US20050016862A1 - Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device - Google Patents
Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device Download PDFInfo
- Publication number
- US20050016862A1 US20050016862A1 US10/920,376 US92037604A US2005016862A1 US 20050016862 A1 US20050016862 A1 US 20050016862A1 US 92037604 A US92037604 A US 92037604A US 2005016862 A1 US2005016862 A1 US 2005016862A1
- Authority
- US
- United States
- Prior art keywords
- zinc oxide
- aqueous solution
- thin film
- oxide thin
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 title claims abstract description 451
- 239000011787 zinc oxide Substances 0.000 title claims abstract description 226
- 239000010409 thin film Substances 0.000 title claims abstract description 164
- 238000000034 method Methods 0.000 title claims abstract description 151
- 239000004065 semiconductor Substances 0.000 title claims description 56
- 239000007864 aqueous solution Substances 0.000 claims abstract description 144
- 239000000758 substrate Substances 0.000 claims abstract description 131
- -1 ammonium ions Chemical class 0.000 claims abstract description 31
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims abstract description 25
- 150000002500 ions Chemical class 0.000 claims abstract description 20
- 239000010408 film Substances 0.000 claims description 27
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims description 24
- 229930195733 hydrocarbon Natural products 0.000 claims description 10
- 150000002430 hydrocarbons Chemical class 0.000 claims description 10
- 239000004215 Carbon black (E152) Substances 0.000 claims description 9
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004246 zinc acetate Substances 0.000 claims description 9
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 3
- JDLYKQWJXAQNNS-UHFFFAOYSA-L zinc;dibenzoate Chemical compound [Zn+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 JDLYKQWJXAQNNS-UHFFFAOYSA-L 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 18
- IWLXWEWGQZEKGZ-UHFFFAOYSA-N azane;zinc Chemical compound N.[Zn] IWLXWEWGQZEKGZ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 253
- 238000006243 chemical reaction Methods 0.000 description 55
- 229910052751 metal Inorganic materials 0.000 description 53
- 239000002184 metal Substances 0.000 description 53
- 238000004544 sputter deposition Methods 0.000 description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 30
- 229910021417 amorphous silicon Inorganic materials 0.000 description 26
- 230000012010 growth Effects 0.000 description 24
- 230000002159 abnormal effect Effects 0.000 description 23
- 238000000151 deposition Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 23
- 239000000243 solution Substances 0.000 description 21
- 229910052709 silver Inorganic materials 0.000 description 20
- 230000008021 deposition Effects 0.000 description 19
- 239000010949 copper Substances 0.000 description 18
- 238000004070 electrodeposition Methods 0.000 description 18
- 229930006000 Sucrose Natural products 0.000 description 17
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 17
- 239000005720 sucrose Substances 0.000 description 17
- 238000012360 testing method Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 14
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 13
- 230000003247 decreasing effect Effects 0.000 description 13
- 229910052725 zinc Inorganic materials 0.000 description 13
- 239000011701 zinc Substances 0.000 description 13
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 12
- 238000005406 washing Methods 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 229910001220 stainless steel Inorganic materials 0.000 description 11
- 239000010935 stainless steel Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 238000001771 vacuum deposition Methods 0.000 description 10
- 229920001353 Dextrin Polymers 0.000 description 9
- 239000004375 Dextrin Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 239000003513 alkali Substances 0.000 description 9
- 238000000149 argon plasma sintering Methods 0.000 description 9
- 230000002542 deteriorative effect Effects 0.000 description 9
- 235000019425 dextrin Nutrition 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 6
- 239000002210 silicon-based material Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 238000005253 cladding Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910003437 indium oxide Inorganic materials 0.000 description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 239000011669 selenium Substances 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 5
- 229940007718 zinc hydroxide Drugs 0.000 description 5
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000006174 pH buffer Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 229910017875 a-SiN Inorganic materials 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229910000078 germane Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 240000002329 Inga feuillei Species 0.000 description 1
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- NHUOVHDOECDKGN-UHFFFAOYSA-L O.O.O.O.O.O.C(=O)[O-].[Zn+2].C(=O)[O-] Chemical compound O.O.O.O.O.O.C(=O)[O-].[Zn+2].C(=O)[O-] NHUOVHDOECDKGN-UHFFFAOYSA-L 0.000 description 1
- JIRMQEPRKFTWOK-UHFFFAOYSA-L O.O.O.O.O.O.[Zn+2].CC([O-])=O.CC([O-])=O Chemical compound O.O.O.O.O.O.[Zn+2].CC([O-])=O.CC([O-])=O JIRMQEPRKFTWOK-UHFFFAOYSA-L 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910020328 SiSn Inorganic materials 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- JIMODRYHNQDMSX-UHFFFAOYSA-N [GeH2].[Si] Chemical compound [GeH2].[Si] JIMODRYHNQDMSX-UHFFFAOYSA-N 0.000 description 1
- FVHZQIFPSUKNBR-UHFFFAOYSA-N [O-2].[Zn+2].[O-2].[Zn+2].[O-2].[Zn+2].[O-2].[Zn+2] Chemical compound [O-2].[Zn+2].[O-2].[Zn+2].[O-2].[Zn+2].[O-2].[Zn+2] FVHZQIFPSUKNBR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- GUBGYTABKSRVRQ-QUYVBRFLSA-N beta-maltose Chemical compound OC[C@H]1O[C@H](O[C@H]2[C@H](O)[C@@H](O)[C@H](O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@@H]1O GUBGYTABKSRVRQ-QUYVBRFLSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 150000002016 disaccharides Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009791 electrochemical migration reaction Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002772 monosaccharides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
-
- H01L31/02167—
-
- H01L31/0236—
-
- H01L31/02363—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method of producing a zinc oxide thin film, a method of producing a photovoltaic device, and a method of producing a semiconductor device substrate.
- a reflecting layer formed on the back thereof is utilized for improving a collection efficient at long wavelengths.
- a reflecting layer preferably exhibits effective reflection properties at a wavelength near the band ends of a semiconductor material at which absorption is low, i.e., a wavelength of 800 to 1200 nm.
- Materials satisfying this condition include metals such as gold, silver, copper and aluminum.
- an uneven layer optically transparent in the predetermined wavelength range is generally provided as a light confinement layer between the metal layer and a semiconductor layer in order to improve a short-circuit current density Jsc by effectively utilizing reflected light.
- a layer comprising a translucent material exhibiting conductivity i.e., a transparent conductive layer, is provided between the metal layer and the semiconductor layer.
- these layers are deposited by a method such as vacuum deposition or sputtering, and show an improvement of 1 mA/cm 2 or more in short-circuit current density.
- T. Tiedje, et al., Proc. 16th IEEE Photovoltaic Specialist Conf. (1982), p. 1423 and H. Deckman, et al., Proc. 16th IEEE Photovoltaic Specialist Conf. (1982); p. 1425 disclose a technique in which a back electrode is formed in a shape having unevenness (texture structure) of a size substantially the same as light wavelength, for scattering light. This lengthens the optical path in a semiconductor layer by scattering light at long wavelengths which is not absorbed by the semiconductor layer, and increases a short-circuit photoelectric current by improving the long wavelength sensitivity of a photovoltaic device, thereby improving the efficiency of photoelectric conversion.
- Zinc oxide has higher resistance to a plasma than tin oxide and indium oxide, and is not reduced by hydrogen even in a plasma containing hydrogen. Therefore, in forming a semiconductor layer comprising amorphous silicon on a transparent conductive layer by a plasma CVD process, a zinc oxide thin film is positively used as the transparent conductive layer.
- Japanese Patent Laid-Open No. 60-84888 (Energy Conversion Devices) discloses a technique in which a transparent conductive layer is interposed between a back electrode and a semiconductor layer to decrease a current flowing in a defect region of the semiconductor layer.
- a zinc oxide thin film is preferably used as the light confinement layer having a texture structure surface.
- an increase in current density or concentration of the solution causes the problem of easily producing abnormal growth of a needle-like, spherical, resin-like shape of the micron order or more on the deposited thin film.
- the use of such a zinc oxide thin film as a part of a photovoltaic device possibly causes the abnormal growth to induce a shunt path in the photovoltaic device.
- the zinc oxide thin film formed by one of the above methods has lower adhesion to a substrate than the vacuum deposition method using resistance heating, an electron beam or the like, the sputtering method, an ion plating method, and the CVD method.
- a zinc oxide thin film suitable for application to a light confinement layer of a photovoltaic device is formed.
- the present invention provides the following methods of producing a zinc oxide thin film and photovoltaic devices formed by using the producing methods.
- a method of producing a zinc oxide thin film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc ions, ammonium ions, and zinc ammonia complex ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
- This producing method is capable of electrochemically forming a zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at wavelength of 600 to 1000 nm. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost. Particularly, the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- the conductive substrate comprises a transparent conductive layer deposited on a support.
- This producing method is capable of relatively easily and uniformly forming an initial film of zinc oxide, and efficiently forming the zinc oxide layer.
- the zinc oxide film can be electrochemically formed on the conductive substrate by protecting a high-reflectance metal previously formed on the conductive substrate having an important function.
- the hydrogen ion concentration (pH) of the aqueous solution for forming the zinc oxide thin film is controlled in the range of 8 to 12.5.
- This producing method is capable of relatively stably supplying complex ions such as the zinc ammonia complex ions or the like by keeping the solution for forming the zinc oxide thin film alkali, and efficiently forming the zinc oxide layer. Also, since the solution for forming the zinc oxide thin film is kept alkali, a wide range of substrates having no need for acid resistance can be used.
- the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin film is formed is controlled in the range of 6 to 8. Since the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin film is formed is locally controlled in the range of 6 to 8, the dense zinc oxide thin film can be continuously formed. At the same time, the hydrogen ion concentration of the aqueous solution in the bulk region is preferably in the range described in (1-3).
- the aqueous solution for forming a zinc oxide thin film contains a hydrocarbon. This producing method can significantly suppress abnormal growth in the zinc oxide layer, and thus further improve yield. The uniformity of the zinc oxide layer can further be improved.
- a method of producing a photovoltaic device comprising the step of forming the zinc oxide thin film.
- This forming step is capable of electrochemically forming the zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at a wavelength of 600 to 1000 nm. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost.
- the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- a method of producing a zinc oxide thin film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc ions, hydrogenzincate ions (HZnO 2 ⁇ ) and zincate ions (ZnO 2 2 ⁇ ) and an electrode as a cathode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
- This producing method is capable of electrochemically forming a zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at wavelength of 600 to 1000 nm.
- the zinc oxide thin film contains no zinc metal. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost. Particularly, the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- the conductive substrate comprises a transparent conductive layer deposited on a support.
- This producing method is capable of relatively easily and uniformly forming an initial film of zinc oxide, and efficiently forming the zinc oxide layer.
- the zinc oxide film can be electrochemically formed on the conductive substrate by protecting a high-reflectance metal previously formed on the conductive substrate having an important function.
- the hydrogen ion concentration (pH) of the aqueous solution for forming the zinc oxide thin film is controlled in the range of 8 to 12.5.
- This producing method is capable of relatively stably supplying ions such as the hydrogenzincate ions, zincate ions and the like by keeping the solution for forming the zinc oxide thin film alkali, and efficiently forming the zinc oxide layer. Also, since the solution for forming the zinc oxide thin film is kept alkali, a wide range of substrates having no need for acid resistance can be used.
- the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin-film is formed is controlled in the range of 6 to 8. Since the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin film is formed is locally controlled in the range of 6 to 8, the dense zinc oxide thin film can be continuously formed. At the same time, the hydrogen ion concentration of the aqueous solution in the bulk region is preferably in the range described in (2-3).
- the aqueous solution for forming a zinc oxide thin film contains a hydrocarbon. This producing method can significantly suppress abnormal growth in the zinc oxide layer, and thus further improve yield. The uniformity of the zinc oxide layer can further be improved.
- a method of producing a photovoltaic device comprising the step of forming the zinc oxide thin film.
- This forming step is capable of electrochemically forming the zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at a wavelength of 600 to 1000 nm. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost.
- the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- a method of producing a zinc oxide thin film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least carboxylic acid ions and zinc ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
- This producing method is capable of forming the zinc oxide film having excellent optical properties at low material cost without the need for a large-scale apparatus.
- the aqueous solution is an aqueous solution of zinc acetate. This producing method is capable of forming the zinc oxide film having excellent optical properties at low material cost without the need for a large-scale apparatus.
- the aqueous solution is an aqueous solution of a zinc formate. This producing method is capable of forming the zinc oxide film having excellent optical properties at low material cost without the need for a large-scale apparatus.
- the conductive substrate comprises a transparent conductive layer deposited on a support. This producing method is capable of forming the zinc oxide thin film having less abnormal growth and excellent uniformity.
- the hydrogen ion concentration pH of the aqueous solution for depositing the zinc oxide thin film is controlled in the range of 3.5 to 5.5. This producing method is capable of forming the zinc oxide thin film having less abnormal growth and excellent uniformity.
- a method of producing a photovoltaic device comprising the step of forming the zinc oxide thin film. This producing method is capable of stably forming the high-performance device at low cost.
- FIG. 1 is a schematic sectional view showing an example of apparatus for producing a zinc oxide thin film of the present invention
- FIG. 2 is a schematic sectional view showing an example of apparatus for continuously producing a zinc oxide thin film of the present invention:
- FIG. 3A is a schematic sectional view showing an example of a photovoltaic device having a zinc oxide thin film of the present invention
- FIG. 3B is a top view of the same:
- FIG. 4 is a schematic sectional view showing an example of the configuration of a semiconductor layer
- FIG. 5A is a schematic exploded sectional view showing an example of the configuration of a photovoltaic device module, and FIG. 5B is a top view of the device portion thereof;
- FIG. 6 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution and efficiency of photoelectric conversion
- FIG. 7 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution near the uppermost surface where a zinc oxide thin film is formed and efficiency of photoelectric conversion;
- FIG. 8 is a graph showing the relation between the sucrose content of an aqueous solution and efficiency of photoelectric conversion
- FIG. 9 is a graph showing the relation between the dextrin content of an aqueous solution and efficiency of photoelectric conversion
- FIG. 10 is a schematic sectional view showing an example in which a zinc oxide thin film of the present invention was applied to a CIGS type photovoltaic device;
- FIG. 11 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution and efficiency of photoelectric conversion
- FIG. 12 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution near the uppermost surface where a zinc oxide thin film is formed and efficiency of photoelectric conversion;
- FIG. 13 is a graph showing the relation between the sucrose content of an aqueous solution and efficiency of photoelectric conversion
- FIG. 14 is a graph showing the relation between the dextrin content of an aqueous solution and efficiency of photoelectric conversion
- FIG. 15 is a schematic sectional view showing an example of apparatus for continuously producing a zinc oxide thin film of the present invention.
- FIG. 16 is a schematic sectional view showing an example of apparatus for continuously producing a zinc oxide thin film of the present invention.
- FIG. 17 is a graph showing changes in pH of an aqueous solution in Examples 22 to 24.
- FIG. 1 shows an example of apparatus for forming the zinc oxide film of the present invention.
- An aqueous solution 102 of the present invention is held in a corrosion-resistant vessel 101 .
- a conductive substrate 103 serves as a cathode
- a counter electrode 104 can be made of platinum, carbon, platinum-plated titanium, or the like other than zinc as a metal to be deposited in a liquid phase.
- the counter electrode 104 serves as an anode.
- Load resistance 106 and a power supply 105 are connected between the conductive substrate 103 serving as a cathode, and the counter electrode 104 serving as an anode so as to pass a substantially constant current.
- a solution circulation system which comprises an inlet bar 108 having a plurality of solution inlets, an injection bar 107 having a plurality of solution injection ports, a solution circulating pump 111 , an intake solution pipe 109 connecting the solution inlet bar 108 and the solution circulating pump 111 , and an injection solution pipe 110 connecting the solution injection bar 107 and the solution circulating pump 111 .
- stirring means such as a magnetic stirrer or the like can be used in place of such a solution circulating system.
- a heater 112 and a thermocouple 113 are used for controlling the temperature of the aqueous solution while monitoring the temperature.
- the temperature of the aqueous solution is preferably 50° C. or higher.
- the conductive substrate 103 may be previously immersed in a hot water bath 114 in order to heat the conductive substrate 103 .
- Hot water whose temperature is controlled by using a heater 115 and a thermocouple 116 is contained in the hot water bath 114 so that the conductive substrate 103 can be heated.
- the conductive substrate 103 is preferably formed by depositing a metal layer as a reflecting layer on a support.
- a metal layer as a reflecting layer on a support.
- aluminum has high reflectance for light at wavelengths of 600 to 1000 nm, and causes no electrochemical migration, and is thus a most promising metal for the metal layer of a photovoltaic device.
- a transparent conductive thin layer is preferably provided on aluminum.
- the transparent conductive layer must be transparent for light at wavelengths of 600 to 1000 nm, and have some conductivity.
- the transparent conductive layer is made of tin oxide (SnO 2 ), indium oxide (In 2 O 3 ), ITO (SnO 2 +In 2 O 3 ), zinc oxide (ZnO), indium zinc oxide, tin zinc oxide, or the like. These oxides can be deposited by the sputtering method, the CVD method, or the vacuum deposition method; The zinc oxide thin film can be formed on the transparent conductive layer by the method of the present invention. For light at wavelengths of 600 to 1000 nm, light confinement or light scattering is sufficiently achieved. Therefore, the photovoltaic device of the present invention exhibits high quality and low power cost.
- Conditions for forming the zinc oxide thin film will be described for each of the aqueous solutions used. Since the formation conditions below depend upon the type, sectional shape and crystal state of the metal layer, the conditions cannot be determined collectively. However, generally, as the ion concentration increases, the grain size of zinc oxide crystals increases, and unevenness easily occurs in the surface. As the formation temperature decreases, the grain size of zinc oxide crystals increases.
- unevenness is preferably formed on the surface at a current density increased for decreasing the cost of the transparent conductive layer comprising zinc oxide.
- the aqueous solution 102 contains at least zinc ions, ammonium ions, and zinc ammonia complex ions (zinc ammine complex ions).
- the conductive substrate 103 and the counter electrode 104 are used as a cathode and an anode, respectively.
- an aqueous solution such as an ammonia aqueous solution of zinc hydroxide, an ammonia aqueous solution of zinc acetate, an ammonia aqueous solution of zinc oxalate, an ammonia aqueous solution of zinc oxide or the like is used.
- the concentration of zinc ammonia complex ions is preferably 0.001 to 3.0 mol/l.
- the hydrogen ion exponent (pH) of the aqueous solution is preferably controlled in the range of pH 8 to pH 12.5.
- the temperature is preferably 50° C. or higher.
- the current density on the surface of the conductive substrate is preferably 0.1 to 100 mA/cm 2 .
- the power source 105 is connected so that the conductive substrate 103 and the counter electrode 104 serve as an anode and a cathode, respectively.
- an aqueous solution such as an ammonia aqueous solution of zinc hydroxide, an ammonia aqueous solution of zinc acetate, an ammonia aqueous solution of zinc oxalate, an ammonia aqueous solution of zinc oxide, or the like is used.
- concentration of ions such as hydrogenzincate ions, zincate ions and the like is preferably 0.01 to 3.0 mol/l.
- the hydrogen ion exponent (pH) of the aqueous solution is preferably controlled in the range of pH 8 to pH 12.5.
- the temperature is preferably 50° C. or higher.
- the current density on the surface of the conductive substrate is preferably 0.1 to 100 mA/cm 2 .
- a hydrocarbon for example, 1 to 300 g/l of sucrose or 0.001 to 10 g/l of dextrin.
- a hydrocarbon for example, 1 to 300 g/l of sucrose or 0.001 to 10 g/l of dextrin.
- a hydrocarbon to the aqueous solution is capable of suppress abnormal growth of a crystal.
- a hydrocarbon for example, a monosaccharide such as glucose, fructose, or the like; a disaccharide such as maltose, sucrose, or the like; or a polysaccharide such as dextrin, starch, or the like can be used.
- a good zinc oxide thin film can be formed.
- the amount of the hydrocarbon added to the aqueous solution is preferably in the range of 0.001 to 300 g/l, more preferably in the range of 0.005 to 100 g/l, and most preferably in the range of 0.01 to 60 g/l.
- the aqueous solution 102 contains at least carboxylic acid ions and zinc ions is described.
- the conductive substrate 103 and the counter electrode 104 are used as a cathode and an anode, respectively.
- aqueous solution for example, an aqueous solution containing carboxylic acid ions and zinc ions originating from zinc acetate or zinc formate can be used.
- concentration of carboxylic acid ions is preferably 0.002 to 2.0 mol/l, more preferably 0.05 to 1.0 mol/l, and most preferably 0.025 to 0.3 mol/l.
- the applied current is preferably 0.1 to 100 mA/cm 2 , more preferably 1 to 30 mA/cm 2 and most preferably 3 to 16 mA/cm 2 .
- the solution temperature is preferably 50° C. or higher.
- the hydrogen ion exponent (pH) of the aqueous solution is preferably controlled in the range of pH 3.5 to pH 5.5.
- FIG. 2 shows an apparatus capable of continuously forming a zinc oxide thin film on the surface of a long sheet-shaped conductive substrate 201 having flexibility in an aqueous solution.
- the conductive substrate 201 is wound in a roll on a feed roll 202 , and rewound on a take-up roll 203 for rewinding the conductive substrate 201 through many transfer rolls 204 .
- the diameter of each of the rolls must be determined in accordance with the material of the conductive substrate 201 .
- the conductive substrate 201 is heated in a hot water tank 205 with a circulation system 206 containing a filter for removing dust particles and connected thereto, and a heater 207 is provided in the hot water tank 205 .
- the zinc oxide thin film is formed in a liquid phase deposition tank 208 to which a circulation system 209 containing a filter for removing dust particles is connected, with a zinc electrode 210 and a heater 21 provided in the liquid phase deposition tank 208 .
- a constant current power source 212 is provided outside the liquid phase deposition tank 208 , and connected to the zinc electrode 210 .
- the circulation system 209 comprises a system for monitoring the solution concentration and on occasion adding a solution.
- a circulation system 214 containing a filter for removing dust particles.
- the conductive substrate 201 is dried with hot air in a drying chamber 215 .
- This apparatus is capable of forming the zinc oxide thin film at low cost.
- FIG. 3A is a schematic sectional view showing an example of a photovoltaic device to which the zinc oxide thin film formed by the method of the present invention was applied.
- the photovoltaic device comprises a support 301 - 1 , a metal layer 301 - 2 , a transparent conductive layer 301 - 3 , a zinc oxide layer 302 formed by the method of the present invention, a semiconductor layer 303 , a transparent conductive layer 304 , and a collecting electrode 305 .
- the support 301 - 1 , the metal layer 301 - 2 and the transparent conductive layer 301 - 3 constitutes a conductive substrate 301 according to the present invention.
- Sunlight is incident on the photovoltaic device from the transparent conductive layer 304 side.
- Light at short wavelengths of 500 nm or less is mostly absorbed by the semiconductor layer 303 .
- light at long wavelengths of about 700 nm or more, which is longer than the band absorption ends is partially transmitted through the semiconductor layer 303 , passes through the zinc oxide layer 302 as a transmitting layer, is reflected by the metal layer 301 - 2 or the support 301 - 1 , again passes through the zinc oxide layer 302 as a transmitting layer, and is then partially or mostly absorbed by the semiconductor layer 303 .
- the optical path of light transmitted through the semiconductor layer 303 is lengthened due to inclination of the optical path, and thus an increase in absorption is expected.
- the increase in absorption due to lengthening of the optical path is negligibly small in a layer transparent for light, the increase is exponential for light in the region where some absorption is present, i.e., for light at wavelengths near the absorption edged of a material.
- the zinc oxide layer 302 as a transparent layer is transparent for external light ranging from visible light to infrared light, light at wavelengths of 600 to 1200 nm is absorbed by the semiconductor layer 303 .
- FIG. 3B is a schematic drawing of the photovoltaic device as viewed from the incident side, in which a plurality of collecting electrodes 305 are arranged so as not to cross the surface of the device.
- the collecting electrodes 305 are arranged in a comb-like form as viewed from the incident side, ends thereof being electrically connected to a bus bar 306 .
- the bus bar 306 is formed on the collecting electrodes 305 and made of a metallic material having high conductivity, such as a Cu plate or the like.
- the bus bar 306 is adhered to the transparent conductive layer 304 with an insulating double side tape arranged therebetween.
- FIG. 4 shows an example of the internal structure of the semiconductor layer 303 made of a hydrogen-containing non-single crystal silicon material and having at least one p-i-n junction therein. This example has three p-i-n junctions.
- the semiconductor layer comprises layers laminated in turn and made of hydrogen-containing non-single crystal silicon materials.
- Doped layers- 401 , 403 , 404 , 406 , 407 and 409 are conductive layers exhibiting p-type or n-type conduction.
- the first doped layer 401 , the third doped layer 404 and the fifth doped layer 407 exhibit the same conductivity, and the second, fourth and sixth doped layers 403 , 406 and 409 exhibit conductivity different from the above doped layers 401 , 404 and 407 .
- First, second and third i-type semiconductor layers (i layers) 402 , 405 and 408 exhibit intrinsic conductivity. From the viewpoint of efficiency of light collection, the following condition is preferably satisfied:
- Band gap of the first i layer 402 ⁇ band gap of the second i layer 405 ⁇ band gap of the third i layer 408 .
- a n-type semiconductor layer (n layer) or a p-type semiconductor layer (p layer) can be used as each of the doped layers.
- FIG. 5A is an exploded sectional view showing a photovoltaic device module in accordance with an embodiment of the present invention
- FIG. 5B is a plan view showing a portion including the photovoltaic devices 507 and the bypass diodes 506 shown in FIG. 5A
- a plurality of the photovoltaic devices 507 are arranged in series, and the bypass diodes 506 are respectively connected to the photovoltaic device 507 in parallel so that even when one of the photovoltaic devices shadows, the total voltage of the other photovoltaic devices is not applied to the photovoltaic device shadowing.
- the members are sealed by a fluororesin 523 and a supporting substrate 501 to suppress entrance of water vapor.
- Each of the collecting electrodes 515 used in the photovoltaic device module comprises a silver cladding layer and a carbon layer containing an acrylic resin as a binder, both of which are formed around a fine copper wire, the collecting electrodes 515 being fused to the transparent conductive layer by heating.
- the silver cladding layer has the function to decrease contact resistance with the copper wire.
- the carbon layer containing an acrylic resin as a binder has the function to maintain adhesion to the transparent conductive layer, and the function to decrease contact resistance with the silver cladding layer.
- the carbon layer also has the function to prevent diffusion of the silver contained in the silver cladding layer into the semiconductor layer.
- the support used in the present invention may comprise a single material or one or a plurality of thin films formed on the support.
- the support may be electrically insulative as long as a surface thereof has conductivity.
- conductive materials include metals such as Cu, Ni, Cr, Fe, Al, Cr, Mo, Nb, Ta, V, Ti, Rh, and the like; and alloys thereof. These materials may be used singly as the support. Particularly, from the viewpoints of workability, strength, chemical stability, cost, etc., stainless steel and Fe are preferred.
- Insulating materials for the support include synthetic resins such as polyester, polyethylene, polycarbonate, cellulose acetate, polypropylene, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, and the like; glass; ceramics; and the like.
- a thin film made of one of the above conductive materials is formed on at least one surface of the support.
- the material is preferably formed in a sheet shape or a roll shape formed by rolling a band on a cylinder.
- the thin film is preferably formed on the support by vacuum deposition, sputtering, screen printing, dipping, plasma CVD, electroplating, electroless plating, or the like.
- the smoothness of the support surface is preferably a center line average surface roughness Ra of 3.0 ⁇ m or less.
- the surface of the support may be appropriately etched with an acid solution of HNO 3 , HF, HCl, H 2 SO 4 , or the like.
- the support can be made as thin as possible in a range in which the function as the support can sufficiently be exhibited.
- the thickness is generally 10 ⁇ m or more.
- the surface of the support is preferably washed with a surfactant or an organic substance.
- the metal layer is not essential, for the support made of a stainless steel or copper plate having low reflectance, or the support made of a material with low conductivity, such as glass, ceramic or resin, the metal layer made of silver, copper, gold or aluminum having high reflectance is provided on the support by sputtering or vaporization.
- a thin transparent conductive layer is formed on the metal layer.
- the metal layer used in the present invention may comprise a single layer or multilayers.
- the total thickness is preferably 0.01 to 0.5 ⁇ m.
- the vacuum deposition method, the sputtering method or the electrochemical deposition method (plating method) using an aqueous solution is preferably used.
- the surface of the metal layer may be either smooth or uneven.
- the support 301 - 1 is made uneven by heating to a temperature of 150° C. or higher-to improve adhesion between the metal layer and the support 301 - 1 .
- This layer is an important layer which determines photoelectric properties of the photovoltaic device, such as the efficiency of photoelectric conversion, release voltage, the short-circuit photocurrent, etc.
- the semiconductor layer of the present invention has at least one p-i-n junction, and comprises a non-single crystal silicon material. In some cases, a p-i-n junction may be formed on a pn junction.
- the non-single crystal silicon material mainly has an amorphous (a-), microcrystalline ( ⁇ c) or polycrystalline (poly) structure.
- a- amorphous
- ⁇ c microcrystalline
- poly polycrystalline
- examples of such materials include a-Si, a-SiGa, a-SiSn, a-SiC, a-SiO, a-SiN, ⁇ c-Si, uc-SiC, and poly-Si.
- an element such as B, Al or the like
- an element such as P, As, Sb, or the like is added.
- defects such as unpaired electrons must be compensated for by adding an element such as H, F, Cl, or the like. This can significantly improve the curve factor (fill factor) of the photovoltaic device.
- the order of the layers may be the n layer, the i layer and the P layer, or conversely the p layer, the i layer and n layer from the support side.
- n-p/n-i-p or p-n/p-i-n from the support side may be used.
- the semiconductor layer may have one p-i-n junction, but preferably have at least two p-i-n junctions in order to suppress photodeterioration of the photovoltaic device (the phenomenon that the fill factor and release voltage are decreased by irradiation of strong light, thereby deteriorating the efficiency of photoelectric conversion with the passage of time).
- the example of the semiconductor layer shown in FIG. 4 has three p-i-n junctions, and preferably comprises the first i layer 402 made of a-SiGe:H, the second i layer 405 made of a-SiGe:H, and the third i layer 408 made of a-Si:H.
- Each of these i layers may comprise a single layer, or a laminated layer such as a-Si/a-s, a-Si/a-SiGe/a-Si, or the like.
- an element such as B or the like may be added.
- the above elements for making the p type and n type to poly-Si or ⁇ c-Si. These materials generally do not cause the above photodeterioration, and are thus preferable for outdoor use for a long period of time. However, the absorption coefficient for visible light is lower than amorphous materials, and thus a thickness of 0.5 ⁇ a or more is required.
- Each of the n and p layers is preferably made of a material exhibiting as the lowest possible absorption, and a-Si, a-SiC, a-SiO, a-SiN, ⁇ c-Si, ⁇ c-SiC, and poly-Si are generally used.
- a plasma CVD method is generally used. Particularly, a microwave plasma CVD method having a high deposition rate is preferably used for forming the i layers.
- a-Si may be formed by the plasma CVD method, the sputtering method, or the like, and then made polycrystalline by irradiating a laser or applying radio-frequency-power.
- raw material gases may be diluted with Ar, H 2 or He 1 to about 100 times.
- raw material gases may be diluted with Ar, H 2 or He about 10 to 100 times.
- This layer is an important layer for efficiently guiding light to the semiconductor layer 303 and guiding a photocurrent to the collecting electrodes without a loss. Therefore, it is necessary to further decrease light absorption, control the thickness with high reproducibility for improving an antireflecting effect, and decrease resistivity as much as possible.
- Suitable materials include SnO 2 , In 2 O 3 , ITO, and the like. It is also possible to improve the antireflecting effect by laminating MgF 2 , TiO 2 , or the like on the above layer.
- the thickness is preferably about 700 to 800 angstroms so that visible light can effectively be guided to the semiconductor layer.
- the vacuum deposition or sputtering method is generally used.
- the conductive layer at a temperature of about 100 to 300° C.
- the transparent conductive layer with low resistivity can be obtained.
- the sputtering method permitting formation on a large area and an increase in deposition rate is preferable.
- the reactive sputtering method of forming a film using a target of In, Sn, or InSn (for example, Sn: 5 wt %) while introducing Ar and O 2 into a deposition chamber is preferable.
- the collecting electrodes 305 preferably have a comb-like shape as viewed from the incident side, as shown in FIG. 3B .
- materials having high conductivity i.e., Au, Ag, Cu, Al and the like, are generally used.
- the collecting electrodes of the present invention may be made of a single layer of one of these metals or a plurality of layers of these metals and other metals.
- the collecting electrodes 305 are preferably formed by coating carbon paste comprising an urethane resin dissolved as a binder in cyclohexane on wires of one of the above metals, placing the wires on the transparent conductive layer 304 , and then drying. In this method, cyclohexane is evaporated by drying to fuse the core wires to the transparent conductive layer 304 , and thus the collecting electrodes having very low contact resistance can be obtained.
- the collecting electrodes may be formed by coating carbon paste in the electrode shape by screen printing, printing the metal on the carbon paste by screen printing, and then drying.
- a single layer or multilayers with another metal may be formed by vacuum deposition using a mask for covering the deposition surface, or sputtering.
- another metal such as Cr/Al/Cr or the like
- the bus bar 306 comprising a copper plate shown in FIG. 3B may be simultaneously fused to a portion with a high current density.
- the same bus bar 306 comprising a copper plate may be fused to the back of the support 301 - 1 .
- the zinc oxide thin film was produced by using the apparatus shown in FIG. 1 .
- the counter electrode 104 on the anode side 4-N zinc having a thickness of 1 mm was used.
