CN110895428A

CN110895428A - Domestic server and domestic server mainboard module

Info

Publication number: CN110895428A
Application number: CN201910460599.XA
Authority: CN
Inventors: 史洪波; 郭煜
Original assignee: EVOC Intelligent Technology Co Ltd
Current assignee: Shenzhen Yiyike Data Equipment Technology Co ltd
Priority date: 2019-05-30
Filing date: 2019-05-30
Publication date: 2020-03-20

Abstract

The invention relates to a domestic server and a domestic server mainboard module, wherein the domestic server mainboard module comprises: the mainboard unit comprises a mainboard, a central processing unit and a higher device, wherein the central processing unit and the higher device are arranged on the same side of the mainboard; the radiator is stacked on the mainboard unit, the heat transfer surface of the radiator facing the mainboard unit is contacted with the central processing unit, and the heat transfer surface is provided with a position avoiding groove corresponding to a higher device. Therefore, the heat transfer surface of the radiator facing the mainboard unit is contacted with the central processing unit, and the heat generated by the central processing unit is transferred to the radiator through the heat dissipation surface, so that the heat dissipation effect of the central processing unit which generates more heat is ensured. And, accomodate the part that higher device exceeds central processing unit through keeping away a recess, can reduce the distance between radiator and the mainboard, and then reduce domestic server mainboard module's height, make domestic server mainboard module accord with the installation demand in small-size space.

Description

Domestic server and domestic server mainboard module

Technical Field

The invention relates to the technical field of computers, in particular to a domestic server and a domestic server mainboard module.

Background

Servers, also known as servers, are devices that provide computing services. A server typically includes a processor, a hard disk, a memory, a system bus, etc., and typically has a high computing power and is capable of being provided to a plurality of users. Further, as home chips are increasingly popularized, demands for home servers on which home chips are mounted are increasing.

In general, the size of the server has a standard specification, for example, 1U (1U — 1.75 inch — 4.445CM), 2U, 4U, or the like. The server is specified in size in order to keep the server in a proper size to be placed on an iron or aluminum rack, and the universality of the server is ensured. However, the height of the whole 1U server is small, the server belongs to a thin type of top-mounted server, the space inside a case is limited, and the size of a traditional server mainboard module is large, so that the mounting requirement of a small-size space cannot be met.

Disclosure of Invention

Based on this, it is necessary to provide a domestic server mainboard module that can satisfy the installation demand of small-size space to the problem that traditional server mainboard module can't satisfy the installation demand of small-size space.

The utility model provides a domestic server mainboard module, domestic server mainboard module includes:

the mainboard unit comprises a mainboard, a central processing unit and a higher device, wherein the central processing unit and the higher device are arranged on the same side of the mainboard, and the height of the higher device relative to the mainboard is larger than that of the central processing unit relative to the mainboard;

the radiator is stacked on the mainboard unit, the heat transfer surface of the radiator facing the mainboard unit is contacted with the central processing unit, and the heat transfer surface is provided with a position avoiding groove corresponding to the higher device.

In the domestic server mainboard module, the heat transfer surface of the radiator facing the mainboard unit is contacted with the central processing unit, and the heat generated by the central processing unit is transferred to the radiator through the heat dissipation surface, so that the heat dissipation effect of the central processing unit which generates more heat is ensured. And, the relative mainboard of higher device highly is greater than the height of the relative mainboard of central processing unit, and in order to avoid the heat transfer surface of radiator and lower central processing unit to contact the back, the radiator takes place to interfere with higher device, has seted up on the heat transfer surface and has kept away the position recess corresponding higher device, accomodates the part that higher device exceeds central processing unit through keeping away the position recess. So the distance between radiator and the mainboard is central processing unit's height only, and the height of higher device can reduce the distance between radiator and the mainboard, and then reduces the height of domestic server mainboard module, makes domestic server mainboard module can assemble in the quick-witted incasement in little space, for example 1U server, makes domestic server mainboard module accord with the installation demand in little size space.

