US20030058616A1 - Method and apparatus for removing heat from a component - Google Patents
Method and apparatus for removing heat from a component Download PDFInfo
- Publication number
- US20030058616A1 US20030058616A1 US09/960,017 US96001701A US2003058616A1 US 20030058616 A1 US20030058616 A1 US 20030058616A1 US 96001701 A US96001701 A US 96001701A US 2003058616 A1 US2003058616 A1 US 2003058616A1
- Authority
- US
- United States
- Prior art keywords
- heat
- removal device
- heat removal
- electronics module
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 238000000151 deposition Methods 0.000 claims abstract 3
- 238000001816 cooling Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- One common cooling scheme consists of a heat sink located within an electronics enclosure, mounted separately from any particular electronics board, that conducts heat away from a series of components or electronics modules, usually with the assistance of one or more fans. Another common scheme is placing a heat sink directly on top of an electronic component. These common cooling schemes require a larger electronic assembly in order to accommodate additional heat transfer devices. In cases where heat removal is not directed at a specific component, the cooling capacity of the overall system must be increased, thereby increasing the cost and decreasing the efficiency of the cooling system.
- FIG. 1 is an isometric of an electronic module
- FIG. 2 is an isometric of an electronics module according to an embodiment of the invention.
- FIG. 3 is an isometric of an electronics module according to another embodiment of the invention.
- FIG. 4 is an isometric of an electronics module according to a further embodiment of the invention.
- FIG. 5 is a flow chart of an embodiment of the invention.
- Coupled and “connected,” along with their derivatives, may be used. It should be understood that these terms are not intended as synonyms for each other. Rather, in particular embodiments, “connected” may be used to indicate that two or more elements are in direct physical or electrical contact. However, “coupled” may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
- a common feature in electronic modules is to have configurable Input/Output (IO) modules where a user can add or remove functionality to the module by the choice of the IO module. Examples include add on cards for a computers, etc. In certain situations where the amount of heat generated by the electronics exceeds the electronics module's capabilities to remove the heat, additional heat removal relief can be obtained by using an IO module designed specifically to remove a portion of the heat, without increasing the overall size of the electronic module.
- IO Input/Output
- FIG. 1 is an isometric of an electronics module 100 .
- electronics module 100 can include a board 103 , such as a motherboard, removable circuit board, and the like, which couples to and operates with a computer or other electronic device (not shown for clarity).
- components 102 can be a processor, application specific integrated circuit (ASIC) random access memory (RAM), and the like.
- ASIC application specific integrated circuit
- RAM random access memory
- Component 102 like other electrical devices, consume electrical power and dissipate much of the power as heat. Higher circuit densities and higher operating speeds cause component 102 to consume greater amounts of power and dissipate greater amounts of heat.
- electronics module 100 includes a host board 103 having a front panel 130 and a surface 104 .
- One or more components 102 are located on surface 104 of electronics module 100 .
- Electronics module 100 may also include one or more mezzanine cards 106 and mezzanine card sites 107 . In general, mezzanine cards are deployed on a variety of electronics modules 100 to provide front panel input/output (I/O), additional functionality, and the like.
- an exemplary embodiment may be a common mezzanine card (CMC) and CMC site as specified and set forth in the Institute of Electrical and Electronics Engineers (IEEE) standard P1386, which is herein incorporated herein by reference.
- CMC common mezzanine card
- IEEE Institute of Electrical and Electronics Engineers
- a particular example of an embodiment is a peripheral component interconnect (PCI) mezzanine card, also known as a PMC.
- PCI peripheral component interconnect
- the mezzanine card, which fits into the PMC site, is known as a PMC module.
- the parameters and specifications of a PMC module and a PMC module site including physical dimensions, number of connectors, location of connectors, electrical specifications, and the like, are also specified in IEEE standard P1386.
- FIG. 2 is an isometric of an electronics module 100 according to an embodiment of the invention.
