US20020075654A1 - Heat dissipation assembly - Google Patents
Heat dissipation assembly Download PDFInfo
- Publication number
- US20020075654A1 US20020075654A1 US09/746,407 US74640700A US2002075654A1 US 20020075654 A1 US20020075654 A1 US 20020075654A1 US 74640700 A US74640700 A US 74640700A US 2002075654 A1 US2002075654 A1 US 2002075654A1
- Authority
- US
- United States
- Prior art keywords
- holder
- heat dissipation
- base
- fan
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49359—Cooling apparatus making, e.g., air conditioner, refrigerator
Definitions
- the present invention relates to a heat dissipation assembly, and more particularly to a heat dissipation assembly which can be readily and securely assembled together.
- a conventional heat dissipation device is formed by extrusion, which significantly limits the height of its formed fins. Furthermore, to meet increasing demands for dissipation of ever-increasing amounts of heat, larger and larger heat dissipation devices are being manufactured. This results in excessively heavy heat dissipation devices which are unwieldy and prone to be unstable.
- an object of the present invention is to provide a heat dissipation assembly which can be readily and securely assembled together.
- a heat dissipation assembly in accordance with the present invention comprises a fan, a heat sink and a holder attaching the fan on the heat sink.
- the fan is box-shaped and defines four through holes at four corners thereof respectively.
- the heat sink comprises a base with two grooves defined thereunder, and a plurality of fins attached on the base. The fins define a channel therethrough.
- the holder comprises two identical and opposing holder members. Each member has a flange extending perpendicularly from a top edge thereof. Each flange comprises a vertical tab for extending into the corresponding through hole of the fan, and a screw hole for engaging with a screw which extends through another corresponding through hole of the fan.
- Each member has two horizontal tabs for inserting into the grooves of the base, whereby the members are secured at opposite sides of the base.
- Each member defines an opening in alignment with the channel of the fins, for accommodating a heat sink clip.
- FIG. 1 is an exploded view of a heat dissipation assembly in accordance with the present invention, together with a heat sink clip;
- FIG. 2 is a perspective view of a fan holder of FIG. 1;
- FIG. 3 is a partly assembled view of FIG. 1;
- FIG. 4 is a completely assembled view of FIG. 1.
- a heat dissipation assembly in accordance with the present invention comprises a fan 10 , a heat sink 20 , and a holder 40 .
- the assembly accommodates a heat sink clip 30 therein.
- the fan 10 is box-shaped and defines four through holes 104 at four corners thereof respectively.
- the heat sink 20 comprises a base 201 and a plurality of folded fins 202 .
- a plurality of parallel ribs 203 is formed on a top surface of the base 201 .
- a pair of T-shaped grooves 205 is defined in a bottom surface of the base 201 , near respective opposite sides of the base 201 and parallel to the ribs 203 .
- a transverse channel 204 is defined through bottom surfaces of the fins 202 , for accommodating the clip 30 .
- a plurality of slots 206 is defined through the bottom surfaces of the fins 202 parallel to the channel 204 , corresponding to the ribs 203 of the base 201 .
- the holder 40 comprises two identical holder members 409 .
- a pair of flanges 402 respectively extends perpendicularly inwardly toward each other from top edges of the members 409 .
- a pair of vertical tabs 404 is respectively stamped upwardly from two diagonally opposite ends of the flanges 402 , for extending into the corresponding through holes 104 of the fan 10 .
- a pair of screw holes 403 is respectively defined in the other two diagonally opposite ends of the flanges 402 , for respectively engaging with a pair of screws 102 which extend through the corresponding through holes 104 of the fan 10 .
- An opening 406 is defined in a lower central portion of each member 409 , corresponding to the channel 204 of the heat sink 20 .
- a pair of horizontal tabs 408 respectively extends perpendicularly inwardly at opposite ends of a bottom edge of each member 409 , for inserting into the corresponding grooves 205 of the heat sink 20 .
- the clip 30 in assembly, is placed on the base 201 parallel to and between the innermost ribs 203 of the base 201 .
- the fins 202 are then attached to the base 201 , with the slots 206 of the folded fins 202 interferentially engaging with the ribs 203 of the base 201 .
- the clip 30 is thus accommodated in the channel 204 of the fins 202 .
- the two members 409 of the holder 40 are then attached on opposite sides of the fins 202 respectively.