In one embodiment, the motherboard unit further includes a debugging pin disposed on the motherboard, the heat sink is provided with a position-avoiding notch corresponding to the debugging pin, and the position-avoiding notch penetrates through the heat sink in a direction from the motherboard unit to the heat sink.

In one embodiment, the heat sink includes a base plate and a heat dissipation fin, the heat dissipation fin is disposed on the base plate, the base plate is located between the main board unit and the heat dissipation fin, and a surface of the base plate facing away from the heat dissipation fin is the heat transfer surface.

In one embodiment, the heat sink further includes a first sleeve pillar disposed on the heat transfer surface, the first sleeve pillar being supported between the main plate and the substrate.

In one embodiment, the portable electronic device further includes a carrier board, the main board is disposed on the carrier board, a second sleeve column is disposed on a surface of the carrier board facing the main board unit, and the second sleeve column is supported between the carrier board and the main board.

In one embodiment, the radiator further comprises a fastener, the main board is provided with a mounting hole, the first sleeve column and the second sleeve column are respectively located on two axial sides of the mounting hole, and the fastener penetrates through the radiator, sequentially passes through the first sleeve column and the mounting hole, then extends into the second sleeve column, and is in threaded connection with the inner wall of the second sleeve column.

In one embodiment, the base plate is provided with a matching hole communicated with the inner hole of the first sleeve column, the matching hole allows the fastener to extend into the first sleeve after passing through, and the radiating fins are distributed on the base plate in all other areas avoiding the remaining matching hole.

In one embodiment, the heat sink further includes a centrifugal fan, the centrifugal fan is disposed on a side of the heat sink opposite to the main board unit, and an air inlet of the centrifugal fan faces the heat sink and drives air to flow through the heat sink.

A domestic server comprises a shell, the domestic server mainboard module and a system fan, wherein the domestic server mainboard module is arranged in the shell, the domestic server mainboard module further comprises a centrifugal fan, the centrifugal fan is arranged on one side, back to a mainboard unit, of a radiator, and an air inlet of the centrifugal fan faces the radiator;

the centrifugal fan drives the outside air to flow from the air inlet to the radiator; the system fan is arranged at the air outlet and drives the air flowing through the radiator to flow to the outside from the air outlet.

In one embodiment, the domestic server is 1U in size.

Drawings

FIG. 1 is a schematic structural diagram of a domestic server according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a partial structure of a motherboard module of the domestic server in the domestic server shown in FIG. 1;

FIG. 3 is a schematic structural diagram of a motherboard unit in the domestic server motherboard module shown in FIG. 2;

FIG. 4 is a schematic view of a view angle of a heat sink in the domestic server motherboard module shown in FIG. 2;

FIG. 5 is a schematic view of the heat sink shown in FIG. 3;

FIG. 6 is a schematic structural diagram of another part of the motherboard module of the domestic server in the domestic server shown in FIG. 1;

fig. 7 is a schematic structural diagram of a carrier board in the domestic server motherboard module shown in fig. 6;

FIG. 8 is a schematic cross-sectional view of the domestic server motherboard module shown in FIG. 6;

FIG. 9 is a schematic diagram of another partial structure of a motherboard module of the home server in the home server shown in FIG. 1;

FIG. 10 is a schematic structural diagram of a centrifugal fan in the motherboard module of the domestic server shown in FIG. 9;

fig. 11 is a schematic diagram of the flow of heat dissipation air of the domestic server shown in fig. 1.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, in an embodiment of the present invention, a home server 100 is provided, where the home server 100 includes a housing 10, and a home server motherboard module 30, a power module 50, and a hard disk 70 all disposed in the housing 10. The power module 50 supplies power to the domestic server 100 system, the hard disk 70 is used for storing information, and the domestic server motherboard module 30 is used for processing calculation data.