- a heat removal device 108 is mounted to electronics module 100 .
- Heat removal device 108 is mounted to electronics module 100 at radial distance 110 from component 102 and substantially in the same plane as component 102 .
- heat removal device 108 is configured to (1) fasten to mezzanine card 106 of electronics module 100 , (2) fasten to a mezzanine card site 107 , or (3) occupy the physical space envelope of the mezzanine card.
- mezzanine card site 107 is a CMC site, in which a CMC module is designed to occupy as defined by IEEE standard P1386.
- heat removal device 108 is receives heat (Q) 118 from component 102 via heat conductor 112 .
- a first portion 115 of heat conductor 112 is coupled to component 102 while a second portion 117 of heat conductor 112 is coupled to heat removal device 108 .
- First portion 115 of heat conductor 112 comprises any surface area of heat conductor 112 proximate to the actual first end 114 of heat conductor 112 .
- Second portion 117 of heat conductor 112 comprises any surface area of heat conductor 112 proximate to the actual second end 116 of heat conductor 112 .
- first portion 115 and second portion 117 that must be coupled to or connected to component 102 and heat removal device 108 depends on the amount of heat (Q) 118 to be removed and can be readily determined by one of ordinary skill in the art.
- heat conductor has an approximately square cross-section and is connected to component only along one side of heat conductor 112 . Any cross-section, shape, size and dimension of heat conductor 112 is within the scope of the invention.
- the heat conductor 112 depicted in FIG. 2 is only an example and not meant to be limiting of the invention. Heat conductor 112 may comprise any means, material, apparatus, device, and the like, that conducts heat (Q) 118 .
- An exemplary heat conductor 112 may be made of aluminum, copper, or other conventional heat conducting material.
- heat conductor 112 can be a heat pipe, for example, a hollow structure with liquid, such as water, flowing through the structure in order to transfer heat (Q) 118 .
- Heat removal device 108 is depicted in FIG. 2 as a heat sink, which is not meant to be limiting of the invention.
- heat removal device 108 may be any means, material, apparatus, device, and the like that is capable of receiving heat from component 102 .
- heat removal device 108 may be a standard heat sink made of a heat conducting material, for example, copper, aluminum, and the like.
- heat removal device 108 may be one or more fans, a heat chimney, and the like.
- heat removal device 108 may be a thermoelectric cooler (TEC), which may include one or more solid-state heat pumps that utilize the Peltier effect. During operation, DC current flows through the TEC causing heat to be transferred from one side of the TEC to the other, creating a cold and hot side.
- TEC thermoelectric cooler
- FIG. 3 is an isometric of an electronics module 100 according to another embodiment of the invention.
- a second heat removal device 120 is coupled to component 102 (not shown).
- second heat removal device 120 can be the same or a different type of heat removal device as discussed above.
- a portion of heat 118 can be removed by second heat removal device 120 , with the remainder of heat 118 being received by heat removal device 108 via heat conductor 112 .
- second heat removal device 120 can act as heat conductor 112 with heat 118 being conducted by second heat removal device 120 to heat removal device 108 .
- FIG. 4 is an isometric of an electronics module 100 according to a further embodiment of the invention.
- a heat rejection device 122 may optionally be coupled to heat removal device 108 .
- heat from component 102 is received by heat removal device 108 with a portion of heat (Q) 126 dissipated by heat rejection device 122 .
- Q heat
- all of heat 118 or a portion of heat is rejected by heat rejection device 122 after passing through heat removal device 108 .
- heat rejection device 122 may be one or more fans, a heat sink, heat pipe, heat chimney, piezoelectric cooler, and the like.
- Heat rejection device 122 is shown coupled to heat removal device 108 , and such assembly is mounted on mezzanine card 106 , fastened in a mezzanine card site 107 or configured to occupy the physical space envelope of mezzanine card 106 .
- FIG. 5 is a flow chart 500 of an embodiment of the invention.