- the aqueous solution 102 was an aqueous solution of 0.03 mol/l zinc hydroxide in 10% ammonia at 65° C. and a pH of 10.3.
- the applied current was 1.0 mA/cm 2 (0.1 A/dm 2 ).
- Electrodeposition was carried out by the same method as Example 1 except that as the conductive substrate 103 , a substrate of stainless 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 100 nm by sputtering and zinc oxide deposited to 100 nm on Ag by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used.
- a substrate of stainless 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 100 nm by sputtering and zinc oxide deposited to 100 nm on Ag by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used.
- the solar cell comprised the support 301 - 1 (conductive substrate of stainless steel SUS430, 10 ⁇ 10 cm 2 , thickness 0.2 mm), the metal layer 301 - 2 (Al), the transparent conductive layer 301 - 3 (zinc oxide thin film), the zinc oxide layer 302 , the semiconductor layer 303 , the transparent conductive layer 304 , and the collecting electrodes 305 (Cu wire/Ag/C).
- the metal layer 301 - 2 and the transparent conductive layer 301 - 3 were formed by the general vacuum deposition or sputtering method.
- the zinc oxide layer 302 was formed by the same method as Example 1 except that 3 g/l of sucrose was added to the aqueous solution.
- the semiconductor layer 303 was formed under the conditions shown in Table 3. TABLE 3 Deposition Forming temperature Thickness Semiconductor layer method (° C.) ( ⁇ m) First doped layer n-type a-Si:H:P RFCVD 300 0.015 First i layer a-SiGe:H Microwave 280 0.1 CVD Second doped layer p type RFCVD 240 0.01 ⁇ c-Si:H:B Third doped layer n-type RFCVD 240 0.01 a-Si:H:P Second i layer a-SiGe:H Microwave 270 0.07 CVD Fourth doped layer p-type RFCVD 240 0.01 ⁇ c-Si:H:B Fifth doped layer n-type RFCVD 230 0.01 a-Si:H:P Third i layer a-Si:H RFCVD 200 0.1 Sixth doped layer p-type RFCVD 165 0.01 ⁇ c-Si:H:B
- the transparent conductive layer 304 was formed by the sputtering method.
- the commercial insulating double side tape 307 On one side of the substrate on which the layers of up to the transparent conductive layer 304 were formed was applied the commercial insulating double side tape 307 , and a Cu plate as the bus bar 306 was placed on the double side tape 307 .
- the collecting electrodes comprising Cu wire/Ag/C were formed and then fused to the conductive layer 304 by heating and drying.
- Ten solar cells were produced (Examples 3-1 to 3-10).
- the initial characteristics (photoconductive characteristics, short-circuit current) of these solar cells were measured.
- the efficiency of photoelectric conversion and short-circuit photocurrent of the photovoltaic devices (Examples 3-1 to 3-10) produced by using the method of forming a zinc oxide thin film of the present invention were 1.15 times and 1.16 times, respectively, as high as the comparative examples.
- the increase in the short-circuit photocurrent indicates that desired unevenness was formed.
- a HH test high-temperature high-humidity test
- a solar cell was placed in an environmental test box and allowed to stand at a temperature of 84° C. and a humidity of 85% for 180 hours.
- the solar cell was then allowed in the environmental test box in which the temperature was set to 25° C., and humidity was set to 50% for 1 hour, and then removed.
- the efficiency of photoelectric conversion and short-circuit photocurrent of the photovoltaic devices Examples 3-1 to 3-10) produced by using the method of forming a zinc oxide thin film of the present invention were 1.09 times and 1.11 times, respectively, as high as the comparative examples.
- Solar cells were formed by the same method as Example 3 except that the pH of the aqueous solution was changed to 7.5 to 13 by using a pH buffer and a strong alkali aqueous solution. As shown in FIG. 6 , the efficiency of photoelectric conversion was the maximum in the pH range of 8 to 12.5.
- Solar cells were formed by the same method as Example 3 except that the hydrogen ion exponent of the aqueous solution near the uppermost surface where the zinc oxide thin film was formed was changed to pH 5.5 to 8.5 by using a 10% ammonia aqueous solution of 0.02 mol/l zinc oxalate at pH 10.3, weak acid and weak alkali pH buffers while changing the applied current. As shown in FIG. 7 , the efficiency of photoelectric conversion was the maximum in the pH range of 6 to 8.
- Solar cells were formed by the same method as Example 3 except that the sucrose content was changed from 0 to 800 g/l. As shown in FIG. 8 , the efficiency of photoelectric conversion was the maximum in the range of sucrose contents of 1 to 300 g/l.
- Solar cells were formed by the same method as Example 3 except that the dextrin content was changed from 0 to 100 g/l. As shown in FIG. 9 , the efficiency of photoelectric conversion was the maximum in the range of sucrose contents of 0.001 to 10 g/l.
- the CIGS type solar cell shown in FIG. 10 was produced.
- a blue glass plate on which Mo was deposited to 2 ⁇ m by sputtering was used as the substrate.
- a Cu—In—Ga—Se mixed crystal precursor at the substrate temperature of 220° C. by the simultaneous vaporization method.
- the substrate was kept in a selenium atmosphere at 500° C. for 80 minutes to form a CIGS thin film.
- the substrate was placed in the aqueous solution for forming a zinc oxide thin film of the present invention, and the zinc oxide thin film of the present invention was electrolytically deposited on the surface of the CIGS thin film under irradiation of strong light in the same manner as Example 1. Characteristics of the obtained CIGS type solar cell were measured by the same method as Example 3. As a result, it was found that the solar cell has excellent initial efficiency of photoelectric conversion and stability with causing substantially no photo-deterioration.
- a zinc oxide thin film was produced by using the apparatus shown in FIG. 1 .
- the power source 105 was set so that the counter electrode 104 serves as the cathode.
- the counter electrode 104 on the cathode side 4-N zinc having a thickness of 1 mm was used.
- the aqueous solution 102 was an aqueous solution of 0.025 mol/l zinc hydroxide in 12% ammonia at 62° C. and a pH of 10.4.
- the applied current was 1.2 mA/cm 2 (0.12 A/dm 2 ).
- Electrodeposition was carried out by the same method as Example 9 except that as the conductive substrate 103 , a substrate of stainless steel 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 70 nm by sputtering and zinc oxide deposited to 110 nm on Ag by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used.
- a substrate of stainless steel 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 70 nm by sputtering and zinc oxide deposited to 110 nm on Ag by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used.
- the solar cell comprised the support 301 - 1 (conductive substrate of stainless steel, SUS430, 10 ⁇ 10 cm 2 , thickness 0.2 mm), the metal layer 301 - 2 (Al), the transparent conductive layer 301 - 3 (zinc oxide thin film), the zinc oxide layer 302 , the semiconductor layer 303 , the transparent conductive layer 304 , and the collecting electrodes 305 (Cu wire/Ag/C).
- the metal layer 301 - 2 and the transparent conductive layer 301 - 3 were formed by the general vacuum deposition or sputtering method.
- the zinc oxide layer 302 was formed by the same method as Example 1 except that 2 g/l of sucrose was added to the aqueous solution.
- the semiconductor layer 303 was formed under the conditions shown in Table 6. TABLE 6 Deposition Forming temperature Thickness Semiconductor layer method (° C.) ( ⁇ m) First doped layer n-type a-Si:H:P RFCVD 310 0.015 First i layer a-SiGe:H Microwave 290 0.1 CVD Second doped layer p type RFCVD 240 0.01 ⁇ c-Si:H:B Third doped layer n-type RFCVD 240 0.01 a-Si:H:P Second i layer a-SiGe:H Microwave 280 0.07 CVD Fourth doped layer p-type RFCVD 240 0.01 ⁇ c-Si:H:B Fifth doped layer n-type RFCVD 230 0.01 a-Si:H:P Third i layer a-Si:H RFCVD 200 0.1 Sixth doped layer p-type RFCVD 165 0.01 ⁇ c-Si:H:B
- the transparent conductive layer 304 was formed by the sputtering method.
- the commercial insulating double side tape 307 On one side of the substrate on which the layers of up to the transparent conductive layer 304 were formed was applied the commercial insulating double side tape 307 , and a Cu plate as the bus bar 306 was placed on the double side tape 307 .
- the collecting electrodes comprising Cu wire/Ag/C were formed and then fused to the conductive layer 304 by heating and drying.
- Ten solar cells were produced (Examples 11-1 to 11-10).
- the initial characteristics (photoconductive characteristics, short-circuit current) of these solar cells were measured.
- a HH test high-temperature high-humidity test
- a solar cell was placed in an environmental test box and allowed to stand at a temperature of 84° C. and a humidity of 85% for 180 hours.
- the solar cell was then allowed in the environmental test box in which the temperature was set to 25° C., and humidity was set to 50% for 1 hour, and then removed.
- the efficiency of photoelectric conversion and short-circuit photocurrent of the photovoltaic devices Examples 11-1 to 11-10) produced by using the method of forming a zinc oxide thin film of the present invention were 1.11 times and 1.13 times, respectively, as high as the comparative examples.
- the photovoltaic device of the present invention is superior to conventional photovoltaic devices.
- Solar cells were formed by the same method as Example 11 except that the pH of the aqueous solution was changed to 7.5 to 13 by using a pH buffer and a strong alkali aqueous solution. As shown in FIG. 11 , the efficiency of photoelectric conversion was the maximum in the pH range of 8 to 12.5.
- Solar cells were formed by the same method as Example 11 except that the hydrogen ion exponent of the aqueous solution near the uppermost surface where the zinc oxide thin film was formed was changed to pH 5.5 to 8.5 by using a 10% ammonia aqueous solution of 0.03 mol/l zinc oxalate at pH 10.2, weak acid and weak alkali pH buffers while changing the applied current. As shown in FIG. 12 , the efficiency of photoelectric conversion was the maximum in the pH range of 6 to 8.
- Solar cells were formed by the same method as Example 11 except that the sucrose content was changed from 0 to 800 g/l. As shown in FIG. 13 , the efficiency of photoelectric conversion was the maximum in the range of dextrin contents of 1 to 300 g/l.
- Solar cells were formed by the same method as Example 11 except that the dextrin content was changed from 0 to 100 g/l. As shown in FIG. 14 , the efficiency of photoelectric conversion was the maximum in the range of sucrose contents of 0.001 to 10 g/l.
- the GIGS type solar cell shown in FIG. 10 was produced.
- a blue glass plate on which Mo was deposited to 2.2 ⁇ m by sputtering was used as the substrate.
- a Cu—In—Ga—Se mixed crystal precursor at the substrate temperature of 210° C. by the simultaneous vaporization method.
- the substrate was kept in a selenium atmosphere at 500° C. for 85 minutes to form a CIGS thin film.
- the substrate was placed in the aqueous solution for forming a zinc oxide thin film of the present invention, and the zinc oxide thin film of the present invention was electrolytically deposited on the surface of the CIGS thin film under irradiation of strong light in the same manner as Example 9. Characteristics of thus-obtained CIGS type solar cell were measured by the same method as Example 3. As a result, it was found that the solar cell has excellent initial efficiency of photoelectric conversion and stability with causing substantially no photo-deterioration.
- a zinc oxide thin film was produced by using the apparatus shown in FIG. 1 .
- the counter electrode 104 on the anode side 4-N zinc having a thickness of 1 mm was used.
- the aqueous solution 102 was an aqueous solution of 0.025 mol/l zinc acetate 65° C. and a pH of 10.4.
- the applied current was 1.0 mA/cm 2 (0.1 A/dm 2 ).
- the thus-obtained zinc oxide thin film was examined by X-ray diffraction, and the thickness and transmittance (in an atmosphere of a reference material) at a wavelength of 800 nm were measured from optical characteristics. Also the number of abnormal growths was visually examined. The results are shown in Table 7.
- Electrodeposition was carried out by the same method as Example 17 except that the aqueous solution was an aqueous solution of 0.025 mol/l zinc formate at 65° C. The results are shown in Table 7.
- Electrodeposition was carried out by the same method as Example 17 except that the aqueous solution was an aqueous solution of 0.025 mol/l zinc formate at 65° C. The results are shown in Table 7.
- Electrodeposition was carried out by the same method as Example 17 except that the aqueous solution was an aqueous solution of 0.025 mol/l zinc nitrate at 65° C. The results are shown in Table 7. TABLE 7 Example Example Comparative 17 18 Example 19 Example 1 Transmittance (%) 75 78 68 58 Thickness (nm) 1020 980 750 580 Type of zinc oxide zinc oxide zinc oxide zinc oxide electrodeposited film measured by X-ray diffraction Number of 0 0 0 123 abnormal growths visually measured
- Table 7 reveals that a zinc oxide thin film having excellent optical characteristics can be formed by electrodeposition of zinc oxide in an aqueous solution containing zinc ions and carboxylic acid ions.
- Electrodeposition was carried out by the same method as Example 17 except that as the conductive substrate 103 on the cathode side, a substrate of stainless steel, 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering and ZnO deposited to 100 nm on Ag by sputtering, with the back coated with an insulating tape (not shown in the drawing), was used, and that the temperature of the aqueous solution was 70° C.
- Electrodeposition was carried out by the same method as Example 20 except that as the conductive substrate 103 on the cathode side, a substrate of stainless steel 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering was used. The results are shown in Table 8. TABLE 8 Example 20 Example 21 Number of abnormal 5 92 growths of 3 ⁇ or more (10 mm ⁇ 10 mm) Result of test of Neither peeling nor No peeling was observed, bending at rack was observed. but cracks of about 1 mm 180° was observed.
- Table 8 indicates that by using as a substrate the conductive substrate on which the zinc oxide thin film is formed, it is possible to increase the deposition rate, decrease abnormal growth and form a zinc oxide thin film having excellent adhesion.
- a zinc oxide thin film was produced by using the apparatus shown in FIG. 1 .
- the counter electrode 104 on the anode side 4-N zinc having a thickness of 1 mm was used.
- the aqueous solution 102 was an aqueous solution of 0.05 mol/l zinc acetate at 65° C.: The applied current was 1.0 mA/cm 2 (0.1 A/dm 2 ). The pH of the aqueous solution was controlled by periodically adding 10% acetic acid.
- FIG. 17 shows changes in pH at intervals of 5 minutes.
- Electrodeposition was carried out by the same method as Example 22 except that the pH of the aqueous solution was not controlled. The results are shown in FIG. 17 and Table 9.
- Electrodeposition was carried out by the same method as Example 22 except that the counter electrode 104 was made of SUS304, and the pH of the aqueous solution was not controlled. The results are shown in FIG. 17 and Table 9. TABLE 9 Example 22 Example 23 Example 24 0-5 25-30 55-60 0-5 25-30 55-60 0-5 25-30 55-60 0-5 25-30 55-60 (min) (min) (min) (min) (min) (min) (min) (min) (min) (min) (min) (min) (min) Thickness 1.1 1.1 1.2 1 1.1 1 1 0.7 No film Number of 3 7 4 5 95 231 5 12 No abnormal film growths of 3 ⁇ or more
- Table 9 and FIG. 7 indicate that a zinc oxide thin film having excellent optical characteristics and less abnormal growth can be stably for a long period of time by controlling the aqueous solution in the pH range of 3.5 to 5.5.
- Electrodeposition was carried out by the same method as Example 17 except that as the conductive substrate 103 on the cathode side, a substrate of stainless steel, 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering, with the back coated with an insulating tape (not shown in the drawing), was used.
- n-type amorphous silicon (a-Si) of 200 angstroms, nondoped amorphous silicon (a-Si) of 20 angstroms, and p-type microcrystalline silicon ( ⁇ c-Si) of 140 angstroms were deposited in turn by the CVD method to form the semiconductor layer 303 .
- ITO of 650 angstroms was vapor-deposited by heating evaporation in an oxygen atmosphere to form the transparent conductive electrode 30 as an upper electrode having the antireflecting effect.
- On the upper electrode was deposited silver cladding by heating evaporation to form the collecting electrodes 305 , to obtain the device shown in FIGS. 3A and 3B .
- the short-circuit current density and efficiency of conversion of the device were measured under artificial sunlight.
- the device was further allowed to stand in an environment of temperature 85° C. and humidity of 85% for 1000 hours to measure the rate of deterioration of the efficiency of conversion.
- the results of measurement are shown in Table 10.
- a device was produced by the same method as Example 25 except that the aqueous solution used was an aqueous solution of 0.025 mol/l zinc formate at 65° C. The results obtained are shown in Table 10.
- a device was formed by the same method as Example 25 except that as the conductive substrate 103 on the cathode side, a substrate of stainless steel 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering and ZnO deposited to 100 nm by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used.
- the results obtained are shown in Table 10.
- a device was formed by the same method as Example 25 except that no zinc oxide thin film was formed. The results obtained are shown in Table 10.
