US20020185746A1 - Ball grid array IC package and manufacturing method thereof - Google Patents
Ball grid array IC package and manufacturing method thereof Download PDFInfo
- Publication number
- US20020185746A1 US20020185746A1 US10/024,888 US2488801A US2002185746A1 US 20020185746 A1 US20020185746 A1 US 20020185746A1 US 2488801 A US2488801 A US 2488801A US 2002185746 A1 US2002185746 A1 US 2002185746A1
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- United States
- Prior art keywords
- grid array
- ball
- package
- semiconductor chip
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- 239000004065 semiconductor Substances 0.000 claims abstract description 63
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- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008859 change Effects 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims description 41
- 238000007669 thermal treatment Methods 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
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Definitions
- the present invention relates generally to a semiconductor or integrated circuit (IC) package and manufacturing method thereof, and more particularly, to a ball grid array package and manufacturing method thereof for providing an IC package in which leads comprising spherical conductive balls are changed into an hourglass type features.
- IC semiconductor or integrated circuit
- a ball grid array for an IC package uses conductive balls, such as solder balls and the like, which are arranged on a back surface of a substrate, to provide external leads.
- conductive balls such as solder balls and the like
- ball grid array packages provide a reduction in IC size, and further reduces the occurrence of lead deformation, unlike QFP (Quad Flat Package) packages.
- FIG. 1A illustrates a cross-sectional view of a ball grid array package according to a first embodiment of a conventional IC package
- FIG. 1B illustrates a cross-sectional view of a ball grid array package according to a second embodiment of a conventional IC package.
- ball grid array IC packages having the above-mentioned advantages are divided into two types, a vessel type having a ship feature shown in FIG. 1A, and an hourglass type having an hourglass feature shown in FIG. 1B, in accordance with conventional packages utilizing conductive balls 112 mounted on a substrate
- a ball grid array package manufactured as either a vessel or hourglass type undergoes a reliance test against heat at a temperature of 200 to 25° C.
- the conductive balls 114 of the vessel type ball grid package are metamorphosed from a spherical type into an elliptic type as shown in FIG. 1A. Stresses are generated from the interfaces among the conductive balls 114 , a print circuit board (PCB, hereinafter called substrate) 100 in contact with the conductive balls 114 , and the semiconductor chip 110 , which may result in formation of cracks in one or more of the contacting members.
- PCB print circuit board
- the present invention is directed to a ball grid array IC package and manufacturing method thereof that substantially obviates one or more of the problems resulting from the limitations and disadvantages of the related art.
- One object of the present invention is to provide a ball grid array package allowing metamorphosis of a conductive ball into an hourglass feature with ease by maintaining a uniform interval between a semiconductor chip and a substrate.
- Another object of the present invention is to provide a method of manufacturing a ball grid array package allowing the metamorphosis of a conductive ball into an hourglass feature with ease by utilizing a member that provides a uniform interval between a semiconductor chip and a substrate.
- ball grid array IC packages include a semiconductor chip having a plurality of chip pads, a substrate having ball lands, hourglass type conductive balls electrically connected to the chip pads and landed at the ball lands, respectively, and an interval maintaining member maintaining a uniform interval between the semiconductor chip and substrate.
- a method of manufacturing ball grid array IC packages includes the steps of providing a semiconductor chip having a plurality of chip pads, attaching spherical conductive balls and an expansive interval maintaining member on the chip pads, mounting the conductive balls on the ball lands, and expanding a volume of the interval maintaining member by carrying out thermal treatment on the resultant so as to change the spherical conductive balls into shapes including hourglass features.
- a method of manufacturing ball grid array IC packages includes the steps of providing a semiconductor chip having a plurality of chip pads, forming spherical conductive balls on the chip pads, forming ball lands and an expansive interval maintaining member on a substrate, mounting the conductive balls on the ball lands, and expanding a volume of the interval maintaining member by carrying out thermal treatment on the resultant structure so as to change the spherical conductive balls into shapes having hourglass features.
