US20030152448A1

US20030152448A1 - IC package feeder

Info

Publication number: US20030152448A1
Application number: US10/136,425
Authority: US
Inventors: Chien-Wen Lee
Original assignee: CHI YHEI Tech INTERNATIONAL Co Ltd
Current assignee: CHI YHEI Tech INTERNATIONAL Co Ltd
Priority date: 2002-02-08
Filing date: 2002-05-02
Publication date: 2003-08-14
Also published as: TW544076U

Abstract

An IC package feeder is constructed to include a platform, a vibrator controlled to oscillate the platform, a material delivery tube path unit formed of fixed rails and movable rails respectively mounted on the platform at the top near a rear side and defining a plurality of pitch-adjustable parallel material delivery tube passages, an IC package path unit formed of fixed rod members and movable rod members respectively mounted on the platform at a top near a front side and defining a plurality of pitch-adjustable IC package passages respectively aligned in line with the material delivery tube passages, the IC package passages each having a tapered rear side expanding backwards, and a cover vertically adjustably mounted on the platform and covering over the rod members of the IC package path unit, the cover having sloping guide means disposed corresponding to the tapered rear sides of the IC package passages and adapted to guide IC packages from the material delivery tube path unit to the IC package passages.

Description

FIELD OF THE INVENTION

The present invention relates to a material feeding apparatus and, more specifically, to an IC package feeder for use in an IC package examination station or SMT (surface mounting technique) production line in a factory.

BACKGROUND OF THE INVENTION

During the manufacturing process of IC packages such as integrated circuit chip packages, an IC package feeder may be used to arrange IC packages in parallel and deliver IC packages forwards in proper order, for enabling a mechanical arm to pick up IC packages one after another to an examination station for examination, or to a SMT production line for mounting on a circuit board or the like. Conventional IC package feeders commonly comprise a platform, a plurality of material delivery tubes arranged on the platform, and a vibrator adapted to oscillate the platform. The vibrator is controlled to oscillate the platform, causing IC packages to be delivered forwards from the material delivery tubes to respective IC package passages at the front side of the platform where mechanical arms are operated to pick up IC packages from the IC package passages one after another in proper order.

Because conventional IC package feeders fit IC packages of a particular specification only (shape and size), different IC package feeders shall be used to fit IC packages of different specifications. Further, during the operation of conventional IC package feeders, IC packages tend to be overlapped over one another when moved away from the material delivery tubes to the IC package passages, resulting in further IC package installation error. In this case, the operator must stop the operation and eliminate the troubles.

SUMMARY OF THE INVENTION

The primary objective of the present invention is to provide an IC package feeder, which fits IC packages of different specifications.

It is another objective of the present invention to provide an IC package feeder, which keeps IC packages arranged in lines and moves IC packages forwards smoothly without causing an overlap of IC packages under delivery.

To achieve these objectives, the IC package feeder comprises a platform; a vibrator controlled to oscillate the platform back and forth; a material delivery tube path unit mounted on the platform at a top side near a rear side of the platform, the material delivery tube path unit comprising a plurality of rails longitudinally arranged in pair on the platform, each pair of the rails of the material delivery tube path unit defining a respective material delivery tube passage, each pair of the rails of the material delivery tube path unit having at least one rail adjustable on the platform in transverse direction between two opposite lateral sides of the platform; an IC package path unit mounted on the platform at a top side near a front side of the platform, the IC package path comprising first rod members and second rod members alternatively longitudinally arranged on the platform and defining a plurality of IC package passages respectively aligned in line with the material delivery tube passages of the material delivery tube path unit, the first rod members and the second rod members being relatively movable to adjust the width of the IC package passages, the first rod members each having a sloping edge disposed at an inner side such that the IC package passages each have a tapered rear side gradually expanding backwards; and a cover vertically adjustably mounted on the platform near a front side of the platform and covering over the first and second rod members of the IC package path unit, the cover having sloping guide means disposed corresponding to the tapered rear sides of the IC package passages and adapted to guide IC packages from the material delivery tube path unit to the IC package passages.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of a preferred embodiment of the present invention. [0007]
FIG. 2 is a perspective view of the preferred embodiment of the present invention in combination. [0008]
FIG. 3 is another perspective view of the preferred embodiment of the present invention after removal of a part of the members above the platform. [0009]
FIG. 4 is another perspective view of the preferred embodiment of the present invention after removal of the cover set from the platform. [0010]
FIG. 5 is a top plain view of the preferred embodiment of the present invention. [0011]
FIG. 6 is a left side view of the preferred embodiment of the present invention. [0012]
FIG. 7 is a schematic view showing IC packages delivered through the IC package passages.[0013]