- Example 25 A device was formed by the same method as Example 25 except that the aqueous solution used was an aqueous solution of 0.025 mol/l zinc nitrate at 65° C. The results obtained are shown in Table 10. TABLE 10 Example Example Comparative Comparative 25 26 27 Example 2 Example 3 Short- Comparison 1.2 1.2 1.3 1 1.15 circuit to Comparative current Example 2 Conversion Comparison 1.15 1.1 1.2 1 1.1 efficiency to Comparative Example 2 Rate of (%) 10 9 3 63 33 deterioration in conversion efficiency after HH test
- Table 10 reveals that a device having excellent short-circuit current, conversion efficiency and reliability can be formed by using the zinc oxide thin film of the present invention. It is also found that a device having higher reliability can be formed by using as a substrate the conductive substrate having the transparent conductive layer composed of the zinc oxide thin film deposited thereon.
- the total three samples formed in the periods of 0 to 5 minutes, 25 to 30 minutes, and 55 to 60 minutes were used for forming devices by the same method as Example 26.
- Example 28 Example 29 0-5 25-30 55-60 0-5 25-30 55-60 (min) (min) (min) (min) (min) (min) (min) (min) Efficiency of Relative 1 1 1 1 0.9 conversion comparison to Example 28 (0-5 min.) Rate of (%) 3 5 4 4 18 32 deterioration in conversion efficiency after HH test
- Table 11 reveals that a device having excellent short-circuit current, efficiency of conversion and reliability can stably be formed for a long period of time by using a zinc oxide thin film formed by electrodeposition under control of the aqueous solution in the pH range of 3.5 to 5.5.
- a zinc oxide thin film was formed by the continuous production method shown in FIG. 15 using as a support a roll of a stainless 430BA thin plate.
- a stainless thin plate as a support roll 1503 is fed by a feeding roller 1501 , and finally wound by a take-up roller 1502 .
- a degreasing tank 1506 Between the feeding roller 1501 and the take-up roller 1502 are provided in turn a degreasing tank 1506 , a water washing tank 1508 , an etching tank 1510 , a water washing tank 1512 , a metal layer forming tank 1514 , a water washing tank 1518 , a hot water tank 1520 , a zinc oxide forming tank 1523 , a water washing tank 1527 , and a drying furnace 1529 .
- a transfer roller 1504 In each of these tanks is provided a transfer roller 1504 for controlling the conveyance passage of the rolled support web 1503 .
- the processing speed of the rolled support web 1503 was 200 cm/min.
- the tension applied to the rolled support web 1503 was 50 kgf.
- the tension was controlled by a tension controlling clutch (not shown in
- the rolled support web 1503 was made rust proof with oil was later removed by the degreasing tank 1506 .
- a degreasing bath 1505 comprised an aqueous solution containing 60 ml of sulfuric acid and 70 ml of hydrochloric acid (37% hydrogen chloride; the same is true for the example below) in 1 l water.
- the temperature was room temperature.
- the rolled support web 1503 was then transferred to the water washing tank 1508 through the transfer roller, and sufficiently washed with water by a water washing shower 1507 .
- the amount of water is preferably at least 2 l per minute.
- the rolled support web 1503 was then transferred to the etching tank 1510 through the transfer roller.
- the etching bath 1511 comprised a mixture containing hydrofluoric acid (46% hydrogen fluoride; the same is true for the example below) and acetic acid at a ratio of 3:1.
- the temperature was room temperature.
- the rolled support web 1503 was then transferred to the same water washing tank 1512 as the water washing tank 1508 after the degreasing tank 1506 . Since the metal layer forming bath 1515 in the next step is alkaline, a weak alkali shower can also be used.
- the rolled support web 1503 was then transferred to the metal layer forming bath 1515 through the transfer roller to form a metal layer.
- the metal layer forming bath 1515 comprised 80 g of copper pyrophosphate, 300 g of potassium pyrophosphate, 6 ml of ammonia water (specific gravity 0.88), and 10 g of potassium nitrate.
- the temperature was controlled to 50 to 60° C.
- the pH was controlled to be in the range of 8.2 to 8.8.
- As the counter electrode 1516 as the anode a copper plate was used. In this apparatus, since the rolled support web 1503 was set at the set potential, layer formation was controlled by reading the current in the counter electrode 1516 . In this example, the current density was 3 A/dm 2 .
- the rate of layer formation was 60 angstroms/sec, and the thickness of the metal layer formed in the metal layer forming bath 1515 was 4000 angstroms.
- the rolled support web 1503 was then washed with water in the water washing tank 1518 , sufficiently pre-heated by passing through the hot water tank 1520 kept at a pure water temperature 85° C. through the transfer roller, and transferred to the zinc oxide forming tank 1523 .
- the zinc oxide forming bath 1524 comprised 10 g of zinc acetate hexahydrate in 1 l water. The liquid temperature was kept at 75° C., and the pH was kept at 4.5 to 5.5.
- As the counter electrode 1526 zinc having a puff-polished surface was used. The density of the current flowing in the zinc counter electrode 1526 was 5 A/dm 2 . The formation rate was 30 ⁇ /sec, and the thickness of the zinc oxide layer formed in the zinc oxide forming bath 1524 was 1 micron.
- the rolled support web 1503 was sent to the drying furnace 1529 through the transfer roller.
- the drying furnace comprised a hot air nozzle and an infrared heater which are not shown in the drawing, hot air being also used for repelling water.
- the hot air from the hot air nozzle was controlled to 80° C.
- the infrared heater was controlled to 200° C.
- the rolled support web 1503 passed through the drying step was wound as a roll comprising the metal layer 301 - 2 and the zinc oxide layer 302 both of which are formed on the support 301 - 1 on the take-up roller 1502 .
- the metal layer forming tank 1514 and the zinc oxide forming tank 1523 were stirred with air, and the pH values of the metal layer forming tank 1514 and the zinc oxide forming tank 1523 were controlled by adding ammonia and zinc nitrate, respectively, on occasion, while constantly monitoring pH of the bathes using a pH meter comprising a glass electrode in which the temperature was corrected.
- the semiconductor layer 303 having a triple structure by the CVD apparatus for a roll.
- a n-type layer was formed on the substrate heated to 340° C. by using mixed gases containing silane, phosphine and hydrogen with a RF power of 400 W charged, and then a i layer was formed on the substrate heated to 450° C. by using mixed gases containing silane, germane and hydrogen with a microwave power charged. Further, a p-type layer was formed on the substrate heated to 250° C. by using mixed gases containing boron trifluoride, silane and hydrogen, to form bottom pin layers. Then, middle nip layers were formed by the same procedure as the above at a increased mixing ratio of silane and germane, and top pin layers were formed by the same procedure except that the i layer was formed by using silane and hydrogen. Then ITO was deposited by a sputtering apparatus for a roll to form the transparent conductive layer 304 , and the collecting electrodes 305 were formed by using silver paste.
- the short-circuit current density and efficiency of conversion of the device were measured under artificial sunlight.
- the device was further allowed to stand in an environment of temperature 85° C. and humidity of 85% for 1000 hours to measure the rate of deterioration in the efficiency of conversion.
- the results of measurement are shown in Table 12.
- the support 301 - 1 was deposited to 4000 angstroms copper by a CVD magnetron sputtering apparatus to form the metal layer 301 - 2 .
- the zinc oxide layer 302 was formed on the metal layer 301 - 2 formed on the support 301 - 1 by using the apparatus shown in FIG. 16 .
- a support roll 1603 was first sufficiently heated in a hot water bath 1605 containing pure water kept at 85° C. in a hot water tank 1606 , and then transferred to a zinc oxide layer forming tank 1612 through a transfer roller 1604 .
- a zinc oxide forming bath 1607 contained 10 g of zinc formate hexahydrate in 1 l water, and was provided with an ultrasonic vibrator 1608 (40 kHz) for ultrasonic processing by stirring the bath. The temperature of the bath was kept at 65° C., and the pH was kept at 4.0 to 5.0. As a counter electrode 1610 , zinc having a puff-polished surface is used. The density of the current flowing in the zinc counter electrode 1610 was 5 A/dm 2 . The formation rate was 30 ⁇ /sec, and the thickness of the zinc oxide layer formed in the zinc oxide forming bath 1607 was 1 micron.
- Example 30 A device was formed on the thus-obtained substrate by the same method as Example 30. The results obtained are shown in Table 12. TABLE 12 Example Example 30 Example 31 27 Short-circuit Comparison to 0.9 0.9 1 current Example 27 Conversion Comparison to 0.95 0.92 1 efficiency Example 27 Rate of (%) 2 5 3 deterioration in conversion efficiency after HH test
- Table 12 reveals that the method of forming a zinc oxide thin film of the present invention has the sufficient effect of improving short-circuit current, conversion efficiency and reliability of a roll-to-roll system.
- the aqueous solution for forming a zinc oxide thin film and the method of producing a zinc oxide thin film of the present invention are capable of forming a zinc oxide thin film having excellent characteristics.
- the method of producing a zinc oxide thin film of the present invention and the photovoltaic device formed by the same producing method permit improvements in photoconductive characteristics such as the conversion of photoelectric conversion, short-circuit photocurrent and leakage current of the photovoltaic device. Also it is possible to improve durability in an outdoor exposure test, a HH (high temperature high humidity) test and long-term light irradiation. Further, the cost of the photovoltaic device can significantly be decreased. Particularly, the power cost of a solar cell can be decreased.
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Abstract
The present invention provides a method of producing a zinc oxide thin film in which a current is passed between a conductive substrate immersed in an aqueous solution containing at least zinc ions, ammonium ions and zinc ammonia complex ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate. This method stabilizes formation of the zinc oxide thin film and improves adhesion between the thin film and the substrate.
Description
- 1. Field of the Invention
- The present invention relates to a method of producing a zinc oxide thin film, a method of producing a photovoltaic device, and a method of producing a semiconductor device substrate.
- 2. Description of the Related Art
- In a conventional photovoltaic device comprising amorphous silicon hydride, amorphous silicon germanium hydride, amorphous silicon carbide hydride, microcrystalline silicon or polycrystalline silicon, a reflecting layer formed on the back thereof is utilized for improving a collection efficient at long wavelengths. Such a reflecting layer preferably exhibits effective reflection properties at a wavelength near the band ends of a semiconductor material at which absorption is low, i.e., a wavelength of 800 to 1200 nm. Materials satisfying this condition include metals such as gold, silver, copper and aluminum.
- Also, an uneven layer optically transparent in the predetermined wavelength range is generally provided as a light confinement layer between the metal layer and a semiconductor layer in order to improve a short-circuit current density Jsc by effectively utilizing reflected light.
- Further, in order to prevent deterioration in properties due to a shunt path, a layer comprising a translucent material exhibiting conductivity, i.e., a transparent conductive layer, is provided between the metal layer and the semiconductor layer.
- In general, these layers are deposited by a method such as vacuum deposition or sputtering, and show an improvement of 1 mA/cm2 or more in short-circuit current density.
- For example, in “Light Confinement Effect in a-SiGe Solar Cell on 29p-MF-2 Stainless Substrate”, Abstracts of the 51st Science Lecture Meeting of the Applied Physical Society of Japan, p. 747, 1990, “a-SiC/a-Si/a-SiGe Multi-Bandgap Stacked Solar Cells With Band Gap Profiling”; Sannomiya et al., Technical Digest of the International PVSEC-5; Kyoto, Japan, p. 387, 1987, and “P-IA-15a-SiC/a-Si/a-SiGe Multi-Bandgap Stacked Solar Cells With Bandgap Profiling”, Sannomiya et al., Technical Digest of the International PVSEC-5, Kyoto, Japan, p. 381, 1990, an improvement in short-circuit photoelectric current is achieved by a structure comprising a reflecting layer as a back layer composed of Ag, and a light confinement layer as an uneven front layer composed of zinc oxide.
- Also, T. Tiedje, et al., Proc. 16th IEEE Photovoltaic Specialist Conf. (1982), p. 1423 and H. Deckman, et al., Proc. 16th IEEE Photovoltaic Specialist Conf. (1982); p. 1425 disclose a technique in which a back electrode is formed in a shape having unevenness (texture structure) of a size substantially the same as light wavelength, for scattering light. This lengthens the optical path in a semiconductor layer by scattering light at long wavelengths which is not absorbed by the semiconductor layer, and increases a short-circuit photoelectric current by improving the long wavelength sensitivity of a photovoltaic device, thereby improving the efficiency of photoelectric conversion.
- Zinc oxide has higher resistance to a plasma than tin oxide and indium oxide, and is not reduced by hydrogen even in a plasma containing hydrogen. Therefore, in forming a semiconductor layer comprising amorphous silicon on a transparent conductive layer by a plasma CVD process, a zinc oxide thin film is positively used as the transparent conductive layer.
- Japanese Patent Laid-Open No. 60-84888 (Energy Conversion Devices) discloses a technique in which a transparent conductive layer is interposed between a back electrode and a semiconductor layer to decrease a current flowing in a defect region of the semiconductor layer.
- On the other hand, as seen in 24th IEEE First WCPEC; Dec. 5-9, 1994, p. 254 “EFFECTS OF Cd-FREE BUFFER LAYER FOR CuInSe2 THIN-FILM SOLAR CELLS”; T. Nii, H. Takeshita, a technique using a zinc oxide thin film as a n-type window layer of copper-indium-selenium (Cu—In—Se2: CIS), copper-(indium, gallium)-selenium (Cu—(InGa)—Se2; SIGS), or the like has recently been disclosed.
- As described above, a zinc oxide thin film is preferably used as the light confinement layer having a texture structure surface.
- Although conventional known methods of producing a zinc oxide thin film include a vacuum deposition method, a sputtering method, an ion plating method, and a CVD method, all methods require an expensive vacuum apparatus, and an expensive vaporization source. Also the light confinement effect at wavelengths of 600 to 1000 nm is insufficient.
- Other known methods include wet methods such as spray pyrolysis, a sol-gel method, a dipping method, and the like. However, in these wet methods, a substrate must be heated to about 300 to 800° C., and thus substrates which can be used are limited. Also, zinc hydroxide is contained in the thin film together with zinc oxide, and it is thus difficult to form a pure zinc oxide thin film.
- As seen in Japanese Patent Laid-Open No. 7-23775, Journal of Electrochemical Soc. Vol. 143, No. 3 “Electrolyte Optimization for Cathodic Growth of Zinc Oxide Films”; Masanobu Izaki, Takashi Omi, it has recently been reported that a counter electrode is immersed in an aqueous solution of zinc nitrate, and a current is passed to electrochemically deposit a transparent zinc oxide thin film.
- Also a technique of forming a zinc oxide thin film by a liquid phase deposition method has been reported in “Formation of ZnO Film by Electrolysis in Aqueous Solution”, (Autumn, 1995), 65th Applied Physics Society, p. 410.
- In these methods, since an expensive vacuum apparatus and expensive target are unnecessary, the production cost of a zinc oxide thin film can significantly be decreased. Also a thin film can be deposited on a large substrate, and the methods are thus advantageous for large photovoltaic devices such as solar cells. However, the electrochemical deposition methods have the following problems:
- (1) Particularly, an increase in current density or concentration of the solution causes the problem of easily producing abnormal growth of a needle-like, spherical, resin-like shape of the micron order or more on the deposited thin film. The use of such a zinc oxide thin film as a part of a photovoltaic device possibly causes the abnormal growth to induce a shunt path in the photovoltaic device.
- (2) In the zinc oxide thin film formed by one of the above methods, unevenness easily occurs in the grain sizes of zinc oxide crystals, and particularly, the problem of unevenness occurs in the case of a large area.
- (3) The zinc oxide thin film formed by one of the above methods has lower adhesion to a substrate than the vacuum deposition method using resistance heating, an electron beam or the like, the sputtering method, an ion plating method, and the CVD method.
- Conventionally, only smooth thin films are formed by the electrochemical deposition methods, and a method of electrochemically depositing a zinc oxide thin film having unevenness for the light confinement effect has not been established yet.
- Accordingly, it is an object of the present invention to stabilize formation of a zinc oxide thin film by electrodeposition, and provide a method of forming a zinc oxide thin film having excellent adhesion to a substrate. Particularly, a zinc oxide thin film suitable for application to a light confinement layer of a photovoltaic device is formed.
- In order to achieve the object, the present invention provides the following methods of producing a zinc oxide thin film and photovoltaic devices formed by using the producing methods.
- (1-1) A method of producing a zinc oxide thin film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc ions, ammonium ions, and zinc ammonia complex ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate. This producing method is capable of electrochemically forming a zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at wavelength of 600 to 1000 nm. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost. Particularly, the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- (1-2) In the method of producing a zinc oxide thin film, the conductive substrate comprises a transparent conductive layer deposited on a support. This producing method is capable of relatively easily and uniformly forming an initial film of zinc oxide, and efficiently forming the zinc oxide layer. Also, in a photovoltaic device, the zinc oxide film can be electrochemically formed on the conductive substrate by protecting a high-reflectance metal previously formed on the conductive substrate having an important function.
- (1-3) In the method of producing a zinc oxide thin film, the hydrogen ion concentration (pH) of the aqueous solution for forming the zinc oxide thin film is controlled in the range of 8 to 12.5. This producing method is capable of relatively stably supplying complex ions such as the zinc ammonia complex ions or the like by keeping the solution for forming the zinc oxide thin film alkali, and efficiently forming the zinc oxide layer. Also, since the solution for forming the zinc oxide thin film is kept alkali, a wide range of substrates having no need for acid resistance can be used.
- (1-4) In the method of producing a zinc oxide thin film, the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin film is formed is controlled in the range of 6 to 8. Since the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin film is formed is locally controlled in the range of 6 to 8, the dense zinc oxide thin film can be continuously formed. At the same time, the hydrogen ion concentration of the aqueous solution in the bulk region is preferably in the range described in (1-3).
- (1-5) In the method of producing a zinc oxide thin film, the aqueous solution for forming a zinc oxide thin film contains a hydrocarbon. This producing method can significantly suppress abnormal growth in the zinc oxide layer, and thus further improve yield. The uniformity of the zinc oxide layer can further be improved.
- (1-6) A method of producing a photovoltaic device comprising the step of forming the zinc oxide thin film. This forming step is capable of electrochemically forming the zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at a wavelength of 600 to 1000 nm. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost. Particularly, the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- (2-1) A method of producing a zinc oxide thin film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc ions, hydrogenzincate ions (HZnO2 −) and zincate ions (ZnO2 2−) and an electrode as a cathode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate. This producing method is capable of electrochemically forming a zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at wavelength of 600 to 1000 nm. Also, since the zinc oxide thin film is formed on the conductive substrate on the anode side, the zinc oxide thin film contains no zinc metal. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost. Particularly, the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- (2-2) In the method of producing a zinc oxide thin film, the conductive substrate comprises a transparent conductive layer deposited on a support. This producing method is capable of relatively easily and uniformly forming an initial film of zinc oxide, and efficiently forming the zinc oxide layer. Also, in a photovoltaic device, the zinc oxide film can be electrochemically formed on the conductive substrate by protecting a high-reflectance metal previously formed on the conductive substrate having an important function.
- (2-3) In the method of producing a zinc oxide thin film, the hydrogen ion concentration (pH) of the aqueous solution for forming the zinc oxide thin film is controlled in the range of 8 to 12.5. This producing method is capable of relatively stably supplying ions such as the hydrogenzincate ions, zincate ions and the like by keeping the solution for forming the zinc oxide thin film alkali, and efficiently forming the zinc oxide layer. Also, since the solution for forming the zinc oxide thin film is kept alkali, a wide range of substrates having no need for acid resistance can be used.
- (2-4) In the method of producing a zinc oxide thin film, the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin-film is formed is controlled in the range of 6 to 8. Since the hydrogen ion concentration pH of the aqueous solution near the uppermost surface where the zinc oxide thin film is formed is locally controlled in the range of 6 to 8, the dense zinc oxide thin film can be continuously formed. At the same time, the hydrogen ion concentration of the aqueous solution in the bulk region is preferably in the range described in (2-3).
- (2-5) In the method of producing a zinc oxide thin film, the aqueous solution for forming a zinc oxide thin film contains a hydrocarbon. This producing method can significantly suppress abnormal growth in the zinc oxide layer, and thus further improve yield. The uniformity of the zinc oxide layer can further be improved.
- (2-6) A method of producing a photovoltaic device comprising the step of forming the zinc oxide thin film. This forming step is capable of electrochemically forming the zinc oxide layer and forming an uneven surface which can sufficiently exhibit light confinement or light scattering for light at a wavelength of 600 to 1000 nm. Therefore, it is possible to produce a photovoltaic device having high quality and low power cost. Particularly, the production cost of the zinc oxide layer can be decreased to about 1/100 of the sputtering method.
- (3-1) A method of producing a zinc oxide thin film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least carboxylic acid ions and zinc ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate. This producing method is capable of forming the zinc oxide film having excellent optical properties at low material cost without the need for a large-scale apparatus.
- (3-2) In the method of producing a zinc oxide thin film, the aqueous solution is an aqueous solution of zinc acetate. This producing method is capable of forming the zinc oxide film having excellent optical properties at low material cost without the need for a large-scale apparatus.
- (3-3) In the method of producing a zinc oxide thin film, the aqueous solution is an aqueous solution of a zinc formate. This producing method is capable of forming the zinc oxide film having excellent optical properties at low material cost without the need for a large-scale apparatus.
- (3-4) In the method of producing a zinc oxide thin film, the conductive substrate comprises a transparent conductive layer deposited on a support. This producing method is capable of forming the zinc oxide thin film having less abnormal growth and excellent uniformity.
- (3-5) In the method of producing a zinc oxide thin film, the hydrogen ion concentration pH of the aqueous solution for depositing the zinc oxide thin film is controlled in the range of 3.5 to 5.5. This producing method is capable of forming the zinc oxide thin film having less abnormal growth and excellent uniformity.
- (3-6) A method of producing a photovoltaic device comprising the step of forming the zinc oxide thin film. This producing method is capable of stably forming the high-performance device at low cost.
- Further objects, features and advantages of the present invention will become apparent from the following description of the preferred embodiments with reference to the attached drawings.
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FIG. 1 is a schematic sectional view showing an example of apparatus for producing a zinc oxide thin film of the present invention; -
FIG. 2 is a schematic sectional view showing an example of apparatus for continuously producing a zinc oxide thin film of the present invention: -
FIG. 3A is a schematic sectional view showing an example of a photovoltaic device having a zinc oxide thin film of the present invention, andFIG. 3B is a top view of the same: -
FIG. 4 is a schematic sectional view showing an example of the configuration of a semiconductor layer; -
FIG. 5A is a schematic exploded sectional view showing an example of the configuration of a photovoltaic device module, andFIG. 5B is a top view of the device portion thereof; -
FIG. 6 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution and efficiency of photoelectric conversion; -
FIG. 7 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution near the uppermost surface where a zinc oxide thin film is formed and efficiency of photoelectric conversion; -
FIG. 8 is a graph showing the relation between the sucrose content of an aqueous solution and efficiency of photoelectric conversion; -
FIG. 9 is a graph showing the relation between the dextrin content of an aqueous solution and efficiency of photoelectric conversion; -
FIG. 10 is a schematic sectional view showing an example in which a zinc oxide thin film of the present invention was applied to a CIGS type photovoltaic device; -
FIG. 11 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution and efficiency of photoelectric conversion; -
FIG. 12 is a graph showing the relation between the hydrogen ion exponent of an aqueous solution near the uppermost surface where a zinc oxide thin film is formed and efficiency of photoelectric conversion; -
FIG. 13 is a graph showing the relation between the sucrose content of an aqueous solution and efficiency of photoelectric conversion; -
FIG. 14 is a graph showing the relation between the dextrin content of an aqueous solution and efficiency of photoelectric conversion; -
FIG. 15 is a schematic sectional view showing an example of apparatus for continuously producing a zinc oxide thin film of the present invention; -
FIG. 16 is a schematic sectional view showing an example of apparatus for continuously producing a zinc oxide thin film of the present invention; and -
FIG. 17 is a graph showing changes in pH of an aqueous solution in Examples 22 to 24. - The method of producing a zinc oxide thin film of the present invention, and a photovoltaic device formed by using the producing method will be described in detail below with reference to the drawings.
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FIG. 1 shows an example of apparatus for forming the zinc oxide film of the present invention. Anaqueous solution 102 of the present invention is held in a corrosion-resistant vessel 101. - In
FIG. 1 , aconductive substrate 103 serves as a cathode, and acounter electrode 104 can be made of platinum, carbon, platinum-plated titanium, or the like other than zinc as a metal to be deposited in a liquid phase. InFIG. 1 , thecounter electrode 104 serves as an anode.Load resistance 106 and apower supply 105 are connected between theconductive substrate 103 serving as a cathode, and thecounter electrode 104 serving as an anode so as to pass a substantially constant current. - The solution is stirred to decrease nonuniformity in formation of the thin film. In order to increase the rate of thin film formation to improve efficiency, a solution circulation system is used, which comprises an
inlet bar 108 having a plurality of solution inlets, aninjection bar 107 having a plurality of solution injection ports, asolution circulating pump 111, anintake solution pipe 109 connecting thesolution inlet bar 108 and thesolution circulating pump 111, and aninjection solution pipe 110 connecting thesolution injection bar 107 and thesolution circulating pump 111. In small-scale apparatus, stirring means such as a magnetic stirrer or the like can be used in place of such a solution circulating system. - A
heater 112 and athermocouple 113 are used for controlling the temperature of the aqueous solution while monitoring the temperature. In order to obtain a desired zinc oxide thin film, the temperature of the aqueous solution is preferably 50° C. or higher. - Before the zinc oxide thin film is formed, the
conductive substrate 103 may be previously immersed in ahot water bath 114 in order to heat theconductive substrate 103. Hot water whose temperature is controlled by using aheater 115 and athermocouple 116 is contained in thehot water bath 114 so that theconductive substrate 103 can be heated. - The
conductive substrate 103 is preferably formed by depositing a metal layer as a reflecting layer on a support. Particularly, aluminum has high reflectance for light at wavelengths of 600 to 1000 nm, and causes no electrochemical migration, and is thus a most promising metal for the metal layer of a photovoltaic device. However, since it is difficult to electrochemically grow (electroplate) zinc oxide directly on aluminum in an aqueous solution, in the use of aluminum for the metal layer, a transparent conductive thin layer is preferably provided on aluminum. - The transparent conductive layer must be transparent for light at wavelengths of 600 to 1000 nm, and have some conductivity. For example, the transparent conductive layer is made of tin oxide (SnO2), indium oxide (In2O3), ITO (SnO2+In2O3), zinc oxide (ZnO), indium zinc oxide, tin zinc oxide, or the like. These oxides can be deposited by the sputtering method, the CVD method, or the vacuum deposition method; The zinc oxide thin film can be formed on the transparent conductive layer by the method of the present invention. For light at wavelengths of 600 to 1000 nm, light confinement or light scattering is sufficiently achieved. Therefore, the photovoltaic device of the present invention exhibits high quality and low power cost.
- Conditions for forming the zinc oxide thin film will be described for each of the aqueous solutions used. Since the formation conditions below depend upon the type, sectional shape and crystal state of the metal layer, the conditions cannot be determined collectively. However, generally, as the ion concentration increases, the grain size of zinc oxide crystals increases, and unevenness easily occurs in the surface. As the formation temperature decreases, the grain size of zinc oxide crystals increases.
- Also, as the current density increases, unevenness less occurs in the surface. However, since the current density is roughly proportional to the formation rate, unevenness is preferably formed on the surface at a current density increased for decreasing the cost of the transparent conductive layer comprising zinc oxide.
- A case is first described in which the
aqueous solution 102 contains at least zinc ions, ammonium ions, and zinc ammonia complex ions (zinc ammine complex ions). In this case, as shown inFIG. 1 , theconductive substrate 103 and thecounter electrode 104 are used as a cathode and an anode, respectively. - As a supply source for zinc ions, excessive ammonium ions, and complex ions such as zinc ammonia ions, for example, an aqueous solution such as an ammonia aqueous solution of zinc hydroxide, an ammonia aqueous solution of zinc acetate, an ammonia aqueous solution of zinc oxalate, an ammonia aqueous solution of zinc oxide or the like is used. In this case, the concentration of zinc ammonia complex ions is preferably 0.001 to 3.0 mol/l. The hydrogen ion exponent (pH) of the aqueous solution is preferably controlled in the range of
pH 8 to pH 12.5. The temperature is preferably 50° C. or higher. In addition, the current density on the surface of the conductive substrate is preferably 0.1 to 100 mA/cm2. - Next, a case is described in which the
aqueous solution 102 contains zinc ions, hydrogenzincate ions, and zincate ions. In this case, inFIG. 1 , thepower source 105 is connected so that theconductive substrate 103 and thecounter electrode 104 serve as an anode and a cathode, respectively. - Where excessive ammonia aqueous solution is added to an aqueous solution containing zinc ions to form a supply source for ions such as zinc ions, hydrogenzincate ions, zincate ions, and the like, for example, an aqueous solution such as an ammonia aqueous solution of zinc hydroxide, an ammonia aqueous solution of zinc acetate, an ammonia aqueous solution of zinc oxalate, an ammonia aqueous solution of zinc oxide, or the like is used. The concentration of ions such as hydrogenzincate ions, zincate ions and the like is preferably 0.01 to 3.0 mol/l. The hydrogen ion exponent (pH) of the aqueous solution is preferably controlled in the range of
pH 8 to pH 12.5. The temperature is preferably 50° C. or higher. In addition, the current density on the surface of the conductive substrate is preferably 0.1 to 100 mA/cm2. - To each of the above two types of aqueous solutions is preferably added as an additive a hydrocarbon, for example, 1 to 300 g/l of sucrose or 0.001 to 10 g/l of dextrin. Although it is advantageous from the industrial viewpoint to increase the current density, in formation of the zinc oxide thin film at a current density increased to 5 mA/cm2 or more, abnormal growth of an erect plate-like shape of 10 μm or more significantly occurs. Such abnormal growth of an erect plate-like shape causes local thinning of the semiconductor layer formed in a position where the abnormal growths occur, and excessive leakage current occurs, thereby causing malfunction in the device.
- The addition of a hydrocarbon to the aqueous solution is capable of suppress abnormal growth of a crystal. As the hydrocarbon, for example, a monosaccharide such as glucose, fructose, or the like; a disaccharide such as maltose, sucrose, or the like; or a polysaccharide such as dextrin, starch, or the like can be used. In combination of at least two of these hydrocarbons to make use of the above advantages, a good zinc oxide thin film can be formed.
- In order to obtain a zinc oxide thin film having no abnormal growth and excellent uniformity and adhesion, the amount of the hydrocarbon added to the aqueous solution is preferably in the range of 0.001 to 300 g/l, more preferably in the range of 0.005 to 100 g/l, and most preferably in the range of 0.01 to 60 g/l.
- Finally, a case in which the
aqueous solution 102 contains at least carboxylic acid ions and zinc ions is described. In this case, as shown inFIG. 1 , theconductive substrate 103 and thecounter electrode 104 are used as a cathode and an anode, respectively. - As the aqueous solution, for example, an aqueous solution containing carboxylic acid ions and zinc ions originating from zinc acetate or zinc formate can be used. The concentration of carboxylic acid ions is preferably 0.002 to 2.0 mol/l, more preferably 0.05 to 1.0 mol/l, and most preferably 0.025 to 0.3 mol/l. The applied current is preferably 0.1 to 100 mA/cm2, more preferably 1 to 30 mA/cm2 and most preferably 3 to 16 mA/cm2. The solution temperature is preferably 50° C. or higher. The hydrogen ion exponent (pH) of the aqueous solution is preferably controlled in the range of pH 3.5 to pH 5.5.
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FIG. 2 shows an apparatus capable of continuously forming a zinc oxide thin film on the surface of a long sheet-shapedconductive substrate 201 having flexibility in an aqueous solution. - To the back of the surface of the
conductive substrate 201 is applied an insulation tape (not shown in the drawing) for preventing deposition of the zinc oxide thin film. Theconductive substrate 201 is wound in a roll on afeed roll 202, and rewound on a take-up roll 203 for rewinding theconductive substrate 201 through many transfer rolls 204. - In order to prevent plastic deformation of the substrate, the diameter of each of the rolls must be determined in accordance with the material of the
conductive substrate 201. - The
conductive substrate 201 is heated in ahot water tank 205 with acirculation system 206 containing a filter for removing dust particles and connected thereto, and aheater 207 is provided in thehot water tank 205. - The zinc oxide thin film is formed in a liquid
phase deposition tank 208 to which acirculation system 209 containing a filter for removing dust particles is connected, with azinc electrode 210 and a heater 21 provided in the liquidphase deposition tank 208. A constantcurrent power source 212 is provided outside the liquidphase deposition tank 208, and connected to thezinc electrode 210. Thecirculation system 209 comprises a system for monitoring the solution concentration and on occasion adding a solution. - To a
washing tank 213 is connected acirculation system 214 containing a filter for removing dust particles. Theconductive substrate 201 is dried with hot air in a dryingchamber 215. - This apparatus is capable of forming the zinc oxide thin film at low cost.
