US20060157228A1 - Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing - Google Patents
Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing Download PDFInfo
- Publication number
- US20060157228A1 US20060157228A1 US11/352,006 US35200606A US2006157228A1 US 20060157228 A1 US20060157228 A1 US 20060157228A1 US 35200606 A US35200606 A US 35200606A US 2006157228 A1 US2006157228 A1 US 2006157228A1
- Authority
- US
- United States
- Prior art keywords
- micro heat
- heat pipe
- section
- heat pipes
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001125 extrusion Methods 0.000 title description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000012530 fluid Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000010409 thin film Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
- F28F1/045—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular with assemblies of stacked elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0225—Microheat pipes
Abstract
A method for fabricating a metal micro heat pipe with a polygonal cross-section including at least two concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe. The concave sides are each formed of a single metal layer via a single drawing process. The polygonal cross-section is triangular, and the micro heat pipe is formed of a single metal plate.
Description
- The application is a Continuation of U.S. patent application Ser. No. 10,654,686 filed on Sep. 3, 2003 which claims the priority of Korean Patent Application No. 2002-80869, filed on Dec. 17, 2002, in the Korean Intellectual Property Office.
- 1. Field of the Invention
- The present invention relates to a heat pipe, and more particularly, to a micro heat pipe for small, thin-film type electronic devices.
- 2. Description of the Related Art
- With the advances of semiconductor manufacturing related technologies, chips packaged in electronic devices and systems have become smaller and have become more highly integrated. However, such chips and systems generate a larger amount of heat per unit area, so that effective cooling techniques are required. Specially, the latest small, thin-film type electronic devices require much smaller cooling devices.
- Conventionally, heat sinks, fans, small circular heat pipes having a diameter of 3 mm or greater, and the like have been used to cool small electronic devices. So far, heat sinks have been widely used as basic cooling devices because their size and thickness can be easily varied in the manufacturing process. However, as the size of heat sinks is reduced more and more, the heat dissipating area becomes smaller and the heat dissipating rate becomes lower. Meanwhile, fans have a limitation in that their size cannot be reduced unlimitedly. In addition, the fans are less reliable than other cooling devices.
- A small heat pipe with a circular cross-section having a diameter of 3 mm or greater can be compressed to be suitable for a thin-film type structure. However, when such a heat pipe is compressed, a wick thereof undergoes structural changes, and the heat transferring performance is greatly deteriorated. Therefore, there is a need to manufacture a micro heat pipe having a diameter of 3 mm or less for small, thin-film type electronic devices.
- The present invention provides a micro heat pipe suitable for small, thin-film type electronic devices.
- In accordance with an aspect of the present invention, there is provided a micro heat pipe with a polygonal cross-section that is manufactured via drawing and has flat or concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe.
- According to specific embodiments of the above micro heat pipe, the micro heat pipe may have at least one flat side. The polygonal cross-section of the micro heat pipe may be triangular or rectangular. Alternatively, a plurality of micro heat pipes with a polygonal cross-section are combined together in parallel to allow working fluid to flow by capillary force generated at the edges of each of the micro heat pipes.
- Another micro heat pipe according to the present invention is manufactured by forming a plurality of through holes with a polygonal cross-section in a metal plate via extrusion, in which each of the through holes has flat or concave sides to allow working fluid to flow by capillary force generated at the edges of each of the through holes.
- In this case, the through holes may have irregular sides. The through holes may be interconnected in groups. The polygonal cross-section of the through holes may be triangular or rectangular.
- The present invention also provides a micro heat pipe comprising a plurality of micro heat pipes with a polygonal cross-section sealed with a metal plate manufactured via extrusion, in which the plurality of micro heat pipes have flat or concave sides to allow working fluid to flow by capillary force generated at the edges of each of the through holes. The plurality of micro heat pipes may have at least one flat side. The polygonal cross-section of the micro heat pipes may be triangular or rectangular.
- As described above, a micro heat pipe according to the present invention can be manufactured easily via simple drawing or extrusion. The micro heat pipe according to the present invention can induce strong capillary force through simple structural modifications, without need to install a separate wick for flowing working fluid.
- The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
-
FIGS. 1A through 1C are perspective views of micro heat pipes having a triangular cross-section according to an embodiment of the present invention; -
FIGS. 2A through 2C are perspective views of micro heat pipes having a rectangular cross-section according to another embodiment of the present invention; -
FIGS. 3A and 3B are perspective views of groups of micro heat pipes having a triangular or rectangular cross-section according to another embodiment of the present invention; -
FIGS. 4A through 4D are perspective views of multi-through hole micro heat pipes having a triangular or rectangular cross-section according to another embodiment of the present invention; and -
FIG. 5 is a perspective view of sealed micro heat pipes having a rectangular cross-section according to still another embodiment of the present invention. - The present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provide so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.
- Referring to
FIGS. 1A through 1C , which are perspective views of micro heat pipes having a triangular cross-section according to an embodiment of the present invention, the micro heat pipes are manufactured via drawing. Working fluid is allowed to flow by capillary force generated at theedges - In particular, the micro heat pipe of
FIG. 1A with a triangular cross-section has threeflat sides 100. The micro heat pipe ofFIG. 1B with a triangular cross-section has threeconcave sides 110. The micro heat pipe ofFIG. 1C with a triangular cross-section has twoconcave sides 120 and oneflat surface 130. - The micro heat pipes of
FIGS. 1A through 1C may be made of metal, such as copper, easily via drawing. However, for the micro heat pipe ofFIG. 1A having the flat sides, the capillary radius is not small enough to induce capillary force at itsedges 101. To make the radius of curvature at theedges sides 110 of the micro heat pipe inFIG. 1B . - When each side of the micro heat pipe with a triangular cross-section is made concave, a capillary force that is strong enough to induce liquid flow can be generated due to the
sharp edges 111. However, in order for the micro heat pipe to be easily and stably packed onto a surface of a target heat-generating source, it is preferable that the micro heat pipe is made to have at least one flat side, like theside 130 of the micro heat pipe inFIG. 1C . -
FIGS. 2A through 2C are perspective views of micro heat pipes with a rectangular cross-section according to another embodiment of the present invention. - Like the micro heat pipes of
FIGS. 1A through 1C , the micro heat pipes having a rectangular cross-section inFIGS. 2A through 2C are manufactured via drawing. Working fluid is allowed to flow by capillary force generated at theedges - In particular, the micro heat pipe of
FIG. 2A with a rectangular cross-section has fourflat sides 140. The micro heat pipe ofFIG. 2B with a rectangular cross-section has fourconcave sides 150. The micro heat pipe ofFIG. 2C with a rectangular cross-section has threeconcave sides 160 and oneflat surface 170. - Although the capillary radius of the micro heat pipes with a rectangular cross-section of
FIGS. 2A through 2C is larger than the capillary radius of the micro heat pipes with a triangular cross-section ofFIGS. 1A through 1C , the micro heat pipes ofFIGS. 2A through 2C can allow a larger amount of working fluid to flow because they have onemore edge - In general, one or two micro heat pipes are mounted on a central processing unit (CPU) of commercially available notebook computers. The number of micro heat pipes to be mounted is determined by the internal chip-mount structure of the notebook computer and the cooling capacity of each micro heat pipe. However, if more compact electronic devices producing a greater amount of heat and having a thin-film type chip-mount structure is developed in the future, a wick-embedded heat pipe having a diameter of 3 mm or larger cannot be applied any longer. Accordingly, it is anticipated that a micro heat pipe with a triangular or rectangular cross-section that does not require a wick will soon be in demand.
- Although the above-embodiments have been described with reference to the micro heat pipes having a triangular or rectangular cross-section, a micro heat pipe according to the present invention may have any polygonal cross-section. It is also obvious that this concept of the present invention utilizing a polygonal cross-sectional structure can be applied to the micro heat pipes described bellows.
-
FIGS. 3A and 3B are perspective views of groups of micro heat pipes having a triangular or rectangular cross-section according to another embodiment of the present invention. Reference numerals inFIGS. 3A and 3B that are the same as those inFIGS. 1A through 1C andFIGS. 2A through 2C denote the same elements. - In particular, when there is a need to dissipate a larger amount of heat, the heat cannot be dissipated with only one of the micro heat pipes having a triangular or rectangular cross-section in
FIGS. 1A through 1C andFIGS. 2A through 2C . In this case, as illustrated inFIGS. 3A and 3B , a plurality of micro heat pipes having a triangular or rectangular cross-section may be combined together in parallel to increase the absolute heat transfer. - In
FIG. 3A , a plurality of micro heat pipes ofFIG. 1C are combined together in parallel. Alternatively, a plurality of micro heat pipes ofFIG. 1A or 1B may be combined together in parallel. In addition, a plurality of various micro heat pipes ofFIGS. 1A through 1C may be combined together in parallel. InFIG. 3B , a plurality of micro heat pipes ofFIG. 2C are combined in parallel. Alternatively, a plurality of micro heat pipes ofFIG. 2A or 2B may be combined together in parallel. In addition, a plurality of various micro heat pipes ofFIGS. 2A through 2C may be combined together in parallel. -
FIGS. 4A through 4D are perspective views of multi-through hole micro heat pipes having a triangular or rectangular cross-section according to another embodiment of the present invention. - In particular, the micro heat pipes of
FIGS. 4A through 4D are manufactured frommetal plates metal plates holes respective metal plates holes edges - In particular, the micro heat pipe of
FIG. 4A includes a plurality of throughholes 210 with a triangular cross-section in themetal plate 200. Each side of the throughholes 210 is concave toward outside. It will be obvious that the throughholes 210 may have flat sides. In addition, in order to minimize the space occupied by the throughholes 210, the throughholes 210 with a triangular cross-section may be formed such that their apexes alternate in an upward and downward direction. - The micro heat pipe of
FIG. 4B includes a plurality of throughholes 230 with a rectangular cross-section in themetal plate 220. Each side of the throughholes 230 is concave toward outside. It will be obvious that the throughholes 230 may have flat sides. - The micro heat pipe of
FIG. 4C includes a plurality of throughholes 250 with a polygonal cross-section, which is modified from the rectangular cross-sectional structure ofFIG. 4B , in themetal plate 240. The throughholes 250 with a polygonal cross-section have irregular sides. - The micro heat pipe of
FIG. 4D includes a plurality of throughholes 270 with a polygonal cross-section, which are arranged in groups of interconnected through holes, for example, two groups of three interconnected through holes, in themetal plate 260. -
FIG. 5 is a perspective view of sealed micro heat pipes having a rectangular cross-section according to still another embodiment of the present invention. - In particular, the sealed package of micro heat pipes of
FIG. 5 includes ametal plate 300. Themetal plate 300 is made of copper or aluminum via extrusion. A plurality ofmicro heat pipes 310 having a rectangular cross-section are closely arranged and sealed with the metal plate 30. In other words, the plurality ofmicro heat pipes 310 is sealed exclusively with the metal plate 30. In the sealed package of micro heat pipes ofFIG. 5 , working fluid is allowed to flow by capillary force generated at the edges of each of themicro heat pipes 310. - Although the embodiment of
FIG. 5 is illustrated with reference to themicro heat pipes 310 with a rectangular cross-section, it will be obvious that micro heat pipes with any polygonal cross-section, for example, a triangular or rectangular cross-section, as illustrated inFIGS. 1A through 1C andFIGS. 2A through 2C , may be sealed with such a metallic plate. In addition, the micro heat pipes with a polygonal cross-section sealed with the metal plate may have flat or concave sides. Alternatively, the micro heat pipes may have at least one flat side. - As described above, a micro heat pipe according to the present invention allows working fluid to flow by capillary force through structural modifications, without need to install a separate wick. The micro heat pipe according to the present invention can be manufactured easily via drawing or extrusion with higher productivity. The micro heat pipe according to the present invention has a diameter as small as 3 mm or less and effective heat dissipating and heat transfer performance, so that the micro heat pipe according to the present invention is quite suitable as a cooling device for small, thin-film type electronic devices.