- heat removal device 108 is configured to fasten to mezzanine card 106 on electronics module 100 , fasten to mezzanine card site 107 or is configured to occupy to the physical space envelope of mezzanine card 106 .
- heat removal device 108 is configured to fasten to a CMC site or occupy CMC physical space envelope, and in a particularly preferred embodiment, heat removal device is configured to fasten to a PMC module site on electronics module 100 .
- step 504 component 102 generates heat.
- heat 118 is conveyed from component 102 to heat removal device 108 .
- heat 118 is conveyed via heat conductor 112 .
- step 508 heat 118 is deposited to heat removal device 108 mounted to electronics module 100 .
- heat 118 is received by heat removal device 108 .
- step 510 an optional heat rejection device 122 removes heat from heat removal device 108 .
- heat rejection device 122 removes a portion of heat 126 .
- heat rejection device 122 removes all of heat 118 .
- the method of the invention is repeated per the return arrow in FIG. 5.
- the apparatus and method of the invention have the advantage of allowing additional heat removal means within the confines of an electronics enclosure that is directed specifically at one or more components.
- the invention also has the advantage of being configured to fasten within an existing mezzanine card physical space envelope.
- Yet another advantage of the invention is the ability to reduce the main cooling system in an electronics enclosure thereby increasing efficiency and reducing overall cooling costs.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
- The heat generated by electronic components/assemblies during operation must be removed to prevent overheating and failure. Many methods exist to achieve this such as conduction, natural convection, forced convection, and radiation. Heat removal devices used specifically for electronic cooling include fans, heat sinks, thermo-electric coolers, phase change materials, liquids, etc. Two opposing trends are making the cooling problem more difficult. First, the increase in performance of electronics components/assemblies has resulted in an increase in the amount of heat generated. Second, the demand for additional electronic functionality in either the same physical size or a smaller size has resulted in less available space for heat removal devices.
- One common cooling scheme consists of a heat sink located within an electronics enclosure, mounted separately from any particular electronics board, that conducts heat away from a series of components or electronics modules, usually with the assistance of one or more fans. Another common scheme is placing a heat sink directly on top of an electronic component. These common cooling schemes require a larger electronic assembly in order to accommodate additional heat transfer devices. In cases where heat removal is not directed at a specific component, the cooling capacity of the overall system must be increased, thereby increasing the cost and decreasing the efficiency of the cooling system.
- Accordingly, there is a significant need for an apparatus and method of providing cooling to electronic components that overcome the deficiencies of the prior art outlined above.
- Referring to the drawing:
- FIG. 1 is an isometric of an electronic module;
- FIG. 2 is an isometric of an electronics module according to an embodiment of the invention;
- FIG. 3 is an isometric of an electronics module according to another embodiment of the invention;
- FIG. 4 is an isometric of an electronics module according to a further embodiment of the invention; and
- FIG. 5 is a flow chart of an embodiment of the invention.
- It will be appreciated that for simplicity and clarity of illustration, elements shown in the drawing have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to each other. Further, where considered appropriate, reference numerals have been repeated among the Figures to indicate corresponding elements.
- In the following detailed description of exemplary embodiments of the invention, reference is made to the accompanying drawings (where like numbers represent like elements), which form a part hereof, and in which is shown by way of illustration specific exemplary embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, but other embodiments may be utilized and logical, mechanical, electrical and other changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims.
- In the following description, numerous specific details are set forth to provide a thorough understanding of the invention. However, it is understood that the invention may be practiced without these specific details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the invention.
- In the following description and claims, the terms “coupled” and “connected,” along with their derivatives, may be used. It should be understood that these terms are not intended as synonyms for each other. Rather, in particular embodiments, “connected” may be used to indicate that two or more elements are in direct physical or electrical contact. However, “coupled” may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
- A common feature in electronic modules is to have configurable Input/Output (IO) modules where a user can add or remove functionality to the module by the choice of the IO module. Examples include add on cards for a computers, etc. In certain situations where the amount of heat generated by the electronics exceeds the electronics module's capabilities to remove the heat, additional heat removal relief can be obtained by using an IO module designed specifically to remove a portion of the heat, without increasing the overall size of the electronic module.