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FIG. 3A is a schematic sectional view showing an example of a photovoltaic device to which the zinc oxide thin film formed by the method of the present invention was applied. The photovoltaic device comprises a support 301-1, a metal layer 301-2, a transparent conductive layer 301-3, azinc oxide layer 302 formed by the method of the present invention, asemiconductor layer 303, a transparentconductive layer 304, and a collectingelectrode 305. The support 301-1, the metal layer 301-2 and the transparent conductive layer 301-3 constitutes aconductive substrate 301 according to the present invention. - Sunlight is incident on the photovoltaic device from the transparent
conductive layer 304 side. Light at short wavelengths of 500 nm or less is mostly absorbed by thesemiconductor layer 303. On the other hand, light at long wavelengths of about 700 nm or more, which is longer than the band absorption ends, is partially transmitted through thesemiconductor layer 303, passes through thezinc oxide layer 302 as a transmitting layer, is reflected by the metal layer 301-2 or the support 301-1, again passes through thezinc oxide layer 302 as a transmitting layer, and is then partially or mostly absorbed by thesemiconductor layer 303. - If unevenness is formed in the support 301-1 and/or the metal layer 301-2 and/or the
zinc oxide layer 302 as a transmitting layer and/or thesemiconductor layer 303 so as to sufficiently bend the optical path, the optical path of light transmitted through thesemiconductor layer 303 is lengthened due to inclination of the optical path, and thus an increase in absorption is expected. Although the increase in absorption due to lengthening of the optical path is negligibly small in a layer transparent for light, the increase is exponential for light in the region where some absorption is present, i.e., for light at wavelengths near the absorption edged of a material. Since thezinc oxide layer 302 as a transparent layer is transparent for external light ranging from visible light to infrared light, light at wavelengths of 600 to 1200 nm is absorbed by thesemiconductor layer 303. -
FIG. 3B is a schematic drawing of the photovoltaic device as viewed from the incident side, in which a plurality of collectingelectrodes 305 are arranged so as not to cross the surface of the device. The collectingelectrodes 305 are arranged in a comb-like form as viewed from the incident side, ends thereof being electrically connected to abus bar 306. Thebus bar 306 is formed on the collectingelectrodes 305 and made of a metallic material having high conductivity, such as a Cu plate or the like. Thebus bar 306 is adhered to the transparentconductive layer 304 with an insulating double side tape arranged therebetween. -
FIG. 4 shows an example of the internal structure of thesemiconductor layer 303 made of a hydrogen-containing non-single crystal silicon material and having at least one p-i-n junction therein. This example has three p-i-n junctions. - As shown in
FIG. 4 , the semiconductor layer comprises layers laminated in turn and made of hydrogen-containing non-single crystal silicon materials. Doped layers-401, 403, 404, 406, 407 and 409 are conductive layers exhibiting p-type or n-type conduction. The firstdoped layer 401, the thirddoped layer 404 and the fifth dopedlayer 407 exhibit the same conductivity, and the second, fourth and sixthdoped layers doped layers - Band gap of the
first i layer 402<band gap of thesecond i layer 405<band gap of thethird i layer 408. As each of the doped layers, a n-type semiconductor layer (n layer) or a p-type semiconductor layer (p layer) can be used. -
FIG. 5A is an exploded sectional view showing a photovoltaic device module in accordance with an embodiment of the present invention, andFIG. 5B is a plan view showing a portion including thephotovoltaic devices 507 and thebypass diodes 506 shown inFIG. 5A . As shown inFIGS. 5A and B, a plurality of thephotovoltaic devices 507 are arranged in series, and thebypass diodes 506 are respectively connected to thephotovoltaic device 507 in parallel so that even when one of the photovoltaic devices shadows, the total voltage of the other photovoltaic devices is not applied to the photovoltaic device shadowing. - In the photovoltaic device module of the present invention, after each of the members is arranged as shown in
FIG. 5A and 5B , the members are sealed by a fluororesin 523 and a supportingsubstrate 501 to suppress entrance of water vapor. - Each of the collecting
electrodes 515 used in the photovoltaic device module comprises a silver cladding layer and a carbon layer containing an acrylic resin as a binder, both of which are formed around a fine copper wire, the collectingelectrodes 515 being fused to the transparent conductive layer by heating. The silver cladding layer has the function to decrease contact resistance with the copper wire. The carbon layer containing an acrylic resin as a binder has the function to maintain adhesion to the transparent conductive layer, and the function to decrease contact resistance with the silver cladding layer. The carbon layer also has the function to prevent diffusion of the silver contained in the silver cladding layer into the semiconductor layer. - Each of the portions will be described in detail below.
- (Support 301-1)
- The support used in the present invention may comprise a single material or one or a plurality of thin films formed on the support. The support may be electrically insulative as long as a surface thereof has conductivity.
- Examples of conductive materials include metals such as Cu, Ni, Cr, Fe, Al, Cr, Mo, Nb, Ta, V, Ti, Rh, and the like; and alloys thereof. These materials may be used singly as the support. Particularly, from the viewpoints of workability, strength, chemical stability, cost, etc., stainless steel and Fe are preferred.
- Insulating materials for the support include synthetic resins such as polyester, polyethylene, polycarbonate, cellulose acetate, polypropylene, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, and the like; glass; ceramics; and the like. A thin film made of one of the above conductive materials is formed on at least one surface of the support.
- In the use of one of the above materials for the support, the material is preferably formed in a sheet shape or a roll shape formed by rolling a band on a cylinder.
- The thin film is preferably formed on the support by vacuum deposition, sputtering, screen printing, dipping, plasma CVD, electroplating, electroless plating, or the like. The smoothness of the support surface is preferably a center line average surface roughness Ra of 3.0 μm or less. In order to form unevenness, the surface of the support may be appropriately etched with an acid solution of HNO3, HF, HCl, H2SO4, or the like.
- Where flexibility is required, the support can be made as thin as possible in a range in which the function as the support can sufficiently be exhibited. However, from the viewpoints of production, handling and mechanical strength of the support, the thickness is generally 10 μm or more.
- In order to prevent peeling of the metal layer 301-2 and the transparent conductive layer 301-3, the surface of the support is preferably washed with a surfactant or an organic substance.
- (Metal Layer 301-2 and Transparent Conductive Layer 301-3)
- Although the metal layer is not essential, for the support made of a stainless steel or copper plate having low reflectance, or the support made of a material with low conductivity, such as glass, ceramic or resin, the metal layer made of silver, copper, gold or aluminum having high reflectance is provided on the support by sputtering or vaporization.
- In the use of aluminum for the metal layer, in order to prevent dissolution of aluminum in the aqueous solution, a thin transparent conductive layer is formed on the metal layer.
- The metal layer used in the present invention may comprise a single layer or multilayers.
- In either case, the total thickness is preferably 0.01 to 0.5 μm.
- As the method of producing the metal layer, the vacuum deposition method, the sputtering method or the electrochemical deposition method (plating method) using an aqueous solution is preferably used. The surface of the metal layer may be either smooth or uneven.
- In formation of the metal layer by sputtering, the support 301-1 is made uneven by heating to a temperature of 150° C. or higher-to improve adhesion between the metal layer and the support 301-1.
- (Semiconductor Layer 303)
- This layer is an important layer which determines photoelectric properties of the photovoltaic device, such as the efficiency of photoelectric conversion, release voltage, the short-circuit photocurrent, etc. The semiconductor layer of the present invention has at least one p-i-n junction, and comprises a non-single crystal silicon material. In some cases, a p-i-n junction may be formed on a pn junction.
- The non-single crystal silicon material mainly has an amorphous (a-), microcrystalline (μc) or polycrystalline (poly) structure. Examples of such materials include a-Si, a-SiGa, a-SiSn, a-SiC, a-SiO, a-SiN, μc-Si, uc-SiC, and poly-Si. In order to make these materials the p type, an element such as B, Al or the like is added, and in order to make the n-type, an element such as P, As, Sb, or the like is added. For materials having the amorphous or microcrystalline structure, defects such as unpaired electrons must be compensated for by adding an element such as H, F, Cl, or the like. This can significantly improve the curve factor (fill factor) of the photovoltaic device.
- The order of the layers may be the n layer, the i layer and the P layer, or conversely the p layer, the i layer and n layer from the support side. In the use of a pn junction, n-p/n-i-p or p-n/p-i-n from the support side may be used. The semiconductor layer may have one p-i-n junction, but preferably have at least two p-i-n junctions in order to suppress photodeterioration of the photovoltaic device (the phenomenon that the fill factor and release voltage are decreased by irradiation of strong light, thereby deteriorating the efficiency of photoelectric conversion with the passage of time).
- The example of the semiconductor layer shown in
FIG. 4 has three p-i-n junctions, and preferably comprises thefirst i layer 402 made of a-SiGe:H, thesecond i layer 405 made of a-SiGe:H, and thethird i layer 408 made of a-Si:H. Each of these i layers may comprise a single layer, or a laminated layer such as a-Si/a-s, a-Si/a-SiGe/a-Si, or the like. Also, in order to make the i layers more intrinsic, an element such as B or the like may be added. In formation of a pn junction, it is preferable to add the above elements for making the p type and n type to poly-Si or μc-Si. These materials generally do not cause the above photodeterioration, and are thus preferable for outdoor use for a long period of time. However, the absorption coefficient for visible light is lower than amorphous materials, and thus a thickness of 0.5μ a or more is required. - Each of the n and p layers is preferably made of a material exhibiting as the lowest possible absorption, and a-Si, a-SiC, a-SiO, a-SiN, μc-Si, μc-SiC, and poly-Si are generally used.
- In order to form the p-i-n junction using a non-single crystal silicon material such as a-Si, a-SiO, a-SiN, μc-Si-or μc-SiC, a plasma CVD method is generally used. Particularly, a microwave plasma CVD method having a high deposition rate is preferably used for forming the i layers. In order to form poly-Si on the substrate, a-Si may be formed by the plasma CVD method, the sputtering method, or the like, and then made polycrystalline by irradiating a laser or applying radio-frequency-power. In layer formation using a RF plasma CVD method, raw material gases may be diluted with Ar, H2 or He 1 to about 100 times. In the use of a non-single crystal silicon material having the microcrystalline structure, raw material gases may be diluted with Ar, H2 or He about 10 to 100 times.
- (Transparent Conductive Layer 304)
- This layer is an important layer for efficiently guiding light to the
semiconductor layer 303 and guiding a photocurrent to the collecting electrodes without a loss. Therefore, it is necessary to further decrease light absorption, control the thickness with high reproducibility for improving an antireflecting effect, and decrease resistivity as much as possible. Suitable materials include SnO2, In2O3, ITO, and the like. It is also possible to improve the antireflecting effect by laminating MgF2, TiO2, or the like on the above layer. - For example, in the use of ITO for the transparent conductive layer, the thickness is preferably about 700 to 800 angstroms so that visible light can effectively be guided to the semiconductor layer.
- In order to form the transparent conductive layer made of one of the above materials on the
semiconductor layer 303, the vacuum deposition or sputtering method is generally used. In general, by forming the conductive layer at a temperature of about 100 to 300° C., the transparent conductive layer with low resistivity can be obtained. However, from the industrial viewpoint, the sputtering method permitting formation on a large area and an increase in deposition rate is preferable. Further, from the viewpoint of cost, the reactive sputtering method of forming a film using a target of In, Sn, or InSn (for example, Sn: 5 wt %) while introducing Ar and O2 into a deposition chamber is preferable. - (Collecting Electrode 305)
- In order to attain a low loss of the photocurrent and effectively guide light to the
semiconductor layer 303, the collectingelectrodes 305 preferably have a comb-like shape as viewed from the incident side, as shown inFIG. 3B . As a material, materials having high conductivity, i.e., Au, Ag, Cu, Al and the like, are generally used. The collecting electrodes of the present invention may be made of a single layer of one of these metals or a plurality of layers of these metals and other metals. - However, like the metal layer 301-2, the use of Au, Ag, or Cu causing migration has the need to prevent migration. Specifically, the collecting
electrodes 305 are preferably formed by coating carbon paste comprising an urethane resin dissolved as a binder in cyclohexane on wires of one of the above metals, placing the wires on the transparentconductive layer 304, and then drying. In this method, cyclohexane is evaporated by drying to fuse the core wires to the transparentconductive layer 304, and thus the collecting electrodes having very low contact resistance can be obtained. Alternatively, the collecting electrodes may be formed by coating carbon paste in the electrode shape by screen printing, printing the metal on the carbon paste by screen printing, and then drying. - In the use of Al as a metal, a single layer or multilayers with another metal, such as Cr/Al/Cr or the like, may be formed by vacuum deposition using a mask for covering the deposition surface, or sputtering. In order to improve chemical stability, about 0.1 to 10% of Ti, Mn, Si, Mo or the like may be added. Also, the
bus bar 306 comprising a copper plate shown inFIG. 3B may be simultaneously fused to a portion with a high current density. In the use of the conductive support 301-1, thesame bus bar 306 comprising a copper plate may be fused to the back of the support 301-1. - Although the method of producing the zinc oxide thin film of the present invention, and a solar cell as a photovoltaic device using the zinc oxide film are described in detail below with reference to examples, the present invention is not limited to these examples.
- The zinc oxide thin film was produced by using the apparatus shown in
FIG. 1 . - As the
conductive substrate 103 on the cathode side, a substrate of stainless 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 300 nm by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used. As thecounter electrode 104 on the anode side, 4-N zinc having a thickness of 1 mm was used. Theaqueous solution 102 was an aqueous solution of 0.03 mol/l zinc hydroxide in 10% ammonia at 65° C. and a pH of 10.3. The applied current was 1.0 mA/cm2 (0.1 A/dm2). - The thus-obtained electrodeposited film was examined by X-ray diffraction, and the deposition rate and reflectance at a wavelength of 800 nm were measured from optical-characteristics. The results are shown in Table 1.
TABLE 1 Type of electrodeposited film Zinc oxide Deposition rate (μm/h) 2 Reflectance (%) 90 - The above results indicate that an excellent zinc oxide thin film can be obtained by the method of producing a zinc oxide thin film of the present invention.
- Electrodeposition was carried out by the same method as Example 1 except that as the
conductive substrate 103, a substrate of stainless 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 100 nm by sputtering and zinc oxide deposited to 100 nm on Ag by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used. - The thus-obtained electrodeposited film was examined by X-ray diffraction, and the deposition rate and reflectance at a wavelength of 800 nm were measured from optical characteristics. The results are shown in Table 2.
TABLE 2 Type of electrodeposited film Zinc oxide Deposition rate (μm/h) 3 Reflectance (%) 72 - The above results indicate that an excellent zinc oxide thin film can be obtained by the method of producing a zinc oxide thin film of the present invention.
- The solar cell shown in
FIG. 3 and having a semiconductor layer having three p-i-n junctions, as shown inFIG. 4 , was produced. - Specifically, the solar cell comprised the support 301-1 (conductive substrate of stainless steel SUS430, 10×10 cm2, thickness 0.2 mm), the metal layer 301-2 (Al), the transparent conductive layer 301-3 (zinc oxide thin film), the
zinc oxide layer 302, thesemiconductor layer 303, the transparentconductive layer 304, and the collecting electrodes 305 (Cu wire/Ag/C). - The metal layer 301-2 and the transparent conductive layer 301-3 were formed by the general vacuum deposition or sputtering method.
- The
zinc oxide layer 302 was formed by the same method as Example 1 except that 3 g/l of sucrose was added to the aqueous solution. - The
semiconductor layer 303 was formed under the conditions shown in Table 3.TABLE 3 Deposition Forming temperature Thickness Semiconductor layer method (° C.) (μm) First doped layer n-type a-Si:H:P RFCVD 300 0.015 First i layer a-SiGe:H Microwave 280 0.1 CVD Second doped layer p type RFCVD 240 0.01 μc-Si:H:B Third doped layer n-type RFCVD 240 0.01 a-Si:H:P Second i layer a-SiGe:H Microwave 270 0.07 CVD Fourth doped layer p-type RFCVD 240 0.01 μc-Si:H:B Fifth doped layer n-type RFCVD 230 0.01 a-Si:H:P Third i layer a-Si: H RFCVD 200 0.1 Sixth doped layer p-type RFCVD 165 0.01 μc-Si:H:B - The transparent
conductive layer 304 was formed by the sputtering method. - As shown in
FIG. 3B , on one side of the substrate on which the layers of up to the transparentconductive layer 304 were formed was applied the commercial insulatingdouble side tape 307, and a Cu plate as thebus bar 306 was placed on thedouble side tape 307. The collecting electrodes comprising Cu wire/Ag/C were formed and then fused to theconductive layer 304 by heating and drying. Ten solar cells were produced (Examples 3-1 to 3-10). - For comparison, ten solar cells (Comparative Examples 3-1 to 3-10) were produced by the same method except that the
zinc oxide layer 302 was formed by the general sputtering method without forming the transparent conductive layer 301-3. - First, the initial characteristics (photoconductive characteristics, short-circuit current) of these solar cells were measured.
- As a result of measurement of the efficiency of photoelectric conversion and short-circuit photocurrent using a solar simulator (AM 1.5, 100 mW/cm2, surface temperature 25° C.), on average, the efficiency of photoelectric conversion and short-circuit photocurrent of the photovoltaic devices (Examples 3-1 to 3-10) produced by using the method of forming a zinc oxide thin film of the present invention were 1.15 times and 1.16 times, respectively, as high as the comparative examples. The increase in the short-circuit photocurrent indicates that desired unevenness was formed.
- Then, as an acceleration test, a HH test (high-temperature high-humidity test) was performed. A solar cell was placed in an environmental test box and allowed to stand at a temperature of 84° C. and a humidity of 85% for 180 hours. The solar cell was then allowed in the environmental test box in which the temperature was set to 25° C., and humidity was set to 50% for 1 hour, and then removed. As a result of measurement of the efficiency of photoelectric conversion and short-circuit photocurrent, the efficiency of photoelectric conversion and short-circuit photocurrent of the photovoltaic devices (Examples 3-1 to 3-10) produced by using the method of forming a zinc oxide thin film of the present invention were 1.09 times and 1.11 times, respectively, as high as the comparative examples.