- the horizontal tabs 408 of the members 409 are respectively inserted into the corresponding grooves 205 of the base 201 .
- the clip 30 thus extends through the openings 406 of the members 409 .
- the fan 10 is then placed on the holder 40 .
- Two diagonally opposite through holes 104 of the fan 10 receive the corresponding vertical tabs 404 of the holder 40 , to position the fan 10 on the holder 40 .
- the other two diagonally opposite through holes 104 align with the corresponding screw holes 403 of the members 409 .
- the two screws 102 are then respectively extended through the corresponding diagonally opposite through holes 104 of the fan 10 , to engage with the screw holes 403 of the holder 40 .
- the fan 10 is readily attached to the top of the fins 202 , and the heat dissipation assembly is ready for use as a single unit.
- Such unit can, for example, be attached to a central processing unit for transferring heat therefrom.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation assembly includes a fan (10), a heat sink (20) and a holder (40) attaching the fan on the heat sink. The fan defines four through holes (104) at four corners thereof. The heat sink includes a base (201) with two grooves (205) defined thereunder, and a plurality of fins (202) attached on the base. The fins define a channel (204) therethrough. The holder includes two identical and opposing holder members (409). Each member includes a flange (402) with a vertical tab (404) for extending into one corresponding through hole of the fan, and a screw hole (403) for engaging with a screw (102) which extends through another corresponding through hole. Each member has two horizontal tabs (408) for inserting into the grooves of the base. Each member defines an opening (406) in alignment with the channel, for accommodating a heat sink clip (30).
Description
- 1. Field of the Invention
- The present invention relates to a heat dissipation assembly, and more particularly to a heat dissipation assembly which can be readily and securely assembled together.
- 2. Related Art
- Electronic devices such as central processing units (CPUs) generate a lot of heat during normal operation. This can deteriorate their operational stability and damage associated electronic devices. Thus the heat must be removed quickly to ensure normal operation. A heat dissipation device is often attached to a top surface of a CPU, to remove heat therefrom.
- A conventional heat dissipation device is formed by extrusion, which significantly limits the height of its formed fins. Furthermore, to meet increasing demands for dissipation of ever-increasing amounts of heat, larger and larger heat dissipation devices are being manufactured. This results in excessively heavy heat dissipation devices which are unwieldy and prone to be unstable.
- To resolve the above-mentioned problems, another kind of heat dissipation device has been developed. The fins of such device are folded from a metal sheet. The device has a large heat dissipation surface area. However, because the fins are folded from a metal sheet, a cooling fan cannot be easily and securely attached to the fins. The device generally removes heat without the benefit of a fan. This limits heat conduction, thereby reducing the efficiency of heat transfer. Thus the device does not reliably remove heat from a CPU.
- An improved heat dissipation assembly which overcomes the above-mentioned problems is strongly desired.
- Accordingly, an object of the present invention is to provide a heat dissipation assembly which can be readily and securely assembled together.
- To achieve the above object, a heat dissipation assembly in accordance with the present invention comprises a fan, a heat sink and a holder attaching the fan on the heat sink. The fan is box-shaped and defines four through holes at four corners thereof respectively. The heat sink comprises a base with two grooves defined thereunder, and a plurality of fins attached on the base. The fins define a channel therethrough. The holder comprises two identical and opposing holder members. Each member has a flange extending perpendicularly from a top edge thereof. Each flange comprises a vertical tab for extending into the corresponding through hole of the fan, and a screw hole for engaging with a screw which extends through another corresponding through hole of the fan. The fan is thereby secured to the holder. Each member has two horizontal tabs for inserting into the grooves of the base, whereby the members are secured at opposite sides of the base. Each member defines an opening in alignment with the channel of the fins, for accommodating a heat sink clip.
- Other objects, advantages and novel features of the present invention will be drawn from the following detailed embodiment of the present invention with attached drawings, in which:
- FIG. 1 is an exploded view of a heat dissipation assembly in accordance with the present invention, together with a heat sink clip;
- FIG. 2 is a perspective view of a fan holder of FIG. 1;
- FIG. 3 is a partly assembled view of FIG. 1; and
- FIG. 4 is a completely assembled view of FIG. 1.