- FIG. 1 is an isometric of an
electronics module 100. As shown in FIG. 1,electronics module 100 can include aboard 103, such as a motherboard, removable circuit board, and the like, which couples to and operates with a computer or other electronic device (not shown for clarity). Included onelectronics module 100 are one ormore components 102. In an embodiment of the invention,component 102 can be a processor, application specific integrated circuit (ASIC) random access memory (RAM), and the like.Component 102, like other electrical devices, consume electrical power and dissipate much of the power as heat. Higher circuit densities and higher operating speeds causecomponent 102 to consume greater amounts of power and dissipate greater amounts of heat. - In the embodiment shown in FIG. 1,
electronics module 100 includes ahost board 103 having afront panel 130 and asurface 104. One ormore components 102 are located onsurface 104 ofelectronics module 100. Although the invention is applicable to one or more components, only onecomponent 102 will be used as an exemplary embodiment of the invention.Electronics module 100 may also include one ormore mezzanine cards 106 andmezzanine card sites 107. In general, mezzanine cards are deployed on a variety ofelectronics modules 100 to provide front panel input/output (I/O), additional functionality, and the like. Although any type ofmezzanine card 106 andmezzanine card site 107 is within the scope of the invention, an exemplary embodiment may be a common mezzanine card (CMC) and CMC site as specified and set forth in the Institute of Electrical and Electronics Engineers (IEEE) standard P1386, which is herein incorporated herein by reference. A particular example of an embodiment is a peripheral component interconnect (PCI) mezzanine card, also known as a PMC. The mezzanine card, which fits into the PMC site, is known as a PMC module. The parameters and specifications of a PMC module and a PMC module site, including physical dimensions, number of connectors, location of connectors, electrical specifications, and the like, are also specified in IEEE standard P1386. - FIG. 2 is an isometric of an
electronics module 100 according to an embodiment of the invention. As shown in FIG. 2, aheat removal device 108 is mounted toelectronics module 100.Heat removal device 108 is mounted toelectronics module 100 atradial distance 110 fromcomponent 102 and substantially in the same plane ascomponent 102. In an exemplary embodiment of the invention,heat removal device 108 is configured to (1) fasten tomezzanine card 106 ofelectronics module 100, (2) fasten to amezzanine card site 107, or (3) occupy the physical space envelope of the mezzanine card. In a preferred embodimentmezzanine card site 107 is a CMC site, in which a CMC module is designed to occupy as defined by IEEE standard P1386. - In the embodiment shown in FIG. 2,
heat removal device 108 is receives heat (Q) 118 fromcomponent 102 viaheat conductor 112. Afirst portion 115 ofheat conductor 112 is coupled tocomponent 102 while asecond portion 117 ofheat conductor 112 is coupled toheat removal device 108.First portion 115 ofheat conductor 112 comprises any surface area ofheat conductor 112 proximate to the actualfirst end 114 ofheat conductor 112.Second portion 117 ofheat conductor 112 comprises any surface area ofheat conductor 112 proximate to the actualsecond end 116 ofheat conductor 112. The actual amount offirst portion 115 andsecond portion 117 that must be coupled to or connected tocomponent 102 andheat removal device 108, respectively, depends on the amount of heat (Q) 118 to be removed and can be readily determined by one of ordinary skill in the art. In the exemplary embodiment depicted in FIG. 2, heat conductor has an approximately square cross-section and is connected to component only along one side ofheat conductor 112. Any cross-section, shape, size and dimension ofheat conductor 112 is within the scope of the invention. Theheat conductor 112 depicted in FIG. 2 is only an example and not meant to be limiting of the invention.Heat conductor 112 may comprise any means, material, apparatus, device, and the like, that conducts heat (Q) 118. Anexemplary heat conductor 112 may be made of aluminum, copper, or other conventional heat conducting material. In another embodiment,heat conductor 112 can be a heat pipe, for example, a hollow structure with liquid, such as water, flowing through the structure in order to transfer heat (Q) 118. -