- Solar cells were formed by the same method as Example 3 except that the pH of the aqueous solution was changed to 7.5 to 13 by using a pH buffer and a strong alkali aqueous solution. As shown in
FIG. 6 , the efficiency of photoelectric conversion was the maximum in the pH range of 8 to 12.5. - Solar cells were formed by the same method as Example 3 except that the hydrogen ion exponent of the aqueous solution near the uppermost surface where the zinc oxide thin film was formed was changed to pH 5.5 to 8.5 by using a 10% ammonia aqueous solution of 0.02 mol/l zinc oxalate at pH 10.3, weak acid and weak alkali pH buffers while changing the applied current. As shown in
FIG. 7 , the efficiency of photoelectric conversion was the maximum in the pH range of 6 to 8. - Solar cells were formed by the same method as Example 3 except that the sucrose content was changed from 0 to 800 g/l. As shown in
FIG. 8 , the efficiency of photoelectric conversion was the maximum in the range of sucrose contents of 1 to 300 g/l. - SEM observation of a section of the transparent conductive layer showed significant abnormal growth of an erect plate-like shape at a sucrose content of 1 g/l or less. Therefore, the leakage current was decreased, thereby deteriorating the efficiency of photoelectric conversion. On the other hand, at a sucrose content of over 300 g/l, the shape was excessively flat, and thus insufficient for light confinement and light scattering, thereby deteriorating the efficiency of photoelectric conversion.
- Solar cells were formed by the same method as Example 3 except that the dextrin content was changed from 0 to 100 g/l. As shown in
FIG. 9 , the efficiency of photoelectric conversion was the maximum in the range of sucrose contents of 0.001 to 10 g/l. - SEM observation of a section of the transparent conductive layer showed significant abnormal growth of an erect plate-like shape at a dextrin content of 0.001 g/l or less. Therefore, the leakage current was decreased, thereby deteriorating the efficiency of photoelectric conversion. On the other hand, at a sucrose content of over 10 g/l, the shape was excessively flat, and thus insufficient for light confinement and light scattering, thereby deteriorating the efficiency of photoelectric conversion.
- The CIGS type solar cell shown in
FIG. 10 was produced. - Specifically, a blue glass plate on which Mo was deposited to 2 μm by sputtering was used as the substrate. On the substrate was formed a Cu—In—Ga—Se mixed crystal precursor at the substrate temperature of 220° C. by the simultaneous vaporization method. Then, the substrate was kept in a selenium atmosphere at 500° C. for 80 minutes to form a CIGS thin film. The substrate was placed in the aqueous solution for forming a zinc oxide thin film of the present invention, and the zinc oxide thin film of the present invention was electrolytically deposited on the surface of the CIGS thin film under irradiation of strong light in the same manner as Example 1. Characteristics of the obtained CIGS type solar cell were measured by the same method as Example 3. As a result, it was found that the solar cell has excellent initial efficiency of photoelectric conversion and stability with causing substantially no photo-deterioration.
- A zinc oxide thin film was produced by using the apparatus shown in
FIG. 1 . However, in this example, thepower source 105 was set so that thecounter electrode 104 serves as the cathode. - As the
conductive substrate 103 on the anode side, a substrate of stainless 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 350 nm by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used. As thecounter electrode 104 on the cathode side, 4-N zinc having a thickness of 1 mm was used. Theaqueous solution 102 was an aqueous solution of 0.025 mol/l zinc hydroxide in 12% ammonia at 62° C. and a pH of 10.4. The applied current was 1.2 mA/cm2 (0.12 A/dm2). - The thus-obtained electrodeposited film was examined by X-ray diffraction, and the deposition rate and reflectance at a wavelength of 800 nm were measured from optical characteristics. The results are shown in Table 4.
TABLE 4 Type of electrodeposited film Zinc oxide Deposition rate (μm/h) 2.2 Reflectance (%) 91 - The above results indicate that an excellent zinc oxide thin film can be obtained by the method of producing a zinc oxide thin film of the present invention.
- Electrodeposition was carried out by the same method as Example 9 except that as the
conductive substrate 103, a substrate of stainless steel 430BA having a thickness of 0.15 mm, and comprising Ag deposited to 70 nm by sputtering and zinc oxide deposited to 110 nm on Ag by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used. - The thus-obtained electrodeposited film was examined by X-ray diffraction, and the deposition rate and reflectance at a wavelength of 800 nm were measured from optical characteristics. The results are shown in Table 5.
TABLE 5 Type of electrodeposited film Zinc oxide Deposition rate (μm/h) 3.5 Reflectance (%) 73 - The above results indicate that an excellent zinc oxide thin film can be obtained by the method of producing a zinc oxide thin film of the present invention.
- The solar cell shown in
FIGS. 3A and 3B and having the semiconductor layer having three p-i-n junctions, as shown inFIG. 4 , was produced. - Specifically, the solar cell comprised the support 301-1 (conductive substrate of stainless steel, SUS430, 10×10 cm2, thickness 0.2 mm), the metal layer 301-2 (Al), the transparent conductive layer 301-3 (zinc oxide thin film), the
zinc oxide layer 302, thesemiconductor layer 303, the transparentconductive layer 304, and the collecting electrodes 305 (Cu wire/Ag/C). - The metal layer 301-2 and the transparent conductive layer 301-3 were formed by the general vacuum deposition or sputtering method.
- The
zinc oxide layer 302 was formed by the same method as Example 1 except that 2 g/l of sucrose was added to the aqueous solution. - The
semiconductor layer 303 was formed under the conditions shown in Table 6.TABLE 6 Deposition Forming temperature Thickness Semiconductor layer method (° C.) (μm) First doped layer n-type a-Si:H:P RFCVD 310 0.015 First i layer a-SiGe:H Microwave 290 0.1 CVD Second doped layer p type RFCVD 240 0.01 μc-Si:H:B Third doped layer n-type RFCVD 240 0.01 a-Si:H:P Second i layer a-SiGe:H Microwave 280 0.07 CVD Fourth doped layer p-type RFCVD 240 0.01 μc-Si:H:B Fifth doped layer n-type RFCVD 230 0.01 a-Si:H:P Third i layer a-Si: H RFCVD 200 0.1 Sixth doped layer p-type RFCVD 165 0.01 μc-Si:H:B - The transparent
conductive layer 304 was formed by the sputtering method. - As shown in
FIG. 3B , on one side of the substrate on which the layers of up to the transparentconductive layer 304 were formed was applied the commercial insulatingdouble side tape 307, and a Cu plate as thebus bar 306 was placed on thedouble side tape 307. The collecting electrodes comprising Cu wire/Ag/C were formed and then fused to theconductive layer 304 by heating and drying. Ten solar cells were produced (Examples 11-1 to 11-10). - For comparison, ten solar cells (Comparative Examples 11-1 to 11-10) were produced by the same method except that the
zinc oxide layer 302 was formed by the general sputtering method without forming the transparent conductive layer 301-3. - First, the initial characteristics (photoconductive characteristics, short-circuit current) of these solar cells were measured.
- As a result of measurement of the efficiency of photoelectric conversion and short-circuit photocurrent using a solar simulator (AM 1.5, 100 mW/cm2, surface temperature 25° C.), on average, the efficiency of photoelectric conversion and short-circuit photocurrent of the photovoltaic devices (Examples 11-1 to 11-10) produced by using the method of forming a zinc oxide thin film of the present invention were 1.16 times and 1.17 times, respectively, as high as the comparative examples.
- Then, as an acceleration test, a HH test (high-temperature high-humidity test) was performed. A solar cell was placed in an environmental test box and allowed to stand at a temperature of 84° C. and a humidity of 85% for 180 hours. The solar cell was then allowed in the environmental test box in which the temperature was set to 25° C., and humidity was set to 50% for 1 hour, and then removed. As a result of measurement of the efficiency of photoelectric conversion and short-circuit photocurrent, the efficiency of photoelectric conversion and short-circuit photocurrent of the photovoltaic devices (Examples 11-1 to 11-10) produced by using the method of forming a zinc oxide thin film of the present invention were 1.11 times and 1.13 times, respectively, as high as the comparative examples.
- As described above, it was found that the photovoltaic device of the present invention is superior to conventional photovoltaic devices.
- Solar cells were formed by the same method as Example 11 except that the pH of the aqueous solution was changed to 7.5 to 13 by using a pH buffer and a strong alkali aqueous solution. As shown in
FIG. 11 , the efficiency of photoelectric conversion was the maximum in the pH range of 8 to 12.5. - Solar cells were formed by the same method as Example 11 except that the hydrogen ion exponent of the aqueous solution near the uppermost surface where the zinc oxide thin film was formed was changed to pH 5.5 to 8.5 by using a 10% ammonia aqueous solution of 0.03 mol/l zinc oxalate at pH 10.2, weak acid and weak alkali pH buffers while changing the applied current. As shown in
FIG. 12 , the efficiency of photoelectric conversion was the maximum in the pH range of 6 to 8. - Solar cells were formed by the same method as Example 11 except that the sucrose content was changed from 0 to 800 g/l. As shown in
FIG. 13 , the efficiency of photoelectric conversion was the maximum in the range of dextrin contents of 1 to 300 g/l. - SEM observation of a section of the transparent conductive layer showed significant abnormal growth of an erect plate-like shape at a sucrose content of 1 g/l or less. Therefore, the leakage current was decreased, thereby deteriorating the efficiency of photoelectric conversion. On the other hand, at a sucrose content of over 300 g/l, the shape was excessively flat, and thus insufficient for light confinement and light scattering, thereby deteriorating the efficiency of photoelectric conversion.
- Solar cells were formed by the same method as Example 11 except that the dextrin content was changed from 0 to 100 g/l. As shown in
FIG. 14 , the efficiency of photoelectric conversion was the maximum in the range of sucrose contents of 0.001 to 10 g/l. - SEM observation of a section of the transparent conductive layer showed significant abnormal growth of an erect plate-like shape at a dextrin content of 0.001 g/l or less. Therefore, the leakage current was decreased, thereby deteriorating the efficiency of photoelectric conversion. On the other hand, at a sucrose content of over 10 g/l, the shape was excessively flat, and thus insufficient for light confinement and light scattering, thereby deteriorating the efficiency of photoelectric conversion.
- The GIGS type solar cell shown in
FIG. 10 was produced. - Specifically, a blue glass plate on which Mo was deposited to 2.2 μm by sputtering was used as the substrate. On the substrate was formed a Cu—In—Ga—Se mixed crystal precursor at the substrate temperature of 210° C. by the simultaneous vaporization method. Then, the substrate was kept in a selenium atmosphere at 500° C. for 85 minutes to form a CIGS thin film. The substrate was placed in the aqueous solution for forming a zinc oxide thin film of the present invention, and the zinc oxide thin film of the present invention was electrolytically deposited on the surface of the CIGS thin film under irradiation of strong light in the same manner as Example 9. Characteristics of thus-obtained CIGS type solar cell were measured by the same method as Example 3. As a result, it was found that the solar cell has excellent initial efficiency of photoelectric conversion and stability with causing substantially no photo-deterioration.
- A zinc oxide thin film was produced by using the apparatus shown in
FIG. 1 . - As the
conductive substrate 103 on the cathode side, a substrate of stainless steel 430BA having a thickness of 0.12 mm, and comprising copper deposited to 200 nm by sputtering, with the back coated with an insulating tape (not shown in the drawing), was used. As thecounter electrode 104 on the anode side, 4-N zinc having a thickness of 1 mm was used. Theaqueous solution 102 was an aqueous solution of 0.025 mol/l zinc acetate 65° C. and a pH of 10.4. The applied current was 1.0 mA/cm2 (0.1 A/dm2). - The thus-obtained zinc oxide thin film was examined by X-ray diffraction, and the thickness and transmittance (in an atmosphere of a reference material) at a wavelength of 800 nm were measured from optical characteristics. Also the number of abnormal growths was visually examined. The results are shown in Table 7.
- Electrodeposition was carried out by the same method as Example 17 except that the aqueous solution was an aqueous solution of 0.025 mol/l zinc formate at 65° C. The results are shown in Table 7.
- Electrodeposition was carried out by the same method as Example 17 except that the aqueous solution was an aqueous solution of 0.025 mol/l zinc formate at 65° C. The results are shown in Table 7.
- Electrodeposition was carried out by the same method as Example 17 except that the aqueous solution was an aqueous solution of 0.025 mol/l zinc nitrate at 65° C. The results are shown in Table 7.
TABLE 7 Example Example Comparative 17 18 Example 19 Example 1 Transmittance (%) 75 78 68 58 Thickness (nm) 1020 980 750 580 Type of zinc oxide zinc oxide zinc oxide zinc oxide electrodeposited film measured by X-ray diffraction Number of 0 0 0 123 abnormal growths visually measured - Table 7 reveals that a zinc oxide thin film having excellent optical characteristics can be formed by electrodeposition of zinc oxide in an aqueous solution containing zinc ions and carboxylic acid ions.
- Electrodeposition was carried out by the same method as Example 17 except that as the
conductive substrate 103 on the cathode side, a substrate of stainless steel, 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering and ZnO deposited to 100 nm on Ag by sputtering, with the back coated with an insulating tape (not shown in the drawing), was used, and that the temperature of the aqueous solution was 70° C. - After electrodeposition, the number of abnormal growths of each of samples was measured in a region of 10 mm×10 mm. A peeling test was also carried out by bending the substrate of each of the samples. The results are shown in Table 8.
- Electrodeposition was carried out by the same method as Example 20 except that as the
conductive substrate 103 on the cathode side, a substrate of stainless steel 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering was used. The results are shown in Table 8.TABLE 8 Example 20 Example 21 Number of abnormal 5 92 growths of 3μ or more (10 mm × 10 mm) Result of test of Neither peeling nor No peeling was observed, bending at rack was observed. but cracks of about 1 mm 180° was observed. - Table 8 indicates that by using as a substrate the conductive substrate on which the zinc oxide thin film is formed, it is possible to increase the deposition rate, decrease abnormal growth and form a zinc oxide thin film having excellent adhesion.
- A zinc oxide thin film was produced by using the apparatus shown in
FIG. 1 . - As the
conductive substrate 103 on the cathode side, a substrate of stainless steel, 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering and ZnO deposited on 100 nm on Ag by sputtering, with the back coated with an insulating tape (not shown in the drawing), was used. As thecounter electrode 104 on the anode side, 4-N zinc having a thickness of 1 mm was used. Theaqueous solution 102 was an aqueous solution of 0.05 mol/l zinc acetate at 65° C.: The applied current was 1.0 mA/cm2 (0.1 A/dm2). The pH of the aqueous solution was controlled by periodically adding 10% acetic acid. - Samples were formed at intervals of 5 minutes in electrodeposition for a total time of 1 hour.
FIG. 17 shows changes in pH at intervals of 5 minutes. - The total three samples formed in the periods of 0 to 5 minutes, 25 to 30 minutes, and 55 to 60 minutes were measured on transmittance, the thickness, and the number of abnormal growths in a region of 10 mm×10 mm by using SEM. The results are shown in Table 9.
- Electrodeposition was carried out by the same method as Example 22 except that the pH of the aqueous solution was not controlled. The results are shown in
FIG. 17 and Table 9. - Electrodeposition was carried out by the same method as Example 22 except that the
counter electrode 104 was made of SUS304, and the pH of the aqueous solution was not controlled. The results are shown inFIG. 17 and Table 9.TABLE 9 Example 22 Example 23 Example 24 0-5 25-30 55-60 0-5 25-30 55-60 0-5 25-30 55-60 (min) (min) (min) (min) (min) (min) (min) (min) (min) Thickness 1.1 1.1 1.2 1 1.1 1 1 0.7 No film Number of 3 7 4 5 95 231 5 12 No abnormal film growths of 3μ or more - Table 9 and
FIG. 7 indicate that a zinc oxide thin film having excellent optical characteristics and less abnormal growth can be stably for a long period of time by controlling the aqueous solution in the pH range of 3.5 to 5.5. - Electrodeposition was carried out by the same method as Example 17 except that as the
conductive substrate 103 on the cathode side, a substrate of stainless steel, 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering, with the back coated with an insulating tape (not shown in the drawing), was used. - Then, n-type amorphous silicon (a-Si) of 200 angstroms, nondoped amorphous silicon (a-Si) of 20 angstroms, and p-type microcrystalline silicon (μc-Si) of 140 angstroms were deposited in turn by the CVD method to form the
semiconductor layer 303. Further, ITO of 650 angstroms was vapor-deposited by heating evaporation in an oxygen atmosphere to form the transparentconductive electrode 30 as an upper electrode having the antireflecting effect. On the upper electrode was deposited silver cladding by heating evaporation to form the collectingelectrodes 305, to obtain the device shown inFIGS. 3A and 3B . - The short-circuit current density and efficiency of conversion of the device were measured under artificial sunlight. The device was further allowed to stand in an environment of temperature 85° C. and humidity of 85% for 1000 hours to measure the rate of deterioration of the efficiency of conversion. The results of measurement are shown in Table 10.