- While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
Claims (3)
1. A method comprising:
fabricating a metal micro heat pipe with a polygonal cross-section including at least two concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe, the at least two concave sides each formed of a single metal layer via a single drawing process, wherein the polygonal cross-section is triangular, and the micro heat pipe is formed of a single metal plate.
2. The method of claim 16, wherein a plurality of micro heat pipes with a polygonal cross-section are combined together in parallel, and working fluid is allowed to flow by capillary force generated at the edges of each of the micro heat pipes.
3. The method of claim 16, wherein the edges of the metal micro heat pipe act as a wick.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/352,006 US20060157228A1 (en) | 2002-09-03 | 2006-02-10 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
US12/414,595 US20090188110A1 (en) | 2002-09-03 | 2009-03-30 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/654,686 US20040112572A1 (en) | 2002-12-17 | 2002-09-03 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
KR2002-80869 | 2002-12-17 | ||
KR1020020080869A KR20030053424A (en) | 2001-12-22 | 2002-12-17 | Micro heat pipe having a cross section of a polygon structure manufactured by extrusion and drawing process |
US11/352,006 US20060157228A1 (en) | 2002-09-03 | 2006-02-10 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/654,686 Continuation US20040112572A1 (en) | 2002-09-03 | 2002-09-03 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/701,610 Division US20070130769A1 (en) | 2002-09-03 | 2007-02-01 | Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060157228A1 true US20060157228A1 (en) | 2006-07-20 |
Family
ID=36682682
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/654,686 Abandoned US20040112572A1 (en) | 2002-09-03 | 2002-09-03 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
US11/352,006 Abandoned US20060157228A1 (en) | 2002-09-03 | 2006-02-10 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/654,686 Abandoned US20040112572A1 (en) | 2002-09-03 | 2002-09-03 | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing |
Country Status (1)
Country | Link |
---|---|
US (2) | US20040112572A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080185128A1 (en) * | 2005-04-19 | 2008-08-07 | Seok Hwan Moon | Flat Plate-Type Heat Pipe |
US20090266514A1 (en) * | 2008-04-24 | 2009-10-29 | Abb Research Ltd | Heat exchange device |
WO2010060302A1 (en) * | 2008-11-03 | 2010-06-03 | Zhao Yaohua | A heat pipe with arranged micro-pore tubes, its fabricating method and a heat exchanging system |
CN102506597A (en) * | 2008-11-03 | 2012-06-20 | 赵耀华 | Platy heat pipe and processing technology thereof |
CN103574938A (en) * | 2012-07-23 | 2014-02-12 | 深圳市鹏桑普太阳能股份有限公司 | Heating medium superconductive tube plate integrated collector plate core and manufacturing method thereof |
CN104006685A (en) * | 2014-05-06 | 2014-08-27 | 新疆太阳能科技开发公司 | Multi-array planar heat tube |
US20160109911A1 (en) * | 2014-10-15 | 2016-04-21 | Futurewei Technologies, Inc. | Support frame with integrated phase change material for thermal management |
US20170318702A1 (en) * | 2016-04-29 | 2017-11-02 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
US11022380B2 (en) | 2008-11-03 | 2021-06-01 | Guangwei Hetong Energy Techology (Beijing) Co., Ltd | Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7147045B2 (en) | 1998-06-08 | 2006-12-12 | Thermotek, Inc. | Toroidal low-profile extrusion cooling system and method thereof |
