US20030234431A1 - Led package - Google Patents
Led package Download PDFInfo
- Publication number
- US20030234431A1 US20030234431A1 US10/271,532 US27153202A US2003234431A1 US 20030234431 A1 US20030234431 A1 US 20030234431A1 US 27153202 A US27153202 A US 27153202A US 2003234431 A1 US2003234431 A1 US 2003234431A1
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- Prior art keywords
- golden film
- film area
- led
- led die
- led package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the present invention relates to a packaging design for light emitting diode (LED), more particularly, to a LED package contains three LED dies.
- LED Light emitting diode
- the diode further includes an ohmic metallic contact on the P-type and N-type layers.
- LED is mainly packaged within an epoxy or a metallic housing. Visible LED are generally used in display screens, automobile braking lights, scanners, indicator lights for equipment and so on.
- SMD LED Surface-mount device LED
- a metallic system carrier what is referred to as a leadframe, namely on a central part or island thereof given standard components or, respectively, standard ICs, and wires are bonded to the chip.
- the chip is also completely enveloped with a plastic molding compound in an injection molding process such that only the ends of the system carrier serving as outer terminals project therefrom.
- SMD LEDs have several of specification, such as 1206M(3.0 mm*1.5 mm*0.7 mm), 1206P (with a size of 3.0 mm*1.5 mm*0.7 mm), 0805M (with a size of 2.0 mm*1.2 mm*0.6 mm), and 0603M (with a size of 1.6 mm*0.8 mm*0.5 mm). Because the 0603M model is especially small in size, only single light emitting diode could be contained in the LED package in accordance with the prior art.
- the conventional LED package can contain only one die, so it is impossible to generate colorful images. Therefore, in order to display colorful images, it is very important for the LED package industry to create a package assembly containing at least a red, a blue, and a green light emitting diodes.
- the second object of the present invention is to disclose a LED package.
- the third object of the present invention is to provide a method for manufacturing a LED package.
- the first embodiment of the present invention discloses a LED package, which is comprised of a flat panel base and three LED dies.
- the flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area.
- the first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area.
- the second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area.
- the third LED die is attached on the third golden film area; wherein the third LED die is composed of an anode connected to the first golden film area by a metallic wire, and a cathode connected to the third golden film area.
- the second embodiment of the present invention discloses a LED package, which is comprised of a flat panel base and three LED dies.
- the flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area.
- the first LED die is attached on the flat panel base by flip-chip mounting, wherein a cathode of the first LED die is connected to the first golden film area, and an anode of the first LED die is connected to the second golden film area.
- the second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of a cathode connected to the first golden film area, and an anode connected to the fourth golden film area.
- the third LED die is attached on the third golden film area; wherein the third LED die is composed of a cathode connected to the first golden film area by a metallic wire, and an anode connected to the third golden film area.
- a flat panel base is first provided. Thereafter, the first golden film area, the second golden film area, the third golden film area, the fourth golden film area, the first connection area, and the second connection area are formed on the flat panel base. After that, the first LED die, the second LED die, and the third LED die are attached on the flat panel base by means of silver glue.
- the anode or cathode of the third LED die is connected to the common anode or common cathode of the LED package by wire bonding.
- a PCB is formed by using a glue plate and a mold, and then the PCB is cut by using a cutter. Finally, a step of classification is performed by inputting a stable current into the LED package.
- FIG. 1 schematically illustrates the top-view diagram of the LED package according to the first embodiment of the present invention
- FIG. 2 schematically illustrates the top-view diagram of the LED package according to the second embodiment of the present invention
- FIG. 3 discloses the process flow of the method of manufacturing a LED package according to the present invention.
- the present invention relates to a packaging design for light emitting diode (LED), more particularly, to a LED package contains three LED dies.
- LED light emitting diode
- FIG. 1 schematically illustrates the top-view diagram of the LED package according to the first embodiment of the present invention.
- the LED package is composed of a flat panel base 10 , the first LED die 40 a, the second LED die 40 b, and the third LED die 40 c.
- the flat panel base 10 is composed of a first golden film area 20 a , a second golden film area 20 b , a third golden film area 20 c , a fourth golden film area 20 d , a first connection area 30 a , and a second connection area 30 b .
- the first connection area 30 a and the second connection area 30 b are connected to the first golden film area 20 a.
- the first golden film area 20 a serves as the common anode of the LED package.
- the second golden film area 20 b serves as the cathode for blue color of the LED package.
- the third golden film area 20 c works as the cathode for green color of the LED package.
- the fourth film area 20 d works as the cathode for the red color of the LED package.
- the first LED die 40 a is a blue-colored light emitting diode manufactured from InGaN.
- the first LED die 40 a is attached on the flat panel base 10 by flip-chip mounting.
- the anode of the first LED die 40 a is connected to the first connection area 30 a and then to the first golden film area 20 a .
- the cathode of the first LED die 40 a is connected to the second golden film area 20 b.
- the second LED die 40 b is a green-colored light emitting diode manufactured from InGaN.
- the second LED die 40 b is attached on the flat panel base 10 by flip-chip mounting.
- the anode of the second LED die 40 b is connected to the second connection area 30 b , and then to the first golden film area 20 a .
- the cathode of the second LED die 40 b is connected to the fourth golden film area 20 d.
- the third LED die 40 c is a red-colored light emitting diode attached on the third golden film area 20 c .
- the anode of the third LED die 40 c is connected to the first golden film area 20 a by a metallic wire 50 .
- the cathode of the third LED die 40 c is connected to the third golden film area 20 c.
- the LED package can specially be a 0603 model package.
- FIG. 2 schematically illustrates the top-view diagram of the LED package according to the second embodiment of the present invention.
- the LED package is composed of a flat panel base 10 , the first LED die 40 a , the second LED die 40 b , and the third LED die 40 c.
- the flat panel base 10 is composed of a first golden film area 20 a , a second golden film area 20 b , a third golden film area 20 c , a fourth golden film area 20 d , a first connection area 30 a , and a second connection area 30 b .
- the first connection area 30 a and the second connection area 30 b are connected to the first golden film area 20 a.
- the first golden film area 20 a serves as the common cathode of the LED package.
- the second golden film area 20 b serves as the anode for blue color of the LED package.
- the third golden film area 20 c works as the anode for green color of the LED package.
- the fourth film area 20 d works as the anode for the red color of the LED package.
- the first LED die 40 a is a blue-colored light emitting diode manufactured from InGaN.
- the first LED die 40 a is attached on the flat panel base 10 by flip-chip mounting.
- the cathode of the first LED die 40 a is connected to the first connection area 30 a and then to the first golden film area 20 a .
- the anode of the first LED die 40 a is connected to the second golden film area 20 b.
- the second LED die 40 b is a green-colored light emitting diode manufactured from InGaN.
- the second LED die 40 b is attached on the flat panel base 10 by flip-chip mounting.
- the cathode of the second LED die 40 b is connected to the second connection area 30 b , and then to the first golden film area 20 a .
- the anode of the second LED die 40 b is connected to the fourth golden film area 20 d.
- the third LED die 40 c is a red-colored light emitting diode attached on the third golden film area 20 c .
- the cathode of the third LED die 40 c is connected to the first golden film area 20 a by a metallic wire 50 .
- the anode of the third LED die 40 c is connected to the third golden film area 20 c.
- the LED package can specially be a 0603 model package.
- a flat panel base 10 is first provided (step 101 ). Thereafter, the first golden film area 20 a , the second golden film area 20 b , the third golden film area 20 c , the fourth golden film area 20 d , the first connection area 30 a , and the second connection area 30 b are formed on the flat panel base 10 (step 102 ). After that, the first LED die 40 a , the second LED die 40 b , and the third LED die 40 c are attached on the flat panel base by means of silver glue (step 103 ).
- the anode or cathode of the third LED die 40 c is connected to the common anode or common cathode of the LED package by means of wire bonding (step 104 ).
- a PCB is formed by using a glue plate and a mold (step 105 ), and then the PCB is cut by using a cutter (step 106 ). Finally, a step of classification is performed by inputting a stable current into the LED package (step 107 ).
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
- 1. Field of Invention
- The present invention relates to a packaging design for light emitting diode (LED), more particularly, to a LED package contains three LED dies. 2. Description of Related Art
- Light emitting diode (LED) is a junction diode formed by an epitaxial P-type layer and an epitaxial N-type layer on a heavily doped semiconductor compound base. The diode further includes an ohmic metallic contact on the P-type and N-type layers. LED is mainly packaged within an epoxy or a metallic housing. Visible LED are generally used in display screens, automobile braking lights, scanners, indicator lights for equipment and so on.