Heat removal device 108 is depicted in FIG. 2 as a heat sink, which is not meant to be limiting of the invention. For example,heat removal device 108 may be any means, material, apparatus, device, and the like that is capable of receiving heat fromcomponent 102. In an exemplary embodiment of the invention,heat removal device 108 may be a standard heat sink made of a heat conducting material, for example, copper, aluminum, and the like. In another embodiment,heat removal device 108 may be one or more fans, a heat chimney, and the like. In still another embodiment,heat removal device 108 may be a thermoelectric cooler (TEC), which may include one or more solid-state heat pumps that utilize the Peltier effect. During operation, DC current flows through the TEC causing heat to be transferred from one side of the TEC to the other, creating a cold and hot side. - FIG. 3 is an isometric of an
electronics module 100 according to another embodiment of the invention. As shown in FIG. 3, a second heat removal device 120 is coupled to component 102 (not shown). In the present embodiment, second heat removal device 120 can be the same or a different type of heat removal device as discussed above. A portion ofheat 118 can be removed by second heat removal device 120, with the remainder ofheat 118 being received byheat removal device 108 viaheat conductor 112. In another embodiment, second heat removal device 120 can act asheat conductor 112 withheat 118 being conducted by second heat removal device 120 to heatremoval device 108. - FIG. 4 is an isometric of an
electronics module 100 according to a further embodiment of the invention. As shown in FIG. 4, aheat rejection device 122 may optionally be coupled toheat removal device 108. In this embodiment, heat fromcomponent 102 is received byheat removal device 108 with a portion of heat (Q) 126 dissipated byheat rejection device 122. In another embodiment, all ofheat 118 or a portion of heat is rejected byheat rejection device 122 after passing throughheat removal device 108. In the present embodiment,heat rejection device 122 may be one or more fans, a heat sink, heat pipe, heat chimney, piezoelectric cooler, and the like.Heat rejection device 122 is shown coupled toheat removal device 108, and such assembly is mounted onmezzanine card 106, fastened in amezzanine card site 107 or configured to occupy the physical space envelope ofmezzanine card 106. - FIG. 5 is a
flow chart 500 of an embodiment of the invention. Instep 502,heat removal device 108 is configured to fasten tomezzanine card 106 onelectronics module 100, fasten tomezzanine card site 107 or is configured to occupy to the physical space envelope ofmezzanine card 106. In a preferred embodiment,heat removal device 108 is configured to fasten to a CMC site or occupy CMC physical space envelope, and in a particularly preferred embodiment, heat removal device is configured to fasten to a PMC module site onelectronics module 100. - In
step 504,component 102 generates heat. Instep 506,heat 118 is conveyed fromcomponent 102 to heatremoval device 108. In one embodiment,heat 118 is conveyed viaheat conductor 112. Instep 508,heat 118 is deposited to heatremoval device 108 mounted toelectronics module 100. In an embodiment,heat 118 is received byheat removal device 108. Instep 510, an optionalheat rejection device 122 removes heat fromheat removal device 108. In one embodiment,heat rejection device 122 removes a portion ofheat 126. In another embodiment,heat rejection device 122 removes all ofheat 118. The method of the invention is repeated per the return arrow in FIG. 5. - The apparatus and method of the invention have the advantage of allowing additional heat removal means within the confines of an electronics enclosure that is directed specifically at one or more components. The invention also has the advantage of being configured to fasten within an existing mezzanine card physical space envelope. Yet another advantage of the invention is the ability to reduce the main cooling system in an electronics enclosure thereby increasing efficiency and reducing overall cooling costs.
