US20040256668A1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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US20040256668A1
US20040256668A1 US10/781,688 US78168804A US2004256668A1 US 20040256668 A1 US20040256668 A1 US 20040256668A1 US 78168804 A US78168804 A US 78168804A US 2004256668 A1 US2004256668 A1 US 2004256668A1
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trenches
semiconductor layer
conductivity type
base layer
gate electrodes
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US6838730B1 (en
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Yusuke Kawaguchi
Syotaro Ono
Yoshihiro Yamaguchi
Akio Nakagawa
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Toshiba Corp
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Toshiba Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42356—Disposition, e.g. buried gate electrode
    • H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
    • H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out

Definitions

  • the present invention relates to a semiconductor device, and more particularly, to a power metal oxide semiconductor (MOS) transistor.
  • MOS metal oxide semiconductor
  • MOSFETs metal oxide semiconductor field effect transistors
  • the power MOSFETs dedicated to the mobile electronic equipment are typically used for a power management circuit, an overcharge protection circuit of a lithium cell, and the like.
  • indices are used to represent characteristics of the power MOSFET, including a product of the ON-resistance (R on ) multiplied by the electronic charges (Q gd ) charged in a gate-drain capacitor, namely, the gate-drain capacitance, R on ⁇ Q gd , and the gate resistance representing a resistance across the gate electrode. Requirements to reduce the switching loss will be lowering both of the indices, R on ⁇ Q gd and the gate resistance.
  • FIG. 7 is a cross-sectional perspective view showing a prior art trench-gate power MOSFET.
  • a reference alphanumeric number X designates a device pitch.
  • an n + type substrate 21 On an upper principal surface of an n + type substrate 21 , an n ⁇ type epitaxial layer 22 is formed, and then, a p type base layer 23 is further formed on top of the n ⁇ type epitaxial layer 22 .
  • a trench 24 is dug, extending from an upper surface of the p type base layer 23 down to the underlying n ⁇ type epitaxial layer 22 .
  • a gate insulation film 25 is deposited to cover side and bottom walls of the trench 24 , and then, a gate electrode 26 is deposited inside the gate insulation film 25 to fill the trench 24 .
  • an interlayer insulation film 28 On an exposed surface of the gate electrode 26 , an interlayer insulation film 28 is disposed.
  • n + type source region 29 Part of a surface area of the p type base layer 23 alongside the trench 24 is covered with an n + type source region 29 , and the remaining surface area of the p type base layer 23 is coated with the P + type diffusion region 30 .
  • the P + type diffusion region 30 , the n + type source region 29 , and the interlayer insulation film 28 are overlaid with a source electrode (not shown), and on a lower principal surface of the n + type substrate 21 , a drain electrode (not shown) is formed.
  • the above-mentioned ON-resistance R on is a resistance between the n + type source region 29 and the n + type substrate 21 .
  • the capacitance Q gd is an electric charge accumulated in a capacitor consisting of the gate electrode 26 and the n ⁇ type epitaxial layer 22 .
  • a gate resistance is a resistance occurring across the gate electrode 26 .
  • FIG. 8 is a graph schematically illustrating characteristics of drain voltage (ON voltage) and drain current upon turning the power MOSFET in FIG. 7.
  • V ds denotes a drain voltage (voltage between a drain and a source) while Id denotes the drain current.
  • a time interval (T gd ) from time t 1 to time t 2 is identical with a period of time when the gate-drain capacitor is being charged.
  • the switching loss can be expressed by a product of the drain current Id and the drain voltage V ds during the charge period T gd (an amount of Id from time 0 to time t 1 is minimal, and the switching loss during the period is negligible).
  • the shorter charge period T gd brings about the accordingly reduced switching loss.
  • One way of shortening the charge time T gd is reducing the gate resistance. This is because a reduction of the gate resistance permits electric charge to be rapidly accumulated in the gate-drain capacitor. To attain this, specifically as shown in FIG. 7, the trench 24 may be dimensioned to have a greater depth, thereby increasing a cross sectional area of the gate electrode 26 .
  • a semiconductor device comprising:
  • gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer,
  • bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer down to the upper surface of the second semiconductor layer and connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes,
  • an impurity diffused region of the second conductivity type formed in the second semiconductor layer adapted to surround the second trenches existing in the second semiconductor layer
  • a drain electrode formed on a back surface of the first semiconductor layer.
  • a semiconductor device comprising:
  • gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer,
  • bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer and being smaller in depth than the base layer, each of the second trenches connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes,
  • an impurity diffused region of the first conductivity type formed around lower portions of the first trenches in the base layer and being contiguous to the second semiconductor layer so as to provide a channel conducting to the source region
  • a drain electrode provided on a back surface of the first semiconductor layer.
  • a semiconductor device comprising:
  • a second semiconductor layer of the first conductivity type formed in an upper principal surface of the first semiconductor layer, the second semiconductor layer being higher in resistance than the first semiconductor layer,
  • gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer,
  • bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer and being smaller in depth than the base layer, each of the second trenches connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes,
  • a drain electrode provided on a back surface of the first semiconductor layer.
  • FIG. 1A and FIG. 1B are partial cross-sectional perspective views showing a first embodiment of a power MOSFET according to the present invention.
  • FIG. 2 is a graph showing effects of the first embodiment in comparison with the prior art
  • FIG. 3 is a partial cross-sectional perspective view showing a second embodiment of the power MOSFET according to the present invention.
  • FIG. 4 is a partial cross-sectional perspective view showing a third embodiment of the power MOSFET according to the present invention.
  • FIG. 5 is a partial cross-sectional perspective view showing a fourth embodiment of the power MOSFET according to the present invention.
  • FIG. 6 is a partial cross-sectional perspective view showing a fifth embodiment of the power MOSFET according to the present invention.
  • FIG. 7 is a partial cross-sectional perspective view showing a prior art power MOSFET.
  • FIG. 8 is a graph illustrating a switching loss in the prior art power MOSFET upon turning the transistor on.
  • FIG. 1A is a partial cross-sectional perspective view showing a first embodiment of a power MOSFET according to the present invention.
  • FIG. 1B is a cross-sectional perspective view of the power MOSFET having a source electrode 12 and a drain electrode 13 eliminated from the structure in FIG. 1.
  • a reference letter P denotes a device pitch.
  • the device pitch P is 4 ⁇ m, for example, and a length of the device in a direction along the pitch P is 2 mm, for example.
  • an n + type substrate 1 is superposed with an n ⁇ type epitaxial layer 2 which has its upper principal surface further overlaid with a p type base layer 3 .
  • Trenches 5 a and 5 b are dug, extending from top of the p type base layer 3 down to the upper surface of the underlying n ⁇ type epitaxial layer 2 .
  • trenches 5 a There are a plurality of the elongated trenches 5 a , which are separated from each other at an identical interval along an extension of the pitch P and are all perpendicular to the extension of the pitch P but in parallel with the principal surface of the substrate. There are also more than one of the trenches 5 b separated from each other at an interval of D in communication with the trenches 5 a .
  • the trenches 5 a and 5 b are of the same depth and may be made either in the same process step or in separate process steps.
  • the elongated trenches 5 a have their respective side and bottom walls covered with a gate insulation film 6 a of silicon oxide, for example. Over the gate insulation film 6 a , doped polysilicon, for example, is deposited to fill the trenches and have gate electrodes 8 a embedded therein.
  • the trenches 5 b have their respective side and bottom walls covered with an insulation film 6 b of silicon oxide, for example.
  • an insulation film 6 b of silicon oxide for example.
  • similarly doped polysilicon for example, is deposited to have bridge electrodes 8 b embedded therein, and each connects a pair of the adjacent gate electrodes and reduces a gate resistance thereacross.
  • the gate electrodes 8 a and the bridge electrodes 8 b may be made either in the same process step or in separate process steps.
  • the gate resistance across the same is reduced.
  • the bridge electrodes 8 a deployed at the excessively small pitches however, channel regions formed in the vicinity of the side walls of the elongated trenches 6 a are undesirably small. This means an undesired reduction of a drain current.
  • the pitch of the bridge electrode 8 b namely, the distance D between the trenches 5 b is determined, allowing for optimization of the gate resistance and the drain current in combination.
  • a p type diffusion region 7 is formed to surround a lower portion of each of the trenches 5 b that reach the n ⁇ type epitaxial layer 2 .
  • the p type diffusion region 7 prevents the bridge electrode 8 b and the n ⁇ type epitaxial layer 2 from close juxtaposition. In this way, the p type diffusion region 7 can avoid development of a capacitor (gate-drain capacitor) between the bridge electrode 8 b and the n ⁇ epitaxial layer 2 upon turning the power MOSFET on.
  • the P diffusion region 7 is not formed in any area under an n + type source region 10 where a channel region is to be formed.
  • An interlayer insulation film 9 is deposited over exposed surfaces of the gate electrodes 8 a and the bridge electrodes 8 b.
  • n + type source region 10 is formed in the both sides of the trenches 5 a alongside the same in part of an upper surface of the P base layer 3 .
  • a p + type diffusion region 11 is formed in the remaining areas of the upper surface of the p type base layer 3 .
  • the p + type diffusion region 11 serves to reduce a resistance developed upon movement of holes generated at a breakdown toward a source electrode 12 (mentioned later).
  • the source electrode 12 of highly conductive material such as aluminum is formed on the p + type diffusion region 11 , the n + type source region 10 , and the interlayer insulation film 9 , as shown in FIG. 1A.
  • the source electrode 12 of highly conductive material such as aluminum is formed on a lower principal surface of the n + type substrate 1 .
  • a drain electrode 13 is formed of highly conductive material such as aluminum.
  • the bridge electrodes 8 b each positioned between the pair of the adjacent gate electrodes 8 a are capable of reduce the gate resistance across the same, as mentioned above.
  • the p type diffusion region 7 surrounding the lower portion of each of the trenches 5 b prevents the development of the capacitor, and then, avoids an increase in capacitance. Further, as apparent from FIG. 1A, the formation of the bridge electrodes 8 b causes no increase in the ON-resistance R on .
  • FIG. 2 is a graph showing a switching time upon turning off the power MOSFET in FIG. 1 in comparison with the prior art power MOSFET.
  • switching time herein is a period of time spent to vary drain voltage V ds from 0.1 V t to 0.9 V t .
  • the power MOSFET in this embodiment needs approximately 4 nsec in switching (time t 1 ).
  • the switching time of the prior art MOSFET is about 8 nsec (time t 2 ).