- Surface-mount device LED (SMD LED) was developed in the early 1980s. For assembling SMD LED, the chip is glued or eutectic bonded to a metallic system carrier, what is referred to as a leadframe, namely on a central part or island thereof given standard components or, respectively, standard ICs, and wires are bonded to the chip. The chip is also completely enveloped with a plastic molding compound in an injection molding process such that only the ends of the system carrier serving as outer terminals project therefrom.
- SMD LEDs have several of specification, such as 1206M(3.0 mm*1.5 mm*0.7 mm), 1206P (with a size of 3.0 mm*1.5 mm*0.7 mm), 0805M (with a size of 2.0 mm*1.2 mm*0.6 mm), and 0603M (with a size of 1.6 mm*0.8 mm*0.5 mm). Because the 0603M model is especially small in size, only single light emitting diode could be contained in the LED package in accordance with the prior art.
- As soon as the rapid development of mobile phones and PDAs (Personal Digital Assistants), there is a request to develop colorful LED panels to display colorful images. Therefore, it is necessary to develop a LED package with three (3) light emitting diodes (generally red, blue, and green).
- However, particularly for the smallest 0603M model, the conventional LED package can contain only one die, so it is impossible to generate colorful images. Therefore, in order to display colorful images, it is very important for the LED package industry to create a package assembly containing at least a red, a blue, and a green light emitting diodes.
- It is the main object of the present invention to provide a LED package with three different light emitting diodes (red, blue, and green).
- The second object of the present invention is to disclose a LED package.
- The third object of the present invention is to provide a method for manufacturing a LED package.
- The first embodiment of the present invention discloses a LED package, which is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area. The third LED die is attached on the third golden film area; wherein the third LED die is composed of an anode connected to the first golden film area by a metallic wire, and a cathode connected to the third golden film area.
- The second embodiment of the present invention discloses a LED package, which is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein a cathode of the first LED die is connected to the first golden film area, and an anode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of a cathode connected to the first golden film area, and an anode connected to the fourth golden film area. The third LED die is attached on the third golden film area; wherein the third LED die is composed of a cathode connected to the first golden film area by a metallic wire, and an anode connected to the third golden film area.
- The process flow of the method of manufacturing a LED package according to the present invention is also disclosed. A flat panel base is first provided. Thereafter, the first golden film area, the second golden film area, the third golden film area, the fourth golden film area, the first connection area, and the second connection area are formed on the flat panel base. After that, the first LED die, the second LED die, and the third LED die are attached on the flat panel base by means of silver glue.
- Next, the anode or cathode of the third LED die is connected to the common anode or common cathode of the LED package by wire bonding.
- Thereafter, a PCB is formed by using a glue plate and a mold, and then the PCB is cut by using a cutter. Finally, a step of classification is performed by inputting a stable current into the LED package.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
- FIG. 1 schematically illustrates the top-view diagram of the LED package according to the first embodiment of the present invention;
- FIG. 2 schematically illustrates the top-view diagram of the LED package according to the second embodiment of the present invention;
- FIG. 3 discloses the process flow of the method of manufacturing a LED package according to the present invention.
- The present invention relates to a packaging design for light emitting diode (LED), more particularly, to a LED package contains three LED dies.