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. from [0014] 1 through 7, an IC package feeder in accordance with a preferred embodiment of the present invention is shown comprised of a platform 10, a vibrator 20, a material delivery tube path unit 30, an IC package path unit 40, a plurality of photosensitive switches 48, a cover set 50, and an auxiliary rack 60.
The [0015] platform 10 is comprised of a bottom board 11 (see FIG. 4), two rear sliding rails 12, two front sliding rails 13, and a top board 15. The bottom board 11 has a first sliding groove 111 and a second sliding groove 112 arranged in parallel on the top near the rear side and transversely extended through the width of the bottom board 11, a third sliding groove 113 and a fourth sliding groove 14 arranged in parallel on the top near the front side and transversely extended through the width of the bottom board 11. The rear sliding rails 12 are respectively slidably mounted in the first and second sliding grooves 111 and 112. The front sliding rails 13 are respectively slidably mounted in the third and fourth sliding grooves 113, 114. The top board 15 is supported on the rear sliding rails 12 and the front sliding rails 13 above the bottom board 11 (see FIG. 3). The size of the top board 15 fits the bottom board 11. The top board 15 comprises a plurality of first slots 151, second slots 152, third slots 153, and fourth slots 154 respectively extended in transverse direction corresponding to the sliding grooves 111, 112, 113, 114 respectively. The platform 10 further comprises a plurality of through holes 16 disposed behind the fourth slots 154 and vertically extended through the top board 15 and the bottom board 11.
The [0016] vibrator 20 is provided at the bottom side of the platform 10, and controlled to oscillate the platform 10 alternatively forwards and backwards (because the structure and function of the vibrator 20 are of the known art not within the scope of the present invention, no further detailed description is necessary).
The material delivery [0017] tube path unit 30 is mounted on the top of the platform 10 near its rear side, comprised of a plurality of fixed rails 31 and a plurality of movable rails 32. The number of the fixed rails 31 is equal to the movable rails 32. The fixed rails 31 and the movable rails 32 are alternatively arranged in parallel in longitudinal direction on the top of the top board 15. The fixed rails 31 have the respective front and rear ends respectively extended over the front side of the second slots 152 and the rear side of the first slots 151.The movable rails 32 each have two screw bolts 33 provided at two ends. The screw bolts 33 of the movable rails 32 are respectively inserted through the first slots 151 and the second slots 152 and fastened to the rear sliding rails 12, enabling the movable rails 32 to be synchronously moved leftwards or rightwards on the top of the top board 15. Each fixed rail 31 defines with the corresponding adjacent right-sided movable rail 32 a respective material delivery tube passage 34 for the positioning of a respective IC package delivery tube 70. The width of each material delivery tube passage 34 is adjustable by moving the movable rails 32 leftwards or rightwards on the top of the top board 15. Further, the fixed rails 31 are equally spaced. The movable rails 32 are connected to the rear sliding rails 12 in parallel at an equal pitch.
The IC [0018] package path unit 40 is mounted on the top of the platform 10 near its front side, comprised of a plurality of fixed rods 41, and a movable comb plate 42. The number of the fixed rods 41 is equal to the number of the fixed rails 31. The fixed rods 41 are fixedly mounted on the top of the top board 15 in longitudinal alignment with the fixed rails 31 respectively. Precisely speaking, the right side of each fixed rod 41 is biased rightwards in comparison with the right side of each corresponding fixed rail, and the difference is about the wall thickness of the IC package delivery tube 70. The movable comb plate 42 comprises a base bar 43 extended in transverse direction, and a plurality of parallel teeth 44 perpendicularly backwardly extended from the base bar 43 and equally arranged in parallel. The number of the parallel teeth 44 is equal to the fixed rods 41. Screws 45 are respectively threaded through the teeth 44 and base bar 43 of the movable comb plate 42, and then respectively inserted through the third slots 153 and the fourth slots 154, and then respectively fastened to the front sliding rails 13, for enabling the movable comb plate 42 to be moved transversely on the top board 15. The teeth 44 of the movable comb plate 42 and the fixed rods 41 are alternatively arranged on the top board 15. Each fixed rod 41 defines with the right-sided adjacent tooth 44 a respective IC package passage 46 extending in longitudinal direction. The width of the IC package passage 46 is adjustable (because the teeth 44 are moved synchronously, the width of all IC package passages 46 is constantly maintained equal). Each IC package passage 46 is maintained in line with the corresponding material delivery tube passage 34. Further, the fixed rods 41 each have a sloping edge 411 disposed at an inner side and sloping in direction from the front side toward the rear side such that each IC package passage 46 has a tapered rear side gradually expanding backwards, as shown in FIG. 5.