- FIG. 1A illustrates a cross-sectional view of a ball grid array IC package according to a first conventional embodiment found in the related art
- FIG. 1B illustrates a cross-sectional view of a ball grid array package according to a second conventional embodiment found in the related art
- FIG. 2 illustrates a cross-sectional view of a ball grid array package according to a first embodiment of the present invention
- FIGS. 3A to 3 D illustrate cross-sectional views showing the steps for manufacturing a ball grid array IC package according to a first embodiment of the present invention
- FIG. 4 illustrates a perspective view of a semiconductor chip having chip pads at a central part thereof according to a first embodiment of the present invent ion
- FIG. 5A and FIG. 5B illustrate the process steps of manufacturing a spherical polymer ball
- FIG. 6 illustrates a perspective view of a semiconductor chip having chip pads at a circumference thereof
- FIG. 7 illustrates a cross-sectional view taken approximately along a line VII-VII extending through the semiconductor chip of FIG. 6;
- FIG. 8 illustrates an exploded perspective view of a ball grid array IC package according to a second embodiment of the present invention
- FIG. 9 illustrates an exploded perspective view of a ball grid array IC package according to a third embodiment of the present invention.
- FIG. 10 illustrates a cross-sectional view of an assembled ball grid array IC package according to the third embodiment of the present invention.
- FIG. 11 illustrates an exploded perspective view of a ball grid array IC package according to a fourth embodiment of the present invention.
- FIGS. 2 to 7 illustrate a ball grid array IC package and manufacturing method thereof according to a first embodiment of the present invention.
- FIG. 2 illustrates a cross-sectional view of a ball grid array IC package according to a first embodiment of the present invention.
- FIGS. 3A to 3 D illustrate cross-sectional views of manufacturing a ball grid array IC package according to a first embodiment of the present invention.
- FIG. 4 illustrates a perspective view of a semiconductor chip having chip pads at a central part thereof according to a first embodiment of the present invention, and
- FIGS. 5A and 5B illustrate a process of manufacturing a spherical polymer ball.
- FIG. 6 illustrates a perspective view of a semiconductor chip having chip pads at a circumference thereof according to a first embodiment of the present invention
- FIG. 7 illustrates a cross-sectional view taken approximately along the line VII-VII of FIG. 6.
- a ball grid array IC package is constructed with a semiconductor chip 210 having a plurality of chip pads 212 , hourglass type conductive balls 215 electrically connected to the chip pads 212 , a substrate 200 having ball lands 204 on which the conductive balls 215 are mounted, polymer balls 230 formed on the semiconductor chip 210 for maintaining a uniform interval between the semiconductor chip 210 and substrate 200 to make the conductive balls 215 hourglass type, and an adhesive layer 232 disposed between the semiconductor chip 210 and the polymer balls 230 .
- the polymer balls 230 are arranged at a peripheral part of the semiconductor chip 210 , where the chip pads 212 are not disposed.
- the chip pads 212 are arranged at the peripheral part of the semiconductor chip 210 , as shown in FIG. 6, the polymer balls 230 are arranged at the central part of the semiconductor chip 210 , where the chip pads 212 are not disposed.
- spherical conductive balls 214 are formed on chip pads 212 of a semiconductor chip 210 .
- the conductive balls 214 are solder balls having a spherical shape.
- Polymer balls 230 are attached to the semiconductor chip 210 using an adhesive layer 232 .
- the adhesive layer 232 may comprise an adhesive tape, an adhesive agent or other appropriate adhesive member.
- the polymer balls 230 shown in FIG. 7 are attached to the semiconductor chip 210 by the adhesive layer 232 and a tape 234 or the like, and are thereby sealed and isolated completely from the outer atmosphere.
- the polymer balls 230 preferably are formed of an epoxy based resin or a polyimide based resin.
- the chip pads 212 and the conductive balls 214 are arranged at the central part of the semiconductor chip 210 , while the polymer balls 230 are arranged at the peripheral part of the semiconductor chip 210 .
- the chip pads 212 and the conductive balls 214 may be arranged at the peripheral part of the semiconductor chip 210 , while the polymer balls 230 are arranged at the central part of the semiconductor chip 210 , as shown in FIG. 6.
- the respective polymer balls 230 are charged with one of air, gas, water, oil or like material 250 using an injector 240 , such as a piston or the like, whereby the volume of the respective polymer balls 230 are expanded, as shown in FIG. 5B.
- the polymer balls 230 may be charged with any material having expansion/contraction properties, depending on a temperature expansion variance instead of the above-described air, gas, water, and oil.
- Ball lands 204 are provided by etching the metal so as to provide portions of the metal, corresponding to the chip pads 212 , on the semiconductor chip 210 .
- the conductive balls 214 are then disposed on the ball lands 204 of the substrate 200 .
- a thermal treatment is carried out on the above resultant structure using an infrared lamp, shown as arrows 220 .