- First please refer to FIG. 1, which schematically illustrates the top-view diagram of the LED package according to the first embodiment of the present invention. The LED package is composed of a
flat panel base 10, the first LED die 40 a, the second LED die 40 b, and the third LED die 40 c. - The
flat panel base 10 is composed of a firstgolden film area 20 a, a secondgolden film area 20 b, a thirdgolden film area 20 c, a fourthgolden film area 20 d, afirst connection area 30 a, and asecond connection area 30 b. Thefirst connection area 30 a and thesecond connection area 30 b are connected to the firstgolden film area 20 a. - The first
golden film area 20 a serves as the common anode of the LED package. The secondgolden film area 20 b serves as the cathode for blue color of the LED package. The thirdgolden film area 20 c works as the cathode for green color of the LED package. Thefourth film area 20 d works as the cathode for the red color of the LED package. - The
first LED die 40 a is a blue-colored light emitting diode manufactured from InGaN. Thefirst LED die 40 a is attached on theflat panel base 10 by flip-chip mounting. The anode of thefirst LED die 40 a is connected to thefirst connection area 30 a and then to the first golden film area20 a. The cathode of thefirst LED die 40 a is connected to the secondgolden film area 20 b. - The second LED die40 b is a green-colored light emitting diode manufactured from InGaN. The
second LED die 40 b is attached on theflat panel base 10 by flip-chip mounting. The anode of thesecond LED die 40 b is connected to thesecond connection area 30 b, and then to the firstgolden film area 20 a. The cathode of thesecond LED die 40 b is connected to the fourthgolden film area 20 d. - The third LED die40 c is a red-colored light emitting diode attached on the third
golden film area 20 c. The anode of the third LED die 40 c is connected to the firstgolden film area 20 a by ametallic wire 50. The cathode of the third LED die 40 c is connected to the thirdgolden film area 20 c. - According to a preferred embodiment of the present invention, the LED package can specially be a 0603 model package.
- Please then to FIG. 2, which schematically illustrates the top-view diagram of the LED package according to the second embodiment of the present invention. The LED package is composed of a
flat panel base 10, the first LED die 40 a, the second LED die 40 b, and the third LED die 40 c. - The
flat panel base 10 is composed of a firstgolden film area 20 a, a secondgolden film area 20 b, a thirdgolden film area 20 c, a fourthgolden film area 20 d, afirst connection area 30 a, and asecond connection area 30 b. Thefirst connection area 30 a and thesecond connection area 30 b are connected to the firstgolden film area 20 a. - The first
golden film area 20 a serves as the common cathode of the LED package. The secondgolden film area 20 b serves as the anode for blue color of the LED package. The thirdgolden film area 20 c works as the anode for green color of the LED package. Thefourth film area 20 d works as the anode for the red color of the LED package. - The first LED die40 a is a blue-colored light emitting diode manufactured from InGaN. The first LED die 40 a is attached on the
flat panel base 10 by flip-chip mounting. The cathode of the first LED die 40 a is connected to thefirst connection area 30 a and then to the first golden film area20 a. The anode of the first LED die 40 a is connected to the secondgolden film area 20 b. - The second LED die40 b is a green-colored light emitting diode manufactured from InGaN. The second LED die 40 b is attached on the
flat panel base 10 by flip-chip mounting. The cathode of the second LED die 40 b is connected to thesecond connection area 30 b, and then to the firstgolden film area 20 a. The anode of the second LED die 40 b is connected to the fourthgolden film area 20 d. - The third LED die40 c is a red-colored light emitting diode attached on the third
golden film area 20 c. The cathode of the third LED die 40 c is connected to the firstgolden film area 20 a by ametallic wire 50. The anode of the third LED die 40 c is connected to the thirdgolden film area 20 c. - According to a preferred embodiment of the present invention, the LED package can specially be a 0603 model package.
- Referring then to FIG. 3, the process flow of the method of manufacturing a LED package according to the present invention is disclosed. A
flat panel base 10 is first provided (step 101). Thereafter, the firstgolden film area 20 a, the secondgolden film area 20 b, the third golden film area20 c, the fourthgolden film area 20 d, thefirst connection area 30 a, and thesecond connection area 30 b are formed on the flat panel base 10 (step 102). After that, the first LED die 40 a, the second LED die 40 b, and the third LED die 40 c are attached on the flat panel base by means of silver glue (step 103). - Next, the anode or cathode of the third LED die40 c is connected to the common anode or common cathode of the LED package by means of wire bonding (step 104).
- Thereafter, a PCB is formed by using a glue plate and a mold (step105), and then the PCB is cut by using a cutter (step 106). Finally, a step of classification is performed by inputting a stable current into the LED package (step 107).
- While the present invention has been described with the reference to a preferred embodiment thereof, those skilled in the art will appreciate various changes in form and detail may be made without departing from the intended scope of the present invention as defined in the appended claims.
Claims (24)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91113659A | 2002-06-21 | ||
TW091113659A TW541731B (en) | 2002-06-21 | 2002-06-21 | LED package module |
TW91113659 | 2002-06-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
US6667497B1 US6667497B1 (en) | 2003-12-23 |
US20030234431A1 true US20030234431A1 (en) | 2003-12-25 |
Family
ID=29708483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/271,532 Expired - Lifetime US6667497B1 (en) | 2002-06-21 | 2002-10-17 | LED package |
Country Status (3)
Country | Link |
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US (1) | US6667497B1 (en) |
KR (1) | KR100685504B1 (en) |
TW (1) | TW541731B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006012842A2 (en) * | 2004-07-26 | 2006-02-09 | Osram Opto Semiconductors Gmbh | Optoelectronic component that emits electromagnetic radiation and illumination module |
US20130168705A1 (en) * | 2012-01-02 | 2013-07-04 | Lextar Electronics Corp. | Solid-state light-emitting device and solid-state light-emitting package thereof |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100533635B1 (en) | 2003-11-20 | 2005-12-06 | 삼성전기주식회사 | Led package |
US10499465B2 (en) | 2004-02-25 | 2019-12-03 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same |
US10178715B2 (en) | 2004-02-25 | 2019-01-08 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same |
US7904723B2 (en) * | 2005-01-12 | 2011-03-08 | Interdigital Technology Corporation | Method and apparatus for enhancing security of wireless communications |
US10986714B2 (en) | 2007-10-06 | 2021-04-20 | Lynk Labs, Inc. | Lighting system having two or more LED packages having a specified separation distance |
TWI404241B (en) * | 2009-11-25 | 2013-08-01 | Everlight Electronics Co Ltd | Light-emitting diode and method for manufacturing thereof |
CN102082218B (en) * | 2009-11-26 | 2013-10-23 | 亿光电子工业股份有限公司 | Light-emitting diode, light-emitting diode device and packaging method of light-emitting diode |
JP6064396B2 (en) * | 2012-07-09 | 2017-01-25 | 日亜化学工業株式会社 | Light emitting device |
CN104409451A (en) * | 2014-12-17 | 2015-03-11 | 木林森股份有限公司 | Bracket set of small-sized LED lamp beads and brackets |
JP6289718B1 (en) * | 2017-01-02 | 2018-03-07 | ルーメンス カンパニー リミテッド | LED display device |
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JPH06310763A (en) * | 1993-04-21 | 1994-11-04 | Sanyo Electric Co Ltd | Led lamp |
JPH10242523A (en) * | 1997-02-28 | 1998-09-11 | Kouha:Kk | Light emitting diode display device and picture display device utilizing the same |
JP3893735B2 (en) * | 1998-04-24 | 2007-03-14 | 松下電器産業株式会社 | Light emitting device |
JP4042213B2 (en) * | 1998-06-05 | 2008-02-06 | 松下電器産業株式会社 | Full color semiconductor light emitting device |
JP2000332297A (en) * | 1999-05-17 | 2000-11-30 | Koha Co Ltd | Full color led module |
US6639360B2 (en) * | 2001-01-31 | 2003-10-28 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
-
2002
- 2002-06-21 TW TW091113659A patent/TW541731B/en not_active IP Right Cessation
- 2002-10-17 US US10/271,532 patent/US6667497B1/en not_active Expired - Lifetime
- 2002-11-13 KR KR1020020070380A patent/KR100685504B1/en not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006012842A2 (en) * | 2004-07-26 | 2006-02-09 | Osram Opto Semiconductors Gmbh | Optoelectronic component that emits electromagnetic radiation and illumination module |
WO2006012842A3 (en) * | 2004-07-26 | 2006-05-11 | Osram Opto Semiconductors Gmbh | Optoelectronic component that emits electromagnetic radiation and illumination module |
US20090001490A1 (en) * | 2004-07-26 | 2009-01-01 | Georg Bogner | Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module |
US8071990B2 (en) | 2004-07-26 | 2011-12-06 | Osram Opto Semiconductors Gmbh | Optoelectronic component that emits electromagnetic radiation and illumination module |
US20130168705A1 (en) * | 2012-01-02 | 2013-07-04 | Lextar Electronics Corp. | Solid-state light-emitting device and solid-state light-emitting package thereof |
Also Published As
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KR20030097574A (en) | 2003-12-31 |
US6667497B1 (en) | 2003-12-23 |
TW541731B (en) | 2003-07-11 |
KR100685504B1 (en) | 2007-02-27 |
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