US20030183369A1 - Heat sink and method of removing heat from power electronics components - Google Patents

Heat sink and method of removing heat from power electronics components Download PDF

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Publication number
US20030183369A1
US20030183369A1 US10/117,547 US11754702A US2003183369A1 US 20030183369 A1 US20030183369 A1 US 20030183369A1 US 11754702 A US11754702 A US 11754702A US 2003183369 A1 US2003183369 A1 US 2003183369A1
Authority
US
United States
Prior art keywords
heat sink
base
substrate
heat
extrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/117,547
Other languages
English (en)
Inventor
John Makaran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Tire Canada Inc
Original Assignee
Siemens VDO Automotive Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens VDO Automotive Inc filed Critical Siemens VDO Automotive Inc
Priority to US10/117,547 priority Critical patent/US20030183369A1/en
Assigned to SIEMENS VDO AUTOMOTIVE INC. reassignment SIEMENS VDO AUTOMOTIVE INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAKARAN, JOHN
Priority to AU2003212172A priority patent/AU2003212172A1/en
Priority to DE10392451T priority patent/DE10392451T5/de
Priority to PCT/CA2003/000436 priority patent/WO2003083941A2/en
Priority to JP2003581260A priority patent/JP2005522036A/ja
Priority to DE20321528U priority patent/DE20321528U1/de
Priority to US10/456,921 priority patent/US20040031588A1/en
Publication of US20030183369A1 publication Critical patent/US20030183369A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49359—Cooling apparatus making, e.g., air conditioner, refrigerator

Definitions

  • the invention relates to heat removal from electronic components of a circuit board and, more particularly, to a heat sink for removing heat from a power electronics component.
  • heat sinks for removing heat from power electronics components of a circuit board are designed for the specific component to be cooled. Development time is significant since a thermal model and thermal stack-up need to be determined for each heat sink. In making heat sinks, costly tooling is required, especially if the heat sink is of the finned type. Furthermore, rapid reconfiguration of a printed circuit board layout is difficult and expensive since there is retooling associated with the conventional heat sinks. This often results in solutions that are unique to the particular packaging embodiment.
  • An object of the invention is to fulfill the need referred to above.
  • this objective is achieved by providing a heat sink for removing heat from a component on a substrate.
  • the heat sink includes a base having a top, a bottom and opposing sides. The top is generally planar for being adhered to the substrate. Locating structure is provided on the top of the heat sink for locating the heat sink with respect to the substrate. Each of the opposing sides has a cutout defining a stepped shoulder.
  • the heat sink also includes a plurality of fins extending from the bottom of the base.
  • the heat sink is made preferably by an extrusion process. Since the heat sink can be glued to the circuit board, a common heat sink can be used for any power electronics component.
  • a method for removing heat from a component mounted on a substrate.
  • the method provides a heat-generating component on a top side of the substrate.
  • a heat sink is provided and has a base including a top, a bottom and opposing sides. The top is generally planar for mounting to the substrate.
  • the heat sink also includes a plurality of fins extending from the bottom of the base. Thermal adhesive is applied to the bottom of the substrate or to at least a portion of the top of the heat sink and the top of the heat sink is secured to the bottom side of the substrate to remove heat from the component.
  • a method of making a heat sink includes extruding material to form a heat sink extrusion of a certain length.
  • the heat sink extrusion has a base including a top, a bottom and opposing sides. The top is generally planar for mounting to a circuit board.
  • the heat sink extrusion also includes a plurality of fins extending from the bottom of the base. A cutout is machined at each of the opposing sides to define stepped shoulders. The extrusion is cut across the length at various locations to provide a plurality of heat sinks from the extrusion.
  • FIG. 1 is a perspective view of a heat sink extrusion provided in accordance with principles of the present invention.
  • FIG. 2 is a perspective view of a heat sink cut from the extrusion of FIG. 1, shown after creating shoulders in opposing sides thereof.
  • FIG. 3 is a cross-sectional view of the heat sink of FIG. 2 shown mounted between a circuit board and a cover member in accordance with the present invention.
  • FIG. 4 is a perspective view of a second embodiment of a heat sink of the invention shown having locating structure on a top thereof.
  • FIG. 5 is a plan view of one of the location structures of the heat sink of FIG. 4 shown received in a through hole in a circuit board.
  • a heat sink extrusion provided in accordance with the invention, is shown generally indicated at 10 .
  • Material such as aluminum or magnesium, is extruded to form the heat sink extrusion 10 having a certain length.
  • the heat sink extrusion 10 has a base 12 including a top 14 , a bottom 16 and opposing sides 18 and 20 .
  • the top 14 is generally planar for mounting to substrate such as a printed circuit board 22 (FIG. 3).
  • the heat sink extrusion 10 also including a plurality of fins 24 extending from the bottom 16 of the base 12 .
  • fins means any structure to cause heat transfer from the base 12 to surrounding air.
  • a cut-out is machined in each of the sides 18 and 20 defining stepped shoulders 26 in the base 12 , the function of which will be explained below. Hence, by extrusion, the base 12 and the fins 24 are formed integrally.
  • the extrusion 10 is cut across the length at various locations (e.g., line A of FIG. 1).
  • many heat sinks 28 can be made from a single extrusion 10 .
  • the heat sink can be made by methods other than extrusion, such as machining or casting.
  • a method of removing heat from a component mounted on a substrate such as a circuit board provides a heat-generating component 30 mounted on a top side 31 of a circuit board 22 .
  • the substrate is preferably of ceramic or insulated metal material.
  • the heat-generating component 30 is a power electronics component such as a MOSFET.
  • the component 30 is preferably covered with potting or conformal coating 32 .
  • Thermal vias 34 are provided through the circuit board 22 adjacent to the component 30 and extend from the top side 31 to a bottom side 36 of the circuit board 22 . In the illustrated embodiment, the vias 34 are bores through the circuit board that are filled with thermally conductive material.
  • the vias 34 provide paths for heat to be transferred from the component 30 to the bottom side 36 of the circuit board 22 .
  • Thermal adhesive 38 is applied to at least a portion of the top of heat sink 28 and the top 14 of the heat sink is secured to the bottom side 36 of the circuit board 22 adjacent to the vias 34 .
  • the adhesive can be applied to the bottom of the circuit board instead of applying adhesive on the heat sink. It can be appreciated that the thermal vias are not required, but are preferred since they aid in heat transfer.
  • a cover member 40 preferably of plastic or aluminum, is provided and has a top surface 42 , a bottom surface 44 , and a bore 45 there-through. At least the top surface 42 is generally planar.
  • the cover member 40 is configured to cover and protect the bottom side 36 of the circuit board 22 without contacting any portions of electrical components on the bottom side 36 of the circuit board 22 . In the broadest aspect of the invention, the cover member need not be provided.
  • a sealant 46 such as silicone or RTV, is placed under each shoulder 26 of the base 12 of the heat sink 28 , or around the bore 45 in the cover member 40 . Thereafter, the fins 24 of the heat sink 28 are inserted through the bore 45 so that the sealant 46 is between the top surface 42 of the cover member 40 and the shoulders 26 , sealing the bore 45 .
  • the locating structure includes at least one pair of locators 50 , of generally rectangular cross-section, extending from the top 14 of the base.
  • ribs 52 can be provided on the top 14 of the base 12 .
  • the central portions of the ribs can be removed by machining to define the locators 50 .
  • the locators 50 can be of any cross-sectional shape.
  • the circuit board 22 can have plated locating holes 54 there-through, each of which is sized to receive an associated locator 50 of the heat sink 28 to control the X-Y location of the heat sink 28 with respect to the circuit board 22 .
  • a common heat sink can be used for all power electronic devices by simply gluing the heat sink to the circuit board relative to the power electronics device. Since the heat sink is a common design, rapid reconfiguration of printed circuit board layout can be achieved. There are no retooling costs associated with the heat sink 28 . Only the location of the bore 45 in the cover member 40 needs to be moved during reconfiguration.
  • the advantages of the invention include: 1) shorter electronics package, 2) easier to re-layout a printed circuit board in an existing application or use in a new application because the heat sink dimensions are common to all designs, 3) no heat sink retooling costs, 4) ability to use finned heat sinks without the need for expensive tooled heat sinks, 5) heat sinks are extruded and therefore are of low cost, 6) minimize development time since heat sink thermal model and thermal stack-up is common to all designs, and 7) if more surface area is needed, a different extrusion with more or longer fins can be used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US10/117,547 2002-04-02 2002-04-02 Heat sink and method of removing heat from power electronics components Abandoned US20030183369A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US10/117,547 US20030183369A1 (en) 2002-04-02 2002-04-02 Heat sink and method of removing heat from power electronics components
AU2003212172A AU2003212172A1 (en) 2002-04-02 2003-03-27 Heat sink and method of removing heat from power electronics components
DE10392451T DE10392451T5 (de) 2002-04-02 2003-03-27 Wärmesenke (Kühlkörper) und Verfahren zur Abführung der Wärme von elektronischen Leistungskomponenten
PCT/CA2003/000436 WO2003083941A2 (en) 2002-04-02 2003-03-27 Heat sink and method of removing heat from power electronics components
JP2003581260A JP2005522036A (ja) 2002-04-02 2003-03-27 ヒートシンク及び電力電子コンポーネントから熱を除去する方法
DE20321528U DE20321528U1 (de) 2002-04-02 2003-03-27 Wärmesenke
US10/456,921 US20040031588A1 (en) 2002-04-02 2003-06-06 Heat sink and method of removing heat from power electronics components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/117,547 US20030183369A1 (en) 2002-04-02 2002-04-02 Heat sink and method of removing heat from power electronics components

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/456,921 Division US20040031588A1 (en) 2002-04-02 2003-06-06 Heat sink and method of removing heat from power electronics components

Publications (1)

Publication Number Publication Date
US20030183369A1 true US20030183369A1 (en) 2003-10-02

Family

ID=28453950

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/117,547 Abandoned US20030183369A1 (en) 2002-04-02 2002-04-02 Heat sink and method of removing heat from power electronics components
US10/456,921 Abandoned US20040031588A1 (en) 2002-04-02 2003-06-06 Heat sink and method of removing heat from power electronics components

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/456,921 Abandoned US20040031588A1 (en) 2002-04-02 2003-06-06 Heat sink and method of removing heat from power electronics components

Country Status (5)

Country Link
US (2) US20030183369A1 (ja)
JP (1) JP2005522036A (ja)
AU (1) AU2003212172A1 (ja)
DE (1) DE10392451T5 (ja)
WO (1) WO2003083941A2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007028672A1 (de) * 2005-09-09 2007-03-15 Vdo Automotive Ag Kühlkörper für elektronikgehäuse
US8944147B2 (en) 2010-05-28 2015-02-03 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method for manufacturing same
US11333341B2 (en) * 2017-05-03 2022-05-17 Fluence Bioengineering, Inc. Systems and methods for coupling a metal core PCB to a heat sink

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124099A (ja) * 2006-11-09 2008-05-29 Sumitomo Bakelite Co Ltd 放熱器付き回路基板
US7845393B2 (en) * 2007-11-06 2010-12-07 Jiing Tung Tec. Metal Co., Ltd. Thermal module
US20100326644A1 (en) * 2009-06-30 2010-12-30 Shui-Hsu Hung Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same
US9398723B2 (en) 2013-08-29 2016-07-19 Eaton Corporation Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
US5050040A (en) * 1988-10-21 1991-09-17 Texas Instruments Incorporated Composite material, a heat-dissipating member using the material in a circuit system, the circuit system
US5161087A (en) * 1990-10-15 1992-11-03 International Business Machines Corporation Pivotal heat sink assembly
AU7096696A (en) * 1995-11-28 1997-06-19 Hitachi Limited Semiconductor device, process for producing the same, and packaged substrate
DE19645636C1 (de) * 1996-11-06 1998-03-12 Telefunken Microelectron Leistungsmodul zur Ansteuerung von Elektromotoren
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
DE19910500A1 (de) * 1999-03-10 2000-10-05 Bosch Gmbh Robert Elektrisches Gerät
KR20010007146A (ko) * 1999-06-01 2001-01-26 안자이 이치로 퍼스널 컴퓨터용 ｃｐｕ의 방열기
US6219241B1 (en) * 1999-06-11 2001-04-17 Intel Coroporation Advanced zero-insertion force (ZIF) socket with heat sink alignment and retention mechanisms
US20020008963A1 (en) * 1999-07-15 2002-01-24 Dibene, Ii Joseph T. Inter-circuit encapsulated packaging
DE10055446B4 (de) * 1999-11-26 2012-08-23 Fuji Electric Co., Ltd. Halbleiterbauelement und Verfahren zu seiner Herstellung
JP2002134973A (ja) * 2000-10-19 2002-05-10 Matsushita Electric Ind Co Ltd ヒートシンク装置及び電子機器
US6392888B1 (en) * 2000-12-07 2002-05-21 Foxconn Precision Components Co., Ltd. Heat dissipation assembly and method of assembling the same
JP2003007976A (ja) * 2001-06-25 2003-01-10 Mitsubishi Electric Corp 半導体装置及びモジュール装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007028672A1 (de) * 2005-09-09 2007-03-15 Vdo Automotive Ag Kühlkörper für elektronikgehäuse
US20090083980A1 (en) * 2005-09-09 2009-04-02 Vdo Automotive Ag Cooling Body for Electronics Housing
US8944147B2 (en) 2010-05-28 2015-02-03 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method for manufacturing same
US11333341B2 (en) * 2017-05-03 2022-05-17 Fluence Bioengineering, Inc. Systems and methods for coupling a metal core PCB to a heat sink
US20220260240A1 (en) * 2017-05-03 2022-08-18 Fluence Bioengineering, Inc. Systems and Methods for Coupling a Metal Core PCB to a Heat Sink
US11774082B2 (en) * 2017-05-03 2023-10-03 Fluence Bioengineering, Inc. Systems and methods for coupling a metal core PCB to a heat sink

Also Published As

Publication number Publication date
WO2003083941A3 (en) 2004-02-12
AU2003212172A8 (en) 2003-10-13
DE10392451T5 (de) 2005-04-14
AU2003212172A1 (en) 2003-10-13
JP2005522036A (ja) 2005-07-21
US20040031588A1 (en) 2004-02-19
WO2003083941A2 (en) 2003-10-09

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Legal Events

Date Code Title Description
AS Assignment

Owner name: SIEMENS VDO AUTOMOTIVE INC., ONTARIO

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MAKARAN, JOHN;REEL/FRAME:013107/0252

Effective date: 20020702

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION