detection method Methods 0.000 claims abstract description 67
- 235000012431 wafers Nutrition 0.000 claims description 66
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- 238000000034 method Methods 0.000 claims description 21
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- 239000000835 fiber Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 239000004831 Hot glue Substances 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
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- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
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Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/339—Metal or metal-coated strand
Definitions
- the invention relates to a textile information carrier and a method for producing a textile information carrier.
- Textile goods are usually provided with textile labels by the manufacturer, clothing manufacturer, distributor or designer, which contain optically readable information on the composition of the goods, instructions for the care and cleaning and information on the garment size, origin, trademark or trade name as well as the designer.
- Jacquard labels are used for identification or labels printed with the inscription of the producer or the trademark, so-called satin labels are used, these being manufactured in expensive processes to make imitations difficult.
- electronic data carriers In order to be able to more easily identify imitations or incorrect labels or also to identify textile goods during manufacture, processing, during transportation, during storage, during distribution and during care and cleaning, electronic data carriers are being increasingly used which contain redundant or additional information on the optically readable textile label and which can only be read by means of a special reader.
- the advantage of information stored on electronic data carriers is that this is largely tamper-proof and insensitive to contamination and cleaning agents and it can also be read without optical sight.
- a textile information carrier consisting of a textile label or textile goods and a textile detection wafer joined to the textile label or the textile goods, commprising a textile carrier in or on which are disposed a textile antenna and an electronic chip module connected to the textile antenna.
- the textile label or the textile goods e.g. the jacket inner pocket or the inner lining of a garment on the one hand and the textile detection wafer on the other hand are first manufactured separately and then connected.
- a textile detection wafer designates a textile carrier with a textile antenna and an electronic chip module.
- the textile detection wafer comprising the textile carrier with the textile antenna and the chip module can be manufactured in a standardised manner independently of the textile label or the textile goods and is suitable for connection to different textile labels or textile goods.
- the electronic chip module itself and electrically conductive components of the textile antenna, which nevertheless exhibit textile properties however, all the other components of the textile information carrier are made of textile material so that the textile property, especially the flexibility is safeguarded.
- the textile detection wafer with its inner side carrying the electronic chip module is advantageously joined to the textile label or the textile goods so that it is reversibly detachable or irreversibly undetachable.
- the electronic chip module is not visible and is protected from mechanical damage.
- the textile detection wafer can be removed, for example, after a manufacturing or transportation process if the information is no longer required subsequently or is not to be used by unauthorised persons.
- the information should remain permanently linked to the textile label or the textile goods. This makes tampering difficult and impossible without destroying the bond between textile label or textile goods on the one hand and the textile detection wafer on the other hand.
- the textile detection wafer can be joined to the textile label or the textile goods by welding or bonding or coating or laminating or gluing or by means of an adhesive film or by means of a patch connection produced under heat and pressure.
- the textile detection wafer is joined directly to the textile label or the textile goods by fusing of fibres or filaments or indirectly by an adhesive material.
- the textile properties of the joined layers of the textile detection wafer and the textile label or textile goods are thus retained.
- connection preferably consists of discrete connecting points or very fine perforated adhesive film.
- connection can consist of self-adhesive embroidery yarn which is embroidered onto the textile carrier of the textile detection wafer.
- the embroidered-on self-adhesive embroidery yarn produces a grid which likewise provides discrete connecting points or discrete connecting lines and thus avoids any stiffening of the joined layers of the textile detection wafer and the textile label or the textile goods as a result of the connection not being over the entire surface.
- the textile detection wafer can be joined to the textile label or the textile goods by a sewing or embroidery process.
- the antenna can be woven-in in a common textile manufacturing process of the textile carrier.
- the antenna can be manufactured together with the manufacture of the textile antenna in one work process.
- the antenna is thereby directly integrated into the textile carrier of the textile detection wafer.
- the antenna can be embroidered onto the textile detection wafer in a separate textile manufacturing process.
- the textile carrier can be joined to the adhesive film before the embroidery process.
- the textile carrier as an embroidery base is present still uncut and therefore the dimensions are larger compared to the dimensions of the textile detection wafer, previous joining to an adhesive film is more economical and can be carried out without impairing the subsequently embroidered antenna structure.
