US20020066806A1 - Nozzle and adjust module - Google Patents
Nozzle and adjust module Download PDFInfo
- Publication number
- US20020066806A1 US20020066806A1 US09/727,494 US72749400A US2002066806A1 US 20020066806 A1 US20020066806 A1 US 20020066806A1 US 72749400 A US72749400 A US 72749400A US 2002066806 A1 US2002066806 A1 US 2002066806A1
- Authority
- US
- United States
- Prior art keywords
- nozzle
- spray head
- reaction chamber
- spray arm
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
- B05B15/65—Mounting arrangements for fluid connection of the spraying apparatus or its outlets to flow conduits
- B05B15/652—Mounting arrangements for fluid connection of the spraying apparatus or its outlets to flow conduits whereby the jet can be oriented
- B05B15/654—Mounting arrangements for fluid connection of the spraying apparatus or its outlets to flow conduits whereby the jet can be oriented using universal joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
- B05B15/68—Arrangements for adjusting the position of spray heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
- B05B12/1472—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet separate supply lines supplying different materials to separate outlets of the spraying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Nozzles (AREA)
Abstract
The present invention relates to a nozzle and adjust module of chemicals when wafers are processed during the IC manufacturing process. After wafers are loaded on a chuck of a reaction chamber, five chemicals required for the manufacturing process are transported into the passages, and are sprayed on the surfaces of rotating wafers via different nozzles. The centrifugal effect due to the rotation of a main motor is exploited to coat the chemicals on the whole wafer quickly and uniformly. The present invention can apply to both closed and open reaction chambers. The spray head of the present invention has a specially designed angle, and has level adjusting and height adjusting functions so that high flexibility in the manufacturing process can be obtained.
Description
- The present invention relates to a nozzle and adjust module and, more particularly, to a nozzle and adjust module of chemicals when wafers are processed during the integrated circuit (IC) manufacturing process.
- A prior art nozzle system for rotating wafers mainly uses a pump to extract chemicals from an acid-providing system to a spray head of a chemical reaction chamber, and then sprays the chemicals on the front surfaces of rotating wafers via the nozzle of the spray head, thereby completing the supply of chemicals for the rotating wafers.
- In the prior art, the nozzle is fixed in the spray head, and the spraying direction of chemicals is perpendicular to the surface of the wafer. Therefore, back spilling may easily occur, resulting in contamination of the wafer. Although the nozzle can make straight reciprocation or level swing along with the spray arm, these types of motions apply only to open reaction chambers, and cannot be adopted in closed reaction chambers. Moreover, the angle and height of the nozzle cannot be adjusted to match the necessity of manufacturing process.
- The primary object of the present invention is to provide a nozzle and adjust module. The present invention relates to a nozzle and adjust module of chemicals when wafers are processed during the IC manufacturing process. In the present invention, chemicals required for the manufacturing process are extracted by a pump to a nozzle in a spray head via the passage of a spray arm, and are then sprayed on the surfaces of wafers in a specially designed angle matching to the rotation direction of the wafers, thereby completing the supply of chemicals. Uniform coating can be achieved, and contamination due to back spilling will not easily arise.
- Another object of the present invention is to provide a nozzle and adjust module, which can provide five different chemicals, and the height of whose spray arm can be adjusted to match the necessity of manufacturing process. In other words, the acid-spraying system can apply to both closed and open fabrication environments.
- Yet another object of the present invention is to provide a nozzle and adjust module, wherein two rotating mechanisms manually adjustable are designed on the spray arm thereof in consideration of conveniences of maintenance and assembly/disassembly. The highly flexible adjusting mechanism of the present invention can meet the requirements of future common or special manufacturing processes.
- To achieve the above objects, the present invention provides a nozzle and adjust module comprising a spray head and nozzle mechanism and a closed reaction chamber formed of an upper cover of reaction chamber and a rotation chuck. The spray head and nozzle mechanism is used for spraying chemicals and meeting the requirements of the manufacturing process calling for specific angle of nozzle. The spray head has a plurality of sideward grooves of specific angle and a plurality of ball seats for the placement of nozzles and ball connectors, respectively. Each sideward groove has a nozzle depressor to cover the ball connector. Thereby, the nozzle can be tilted a proper angle and adjusted. The top end of the nozzle is connected to an acid-providing system via a bent pipe.