The [0019] photosensitive switches 48 are respectively mounted on the bottom side of the front edge of the platform 10 corresponding to the IC package passages 46 (see FIG. 6), and controlled to emit infrared rays upwardly through the through holes 16 of the platform 10.
The [0020] cover set 50 comprises two side blocks 51, a cover plate 53, and a frame 54. The side blocks 51 each have a longitudinal mounting slot 511. Screws 52 are respectively inserted through the longitudinal mounting slots 511 of the side blocks 51 to vertically adjustably fasten the side blocks 51 to two opposite lateral sides of the platform 10 near its front side. The cover plate 53 is a rectangular, transparent acrylic board extended in transverse direction and fixedly fastened to the rear side of the frame 54. The frame 54 has two longitudinal slots 541 respectively disposed in left and right ends thereof. Screws 55 are respectively vertically inserted through the longitudinal slots 541 of the frame 54 and respectively threaded into the top sides of the side blocks 51 to secure the frame 54 to the side blocks 51. When loosened the screws 55, the frame 54 can be adjusted horizontally in longitudinal direction relative to the side blocks 51. The cover plate 53 covers over the top sides of the fixed rods 41 and the teeth 44, keeping the rear side edge disposed corresponding to the narrow end of the tapered rear sides of the IC package passages 46 (See FIG. 5). The rear side edge of the cover plate 53 is a beveled edge sloping downwards from the rear side toward the front side (see FIG. 7) at 45˜65°. The front side edge of the frame 54 is spaced behind the front ends of the IC package passages 46, i.e., the front ends of the IC package passages 46 are maintained opened and not shield.
The [0021] auxiliary rack 60 comprises two sideboards 61 and three transverse rods 62. The sideboards 61 are bilaterally fastened to the rear side of the platform and arranged in parallel, each having three vertical slots 611 The transverse rods 62 are respectively horizontally connected between the sideboards 61 at different elevations, each having a plurality of protruding flanges 621 corresponding to the material delivery tube passages 34. The protruding flanges 621 are respectively disposed at the left side corresponding to the imaginary lines longitudinally extended from the material delivery tube passages 34. Screws 63 are respectively inserted through the vertical slots 611 of the sideboards 61 and threaded into the ends of the transverse rods 62 to vertically adjustably secure the transverse rods 62 to the sideboards 61 in horizontal at different elevations.
The above statement describes the structural features of the IC package feeder. When in use, as shown in FIGS. 5 and 6, IC [0022] package delivery tubes 70 are mounted in the IC package feeder, keeping the rear ends of the IC package delivery tubes 70 respectively extended over the top side of the last two transverse rods 62 and the bottom side of the front transverse rod 62 and stopped at the respective protruding flanges 621; the middle sections of the IC package delivery tubes 70 respectively suspended in the material delivery tube passages 34, and the front ends of the IC package delivery tubes 70 respectively stopped at the tapered rear sides of the rear ends of the IC package passages 46 in longitudinal alignment with the IC package passages 46. During operation, the vibrator 20 is controlled to oscillate the platform 10 obliquely alternatively back and forth; thereby causing IC packages 80 to be forced forwards and moved out of the IC package delivery tubes 70 into the IC package passages 46 toward the front open sides of the IC package passages 46 in proper order. When an IC package 80 reaches the front open side of the corresponding IC package passage 46, the corresponding photosensitive switch 48 detects its presence, and drives the corresponding mechanical arm (not shown) to pick up the IC package 80.
During the aforesaid operation, the width of the material [0023] delivery tube passages 34 is adjusted to the level slightly greater than the thickness of the IC package delivery tubes 70; the width of the IC package passages 46 is adjusted to the level slightly greater than the width of the IC packages 80; the elevation and horizontal position of the cover plate 53 is adjusted to the level that the rear side edge of the cover plate 53 is stopped at the top of the front side of the IC package delivery tubes 70 to guide IC packages 80 downwards out of the material delivery tubes 70 into the corresponding IC package passages 46, keeping IC packages 80 arranged in the IC package passages 46 and properly delivered forwards.
As indicated above, the IC package feeder of the present invention provides the following advantages: [0024]
1. The width of the [0025] material delivery passages 34 as well as the width of the IC package passages 46 are adjustable to fit different sizes of IC packages.
2. When an [0026] IC package 80 is going to fall out of the front end of the corresponding IC package delivery tube 70, the beveled rear side edge of the cover plate 53 guides the IC package 80 obliquely downwards into the corresponding IC package passage 46 behind the precedent IC package, preventing jumping of one IC package onto the precedent IC package. Therefore, all IC packages 80 are arranged in line in the IC package passages 46, and delivered forwards in proper order so that the respective mechanical arm can pick up the IC packages 80 accurately one after another, improving the working efficiency.