US6935409B1 (en) | 1998-06-08 | 2005-08-30 | Thermotek, Inc. | Cooling apparatus having low profile extrusion |
US7305843B2 (en) * | 1999-06-08 | 2007-12-11 | Thermotek, Inc. | Heat pipe connection system and method |
US7857037B2 (en) * | 2001-11-27 | 2010-12-28 | Thermotek, Inc. | Geometrically reoriented low-profile phase plane heat pipes |
US9113577B2 (en) | 2001-11-27 | 2015-08-18 | Thermotek, Inc. | Method and system for automotive battery cooling |
US7198096B2 (en) * | 2002-11-26 | 2007-04-03 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
US7080683B2 (en) * | 2004-06-14 | 2006-07-25 | Delphi Technologies, Inc. | Flat tube evaporator with enhanced refrigerant flow passages |
US7518868B2 (en) * | 2006-02-28 | 2009-04-14 | International Business Machines Corporation | Apparatus, system, and method for efficient heat dissipation |
WO2008019060A2 (en) * | 2006-08-03 | 2008-02-14 | U.S. Department Of Veterans Affairs Office Of General Counsel-Psg Iv (024) | Method for predicting onset/risk of atrial fibrillation (af) |
US20080087406A1 (en) * | 2006-10-13 | 2008-04-17 | The Boeing Company | Cooling system and associated method for planar pulsating heat pipe |
CN101504197B (en) * | 2009-03-02 | 2011-05-18 | 赵耀华 | Solar energy water heater |
EP2568789B1 (en) * | 2011-09-06 | 2014-04-16 | ABB Research Ltd. | Heat exchanger |
JP5677267B2 (en) * | 2011-11-07 | 2015-02-25 | 株式会社東芝 | Shape memory alloy actuator |
CN103837026A (en) * | 2014-03-18 | 2014-06-04 | 清华大学 | Microarray heat pipe gas-liquid heat exchange device |
KR20160015949A (en) * | 2014-08-01 | 2016-02-15 | 삼성전자주식회사 | Set-top box |
CN104913581A (en) * | 2015-05-29 | 2015-09-16 | 福州开发区引射低温制冷技术有限公司 | Aluminum alloy evaporating pipe for freezing device |
CN105698583A (en) * | 2016-03-23 | 2016-06-22 | 上海海洋大学 | Novel heat exchange tube |
CN107120988A (en) * | 2017-05-26 | 2017-09-01 | 成都东浩散热器有限公司 | A kind of heat abstractor of automobile engine |
USD1009813S1 (en) * | 2019-12-30 | 2024-01-02 | Asia Vital Components Co., Ltd. | Heat pipe |
JP7457760B2 (en) | 2022-07-29 | 2024-03-28 | 株式会社Uacj鋳鍛 | heat transfer plate |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4766953A (en) * | 1986-03-29 | 1988-08-30 | Mtu Motoren-Und Turbinen-Union Munchen Gmbh | Shaped tube with elliptical cross-section for tubular heat exchangers and a method for their manufacture |
US4998580A (en) * | 1985-10-02 | 1991-03-12 | Modine Manufacturing Company | Condenser with small hydraulic diameter flow path |
US5179043A (en) * | 1989-07-14 | 1993-01-12 | The Texas A&M University System | Vapor deposited micro heat pipes |
US5219021A (en) * | 1991-10-17 | 1993-06-15 | Grumman Aerospace Corporation | Large capacity re-entrant groove heat pipe |
US5251692A (en) * | 1991-06-20 | 1993-10-12 | Thermal-Werke Warme-, Kalte-, Klimatechnik Gmbh | Flat tube heat exchanger, method of making the same and flat tubes for the heat exchanger |
US5309986A (en) * | 1992-11-30 | 1994-05-10 | Satomi Itoh | Heat pipe |
US5527588A (en) * | 1994-10-06 | 1996-06-18 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Micro heat pipe panels and method for producing same |
US5642775A (en) * | 1995-02-16 | 1997-07-01 | Actronics Kabushiki Kaisha | Ribbon-like plate heat pipes |
US5682944A (en) * | 1992-11-25 | 1997-11-04 | Nippondenso Co., Ltd. | Refrigerant condenser |
US5704415A (en) * | 1994-11-25 | 1998-01-06 | Nippon Light Metal Co. Ltd. | Winding small tube apparatus and manufacturing method thereof |