As shown in fig. 2-4, the domestic server motherboard module 30 includes a motherboard unit 32 and a heat sink 34, the motherboard unit 32 includes a motherboard 321, and a central processing unit 323 and a higher device 325 both disposed on the same side of the motherboard 321, and the higher device 325 is an auxiliary device and cooperates with the central processing unit 323 to process data. Optionally, the central processor 323 is a domestic processor, such as a megacore processor, a Feiteng processor, or the like.

The heat sink 34 is stacked on the main board unit 32, and heat generated by the main board unit 32 can be transferred to the heat sink 34, and the heat of the main board unit 32 is taken away by the heat sink 34 to dissipate heat of the main board unit 32. The heat transfer surface 342 of the heat sink 34 facing the motherboard unit 32 contacts the cpu 323, and transfers heat generated by the cpu 323 to the heat sink 34 through the heat transfer surface, so as to ensure the heat dissipation effect of the cpu 323 generating more heat.

Moreover, the height of the higher device 325 relative to the main board 321 is greater than that of the cpu 323 relative to the main board 321, so as to avoid interference between the heat sink 34 and the higher device 325 after the heat transfer surface 342 of the heat sink 34 contacts the lower cpu 323, a avoiding groove 341 is formed in the heat transfer surface 342 corresponding to the higher device 325, and the avoiding groove 341 accommodates the part of the higher device 325 higher than the cpu 323. Thus, the distance between the heat sink 34 and the motherboard 321 is only the height of the central processing unit 323, not the height of the higher device 325, which can reduce the distance between the heat sink 34 and the motherboard 321, and further reduce the height of the domestic server motherboard module 30, so that the domestic server motherboard module 30 can be assembled in a small-space chassis, for example, a 1U processor, and the domestic server motherboard module 30 meets the installation requirement of a small-size space.

The main board unit 32 further includes a debug pin 327 disposed on the main board 321, and the debug pin 327 is used for plugging an external connector so as to electrically connect the external connector with a device in the main board unit 32. The heat sink 34 is provided with a position-avoiding notch 343 corresponding to the debug pin 327, and the position-avoiding notch 343 penetrates the heat sink 34 in a direction from the motherboard unit 32 to the heat sink 34, so that the external connector is inserted and matched with the debug pin 327 through the position-avoiding notch 343 from above the heat sink 34. In the present embodiment, the avoiding groove 341 corresponding to the higher device 325 on the heat sink 34 is not disposed through the heat sink 34 in the direction from the main board unit 32 to the heat sink 34, so that the heat transfer of the heat sink 34 is continuous.

As shown in fig. 2 and 5, the heat sink 34 includes a base plate 344 and heat dissipation fins 346, the heat dissipation fins 346 are disposed on the base plate 344, the base plate 344 is located between the main plate unit 32 and the heat dissipation fins 346, a surface of the base plate 344 facing away from the heat dissipation fins 346 is a heat transfer surface 342, the base plate 344 is in stacked contact with the main plate unit 32 through the heat transfer surface 342, and the heat dissipation fins 346 dissipate heat transferred from the base plate 344 to the ambient air.

The heat sink 34 further includes a first sleeve pillar 345 disposed on the heat transfer surface 342, the first sleeve pillar 345 is supported between the main board 321 and the substrate 344, and the substrate 344 is supported by the first sleeve pillar 345, so as to prevent the substrate 344 from directly pressing the cpu 323 on the main board 321 and protect the components on the main board 321. Wherein the first sleeve posts 345 support the substrate 344 to share a portion of the weight of the heat sink 34, and the height of the first sleeve posts 345 can be set appropriately to allow the heat transfer surface 342 of the substrate 344 to just contact the cpu 323 directly.

As shown in fig. 6-8, the domestic server motherboard module 30 further includes a carrier 36, and the motherboard 321 is disposed on the carrier 36, and the motherboard unit 32 is mounted on the carrier 36. One surface of the carrier plate 36 facing the main board unit 32 is provided with a second sleeve column 361, the second sleeve column 361 is supported between the carrier plate 36 and the main board 321, the main board unit 32 is supported on the carrier plate 36 through the second sleeve column 361, a certain gap is reserved between the main board 321 and the carrier plate 36, and the heat dissipation effect of the main board 321 can be improved.