- the woven antenna preferably consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or synthetic and/or natural multifibres and/or at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament.
- Such a hybrid yarn has a higher tearing resistance than a yarn consisting exclusively of electrically conductive filaments. As a result, it can be processed on conventional industrial textile machines.
- the embroidered antenna preferably consists of an upper thread and a lower thread of which one of the threads consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or synthetic and/or natural multifibres and/or at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament and the other thread consists of a yarn comprising at least one synthetic and/or natural fibre or synthetic and/or natural multifibres and/or at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments.
- the at least one synthetic and/or natural fibre or the synthetic and/or natural multifibres and/or the at least one synthetic and/or natural filament or the synthetic and/or natural multifilaments can be twisted or intermingled/textured and then twisted with the at least one electrically conductive filament.
- the tearing resistance of the electrically conductive filament is hereby improved. Since the electrically conductive filament undergoes a permanent elongation in the event of an expansion and subsequent contraction of the hybrid yarn, the overlength of the electrically conductive filament can be distributed uniformly around the synthetic and/or natural fibre or the synthetic and/or natural multifibres and/or the synthetic and/or natural filament or the synthetic and/or natural multifilaments.
- the synthetic fibres or synthetic multifibres or synthetic filaments or synthetic multifilaments advantageously form a polyamide or polyester textured yarn.
- This material is especially tear-resistant and can easily be processed on industrial textile machines.
- the electrically conductive filaments are preferably copper or brass or aluminium monofilaments or multifilaments.
- the material is flexible with low spring elasticity and therefore can easily be processed in combination with natural or synthetic fibres or filaments on industrial textile machines.
- the electrically conductive filaments can also be polyamide or polyester monofilaments or multifilaments with vapour-coated or electrolytically coated metal surfaces such as those marketed under the trade name X-Static for example.
- the textile properties and the processability on industrial textile machines of these electrically conductive filaments approximately correspond to those of uncoated filaments or multifilaments.
- the electrically conductive filaments can also be carbon yarns such as those marketed under the trade name Beltron, for example.
- Carbon yarns are distinguished by a high elasticity and tearing resistance and are resistant to chemical influences, e.g. during chemical cleaning.
- the electrically conductive filaments can also be cut aluminium or aluminium-plastic composite films such as those marketed under the trade name Lurex for example.
- These electrically conductive filaments are particularly inexpensive and flexible.
- the electrically cut filaments can also be metal cut fibres disposed in the spun yarn.
- short metal cut fibres are disposed integrally in the spun yarn whereby these filaments are elastically stretchable without permanent elongation of the metal cut fibres. This property facilitates processing on industrial textile machines at high production rates.
- the antenna can be constructed as a half-wave dipole.
- the antenna can be constructed as a shortened dipole with extension coils.
- the embodiment makes it possible to arrange the antenna on a textile detection wafer whose dimensions are smaller than the half-wavelength of the working frequency of the electronic detection wafer.
- the antenna can be constructed as a quarter-wave ground plane comprising an emitter and a counterpoise.
- this embodiment matching to the output impedance of the electronic detection wafer and a good antenna efficiency are likewise ensured.
- this embodiment only requires a space requirement on the textile detection wafer which lies somewhat above a quarter wavelength of the working frequency of the electronic detection wafer.
- the antenna can be constructed as a shortened ground plane comprising a shortened emitter with an extension coil and a counterpoise.
- This embodiment is suitable for a textile detection wafer whose dimensions are smaller than the quarter wavelength of the working frequency of the electronic detection wafer. Compared to a shortened dipole, the space requirement is further reduced by about a half.
- the antenna can be constructed as a magnetic loop.
- the magnetic component of the electromagnetic field predominates in the near field. Damping influences from electrically conductive materials in the vicinity of the antenna thus have a weaker influence on the field propagation.
- connections of the antenna can be connected to connections of the chip module by an adhesive bond comprising an electrically conductive, furnace- or UV-curable adhesive paste.
- This embodiment makes it possible to achieve a reliable connection between the connections whilst at the same time protecting the textile structure.
- the embodiment is suitable for manual fabrication of small numbers of items and also for mechanical fabrication with large numbers of items.
