US20040000392A1 - Radiator device - Google Patents

Radiator device Download PDF

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Publication number
US20040000392A1
US20040000392A1 US10/186,588 US18658802A US2004000392A1 US 20040000392 A1 US20040000392 A1 US 20040000392A1 US 18658802 A US18658802 A US 18658802A US 2004000392 A1 US2004000392 A1 US 2004000392A1
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US
United States
Prior art keywords
radiator device
radiation
radiation fins
present
heat conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/186,588
Inventor
Jiunn-Liang Chen
Yu-Yu Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US10/186,588 priority Critical patent/US20040000392A1/en
Priority to DE20211361U priority patent/DE20211361U1/en
Publication of US20040000392A1 publication Critical patent/US20040000392A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a radiator device. More particularly, the present invention relates to a radiator device for a chip of a central processor unit.
  • a conventional radiator device 1 has a heat conductive interface 10 and a plurality of radiation fins 11 .
  • a fan 2 is disposed on the conventional radiator device 1 .
  • the conventional radiator device 1 cannot radiate heat very effectively. Therefore, it requires a large radiation area.
  • An object of the present invention is to provide a radiator device which radiates heat effectively.
  • a radiator device comprises a heat conductive interface and a plurality of radiation fins.
  • Each of the radiation fins has a molecular polymeric form.
  • a radiator device comprises a heat conductive interface and a radiation block.
  • the radiation block which has a molecular polymeric form is made by a metal granular metallurgy.
  • FIG. 1 is a perspective exploded view of a fan and a radiator device of the prior art
  • FIG. 2 is a perspective assembly view of a fan and a radiator device of the prior art
  • FIG. 3 is a perspective exploded view of a fan and a radiator device of a preferred embodiment in accordance with the present invention
  • FIG. 3A is an enlarged view of a portion of a radiation fin of a preferred embodiment in accordance with the present invention.
  • FIG. 3B is another enlarged view of a portion of a radiation fin of a preferred embodiment in accordance with the present invention.
  • FIG. 4 is a perspective assembly view of a fan and a radiator device of a preferred embodiment in accordance with the present invention.
  • FIG. 5 is a perspective assembly view of a fan and a radiator device of another preferred embodiment in accordance with the present invention.
  • a radiator device 3 comprises a heat conductive interface 30 and a plurality of radiation fins 31 .
  • Each of the radiation fins 31 which has a molecular polymeric form is made by a metal granular metallurgy.
  • each of the radiation fins 31 has a porous structure in order to radiate heat effectively.
  • a fan 4 is disposed on the radiator device 3 .
  • another radiator device 3 ′ comprises a heat conductive interface 30 ′ and a radiation block 31 ′.
  • the radiation block 31 ′ which has a molecular polymeric form is made by a metal granular metallurgy.
  • a fan 4 ′ is disposed on the radiator device 3 ′.

Abstract

A radiator device has a heat conductive interface and a plurality of radiation fins. Each of the radiation fins which has a molecular polymeric form is made by a metal granular metallurgy.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a radiator device. More particularly, the present invention relates to a radiator device for a chip of a central processor unit. [0001]
  • Referring to FIGS. 1 and 2, a [0002] conventional radiator device 1 has a heat conductive interface 10 and a plurality of radiation fins 11. A fan 2 is disposed on the conventional radiator device 1. However, the conventional radiator device 1 cannot radiate heat very effectively. Therefore, it requires a large radiation area.
    • SUMMARY OF THE INVENTION
  • An object of the present invention is to provide a radiator device which radiates heat effectively. [0003]
  • In accordance with a first embodiment of the present invention, a radiator device comprises a heat conductive interface and a plurality of radiation fins. Each of the radiation fins has a molecular polymeric form. [0004]
  • In accordance with a second embodiment of the present invention, a radiator device comprises a heat conductive interface and a radiation block. The radiation block which has a molecular polymeric form is made by a metal granular metallurgy.[0005]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective exploded view of a fan and a radiator device of the prior art; [0006]
  • FIG. 2 is a perspective assembly view of a fan and a radiator device of the prior art; [0007]
  • FIG. 3 is a perspective exploded view of a fan and a radiator device of a preferred embodiment in accordance with the present invention; [0008]
  • FIG. 3A is an enlarged view of a portion of a radiation fin of a preferred embodiment in accordance with the present invention; [0009]
  • FIG. 3B is another enlarged view of a portion of a radiation fin of a preferred embodiment in accordance with the present invention; [0010]
  • FIG. 4 is a perspective assembly view of a fan and a radiator device of a preferred embodiment in accordance with the present invention; and [0011]
  • FIG. 5 is a perspective assembly view of a fan and a radiator device of another preferred embodiment in accordance with the present invention.[0012]
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 3, 3A, [0013] 3B and 4, a radiator device 3 comprises a heat conductive interface 30 and a plurality of radiation fins 31.
  • Each of the [0014] radiation fins 31 which has a molecular polymeric form is made by a metal granular metallurgy.
  • Therefore, each of the [0015] radiation fins 31 has a porous structure in order to radiate heat effectively.
  • A [0016] fan 4 is disposed on the radiator device 3.
  • Referring to FIG. 5, another [0017] radiator device 3′ comprises a heat conductive interface 30′ and a radiation block 31′.
  • The [0018] radiation block 31′ which has a molecular polymeric form is made by a metal granular metallurgy.
  • A [0019] fan 4′ is disposed on the radiator device 3′.
  • The invention is not limited to the above embodiment but various modification thereof may be made. Further, various changes in form and detail may be made without departing from the scope of the invention. [0020]