  • the power MOSFET in this embodiment switches in approx. 4-nsec (t 2 ⁇ t 1 ) which is quicker than the prior art. This is resulted from a reduction of a period of time spent for electric discharge.
  • the time t 1 is a period of time needed to electrically discharge while the time 2 is the period of electric discharge in the prior art.
  • a difference between the periods of electrical discharge (t 2 ⁇ t 1 ) is reflected to the aforementioned difference in the switching time.
  • the switching loss during turning the transistor off is expressed by a product of I d and V ds during the electric discharge, and as the product is reduced, the switching loss becomes accordingly smaller.
  • this embodiment attains a decrease in the duration of the electric discharge by t 2 ⁇ t 1 , compared with the prior art embodiment, and this embodiment successfully provides the reduced switching loss.
  • each of the bridge electrodes connects the pair of the adjacent gate electrodes while having its lower portion surrounded by the region diffused with impurities, and therefore, a gate resistance across that portion can be reduced, with the product Ron ⁇ Qgd being retained small.
  • the duration of discharging energy upon turning the transistor off and the duration of charging energy upon turning it on are reduced, and accordingly, the switching loss can be decreased.
  • FIG. 3 is a partial cross-sectional perspective view showing a second embodiment of the power MOSFET according to the present invention.
  • like reference numerals denote the similar components to those in the first embodiment in FIG. 1.
  • neither of the elongated trenches 5 a and 5 b extending from the upper surface of the p type base layer 3 reaches the n ⁇ type epitaxial layer 2 , and an n type diffusion region 16 is formed around a lower portion of each of the elongated trenches 5 a .
  • This embodiment will be described in more detail below.
  • the n + type substrate 1 is overlaid with the n ⁇ type epitaxial layer 2 which is further superposed with the p type base layer 3 .
  • the p type base layer 3 is greater in depth, compared with the first embodiment.
  • the trenches 5 a and 5 b extending downward from the top surface of the p type base layer 3 , are formed smaller in depth than the p type base layer 3 . Thus, neither of the trenches 5 a and 5 b reaches an upper surface of the n ⁇ type epitaxial layer 2 .
  • Each of the trenches 5 a among the elongated trenches has its lower portion surrounded by the n type diffusion region 16 contiguous to the n ⁇ type epitaxial layer 2 .
  • the n type diffusion region 16 serves to provide a channel conducting to a source region 10 (mentioned later) upon turning the transistor on.
  • a gate insulation film 6 a and an insulation film 6 b are deposited to fill the trenches 5 a and 5 b and have gate electrodes 8 a and bridge electrodes 8 b embedded therein. Upper surfaces of the gate electrodes 8 a and the bridge electrodes 8 b are covered with an interlayer insulation film 9 .
  • an n + type source region 10 and a p + type diffusion region 11 are formed.
  • a source electrode (not shown) is overlaid on the n + type source region 10 , the p + type diffusion region 11 , and the interlayer insulation film 9 , while a drain electrode (not shown) is overlaid on the lower surface of the n + type substrate 1 .
  • the trenches 5 b are formed so as not to reach the upper surface of the n ⁇ type epitaxial layer 2 , and hence, the bridge electrodes 8 b embedded in the trenches 5 b would not overlap the n ⁇ type epitaxial layer 2 , which effectively prevents development of capacitors between the bridge electrodes 8 b and the n ⁇ type epitaxial layer 2 . Resultantly, a gate resistance across that portion can be decreased with the product R on ⁇ Q gd retained small.
  • FIG. 4 is a partial cross-sectional perspective view showing a third embodiment of the power MOSFET according to the present invention.
  • like reference numerals denote the similar components to those in the first embodiment in FIG. 1.
  • This embodiment is different from the above-mentioned first embodiment in that a p type diffusion region (prevention region for generation of inverted region; anti-inverting region, hereinafter) 18 is formed in the p type base layer 3 along side walls of the trenches 5 b.
  • a p type diffusion region prevention region for generation of inverted region; anti-inverting region, hereinafter
  • the anti-inverting region 18 is formed on one side of the insulation film 6 b opposite to the bridge electrode 8 b .
  • the anti-inverting region 18 serves to reduce carriers induced in the contiguous region beyond the insulation film 6 b upon turning the transistor on; that is, the anti-inverting region 18 functions to reduce energy charged in the capacitors (i.e., capacitance) between the bridge electrodes 8 b and the p type base layer 3 .
  • the higher impurity concentration in the anti-inverting region 18 effects this function more successfully.
  • FIG. 5 is a partial cross-sectional perspective view showing a fourth embodiment of the power MOSFET according to the present invention.
  • like reference numerals denote the similar components to those in the above-mentioned second and third embodiments in FIGS. 3 and 4.
  • a modified feature of this embodiment is that it is an effective combination of the second embodiment with the third embodiment.
  • neither of elongated trenches 5 a and 5 b reaches an upper surface of an n ⁇ type epitaxial layer 2 .
  • An n type diffusion region 16 is formed around a lower portion of each of the elongated trenches 5 a while an anti-inverting region 18 is formed along side walls of the trenches 5 b.
  • FIG. 6 is a partial cross-sectional perspective view showing a fifth embodiment of the power MOSFET. Like reference numerals denote the similar components to those in the first embodiment in FIG. 1.
  • a modified feature of this embodiment is that the elongated trenches 5 a reach the upper surface of the n ⁇ type epitaxial layer 2 , but the elongated trenches 5 b conducting the trenches 5 a to one another do not extend down to the upper surface of the n ⁇ type epitaxial layer 2 .
  • the bridge electrodes 8 b do not overlap the n ⁇ type epitaxial layer, and hence, there is no capacitor developed between the bridge electrodes 8 b and the n ⁇ epitaxial layer 2 .
  • Q gd gate-drain capacitance
  • the gate resistance can be reduced, with Ron ⁇ Qgd being retained small.
  • each of the bridge electrodes connects adjacent ones of the gate electrodes while development of capacitors based on the disposition of the bridge electrodes is avoided as much as possible, accordingly the gate resistance can be reduced, with the product of the ON-resistance and the gate-drain capacitance being retained small. This effects a successful reduction of the switching loss.

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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

A semiconductor device comprises a first semiconductor layer of a first conductivity type, a second semiconductor layer of the first conductivity type formed in an upper surface of the first semiconductor layer, resistance of the second semiconductor layer being higher than that of the first semiconductor layer, a base layer of a second conductivity type formed on the second semiconductor layer, gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer, bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer down to the upper surface of the second semiconductor layer and connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes, an impurity diffused region of the second conductivity type formed in the second semiconductor layer adapted to surround the second trenches existing in the second semiconductor layer, a source region of the first conductivity type formed in a surface area of the base layer alongside extensions of the gate electrodes, a source electrode formed on the surface of the source region, and a drain electrode formed on a back surface of the first semiconductor layer.

Description

    CROSS REFERENCE TO RELATED APPLICATION
  • This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2003-173852, filed on Jun. 18, 2003; the entire contents of which are incorporated herein by reference.[0001]
    • BACKGROUND OF THE INVENTION
  • The present invention relates to a semiconductor device, and more particularly, to a power metal oxide semiconductor (MOS) transistor. [0002]
  • Recently, there has been an increased rush for power metal oxide semiconductor field effect transistors (MOSFETs) in the markets of switching power supplies for good characteristics of high-current power and high withstand voltage as well as in the market of energy saving switching power supplies for mobile electronic equipment such as a notebook PC. The power MOSFETs dedicated to the mobile electronic equipment are typically used for a power management circuit, an overcharge protection circuit of a lithium cell, and the like. [0003]
  • Among such power MOSFETs, some used in the mobile electronic equipment is strongly desired to have a reduced switching loss as well as enhanced performance of operability at lower supply voltage, which enables a directly operation by a battery. In order to reduce the switching loss, for instance, a resistance upon turning the transistor on (referred to as ON-resistance), a gate-drain capacitance, and a gate resistance must be reduced. [0004]
  • Various indices are used to represent characteristics of the power MOSFET, including a product of the ON-resistance (R[0005] on) multiplied by the electronic charges (Qgd) charged in a gate-drain capacitor, namely, the gate-drain capacitance, Ron×Qgd, and the gate resistance representing a resistance across the gate electrode. Requirements to reduce the switching loss will be lowering both of the indices, Ron×Qgd and the gate resistance.
  • However, lowering the gate resistance in order to reduce the switching loss leads to an adverse effect of an increase in the product R[0006] on×Qgd. On the other hand, a reduction of Ron×Qgd causes an undesirable increase in the gate resistance. Hence, it's not a simple matter to find a solution of the reduction of the switching loss. This will be detailed below.
  • FIG. 7 is a cross-sectional perspective view showing a prior art trench-gate power MOSFET. A reference alphanumeric number X designates a device pitch. [0007]
  • On an upper principal surface of an n[0008] +type substrate 21, an n− type epitaxial layer 22 is formed, and then, a p type base layer 23 is further formed on top of the n− type epitaxial layer 22. A trench 24 is dug, extending from an upper surface of the p type base layer 23 down to the underlying n− type epitaxial layer 22. A gate insulation film 25 is deposited to cover side and bottom walls of the trench 24, and then, a gate electrode 26 is deposited inside the gate insulation film 25 to fill the trench 24. On an exposed surface of the gate electrode 26, an interlayer insulation film 28 is disposed. Part of a surface area of the p type base layer 23 alongside the trench 24 is covered with an n+ type source region 29, and the remaining surface area of the p type base layer 23 is coated with the P+ type diffusion region 30. The P+ type diffusion region 30, the n+ type source region 29, and the interlayer insulation film 28 are overlaid with a source electrode (not shown), and on a lower principal surface of the n+ type substrate 21, a drain electrode (not shown) is formed.
  • In FIG. 7, the above-mentioned ON-resistance R[0009] on is a resistance between the n+ type source region 29 and the n+ type substrate 21. The capacitance Qgd is an electric charge accumulated in a capacitor consisting of the gate electrode 26 and the n− type epitaxial layer 22. A gate resistance is a resistance occurring across the gate electrode 26.
  • FIG. 8 is a graph schematically illustrating characteristics of drain voltage (ON voltage) and drain current upon turning the power MOSFET in FIG. 7. [0010]
  • In FIG. 8, V[0011] ds denotes a drain voltage (voltage between a drain and a source) while Id denotes the drain current.