Further, the domestic server motherboard module 30 further includes a fastener 37, and the fastener 37 is connected to the carrier 36 after passing through the heat sink 34 and the motherboard 321, so as to fix the motherboard unit 32 and the heat sink 34 on the carrier 36. Specifically, the main plate 321 is provided with a mounting hole 322, the first sleeve column 345 and the second sleeve column 361 are respectively located at two axial sides of the mounting hole 322, and the fastener 37 passes through the heat sink 34, sequentially passes through the first sleeve column 345 and the mounting hole 322, then extends into the second sleeve column 361, and is in threaded connection with the inner wall of the second sleeve column 361. The first sleeve pillar 345 and the second sleeve pillar 361 are used not only for supporting but also for mounting the fastening member 37 to fix the heat sink 34, the main board unit 32 and the carrier board 36 through which the fastening member 37 passes by means of the screw connection of the fastening member 37 and the second sleeve pillar 361. Moreover, a nut matched with the fastener 37 is not needed to be arranged additionally, and the structure and the installation are simple.

As shown in fig. 5, further, the base plate 344 is provided with a fitting hole 347 communicating with the inner hole of the first sleeve pillar 345, the fitting hole 347 allows the fastener 37 to pass through and extend into the first sleeve pillar 345, and the remaining other area of the base plate 344 that avoids the fitting hole 347 is completely distributed with the heat dissipation fins 346. That is, a fitting hole 347 is opened in the base plate 344 of the heat sink 34 for fitting the fastener 37, and the heat dissipating fins 346 avoid the area where the fitting hole 347 is located, and the fastener 37 may protrude into the fitting hole 347 from the side of the base plate 344 where the heat dissipating fins 346 are located. In addition, the heat dissipation fins 346 are distributed on the other areas of the base plate 344 away from the matching holes 347, so that the distribution range of the heat dissipation fins 346 is large, and the heat dissipation effect is good. Optionally, the perimeter dimension of the base 344 coincides with the perimeter dimension of the main plate 321.

As shown in fig. 9-10, the domestic server motherboard module 30 further includes a centrifugal fan 38, the centrifugal fan 38 is disposed on a side of the heat sink 34 opposite to the motherboard unit 32, and an air inlet 381 of the centrifugal fan 38 faces the heat sink 34 and drives air to flow through the heat sink 34, so as to increase a flow speed of the air flowing through the heat sink 34 and improve a heat dissipation effect. The centrifugal fan 38 is directly disposed on the heat sink 34, and can gather more air to flow to the heat sink 34, and the air inlet 381 of the centrifugal fan 38 faces the heat sink 34, and drives the air to flow through the heat sink 34, enter the centrifugal fan 38, and be exhausted from the air outlet of the centrifugal fan 38. Furthermore, after the air inlet 381 of the centrifugal fan 38 faces the heat sink 34, the top surface of the centrifugal fan 38 opposite to the heat sink 34 is parallel to and infinitely close to the upper wall of the housing 10, so that the height space inside the domestic server 100 can be fully utilized. Specifically, the centrifugal fan 38 is disposed on the heat dissipating fins 346 of the heat sink 34, and can drive air to flow through the gaps between the heat dissipating fins 346.

As shown in fig. 11, the domestic server 100 further includes a system fan 80, the housing 10 is provided with an air inlet 12 and an air outlet 14, the centrifugal fan 38 drives the external air to flow from the air inlet 12 to the heat sink 34, the system fan 80 is provided at the air outlet 14 to drive the air flowing through the heat sink 34 to flow from the air outlet 14 to the outside, so that the external air flows into the housing 10 through the heat sink 34 by the two fans, and then the hot air is driven to flow to the outside, thereby achieving heat dissipation.