Claims (2)

I claim:
1. A radiator device comprises:
a heat conductive interface and a plurality of radiation fins, and
each of the radiation fins having a molecular polymeric form.
2. A radiator device comprises:
a heat conductive interface and a radiation block, and
the radiation block having a molecular polymeric form.
US10/186,588 2002-06-28 2002-06-28 Radiator device Abandoned US20040000392A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/186,588 US20040000392A1 (en) 2002-06-28 2002-06-28 Radiator device
DE20211361U DE20211361U1 (en) 2002-06-28 2002-07-27 radiator assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/186,588 US20040000392A1 (en) 2002-06-28 2002-06-28 Radiator device
DE20211361U DE20211361U1 (en) 2002-06-28 2002-07-27 radiator assembly

Publications (1)

Publication Number Publication Date
US20040000392A1 true US20040000392A1 (en) 2004-01-01

Family

ID=32299358

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/186,588 Abandoned US20040000392A1 (en) 2002-06-28 2002-06-28 Radiator device

Country Status (2)

Country Link
US (1) US20040000392A1 (en)
DE (1) DE20211361U1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070044941A1 (en) * 2005-08-30 2007-03-01 Ching-Lin Kuo Heatsink having porous fin
US20080247134A1 (en) * 2007-04-06 2008-10-09 Foxconn Technology Co., Ltd. Heat dissipation apparatus with porous type heat dissipater
US20100101758A1 (en) * 2008-10-24 2010-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with fan
US20100139904A1 (en) * 2005-08-11 2010-06-10 Osaka University Heat sink and method of producing the same
US20150245536A1 (en) * 2014-02-21 2015-08-27 Lenovo (Beijing) Co., Ltd. Heat Dissipating Device And Electronic Apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100139904A1 (en) * 2005-08-11 2010-06-10 Osaka University Heat sink and method of producing the same
US8371367B2 (en) * 2005-08-11 2013-02-12 Mitsubishi Denki Kabushiki Kaisha Heat sink and fabricating method of the same
US20070044941A1 (en) * 2005-08-30 2007-03-01 Ching-Lin Kuo Heatsink having porous fin
US20080247134A1 (en) * 2007-04-06 2008-10-09 Foxconn Technology Co., Ltd. Heat dissipation apparatus with porous type heat dissipater
US7492588B2 (en) * 2007-04-06 2009-02-17 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation apparatus with porous type heat dissipater
US20100101758A1 (en) * 2008-10-24 2010-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with fan
US20150245536A1 (en) * 2014-02-21 2015-08-27 Lenovo (Beijing) Co., Ltd. Heat Dissipating Device And Electronic Apparatus
US9532485B2 (en) * 2014-02-21 2016-12-27 Lenovo (Beijing) Co., Ltd. Heat dissipating device and electronic apparatus

Also Published As

Publication number Publication date
DE20211361U1 (en) 2002-10-24

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