- Referring to FIG. 1, a heat dissipation assembly in accordance with the present invention comprises a
fan 10, aheat sink 20, and aholder 40. The assembly accommodates aheat sink clip 30 therein. - The
fan 10 is box-shaped and defines four throughholes 104 at four corners thereof respectively. - The
heat sink 20 comprises abase 201 and a plurality of foldedfins 202. A plurality ofparallel ribs 203 is formed on a top surface of thebase 201. A pair of T-shaped grooves 205 is defined in a bottom surface of thebase 201, near respective opposite sides of thebase 201 and parallel to theribs 203. Atransverse channel 204 is defined through bottom surfaces of thefins 202, for accommodating theclip 30. A plurality ofslots 206 is defined through the bottom surfaces of thefins 202 parallel to thechannel 204, corresponding to theribs 203 of thebase 201. - Referring also to FIG. 2, the
holder 40 comprises twoidentical holder members 409. A pair offlanges 402 respectively extends perpendicularly inwardly toward each other from top edges of themembers 409. A pair ofvertical tabs 404 is respectively stamped upwardly from two diagonally opposite ends of theflanges 402, for extending into the corresponding throughholes 104 of thefan 10. A pair ofscrew holes 403 is respectively defined in the other two diagonally opposite ends of theflanges 402, for respectively engaging with a pair ofscrews 102 which extend through the corresponding throughholes 104 of thefan 10. Anopening 406 is defined in a lower central portion of eachmember 409, corresponding to thechannel 204 of theheat sink 20. A pair ofhorizontal tabs 408 respectively extends perpendicularly inwardly at opposite ends of a bottom edge of eachmember 409, for inserting into thecorresponding grooves 205 of theheat sink 20. - Referring also to FIGS. 3 and 4, in assembly, the
clip 30 is placed on thebase 201 parallel to and between theinnermost ribs 203 of thebase 201. Thefins 202 are then attached to thebase 201, with theslots 206 of the foldedfins 202 interferentially engaging with theribs 203 of thebase 201. Theclip 30 is thus accommodated in thechannel 204 of thefins 202. The twomembers 409 of theholder 40 are then attached on opposite sides of thefins 202 respectively. Thehorizontal tabs 408 of themembers 409 are respectively inserted into thecorresponding grooves 205 of thebase 201. Theclip 30 thus extends through theopenings 406 of themembers 409. Thefan 10 is then placed on theholder 40. Two diagonally opposite throughholes 104 of thefan 10 receive the correspondingvertical tabs 404 of theholder 40, to position thefan 10 on theholder 40. The other two diagonally opposite throughholes 104 align with thecorresponding screw holes 403 of themembers 409. The twoscrews 102 are then respectively extended through the corresponding diagonally opposite throughholes 104 of thefan 10, to engage with thescrew holes 403 of theholder 40. Thus thefan 10 is readily attached to the top of thefins 202, and the heat dissipation assembly is ready for use as a single unit. Such unit can, for example, be attached to a central processing unit for transferring heat therefrom. - It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present examples and embodiment are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
Claims (12)
1. A heat dissipation assembly comprising:
a heat sink adapted for removing heat from a heat-generating electronic device, the heat sink comprising a base with at least one groove defined thereunder and a plurality of fins attached to the base;
a fan adapted for facilitating heat dissipation; and
a holder 40 attaching the fan on the heat sink, the holder having at least two tabs for engaging with the at least one groove thereby securing the holder on the base.
2. The heat dissipation assembly as recited in claim 1 , wherein the holder comprises two identical holder members which are respectively attached on opposite sides of the base of the heat sink.
3. The heat dissipation assembly as recited in claim 2 , wherein the fan defines four through holes therein, and wherein each member of the holder comprises a vertical tab adapted for being received in one corresponding through hole of the fan, and a screw hole for engagement with a screw which extends through another corresponding through hole of the fan, thereby securing the fan on the holder.
4. The heat dissipation assembly as recited in claim 3 , wherein each member of the holder comprises a flange extending from a top edge of the member, and wherein the vertical tab and the screw hole are respectively formed at opposite ends of the flange.
5. The heat dissipation assembly as recited in claim 2 , wherein the fins of the heat sink define a channel therethrough, and each member of the holder defines an opening in alignment with the channel, for accommodating a heat sink clip.
6. The heat dissipation assembly as recited in claim 1 , wherein the base of the heat sink comprises at least one rib, and the fins of the heat sink define at least one slot therethrough for interferentially engaging with the corresponding rib, thereby securing the fins to the base.