- the thermal treatment is preferably carried out at a temperature of between 200 to 250° C., and more preferably, at a temperature of about 235° C.
- the conductive balls 215 are reflowed by the thermal treatment so as to be metamorphosed into shapes having hourglass features.
- the infrared lamp (not shown) is turned off, as shown in FIG. 3D, whereby the polymer balls 230 contract because of a decrease in their volume as a result of the temperature drop.
- FIG. 8 illustrates an exploded perspective view of a ball grid array IC package according to a second embodiment of the present invention.
- a ball grid array IC package is constructed with a semiconductor chip 310 having a plurality of chip pads (not shown), conductive balls 314 (shown in phantom) electrically connected to the chip pads, a substrate 300 having ball lands 304 on which conductive balls 314 are mounted, polymer balls 330 , formed on those portions of the substrate 300 where the ball lands 304 are not formed, for maintaining a uniform interval between the semiconductor chip 310 and the substrate 300 so as to change the shape of the conductive balls 314 to ones having an hourglass type, and an adhesive layer 332 disposed between the substrate 300 and the polymer balls 330 .
- a method of manufacturing a ball grid array IC package according to the second embodiment of the present invention is almost the same as the first embodiment of the present invention except for polymer balls 330 being formed on a substrate 300 .
- the spherical conductive balls 314 are attached to the chip pads (not shown) of the semiconductor chip 310 .
- Polymer balls 330 are then attached to those portions of the substrate 300 where ball lands 304 are not formed by inserting the adhesive layer 332 at a peripheral part.
- the respective polymer balls 330 are charged with one of air, gas, water, oil or the like.
- the conductive balls 314 are then mounted on the ball lands 304 of the substrate 300 .
- thermal treatment is carried out on the above resultant structure. Maintaining a uniform interval between the semiconductor chip 310 and substrate 300 is achieved by the expansion of the polymer balls 330 to provide a uniform distance between the surfaces of the chip 310 and the substrate 300 .
- the conductive balls 314 are reflowed by the thermal treatment so as to be metamorphosed into shapes having the hourglass features.
- the removal of the contact polymer balls 330 is optional, and alternatively, they are allowed to reduce their volume and size to be less than the height of the conductive members having the hourglass features.
- the spherical conductive balls are metamorphosed into shapes having the hourglass features using polymer balls having expansion/contraction properties depending on temperature variance by maintaining a uniform interval between the semiconductor chip and substrate.
- FIG. 9 illustrates an exploded perspective view of a ball grid array IC package according to a third embodiment of the present invention
- FIG. 10 illustrates a cross-sectional view of a ball grid array IC package according to the third embodiment of the present invention.
- a ball grid array IC package is constructed with a semiconductor chip 410 having a plurality of chip pads (not shown), conductive balls 414 (shown in phantom) electrically connected to the chip pads, a substrate 400 having ball lands 404 on which the conductive balls 414 are later mounted, a jig 434 attached to a peripheral part of the substrate 400 where the ball lands 404 are not formed, polymer balls 430 formed on the jig 434 for maintaining a uniform interval between the semiconductor chip 410 and the substrate 400 so as to make the conductive balls 414 have shapes of the hourglass type, and an adhesive layer 432 disposed between the semiconductor chip 410 and the polymer balls 430 .
- FIGS. 9 and 10 A method of manufacturing a ball grid array IC package according to the third embodiment of the present invention is shown in FIGS. 9 and 10.
- the conductive balls are formed on the chips pads of the semiconductor chip 410 .
- ball lands 404 are provided by etching the metal so as to leave portions of the metal corresponding to the chip pads on the surface of substrate 400 .
- a jig 434 is attached to a peripheral part of the substrate 400 where the ball lands 404 are not formed. In this case, the polymer balls 430 are arranged on the jig 434 .
- the adhesive layer 432 is disposed between the polymer balls 430 and the jig 434 so as to strengthen the adhesive power of the polymer ball attachment. Moreover, the polymer balls 430 are charged with any material having expansion/contraction properties depending on a temperature variance, for example, air, gas, water, oil or the like.
- thermal treatment is carried out on the above resultant structure using an infrared lamp (not shown).
- an infrared lamp not shown
- the volume of each of the polymer balls 430 is expanded, whereby a uniform interval between the semiconductor chip 410 and substrate 400 is obtained.
- the conductive balls 414 are reflowed by the thermal treatment so as to be metamorphosed into connections having the hourglass features.