Specifically, from the perspective of the processor being mounted on the rack, the air inlets 12 are formed on the side walls of the left and right sides of the casing 10, the air outlet 14 is formed on the back plate of the casing 10, and air is discharged from the air outlet 14 of the back plate after flowing through the heat dissipation fins 346 of the heat sink 34 from the air inlets of the left and right sides.

Optionally, the domestic server 100 has a size of 1U, a compact structure, and a low height.

The invention also provides the domestic server mainboard module 30, the domestic server mainboard module 30 comprises a mainboard unit 32 and a radiator 34, the mainboard unit 32 comprises a mainboard 321, and a central processing unit 323 and a higher device 325 which are both arranged on the same side of the mainboard 321, and the higher device 325 is an auxiliary component and is matched with the central processing unit 323 to process data. The heat sink 34 is stacked on the main board unit 32, and heat generated by the main board unit 32 can be transferred to the heat sink 34, and the heat of the main board unit 32 is taken away by the heat sink 34 to dissipate heat of the main board unit 32. The heat transfer surface 342 of the heat sink 34 facing the motherboard unit 32 contacts the cpu 323, and transfers heat generated by the cpu 323 to the heat sink 34 through the heat transfer surface, so as to ensure the heat dissipation effect of the cpu 323 generating more heat.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a domestic server mainboard module which characterized in that, domestic server mainboard module includes:

2. The domestic server motherboard module as recited in claim 1, wherein said motherboard unit further comprises a debugging pin disposed on said motherboard, said heat sink is provided with a clearance gap corresponding to said debugging pin, said clearance gap penetrates said heat sink in a direction from said motherboard unit to said heat sink.

3. The domestic server motherboard module as claimed in claim 1, wherein said heat sink comprises a base plate and a heat sink fin, said heat sink fin is disposed on said base plate, said base plate is located between said motherboard unit and said heat sink fin, and a surface of said base plate facing away from said heat sink fin is said heat transfer surface.

4. The domestic server motherboard module as recited in claim 3, wherein said heat sink further comprises a first sleeve column disposed on said heat transfer surface, said first sleeve column being supported between said motherboard and said base plate.

5. The domestic server motherboard module as claimed in claim 4, further comprising a carrier board, wherein the motherboard is disposed on the carrier board, and a second sleeve column is disposed on a surface of the carrier board facing the motherboard unit, and the second sleeve column is supported between the carrier board and the motherboard.

6. The domestic server motherboard module as recited in claim 5, further comprising a fastener, wherein the motherboard is provided with a mounting hole, the first sleeve column and the second sleeve column are respectively located at two axial sides of the mounting hole, the fastener passes through the heat sink, and after passing through the first sleeve column and the mounting hole in sequence, the fastener extends into the second sleeve column and is in threaded connection with an inner wall of the second sleeve column.

7. The domestic server motherboard module as claimed in claim 6, wherein said base plate is provided with a mating hole communicating with the inner hole of said first sleeve post, said mating hole allows said fastener to extend into said first sleeve post after passing through, and said heat dissipating fins are distributed on all other areas of said base plate away from the rest of said mating hole.

8. The domestic server motherboard module as claimed in any one of claims 1 to 7, further comprising a centrifugal fan, wherein said centrifugal fan is disposed on a side of said heat sink opposite to said motherboard unit, and an air inlet of said centrifugal fan faces said heat sink and drives air to flow through said heat sink.

9. A domestic server, comprising a housing, a domestic server motherboard module as claimed in any one of claims 1 to 8, and a system fan, wherein the domestic server motherboard module is disposed in the housing, the domestic server motherboard module further comprises a centrifugal fan, the centrifugal fan is disposed on a side of the heat sink facing away from the motherboard unit, and an air inlet of the centrifugal fan faces the heat sink;

10. The domestic server according to claim 9, wherein the domestic server has a size specification of 1U.