7. The heat dissipation assembly as recited in claim 1 , wherein each groove is T-shaped.
8. A heat dissipation assembly comprising:
a heat sink adapted for removing heat from a heat-generating electronic device;
a fan adapted for facilitating heat dissipation;
a holder attaching the fan on the heat sink; and
securing means for attaching the holder on the heat sink.
9. The heat dissipation assembly as recited in claim 8 , wherein the heat sink comprises a base and a plurality of fins attached on the base.
10. The heat dissipation assembly as recited in claim 9 , wherein the securing means comprises at least two tabs extending from the holder for engaging with the base.
11. The heat dissipation assembly as recited in claim 10 , wherein the securing means further comprises at least one groove defined in the base, and wherein the at least two tabs respectively engage with the opposite ends of the groove.
12. The heat dissipation assembly as recited in claim 10 , wherein the securing means further comprises at least two grooves defined in the base for respectively engaging with two tabs.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89221276U TW487294U (en) | 2000-12-07 | 2000-12-07 | Heat sink assembly |
TW089221276U | 2000-12-07 | ||
TW89126898 | 2000-12-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
US6396697B1 US6396697B1 (en) | 2002-05-28 |
US20020075654A1 true US20020075654A1 (en) | 2002-06-20 |
Family
ID=26666939
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/746,407 Expired - Fee Related US6396697B1 (en) | 2000-12-07 | 2000-12-20 | Heat dissipation assembly |
US09/746,597 Expired - Fee Related US6392888B1 (en) | 2000-12-07 | 2000-12-20 | Heat dissipation assembly and method of assembling the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US09/746,597 Expired - Fee Related US6392888B1 (en) | 2000-12-07 | 2000-12-20 | Heat dissipation assembly and method of assembling the same |
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US (2) | US6396697B1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050241800A1 (en) * | 2004-04-30 | 2005-11-03 | Shankar Hegde | Twin fin arrayed cooling device |
US20060120046A1 (en) * | 2004-12-03 | 2006-06-08 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20070097631A1 (en) * | 2005-11-02 | 2007-05-03 | Foxconn Technology Co.,Ltd | Heat sink assembly |
US20090034193A1 (en) * | 2007-07-30 | 2009-02-05 | Inventec Corporation | Heat-dissipating module |
DE102009034829A1 (en) * | 2009-07-27 | 2011-02-03 | Siemens Aktiengesellschaft | Apparatus for detachable attachment of blower e.g. axial blower, to housing wall of industrial electronic equipments, has two identical parts and central plate-shaped device, where front side of device includes supporting unit |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6515861B1 (en) * | 2001-04-02 | 2003-02-04 | Advanced Micro Devices, Inc. | Method and apparatus for shielding electromagnetic emissions from an integrated circuit |
US6822867B2 (en) | 2001-06-29 | 2004-11-23 | Intel Corporation | Electronic assembly with solderable heat sink and methods of manufacture |
US20030033398A1 (en) * | 2001-08-10 | 2003-02-13 | Sun Microsystems, Inc. | Method, system, and program for generating and using configuration policies |
US20030033346A1 (en) * | 2001-08-10 | 2003-02-13 | Sun Microsystems, Inc. | Method, system, and program for managing multiple resources in a system |
US7252139B2 (en) * | 2001-08-29 | 2007-08-07 | Sun Microsystems, Inc. | Method and system for cooling electronic components |
US7133907B2 (en) * | 2001-10-18 | 2006-11-07 | Sun Microsystems, Inc. | Method, system, and program for configuring system resources |
US6965559B2 (en) * | 2001-10-19 | 2005-11-15 | Sun Microsystems, Inc. | Method, system, and program for discovering devices communicating through a switch |
US6459584B1 (en) * | 2001-12-13 | 2002-10-01 | Kuo Yung-Pin | Fixing frame for positioning heat dispensing device of computers |