US5875837A (en) * | 1998-01-15 | 1999-03-02 | Modine Manufacturing Company | Liquid cooled two phase heat exchanger |
US5960866A (en) * | 1996-11-15 | 1999-10-05 | Furukawa Electric Co., Ltd | Method for manufacturing cooling unit comprising heat pipes and cooling unit |
US6216343B1 (en) * | 1999-09-02 | 2001-04-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of making micro channel heat pipe having corrugated fin elements |
US6289981B1 (en) * | 1997-05-30 | 2001-09-18 | Showa Denko K.K. | Multi-bored flat tube for use in a heat exchanger and heat exchanger including said tubes |
US20020023735A1 (en) * | 2000-08-30 | 2002-02-28 | Akira Uchikawa | Double heat exchanger with condenser and radiator |
US20020121359A1 (en) * | 1999-07-01 | 2002-09-05 | Timo Heikkila | Method of installing heat source, and micro heat pipe module |
US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
US6935414B2 (en) * | 2001-10-09 | 2005-08-30 | Denso Corporation | Tube and heat exchanger having the same |
-
2002
- 2002-09-03 US US10/654,686 patent/US20040112572A1/en not_active Abandoned
-
2006
- 2006-02-10 US US11/352,006 patent/US20060157228A1/en not_active Abandoned
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4998580A (en) * | 1985-10-02 | 1991-03-12 | Modine Manufacturing Company | Condenser with small hydraulic diameter flow path |
US4766953A (en) * | 1986-03-29 | 1988-08-30 | Mtu Motoren-Und Turbinen-Union Munchen Gmbh | Shaped tube with elliptical cross-section for tubular heat exchangers and a method for their manufacture |
US5179043A (en) * | 1989-07-14 | 1993-01-12 | The Texas A&M University System | Vapor deposited micro heat pipes |
US5251692A (en) * | 1991-06-20 | 1993-10-12 | Thermal-Werke Warme-, Kalte-, Klimatechnik Gmbh | Flat tube heat exchanger, method of making the same and flat tubes for the heat exchanger |
US5219021A (en) * | 1991-10-17 | 1993-06-15 | Grumman Aerospace Corporation | Large capacity re-entrant groove heat pipe |
US5682944A (en) * | 1992-11-25 | 1997-11-04 | Nippondenso Co., Ltd. | Refrigerant condenser |
US5309986A (en) * | 1992-11-30 | 1994-05-10 | Satomi Itoh | Heat pipe |
US5527588A (en) * | 1994-10-06 | 1996-06-18 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Micro heat pipe panels and method for producing same |
US5704415A (en) * | 1994-11-25 | 1998-01-06 | Nippon Light Metal Co. Ltd. | Winding small tube apparatus and manufacturing method thereof |
US5642775A (en) * | 1995-02-16 | 1997-07-01 | Actronics Kabushiki Kaisha | Ribbon-like plate heat pipes |
US5960866A (en) * | 1996-11-15 | 1999-10-05 | Furukawa Electric Co., Ltd | Method for manufacturing cooling unit comprising heat pipes and cooling unit |
US6289981B1 (en) * | 1997-05-30 | 2001-09-18 | Showa Denko K.K. | Multi-bored flat tube for use in a heat exchanger and heat exchanger including said tubes |
US5875837A (en) * | 1998-01-15 | 1999-03-02 | Modine Manufacturing Company | Liquid cooled two phase heat exchanger |
US20020121359A1 (en) * | 1999-07-01 | 2002-09-05 | Timo Heikkila | Method of installing heat source, and micro heat pipe module |
US6216343B1 (en) * | 1999-09-02 | 2001-04-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of making micro channel heat pipe having corrugated fin elements |
US20020023735A1 (en) * | 2000-08-30 | 2002-02-28 | Akira Uchikawa | Double heat exchanger with condenser and radiator |
US6935414B2 (en) * | 2001-10-09 | 2005-08-30 | Denso Corporation | Tube and heat exchanger having the same |