- A cover plate of spray head joins a connecting plate so that the levels of the spray head and the upper cover of reaction chamber can be adjusted through a level adjusting mechanism of the spray head. The spray head also has a ringed channel to suck up the upper cover by means of vacuum clamping. Contamination of wafers due to particles generated when screwing screws can be avoided. Moreover, an acid-resistant0-ring is matched to prevent the leakage of chemicals.
- The level adjusting mechanism of the spray head comprises a connecting plate and a level adjusting plate. The level adjusting plate has a plurality of sets of adjusting studs and locking studs. Moreover, an outer housing of reaction chamber and a spray arm are fixed on the level adjusting plate using a clamping block and a clamping stud, respectively.
- The rotation mechanism of the present invention comprises a spray arm and a rotation seat. A clamping stud of the rotation seat clamps the spray arm and is placed on a supporting seat. The rotation seat and the supporting seat are connected via a bearing so that the spray arm can rotate freely. The whole spray arm is clamped steadily. Two sets of rotation seats and supporting seats are adopted so that they can be evenly fixed on an elevating plate. The elevating plate is locked with an elevating slide block. Once an elevating motor starts to rotate, the elevating slide block will be driven by a screw bar to generate straight motion, thereby driving the spray arm to make straight elevation.
- The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:
- FIG. 1 is a top view of the present invention;
- FIG. 2 is a cross-sectional view of the present invention along the A-A line in FIG. 1;
- FIG. 3 is an enlarged view of the present invention of part A in FIG. 2;
- FIG. 4 is an enlarged view of the present invention of part B in FIG. 2;
- FIG. 5 is a top view of the spray head and nozzle mechanism of the present invention;
- FIG. 6 is a side view of the spray head and nozzle mechanism of the present invention;
- FIG. 7 is a cross-sectional view of the present invention along the A-A line in
- FIG. 5;
- FIG. 8 is a front view of the level adjusting mechanism of the spray head of the present invention;
- FIG. 9 is a top view of the level adjusting mechanism of the s pray head of the present invention; and
- FIG. 10 is a cross-sectional view of the present invention along the A-A line in FIG. 9.
- Please refer to FIGS.1 to 4. The present invention comprises three modular mechanisms to resolve corresponding problems. The present invention comprises a spray head and nozzle mechanism, a level adjusting mechanism of spray head, and a rotation mechanism of spray arm. The spray head and nozzle mechanism (shown in FIG. 3) is used for spraying chemicals and meeting the requirements of manufacturing process calling for specific angle of nozzle. An upper cover of reaction chamber and a chuck form a closed reaction chamber, or form an open space of specific spacing to match special manufacturing processes. The level adjusting mechanism of spray head (shown in FIG. 1) is used for adjusting the gap and level of the upper cover and the chuck. The adjustment will also influence the levels of the spray head and the nozzle. Moreover, the positions where the spray head sprays on the surfaces of wafers will be changed. The rotation mechanism of spray arm (shown in FIG. 4) is used for the rotation of the whole nozzle module. The means of motion is designed to be manual mainly in consideration of conveniences of maintenance and assembly/disassembly of components of the reaction chamber.
- Please refer to FIGS.5 to 7 simultaneously. The spray head and nozzle mechanism of the present invention comprises a
spray head 4 and fivenozzles 9. Thespray head 4 is processed to have fivesideward grooves 24 of specific angle for the placement of thenozzles 9 andball connectors 10. Anozzle depressor 8 is used to cover theball connector 10 to prevent the nozzle from moving out, and to depress theball connector 10 so that theball connector 10 and thespray head 4 will be stuck tightly to prevent the leakage of chemicals. Because of the design of the ball seat of thespray head 4 and thenozzle depressor 8, a proper adjustment space can be provided for theball connector 10 so that the nozzle can be tilted a proper angle and adjusted to match the manufacturing process. Therefore, unsprayed regions on the surface of wafers and back spilling of chemicals can be avoided. The top end of thenozzle 9 is further connected to an acid-providing system (not shown) via abent pipe 6. Material of this part must have good tolerance and cleanness, and cannot be easily contaminated due to temperature and chemicals. - The
spray head 4 joins a cover plate ofspray head 5 and an upper cover ofreaction chamber 7. Thecover plate 5 joins a connectingplate 11. Thereby, levels of thespray head 4 and theupper cover 7 can be adjusted through the level adjusting mechanism of spray head. Moreover, in consideration of conveniences of maintenance and assembly/disassembly of theupper cover 7, thespray head 4 is processed to have a ringedchannel 25 for sucking up theupper cover 7 by means of vacuum clamping. An acid-resistant O-ring 23 is also matched to prevent the leakage of chemicals. Because there are no locking components such as screws, this way of sucking up theupper cover 7 by means of vacuum clamping can prevent the generation of particles to contaminate the wafers. - Please refer to FIGS. 8 and 9 simultaneously. The level adjusting mechanism of spray head comprises a connecting