- the jig 434 is detachable so as to be reused after the thermal treatment.
- FIG. 11 illustrates an exploded perspective view of a ball grid array IC package according to a fourth embodiment of the present invention.
- a ball grid array IC package according to a fourth embodiment of the present invention is constructed with a semiconductor chip 510 having a plurality of chip pads (not shown), conductive balls 514 (shown in phantom) electrically connected to the chip pads, a substrate 500 having ball lands 504 on which the conductive balls 514 are later mounted, a jig 534 attached to a peripheral part of the substrate 500 where the ball lands 504 are not formed, and bimetals 530 formed on the jig 534 for maintaining a uniform interval between the semiconductor chip 510 and the substrate 500 so as to change the shape of the conductive balls 514 into on of having the hourglass type.
- Each of the bimetals 530 is constructed comprising plural thin metal pieces, each having different heat expansion coefficients, the bimetals 530 being bent in accordance with a temperature variance.
- a method of manufacturing a ball grid array IC package according to the fourth embodiment of the present invention is essentially the same of the third embodiment of the present invention.
- the conductive balls 514 are attached to the chips pads of the semiconductor chip 510 .
- the ball lands 504 are formed on the substrate 500 .
- the jig 534 on which the bimetals 530 are formed, is attached to a peripheral part of the substrate 500 .
- An adhesive layer may be disposed between the substrate 500 and the jig 534 so as to strengthen the adhesiveness power between the substrate and the bimetals 530 .
- thermal treatment is carried out on the above resultant structure using an infrared lamp (not shown).
- the bimetals 530 are expanded.
- the spherical conductive balls 514 are extended by the vertical expansion of the bimetals 530 to the extent of the interval between the semiconductor chip 510 and substrate 500 SO as to change the connection into a shape having the hourglass features.
- the jig 534 is detachable so as to be reused after the thermal treatment.
- an interval maintaining member is formed on a substrate or a semiconductor chip so as to secure a uniform interval between the semiconductor substrate and the semiconductor chip.
- the present invention is capable of extending the length of the respective conductive balls to the extent of the interval so as to manufacture an hourglass type IC package with greater precision and efficiency.
- the present invention does not require equipment for pulling upward a semiconductor chip in vacuum to provide an hourglass type conductive ball.
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Abstract
Description
- 1. Field of the Invention
- The present invention relates generally to a semiconductor or integrated circuit (IC) package and manufacturing method thereof, and more particularly, to a ball grid array package and manufacturing method thereof for providing an IC package in which leads comprising spherical conductive balls are changed into an hourglass type features.
- 2. Description of the Related Art
- Generally, a ball grid array for an IC package uses conductive balls, such as solder balls and the like, which are arranged on a back surface of a substrate, to provide external leads. As a result, ball grid array packages provide a reduction in IC size, and further reduces the occurrence of lead deformation, unlike QFP (Quad Flat Package) packages.
- FIG. 1A illustrates a cross-sectional view of a ball grid array package according to a first embodiment of a conventional IC package, and FIG. 1B illustrates a cross-sectional view of a ball grid array package according to a second embodiment of a conventional IC package.
- Generally, ball grid array IC packages having the above-mentioned advantages are divided into two types, a vessel type having a ship feature shown in FIG. 1A, and an hourglass type having an hourglass feature shown in FIG. 1B, in accordance with conventional packages utilizing
conductive balls 112 mounted on a substrate A ball grid array package manufactured as either a vessel or hourglass type undergoes a reliance test against heat at a temperature of 200 to 25° C. - During the reliance test against heat at these temperatures, the
conductive balls 114 of the vessel type ball grid package are metamorphosed from a spherical type into an elliptic type as shown in FIG. 1A. Stresses are generated from the interfaces among theconductive balls 114, a print circuit board (PCB, hereinafter called substrate) 100 in contact with theconductive balls 114, and thesemiconductor chip 110, which may result in formation of cracks in one or more of the contacting members. - In order to overcome the manufacturing problems of vessel type packages, an hourglass type ball grid array package having an excellent joint reliance for a solder joint and an excellent thermal reliance has been proposed. Unfortunately, the hourglass type package needs an additional process of pulling up a semiconductor chip in vacuum, which requires using additional equipment so as to metamorphose a conductive ball into an hourglass type cylinder.
- Accordingly, the present invention is directed to a ball grid array IC package and manufacturing method thereof that substantially obviates one or more of the problems resulting from the limitations and disadvantages of the related art.