US20030135609A1 (en) * | 2002-01-16 | 2003-07-17 | Sun Microsystems, Inc. | Method, system, and program for determining a modification of a system resource configuration |
US20030183369A1 (en) * | 2002-04-02 | 2003-10-02 | John Makaran | Heat sink and method of removing heat from power electronics components |
TW524434U (en) * | 2002-05-07 | 2003-03-11 | Polo Tech Co Ltd | Combinational structure of heat sink |
TW535489B (en) * | 2002-05-31 | 2003-06-01 | Peng Jian | Composite working method of heat conduction device and the product thereof |
TW520149U (en) * | 2002-06-14 | 2003-02-01 | San-Yuan Lin | Heat dissipating fan capable of emitting light |
US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
JP3853263B2 (en) * | 2002-07-08 | 2006-12-06 | Necエレクトロニクス株式会社 | Semiconductor device |
US7103889B2 (en) | 2002-07-23 | 2006-09-05 | Sun Microsystems, Inc. | Method, system, and article of manufacture for agent processing |
US7143615B2 (en) | 2002-07-31 | 2006-12-05 | Sun Microsystems, Inc. | Method, system, and program for discovering components within a network |
US20040022200A1 (en) * | 2002-07-31 | 2004-02-05 | Sun Microsystems, Inc. | Method, system, and program for providing information on components within a network |
US20040024887A1 (en) * | 2002-07-31 | 2004-02-05 | Sun Microsystems, Inc. | Method, system, and program for generating information on components within a network |
JP3894070B2 (en) * | 2002-08-06 | 2007-03-14 | 富士通株式会社 | Heat sink, heat sink device, fixing method of heat sink, and electronic device using the heat sink |
TW536139U (en) * | 2002-09-09 | 2003-06-01 | Hon Hai Prec Ind Co Ltd | Dissipating assembly |
US6953227B2 (en) * | 2002-12-05 | 2005-10-11 | Sun Microsystems, Inc. | High-power multi-device liquid cooling |
US6657865B1 (en) * | 2002-12-12 | 2003-12-02 | Wuh Chuong Indutrial Co., Ltd. | Heat dissipating structure |
US20040184272A1 (en) * | 2003-03-20 | 2004-09-23 | Wright Steven A. | Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same |
US6903271B2 (en) * | 2003-09-30 | 2005-06-07 | Intel Corporation | Electronic assembly with thermally separated support |
US7327578B2 (en) * | 2004-02-06 | 2008-02-05 | Sun Microsystems, Inc. | Cooling failure mitigation for an electronics enclosure |
TW200611107A (en) * | 2004-09-24 | 2006-04-01 | Via Tech Inc | Heat dissipation module |
US7284882B2 (en) | 2005-02-17 | 2007-10-23 | Federal-Mogul World Wide, Inc. | LED light module assembly |
CN1913766A (en) * | 2005-08-12 | 2007-02-14 | 鸿富锦精密工业(深圳)有限公司 | Heat sink capable of preventing interference of electromagnetic |
US7289330B2 (en) * | 2005-11-10 | 2007-10-30 | Fu Shun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fan mounting device |
US7493940B2 (en) * | 2006-10-10 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having mounting brackets |
US20080089031A1 (en) * | 2006-10-17 | 2008-04-17 | Hon Hai Precision Industry Co., Ltd. | Heat sink assembly |
US7950446B2 (en) * | 2007-07-16 | 2011-05-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with clip for mounting a fan to a heat sink thereof |
US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US20090284933A1 (en) * | 2008-05-15 | 2009-11-19 | Edison Opto Corporation | Combination type heat dissipation module |
CN101742819B (en) * | 2008-11-21 | 2013-03-20 | 鸿富锦精密工业(深圳)有限公司 | Circuit board compobination |
CN101778553A (en) * | 2009-01-12 | 2010-07-14 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
WO2010102021A1 (en) * | 2009-03-03 | 2010-09-10 | The Board Of Regents For Oklahoma State University | Roof truss system for long span and method of assembly thereof |
WO2011060319A1 (en) * | 2009-11-13 | 2011-05-19 | Uni-Light Llc | Led thermal management |
EP2608258A1 (en) * | 2011-12-20 | 2013-06-26 | STMicroelectronics (Grenoble 2) SAS | A package |
US10239164B2 (en) * | 2013-10-23 | 2019-03-26 | Onanon, Inc. | Robotic wire termination system |
USD732655S1 (en) * | 2013-11-21 | 2015-06-23 | Sanyo Denki Co., Ltd. | Fan |
EP2963680A1 (en) * | 2014-07-01 | 2016-01-06 | Siemens Aktiengesellschaft | Electronics assembly with a heat sink |
US10624245B2 (en) * | 2016-06-23 | 2020-04-14 | Laird Technologies, Inc. | Laser weldable brackets for attachment of heat sinks to board level shields |
US11195800B2 (en) * | 2019-03-06 | 2021-12-07 | Samsung Electro-Mechanics Co., Ltd. | Electronic device module and method of manufacturing the same |
US10886685B2 (en) | 2019-03-08 | 2021-01-05 | Onanon, Inc. | Preformed solder-in-pin system |
US20220210945A1 (en) * | 2019-04-29 | 2022-06-30 | Ventiva, Inc. | Ionic wind generator |
US10868401B1 (en) | 2020-03-04 | 2020-12-15 | Onanon, Inc. | Robotic wire termination system |
US11699884B2 (en) * | 2020-07-27 | 2023-07-11 | International Business Machines Corporation | Electromagnetic shielding of heatsinks with spring press-fit pins |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4544942A (en) * | 1982-02-22 | 1985-10-01 | Aavid Engineering, Inc. | Heat sinks with staked solderable studs |
US5241453A (en) * | 1991-11-18 | 1993-08-31 | The Whitaker Corporation | EMI shielding device |
FR2686765B1 (en) * | 1992-01-28 | 1994-03-18 | Alcatel Converters | FIXING DEVICE, PARTICULARLY FOR FIXING AN ELECTRONIC COMPONENT ON A WALL OF A HEAT SINK. |
US5699610A (en) * | 1994-04-22 | 1997-12-23 | Nec Corporation | Process for connecting electronic devices |
GB2293487B (en) * | 1994-09-21 | 1998-08-12 | Hewlett Packard Co | Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package |
US5566052A (en) * | 1995-06-08 | 1996-10-15 | Northern Telecom Limited | Electronic devices with electromagnetic radiation interference shields and heat sinks |
US5706169A (en) * | 1996-05-15 | 1998-01-06 | Yeh; Robin | Cooling apparatus for a computer central processing unit |
US5864464A (en) * | 1997-06-09 | 1999-01-26 | Lin; Alex | Heat sink for integrated circuit |
US5875097A (en) * | 1997-06-09 | 1999-02-23 | Power Trends, Inc. | Heat sink for auxiliary circuit board |
US5870286A (en) * | 1997-08-20 | 1999-02-09 | International Business Machines Corporation | Heat sink assembly for cooling electronic modules |
TW477437U (en) * | 1998-06-23 | 2002-02-21 | Foxconn Prec Components Co Ltd | Assembled-type CPU heat sink |
US6017185A (en) * | 1998-08-13 | 2000-01-25 | Chaun-Choung Industrial Corp. | Fan fixing structure of a radiator |
US6219239B1 (en) * | 1999-05-26 | 2001-04-17 | Hewlett-Packard Company | EMI reduction device and assembly |
US6278615B1 (en) * | 1999-06-30 | 2001-08-21 | International Business Machines Corporation | Heatsink grounding spring and shield apparatus |
-
2000
- 2000-12-20 US US09/746,407 patent/US6396697B1/en not_active Expired - Fee Related
- 2000-12-20 US US09/746,597 patent/US6392888B1/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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US20050241800A1 (en) * | 2004-04-30 | 2005-11-03 | Shankar Hegde | Twin fin arrayed cooling device |
US7497248B2 (en) * | 2004-04-30 | 2009-03-03 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device |
US20060120046A1 (en) * | 2004-12-03 | 2006-06-08 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7269010B2 (en) * | 2004-12-03 | 2007-09-11 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US20070097631A1 (en) * | 2005-11-02 | 2007-05-03 | Foxconn Technology Co.,Ltd | Heat sink assembly |
US7304845B2 (en) * | 2005-11-02 | 2007-12-04 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink assembly |
US20090034193A1 (en) * | 2007-07-30 | 2009-02-05 | Inventec Corporation | Heat-dissipating module |
DE102009034829A1 (en) * | 2009-07-27 | 2011-02-03 | Siemens Aktiengesellschaft | Apparatus for detachable attachment of blower e.g. axial blower, to housing wall of industrial electronic equipments, has two identical parts and central plate-shaped device, where front side of device includes supporting unit |
DE102009034829B4 (en) * | 2009-07-27 | 2011-06-09 | Siemens Aktiengesellschaft | Device for releasably securing a fan |
Also Published As
Publication number | Publication date |
---|---|
US6392888B1 (en) | 2002-05-21 |
US6396697B1 (en) | 2002-05-28 |
US20020075655A1 (en) | 2002-06-20 |
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