plate 11 and alevel adjusting plate 12. Thecover plate 5 joins the connectingplate 11. The adjustingplate 12 has a plurality of sets of adjustingstuds 14 and lockingstuds 17. The connectingplate 11 and thelevel adjusting plate 12 are adjusted through the adjustingstuds 14 so as to adjust the designed gap between theupper cover 7 and a rotation chuck (not shown). The lockingstuds 17 are then used for fixing. One end of thelevel adjusting plate 12 is connected to an outer housing ofreaction chamber 16, which is designed to match the elevation of thespray arm 3 so that the outer environment can be effectively isolated. - As shown in FIGS.1 to 4, the
spray arm 3 is fixed through the clamping of arotation seat 20. Therotation seat 20 and a supportingseat 22 are connected via abearing 21 so that thespray arm 3 can rotate freely. A retaining mechanism (not shown) is further designed in consideration of both the fabrication and maintenance. Thewhole spray arm 3 is clamped steadily. Two sets ofrotation seats 20 are adopted so that they can be evenly fixed on an elevatingplate 18. The elevatingplate 18 is locked with an elevatingslide block 2. Once an elevating motor (not shown) starts to rotate, the elevatingslide block 2 will be driven by a screw bar (not shown) to generate straight motion, thereby driving thespray arm 3 to make straight elevation. - The present invention provides a nozzle and adjust module for spraying liquid on the surface of wafers, and matches the requirements of the manufacturing process and environment so that it can apply to both closed and open reaction chambers. Moreover, the nozzle and adjust module of the present invention can meet the requirement of convenience of maintenance. As shown in FIGS.1 to 4, when wafers are loaded on a
chuck 26 of a reaction chamber via a transport arm, thewafers 27 are fixed on thechuck 26 by means of vacuum suction. Through driving theelevation slide block 2 and the elevatingplate 18 slidably matched on asupport 1 by a motor, thespray arm 3 along with the upper cover ofreaction chamber 7 is lowered to a position having a gap of 0.5 mm distant form the height of thechuck 26. Thereby, a closed reaction chamber is formed. If the gap is not uniform, three sets of the adjustingstuds 14 and the clampingstuds 15 can be tuned to meet the requirements of the fabrication environment. Chemicals required for the manufacturing process are transported into the passages from tanks of the chemicals by clean and compressed high-pressure gases, then enter into thesideward nozzles 9 in thespray head 4 via an erosion-resistant plasticbent pipe 6, and are finally sprayed on the surfaces of thewafers 27. Through the flexibility of theball connectors 10, specific angle of thenozzles 9 can be adjusted to match the requirements of the manufacturing process for the sprayed positions on the wafers. Furthermore, thespray head 4 has five coned holes (for the nozzle to have an adjustment space in the hole) for placing five different chemicals such as deionized (DI) water, nitrogen, isopropanol, and other two chemicals. A rotation motor drives thechuck 26 and thewafers 27 to rotate so that chemicals can be evenly coated on thewafers 27, thereby completing the spraying operation successfully. After all the fabrication procedures are finished, if the components of the reaction chamber need to be maintained or cleaned, thespray arm 3 is lifted by the elevation motor to the maintenance height. A fixing pin (not shown) for fixing the clamping mechanism is pulled, and then thespray 3 is rotated about 60 degrees manually, Next, the fixing pin is put down to fix the position of thespray arm 3. The assembly/disassembly and maintenance of the components of the reaction chamber are then performed. - To sum up, the present invention can meet the requirements of different manufacturing processes by adjusting the height of the
nozzles 9 through the elevating motor. There are fiveseparate nozzles 9 of different chemicals in thespray head 4 of the present invention. Not only can the cross contamination between passages be avoided, but also can the flexibility of selection of chemicals be enhanced. Thenozzles 9 of the present invention can be stationary, or can make straight motion or reciprocating swing within a certain angle along with thespray arm 3. - Although the present invention has been described with reference to the preferred embodiments thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (5)
1. A nozzle and adjust module comprising:
a reaction chamber formed of an upper cover of reaction chamber and a rotation chuck; and
a spray head and nozzle mechanism having a plurality of sideward grooves of specific angle and ball seats respectively for the placement of nozzles and ball connectors, each of said sideward groove having a nozzle depressor to cover said ball connector so that said nozzle can be tilted a proper angle and adjusted, the top end of said nozzle being connected to an acid-providing system via a bent pipe, a cover plate of spray head joining a connecting plate so that said spray head and said upper cover of reaction chamber can be adjusted through a level adjusting mechanism of spray head.
2. The nozzle and adjust module as claimed in claim 1 , wherein said level adjusting mechanism of spray head comprises a connecting plate and a level adjusting plate, said level adjusting plate having a plurality of sets of adjusting studs and locking studs, an outer housing of reaction chamber and a spray arm being fixed on said level adjusting plate respectively using a clamping block and a clamping stud.
3. The nozzle and adjust module as claimed in claim 1 further comprises a rotation mechanism of spray arm, said rotation mechanism comprising a spray arm and a rotation seat, said rotation seat clamping said spray arm via a clamping stud and being placed on a supporting seat, said rotation seat and said supporting seat being connected via a bearing so that said spray arm can rotate freely.
4. The nozzle and adjust module as claimed in claim 3 , wherein said spray arm is clamped steadily, and two sets of said rotation seats and said supporting seats are evenly fixed on an elevating plate, said elevating plate being locked with an elevating slide block, said spray arm being driven to make straight elevation by driving said elevating slide block to make straight motion through an elevating motor and a screw bar.
5. The nozzle and adjust module as claimed in claim 1 , wherein said spray head further has a ringed channel for sucking up said upper cover of reaction chamber by means of vacuum clamping, and an acid-resistant O-ring is also matched to prevent the leakage of chemicals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/727,494 US6390394B1 (en) | 2000-12-04 | 2000-12-04 | Nozzle and adjust module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/727,494 US6390394B1 (en) | 2000-12-04 | 2000-12-04 | Nozzle and adjust module |
Publications (2)
Publication Number | Publication Date |
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US6390394B1 US6390394B1 (en) | 2002-05-21 |
US20020066806A1 true US20020066806A1 (en) | 2002-06-06 |
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ID=24922893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/727,494 Expired - Fee Related US6390394B1 (en) | 2000-12-04 | 2000-12-04 | Nozzle and adjust module |
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US (1) | US6390394B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104985817A (en) * | 2015-07-14 | 2015-10-21 | 成都思维智造科技有限公司 | Nozzle-adjustable spray head structure of three-dimensional printer |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6860945B2 (en) * | 2001-03-22 | 2005-03-01 | Tokyo Electron Limited | Substrate coating unit and substrate coating method |
CN113118099A (en) * | 2019-12-31 | 2021-07-16 | 盛美半导体设备(上海)股份有限公司 | Rotary spray head, cleaning equipment and cleaning method |
CN111957517A (en) * | 2020-05-06 | 2020-11-20 | 山东万物生机械技术有限公司 | Material conveying device |
CN112517293B (en) * | 2020-11-25 | 2022-08-12 | 高邮市金利达机械有限公司 | Multifunctional electromechanical product surface repairing device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3972424A (en) * | 1973-03-12 | 1976-08-03 | The Computervision Corporation | Automatic wafer loading and pre-alignment system |
US4236851A (en) * | 1978-01-05 | 1980-12-02 | Kasper Instruments, Inc. | Disc handling system and method |
US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
US5746834A (en) * | 1996-01-04 | 1998-05-05 | Memc Electronics Materials, Inc. | Method and apparatus for purging barrel reactors |
US5730370A (en) * | 1996-11-14 | 1998-03-24 | Bex Engineering Ltd. | Leak resistant nozzle ball |
-
2000
- 2000-12-04 US US09/727,494 patent/US6390394B1/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104985817A (en) * | 2015-07-14 | 2015-10-21 | 成都思维智造科技有限公司 | Nozzle-adjustable spray head structure of three-dimensional printer |
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US6390394B1 (en) | 2002-05-21 |
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Owner name: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TUNG, FU-CHING;CHEN, CHIA-MING;HUANG, JEN-RONG;AND OTHERS;REEL/FRAME:011322/0930;SIGNING DATES FROM 20001120 TO 20001121 |
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LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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Effective date: 20140521 |