- While we have shown and described specific embodiments of the present invention, further modifications and improvements will occur to those skilled in the art. It is therefore, to be understood that appended claims are intended to cover all such modifications and changes as fall within the true spirit and scope of the invention.
Claims (24)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/960,017 US6538884B1 (en) | 2001-09-21 | 2001-09-21 | Method and apparatus for removing heat from a component |
CA002399898A CA2399898A1 (en) | 2001-09-21 | 2002-08-27 | Method and apparatus for removing heat from a component |
DE60216033T DE60216033T2 (en) | 2001-09-21 | 2002-09-02 | Method and device for cooling a component |
AT02019564T ATE345664T1 (en) | 2001-09-21 | 2002-09-02 | METHOD AND DEVICE FOR COOLING A COMPONENT |
EP02019564A EP1303174B1 (en) | 2001-09-21 | 2002-09-02 | Method and apparatus for removing heat from a component |
JP2002271249A JP4206435B2 (en) | 2001-09-21 | 2002-09-18 | Method and apparatus for removing heat from components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/960,017 US6538884B1 (en) | 2001-09-21 | 2001-09-21 | Method and apparatus for removing heat from a component |
Publications (2)
Publication Number | Publication Date |
---|---|
US6538884B1 US6538884B1 (en) | 2003-03-25 |
US20030058616A1 true US20030058616A1 (en) | 2003-03-27 |
Family
ID=25502690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/960,017 Expired - Lifetime US6538884B1 (en) | 2001-09-21 | 2001-09-21 | Method and apparatus for removing heat from a component |
Country Status (6)
Country | Link |
---|---|
US (1) | US6538884B1 (en) |
EP (1) | EP1303174B1 (en) |
JP (1) | JP4206435B2 (en) |
AT (1) | ATE345664T1 (en) |
CA (1) | CA2399898A1 (en) |
DE (1) | DE60216033T2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040008487A1 (en) * | 2002-07-12 | 2004-01-15 | Kabushiki Kaisha Toshiba | Cooling device for electronic element producing concentrated heat and electronic device |
EP1998382A1 (en) * | 2007-06-01 | 2008-12-03 | Foxsemicon Integrated Technology, Inc. | Light source module |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6721182B1 (en) * | 2002-10-10 | 2004-04-13 | Harris Corporation | Circuit card module including mezzanine card heat sink and related methods |
US6768642B2 (en) * | 2002-12-16 | 2004-07-27 | Lockheed Martin Corporation | VME circuit host card with triple mezzanine configuration |
TW200537279A (en) * | 2004-05-13 | 2005-11-16 | Mitac Technology Corp | Heat sink module having heat conduction cover plate |
US7369412B2 (en) * | 2006-05-02 | 2008-05-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7391610B2 (en) * | 2006-09-29 | 2008-06-24 | Rockwell Automation Technologies, Inc. | Thermal cooling of industrial electronic module by conductive structure |
US7444209B2 (en) * | 2006-10-26 | 2008-10-28 | Honeywell International Inc. | Miniature cooling device |
TW200910070A (en) * | 2007-08-28 | 2009-03-01 | Inventec Corp | Heat dissipation module |
US20090323286A1 (en) * | 2008-06-13 | 2009-12-31 | Evga Corporation | Apparatus for removing heat from pc circuit board devices such as graphics cards and the like |
TWI476575B (en) * | 2012-05-04 | 2015-03-11 | Inventec Corp | Electronic device and heat dissipation structure |
US9013874B2 (en) * | 2012-09-12 | 2015-04-21 | Sk Hynix Memory Solutions Inc. | Heat dissipation device |
US9497888B2 (en) | 2013-02-27 | 2016-11-15 | International Business Machines Corporation | Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) |