Claims

What is claimed is:

1. An IC package feeder comprising:

a platform;

a vibrator controlled to oscillate said platform back and forth;

a material delivery tube path unit mounted on said platform at a top side near a rear side of said platform, said material delivery tube path unit comprising a plurality of rails longitudinally arranged in pair on said platform, each pair of the rails of said material delivery tube path unit defining a respective material delivery tube passage, each pair of the rails of said material delivery tube path unit having at least one rail adjustable on said platform in transverse direction between two opposite lateral sides of said platform;

an IC package path unit mounted on said platform at a top side near a front side of said platform, said IC package path comprising first rod members and second rod members alternatively longitudinally arranged on said platform and defining a plurality of IC package passages respectively aligned in line with said material delivery tube passages of said material delivery tube path unit, the first rod members and said second rod members being relatively movable to adjust the width of said IC package passages, said first rod members each having a sloping edge disposed at an inner side such that said IC package passages each have a tapered rear side gradually expanding backwards; and

a cover vertically adjustably mounted on said platform near a front side of said platform and covering over the first and second rod members of said IC package path unit, said cover having sloping guide means disposed corresponding to the tapered rear sides of said IC package passages and adapted to guide IC packages from said material delivery tube path unit to said IC package passages.

2. The IC package feeder as claimed in claim 1, wherein the rails of said material delivery tube path unit include a plurality of fixed rails and a plurality of movable rails alternatively arranged on said platform and defining said material delivery tube passages, said fixed rails being longitudinally fixedly fastened to said platform, said movable rails being connected in parallel to one another and moved relative to said fixed rails to adjust the pitch of said material delivery tube passages.

3. The IC package feeder as claimed in claim 2, wherein said platform comprises a bottom board, said bottom board having a first sliding groove and a second sliding groove arranged in parallel on a top side near a rear side thereof and transversely extended two opposite lateral sides of said bottom board, two sliding rails respectively slidably mounted in said first sliding groove and said second sliding groove, a top board mounted on said bottom board above the sliding rails in the first sliding groove and second sliding groove of said bottom board, said top board having a plurality of transverse slots corresponding to the first and second sliding grooves of said bottom board; said movable rails of said material delivery tube path unit each have two ends respectively connected to the first and second sliding rails in said first sliding groove and said second sliding groove by screws being inserted through the transverse slots of said top board; said fixed rails mounted on the top board.

4. The IC package feeder as claimed in claim 1, wherein the first rod members of said IC package path unit are longitudinally fixedly mounted on said top board and movable comb plate; the second rod members of said IC package path unit are perpendicularly to a transversely extended base bar of said IC package path unit and arranged in parallel for synchronous movement with said base bar relative to the first rod members of said IC package path unit to adjust the pitch of said IC package passages.

5. The IC package feeder as claimed in claimed 4, wherein said platform comprises said platform comprises a bottom board, said bottom board having two sliding grooves arranged in parallel on a top side near a front side thereof and transversely extended two opposite lateral sides of said bottom board, two sliding rails respectively slidably mounted in said sliding grooves, a top board mounted on said bottom board above the sliding rails in said sliding grooves, said top board having a plurality of transverse slots corresponding to the sliding grooves of said bottom board; the second rod members and base bar of said IC package path unit are respectively fastened to the sliding rails in the sliding grooves of said bottom board by screws being inserted through the transverse slots of said top board.

6. The IC package feeder as claimed in claim 1, wherein said cover is mounted on two side blocks at two opposite lateral sides of said platform, said side blocks each having a vertical mounting slots and a screw respectively inserted through said vertical mounting slots and fastened to said platform to vertically adjustably fasten the corresponding side block to said platform.

7. The IC package feeder as claimed in claim 6, wherein said cover is fastened to said side blocks and horizontally adjustable in longitudinal direction.

8. The IC package feeder as claimed in claim 7, wherein said cover comprises two longitudinal slots arranged in parallel near two opposite lateral sides thereof, and two screws respectively inserted through said longitudinal slots threaded into the topmost edges of said side blocks.

9. The IC package feeder as claimed in claim 1, wherein said cover is a transparent plate.

10. The IC package feeder as claimed in claim 1, further comprising sideboards bilaterally fastened to a rear side of said platform and arranged in parallel, said sideboards each having a plurality of vertical slots, a plurality of transverse rods connected between said sideboards, and a plurality of screws respectively inserted through the vertical slots of said sideboards and threaded into two opposite ends of each of said transverse rods to vertically adjustably secure said transverse rods to said sideboards in horizontal at different elevations.

11. The IC package feeder as claimed in claim 10, wherein said transverse rods each have a plurality of protruding flanges respectively disposed at a left side corresponding to the imaginary lines longitudinally extended from said material delivery tube passages.

12. The IC package feeder as claimed in claim 1, further comprising a plurality of photosensitive switches respectively disposed at a front side of each of said IC package passages.