  • As can be seen in FIG. 8, at time zero, voltage is applied between the source electrode (not shown) and the [0012] gate electrode 26 to turn the gate electrode to positive while voltage is being applied between the drain electrode (not shown) and the source electrode (not shown) to turn the drain electrode to positive. During a delay time before time t1, the drain current Id scarcely flows, but after time t1, the drain current gradually increases till time t2 when the drain current Id reaches a predetermined level. In this state, the device turns on. The above-mentioned ON-resistance Ron is the drain voltage Vds (Vr) at this time divided by the concurrent drain current Id.
  • As in FIG. 8, a time interval (T[0013] gd) from time t1 to time t2 is identical with a period of time when the gate-drain capacitor is being charged. The switching loss can be expressed by a product of the drain current Id and the drain voltage Vds during the charge period Tgd (an amount of Id from time 0 to time t1 is minimal, and the switching loss during the period is negligible). Thus, the shorter charge period Tgd brings about the accordingly reduced switching loss.
  • One way of shortening the charge time T[0014] gd is reducing the gate resistance. This is because a reduction of the gate resistance permits electric charge to be rapidly accumulated in the gate-drain capacitor. To attain this, specifically as shown in FIG. 7, the trench 24 may be dimensioned to have a greater depth, thereby increasing a cross sectional area of the gate electrode 26.
  • This way of reducing the gate resistance results in an increase in an area of the interface between the [0015] gate electrode 26 and the n− type epitaxial layer 22 to cause the gate-drain capacitance Qgd to increase, which consequently leads to an increase of Ron×Qgd.
    • SUMMARY OF THE INVENTION
  • According to a first aspect of the present invention, there is provided a semiconductor device comprising: [0016]
  • a first semiconductor layer of a first conductivity type, [0017]
  • a second semiconductor layer of the first conductivity type formed in an upper surface of the first semiconductor layer, resistance of the second semiconductor layer being higher than that of the first semiconductor layer, [0018]
  • a base layer of a second conductivity type formed on the second semiconductor layer, [0019]
  • gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer, [0020]
  • bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer down to the upper surface of the second semiconductor layer and connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes, [0021]
  • an impurity diffused region of the second conductivity type formed in the second semiconductor layer adapted to surround the second trenches existing in the second semiconductor layer, [0022]
  • a source region of the first conductivity type formed in a surface area of the base layer alongside extensions of the gate electrodes, [0023]
  • a source electrode formed on the surface of the source region, and [0024]
  • a drain electrode formed on a back surface of the first semiconductor layer. [0025]
  • According to a second aspect of the present invention, there is provided a semiconductor device comprising: [0026]
  • a first semiconductor layer of a first conductivity type, [0027]
  • a second semiconductor layer of the first conductivity type formed on an upper surface of the first semiconductor layer, resistance of the second semiconductor layer being higher than that of the first semiconductor layer, [0028]
  • a base layer of a second conductivity type formed on the second semiconductor layer, [0029]
  • gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer, [0030]
  • bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer and being smaller in depth than the base layer, each of the second trenches connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes, [0031]
  • a source region of the first conductivity type formed in a surface area of the base layer alongside extensions of the gate electrodes, [0032]
  • a source electrode formed on the source region, [0033]
  • an impurity diffused region of the first conductivity type formed around lower portions of the first trenches in the base layer and being contiguous to the second semiconductor layer so as to provide a channel conducting to the source region, and [0034]
  • a drain electrode provided on a back surface of the first semiconductor layer. [0035]
  • According to a third aspect of the present invention, there is provided a semiconductor device, comprising: [0036]
  • a first semiconductor layer of a first conductivity type, [0037]
  • a second semiconductor layer of the first conductivity type formed in an upper principal surface of the first semiconductor layer, the second semiconductor layer being higher in resistance than the first semiconductor layer, [0038]
  • a base layer of a second conductivity type formed in an upper principal surface of the second semiconductor layer, [0039]
  • gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer, [0040]
  • bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer and being smaller in depth than the base layer, each of the second trenches connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes, [0041]
  • a source region of the first conductivity type formed on a surface area of the base layer alongside extensions of the gate electrodes, [0042]
  • a source electrode formed on the source region, and [0043]
  • a drain electrode provided on a back surface of the first semiconductor layer.[0044]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1A and FIG. 1B are partial cross-sectional perspective views showing a first embodiment of a power MOSFET according to the present invention; [0045]
  • FIG. 2 is a graph showing effects of the first embodiment in comparison with the prior art; [0046]
  • FIG. 3 is a partial cross-sectional perspective view showing a second embodiment of the power MOSFET according to the present invention; [0047]
  • FIG. 4 is a partial cross-sectional perspective view showing a third embodiment of the power MOSFET according to the present invention; [0048]
  • FIG. 5 is a partial cross-sectional perspective view showing a fourth embodiment of the power MOSFET according to the present invention; [0049]
  • FIG. 6 is a partial cross-sectional perspective view showing a fifth embodiment of the power MOSFET according to the present invention; [0050]
  • FIG. 7 is a partial cross-sectional perspective view showing a prior art power MOSFET; and [0051]
  • FIG. 8 is a graph illustrating a switching loss in the prior art power MOSFET upon turning the transistor on.[0052]
    • DETAILED DESCRIPTION OF THE INVENTION
  • (Embodiment 1) [0053]
  • FIG. 1A is a partial cross-sectional perspective view showing a first embodiment of a power MOSFET according to the present invention. FIG. 1B is a cross-sectional perspective view of the power MOSFET having a [0054] source electrode 12 and a drain electrode 13 eliminated from the structure in FIG. 1.