JP6456891B2 (en) * | 2016-09-23 | 2019-01-23 | レノボ・シンガポール・プライベート・リミテッド | Electronics |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0231456B1 (en) * | 1985-12-13 | 1991-06-26 | Ascom Hasler AG | Process and device for the transfer of waste heat by at least one element of an electrical assembly |
US4931904A (en) | 1989-05-30 | 1990-06-05 | Motorola, Inc. | Localized circuit card cooling device |
JPH0629683A (en) * | 1992-03-31 | 1994-02-04 | Furukawa Electric Co Ltd:The | Heat pipe type heat dissipation unit for electronic apparatus |
US5343940A (en) * | 1992-10-29 | 1994-09-06 | Amigo Jean | Flexible heat transfer device |
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US5472043A (en) * | 1994-03-22 | 1995-12-05 | Aavid Laboratories, Inc. | Two-phase component cooler with radioactive initiator |
US5613906A (en) | 1995-07-20 | 1997-03-25 | Elonex I.P. Holdings, Ltd. | Method and apparatus for waste heat removal from a computer enclosure |
US5986887A (en) | 1998-10-28 | 1999-11-16 | Unisys Corporation | Stacked circuit board assembly adapted for heat dissipation |
US6246582B1 (en) * | 1998-12-30 | 2001-06-12 | Honeywell Inc. | Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module |
TW448711B (en) * | 1999-07-22 | 2001-08-01 | Foxconn Prec Components Co Ltd | Heat dissipation device |
US6407916B1 (en) * | 2000-06-12 | 2002-06-18 | Intel Corporation | Computer assembly for cooling high powered microprocessors |
US6377459B1 (en) * | 2000-08-04 | 2002-04-23 | Sun Microsystems, Inc. | Chip cooling management |
-
2001
- 2001-09-21 US US09/960,017 patent/US6538884B1/en not_active Expired - Lifetime
-
2002
- 2002-08-27 CA CA002399898A patent/CA2399898A1/en not_active Abandoned
- 2002-09-02 AT AT02019564T patent/ATE345664T1/en not_active IP Right Cessation
- 2002-09-02 DE DE60216033T patent/DE60216033T2/en not_active Expired - Lifetime
- 2002-09-02 EP EP02019564A patent/EP1303174B1/en not_active Expired - Lifetime
- 2002-09-18 JP JP2002271249A patent/JP4206435B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040008487A1 (en) * | 2002-07-12 | 2004-01-15 | Kabushiki Kaisha Toshiba | Cooling device for electronic element producing concentrated heat and electronic device |
US7113399B2 (en) * | 2002-07-12 | 2006-09-26 | Kabushiki Kaisha Toshiba | Cooling device for electronic element producing concentrated heat and electronic device |
EP1998382A1 (en) * | 2007-06-01 | 2008-12-03 | Foxsemicon Integrated Technology, Inc. | Light source module |
Also Published As
Publication number | Publication date |
---|---|
EP1303174B1 (en) | 2006-11-15 |
US6538884B1 (en) | 2003-03-25 |
JP4206435B2 (en) | 2009-01-14 |
ATE345664T1 (en) | 2006-12-15 |
DE60216033D1 (en) | 2006-12-28 |
EP1303174A2 (en) | 2003-04-16 |
DE60216033T2 (en) | 2007-06-21 |
CA2399898A1 (en) | 2003-03-21 |
EP1303174A3 (en) | 2005-01-12 |
JP2003179372A (en) | 2003-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6538884B1 (en) | Method and apparatus for removing heat from a component | |
US7400505B2 (en) | Hybrid cooling system and method for a multi-component electronics system | |
US7715194B2 (en) | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers | |
US7639498B2 (en) | Conductive heat transport cooling system and method for a multi-component electronics system | |
US8474275B2 (en) | Modular absorption heat sink devices for passive cooling of servers and other electronics | |
US7012807B2 (en) | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack | |
US5933323A (en) | Electronic component lid that provides improved thermal dissipation | |
TWI308049B (en) | Systems to cool multiple electrical components | |
US5859763A (en) | Multi chip module cooling apparatus | |
US6201695B1 (en) | Heat sink for chip stacking applications | |
CN112369131B (en) | Cooling electronic equipment in a data center | |