- connections of the antenna can also be joined to connections of the chip module by an adhesive bond comprising an electrically conductive hot melt adhesive which can be applied warm and in liquid form and which hardens at ambient temperature.
- connections of the antenna can be joined to connections of the chip module by an adhesive bond comprising an electrically conductive hot melt adhesive provided on the textile carrier or connections of the chip module which can be activated by temporary heating and then hardened at ambient temperature.
- This embodiment makes it possible to achieve a reliable connection between the connections whilst at the same time protecting the textile structure.
- the embodiment is especially suitable for manual fabrication of small numbers of items but is also suitable for mechanical fabrication with large numbers of items.
- connections of the antenna can be joined to connections of the chip module by an adhesive bond comprising an electrically conductive adhesive film or an electrically conductive adhesive foil where the adhesive film or the adhesive foil is disposed on the connections of the chip module and is activated by pressure and heat during the adhesive process.
- This embodiment is also suitable for rapid manual and industrial fabrication since the connections only need to be brought in contact briefly by pressure and heat to make the connection and further work steps are eliminated.
- connections of the antenna can be joined to the connections of the chip module by a welded joint.
- connections of the antenna are joined to connections of the chip module by a crimped connection.
- the chip module can be fixed on the textile carrier by embroidery yarn.
- the textile antenna can be additionally fitted with the chip module and said module can be fixed. If, in this case, the embroidery yarn is used with an electrically conductive filament of the textile antenna, electrical contact is already produced between the connections of the textile antenna and the connections of the chip module.
- the embroidery yarn can wrap around soldering tags of the chip module.
- the embroidery yarn can penetrate into holes in the soldering tags of the chip module.
- This embodiment allows the chip module to be fixed and contacted positively.
- the chip module and the connections of the chip module can be potted using a protective compound as a globtop.
- the chip module and the connections of the chip module with the antenna are fixed on the textile carrier and protected against mechanical and chemical influences such as those which occur during usage of the textile goods and cleaning.
- Silicone for example, is suitable as the protective compound.
- the textile detection wafers preferably have constant dimensions when the textile label or the textile goods are different sizes, which are dimensioned at least according to the smallest technically still-feasible size of the textile detection wafer.
- the textile carrier As a result of the constant dimensions of the textile carrier, this can be manufactured with the antenna and the electronic chip module in standardised form and joined to textile labels or textile goods or the same or arbitrarily larger dimensions to form a textile information carrier. A considerably cost advantage is thus obtained during manufacture.
- the smallest technically still-feasible size of the textile detection wafer is predetermined by the working frequency of the electronic chip module and the geometrical dimensions of the textile antenna for which an adequate reading range is still ensured.
- the textile detection wafer can have standard electrical and electronic properties for different sizes of textile label or textile goods.
- the textile detection wafer can have the same reading range for different sizes of textile label or textile goods.
- This type of standardisation ensures that devices with readers fir identification of textile labels and textile goods during the manufacture, processing, during transportation, during storage, during distribution and during care and cleaning can be set up according to standard guidelines and parameters using reference detection wafers. Reliable identification of real textile information carriers used is then ensured during subsequent operation.
- the object is solved by the features of claim 37 .
- the textile detection wafer comprising the textile carrier with the textile antenna and the chip module can be manufactured in a standardised fashion independently of the textile label or the textile goods and is suitable for connection to different textile labels or textile goods.
- all the other components of the textile information carrier are made of textile material so that the textile property, especially the flexibility, is safeguarded.
- the textile detection wafer is preferably made of a textile carrier, an antenna is embroidered onto the textile carrier, a chip module is then positioned with its connections above connections of the antenna and then the connections of the chip module are connected in an electrically conducting fashion to the connections of the antenna.
- the antenna there is a greater freedom in the geometrically constructive configuration of the antenna.
- weaving the antenna can only be woven-in in the direction of manufacture or transverse thereto, embroidery allows the antenna to be arranged in any directions and changes of direction.
- the antenna can be manufactured on conventional industrial embroidery machines and thus can be manufactured very economically.
- the textile detection wafer can be produced on a textile carrier, an antenna can be embroidered on the textile carrier and a chip module can be positioned over connections of the antenna and fixed by embroidery yarn. At the same time as the fixing or subsequently, the connections of the chip module can be connected to the connections of the antenna in an electrically conducting fashion.
- textile labels or textile goods of different size can be joined to textile detection wafers of constant dimensions, the dimensions being determined according to the smallest still feasible size of the textile detection wafer.
- FIG. 1 is an embroidery base provided with embroidered antenna structures
- FIG. 2 is a schematic diagram of an equipping process using strip-shaped textile carriers
- FIG. 3 is a schematic diagram of an equipping process using isolated textile carriers
- FIG. 4 is a schematic diagram of a final manufacturing process
- FIG. 5 is a section through a textile information carrier.
- FIG. 1 shows an embroidery base 10 , also designated as embroidery web, with embroidered structures of textile antennae 12 .
- Fabrication takes place on an embroidery machine conventionally used in the textile industry.
- a section of embroidery base 10 from a roll 14 is fixed as raw material in an embroidery frame of the embroidery machine over the height and width of the embroidery frame and the structures of textile antennae 12 are embroidered in the selected pattern repeat over the entire width of the embroidery frame of the knitting machine.
- the embroidery base 10 located on the roll 14 can be provided with an adhesive film.
- the embroidery process is then repeated line by line over the height of the embroidery base.
- the embroidered section of the embroidery base 10 is then cut from the roll 14 and a new section from the roll 14 is clamped in the embroidery frame and embroidered in similar fashion.
- the individual textile detection wafers with the antenna structures 12 can be cut or stamped before or after equipping with the electronic chip module.
- chip modules can also be supplied and fixed with the embroidery yarn.
- connections of the chip module can be connected electrically preliminarily and permanently to connections of the textile antenna.
- FIG. 2 shows a schematic diagram of an equipping process with strip-shaped cohesive textile carriers 20 for the case where the chip modules 16 have not already been equipped and contacted during the embroidery but this takes place in a separate equipping process.
- Chip modules 16 are positioned using an equipping device 18 at the contact point provided over the connections of the textile antenna and then placed on the textile carrier 20 .
- the electronic chip module 16 is then connected to the textile carrier 20 and the connections of the electronic chip module 16 are connected to the connections of the antenna by pressure p and heat T. It is also possible to exclusively connect the connections of the electronic chip module 16 to the connections of the antenna and fix mechanically over the antenna.
- a protective compound 24 is then applied over the chip module 16 and the connections between the chip module 16 and the antenna by means of a spray device 22 .
- an adhesive film can be supplied at the same time as the equipping process and connected to the textile carrier 20 .
- the cohesive textile detection wafers 40 on the final blank are then cut or stamped into individual textile detection wafers 40 .
- a functional test of the finished textile detection wafers 40 with the electronic chip modules 16 is then carried out using a reader 26 .
- FIG. 3 shows a schematic diagram of an equipping process using isolated textile carriers 20 each of which have already been cut to the final dimensions.
- the textile carriers 20 are located in a storage device 28 .
- chip modules 16 are located in a storage device 30 .
- a textile carrier 20 and a chip module 16 are each supplied successively individually to an equipping device 18 by means of a feed device 32 , the textile carrier 20 is equipped with a chip module 16 and a connection is made between the connections of the chip module 16 and the connections of the textile antenna by pressure p and heat T.
- a protective compound 24 over the chip module 16 and the connections between the chip module 16 and the antenna by means of a spray device 22 .
- the finished textile detection wafers 40 finally enter into a storage device 34 .
- FIG. 4 shows a schematic diagram of a final production process.
- Finely perforated adhesive film from a roll 38 and then textile detection wafers 40 with chip modules and antennae from a storage device 34 are supplied to a web of textile labels 44 , such as Jacquard labels or satin labels on a roll 36 , for example.
- the textile detection wafers 40 are joined to the backs of the textile labels 44 over the finely perforated adhesive film under pressure 9 and heat T to form textile information carriers.
- the still cohesive textile information carriers are then separated by separating cuts of the web.
- FIG. 5 shows a section through a textile information carrier.
- This consists of a textile label 44 , comprising a front side 52 which carries optically visible information and a back side 54 which subsequently faces the textile goods when sewn in.