  • In FIGS. 1A and 1B, a reference letter P denotes a device pitch. The device pitch P is 4 μm, for example, and a length of the device in a direction along the pitch P is 2 mm, for example. [0055]
  • As depicted in FIG. 1B, an n[0056] + type substrate 1 is superposed with an n− type epitaxial layer 2 which has its upper principal surface further overlaid with a p type base layer 3. Trenches 5 a and 5 b are dug, extending from top of the p type base layer 3 down to the upper surface of the underlying n− type epitaxial layer 2.
  • There are a plurality of the [0057] elongated trenches 5 a, which are separated from each other at an identical interval along an extension of the pitch P and are all perpendicular to the extension of the pitch P but in parallel with the principal surface of the substrate. There are also more than one of the trenches 5 b separated from each other at an interval of D in communication with the trenches 5 a. The trenches 5 a and 5 b are of the same depth and may be made either in the same process step or in separate process steps.
  • The [0058] elongated trenches 5 a have their respective side and bottom walls covered with a gate insulation film 6 a of silicon oxide, for example. Over the gate insulation film 6 a, doped polysilicon, for example, is deposited to fill the trenches and have gate electrodes 8 a embedded therein.
  • On the other hand, the [0059] trenches 5 b have their respective side and bottom walls covered with an insulation film 6 b of silicon oxide, for example. Over the insulation film 6 b, similarly doped polysilicon, for example, is deposited to have bridge electrodes 8 b embedded therein, and each connects a pair of the adjacent gate electrodes and reduces a gate resistance thereacross.
  • The [0060] gate electrodes 8 a and the bridge electrodes 8 b may be made either in the same process step or in separate process steps.
  • As can be seen in FIG. 1B, as the [0061] bridge electrodes 8 b are deployed at smaller pitches, the gate resistance across the same is reduced. With the bridge electrodes 8 a deployed at the excessively small pitches, however, channel regions formed in the vicinity of the side walls of the elongated trenches 6 a are undesirably small. This means an undesired reduction of a drain current. Thus, the pitch of the bridge electrode 8 b, namely, the distance D between the trenches 5 b is determined, allowing for optimization of the gate resistance and the drain current in combination.
  • A p [0062] type diffusion region 7 is formed to surround a lower portion of each of the trenches 5 b that reach the n− type epitaxial layer 2. The p type diffusion region 7 prevents the bridge electrode 8 b and the n− type epitaxial layer 2 from close juxtaposition. In this way, the p type diffusion region 7 can avoid development of a capacitor (gate-drain capacitor) between the bridge electrode 8 b and the n− epitaxial layer 2 upon turning the power MOSFET on. Preferably, as depicted in FIG. 1B, the P diffusion region 7 is not formed in any area under an n+ type source region 10 where a channel region is to be formed.
  • An [0063] interlayer insulation film 9 is deposited over exposed surfaces of the gate electrodes 8 a and the bridge electrodes 8 b.
  • The n[0064] + type source region 10 is formed in the both sides of the trenches 5 a alongside the same in part of an upper surface of the P base layer 3. In the remaining areas of the upper surface of the p type base layer 3, a p+ type diffusion region 11 is formed. The p+ type diffusion region 11 serves to reduce a resistance developed upon movement of holes generated at a breakdown toward a source electrode 12 (mentioned later).
  • On the p[0065] + type diffusion region 11, the n+ type source region 10, and the interlayer insulation film 9, as shown in FIG. 1A, the source electrode 12 of highly conductive material such as aluminum is formed. Similarly, on a lower principal surface of the n+ type substrate 1, a drain electrode 13 is formed of highly conductive material such as aluminum.
  • Configured in this manner, the [0066] bridge electrodes 8 b each positioned between the pair of the adjacent gate electrodes 8 a are capable of reduce the gate resistance across the same, as mentioned above. The p type diffusion region 7 surrounding the lower portion of each of the trenches 5 b prevents the development of the capacitor, and then, avoids an increase in capacitance. Further, as apparent from FIG. 1A, the formation of the bridge electrodes 8 b causes no increase in the ON-resistance Ron.
  • Thus, retaining the product of the ON-resistance multiplied by the gate-drain capacitance (R[0067] on×Qgd) small as desired, the gate resistance can be reduced.
  • FIG. 2 is a graph showing a switching time upon turning off the power MOSFET in FIG. 1 in comparison with the prior art power MOSFET. The term “switching time” herein is a period of time spent to vary drain voltage V[0068] ds from 0.1 Vt to 0.9 Vt.
  • As illustrated in FIG. 2, the power MOSFET in this embodiment needs approximately 4 nsec in switching (time t[0069] 1). In contrast, the switching time of the prior art MOSFET is about 8 nsec (time t2). Thus, the power MOSFET in this embodiment switches in approx. 4-nsec (t2−t1) which is quicker than the prior art. This is resulted from a reduction of a period of time spent for electric discharge.
  • More specifically, as in FIG. 2, the time t[0070] 1 is a period of time needed to electrically discharge while the time 2 is the period of electric discharge in the prior art. A difference between the periods of electrical discharge (t2−t1) is reflected to the aforementioned difference in the switching time.
  • A reduction of the switching time brings about a reduction of a switching loss. Details of this will be set forth below. [0071]
  • The switching loss during turning the transistor off is expressed by a product of I[0072] d and Vds during the electric discharge, and as the product is reduced, the switching loss becomes accordingly smaller. As mentioned above, it has been proved that this embodiment attains a decrease in the duration of the electric discharge by t2−t1, compared with the prior art embodiment, and this embodiment successfully provides the reduced switching loss.
  • As has been described, in this embodiment of the present invention, each of the bridge electrodes connects the pair of the adjacent gate electrodes while having its lower portion surrounded by the region diffused with impurities, and therefore, a gate resistance across that portion can be reduced, with the product Ron×Qgd being retained small. Thus, both the duration of discharging energy upon turning the transistor off and the duration of charging energy upon turning it on are reduced, and accordingly, the switching loss can be decreased. [0073]
  • (Embodiment 2) [0074]
  • FIG. 3 is a partial cross-sectional perspective view showing a second embodiment of the power MOSFET according to the present invention. In FIG. 3, like reference numerals denote the similar components to those in the first embodiment in FIG. 1. [0075]
  • In this embodiment, unlike the above mentioned first embodiment, neither of the [0076] elongated trenches 5 a and 5 b extending from the upper surface of the p type base layer 3 reaches the n− type epitaxial layer 2, and an n type diffusion region 16 is formed around a lower portion of each of the elongated trenches 5 a. This embodiment will be described in more detail below.
  • As recognized in FIG. 3, similar to the first embodiment, the n[0077] + type substrate 1 is overlaid with the n− type epitaxial layer 2 which is further superposed with the p type base layer 3. The p type base layer 3 is greater in depth, compared with the first embodiment.
  • The [0078] trenches 5 a and 5 b, extending downward from the top surface of the p type base layer 3, are formed smaller in depth than the p type base layer 3. Thus, neither of the trenches 5 a and 5 b reaches an upper surface of the n− type epitaxial layer 2.
  • Each of the [0079] trenches 5 a among the elongated trenches has its lower portion surrounded by the n type diffusion region 16 contiguous to the n− type epitaxial layer 2. The n type diffusion region 16 serves to provide a channel conducting to a source region 10 (mentioned later) upon turning the transistor on.
  • Inside the walls of the [0080] trenches 5 a and 5 b, similar to the first embodiment, a gate insulation film 6 a and an insulation film 6 b are deposited to fill the trenches 5 a and 5 b and have gate electrodes 8 a and bridge electrodes 8 b embedded therein. Upper surfaces of the gate electrodes 8 a and the bridge electrodes 8 b are covered with an interlayer insulation film 9. On the upper surface of the p type base layer 3, an n+ type source region 10 and a p+ type diffusion region 11 are formed.
  • A source electrode (not shown) is overlaid on the n[0081] + type source region 10, the p+ type diffusion region 11, and the interlayer insulation film 9, while a drain electrode (not shown) is overlaid on the lower surface of the n+ type substrate 1.
  • As has been described, in this embodiment of the present invention, the [0082] trenches 5 b are formed so as not to reach the upper surface of the n− type epitaxial layer 2, and hence, the bridge electrodes 8 b embedded in the trenches 5 b would not overlap the n− type epitaxial layer 2, which effectively prevents development of capacitors between the bridge electrodes 8 b and the n− type epitaxial layer 2. Resultantly, a gate resistance across that portion can be decreased with the product Ron×Qgd retained small.
  • (Embodiment 3) [0083]
  • FIG. 4 is a partial cross-sectional perspective view showing a third embodiment of the power MOSFET according to the present invention. In FIG. 4, like reference numerals denote the similar components to those in the first embodiment in FIG. 1. [0084]
  • This embodiment is different from the above-mentioned first embodiment in that a p type diffusion region (prevention region for generation of inverted region; anti-inverting region, hereinafter) [0085] 18 is formed in the p type base layer 3 along side walls of the trenches 5 b.
  • In the first embodiment, as depicted in FIG. 1B, upon turning the transistor on, energy is slightly charged in the capacitors between the side walls of the [0086] bridge electrodes 8 b and the p type base layer 3. Such accumulation of electric charge leads to an increase in gate-drain capacitance Qgd.
  • Thus, in this embodiment, the [0087] anti-inverting region 18 is formed on one side of the insulation film 6 b opposite to the bridge electrode 8 b. The anti-inverting region 18 serves to reduce carriers induced in the contiguous region beyond the insulation film 6 b upon turning the transistor on; that is, the anti-inverting region 18 functions to reduce energy charged in the capacitors (i.e., capacitance) between the bridge electrodes 8 b and the p type base layer 3. The higher impurity concentration in the anti-inverting region 18 effects this function more successfully.
  • As has been described, in this embodiment of the present invention, with the [0088] anti-inverting region 18 formed along the side walls of the bridge electrodes 8 b, the product Ron×Qgd can be retained much smaller, compared with the first embodiment.
  • (Embodiment 4) [0089]
  • FIG. 5 is a partial cross-sectional perspective view showing a fourth embodiment of the power MOSFET according to the present invention. In FIG. 5, like reference numerals denote the similar components to those in the above-mentioned second and third embodiments in FIGS. 3 and 4. [0090]
  • A modified feature of this embodiment is that it is an effective combination of the second embodiment with the third embodiment. [0091]
  • In this embodiment, as shown in FIG. 5, neither of [0092] elongated trenches 5 a and 5 b reaches an upper surface of an n− type epitaxial layer 2. An n type diffusion region 16 is formed around a lower portion of each of the elongated trenches 5 a while an anti-inverting region 18 is formed along side walls of the trenches 5 b.
  • Thus, in this embodiment of the present invention, it is increasingly ensured that the gate resistance can be reduced, with R[0093] on×Qgd being retained small.
  • (Embodiment 5) [0094]
  • FIG. 6 is a partial cross-sectional perspective view showing a fifth embodiment of the power MOSFET. Like reference numerals denote the similar components to those in the first embodiment in FIG. 1. [0095]
  • A modified feature of this embodiment is that the [0096] elongated trenches 5 a reach the upper surface of the n− type epitaxial layer 2, but the elongated trenches 5 b conducting the trenches 5 a to one another do not extend down to the upper surface of the n− type epitaxial layer 2. Thus, the bridge electrodes 8 b do not overlap the n− type epitaxial layer, and hence, there is no capacitor developed between the bridge electrodes 8 b and the n− epitaxial layer 2. Thus, there is no increase in the gate-drain capacitance (Qgd).
  • Accordingly, in this embodiment of the present invention, the gate resistance can be reduced, with Ron×Qgd being retained small. [0097]
  • In accordance with the present invention, since each of the bridge electrodes connects adjacent ones of the gate electrodes while development of capacitors based on the disposition of the bridge electrodes is avoided as much as possible, accordingly the gate resistance can be reduced, with the product of the ON-resistance and the gate-drain capacitance being retained small. This effects a successful reduction of the switching loss. [0098]

Claims (10)

What is claimed is:
1. A semiconductor device comprising,
a first semiconductor layer of a first conductivity type,
a second semiconductor layer of the first conductivity type formed in an upper surface of the first semiconductor layer, resistance of the second semiconductor layer being higher than that of the first semiconductor layer,
a base layer of a second conductivity type formed on the second semiconductor layer,
gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer,
bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer down to the upper surface of the second semiconductor layer and connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes,
an impurity diffused region of the second conductivity type formed in the second semiconductor layer adapted to surround the second trenches existing in the second semiconductor layer,
a source region of the first conductivity type formed in a surface area of the base layer alongside extensions of the gate electrodes,
a source electrode formed on the surface of the source region, and
a drain electrode formed on a back surface of the first semiconductor layer.
2. A semiconductor device according to claim 1, wherein the bridge electrodes are disposed at a predetermined pitch along an extension of the gate electrodes.
3. A semiconductor device according to claim 1, wherein the impurity diffused region of the second conductivity type is formed in the base layer along side walls of the second trenches to reduce carriers induced in the vicinity of the opposite sides of the bridge electrodes upon turning the device on.
4. A semiconductor device according to claim 3, wherein the bridge electrodes are disposed at a predetermined pitch along an extension of the gate electrodes.
5. A semiconductor device comprising,
a first semiconductor layer of a first conductivity type,
a second semiconductor layer of the first conductivity type formed on an upper surface of the first semiconductor layer, resistance of the second semiconductor layer being higher than that of the first semiconductor layer,
a base layer of a second conductivity type formed on the second semiconductor layer,
gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer,
bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer and being smaller in depth than the base layer, each of the second trenches connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes,
a source region of the first conductivity type formed in a surface area of the base layer alongside extensions of the gate electrodes,
a source electrode formed on the source region,
an impurity diffused region of the first conductivity type formed around lower portions of the first trenches in the base layer and being contiguous to the second semiconductor layer so as to provide a channel conducting to the source region, and
a drain electrode provided on a back surface of the first semiconductor layer.
6. A semiconductor device according to claim 5, wherein the bridge electrodes are disposed at a predetermined pitch along an extension of the gate electrodes.
7. A semiconductor device according to claim 5, further comprising an impurity diffused region of the second conductivity type formed in the base layer along side walls of the second trenches to reduce carriers induced in the vicinity of the opposite sides of the bridge electrodes upon turning the device on.
8. A semiconductor device according to claim 7, wherein the bridge electrodes are disposed at a predetermined pitch along an extension of the gate electrodes.
9. A semiconductor device comprising,
a first semiconductor layer of a first conductivity type,
a second semiconductor layer of the first conductivity type formed in an upper principal surface of the first semiconductor layer, the second semiconductor layer being higher in resistance than the first semiconductor layer,
a base layer of a second conductivity type formed in an upper principal surface of the second semiconductor layer,
gate electrodes deposited in a plurality of first trenches, a gate insulation film being disposed between inner walls and the gate electrodes, each of the first trenches having a band-shaped planar pattern and extending from top of the base layer down to the upper surface of the second semiconductor layer,
bridge electrodes filling a plurality of second trenches and surrounded by an insulation film deposited over walls of the trenches, the second trenches extending from the top of the base layer and being smaller in depth than the base layer, each of the second trenches connecting adjacent ones of the first trenches in communication with one another so that each of the bridge electrodes electrically connects adjacent ones of the gate electrodes,
a source region of the first conductivity type formed on a surface area of the base layer alongside extensions of the gate electrodes,
a source electrode formed on the source region, and
a drain electrode provided on a back surface of the first semiconductor layer.
10. A semiconductor device according to claim 9, wherein the bridge electrodes are disposed at a predetermined pitch along an extension of the gate electrodes.
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