US20070291452A1 (en) | Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack | |
US6459576B1 (en) | Fan based heat exchanger | |
US20060203451A1 (en) | Heat dissipation apparatus with second degree curve shape heat pipe | |
US8111516B2 (en) | Housing used as heat collector | |
EP3573438B1 (en) | Remote heat exchanger | |
US7554808B2 (en) | Heat sink with thermoelectric module | |
US10874034B1 (en) | Pump driven liquid cooling module with tower fins | |
US20080218964A1 (en) | Desktop personal computer and thermal module thereof | |
US7071552B2 (en) | IC die with directly bonded liquid cooling device | |
US20210084793A1 (en) | Cooling chassis design for server liquid cooling of electronic racks of a data center | |
US20050199377A1 (en) | Heat dissipation module with heat pipes | |
CN210119733U (en) | Domestic server and domestic server mainboard module | |
CN219305107U (en) | High-precision PCB (printed circuit board) metalized half-hole circuit board structure | |
CN110895428A (en) | Domestic server and domestic server mainboard module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MOTOROLA, INC., ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WONG, HENRY;BERTRAM, THOMAS J.;REEL/FRAME:012206/0521 Effective date: 20010921 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
AS | Assignment |
Owner name: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MOTOROLA, INC.;REEL/FRAME:020540/0714 Effective date: 20071231 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., A Free format text: SECURITY AGREEMENT;ASSIGNORS:ARTESYN TECHNOLOGIES, INC.;ARTESYN NORTH AMERICA LLC;EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.;REEL/FRAME:031719/0417 Effective date: 20131122 Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE, FLORIDA Free format text: SECURITY AGREEMENT;ASSIGNORS:ARTESYN TECHNOLOGIES, INC.;ARTESYN NORTH AMERICA LLC;EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.;REEL/FRAME:031719/0417 Effective date: 20131122 |
|
AS | Assignment |
Owner name: BANK OF AMERICA, N.A., AS COLLATERAL AGENT, CALIFORNIA Free format text: SECURITY AGREEMENT;ASSIGNORS:ARTESYN TECHNOLOGIES, INC.;ARTESYN NORTH AMERICA LLC;EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.;REEL/FRAME:031731/0048 Effective date: 20131122 Owner name: BANK OF AMERICA, N.A., AS COLLATERAL AGENT, CALIFO Free format text: SECURITY AGREEMENT;ASSIGNORS:ARTESYN TECHNOLOGIES, INC.;ARTESYN NORTH AMERICA LLC;EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.;REEL/FRAME:031731/0048 Effective date: 20131122 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NE Free format text: PARTIAL RELEASE OF SECURITY INTEREST;ASSIGNOR:BANK OF AMERICA, N.A.;REEL/FRAME:049694/0096 Effective date: 20190708 Owner name: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.), ARIZONA Free format text: PARTIAL RELEASE OF SECURITY INTEREST;ASSIGNOR:BANK OF AMERICA, N.A.;REEL/FRAME:049694/0096 Effective date: 20190708 |
|
AS | Assignment |
Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., F Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.);REEL/FRAME:049698/0222 Effective date: 20190708 Owner name: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., FLORIDA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.);REEL/FRAME:049698/0222 Effective date: 20190708 |
|
AS | Assignment |
Owner name: ARTESYN EMBEDDED COMPUTING, INC., ARIZONA Free format text: CHANGE OF NAME;ASSIGNOR:EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.;REEL/FRAME:052978/0634 Effective date: 20140305 |
|
AS | Assignment |
Owner name: SMART EMBEDDED COMPUTING, INC., ARIZONA Free format text: CHANGE OF NAME;ASSIGNOR:ARTESYN EMBEDDED COMPUTING, INC.;REEL/FRAME:053023/0953 Effective date: 20190826 |