- a textile detection wafer 40 is connected to the back side 54 of the textile label 44 .
- the textile detection wafer 40 comprises a textile carrier 20 , an electronic chip module 16 with a protective compound 24 and an embroidered antenna comprising a hybrid yarn 46 and a yarn 48 .
- the embroidered antenna is positioned on the front side of the textile detection wafer 40 such that the hybrid yarn 46 comprising, for example, polyester texture multifilaments and copper monofilaments comes to rest against the back side 54 of the textile label 44 .
- the textile antenna and the chip module 16 thereby have maximum protection inside the structure.
- the part of the embroidered textile antenna on the back side of the textile detection wafer 40 consists of only one yarn 48 comprising polyester texture filaments or a normal embroidery yarn.
- the connection between the textile label 44 and the textile detection wafer 40 is made by adhesive points 50 or a finely perforated adhesive film.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Woven Fabrics (AREA)
- Credit Cards Or The Like (AREA)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510010841 DE102005010841A1 (de) | 2005-03-07 | 2005-03-07 | Textilinformationsträger und Verfahren zur Herstellung eines Textilinformationsträgers |
DE102005010841.5 | 2005-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060201571A1 true US20060201571A1 (en) | 2006-09-14 |
Family
ID=36587313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/369,091 Abandoned US20060201571A1 (en) | 2005-03-07 | 2006-03-06 | Textile information carrier and method for producing a textile information carrier |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060201571A1 (de) |
EP (1) | EP1701298A3 (de) |
DE (1) | DE102005010841A1 (de) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080083098A1 (en) * | 2006-10-04 | 2008-04-10 | Riri Group S.A. | Fluid-Tight Slide Fastener |
US20100005557A1 (en) * | 2007-10-04 | 2010-01-14 | Riri Group, S.A. | Fluid-tight slide fastener |
US20100321248A1 (en) * | 2007-07-04 | 2010-12-23 | Arjowiggins Security Integrale Solutions | Fibrous substrate for insert including an antenna |
CN102522346A (zh) * | 2011-12-23 | 2012-06-27 | 江苏安智博电子科技有限公司 | 电子标签直焊加工法 |
EP2897084A1 (de) * | 2014-01-20 | 2015-07-22 | King's Metal Fiber Technologies Co., Ltd. | Textilienstruktur |
US10354905B2 (en) * | 2015-03-11 | 2019-07-16 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
CN114664701A (zh) * | 2022-03-12 | 2022-06-24 | 上海潞淼物联网信息科技有限公司 | 一种应用于金属附着rfid电子标签封装设备及使用方法 |
US20220343123A1 (en) * | 2019-09-17 | 2022-10-27 | Lintec Corporation | Rfid-tagged flexible material, rfid-tagged article, and method for manufacturing rfid-tagged flexible material |
Families Citing this family (3)
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DE202007009845U1 (de) * | 2007-07-12 | 2008-11-13 | Gutehoffnungshütte Radsatz Gmbh | Vorrichtung zur berührungslosen Datenübertragung von einem Objekt an eine Abfrageeinrichtung |
DE102010017684B4 (de) * | 2010-07-01 | 2013-03-28 | Johann Kirnbauer | Verfahren zum Herstellen von Antennen für RFID-Transponder |
EP4402606A1 (de) * | 2021-09-16 | 2024-07-24 | SML Brand Identification Solutions Limited | Textilbasierte rfid-etiketten und herstellungsverfahren |
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EP2897084A1 (de) * | 2014-01-20 | 2015-07-22 | King's Metal Fiber Technologies Co., Ltd. | Textilienstruktur |
US10354905B2 (en) * | 2015-03-11 | 2019-07-16 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
US20220343123A1 (en) * | 2019-09-17 | 2022-10-27 | Lintec Corporation | Rfid-tagged flexible material, rfid-tagged article, and method for manufacturing rfid-tagged flexible material |
CN114664701A (zh) * | 2022-03-12 | 2022-06-24 | 上海潞淼物联网信息科技有限公司 | 一种应用于金属附着rfid电子标签封装设备及使用方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1701298A3 (de) | 2008-06-11 |
EP1701298A2 (de) | 2006-09-13 |
DE102005010841A1 (de) | 2006-09-14 |
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