- A device was produced by the same method as Example 25 except that the aqueous solution used was an aqueous solution of 0.025 mol/l zinc formate at 65° C. The results obtained are shown in Table 10.
- A device was formed by the same method as Example 25 except that as the
conductive substrate 103 on the cathode side, a substrate of stainless steel 430BA having a thickness of 0.12 mm, and comprising Ag deposited to 200 nm by sputtering and ZnO deposited to 100 nm by sputtering, with the back covered with an insulating tape (not shown in the drawing), was used. The results obtained are shown in Table 10. - A device was formed by the same method as Example 25 except that no zinc oxide thin film was formed. The results obtained are shown in Table 10.
- A device was formed by the same method as Example 25 except that the aqueous solution used was an aqueous solution of 0.025 mol/l zinc nitrate at 65° C. The results obtained are shown in Table 10.
TABLE 10 Example Example Example Comparative Comparative 25 26 27 Example 2 Example 3 Short- Comparison 1.2 1.2 1.3 1 1.15 circuit to Comparative current Example 2 Conversion Comparison 1.15 1.1 1.2 1 1.1 efficiency to Comparative Example 2 Rate of (%) 10 9 3 63 33 deterioration in conversion efficiency after HH test - Table 10 reveals that a device having excellent short-circuit current, conversion efficiency and reliability can be formed by using the zinc oxide thin film of the present invention. It is also found that a device having higher reliability can be formed by using as a substrate the conductive substrate having the transparent conductive layer composed of the zinc oxide thin film deposited thereon.
- Samples were formed at intervals of 5 minutes in the same manner as Example 22.
- The total three samples formed in the periods of 0 to 5 minutes, 25 to 30 minutes, and 55 to 60 minutes were used for forming devices by the same method as Example 26.
- The short-circuit current density and efficiency of conversion of each of the devices were measured under artificial sunlight. Each of the devices was further allowed to stand in an environment of temperature 85° C. and humidity of 85% for 1000 hours to measure the rate of deterioration of the efficiency of conversion. The results of measurement are shown in Table 11.
- Devices were formed by the same method as Example 28 except that the pH of the aqueous solution was not controlled. The results obtained are shown in Table 11.
TABLE 11 Example 28 Example 29 0-5 25-30 55-60 0-5 25-30 55-60 (min) (min) (min) (min) (min) (min) Efficiency of Relative 1 1 1 1 1 0.9 conversion comparison to Example 28 (0-5 min.) Rate of (%) 3 5 4 4 18 32 deterioration in conversion efficiency after HH test - Table 11 reveals that a device having excellent short-circuit current, efficiency of conversion and reliability can stably be formed for a long period of time by using a zinc oxide thin film formed by electrodeposition under control of the aqueous solution in the pH range of 3.5 to 5.5.
- A zinc oxide thin film was formed by the continuous production method shown in
FIG. 15 using as a support a roll of a stainless 430BA thin plate. - In
FIG. 15 , a stainless thin plate as asupport roll 1503 is fed by afeeding roller 1501, and finally wound by a take-uproller 1502. Between thefeeding roller 1501 and the take-uproller 1502 are provided in turn adegreasing tank 1506, awater washing tank 1508, anetching tank 1510, awater washing tank 1512, a metallayer forming tank 1514, awater washing tank 1518, ahot water tank 1520, a zincoxide forming tank 1523, awater washing tank 1527, and adrying furnace 1529. In each of these tanks is provided atransfer roller 1504 for controlling the conveyance passage of the rolledsupport web 1503. The processing speed of the rolledsupport web 1503 was 200 cm/min. The tension applied to the rolledsupport web 1503 was 50 kgf. The tension was controlled by a tension controlling clutch (not shown in the drawing) provided in the take-uproller 1502. - The rolled
support web 1503, was made rust proof with oil was later removed by thedegreasing tank 1506. Adegreasing bath 1505 comprised an aqueous solution containing 60 ml of sulfuric acid and 70 ml of hydrochloric acid (37% hydrogen chloride; the same is true for the example below) in 1 l water. The temperature was room temperature. The rolledsupport web 1503 was then transferred to thewater washing tank 1508 through the transfer roller, and sufficiently washed with water by awater washing shower 1507. The amount of water is preferably at least 2 l per minute. - The rolled
support web 1503 was then transferred to theetching tank 1510 through the transfer roller. Theetching bath 1511 comprised a mixture containing hydrofluoric acid (46% hydrogen fluoride; the same is true for the example below) and acetic acid at a ratio of 3:1. The temperature was room temperature. The rolledsupport web 1503 was then transferred to the samewater washing tank 1512 as thewater washing tank 1508 after thedegreasing tank 1506. Since the metallayer forming bath 1515 in the next step is alkaline, a weak alkali shower can also be used. - The rolled
support web 1503 was then transferred to the metallayer forming bath 1515 through the transfer roller to form a metal layer. The metallayer forming bath 1515 comprised 80 g of copper pyrophosphate, 300 g of potassium pyrophosphate, 6 ml of ammonia water (specific gravity 0.88), and 10 g of potassium nitrate. The temperature was controlled to 50 to 60° C. The pH was controlled to be in the range of 8.2 to 8.8. As thecounter electrode 1516 as the anode a copper plate was used. In this apparatus, since the rolledsupport web 1503 was set at the set potential, layer formation was controlled by reading the current in thecounter electrode 1516. In this example, the current density was 3 A/dm2. The rate of layer formation was 60 angstroms/sec, and the thickness of the metal layer formed in the metallayer forming bath 1515 was 4000 angstroms. - The rolled
support web 1503 was then washed with water in thewater washing tank 1518, sufficiently pre-heated by passing through thehot water tank 1520 kept at a pure water temperature 85° C. through the transfer roller, and transferred to the zincoxide forming tank 1523. The zincoxide forming bath 1524 comprised 10 g of zinc acetate hexahydrate in 1 l water. The liquid temperature was kept at 75° C., and the pH was kept at 4.5 to 5.5. As thecounter electrode 1526, zinc having a puff-polished surface was used. The density of the current flowing in thezinc counter electrode 1526 was 5 A/dm2. The formation rate was 30 Å/sec, and the thickness of the zinc oxide layer formed in the zincoxide forming bath 1524 was 1 micron. - After water washing in the
water washing tank 1527, the rolledsupport web 1503 was sent to the dryingfurnace 1529 through the transfer roller. The drying furnace comprised a hot air nozzle and an infrared heater which are not shown in the drawing, hot air being also used for repelling water. The hot air from the hot air nozzle was controlled to 80° C., and the infrared heater was controlled to 200° C. - The rolled
support web 1503 passed through the drying step was wound as a roll comprising the metal layer 301-2 and thezinc oxide layer 302 both of which are formed on the support 301-1 on the take-uproller 1502. - The metal
layer forming tank 1514 and the zincoxide forming tank 1523 were stirred with air, and the pH values of the metallayer forming tank 1514 and the zincoxide forming tank 1523 were controlled by adding ammonia and zinc nitrate, respectively, on occasion, while constantly monitoring pH of the bathes using a pH meter comprising a glass electrode in which the temperature was corrected. - On the thus-obtained substrate comprising the metal layer 301-2 and the
zinc oxide layer 302 formed on the support 301-1 was formed thesemiconductor layer 303 having a triple structure by the CVD apparatus for a roll. - First, a n-type layer was formed on the substrate heated to 340° C. by using mixed gases containing silane, phosphine and hydrogen with a RF power of 400 W charged, and then a i layer was formed on the substrate heated to 450° C. by using mixed gases containing silane, germane and hydrogen with a microwave power charged. Further, a p-type layer was formed on the substrate heated to 250° C. by using mixed gases containing boron trifluoride, silane and hydrogen, to form bottom pin layers. Then, middle nip layers were formed by the same procedure as the above at a increased mixing ratio of silane and germane, and top pin layers were formed by the same procedure except that the i layer was formed by using silane and hydrogen. Then ITO was deposited by a sputtering apparatus for a roll to form the transparent
conductive layer 304, and the collectingelectrodes 305 were formed by using silver paste. - The short-circuit current density and efficiency of conversion of the device were measured under artificial sunlight. The device was further allowed to stand in an environment of temperature 85° C. and humidity of 85% for 1000 hours to measure the rate of deterioration in the efficiency of conversion. The results of measurement are shown in Table 12.
- On the support 301-1 was deposited to 4000 angstroms copper by a CVD magnetron sputtering apparatus to form the metal layer 301-2. The
zinc oxide layer 302 was formed on the metal layer 301-2 formed on the support 301-1 by using the apparatus shown inFIG. 16 . - A
support roll 1603 was first sufficiently heated in ahot water bath 1605 containing pure water kept at 85° C. in ahot water tank 1606, and then transferred to a zinc oxidelayer forming tank 1612 through atransfer roller 1604. - A zinc
oxide forming bath 1607 contained 10 g of zinc formate hexahydrate in 1 l water, and was provided with an ultrasonic vibrator 1608 (40 kHz) for ultrasonic processing by stirring the bath. The temperature of the bath was kept at 65° C., and the pH was kept at 4.0 to 5.0. As acounter electrode 1610, zinc having a puff-polished surface is used. The density of the current flowing in thezinc counter electrode 1610 was 5 A/dm2. The formation rate was 30 Å/sec, and the thickness of the zinc oxide layer formed in the zincoxide forming bath 1607 was 1 micron. - A device was formed on the thus-obtained substrate by the same method as Example 30. The results obtained are shown in Table 12.
TABLE 12 Example Example 30 Example 31 27 Short-circuit Comparison to 0.9 0.9 1 current Example 27 Conversion Comparison to 0.95 0.92 1 efficiency Example 27 Rate of (%) 2 5 3 deterioration in conversion efficiency after HH test - Table 12 reveals that the method of forming a zinc oxide thin film of the present invention has the sufficient effect of improving short-circuit current, conversion efficiency and reliability of a roll-to-roll system.
- The aqueous solution for forming a zinc oxide thin film and the method of producing a zinc oxide thin film of the present invention are capable of forming a zinc oxide thin film having excellent characteristics. The method of producing a zinc oxide thin film of the present invention and the photovoltaic device formed by the same producing method permit improvements in photoconductive characteristics such as the conversion of photoelectric conversion, short-circuit photocurrent and leakage current of the photovoltaic device. Also it is possible to improve durability in an outdoor exposure test, a HH (high temperature high humidity) test and long-term light irradiation. Further, the cost of the photovoltaic device can significantly be decreased. Particularly, the power cost of a solar cell can be decreased.
- While the present invention has been described with reference to what are presently considered to be the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, the invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Claims (28)
1-15. (Cancelled)
16. A method of producing a zinc oxide thin film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc ions, hydrogenzincate ions and zincate ions, and an electrode as a cathode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
17. A method of producing a zinc oxide thin film according to claim 16 , wherein the conductive substrate comprises a support and a transparent conductive layer deposited thereon.
18. A method of producing a zinc oxide thin film according to claim 16 , wherein the hydrogen ion concentration of the aqueous solution is controlled in the range of pH 8 to pH 12.5.
19. A method of producing a zinc oxide thin film according to claim 16 , wherein the hydrogen ion concentration of the aqueous solution near the uppermost surface in which the zinc oxide thin film is formed is controlled in the range of pH 6 to pH 8.
20. A method of producing a zinc oxide thin film according to claim 16 , wherein the aqueous solution contains a hydrocarbon.
21. A method of producing a photovoltaic device comprising the steps of:
forming a zinc oxide thin film on a conductive substrate immersed in an aqueous solution containing at least zinc ions, hydrogenzincate ions and zincate ions by passing a current between the conductive substrate and an electrode as a cathode immersed in the aqueous solution; and
forming a semiconductor layer.
22. A method of producing a photovoltaic device according to claim 21 , wherein the conductive substrate comprises a support and a transparent conductive layer deposited thereon.
23. A method of producing a photovoltaic device according to claim 21 , wherein the hydrogen ion concentration of the aqueous solution is controlled in the range of pH 8 to pH 12.5.
24. A method of producing a photovoltaic device according to claim 21 , wherein the hydrogen ion concentration of the aqueous solution near the uppermost surface in which the zinc oxide thin film is formed is controlled in the range of pH 6 to pH 8.
25. A method of producing a photovoltaic device according to claim 21 , wherein the aqueous solution contains a hydrocarbon.
26. A method of producing a semiconductor device substrate comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc ions, hydrogenzincate ions and zincate ions, and an electrode as a cathode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
27. A method of producing a semiconductor device substrate according to claim 26 , wherein the conductive substrate comprises a support and a transparent conductive layer deposited thereon.
28. A method of producing a semiconductor device substrate according to claim 26 , wherein the hydrogen ion concentration of the aqueous solution is controlled in the range of pH 8 to pH 12.5.
29. A method of producing a semiconductor device substrate according to claim 26 , wherein the hydrogen ion concentration of the aqueous solution near the uppermost surface in which the zinc oxide thin film is formed is controlled in the range of pH 6 to pH 8.
30. A method of producing a semiconductor device substrate according to claim 26 , wherein the aqueous solution contains a hydrocarbon.
31-45. (Cancelled)
46. A method of producing a zinc oxide film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc acetate, zinc ions and acetate ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
47. A method of producing a zinc oxide film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc formate, zinc ions and formate ions and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
48. A method of producing a zinc oxide film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc benzoate, zinc ions and benzoate ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
49. A method of producing a zinc oxide film comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least carboxylic acid ions and zinc ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate, wherein the aqueous solution is controlled in the range of pH 3.5 to pH to 5.5.
50. A method of producing a photovoltaic device comprising the steps of:
forming a zinc oxide thin film on a conductive substrate immersed in an aqueous solution containing at least zinc acetate, zinc ions and acetate ions, by passing a current between the conductive substrate and an electrode as an anode immersed in the aqueous solution; and
forming a semiconductor layer on the top of the zinc oxide thin film.
51. A method of producing a photovoltaic device comprising the steps of:
forming a zinc oxide thin film on a conductive substrate immersed in an aqueous solution containing at least zinc formate, zinc ions and formate ions, by passing a current between the conductive substrate and an electrode as an anode immersed in the aqueous solution; and
forming a semiconductor layer on the top of the zinc oxide thin film.
52. A method of producing a photovoltaic device comprising the steps of:
forming a zinc oxide thin film on a conductive substrate immersed in an aqueous solution containing at least zinc benzoate, zinc ions and benzoate ions, by passing a current between the conductive substrate and an electrode as an anode immersed in the aqueous solution; and
forming a semiconductor layer on the top of the zinc oxide thin film.
53. A method of producing a photovoltaic device comprising the steps of:
forming a zinc oxide thin film on a conductive substrate immersed in an aqueous solution controlled in the range of pH 3.5 to pH 5.5 containing at least zinc benzoate, zinc ions and benzoate ions, by passing a current between the conductive substrate and an electrode as an anode immersed in the aqueous solution; and
forming a semiconductor layer on the top of the zinc oxide thin film.
54. A method of producing a semiconductor device substrate comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least zinc acetate, zinc ions and acetate ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
55. A method of producing a semiconductor device substrate comprising passing a current between a conductive substrate immersed in an aqueous solution anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate.
57. A method of producing a semiconductor device substrate comprising passing a current between a conductive substrate immersed in an aqueous solution containing at least carboxylic acid ions and zinc ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate, wherein the aqueous solution is controlled in the range of pH 3.5 to pH 5.5.
Priority Applications (1)
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US10/920,376 US20050016862A1 (en) | 1997-05-13 | 2004-08-18 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
Applications Claiming Priority (5)
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JP121921-1997 | 1997-05-13 | ||
JP12192197A JP3327811B2 (en) | 1997-05-13 | 1997-05-13 | Method for producing zinc oxide thin film, photovoltaic element and semiconductor element substrate using the same |
US09/074,699 US6346184B1 (en) | 1997-05-13 | 1998-05-08 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
US10/046,903 US6802953B2 (en) | 1997-05-13 | 2002-01-17 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
US10/920,376 US20050016862A1 (en) | 1997-05-13 | 2004-08-18 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
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US10/046,903 Division US6802953B2 (en) | 1997-05-13 | 2002-01-17 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
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US09/074,699 Expired - Lifetime US6346184B1 (en) | 1997-05-13 | 1998-05-08 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
US10/046,903 Expired - Fee Related US6802953B2 (en) | 1997-05-13 | 2002-01-17 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
US10/920,376 Abandoned US20050016862A1 (en) | 1997-05-13 | 2004-08-18 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
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US10/046,903 Expired - Fee Related US6802953B2 (en) | 1997-05-13 | 2002-01-17 | Method of producing zinc oxide thin film, method of producing photovoltaic device and method of producing semiconductor device |
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Also Published As
Publication number | Publication date |
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JPH10313127A (en) | 1998-11-24 |
US20020100696A1 (en) | 2002-08-01 |
US6346184B1 (en) | 2002-02-12 |
US6802953B2 (en) | 2004-10-12 |
JP3327811B2 (en) | 2002-09-24 |
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