- One object of the present invention is to provide a ball grid array package allowing metamorphosis of a conductive ball into an hourglass feature with ease by maintaining a uniform interval between a semiconductor chip and a substrate.
- Another object of the present invention is to provide a method of manufacturing a ball grid array package allowing the metamorphosis of a conductive ball into an hourglass feature with ease by utilizing a member that provides a uniform interval between a semiconductor chip and a substrate.
- Additional features and advantages of the invention will be set forth in the following detailed description, and in part will be apparent from the description, or may be learned by practice of the invention as herein disclosed. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
- To achieve these and other advantages, and in accordance with the purpose of the present invention as embodied and broadly described, ball grid array IC packages according to the present invention include a semiconductor chip having a plurality of chip pads, a substrate having ball lands, hourglass type conductive balls electrically connected to the chip pads and landed at the ball lands, respectively, and an interval maintaining member maintaining a uniform interval between the semiconductor chip and substrate.
- In another embodiment, a method of manufacturing ball grid array IC packages according to the present invention includes the steps of providing a semiconductor chip having a plurality of chip pads, attaching spherical conductive balls and an expansive interval maintaining member on the chip pads, mounting the conductive balls on the ball lands, and expanding a volume of the interval maintaining member by carrying out thermal treatment on the resultant so as to change the spherical conductive balls into shapes including hourglass features.
- In a further embodiment, a method of manufacturing ball grid array IC packages according to the present invention includes the steps of providing a semiconductor chip having a plurality of chip pads, forming spherical conductive balls on the chip pads, forming ball lands and an expansive interval maintaining member on a substrate, mounting the conductive balls on the ball lands, and expanding a volume of the interval maintaining member by carrying out thermal treatment on the resultant structure so as to change the spherical conductive balls into shapes having hourglass features.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as described and as claimed herein.
- The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
- FIG. 1A illustrates a cross-sectional view of a ball grid array IC package according to a first conventional embodiment found in the related art;
- FIG. 1B illustrates a cross-sectional view of a ball grid array package according to a second conventional embodiment found in the related art;
- FIG. 2 illustrates a cross-sectional view of a ball grid array package according to a first embodiment of the present invention;
- FIGS. 3A to3D illustrate cross-sectional views showing the steps for manufacturing a ball grid array IC package according to a first embodiment of the present invention;
- FIG. 4 illustrates a perspective view of a semiconductor chip having chip pads at a central part thereof according to a first embodiment of the present invent ion;
- FIG. 5A and FIG. 5B illustrate the process steps of manufacturing a spherical polymer ball;
- FIG. 6 illustrates a perspective view of a semiconductor chip having chip pads at a circumference thereof;
- FIG. 7 illustrates a cross-sectional view taken approximately along a line VII-VII extending through the semiconductor chip of FIG. 6;
- FIG. 8 illustrates an exploded perspective view of a ball grid array IC package according to a second embodiment of the present invention;
- FIG. 9 illustrates an exploded perspective view of a ball grid array IC package according to a third embodiment of the present invention;
- FIG. 10 illustrates a cross-sectional view of an assembled ball grid array IC package according to the third embodiment of the present invention; and
- FIG. 11 illustrates an exploded perspective view of a ball grid array IC package according to a fourth embodiment of the present invention.
- Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Where possible, the same reference numerals will be used to illustrate like elements throughout the several embodiments of the specification.
- FIGS.2 to 7 illustrate a ball grid array IC package and manufacturing method thereof according to a first embodiment of the present invention. FIG. 2 illustrates a cross-sectional view of a ball grid array IC package according to a first embodiment of the present invention. FIGS. 3A to 3D illustrate cross-sectional views of manufacturing a ball grid array IC package according to a first embodiment of the present invention. FIG. 4 illustrates a perspective view of a semiconductor chip having chip pads at a central part thereof according to a first embodiment of the present invention, and FIGS. 5A and 5B illustrate a process of manufacturing a spherical polymer ball.
- FIG. 6 illustrates a perspective view of a semiconductor chip having chip pads at a circumference thereof according to a first embodiment of the present invention and FIG. 7 illustrates a cross-sectional view taken approximately along the line VII-VII of FIG. 6.
- Referring again to FIG. 2, a ball grid array IC package according to a first embodiment of the present invention is constructed with a
semiconductor chip 210 having a plurality ofchip pads 212, hourglass typeconductive balls 215 electrically connected to thechip pads 212, asubstrate 200 havingball lands 204 on which theconductive balls 215 are mounted,polymer balls 230 formed on thesemiconductor chip 210 for maintaining a uniform interval between thesemiconductor chip 210 andsubstrate 200 to make theconductive balls 215 hourglass type, and anadhesive layer 232 disposed between thesemiconductor chip 210 and thepolymer balls 230. - When the
chip pads 212 are arranged at a central part of thesemiconductor chip 210, as shown in FIG. 4, thepolymer balls 230 are arranged at a peripheral part of thesemiconductor chip 210, where thechip pads 212 are not disposed. On the other hand, when thechip pads 212 are arranged at the peripheral part of thesemiconductor chip 210, as shown in FIG. 6, thepolymer balls 230 are arranged at the central part of thesemiconductor chip 210, where thechip pads 212 are not disposed. - In a method of manufacturing the ball grid array IC package according to the first embodiment of the present invention, shown in FIG. 3A, spherical
conductive balls 214 are formed onchip pads 212 of asemiconductor chip 210. Preferably, theconductive balls 214 are solder balls having a spherical shape. -
Polymer balls 230 are attached to thesemiconductor chip 210 using anadhesive layer 232. Theadhesive layer 232 may comprise an adhesive tape, an adhesive agent or other appropriate adhesive member. - The
polymer balls 230 shown in FIG. 7 are attached to thesemiconductor chip 210 by theadhesive layer 232 and atape 234 or the like, and are thereby sealed and isolated completely from the outer atmosphere. Thepolymer balls 230 preferably are formed of an epoxy based resin or a polyimide based resin. - In FIGS. 3A to3D, the
chip pads 212 and theconductive balls 214 are arranged at the central part of thesemiconductor chip 210, while thepolymer balls 230 are arranged at the peripheral part of thesemiconductor chip 210. Conversely, thechip pads 212 and theconductive balls 214 may be arranged at the peripheral part of thesemiconductor chip 210, while thepolymer balls 230 are arranged at the central part of thesemiconductor chip 210, as shown in FIG. 6. - As shown in FIG. 5A and FIG. 7, the respective polymer balls230) are charged with one of air, gas, water, oil or like
material 250 using aninjector 240, such as a piston or the like, whereby the volume of therespective polymer balls 230 are expanded, as shown in FIG. 5B. Alternatively, thepolymer balls 230 may be charged with any material having expansion/contraction properties, depending on a temperature expansion variance instead of the above-described air, gas, water, and oil. - Referring now to FIGS. 3A to3D, a metal has been deposited on the
substrate 200. Ball lands 204 are provided by etching the metal so as to provide portions of the metal, corresponding to thechip pads 212, on thesemiconductor chip 210. Theconductive balls 214 are then disposed on the ball lands 204 of thesubstrate 200. - Referring now to FIG. 3B, a thermal treatment is carried out on the above resultant structure using an infrared lamp, shown as
arrows 220. In this case, the thermal treatment is preferably carried out at a temperature of between 200 to 250° C., and more preferably, at a temperature of about 235° C. - As a result of the thermal treatment, the volume of each of the
polymer balls 230 charged with one of air, gas, water, oil or the like is expanded, whereby thepolymer balls 230 come into contact with thesubstrate 200. Such contact applies a predetermined pressure to thesubstrate 200. - Consequently, a uniform interval between the
semiconductor chip 210 andsubstrate 200 is obtained. he expandedpolymer balls 230 maintain a predetermined interval between thesemiconductor chip 210 and thesubstrate 200. - Referring now to FIG. 3C, the
conductive balls 215 are reflowed by the thermal treatment so as to be metamorphosed into shapes having hourglass features. - Then, the infrared lamp (not shown) is turned off, as shown in FIG. 3D, whereby the
polymer balls 230 contract because of a decrease in their volume as a result of the temperature drop. - After the hourglass type
conductive balls 215 have been fabricated, the removal of thecontact polymer balls 230 is optional. - FIG. 8 illustrates an exploded perspective view of a ball grid array IC package according to a second embodiment of the present invention.
- Referring to FIG. 8, a ball grid array IC package according to a second embodiment of the present invention is constructed with a
semiconductor chip 310 having a plurality of chip pads (not shown), conductive balls 314 (shown in phantom) electrically connected to the chip pads, asubstrate 300 having ball lands 304 on whichconductive balls 314 are mounted,polymer balls 330, formed on those portions of thesubstrate 300 where the ball lands 304 are not formed, for maintaining a uniform interval between thesemiconductor chip 310 and thesubstrate 300 so as to change the shape of theconductive balls 314 to ones having an hourglass type, and anadhesive layer 332 disposed between thesubstrate 300 and thepolymer balls 330. - A method of manufacturing a ball grid array IC package according to the second embodiment of the present invention is almost the same as the first embodiment of the present invention except for
polymer balls 330 being formed on asubstrate 300. - The method of manufacturing a ball grid array package according to the second embodiment of the present invention is explained briefly as follows.
- First, the spherical
conductive balls 314 are attached to the chip pads (not shown) of thesemiconductor chip 310.Polymer balls 330, as shown in FIG. 8, are then attached to those portions of thesubstrate 300 where ball lands 304 are not formed by inserting theadhesive layer 332 at a peripheral part. - Subsequently, the
respective polymer balls 330 are charged with one of air, gas, water, oil or the like. Theconductive balls 314 are then mounted on the ball lands 304 of thesubstrate 300. - Subsequently, thermal treatment is carried out on the above resultant structure. Maintaining a uniform interval between the
semiconductor chip 310 andsubstrate 300 is achieved by the expansion of thepolymer balls 330 to provide a uniform distance between the surfaces of thechip 310 and thesubstrate 300. Theconductive balls 314 are reflowed by the thermal treatment so as to be metamorphosed into shapes having the hourglass features. - After the hourglass type conductive balls have been fabricated, the removal of the
contact polymer balls 330 is optional, and alternatively, they are allowed to reduce their volume and size to be less than the height of the conductive members having the hourglass features. - Accordingly, in the first and second embodiments of the present invention, the spherical conductive balls are metamorphosed into shapes having the hourglass features using polymer balls having expansion/contraction properties depending on temperature variance by maintaining a uniform interval between the semiconductor chip and substrate.
- FIG. 9 illustrates an exploded perspective view of a ball grid array IC package according to a third embodiment of the present invention, and FIG. 10 illustrates a cross-sectional view of a ball grid array IC package according to the third embodiment of the present invention.
- Referring to FIG. 9, a ball grid array IC package according to a third embodiment of the present invention is constructed with a
semiconductor chip 410 having a plurality of chip pads (not shown), conductive balls 414 (shown in phantom) electrically connected to the chip pads, asubstrate 400 having ball lands 404 on which theconductive balls 414 are later mounted, ajig 434 attached to a peripheral part of thesubstrate 400 where the ball lands 404 are not formed,polymer balls 430 formed on thejig 434 for maintaining a uniform interval between thesemiconductor chip 410 and thesubstrate 400 so as to make theconductive balls 414 have shapes of the hourglass type, and anadhesive layer 432 disposed between thesemiconductor chip 410 and thepolymer balls 430. - A method of manufacturing a ball grid array IC package according to the third embodiment of the present invention is shown in FIGS. 9 and 10. First, the conductive balls are formed on the chips pads of the
semiconductor chip 410. After a metal has been deposited on thesubstrate 400 by known sputtering methods, ball lands 404 are provided by etching the metal so as to leave portions of the metal corresponding to the chip pads on the surface ofsubstrate 400. Ajig 434 is attached to a peripheral part of thesubstrate 400 where the ball lands 404 are not formed. In this case, thepolymer balls 430 are arranged on thejig 434. - The
adhesive layer 432 is disposed between thepolymer balls 430 and thejig 434 so as to strengthen the adhesive power of the polymer ball attachment. Moreover, thepolymer balls 430 are charged with any material having expansion/contraction properties depending on a temperature variance, for example, air, gas, water, oil or the like. - After the
conductive balls 414 have come into contact with the ball lands 404, thermal treatment is carried out on the above resultant structure using an infrared lamp (not shown). As a result of the thermal treatment, the volume of each of thepolymer balls 430 is expanded, whereby a uniform interval between thesemiconductor chip 410 andsubstrate 400 is obtained. Theconductive balls 414 are reflowed by the thermal treatment so as to be metamorphosed into connections having the hourglass features. Moreover, thejig 434 is detachable so as to be reused after the thermal treatment. - FIG. 11 illustrates an exploded perspective view of a ball grid array IC package according to a fourth embodiment of the present invention. Referring to FIG. 11, a ball grid array IC package according to a fourth embodiment of the present invention is constructed with a
semiconductor chip 510 having a plurality of chip pads (not shown), conductive balls 514 (shown in phantom) electrically connected to the chip pads, asubstrate 500 having ball lands 504 on which theconductive balls 514 are later mounted, ajig 534 attached to a peripheral part of thesubstrate 500 where the ball lands 504 are not formed, and bimetals 530 formed on thejig 534 for maintaining a uniform interval between thesemiconductor chip 510 and thesubstrate 500 so as to change the shape of theconductive balls 514 into on of having the hourglass type. - Each of the
bimetals 530 is constructed comprising plural thin metal pieces, each having different heat expansion coefficients, thebimetals 530 being bent in accordance with a temperature variance. - A method of manufacturing a ball grid array IC package according to the fourth embodiment of the present invention is essentially the same of the third embodiment of the present invention. First, the
conductive balls 514 are attached to the chips pads of thesemiconductor chip 510. The ball lands 504 are formed on thesubstrate 500. - Subsequently, as shown in FIG. 11, the
jig 534, on which thebimetals 530 are formed, is attached to a peripheral part of thesubstrate 500. An adhesive layer may be disposed between thesubstrate 500 and thejig 534 so as to strengthen the adhesiveness power between the substrate and thebimetals 530. - After the
conductive balls 514 have been made to come into contact with the ball lands 504, thermal treatment, is carried out on the above resultant structure using an infrared lamp (not shown). As a result of the thermal treatment, thebimetals 530 are expanded. In this case, the sphericalconductive balls 514 are extended by the vertical expansion of thebimetals 530 to the extent of the interval between thesemiconductor chip 510 andsubstrate 500 SO as to change the connection into a shape having the hourglass features. Moreover, thejig 534 is detachable so as to be reused after the thermal treatment. - As mentioned in the above description of the present invention, an interval maintaining member is formed on a substrate or a semiconductor chip so as to secure a uniform interval between the semiconductor substrate and the semiconductor chip. Thus, the present invention is capable of extending the length of the respective conductive balls to the extent of the interval so as to manufacture an hourglass type IC package with greater precision and efficiency.
- Moreover, the present invention does not require equipment for pulling upward a semiconductor chip in vacuum to provide an hourglass type conductive ball.
- The foregoing embodiments are merely exemplary and are not to be construed as limiting the present invention. The present teachings can be readily applied to other types of similar or dissimilar apparatus. The description of the present invention is intended to be illustrative, and not to limit the scope of the following claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art from an understanding of the invention as described and illustrated.
Claims (21)
Applications Claiming Priority (2)
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KR2001-32872 | 2001-06-12 | ||
KR10-2001-0032872A KR100443504B1 (en) | 2001-06-12 | 2001-06-12 | ball grid array package and method of fabricating the same |
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US20020185746A1 true US20020185746A1 (en) | 2002-12-12 |
US6642626B2 US6642626B2 (en) | 2003-11-04 |
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US10/024,888 Expired - Fee Related US6642626B2 (en) | 2001-06-12 | 2001-12-18 | Ball grid array IC package and manufacturing method thereof |
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US (1) | US6642626B2 (en) |
JP (1) | JP3906442B2 (en) |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US6630365B2 (en) | 2000-06-08 | 2003-10-07 | Micron Technology, Inc. | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
US7098529B1 (en) * | 2004-01-07 | 2006-08-29 | Credence Systems Corporation | System and method for packaging a semiconductor device |
US20060231949A1 (en) * | 2005-04-14 | 2006-10-19 | Chang-Yong Park | Semiconductor module and method of forming a semiconductor module |
US20070069378A1 (en) * | 2005-04-15 | 2007-03-29 | Chang-Yong Park | Semiconductor module and method of forming a semiconductor module |
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- 2001-06-12 KR KR10-2001-0032872A patent/KR100443504B1/en not_active IP Right Cessation
- 2001-11-19 JP JP2001353483A patent/JP3906442B2/en not_active Expired - Fee Related
- 2001-12-17 TW TW090131224A patent/TW533568B/en active
- 2001-12-18 US US10/024,888 patent/US6642626B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
US6642626B2 (en) | 2003-11-04 |
TW533568B (en) | 2003-05-21 |
KR100443504B1 (en) | 2004-08-09 |
KR20020094592A (en) | 2002-12-18 |
JP3906442B2 (en) | 2007-04-18 |
JP2003007761A (en) | 2003-01-10 |
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