US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080185128A1 (en) * | 2005-04-19 | 2008-08-07 | Seok Hwan Moon | Flat Plate-Type Heat Pipe |
US20090266514A1 (en) * | 2008-04-24 | 2009-10-29 | Abb Research Ltd | Heat exchange device |
US11022380B2 (en) | 2008-11-03 | 2021-06-01 | Guangwei Hetong Energy Techology (Beijing) Co., Ltd | Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe |
WO2010060302A1 (en) * | 2008-11-03 | 2010-06-03 | Zhao Yaohua | A heat pipe with arranged micro-pore tubes, its fabricating method and a heat exchanging system |
CN102506597A (en) * | 2008-11-03 | 2012-06-20 | 赵耀华 | Platy heat pipe and processing technology thereof |
CN103574938A (en) * | 2012-07-23 | 2014-02-12 | 深圳市鹏桑普太阳能股份有限公司 | Heating medium superconductive tube plate integrated collector plate core and manufacturing method thereof |
CN104006685A (en) * | 2014-05-06 | 2014-08-27 | 新疆太阳能科技开发公司 | Multi-array planar heat tube |
US20160109911A1 (en) * | 2014-10-15 | 2016-04-21 | Futurewei Technologies, Inc. | Support frame with integrated phase change material for thermal management |
US9836100B2 (en) * | 2014-10-15 | 2017-12-05 | Futurewei Technologies, Inc. | Support frame with integrated phase change material for thermal management |
US10694641B2 (en) * | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
US10917994B2 (en) | 2016-04-29 | 2021-02-09 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in rack servers |
US20170318702A1 (en) * | 2016-04-29 | 2017-11-02 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
US11324139B2 (en) * | 2016-04-29 | 2022-05-03 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes |
Also Published As
Publication number | Publication date |
---|---|
US20040112572A1 (en) | 2004-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20060157228A1 (en) | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing | |
US20090188110A1 (en) | Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing | |
US10524388B2 (en) | Loop heat pipe and electronic device | |
US7028758B2 (en) | Heat dissipating device with heat pipe | |
US7025125B2 (en) | Heat dissipating device with heat pipe | |
US7414843B2 (en) | Method and apparatus for a layered thermal management arrangement | |
US7296617B2 (en) | Heat sink | |
US20070246193A1 (en) | Orientation insensitive thermosiphon of v-configuration | |
US7497249B2 (en) | Thermosiphon for laptop computer | |
US7269014B1 (en) | Heat dissipation device | |
US20070215321A1 (en) | Heat dissipation device | |
US20060032616A1 (en) | Compound heat-dissipating device | |
US20050286232A1 (en) | Heat sink | |
US20130003303A1 (en) | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | |
US9179577B2 (en) | Flat heat pipe and fabrication method thereof | |
US20080017350A1 (en) | Heat sink | |
US20060215368A1 (en) | Heat-dissipating module and electronic apparatus having the same | |
JP2001196511A (en) | Heat sink and method of its manufacturing and cooler using it | |
US10108237B1 (en) | Heat dissipating device with improved cooling performance | |
US20100051236A1 (en) | Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base | |
KR100609714B1 (en) | Micro heat pipe having a cross section of a polygon structure manufactured by extrusion and drawing process | |
US20080011452A1 (en) | Heat sink | |
WO2009058515A1 (en) | Method and system for removing heat | |
US20070095509A1 (en) | Heat dissipation having a heat pipe | |
KR101880533B1 (en) | Sintered flat panel heat dissipation structure comprising Aluminum powder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |